CN105992488A - Liquid cooling-type radiating structure and manufacturing method thereof - Google Patents
Liquid cooling-type radiating structure and manufacturing method thereof Download PDFInfo
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- CN105992488A CN105992488A CN201510044320.1A CN201510044320A CN105992488A CN 105992488 A CN105992488 A CN 105992488A CN 201510044320 A CN201510044320 A CN 201510044320A CN 105992488 A CN105992488 A CN 105992488A
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- heat conduction
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Abstract
The present invention provides a liquid cooling-type radiating structure and a manufacturing method thereof. The liquid cooling-type radiating structure comprises a single-piece type heat conduction module and a combined water supply module, the single-piece type heat conduction module comprises a heat conduction substrate contacted with a heating source, a plurality of heat conduction fins fixedly arranged on the heat conduction substrate, a heat conduction spreader plate fixedly arranged on the heat conduction substrate and covering the plurality of heat conduction fins and a heat conduction flow deflector fixedly arranged on the heat conduction spreader plate, and the combined water supply module comprises an outer cover body arranged on the heat conduction substrate detachably and a rotating member arranged between the outer cover body and the heat conduction flow deflector detachably, wherein the plurality of heat conduction fins, the heat conduction spreader plate and the heat conduction flow deflector are all accommodated in the outer cover body. Therefore, the cooling liquid is driven by the rotating member to enter the outer cover body from a liquid input port to be contacted with the heat conduction module directly, thereby absorbing the heat conducted from the heating source to the single-piece type heat conduction module.
Description
Technical field
The present invention relates to a kind of liquid-cooling type radiator structure, a kind of for promoting integral heat sink usefulness
Liquid-cooling type radiator structure.
Background technology
Lifting along with central processing unit (CPU) processing speed Yu usefulness so that the quantity of heat production of CPU increases at present
Add, and higher operating frequency, also make wattage during work relatively promote, high temperature meeting produced by it
Make CPU lower the life-span, especially when too much heat fails effectively to get rid of, easily cause system unstable.
The problem overheated for solving CPU, the most all uses the combination of radiator and fan, in the way of forcing cooling
Heat is got rid of, and reaches to maintain the effect of the normal operation of CPU.But, existing fan is in high rotating speed
Disturb people's noise and high power consumption produced by Xia, be often manufacturer's problem of being difficult to overcome.
In order to solve above-mentioned existing puzzlement, a kind of Water cooling head heat radiation structure in response to and give birth to.Existing water-cooling head
Radiator structure includes the lid that a pedestal and is arranged on pedestal, and wherein pedestal has multiple fin, seat
The bottom of body can directly contact a pyrotoxin, and lid has an inlet opening and an apopore.So, logical
Cross the bottom of pedestal and contacting of pyrotoxin, so that heat can be transmitted to multiple heat radiation produced by pyrotoxin
On sheet, the most again by coolant circulating between inlet opening and apopore, with by multiple fin
The quick diversion of heat absorbed, to reach the purpose of quick heat radiating.
But, existing Water cooling head heat radiation structure is sent out except the multiple fin being arranged on pedestal can be used to absorb
Outside heat produced by thermal source, lid is all to use plastic material with the design of other accessory, therefore cannot
Effectively promote the integral heat sink usefulness of Water cooling head heat radiation structure.Therefore, the improvement how to design by structure, comes
Promote the integral heat sink usefulness of Water cooling head heat radiation structure, it has also become the important topic that this cause to be solved
One.
Summary of the invention
The technical problem to be solved is, provides a kind of liquid cooling for the deficiencies in the prior art
Formula radiator structure and preparation method thereof, it can use single-piece heat conducting module, so to promote overall heat radiation
Usefulness.
A kind of liquid-cooling type radiator structure that a present invention wherein embodiment is provided, comprising: a single-piece
Formula heat conducting module and a combination type water supply module.Described single-piece heat conducting module includes leading of a contact heating source
Hot substrate, multiple be fixedly installed on described heat-conducting substrate heat conduction fin, one be fixedly installed on described heat conduction
On substrate and cover the heat conduction flow distribution plate and of multiple described heat conduction fin and be fixedly installed on described heat conduction shunting
Heat conduction deflector on plate, wherein said heat conduction deflector has one first deflector opening and by one the
One accommodation space is to be communicated in the second deflector opening of described first deflector opening, and described heat conduction shunting
Plate has one by one second accommodation space to be communicated in the first flow distribution plate opening of described second deflector opening
And one by one the 3rd accommodation space to be communicated in the second flow distribution plate opening of described first flow distribution plate opening；Institute
State combination type water supply module and include that one is removably disposed in the outer outlet body on described heat-conducting substrate and detachable
Be arranged on the pump on described outer outlet body, plurality of described heat conduction fin, described heat conduction flow distribution plate and institute
State heat conduction deflector to be all contained in described outer outlet body, and described outer outlet body has at least one by one the 4th appearance
It is communicated in described second point being communicated in the liquid inlet and at least of described first deflector opening between being empty
The liquid outlet of stream plate opening；Wherein, conduction of heat produced by described pyrotoxin is to described single-piece heat conduction
The described heat-conducting substrate of module, multiple described heat conduction fin, described heat conduction flow distribution plate and described heat conduction water conservancy diversion
Plate；Wherein, cooling liquid enters described outer housing by the drive of described pump from liquid inlet described at least
Internal, directly to contact described heat-conducting substrate, multiple described heat conduction fin, described heat conduction flow distribution plate and institute
State heat conduction deflector, so conduct to described heat-conducting substrate, multiple described heat conduction from described pyrotoxin to absorb
Fin, described heat conduction flow distribution plate and the heat of described heat conduction deflector.
A kind of liquid-cooling type radiator structure that the other embodiment of the present invention is provided, comprising: a single-piece
Formula heat conducting module and a combination type water supply module.Described single-piece heat conducting module includes leading of a contact heating source
Hot substrate, multiple be fixedly installed on described heat-conducting substrate heat conduction fin, one be fixedly installed on described heat conduction
On substrate and cover the heat conduction flow distribution plate and of multiple described heat conduction fin and be fixedly installed on described heat conduction shunting
Heat conduction deflector on plate；Described combination type water supply module includes that one is removably disposed in described heat-conducting substrate
On outer outlet body and be removably disposed in the tumbler between described outer outlet body and described heat conduction deflector,
Plurality of described heat conduction fin, described heat conduction flow distribution plate and described heat conduction deflector be all contained in described outside
In cover body, and described outer outlet body has at least one liquid inlet and at least one liquid outlet；Wherein, cold
But liquid enters in described outer outlet body by the drive of described tumbler from liquid inlet described at least, with
Directly contact described single-piece heat conducting module, so lead to described single-piece from the conduction of described pyrotoxin to absorb
The heat of thermal modules.
The manufacture method of a kind of liquid-cooling type radiator structure that the other another embodiment of the present invention is provided, its
Comprising the following steps: first, form a single-piece heat conducting module, wherein said single-piece heat conducting module includes
The heat-conducting substrate in one contact heating source, multiple heat conduction fin, solid being fixedly installed on described heat-conducting substrate
Surely it is arranged on described heat-conducting substrate and covers the heat conduction flow distribution plate of multiple described heat conduction fin and fixing to set
Put the heat conduction deflector on described heat conduction flow distribution plate；Then, by a combination type water supply module removably group
Being contained on described single-piece heat conducting module, wherein said combination type water supply module includes that one is removably disposed in
Outer outlet body and one on described heat-conducting substrate be removably disposed in described outer outlet body and described heat conduction deflector it
Between tumbler, plurality of described heat conduction fin, described heat conduction flow distribution plate and described heat conduction deflector are all
It is contained in described outer outlet body, and described outer outlet body has at least one liquid inlet and at least one liquid is discharged
Mouthful；Wherein, cooling liquid enters described by the drive of described tumbler from liquid inlet described at least
In outer outlet body, with directly contact described single-piece heat conducting module, so with absorb from described pyrotoxin conduction to
The heat of described single-piece heat conducting module.
Beneficial effects of the present invention can be, the liquid-cooling type radiator structure that the embodiment of the present invention is provided,
It can be by " single-piece heat conducting module includes the heat-conducting substrate in a contact heating source, multiple is fixedly installed on institute
State the heat conduction fin on heat-conducting substrate, one be fixedly installed on described heat-conducting substrate and cover multiple described heat conduction
The heat conduction flow distribution plate of fin and one is fixedly installed on the heat conduction deflector on described heat conduction flow distribution plate " and " cold
But liquid enters in described outer outlet body by the drive of described tumbler from liquid inlet described at least, with
Directly contact described single-piece heat conducting module, so lead to described single-piece from the conduction of described pyrotoxin to absorb
The heat of thermal modules " design, more effectively to promote the integral heat sink usefulness of liquid-cooling type radiator structure.
It is further understood that inventive feature and technology contents for enabling, refers to below in connection with the present invention's
Describe in detail and accompanying drawing, however institute's accompanying drawings only provide with reference to and explanation use, be not used for the present invention in addition
Limit.
Accompanying drawing explanation
Fig. 1 is the perspective exploded view at a wherein viewing visual angle of fluid present invention cooled radiator structure；
Fig. 2 is the perspective exploded view at an other viewing visual angle of fluid present invention cooled radiator structure；
Fig. 3 is the three-dimensional combination schematic diagram of fluid present invention cooled radiator structure；
Fig. 4 is the generalized section of the A-A face line of Fig. 3；
Fig. 5 is the enlarged diagram of the part A of Fig. 4；
Fig. 6 is the generalized section of the B-B face line of Fig. 3；
Fig. 7 is the generalized section of the C-C face line of Fig. 3；
Fig. 8 is the flow chart of the manufacture method of fluid present invention cooled radiator structure.
Description of reference numerals: liquid-cooling type radiator structure M；Single-piece heat conducting module M1；Heat-conducting substrate 1；
Heat conduction fin 2；Heat conduction flow distribution plate 3 first is around shape barricade portion 3A；First ceiling plate portion 3B；Through hole 30；
First perforated portion 30A；Second perforated portion 30B；First aperture D1；Second aperture D2；First flow distribution plate is opened
Mouth 31；Second flow distribution plate opening 32；Heat conduction deflector 4 second is around shape barricade portion 4A；Second ceiling plate portion
4B；Connecting portion 4C；Embedded Division 40C；First deflector opening 41；Second deflector opening 42；Combination
Formula water supply module M2；Outer outlet body 5 liquid inlet 51；Liquid outlet 52；Liquid inlet 53；Pump
6 tumblers 60；Fixture 61；Bolt S；Around shape weld layer W；Cooling liquid L；First accommodating sky
Between R1；Second accommodation space R2；3rd accommodation space R3；4th accommodation space R4；Pyrotoxin H.
Detailed description of the invention
The following is by specific instantiation so that disclosed relevant " liquid-cooling type heat radiation knot to be described
Structure " detailed description of the invention, the stakeholder being familiar with this skill can be understood by content disclosed in the present specification
Advantages of the present invention and effect.The present invention can be implemented by other different specific embodiments or be applied,
Every details in this specification may be based on different viewpoints and application, enters under without departing from the spirit
The various modifications of row and change.It addition, the graphic of the present invention is only the most schematically illustrate, not according to actual size
Description, first give chat bright.Detailed description below will be explained in further detail the correlation technique of the present invention
Content, but disclosed content and be not used to limit the present invention technology category.
Referring to shown in Fig. 1 to Fig. 7, the present invention provides a kind of liquid-cooling type radiator structure M, comprising:
An one single-piece heat conducting module M1 and combination type water supply module M2.
First, coordinating shown in Fig. 2, Fig. 3 and Fig. 4, single-piece heat conducting module M1 includes a contact heating source
The heat-conducting substrate 1 of H (wafer that such as CUP or any can generate heat), multiple it is fixedly installed on heat-conducting substrate 1
Heat conduction fin 2, be fixedly installed on heat-conducting substrate 1 and cover the heat conduction flow distribution plate of multiple heat conduction fin 2
3 and one are fixedly installed on the heat conduction deflector 4 on heat conduction flow distribution plate 3.It addition, combination type water supply module M2
It is removably disposed in outer outlet body 5 including an outer outlet body 5 and being removably disposed on heat-conducting substrate 1
On pump 6, plurality of heat conduction fin 2, heat conduction flow distribution plate 3 and heat conduction deflector 4 are all contained in outer housing
In body 5.For example, outer outlet body 5 can be by multiple bolt S to be removably disposed in heat-conducting substrate 1
On, and pump 6 includes a tumbler 60 being removably disposed between outer outlet body 5 and heat conduction deflector 4 (also
I.e. rotor) and one corresponding to the fixture 61 (namely stator) of tumbler 60.
For further, coordinating shown in Fig. 4 and Fig. 6, heat conduction deflector 4 has one first deflector and opens
Mouth 41 and one is opened with the second deflector being communicated in the first deflector opening 41 by one first accommodation space R1
Mouth 42.It addition, coordinate shown in Fig. 4 and Fig. 7, heat conduction flow distribution plate 3 has one by one second accommodation space
R2 passes through one the 3rd accommodation space with the first flow distribution plate opening 31 and being communicated in the second deflector opening 42
R3 is to be communicated in the second flow distribution plate opening 32 of the first flow distribution plate opening 31.Additionally, coordinate Fig. 2, Fig. 4,
Shown in Fig. 6 and Fig. 7, outer outlet body 5 has at least one is led to be communicated in first by one the 4th accommodation space R4
The liquid inlet 51 and at least one of stream plate opening 41 is communicated in the liquid outlet of the second flow distribution plate opening 32
52.It is noted that outer outlet body 5 can additionally set up another liquid inlet 53, to provide multiple liquid
When body cooled radiator structure M uses at the same time, can according to different demands carry out parallel connection, series connection or
Layout designs that is the most in parallel and that connect.
For example, coordinating shown in Fig. 2, Fig. 4 and Fig. 7, heat conduction flow distribution plate 3 has one and is arranged on heat conduction base
On plate 1 and it is connected to first around the first of multiple heat conduction fins 2 around shape barricade portion 3A and keep off around shape
Wall portion 3A and be arranged on first ceiling plate portion 3B of top of multiple heat conduction fin 2, wherein the first flow distribution plate is opened
Mouthfuls 31 can run through the first ceiling plate portion 3B, and the second flow distribution plate opening 32 can run through the first ceiling plate portion 3B and
It is connected to first around shape barricade portion 3A.It should be noted that produced by pyrotoxin H, heat can be by first
Around shape barricade portion 3A, to be transferred to the first ceiling plate portion 3B.So, the present invention can rely on heat conduction flow distribution plate 3
The thermal conduction characteristic provided is to promote the integral heat sink usefulness of liquid-cooling type radiator structure M.
For example, coordinating shown in Fig. 2, Fig. 4 and Fig. 5, heat conduction deflector 4 has one and is arranged on the first lid
On plate portion 3B second around shape barricade portion 4A, one be connected to second and around shape barricade portion 4A and be arranged on
Second ceiling plate portion 4B and multiple bottom surface from the second ceiling plate portion 4B of the top of one ceiling plate portion 3B downwardly extend
To be connected to the connecting portion 4C of the first ceiling plate portion 3B, and the first deflector opening 41 and the second deflector are opened
Mouthfuls 42 all run through the second ceiling plate portion 4B and are connected to second around shape barricade portion 4A.It should be noted that biography
The heat being handed to the first ceiling plate portion 3B can be by second around shape barricade portion 4A and multiple connecting portion 4C, with transmission
To the second ceiling plate portion 4B.So, the present invention can promote by the thermal conduction characteristic that heat conduction deflector 4 is provided
The integral heat sink usefulness of liquid-cooling type radiator structure M.
It is noted that coordinate shown in Fig. 4, Fig. 6 and Fig. 7, outside the first accommodation space R1 can be formed at
Between cover body 5 and the second ceiling plate portion 4B, the second accommodation space R2 and the 4th accommodation space R4 can be formed
Between heat conduction deflector 4 and the first ceiling plate portion 3B, and the 3rd accommodation space R3 can be formed at heat conduction and divide
Between stream plate 3 and heat-conducting substrate 1.It addition, coordinate shown in Fig. 4 and Fig. 7, the second accommodation space R2 and the
Four accommodation space R4 are separated around shape barricade portion 4A by second, a portion of multiple connecting portion 4C
Can be arranged in the second accommodation space R2, and the remainder of multiple connecting portion 4C can be arranged on the 4th appearance
It is empty in a R4, so that multiple connecting portion 4C presents the cloth being dispersed in two accommodation spaces being spaced
Office's design.
The mode of the first ceiling plate portion 3B it is connected to about multiple connecting portion 4C, for example, as it is shown in figure 5,
First ceiling plate portion 3B has multiple through hole 30 (namely riveted holes), and each through hole 30 has one
The the first perforated portion 30A and one being connected to the second accommodation space R2 or the 4th accommodation space R4 is connected to first
The second perforated portion 30B between perforated portion 30A and the 3rd accommodation space R3.It should be noted that first wears
Hole portion 30A has the first identical aperture D1, and the second perforated portion 30B has from the first perforated portion 30A court
Gradually become the second big aperture D2 to the direction of the 3rd accommodation space R3, and each connecting portion 4C has
One embeds the Embedded Division 40C in corresponding through hole 30.Therefore, the Embedded Division of each connecting portion 4C
40C can firmly fix in corresponding through hole 30, so arranges with effectively lifting heat conduction deflector 4
Steadiness in the first ceiling plate portion 3B.
In sum, coordinate shown in Fig. 4, Fig. 6 and Fig. 7, it is readily understood that, when pyrotoxin H institute
The conduction of heat produced is to the heat-conducting substrate 1 of single-piece heat conducting module M1, multiple heat conduction fin 2, heat conduction shunting
When plate 3 and heat conduction deflector 4, cooling liquid L can be by the drive of the tumbler 60 of pump 6 from least one
Liquid inlet 51 enters in outer outlet body 5, with directly contact single-piece heat conducting module M1 heat-conducting substrate 1,
Multiple heat conduction fins 2, heat conduction flow distribution plate 3 and heat conduction deflector 4, so conduct from pyrotoxin H to absorb
To the heat-conducting substrate 1 of single-piece heat conducting module M1, multiple heat conduction fin 2, heat conduction flow distribution plate 3 and heat conduction
The heat of deflector 4.So, the present invention can rely on heat-conducting substrate 1, multiple heat conduction fin 2, heat conduction to divide simultaneously
The thermal conduction characteristic that stream plate 3 and heat conduction deflector 4 are provided is to promote the whole of liquid-cooling type radiator structure M
Body heat dissipation.
It is noted that coordinate shown in Fig. 2, Fig. 3 and Fig. 8, it is cold that the present invention additionally also provides for a kind of liquid
But the manufacture method of formula radiator structure M, first it comprise the following steps:, forms a single-piece heat conducting module
M1 (S10), wherein single-piece heat conducting module M1 includes the heat-conducting substrate 1 of a contact heating source H, Duo Gegu
Surely the heat conduction fin 2, being arranged on heat-conducting substrate 1 is fixedly installed on heat-conducting substrate 1 and covers multiple leading
The heat conduction flow distribution plate 3 of hot fin 2 and a heat conduction deflector 4 being fixedly installed on heat conduction flow distribution plate 3；So
After, a combination type water supply module M2 is removably assembled on single-piece heat conducting module M1 (S12), its
Middle combination type water supply module M2 includes that an outer outlet body 5 and being removably disposed on heat-conducting substrate 1 is removable
The tumbler 60 being arranged on unloading between outer outlet body 5 and heat conduction deflector 4, plurality of heat conduction fin 2,
Heat conduction flow distribution plate 3 and heat conduction deflector 4 are all contained in outer outlet body 5, and outer outlet body 5 has at least one
Liquid inlet 51 and at least one liquid outlet 52.So, the cooling liquid L band by tumbler 60
Moving enters in outer outlet body 5 from least one liquid inlet 51, with directly contact single-piece heat conducting module M1,
So to absorb the heat from pyrotoxin H conduction to single-piece heat conducting module M1.
For example, as shown in Figure 8, formed in step S10 of single-piece heat conducting module M1, can more enter
One step includes: first, forms multiple heat conduction fin 2 (S100) on heat-conducting substrate 1；Then, heat conduction is led
Stream plate 4 be riveted on (S102) on heat conduction flow distribution plate 3, wherein heat conduction flow distribution plate 3 have multiple riveted holes (namely
Through hole 30)；Then, the heat conduction flow distribution plate 3 with heat conduction deflector 4 is welded on heat-conducting substrate 1
(S104) one, is wherein formed between heat conduction flow distribution plate 3 and heat-conducting substrate 1 around shape weld layer W.It is worth one
Be mentioned that, heat-conducting substrate 1 can by one first predetermined Heat Conduction Material by the way of extrusion molding made by, many
Individual heat conduction fin 2 can be carried out made by the mode shoveling or dig on heat-conducting substrate 1, and sets according to different
Meter demand, the first predetermined Heat Conduction Material can be copper, aluminum and graphite three one of them.It addition, heat conduction divides
Stream plate 3 can be by one second predetermined Heat Conduction Material through made by stamping forming mode, and according to different
Design requirement, the second predetermined Heat Conduction Material can be copper, aluminum and graphite three one of them.Additionally, heat conduction
Deflector 4 can by one the 3rd predetermined Heat Conduction Material by the way of die cast made by, and according to different
Design requirement, the 3rd predetermined Heat Conduction Material can be copper, aluminum and graphite three one of them.
But, an above-mentioned institute illustrated example the most feasible enforcement aspect, it is not used for limiting
The present invention.Such as, single-piece heat conducting module M1 may also be by a predetermined Heat Conduction Material by integrated side
Made by formula, and according to different design requirements, predetermined Heat Conduction Material is the most optional to copper, aluminum and graphite
Three one of them.
(possible effect of embodiment)
In sum, beneficial effects of the present invention can be, the liquid cooling that the embodiment of the present invention is provided
Formula radiator structure M, it can be by " single-piece heat conducting module M1 includes the heat conduction base of a contact heating source H
Plate 1, multiple heat conduction fin 2, being fixedly installed on heat-conducting substrate 1 are fixedly installed on heat-conducting substrate 1
And the heat conduction flow distribution plate 3 and covering multiple heat conduction fin 2 is fixedly installed on the heat conduction on heat conduction flow distribution plate 3
Deflector 4 " and " cooling liquid L passes through the drive of tumbler 60 from least one liquid inlet 51 enters
In cover body 5, with directly contact single-piece heat conducting module M1, so conduct to single-piece from pyrotoxin H to absorb
The heat of formula heat conducting module M1 " design, more effectively to promote the integral heat sink effect of liquid-cooling type radiator structure
Energy.
Described above it is merely exemplary for the purpose of the present invention, and nonrestrictive, ordinary skill people
Member understand, in the case of the spirit and scope limited without departing from claim, can many modifications may be made,
Change or equivalence, but within falling within protection scope of the present invention.
Claims (20)
1. a liquid-cooling type radiator structure, it is characterised in that comprising:
One single-piece heat conducting module, described single-piece heat conducting module include a contact heating source heat-conducting substrate,
Multiple be fixedly installed on described heat-conducting substrate heat conduction fin, one be fixedly installed on described heat-conducting substrate and
The heat conduction flow distribution plate and one covering multiple described heat conduction fin is fixedly installed on leading on described heat conduction flow distribution plate
Thermally induced flow plate, wherein said heat conduction deflector has one first deflector opening and by one first accommodating sky
Between to be communicated in the second deflector opening of described first deflector opening, and described heat conduction flow distribution plate has one
Passed through with the first flow distribution plate opening and being communicated in described second deflector opening by one second accommodation space
One the 3rd accommodation space is to be communicated in the second flow distribution plate opening of described first flow distribution plate opening；And
One combination type water supply module, described combination type water supply module includes that one is removably disposed in described heat conduction
Outer outlet body and one on substrate is removably disposed in the pump on described outer outlet body, plurality of described heat conduction fin
Sheet, described heat conduction flow distribution plate and described heat conduction deflector are all contained in described outer outlet body, and described outer housing
Body has at least one by one the 4th accommodation space to be communicated in the liquid inlet of described first deflector opening
And at least one liquid outlet being communicated in described second flow distribution plate opening；
Wherein, conduction of heat produced by described pyrotoxin to described single-piece heat conducting module described heat-conducting substrate,
Multiple described heat conduction fins, described heat conduction flow distribution plate and described heat conduction deflector；
Wherein, cooling liquid enters described outer housing by the drive of described pump from liquid inlet described at least
Internal, directly to contact described heat-conducting substrate, multiple described heat conduction fin, described heat conduction flow distribution plate and institute
State heat conduction deflector, so conduct to described heat-conducting substrate, multiple described heat conduction from described pyrotoxin to absorb
Fin, described heat conduction flow distribution plate and the heat of described heat conduction deflector.
2. liquid-cooling type radiator structure as claimed in claim 1, it is characterised in that: described heat conduction flow distribution plate
Have one be arranged on described heat-conducting substrate and around multiple described heat conduction fins first around shape barricade portion and
One is connected to described first around shape barricade portion and the first cover plate of the top being arranged on multiple described heat conduction fin
Portion.
3. liquid-cooling type radiator structure as claimed in claim 2, it is characterised in that: described first flow distribution plate
Opening runs through described first ceiling plate portion, and described second flow distribution plate opening runs through described first ceiling plate portion and is connected to
Described first around shape barricade portion, and heat produced by described pyrotoxin is by described first around shape barricade portion,
To be transferred to described first ceiling plate portion.
4. liquid-cooling type radiator structure as claimed in claim 2, it is characterised in that: described heat conduction deflector
Have one be arranged in described first ceiling plate portion second around shape barricade portion, one be connected to described second around
Shape barricade portion and be arranged on described first ceiling plate portion top the second ceiling plate portion and multiple from described second lid
The bottom surface in plate portion downwardly extends to be connected to the connecting portion of described first ceiling plate portion.
5. liquid-cooling type radiator structure as claimed in claim 4, it is characterised in that: described first deflector
Opening and described second deflector opening all run through described second ceiling plate portion and are connected to described second around shape gear
Wall portion, and it is transferred to the heat of described first ceiling plate portion by described second around shape barricade portion and multiple described company
Meet portion, to be transferred to described second ceiling plate portion.
6. liquid-cooling type radiator structure as claimed in claim 4, it is characterised in that: the described first accommodating sky
Between be formed between described outer outlet body and described second ceiling plate portion, described second accommodation space and described 4th hold
It is formed between being empty between described heat conduction deflector and described first ceiling plate portion, and described 3rd accommodation space
It is formed between described heat conduction flow distribution plate and described heat-conducting substrate, wherein said second accommodation space and described
Four accommodation spaces are separated around shape barricade portion by described second, and a portion of multiple described connecting portions sets
Put in described second accommodation space, and the remainder of multiple described connecting portion is arranged on the described 4th and houses
In space.
7. liquid-cooling type radiator structure as claimed in claim 6, it is characterised in that: described first ceiling plate portion
Having multiple through hole, each described through hole has one and is connected to described second accommodation space or described
First perforated portion of four accommodation spaces and one is connected between described first perforated portion and described 3rd accommodation space
The second perforated portion, described first perforated portion has the first identical aperture, described second perforated portion have from
Described first perforated portion gradually becomes the second big aperture towards the direction of described 3rd accommodation space.
8. liquid-cooling type radiator structure as claimed in claim 7, it is characterised in that: each described connection
Portion has the Embedded Division in the described through hole that an embedding is corresponding.
9. a liquid-cooling type radiator structure, it is characterised in that comprising:
One single-piece heat conducting module, described single-piece heat conducting module include a contact heating source heat-conducting substrate,
Multiple be fixedly installed on described heat-conducting substrate heat conduction fin, one be fixedly installed on described heat-conducting substrate and
The heat conduction flow distribution plate and one covering multiple described heat conduction fin is fixedly installed on leading on described heat conduction flow distribution plate
Thermally induced flow plate；And
One combination type water supply module, described combination type water supply module includes that one is removably disposed in described heat conduction
Outer outlet body and one on substrate is removably disposed in the rotation between described outer outlet body and described heat conduction deflector
Part, plurality of described heat conduction fin, described heat conduction flow distribution plate and described heat conduction deflector are all contained in institute
State in outer outlet body, and described outer outlet body has at least one liquid inlet and at least one liquid outlet；
Wherein, cooling liquid enters described by the drive of described tumbler from liquid inlet described at least
In outer outlet body, with directly contact described single-piece heat conducting module, so with absorb from described pyrotoxin conduction to
The heat of described single-piece heat conducting module.
10. liquid-cooling type radiator structure as claimed in claim 9, it is characterised in that: described heat conduction shunts
Plate have one be arranged on described heat-conducting substrate and around multiple described heat conduction fins first around shape barricade portion
And one be connected to described first around the first lid of shape barricade portion and the top being arranged on multiple described heat conduction fin
Plate portion, and heat produced by described pyrotoxin is by described first around shape barricade portion, to be transferred to described the
One ceiling plate portion.
11. liquid-cooling type radiator structures as claimed in claim 10, it is characterised in that: described heat conduction water conservancy diversion
Plate have one be arranged in described first ceiling plate portion second around shape barricade portion, one be connected to described second and enclose
Around shape barricade portion and the second ceiling plate portion of the top being arranged on described first ceiling plate portion and multiple from described second
The bottom surface of ceiling plate portion downwardly extends to be connected to the connecting portion of described first ceiling plate portion, and is transferred to described first
The heat of ceiling plate portion is by described second around shape barricade portion and multiple described connecting portion, to be transferred to described second
Ceiling plate portion.
12. liquid-cooling type radiator structures as claimed in claim 11, it is characterised in that: described first cover plate
Portion has multiple through hole, and it is embedding that each described connecting portion has in the described through hole that an embedding is corresponding
Enter portion.
The manufacture method of 13. 1 kinds of liquid-cooling type radiator structures, it is characterised in that it comprises the following steps:
Forming a single-piece heat conducting module, wherein said single-piece heat conducting module includes leading of a contact heating source
Hot substrate, multiple be fixedly installed on described heat-conducting substrate heat conduction fin, one be fixedly installed on described heat conduction
On substrate and cover the heat conduction flow distribution plate and of multiple described heat conduction fin and be fixedly installed on described heat conduction shunting
Heat conduction deflector on plate；And
One combination type water supply module is removably assembled on described single-piece heat conducting module, wherein said group
Box-like water supply module includes that one is removably disposed in the outer outlet body on described heat-conducting substrate and and removably sets
Put the tumbler between described outer outlet body and described heat conduction deflector, plurality of described heat conduction fin, institute
State heat conduction flow distribution plate and described heat conduction deflector is all contained in described outer outlet body, and described outer outlet body has
At least one liquid inlet and at least one liquid outlet；
Wherein, cooling liquid enters described by the drive of described tumbler from liquid inlet described at least
In outer outlet body, with directly contact described single-piece heat conducting module, so with absorb from described pyrotoxin conduction to
The heat of described single-piece heat conducting module.
The manufacture method of 14. liquid-cooling type radiator structures as claimed in claim 13, it is characterised in that: shape
Become in the step of described single-piece heat conducting module, further include:
Described heat-conducting substrate is formed multiple described heat conduction fin；
Being riveted on described heat conduction flow distribution plate by described heat conduction deflector, wherein said heat conduction flow distribution plate has many
Individual riveted holes；And
The described heat conduction flow distribution plate with described heat conduction deflector is welded on described heat-conducting substrate, Qi Zhongsuo
State and form one between heat conduction flow distribution plate and described heat-conducting substrate around shape weld layer.
The manufacture method of 15. liquid-cooling type radiator structures as claimed in claim 13, it is characterised in that: institute
State heat-conducting substrate be by one first predetermined Heat Conduction Material by the way of extrusion molding made by, multiple described in lead
Hot fin is to carry out on described heat-conducting substrate made by the mode shoveling or dig, and described heat conduction flow distribution plate is by one
Second predetermined Heat Conduction Material is through made by stamping forming mode, and described heat conduction deflector is by one the 3rd
Predetermined Heat Conduction Material is made by by the way of die cast.
The manufacture method of 16. liquid-cooling type radiator structures as claimed in claim 15, it is characterised in that: institute
State the first predetermined Heat Conduction Material be copper, aluminum and graphite three one of them, described second predetermined Heat Conduction Material
For copper, aluminum and graphite three one of them, and described 3rd predetermined Heat Conduction Material is copper, aluminum and graphite
Three one of them.
The manufacture method of 17. liquid-cooling type radiator structures as claimed in claim 13, it is characterised in that: institute
Stating single-piece heat conducting module is by made by integrated mode by a predetermined Heat Conduction Material.
The manufacture method of 18. liquid-cooling type radiator structures as claimed in claim 13, it is characterised in that: institute
State heat conduction flow distribution plate to have one and be arranged on described heat-conducting substrate and enclose around the first of multiple described heat conduction fins
It is connected to described first around shape barricade portion and one and around shape barricade portion and is arranged on the upper of multiple described heat conduction fin
First ceiling plate portion of side, and heat produced by described pyrotoxin is by described first around shape barricade portion, to pass
It is handed to described first ceiling plate portion.
The manufacture method of 19. liquid-cooling type radiator structures as claimed in claim 18, it is characterised in that: institute
State heat conduction deflector have one be arranged in described first ceiling plate portion second around shape barricade portion, one be connected to
Described second around shape barricade portion and the second ceiling plate portion of the top being arranged on described first ceiling plate portion and multiple
Downwardly extend to be connected to the connecting portion of described first ceiling plate portion, and transmission from the bottom surface of described second ceiling plate portion
To the heat of described first ceiling plate portion by described second around shape barricade portion and multiple described connecting portion, with transmission
To described second ceiling plate portion.
The manufacture method of 20. liquid-cooling type radiator structures as claimed in claim 19, it is characterised in that: institute
State the first ceiling plate portion and there is multiple through hole, each described connecting portion have an embedding corresponding described in pass through
Embedded Division in perforation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510044320.1A CN105992488A (en) | 2015-01-28 | 2015-01-28 | Liquid cooling-type radiating structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510044320.1A CN105992488A (en) | 2015-01-28 | 2015-01-28 | Liquid cooling-type radiating structure and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105992488A true CN105992488A (en) | 2016-10-05 |
Family
ID=57036440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510044320.1A Withdrawn CN105992488A (en) | 2015-01-28 | 2015-01-28 | Liquid cooling-type radiating structure and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105992488A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102018125375A1 (en) * | 2018-10-14 | 2020-04-16 | Han Xu Hardware Plastic Technological Co., Ltd. | WATER COOLED HIGH EFFICIENCY HEAT EXTRACTION DEVICE |
| TWI725590B (en) * | 2019-10-25 | 2021-04-21 | 雙鴻科技股份有限公司 | Cold plate |
| TWI726750B (en) * | 2019-06-26 | 2021-05-01 | 雙鴻科技股份有限公司 | Cold plate |
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| DE102018125375A1 (en) * | 2018-10-14 | 2020-04-16 | Han Xu Hardware Plastic Technological Co., Ltd. | WATER COOLED HIGH EFFICIENCY HEAT EXTRACTION DEVICE |
| TWI726750B (en) * | 2019-06-26 | 2021-05-01 | 雙鴻科技股份有限公司 | Cold plate |
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Application publication date: 20161005 |