TW202100929A - Cold plate - Google Patents

Cold plate Download PDF

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Publication number
TW202100929A
TW202100929A TW109121145A TW109121145A TW202100929A TW 202100929 A TW202100929 A TW 202100929A TW 109121145 A TW109121145 A TW 109121145A TW 109121145 A TW109121145 A TW 109121145A TW 202100929 A TW202100929 A TW 202100929A
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Taiwan
Prior art keywords
water
heat transfer
transfer structure
item
working medium
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TW109121145A
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Chinese (zh)
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TWI726750B (en
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陳建安
陳建佑
陳韋豪
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雙鴻科技股份有限公司
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254Cold plates transferring heat from heat source to coolant

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)

Abstract

The present invention provides a cold plate, comprising: a heat absorption chamber for a working medium to be filled in; a heat transfer structure disposed on a base within the heat absorption chamber for transferring heat energy generated from a heat source contacting to the base to the working medium; a chamber disposed above the heat transfer structure within a casing and separated from the heat absorption; and a connection structure disposed in the casing to communicate with the chamber and the heat absorption chamber.

Description

水冷頭 Water block

本發明涉及散熱領域,尤指一種水冷頭。 The invention relates to the field of heat dissipation, in particular to a water cooling head.

因應現代化需求,電腦與各種電子裝置發展快速且效能不斷地提昇,但在此過程中,高效能之硬體所帶來之散熱問題亦隨之而來。一般而言,電腦與各種電子裝置通常會使用散熱元件來進行散熱,例如使用散熱膏或散熱片來貼附於欲散熱之電子元件上,以將熱吸出並逸散。然而,此種散熱方式效果有限,因而發展出使用液體冷卻方式之散熱模組。 In response to modernization needs, computers and various electronic devices have developed rapidly and their performance has been continuously improved. However, in the process, heat dissipation problems caused by high-performance hardware have also followed. Generally speaking, computers and various electronic devices usually use heat-dissipating components to dissipate heat. For example, heat-dissipating paste or heat sinks are used to attach heat to the electronic components to be dissipated to absorb and dissipate heat. However, the effect of this heat dissipation method is limited, so a heat dissipation module using a liquid cooling method has been developed.

現有之使用液體冷卻方式之散熱模組一般是採用冷卻液來吸附熱能,例如將冷卻液流體連接至欲散熱之電子元件,已受熱之冷卻液可往較低溫處流動來進行熱交換,熱交換後之冷卻液即可再流動至欲散熱之電子元件來吸附熱能,如此可形成一散熱循環。 Existing heat dissipation modules that use liquid cooling methods generally use coolant to absorb heat. For example, the coolant is fluidly connected to electronic components to be dissipated. The heated coolant can flow to a lower temperature for heat exchange. The subsequent cooling liquid can then flow to the electronic components to be dissipated to absorb heat energy, thus forming a heat dissipation cycle.

惟現有之散熱模組在將冷卻液運送至欲散熱之電子元件中用以吸附熱能之空間時,冷卻液的儲存空間經常不足,導致水冷頭位置變更或移動時,經常發生冷卻液供給不及的問題。 However, when the existing heat dissipation module transports the cooling liquid to the space for absorbing heat energy in the electronic components to be dissipated, the storage space of the cooling liquid is often insufficient, which causes the lack of cooling liquid supply when the position of the water block is changed or moved. problem.

是以,如何提出一種可解決上述問題之水冷頭,為目前業界亟待解決的課題之一。 Therefore, how to propose a water-cooling head that can solve the above-mentioned problems is one of the urgent problems in the industry.

本發明之一目的在於提供一種水冷頭,包括:殼體;底座,係結合至該殼體,以在該殼體與該底座間形成一供工作介質流動於其中之作用空間;腔室,係形成於該殼體內且與該作用空間分離,並透過一連通結構連通該作用空間;傳熱結構,係設於該底座之內側,用以將接觸於該底座之外側上之熱源所產生的熱能傳遞至該作用空間內之工作介質;以及泵浦,係設於部分該傳熱結構上方,用以將該作用空間區隔為吸熱空間及排水空間,以驅動該工作介質從該腔室經由該連通結構流動至該吸熱空間及該排水空間。 An object of the present invention is to provide a water cooling head, comprising: a housing; a base coupled to the housing to form a working space between the housing and the base for a working medium to flow therein; a cavity, It is formed in the shell and separated from the working space, and communicates with the working space through a communicating structure; the heat transfer structure is arranged on the inner side of the base to transfer the heat generated by the heat source on the outer side of the base The working medium transferred to the working space; and a pump, which is arranged above part of the heat transfer structure to partition the working space into a heat absorption space and a drainage space, so as to drive the working medium from the chamber through the The communication structure flows to the heat absorption space and the drainage space.

前述之水冷頭中,更包括:第一進水通道,係與該腔室連通,用以使該工作介質流入該腔室;第二進水通道,係與該連通結構連通,用以使該工作介質流入該吸熱空間;以及排水通道,係與該排水空間連通,用以將該工作介質從該排水空間排出。 The aforementioned water cooling head further includes: a first water inlet channel connected to the chamber to allow the working medium to flow into the cavity; a second water inlet channel connected to the communicating structure to enable the The working medium flows into the heat absorption space; and the drainage channel is connected with the drainage space to discharge the working medium from the drainage space.

前述之水冷頭中,該第一進水通道與該排水通道係位於該殼體之同一側,而該第二進水通道與該排水通道係位於該殼體之不同側。 In the aforementioned water cooling head, the first water inlet channel and the drain channel are located on the same side of the casing, and the second water inlet channel and the drain channel are located on different sides of the casing.

前述之水冷頭中,該連通結構設於該殼體內之該腔室與該第二進水通道之間。 In the aforementioned water cooling head, the communication structure is provided between the cavity in the housing and the second water inlet channel.

前述之水冷頭中,該殼體位於與該底座組合之側上具有凹部,且位於該泵浦下方之該傳熱結構的高度低於位於該凹部下方之該傳熱結構的高度。 In the aforementioned water cooling head, the shell has a recess on the side combined with the base, and the height of the heat transfer structure under the pump is lower than the height of the heat transfer structure under the recess.

前述之水冷頭中,該腔室係外露於該殼體與該底座組合之側的相對側。 In the aforementioned water cooling head, the cavity is exposed on the side opposite to the side where the shell and the base are combined.

前述之水冷頭中,該連通結構為形成於該殼體內並連通該腔室之一側及該傳熱結構之周圍的通道。 In the aforementioned water cooling head, the communicating structure is a channel formed in the housing and communicating one side of the cavity and the surroundings of the heat transfer structure.

前述之水冷頭中,該連通結構為該殼體上貫通該腔室至該作用空間之導流槽。 In the aforementioned water cooling head, the communicating structure is a diversion groove on the shell that penetrates the chamber to the working space.

前述之水冷頭中,該導流槽係位於部分該傳熱結構上方。 In the aforementioned water cooling head, the diversion groove is located above a part of the heat transfer structure.

前述之水冷頭中,該傳熱結構為複數個鰭片,且該導流槽之延伸方向係不同於該複數個鰭片之延伸方向。 In the aforementioned water cooling head, the heat transfer structure is a plurality of fins, and the extension direction of the flow guide groove is different from the extension direction of the plurality of fins.

前述之水冷頭中,在該傳熱結構之周圍的該底座之內側上凹陷形成一匯流區,用以將該工作介質引導至該泵浦下方。 In the aforementioned water-cooling head, a confluence area is recessed on the inner side of the base around the heat transfer structure to guide the working medium under the pump.

本發明之另一目的在於提供一種水冷頭,包括:吸熱空間,係供工作介質流動於其中;傳熱結構,係設於底座上並位於該吸熱空間中,用以將與該底座接觸之熱源所產生之熱能傳遞至該工作介質;腔室,係位於該傳熱結構上方的殼體內且與該吸熱空間分離;以及連通結構,係設於該殼體內以連通該腔室及該吸熱空間。 Another object of the present invention is to provide a water-cooling head, including: a heat absorption space for working medium to flow therein; a heat transfer structure, which is arranged on a base and located in the heat absorption space, and is used to connect a heat source in contact with the base The generated heat energy is transferred to the working medium; the cavity is located in the shell above the heat transfer structure and separated from the heat absorption space; and the communication structure is provided in the shell to communicate the cavity and the heat absorption space.

前述之水冷頭中,更包括:至少一進水通道,用以使該工作介質流入該腔室;以及排水通道,用以將該工作介質從該吸熱空間排出。 The aforementioned water cooling head further includes: at least one water inlet channel for allowing the working medium to flow into the chamber; and a drainage channel for discharging the working medium from the heat absorption space.

前述之水冷頭中,該進水通道與該排水通道係位於該殼體之同一側或不同側。 In the aforementioned water cooling head, the water inlet channel and the drain channel are located on the same side or different sides of the housing.

前述之水冷頭中,該連通結構係設於該殼體內之該腔室與該進水通道之間。 In the aforementioned water cooling head, the communication structure is provided between the chamber and the water inlet channel in the housing.

前述之水冷頭中,該殼體面向該傳熱結構之側上具有凹部,且位於該凹部下方之該傳熱結構的高度高於未位於該凹部下方之該傳熱結構的高度。 In the aforementioned water cooling head, the shell has a recess on the side facing the heat transfer structure, and the height of the heat transfer structure located under the recess is higher than the height of the heat transfer structure not located under the recess.

前述之水冷頭中,該腔室係外露於該殼體面向該傳熱結構之側的相對側。 In the aforementioned water cooling head, the cavity is exposed on the side opposite to the side of the shell facing the heat transfer structure.

前述之水冷頭中,該連通結構為形成於該殼體內並連通該腔室之一側及該傳熱結構之周圍的通道。 In the aforementioned water cooling head, the communicating structure is a channel formed in the housing and communicating one side of the cavity and the surroundings of the heat transfer structure.

前述之水冷頭中,該連通結構為該殼體上貫通該腔室至該吸熱空間之導流槽。 In the aforementioned water cooling head, the communication structure is a diversion groove on the shell that penetrates the cavity to the heat absorption space.

前述之水冷頭中,該導流槽係位於部分該傳熱結構上方。 In the aforementioned water cooling head, the diversion groove is located above a part of the heat transfer structure.

前述之水冷頭中,該傳熱結構為複數個鰭片,且該導流槽之延伸方向係不同於該複數個鰭片之延伸方向。 In the aforementioned water cooling head, the heat transfer structure is a plurality of fins, and the extension direction of the flow guide groove is different from the extension direction of the plurality of fins.

前述之水冷頭中,在該傳熱結構之周圍的該底座上凹陷形成一匯流區。 In the aforementioned water-cooling head, a confluence area is recessed on the base around the heat transfer structure.

1、1’:水冷頭 1, 1’: Water cooling head

2:殼體 2: shell

21:機電腔室 21: Electromechanical chamber

22、22’:第一進水通道 22, 22’: The first water inlet channel

23、23’:第二進水通道 23, 23’: The second water inlet channel

24:腔室 24: Chamber

241:導流槽 241: diversion groove

25、25’:排水通道 25, 25’: Drainage channel

26:通道 26: Channel

27:凹部 27: recess

28、29:凹槽 28, 29: Groove

3:上蓋 3: upper cover

4:底座 4: base

41:吸熱面 41: Endothermic surface

42:傳熱結構 42: Heat transfer structure

43:內側 43: inside

44:匯流區 44: Confluence area

45:凹槽 45: Groove

5:泵浦 5: Pump

51:電路板 51: circuit board

52:第一磁性元件 52: The first magnetic element

53:扇葉 53: fan blade

531:頂壁 531: top wall

532:底盤 532: Chassis

533:間隔牆 533: Partition Wall

534:軸套 534: Bushing

535:軸棒 535: Shaft

536:鏤空部 536: Hollow

537:肋條 537: rib

538:排水腔 538: Drain cavity

539:固定件 539: fixed parts

54:第二磁性元件 54: second magnetic element

55:電線 55: Wire

6:作用空間 6: Action space

61:吸熱空間 61: Endothermic space

62:排水空間 62: Drainage space

71、72、73:管路 71, 72, 73: pipeline

74:封蓋 74: cap

8:外蓋 8: Outer cover

9A、9B、9C:接頭 9A, 9B, 9C: Connector

θ:角度 θ: Angle

第1A及1B圖為本發明之水冷頭於不同視角之立體示意圖。 Figures 1A and 1B are three-dimensional schematic diagrams of the water block of the present invention from different viewing angles.

第1C圖為本發明之水冷頭之爆炸示意圖。 Figure 1C is an exploded schematic diagram of the water block of the present invention.

第2A至2D圖為本發明之水冷頭中殼體及泵浦於不同視角之立體示意圖。 2A to 2D are three-dimensional schematic diagrams of the housing and pump of the water block of the present invention from different viewing angles.

第3A圖為第1A圖中沿3A-3A剖面線之剖面示意圖。 Figure 3A is a schematic cross-sectional view taken along the line 3A-3A in Figure 1A.

第3B圖為第1A圖中沿3B-3B剖面線之剖面示意圖。 Figure 3B is a schematic cross-sectional view taken along the line 3B-3B in Figure 1A.

第3C圖為第1A圖中沿3C-3C剖面線之剖面示意圖。 Figure 3C is a schematic cross-sectional view taken along the line 3C-3C in Figure 1A.

第3D圖為第1A圖中沿3D-3D剖面線之剖面示意圖。 Figure 3D is a schematic cross-sectional view taken along the line 3D-3D in Figure 1A.

第4A圖為本發明之水冷頭中泵浦與底座之立體示意圖。 Figure 4A is a perspective view of the pump and the base of the water cooling head of the present invention.

第4B及4C圖為本發明之水冷頭中泵浦於不同視角之立體示意圖。 4B and 4C are three-dimensional schematic diagrams of the pump in different viewing angles in the water block of the present invention.

第5A及5B圖為本發明之水冷頭與其他水冷頭共同構成迴路時之示意圖。 Figures 5A and 5B are schematic diagrams when the water block of the present invention and other water blocks form a circuit together.

第6A圖為本發明之水冷頭之另一實施例之立體示意圖。 Fig. 6A is a perspective view of another embodiment of the water block of the present invention.

第6B圖為第6A圖中將外殼拆解後之立體示意圖。 Figure 6B is a perspective view of Figure 6A with the housing disassembled.

第6C及6D圖為第6B圖中將上蓋拆解後以外露腔室之於不同視角之立體示意圖。 Figures 6C and 6D are three-dimensional diagrams of the chamber exposed from different perspectives after the upper cover is disassembled in Figure 6B.

第6E圖為本發明之水冷頭之另一實施例之爆炸示意圖。 Figure 6E is an exploded schematic view of another embodiment of the water block of the present invention.

第7A及7B圖為本發明之水冷頭之另一實施例中,殼體與泵浦於組裝後及組裝前之立體示意圖。 Figures 7A and 7B are perspective schematic views of the housing and the pump after and before assembly in another embodiment of the water cooling head of the present invention.

第8A圖為第6A圖中沿8A-8A剖面線之剖面示意圖。 Figure 8A is a schematic cross-sectional view taken along the line 8A-8A in Figure 6A.

第8B圖為第6A圖中沿8B-8B剖面線之剖面示意圖。 Figure 8B is a schematic cross-sectional view taken along section line 8B-8B in Figure 6A.

第8C圖為第6A圖中沿8C-8C剖面線之剖面示意圖。 Figure 8C is a schematic cross-sectional view taken along the line 8C-8C in Figure 6A.

第9A及9B圖為本發明之水冷頭之另一實施例中,工作介質於殼體與底座之間流動的過程示意圖。 9A and 9B are schematic diagrams of the process of the working medium flowing between the housing and the base in another embodiment of the water cooling head of the present invention.

第9C至9E圖為本發明之水冷頭之另一實施例中,導流槽之不同實施態樣之示意圖。 Figures 9C to 9E are schematic diagrams of different implementations of the diversion groove in another embodiment of the water block of the present invention.

以下藉由特定之具體實施例加以說明本發明之實施方式,而熟悉此技術之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點和功效,亦可藉由其他不同的具體實施例加以施行或應用。 The following specific examples illustrate the implementation of the present invention, and those skilled in the art can easily understand the other advantages and effects of the present invention from the contents disclosed in this specification, as well as other different specific embodiments. To implement or apply.

本發明所提供的水冷頭可安裝於電腦主機或伺服器等電子裝置中,水冷頭內部可充填工作介質(例如冷卻液),該工作介質可吸收發熱源(例如晶片或是記憶體等電子元件)所產生的熱能,升溫後的工作介質可傳送至冷凝裝置予以降溫,而降溫後的工作介質可再傳回至水冷頭,以進行下一次的吸熱與循環流動。 The water cooling head provided by the present invention can be installed in electronic devices such as a computer host or a server. The inside of the water cooling head can be filled with a working medium (such as coolant), which can absorb heat sources (such as chips or electronic components such as memory). ) The heated working medium can be sent to the condensing device to cool down the heat generated, and the cooled working medium can be transferred back to the water block for the next heat absorption and circulating flow.

請同時參閱第1A至1C、2A至2D圖,本發明之水冷頭1可包括殼體2、上蓋3、底座4以及泵浦5。殼體2可作為水冷頭1主要的結構件,其上方與上蓋3結合,其下方與底座4結合,其側邊則可形成有第一進水通道22、第二進水通道23以及排水通道25。上述殼體2與各部件之結合,可在殼體2之不同部位上形成有例如螺孔、螺柱或扣具等固定結構,以利組裝時通過鎖固方式來結合各部件,但本發明並不限於此種結合方式。 Please refer to FIGS. 1A to 1C and 2A to 2D at the same time. The water cooling head 1 of the present invention may include a housing 2, an upper cover 3, a base 4, and a pump 5. The housing 2 can be used as the main structural part of the water cooling head 1. The upper part is combined with the upper cover 3, and the lower part is combined with the base 4, and the sides can be formed with a first water inlet channel 22, a second water inlet channel 23 and a drain channel 25. The above-mentioned combination of the housing 2 and the components can be formed with fixing structures such as screw holes, studs or fasteners on different parts of the housing 2, so as to facilitate the combination of the various components by locking during assembly. However, the present invention It is not limited to this combination.

在本實施例中,殼體2在結構上可界定出不同的腔室以及通道,包括機電腔室21、第一進水通道22、第二進水通道23、腔室24以及排水通道25等,其中,機電腔室21開口於殼體2的頂側並獨立於水冷頭1中工作介質流動的路徑,因而能夠保護設置在機電腔室21內的通電元件,避免因工作介質之介入而發生短路情況。 In this embodiment, the housing 2 can define different chambers and channels in structure, including an electromechanical chamber 21, a first water inlet channel 22, a second water inlet channel 23, a chamber 24, a drain channel 25, etc. Among them, the electromechanical chamber 21 opens on the top side of the housing 2 and is independent of the path of the working medium flowing in the water cooling head 1, so that the energized components arranged in the electromechanical chamber 21 can be protected to avoid the occurrence of the working medium. Short circuit situation.

在本實施例中,泵浦5可包括電路板51、第一磁性元件52、扇葉53以及第二磁性元件54,其中,電路板51與第一磁性元件52可設置在機電腔室21內,而扇葉53以及第二磁性元件54則設置在機電腔室21之另一側(例如位在 工作介質流經的路徑內,如第2C圖所示之凹槽28中),且其中,透過電路板51以提供泵浦5運轉所需的電力,例如利用電線55的有線連接方式(如第6A至6D圖所示),或是以電磁感應等其他無線連接方式來連接一電源(圖未示)。於本實施例中,電路板51及第一磁性元件52藉由殼體2而與扇葉53及第二磁性元件54分隔開來,但第一磁性元件52與第二磁性元件54仍是共軸設置。於一實施例中,第一磁性元件52與第二磁性元件54可以選自磁鐵或是其他可以被磁場所驅動或吸引的材料。此外,第二磁性元件54與扇葉53結合在一起,當泵浦5通電時,在電路板51、第一磁性元件52以及第二磁性元件54的共同作用下,與第二磁性元件54軸接的扇葉53即令為該第二磁性元件54所驅動而轉動,俾由扇葉53之轉動帶領工作介質流動。 In this embodiment, the pump 5 may include a circuit board 51, a first magnetic element 52, a fan blade 53, and a second magnetic element 54, wherein the circuit board 51 and the first magnetic element 52 may be arranged in the electromechanical chamber 21 , And the fan blade 53 and the second magnetic element 54 are arranged on the other side of the electromechanical chamber 21 (for example, located at In the path through which the working medium flows, such as in the groove 28 shown in Figure 2C), and the circuit board 51 is used to provide the power required for the operation of the pump 5, for example, a wired connection method using a wire 55 (such as 6A to 6D), or other wireless connection methods such as electromagnetic induction to connect a power source (not shown). In this embodiment, the circuit board 51 and the first magnetic element 52 are separated from the fan blade 53 and the second magnetic element 54 by the housing 2, but the first magnetic element 52 and the second magnetic element 54 are still Coaxial setting. In one embodiment, the first magnetic element 52 and the second magnetic element 54 can be selected from magnets or other materials that can be driven or attracted by a magnetic field. In addition, the second magnetic element 54 is combined with the fan blade 53. When the pump 5 is energized, under the joint action of the circuit board 51, the first magnetic element 52, and the second magnetic element 54, the axis of the second magnetic element 54 The connected fan blade 53 is driven by the second magnetic element 54 to rotate, so that the rotation of the fan blade 53 leads the working medium to flow.

於本實施例中,底座4用以吸收熱能,其材質可選自金屬或其他導熱性良好的材料。底座4在結構上可以是一件式(一體成形)的結構,也可是複數層或複數個元件所組成的複合結構,本發明並不以此為限。底座4之外側(遠離殼體2之側)具有一吸熱面41,底座4的內側43(面向殼體2之側)上形成有(或可設置)一傳熱結構42,其中,吸熱面41可與熱源直接或間接接觸,使得吸熱面41可吸收熱源所產生之熱能後,將熱能傳遞至傳熱結構42,傳熱結構42則會再透過與工作介質之接觸,而將熱能傳遞至工作介質。 In this embodiment, the base 4 is used to absorb heat energy, and its material can be selected from metal or other materials with good thermal conductivity. The base 4 can be a one-piece (integrally formed) structure, or a composite structure composed of multiple layers or multiple elements, and the present invention is not limited thereto. The outer side of the base 4 (the side away from the housing 2) has a heat-absorbing surface 41, and a heat transfer structure 42 is formed (or can be provided) on the inner side 43 (the side facing the housing 2) of the base 4, wherein the heat-absorbing surface 41 It can be in direct or indirect contact with the heat source, so that the heat absorbing surface 41 can absorb the heat energy generated by the heat source and then transfer the heat energy to the heat transfer structure 42. The heat transfer structure 42 will then transfer the heat energy to the work through contact with the working medium. medium.

於一實施例中,底座4的傳熱結構42可為切削式鰭片(skived fin),或是其他柱狀、片狀、甚至於是不規則的形狀的鰭片,只要能夠增加與工作介質接觸的面積,讓熱能更快傳遞至工作介質即可,本發明並不限制傳熱結構42之具體結構。 In one embodiment, the heat transfer structure 42 of the base 4 can be skived fins, or other columnar, sheet-like, or even irregularly shaped fins, as long as it can increase contact with the working medium The area of ?? allows the heat to be transferred to the working medium faster, and the present invention does not limit the specific structure of the heat transfer structure 42.

請再配合參閱第3C及3D圖,當底座4結合至殼體2後,殼體2與底座4兩者可共同界定出一個作用空間6,該作用空間6可填充工作介質並供工作介質流動。於一實施例中,作用空間6可由泵浦5之扇葉53來區隔出一吸熱空間61以及一排水空間62,而不依靠其他的隔牆或是隔間等元件,因而能夠簡化水冷頭1內部的結構。於本實施例中,殼體2之第一進水通道22及第二進水通道23係與吸熱空間61連通,用以讓冷卻後的工作介質流入吸熱空間61內,使工作介質吸收由傳熱結構42所傳遞之熱能。扇葉53可將工作介質直接從吸熱空間61吸取到排水空間62。另外,排水通道25則與排水空間62連通,故可將已升溫的工作介質傳送至水冷頭1的外部來進行冷卻。此外,第一進水通道22、第二進水通道23與排水通道25可分別再向外延伸或是連接如第6A至6D圖所示之接頭9A、9B、9C,接頭9A、9B、9C則再藉由如第5A及5B之管路71、72、73來與冷凝裝置(例如水冷排、風扇等)做連通。接頭9A、9B、9C可垂直或水平地連接於殼體2上,或是採用彎頭的設置,以符合水冷頭1內部不同的空間配置需求,本發明並不以此為限。 Please refer to Figures 3C and 3D for cooperation. When the base 4 is combined with the housing 2, the housing 2 and the base 4 can jointly define a working space 6, which can be filled with and flowed by working medium . In one embodiment, the action space 6 can be separated by a heat absorption space 61 and a drainage space 62 by the fan blades 53 of the pump 5, instead of relying on other partition walls or compartments, etc., thereby simplifying the water block 1 Internal structure. In this embodiment, the first water inlet channel 22 and the second water inlet channel 23 of the housing 2 are connected to the heat absorption space 61 to allow the cooled working medium to flow into the heat absorption space 61, so that the working medium can absorb the heat The thermal energy transferred by the thermal structure 42. The fan blade 53 can directly suck the working medium from the heat absorption space 61 to the drainage space 62. In addition, the drainage channel 25 is connected to the drainage space 62, so the heated working medium can be transported to the outside of the water block 1 for cooling. In addition, the first water inlet channel 22, the second water inlet channel 23, and the drain channel 25 can respectively extend outward or be connected to the connectors 9A, 9B, 9C, and connectors 9A, 9B, 9C shown in Figures 6A to 6D. Then, it communicates with the condensing device (such as a water cooling radiator, a fan, etc.) through pipelines 71, 72, and 73 of 5A and 5B. The joints 9A, 9B, and 9C can be connected to the housing 2 vertically or horizontally, or arranged with elbows to meet the different space configuration requirements inside the water cooling head 1, and the present invention is not limited thereto.

以下進一步說明本發明水冷頭1中泵浦5之扇葉53的整體結構,請進一步同時參閱第4B及4C圖。如前所述,本發明之水冷頭1中的作用空間6係由泵浦5之扇葉53來區隔出吸熱空間61以及排水空間62,因此,扇葉53本身同時具備有吸取工作介質以及排出工作介質的雙重功能。為了達成上述的功能,扇葉53係設置在作用空間6內並鄰近排水通道25,用以將工作介質直接從吸熱空間61吸取到排水空間62後,經由排水通道25將工作介質排出水冷頭1。扇葉53包括頂壁531、底盤532、間隔牆533、軸套534以及軸棒535,而底盤532與軸套534之間形成有鏤空部536,並且底盤532與軸套534可透過在鏤空部536中之至少一肋條 537來連接。底盤532是扇葉53中主要將作用空間6劃分為吸熱空間61與排水空間62的結構,而吸熱空間61與排水空間62則藉由鏤空部536來進行液體的耦合(fluidly coupling),也就是工作介質得以從吸熱空間61經由鏤空部536而進入排水空間62。頂壁531與底盤532係間隔設置,兩者之間連接有複數個間隔牆533,因而能夠區隔出複數個排水腔538。當工作介質從吸熱空間61經由鏤空部536而向上傳遞至排水空間62的過程中,工作介質會先碰觸到頂壁531後轉向,往各個排水腔538移動,然後因為離心力的作用而讓各排水腔538內的工作介質依序被甩入排水通道25後排出水冷頭1。扇葉53的頂壁531除了具有可以改變流向的導引功能之外,同時也可防止間隔牆533直接碰觸到殼體2,降低磨耗發生的機會。 The following further describes the overall structure of the fan blade 53 of the pump 5 in the water cooling head 1 of the present invention. Please refer to FIGS. 4B and 4C at the same time. As mentioned above, the working space 6 in the water cooling head 1 of the present invention is separated by the heat absorption space 61 and the drainage space 62 by the fan blade 53 of the pump 5. Therefore, the fan blade 53 itself has both suction working medium and The dual function of discharging working medium. In order to achieve the above-mentioned functions, the fan blade 53 is arranged in the working space 6 and adjacent to the drainage channel 25 to directly suck the working medium from the heat absorption space 61 into the drainage space 62, and then discharge the working medium from the water cooling head 1 through the drainage channel 25. . The fan blade 53 includes a top wall 531, a bottom plate 532, a partition wall 533, a shaft sleeve 534, and a shaft rod 535. A hollow portion 536 is formed between the bottom plate 532 and the shaft sleeve 534, and the bottom plate 532 and the shaft sleeve 534 can pass through the hollow portion At least one rib in 536 537 to connect. The chassis 532 is a structure of the fan blade 53 that mainly divides the action space 6 into a heat absorption space 61 and a drainage space 62, and the heat absorption space 61 and the drainage space 62 are fluidly coupled through the hollow portion 536, that is, The working medium can enter the drainage space 62 from the heat absorption space 61 through the hollow part 536. The top wall 531 and the chassis 532 are spaced apart, and a plurality of partition walls 533 are connected between the two, so that a plurality of drainage cavities 538 can be separated. When the working medium is transferred upwards from the heat absorption space 61 to the drainage space 62 through the hollow part 536, the working medium will first touch the top wall 531 and then turn, move to each drainage cavity 538, and then drain each drain due to centrifugal force. The working medium in the cavity 538 is sequentially thrown into the drainage channel 25 and then discharged from the water block 1. The top wall 531 of the fan blade 53 not only has a guiding function that can change the flow direction, but also prevents the partition wall 533 from directly contacting the housing 2 to reduce the chance of wear.

於本實施例中,扇葉53是藉由第一磁性元件52與第二磁性元件54彼此間的電磁感應而被驅動,並非經由軸棒535來驅動,因此扇葉53與軸棒535之間沒有連動的關係。但為了能夠維持扇葉53的耐用度與穩定度,使其旋轉時不致偏軸或是碰觸到殼體2而產生磨耗,因此,扇葉53內部可設置有中空結構的軸套534,可供軸棒535套設。又,為了將軸棒535予以固定,軸棒535之一端可容設在作用空間6的頂部(也就是殼體2的內側)的凹槽28中,而另一端可藉由固定件539來加以固定,例如固定件539上設有供軸棒535容設之盲孔或穿孔等。此外,固定件539可收納並固定於殼體2底面的一凹槽29內(如第7A圖所示),或是將固定件539直接安裝在底座4的凹槽45內(如第1C圖所示),本發明並不以此為限。於一實施例中,當軸棒535安裝於作用空間6內時,較佳的方式是要與固定件539一起延伸或深入到吸熱空間61內,此舉將使得扇葉53轉動時更加穩固,但本發明並不以此為限。 In this embodiment, the fan blade 53 is driven by the electromagnetic induction between the first magnetic element 52 and the second magnetic element 54 instead of the shaft rod 535. Therefore, the fan blade 53 and the shaft rod 535 are There is no linkage relationship. However, in order to maintain the durability and stability of the fan blade 53 so that it does not deviate from the axis or touch the housing 2 and cause wear when rotating, therefore, a hollow structure sleeve 534 can be provided inside the fan blade 53. 535 sets of shaft rods. In addition, in order to fix the shaft rod 535, one end of the shaft rod 535 can be accommodated in the groove 28 at the top of the working space 6 (that is, the inner side of the housing 2), and the other end can be fixed by a fixing member 539 For fixing, for example, the fixing member 539 is provided with blind holes or perforations for the shaft rod 535 to accommodate. In addition, the fixing member 539 can be received and fixed in a groove 29 on the bottom surface of the housing 2 (as shown in Fig. 7A), or the fixing member 539 can be directly installed in the groove 45 of the base 4 (as shown in Fig. 1C). As shown), the present invention is not limited thereto. In one embodiment, when the shaft 535 is installed in the working space 6, the better way is to extend together with the fixing member 539 or go deep into the heat absorption space 61, which will make the fan blade 53 more stable when rotating. However, the present invention is not limited to this.

於一實施例中,考量到扇葉53本身的材質,若需要時可在軸套534內再套設並固定一軸管(圖未示),此軸管與軸套534跟軸棒535共軸設置,並且位於軸套534跟軸棒535之間。軸管的材質可選用抗磨耗或是較耐磨的材質,從而能降低扇葉53與軸棒535在相對轉動時的磨損,延長扇葉53的壽命。 In one embodiment, considering the material of the fan blade 53 itself, if necessary, a shaft tube (not shown) can be sleeved and fixed in the shaft sleeve 534. The shaft tube and the shaft sleeve 534 are coaxial with the shaft rod 535. Set, and located between the sleeve 534 and the shaft 535. The material of the shaft tube can be made of abrasion-resistant or more wear-resistant material, so that the wear of the fan blade 53 and the shaft rod 535 during relative rotation can be reduced, and the life of the fan blade 53 can be prolonged.

為了讓水冷頭1內工作介質之供應不會中斷,殼體2內形成有腔室24。腔室24與第一進水通道22連通,以使工作介質通過第一進水通道22而流入腔室24。腔室24亦與第二進水通道23連通,以使工作介質可通過第二進水通道23而流入腔室24。在本實施例中,第一進水通道22及排水通道25可設置在殼體2之同一側(相鄰於泵浦5之側),而第二進水通道23則可設置在不同於第一進水通道22及排水通道25之殼體2的另一側(遠離泵浦5之側),亦即,第一進水通道22與第二進水通道23是設置在腔室24之相對側面,但本發明並不以此為限,第一進水通道22與第二進水通道23也可以根據產品結構之設計需求,而設置在腔室24之相鄰側面或同一側面,以增加使用者安裝彈性。 In order to prevent the supply of working medium in the water cooling head 1 from being interrupted, a chamber 24 is formed in the housing 2. The chamber 24 is in communication with the first water inlet channel 22 so that the working medium flows into the chamber 24 through the first water inlet channel 22. The chamber 24 is also in communication with the second water inlet channel 23 so that the working medium can flow into the chamber 24 through the second water inlet channel 23. In this embodiment, the first water inlet channel 22 and the drain channel 25 can be arranged on the same side of the housing 2 (the side adjacent to the pump 5), and the second water inlet channel 23 can be arranged on a different side A water inlet channel 22 and a drain channel 25 on the other side of the housing 2 (the side away from the pump 5), that is, the first water inlet channel 22 and the second water inlet channel 23 are arranged opposite to the chamber 24 Side, but the present invention is not limited to this. The first water inlet channel 22 and the second water inlet channel 23 can also be arranged on the adjacent side or the same side of the chamber 24 according to the design requirements of the product structure to increase User installation flexibility.

在本實施例中,腔室24基本上係與作用空間6物理分離(即腔室24與作用空間6藉由殼體2而獨立分隔開來),但腔室24可透過殼體2內之連通結構而與作用空間連通,此連通結構可例如為形成於殼體2內的通道26。具體而言,通道26係形成在腔室24之一側,並位於腔室24與第二進水通道23之間,故工作介質從第二進水通道23流入後會先經過通道26,才會再流入腔室24。 In this embodiment, the chamber 24 is basically physically separated from the working space 6 (that is, the chamber 24 and the working space 6 are separated by the housing 2 independently), but the chamber 24 can penetrate through the housing 2 The communicating structure communicates with the working space. The communicating structure may be, for example, a channel 26 formed in the housing 2. Specifically, the channel 26 is formed on one side of the chamber 24 and is located between the chamber 24 and the second water inlet channel 23. Therefore, the working medium will first pass through the channel 26 after flowing in from the second water inlet channel 23. Will flow into the chamber 24 again.

如第2C及2D圖所示,殼體2與底座4組合之側上具有凹部27。在殼體2與底座4組合之後,凹部27可與底座4共同界定出作用空間6中的吸熱空間61,且此凹部27亦與通道26連通。在工作介質從第二進水通道23流入時,可先經過通道26後直接流入吸熱空間61中。 As shown in Figures 2C and 2D, the side where the housing 2 and the base 4 are combined has a recess 27. After the casing 2 and the base 4 are combined, the recess 27 and the base 4 can jointly define the heat absorption space 61 in the working space 6, and the recess 27 is also communicated with the channel 26. When the working medium flows in from the second water inlet channel 23, it may first pass through the channel 26 and then directly flow into the heat absorption space 61.

於一實施例中,腔室24係外露於殼體2與底座4組合之側的相對側,例如腔室24之外露方向可與機電腔室21的開口同一側,並可透過上蓋3而予以密封。上蓋3可藉由螺絲而鎖固於殼體2的螺孔,但亦可藉由加熱固接或其他接合手段來進行接合,本發明並不以此為限。於另一實施例中,上蓋3可為透明或透光材質所製成,以幫助使用者觀察工作介質的供給情況。 In one embodiment, the cavity 24 is exposed on the side opposite to the side where the housing 2 and the base 4 are combined. For example, the cavity 24 can be exposed on the same side as the opening of the electromechanical chamber 21, and can be provided through the upper cover 3. seal. The upper cover 3 can be fixed to the screw hole of the housing 2 by screws, but can also be joined by heating fixing or other joining means, and the present invention is not limited to this. In another embodiment, the upper cover 3 may be made of a transparent or light-transmitting material to help the user observe the supply of the working medium.

在殼體2與底座4組合之後,通道26會位於傳熱結構42之周圍,凹部27則可容納傳熱結構42,且泵浦5會設於傳熱結構42之一部分上方(如第4A圖所示),這使得用來安裝泵浦5的機電腔室21與凹部27、腔室24分別位於相對於殼體2之不同水平位置,因而不會在垂直方向上有所重疊,可有效減少水冷頭1的高度,具備薄型化之設計。於一實施例中,如第1C、3B及4A圖所示,傳熱結構42的鰭片的高度可不等高,例如位於泵浦5下方之傳熱結構42的鰭片的高度可低於位於凹部27下方的傳熱結構42的鰭片的高度,此係為了降低工作介質離開傳熱結構42時的阻力。於其他實施例中,傳熱結構42之鰭片的高度亦可等高,但本發明並不以此為限。 After the casing 2 and the base 4 are combined, the channel 26 will be located around the heat transfer structure 42, the recess 27 can accommodate the heat transfer structure 42, and the pump 5 will be arranged above a part of the heat transfer structure 42 (as shown in Figure 4A As shown), this makes the electromechanical chamber 21 and the recess 27 and the chamber 24 used to install the pump 5 in different horizontal positions relative to the housing 2, so that they will not overlap in the vertical direction, which can effectively reduce The height of the water block 1 has a thin design. In one embodiment, as shown in FIGS. 1C, 3B, and 4A, the height of the fins of the heat transfer structure 42 may be unequal. For example, the height of the fins of the heat transfer structure 42 under the pump 5 may be lower than The height of the fins of the heat transfer structure 42 under the recess 27 is to reduce the resistance when the working medium leaves the heat transfer structure 42. In other embodiments, the height of the fins of the heat transfer structure 42 can be the same height, but the invention is not limited thereto.

請參閱第3A至3D圖,進入水冷頭1之工作介質可從第一進水通道22沿箭頭A方向流入腔室24,亦可從第二進水通道23沿箭頭B方向流入腔室24或通道26。接著,在腔室24之工作介質或從第二進水通道23流入之工作介質可流入通道26,並在通道26中轉向,沿箭頭C方向流入吸熱空間61。之後,工作介質沿箭頭D方向通過傳熱結構42內部,以吸收傳熱結構42所吸取的熱能後流至泵浦5下方。最後,工作介質沿箭頭E方向被扇葉53從吸熱空間61吸取到排水空間62,並沿著箭頭F方向從與排水空間62連通的排水通道25排出至水冷頭1之外部,以進行進一步的冷卻。 Please refer to Figures 3A to 3D. The working medium entering the water block 1 can flow into the chamber 24 from the first water inlet channel 22 in the direction of arrow A, or from the second water inlet channel 23 into the chamber 24 in the direction of arrow B. Channel 26. Then, the working medium in the chamber 24 or the working medium flowing in from the second water inlet passage 23 can flow into the passage 26, turn in the passage 26, and flow into the heat absorption space 61 in the direction of arrow C. After that, the working medium passes through the inside of the heat transfer structure 42 in the direction of arrow D to absorb the heat energy absorbed by the heat transfer structure 42 and then flows to the bottom of the pump 5. Finally, the working medium is sucked by the fan blade 53 from the heat absorption space 61 to the drainage space 62 in the direction of arrow E, and is discharged from the drainage channel 25 communicating with the drainage space 62 to the outside of the water block 1 in the direction of arrow F for further processing. cool down.

本發明之水冷頭1在應用時,因第一進水通道22與第二進水通道23位於腔室24之不同側,故可將複數個水冷頭1、1’串接,來強化冷卻效率或同時對複數發熱源進行散熱。如第5A圖所示,管路71為工作介質之供給管路,連接至水冷頭1的第二進水通道23,而工作介質在吸收水冷頭1內部的熱能後,從水冷頭1之排水通道25排出,並進入管路72。管路72可再連接至另一水冷頭1’的第一進水通道22’,以供工作介質進入水冷頭1’。在工作介質吸收水冷頭1’內部的熱能後,可從水冷頭1’之排水通道25’排出,並將由管路73離開水冷頭1’至冷凝裝置(圖未示)。在上述實施例中,水冷頭1’之第二進水通道23’可用封蓋74來封閉,使得水冷頭1’可設置在靠近機殼的角落或緊鄰機殼的側壁,而不會受到空間的限制。 When the water cooling head 1 of the present invention is applied, since the first water inlet channel 22 and the second water inlet channel 23 are located on different sides of the chamber 24, a plurality of water cooling heads 1, 1'can be connected in series to enhance the cooling efficiency Or heat dissipation of multiple heat sources at the same time. As shown in Figure 5A, the pipeline 71 is the supply pipeline of the working medium, connected to the second water inlet channel 23 of the water block 1, and the working medium drains the water from the water block 1 after absorbing the heat energy inside the water block 1 The channel 25 exits and enters the pipeline 72. The pipeline 72 can be connected to the first water inlet channel 22' of the other water cooling head 1'for the working medium to enter the water cooling head 1'. After the working medium absorbs the heat energy inside the water block 1', it can be discharged from the drain channel 25' of the water block 1', and will leave the water block 1'through the pipeline 73 to the condensing device (not shown). In the above-mentioned embodiment, the second water inlet channel 23' of the water-cooling head 1'can be closed with a cover 74, so that the water-cooling head 1'can be placed near the corner of the casing or close to the side wall of the casing without being exposed to space limits.

於另一實施例中,水冷頭1、1’亦可使用如第5B圖的串接方式。管路71為工作介質之供給管路,連接至水冷頭1的第二進水通道23,而工作介質在吸收水冷頭1內部的熱能後,從水冷頭1之排水通道25排出,並進入管路72。管路72可再連接至另一水冷頭1’的第二進水通道23’,以供工作介質進入水冷頭1’。在工作介質吸收水冷頭1’內部的熱能後,可從水冷頭1’之排水通道25’排出,並經由管路73離開水冷頭1’至冷凝裝置(圖未示)。在上述實施例中,水冷頭1、1’之第一進水通道可用封蓋74來封閉。此實施例可讓管路71、73不用通過水冷頭1、1’上方,適合較扁平的空間。 In another embodiment, the water block 1, 1'can also be connected in series as shown in Figure 5B. The pipeline 71 is the supply pipeline of the working medium, which is connected to the second water inlet channel 23 of the water-cooled head 1. After the working medium absorbs the heat energy inside the water-cooled head 1, it is discharged from the drain channel 25 of the water-cooled head 1 and enters the pipe Road 72. The pipeline 72 can be connected to the second water inlet channel 23' of the other water cooling head 1'for the working medium to enter the water cooling head 1'. After the working medium absorbs the heat energy inside the water block 1', it can be discharged from the drain channel 25' of the water block 1', and leave the water block 1'via a pipe 73 to the condensing device (not shown). In the above embodiment, the first water inlet channel of the water cooling head 1, 1'can be closed by the cover 74. In this embodiment, the pipes 71 and 73 do not need to pass over the water block 1, 1', which is suitable for a relatively flat space.

請參閱第6A至7B圖,其為本發明水冷頭1之另一實施例,本實施例與前述實施例之不同處在於殼體內之連通結構與傳熱結構之設計,其餘結構特徵大致相同。以下僅說明不同處,相同處於此不再贅述。 Please refer to Figures 6A to 7B, which is another embodiment of the water cooling head 1 of the present invention. The difference between this embodiment and the previous embodiment lies in the design of the communication structure and the heat transfer structure in the housing, and the remaining structural features are substantially the same. Only the differences are explained below, and the same will not be repeated here.

在本實施例中,連通結構為形成於殼體2中且貫通腔室24與作用空間6之導流槽241。具體而言,導流槽241為形成於腔室24之底部(或是殼體2的凹部27)上的開口,並位於傳熱結構42之一部分的上方。於一實施例中,導流槽241之延伸方向係不同於傳熱結構42之鰭片的延伸方向,例如導流槽241之延伸方向可垂直於傳熱結構42之鰭片的延伸方向,但本發明並不以此為限。導流槽241之延伸方向亦可與傳熱結構42之鰭片的延伸方向夾設一角度(例如30度、45度、60度等),如第9C圖所示,導流槽241之兩端可分別位於工作介質沿箭頭A、B之流入方向,而使得導流槽241之延伸方向與傳熱結構42之鰭片的延伸方向夾設了一角度θ,角度θ可根據產品結構之設計需求而有不同變化,本發明並不特定限制角度θ之值。另外,導流槽241之兩端之位置亦可根據產品結構之設計需求而有不同變化,本發明並不特定限制導流槽241之兩端之位置。 In this embodiment, the communicating structure is a diversion groove 241 formed in the housing 2 and passing through the cavity 24 and the working space 6. Specifically, the diversion groove 241 is an opening formed on the bottom of the cavity 24 (or the recess 27 of the housing 2) and is located above a part of the heat transfer structure 42. In one embodiment, the extending direction of the flow guiding groove 241 is different from the extending direction of the fins of the heat transfer structure 42. For example, the extending direction of the flow guiding groove 241 may be perpendicular to the extending direction of the fins of the heat transfer structure 42, but The present invention is not limited to this. The extension direction of the diversion groove 241 can also be interposed by an angle (such as 30 degrees, 45 degrees, 60 degrees, etc.) with the extension direction of the fins of the heat transfer structure 42. As shown in Figure 9C, two of the diversion grooves 241 The ends can be respectively located in the inflow direction of the working medium along the arrows A and B, so that the extending direction of the diversion groove 241 and the extending direction of the fins of the heat transfer structure 42 sandwich an angle θ, which can be designed according to the product structure There are different changes depending on requirements, and the present invention does not specifically limit the value of the angle θ. In addition, the positions of the two ends of the diversion groove 241 can also be changed according to the design requirements of the product structure, and the present invention does not specifically limit the positions of the two ends of the diversion groove 241.

於一實施例中,導流槽241鄰近第一進水通道22之一端的寬度,可大於(或小於)鄰近第二進水通道23之一端的寬度,或是導流槽241之一端的寬度至導流槽241之另一端的寬度可逐漸縮小。本發明並不限制導流槽241較寬之一端的位置,如第9A圖所示,導流槽241較寬之一端可鄰近第一進水通道22,亦可如第9D圖所示,導流槽241較寬之一端可鄰近第二進水通道23。再於一實施例中,如第9E圖所示,導流槽241可為均等寬度。 In one embodiment, the width of an end of the diversion groove 241 adjacent to the first water inlet channel 22 may be greater (or smaller) than the width of an end adjacent to the second water intake channel 23, or the width of one end of the diversion groove 241 The width to the other end of the diversion groove 241 can be gradually reduced. The present invention does not limit the position of the wider end of the diversion groove 241. As shown in Fig. 9A, the wider end of the diversion groove 241 may be adjacent to the first water inlet channel 22, or as shown in Fig. 9D, The wider end of the runner 241 may be adjacent to the second water inlet channel 23. In another embodiment, as shown in FIG. 9E, the diversion grooves 241 may have a uniform width.

在本實施例中,腔室24除了可透過上蓋3予以密封外,更可再組合一外蓋8來強化整體結構。外蓋8可藉由螺孔、螺柱、卡勾、卡槽或扣具來結合至殼體2,且外殼8亦可為透明或透光材質,以利使用者觀察工作介質之供給或流動情況。 In this embodiment, the cavity 24 can be sealed through the upper cover 3, and an outer cover 8 can be combined to strengthen the overall structure. The outer cover 8 can be combined with the housing 2 by screw holes, studs, hooks, slots or fasteners, and the housing 8 can also be made of transparent or light-transmitting material to facilitate the user to observe the supply or flow of the working medium Happening.

請進一步參閱第8A至8C、9A至9B圖,進入水冷頭1之工作介質可從第一進水通道22沿箭頭A方向流入腔室24,或是從第二進水通道23沿箭頭B方向流入腔室24。由於腔室24之底部具有導流槽241,故腔室24內的工作介質會轉向沿箭頭C方向進入吸熱空間61,並沿著箭頭D方向通過傳熱結構42內部並帶走傳熱結構42所吸收的熱能。由於導流槽241之延伸方向係不同於傳熱結構42之鰭片的延伸方向,故在傳熱結構42之周圍的底座4之內側43上可凹陷形成匯流區44。匯流區44可將工作介質匯集並轉向(如沿著箭頭D方向),且沿著箭頭E方向匯集至泵浦5之扇葉53下方。接著,工作介質被扇葉53所吸引而從吸熱空間61沿箭頭F方向向上移動至排水空間62。最後,工作介質經由與排水空間62連通的排水通道25沿箭頭G方向而被排出水冷頭1之外部來進行冷卻。 Please further refer to Figures 8A to 8C and 9A to 9B. The working medium entering the water block 1 can flow into the chamber 24 from the first water inlet channel 22 along the arrow A direction, or from the second water inlet channel 23 along the arrow B direction Inflow into the chamber 24. Since the bottom of the chamber 24 has a diversion groove 241, the working medium in the chamber 24 will turn to enter the heat absorption space 61 along the arrow C direction, and pass through the heat transfer structure 42 along the arrow D direction and take away the heat transfer structure 42 The heat absorbed. Since the extension direction of the flow guide groove 241 is different from the extension direction of the fins of the heat transfer structure 42, a confluence area 44 can be recessed on the inner side 43 of the base 4 around the heat transfer structure 42. The confluence area 44 can converge and divert the working medium (for example, in the direction of arrow D), and converge in the direction of arrow E to below the fan blade 53 of the pump 5. Then, the working medium is attracted by the fan blade 53 and moves upward from the heat absorption space 61 in the arrow F direction to the drainage space 62. Finally, the working medium is discharged to the outside of the water block 1 in the direction of arrow G through the drain passage 25 communicating with the drain space 62 to be cooled.

藉由本發明之水冷頭中所具有腔室之設計,可使工作介質有效地暫存殼體內,確保工作介質之供給不會中斷。此外,本發明水冷頭中與腔室及作用空間連通之連通結構之設計,更可有效地將腔室內所暫存之工作介質導引至傳熱結構來進行熱能之吸附。又,由於本發明之機電腔室、腔室及凹部分別位於殼體之不同水平位置,更可在有暫存工作介質之腔室下,同時具備水冷頭薄型化設計之功效。 With the design of the chamber in the water cooling head of the present invention, the working medium can be effectively temporarily stored in the shell, ensuring that the supply of the working medium will not be interrupted. In addition, the design of the communication structure in the water cooling head of the present invention that communicates with the chamber and the working space can effectively guide the working medium temporarily stored in the chamber to the heat transfer structure for heat absorption. In addition, since the electromechanical chamber, the chamber and the recess of the present invention are located at different horizontal positions of the housing, it can also be used under the chamber where the working medium is temporarily stored, and has the effect of a thinner water block design.

上述實施形態僅為例示性說明本發明之技術原理、特點及其功效,並非用以限制本發明之可實施範疇,任何熟習此技術之人士均可在不違背本發明之精神與範疇下,對上述實施形態進行修飾與改變。然任何運用本發明所教示內容而完成之等效修飾及改變,均仍應為下述之申請專利範圍所涵蓋。而本發明之權利保護範圍,應如下述之申請專利範圍所列。 The above-mentioned embodiments are only illustrative to illustrate the technical principles, features and effects of the present invention, and are not intended to limit the scope of the present invention. Anyone familiar with this technology can do the same without departing from the spirit and scope of the present invention. The above embodiments are modified and changed. However, any equivalent modifications and changes made by using the teachings of the present invention should still be covered by the following patent applications. The scope of protection of the rights of the present invention should be listed in the following patent scope.

1:水冷頭 1: water block

2:殼體 2: shell

21:機電腔室 21: Electromechanical chamber

22:第一進水通道 22: The first water inlet channel

23:第二進水通道 23: The second water inlet channel

24:腔室 24: Chamber

25:排水通道 25: Drainage channel

26:通道 26: Channel

3:上蓋 3: upper cover

4:底座 4: base

41:吸熱面 41: Endothermic surface

42:傳熱結構 42: Heat transfer structure

43:內側 43: inside

45:凹槽 45: Groove

5:泵浦 5: Pump

51:電路板 51: circuit board

52:第一磁性元件 52: The first magnetic element

53:扇葉 53: fan blade

539:固定件 539: fixed parts

54:第二磁性元件 54: second magnetic element

Claims (22)

一種水冷頭,包括: A water cooling head, including: 殼體; case; 底座,係結合至該殼體,以在該殼體與該底座間形成一供工作介質流動於其中之作用空間; The base is coupled to the shell to form a working space for the working medium to flow between the shell and the base; 腔室,係形成於該殼體內且與該作用空間分離,並透過一連通結構連通該作用空間; The chamber is formed in the housing and separated from the working space, and communicates with the working space through a communicating structure; 傳熱結構,係設於該底座之內側,用以將接觸於該底座之外側上之熱源所產生的熱能傳遞至該作用空間內之工作介質;以及 The heat transfer structure is arranged on the inner side of the base to transfer heat generated by the heat source contacting the outer side of the base to the working medium in the working space; and 泵浦,係設於部分該傳熱結構上方,用以將該作用空間區隔為吸熱空間及排水空間,以驅動該工作介質從該腔室經由該連通結構流動至該吸熱空間及該排水空間。 The pump is arranged above part of the heat transfer structure to partition the working space into a heat absorption space and a drainage space, so as to drive the working medium to flow from the chamber to the heat absorption space and the drainage space through the communication structure . 如申請專利範圍第1項所述之水冷頭,更包括: The water block described in item 1 of the scope of patent application includes: 第一進水通道,係與該腔室連通,用以使該工作介質流入該腔室; The first water inlet channel is in communication with the chamber to allow the working medium to flow into the chamber; 第二進水通道,係與該連通結構連通,用以使該工作介質流入該吸熱空間;以及 The second water inlet channel is in communication with the communication structure for allowing the working medium to flow into the heat absorption space; and 排水通道,係與該排水空間連通,用以將該工作介質從該排水空間排出。 The drainage channel is connected with the drainage space for draining the working medium from the drainage space. 如申請專利範圍第2項所述之水冷頭,其中,該第一進水通道與該排水通道係位於該殼體之同一側,而該第二進水通道與該排水通道係位於該殼體之不同側。 The water cooling head described in item 2 of the scope of patent application, wherein the first water inlet channel and the drainage channel are located on the same side of the housing, and the second water inlet channel and the drainage channel are located on the housing的 different side. 如申請專利範圍第2項所述之水冷頭,其中,該連通結構設於該殼體內之該腔室與該第二進水通道之間。 The water-cooling head described in item 2 of the scope of patent application, wherein the communication structure is provided between the chamber in the housing and the second water inlet channel. 如申請專利範圍第1項所述之水冷頭,其中,該殼體位於與該底座組合之側上具有凹部,且位於該泵浦下方之該傳熱結構的高度低於位於該凹部下方之該傳熱結構的高度。 The water-cooling head described in claim 1, wherein the shell has a recess on the side combined with the base, and the height of the heat transfer structure located under the pump is lower than the height of the heat transfer structure located under the recess The height of the heat transfer structure. 如申請專利範圍第1項所述之水冷頭,其中,該腔室係外露於該殼體與該底座組合之側的相對側。 According to the water-cooled head described in item 1 of the scope of patent application, the cavity is exposed on the side opposite to the side where the shell and the base are combined. 如申請專利範圍第1項所述之水冷頭,其中,該連通結構為形成於該殼體內並連通該腔室之一側及該傳熱結構之周圍的通道。 According to the water-cooling head described in item 1 of the scope of patent application, the communication structure is a channel formed in the housing and connected to one side of the cavity and the periphery of the heat transfer structure. 如申請專利範圍第1項所述之水冷頭,其中,該連通結構為該殼體上貫通該腔室至該作用空間之導流槽。 The water-cooling head described in item 1 of the scope of patent application, wherein the communication structure is a diversion groove on the shell that penetrates the chamber to the working space. 如申請專利範圍第8項所述之水冷頭,其中,該導流槽係位於部分該傳熱結構上方。 According to the water-cooling head described in item 8 of the scope of patent application, the diversion groove is located above a part of the heat transfer structure. 如申請專利範圍第9項所述之水冷頭,其中,該傳熱結構為複數個鰭片,且該導流槽之延伸方向係不同於該複數個鰭片之延伸方向。 The water-cooling head described in item 9 of the scope of patent application, wherein the heat transfer structure is a plurality of fins, and the extension direction of the diversion groove is different from the extension direction of the plurality of fins. 如申請專利範圍第8項所述之水冷頭,其中,在該傳熱結構之周圍的該底座之內側上凹陷形成一匯流區,用以將該工作介質引導至該泵浦下方。 The water-cooled head described in item 8 of the scope of patent application, wherein a confluence area is recessed on the inner side of the base around the heat transfer structure to guide the working medium to the bottom of the pump. 一種水冷頭,包括: A water cooling head, including: 吸熱空間,係供工作介質流動於其中; The heat absorption space is for the working medium to flow in it; 傳熱結構,係設於底座上並位於該吸熱空間中,用以將與該底座接觸之熱源所產生之熱能傳遞至該工作介質; The heat transfer structure is arranged on the base and located in the heat absorption space, and is used to transfer the heat energy generated by the heat source in contact with the base to the working medium; 腔室,係位於該傳熱結構上方的殼體內且與該吸熱空間分離;以及 The cavity is located in the shell above the heat transfer structure and separated from the heat absorption space; and 連通結構,係設於該殼體內以連通該腔室及該吸熱空間。 The communicating structure is arranged in the shell to communicate the cavity and the heat absorption space. 如申請專利範圍第12項所述之水冷頭,更包括: The water block mentioned in item 12 of the scope of patent application includes: 至少一進水通道,用以使該工作介質流入該腔室;以及 At least one water inlet channel for allowing the working medium to flow into the chamber; and 排水通道,用以將該工作介質從該吸熱空間排出。 The drainage channel is used to discharge the working medium from the heat absorption space. 如申請專利範圍第13項所述之水冷頭,其中,該進水通道與該排水通道係位於該殼體之同一側或不同側。 The water-cooling head described in item 13 of the scope of patent application, wherein the water inlet channel and the drain channel are located on the same side or different sides of the housing. 如申請專利範圍第13項所述之水冷頭,其中,該連通結構係設於該殼體內之該腔室與該進水通道之間。 The water-cooling head described in item 13 of the scope of patent application, wherein the communication structure is provided between the chamber and the water inlet channel in the housing. 如申請專利範圍第12項所述之水冷頭,其中,該殼體面向該傳熱結構之側上具有凹部,且位於該凹部下方之該傳熱結構的高度高於未位於該凹部下方之該傳熱結構的高度。 The water-cooling head according to item 12 of the scope of patent application, wherein the shell has a recess on the side facing the heat transfer structure, and the height of the heat transfer structure located below the recess is higher than that of the heat transfer structure not located below the recess The height of the heat transfer structure. 如申請專利範圍第12項所述之水冷頭,其中,該腔室係外露於該殼體面向該傳熱結構之側的相對側。 The water-cooled head described in item 12 of the scope of patent application, wherein the cavity is exposed on the side opposite to the side of the shell facing the heat transfer structure. 如申請專利範圍第12項所述之水冷頭,其中,該連通結構為形成於該殼體內並連通該腔室之一側及該傳熱結構之周圍的通道。 According to the water-cooling head described in item 12 of the scope of patent application, the communication structure is a channel formed in the housing and connecting one side of the cavity and the periphery of the heat transfer structure. 如申請專利範圍第12項所述之水冷頭,其中,該連通結構為該殼體上貫通該腔室至該吸熱空間之導流槽。 According to the water-cooling head described in item 12 of the scope of patent application, the communication structure is a diversion groove on the shell that penetrates the cavity to the heat absorption space. 如申請專利範圍第19項所述之水冷頭,其中,該導流槽係位於部分該傳熱結構上方。 For the water-cooled head described in item 19 of the scope of patent application, the diversion groove is located above a part of the heat transfer structure. 如申請專利範圍第20項所述之水冷頭,其中,該傳熱結構為複數個鰭片,且該導流槽之延伸方向係不同於該複數個鰭片之延伸方向。 According to the water-cooling head described in item 20 of the scope of patent application, wherein the heat transfer structure is a plurality of fins, and the extension direction of the diversion groove is different from the extension direction of the plurality of fins. 如申請專利範圍第12項所述之水冷頭,其中,在該傳熱結構之周圍的該底座上凹陷形成一匯流區。 The water-cooled head described in item 12 of the scope of patent application, wherein the base around the heat transfer structure is recessed to form a confluence area.
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