TW202100929A - Cold plate - Google Patents
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- TW202100929A TW202100929A TW109121145A TW109121145A TW202100929A TW 202100929 A TW202100929 A TW 202100929A TW 109121145 A TW109121145 A TW 109121145A TW 109121145 A TW109121145 A TW 109121145A TW 202100929 A TW202100929 A TW 202100929A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Abstract
Description
本發明涉及散熱領域,尤指一種水冷頭。 The invention relates to the field of heat dissipation, in particular to a water cooling head.
因應現代化需求,電腦與各種電子裝置發展快速且效能不斷地提昇,但在此過程中,高效能之硬體所帶來之散熱問題亦隨之而來。一般而言,電腦與各種電子裝置通常會使用散熱元件來進行散熱,例如使用散熱膏或散熱片來貼附於欲散熱之電子元件上,以將熱吸出並逸散。然而,此種散熱方式效果有限,因而發展出使用液體冷卻方式之散熱模組。 In response to modernization needs, computers and various electronic devices have developed rapidly and their performance has been continuously improved. However, in the process, heat dissipation problems caused by high-performance hardware have also followed. Generally speaking, computers and various electronic devices usually use heat-dissipating components to dissipate heat. For example, heat-dissipating paste or heat sinks are used to attach heat to the electronic components to be dissipated to absorb and dissipate heat. However, the effect of this heat dissipation method is limited, so a heat dissipation module using a liquid cooling method has been developed.
現有之使用液體冷卻方式之散熱模組一般是採用冷卻液來吸附熱能,例如將冷卻液流體連接至欲散熱之電子元件,已受熱之冷卻液可往較低溫處流動來進行熱交換,熱交換後之冷卻液即可再流動至欲散熱之電子元件來吸附熱能,如此可形成一散熱循環。 Existing heat dissipation modules that use liquid cooling methods generally use coolant to absorb heat. For example, the coolant is fluidly connected to electronic components to be dissipated. The heated coolant can flow to a lower temperature for heat exchange. The subsequent cooling liquid can then flow to the electronic components to be dissipated to absorb heat energy, thus forming a heat dissipation cycle.
惟現有之散熱模組在將冷卻液運送至欲散熱之電子元件中用以吸附熱能之空間時,冷卻液的儲存空間經常不足,導致水冷頭位置變更或移動時,經常發生冷卻液供給不及的問題。 However, when the existing heat dissipation module transports the cooling liquid to the space for absorbing heat energy in the electronic components to be dissipated, the storage space of the cooling liquid is often insufficient, which causes the lack of cooling liquid supply when the position of the water block is changed or moved. problem.
是以,如何提出一種可解決上述問題之水冷頭,為目前業界亟待解決的課題之一。 Therefore, how to propose a water-cooling head that can solve the above-mentioned problems is one of the urgent problems in the industry.
本發明之一目的在於提供一種水冷頭,包括:殼體;底座,係結合至該殼體,以在該殼體與該底座間形成一供工作介質流動於其中之作用空間;腔室,係形成於該殼體內且與該作用空間分離,並透過一連通結構連通該作用空間;傳熱結構,係設於該底座之內側,用以將接觸於該底座之外側上之熱源所產生的熱能傳遞至該作用空間內之工作介質;以及泵浦,係設於部分該傳熱結構上方,用以將該作用空間區隔為吸熱空間及排水空間,以驅動該工作介質從該腔室經由該連通結構流動至該吸熱空間及該排水空間。 An object of the present invention is to provide a water cooling head, comprising: a housing; a base coupled to the housing to form a working space between the housing and the base for a working medium to flow therein; a cavity, It is formed in the shell and separated from the working space, and communicates with the working space through a communicating structure; the heat transfer structure is arranged on the inner side of the base to transfer the heat generated by the heat source on the outer side of the base The working medium transferred to the working space; and a pump, which is arranged above part of the heat transfer structure to partition the working space into a heat absorption space and a drainage space, so as to drive the working medium from the chamber through the The communication structure flows to the heat absorption space and the drainage space.
前述之水冷頭中,更包括:第一進水通道,係與該腔室連通,用以使該工作介質流入該腔室;第二進水通道,係與該連通結構連通,用以使該工作介質流入該吸熱空間;以及排水通道,係與該排水空間連通,用以將該工作介質從該排水空間排出。 The aforementioned water cooling head further includes: a first water inlet channel connected to the chamber to allow the working medium to flow into the cavity; a second water inlet channel connected to the communicating structure to enable the The working medium flows into the heat absorption space; and the drainage channel is connected with the drainage space to discharge the working medium from the drainage space.
前述之水冷頭中,該第一進水通道與該排水通道係位於該殼體之同一側,而該第二進水通道與該排水通道係位於該殼體之不同側。 In the aforementioned water cooling head, the first water inlet channel and the drain channel are located on the same side of the casing, and the second water inlet channel and the drain channel are located on different sides of the casing.
前述之水冷頭中,該連通結構設於該殼體內之該腔室與該第二進水通道之間。 In the aforementioned water cooling head, the communication structure is provided between the cavity in the housing and the second water inlet channel.
前述之水冷頭中,該殼體位於與該底座組合之側上具有凹部,且位於該泵浦下方之該傳熱結構的高度低於位於該凹部下方之該傳熱結構的高度。 In the aforementioned water cooling head, the shell has a recess on the side combined with the base, and the height of the heat transfer structure under the pump is lower than the height of the heat transfer structure under the recess.
前述之水冷頭中,該腔室係外露於該殼體與該底座組合之側的相對側。 In the aforementioned water cooling head, the cavity is exposed on the side opposite to the side where the shell and the base are combined.
前述之水冷頭中,該連通結構為形成於該殼體內並連通該腔室之一側及該傳熱結構之周圍的通道。 In the aforementioned water cooling head, the communicating structure is a channel formed in the housing and communicating one side of the cavity and the surroundings of the heat transfer structure.
前述之水冷頭中,該連通結構為該殼體上貫通該腔室至該作用空間之導流槽。 In the aforementioned water cooling head, the communicating structure is a diversion groove on the shell that penetrates the chamber to the working space.
前述之水冷頭中,該導流槽係位於部分該傳熱結構上方。 In the aforementioned water cooling head, the diversion groove is located above a part of the heat transfer structure.
前述之水冷頭中,該傳熱結構為複數個鰭片,且該導流槽之延伸方向係不同於該複數個鰭片之延伸方向。 In the aforementioned water cooling head, the heat transfer structure is a plurality of fins, and the extension direction of the flow guide groove is different from the extension direction of the plurality of fins.
前述之水冷頭中,在該傳熱結構之周圍的該底座之內側上凹陷形成一匯流區,用以將該工作介質引導至該泵浦下方。 In the aforementioned water-cooling head, a confluence area is recessed on the inner side of the base around the heat transfer structure to guide the working medium under the pump.
本發明之另一目的在於提供一種水冷頭,包括:吸熱空間,係供工作介質流動於其中;傳熱結構,係設於底座上並位於該吸熱空間中,用以將與該底座接觸之熱源所產生之熱能傳遞至該工作介質;腔室,係位於該傳熱結構上方的殼體內且與該吸熱空間分離;以及連通結構,係設於該殼體內以連通該腔室及該吸熱空間。 Another object of the present invention is to provide a water-cooling head, including: a heat absorption space for working medium to flow therein; a heat transfer structure, which is arranged on a base and located in the heat absorption space, and is used to connect a heat source in contact with the base The generated heat energy is transferred to the working medium; the cavity is located in the shell above the heat transfer structure and separated from the heat absorption space; and the communication structure is provided in the shell to communicate the cavity and the heat absorption space.
前述之水冷頭中,更包括:至少一進水通道,用以使該工作介質流入該腔室;以及排水通道,用以將該工作介質從該吸熱空間排出。 The aforementioned water cooling head further includes: at least one water inlet channel for allowing the working medium to flow into the chamber; and a drainage channel for discharging the working medium from the heat absorption space.
前述之水冷頭中,該進水通道與該排水通道係位於該殼體之同一側或不同側。 In the aforementioned water cooling head, the water inlet channel and the drain channel are located on the same side or different sides of the housing.
前述之水冷頭中,該連通結構係設於該殼體內之該腔室與該進水通道之間。 In the aforementioned water cooling head, the communication structure is provided between the chamber and the water inlet channel in the housing.
前述之水冷頭中,該殼體面向該傳熱結構之側上具有凹部,且位於該凹部下方之該傳熱結構的高度高於未位於該凹部下方之該傳熱結構的高度。 In the aforementioned water cooling head, the shell has a recess on the side facing the heat transfer structure, and the height of the heat transfer structure located under the recess is higher than the height of the heat transfer structure not located under the recess.
前述之水冷頭中,該腔室係外露於該殼體面向該傳熱結構之側的相對側。 In the aforementioned water cooling head, the cavity is exposed on the side opposite to the side of the shell facing the heat transfer structure.
前述之水冷頭中,該連通結構為形成於該殼體內並連通該腔室之一側及該傳熱結構之周圍的通道。 In the aforementioned water cooling head, the communicating structure is a channel formed in the housing and communicating one side of the cavity and the surroundings of the heat transfer structure.
前述之水冷頭中,該連通結構為該殼體上貫通該腔室至該吸熱空間之導流槽。 In the aforementioned water cooling head, the communication structure is a diversion groove on the shell that penetrates the cavity to the heat absorption space.
前述之水冷頭中,該導流槽係位於部分該傳熱結構上方。 In the aforementioned water cooling head, the diversion groove is located above a part of the heat transfer structure.
前述之水冷頭中,該傳熱結構為複數個鰭片,且該導流槽之延伸方向係不同於該複數個鰭片之延伸方向。 In the aforementioned water cooling head, the heat transfer structure is a plurality of fins, and the extension direction of the flow guide groove is different from the extension direction of the plurality of fins.
前述之水冷頭中,在該傳熱結構之周圍的該底座上凹陷形成一匯流區。 In the aforementioned water-cooling head, a confluence area is recessed on the base around the heat transfer structure.
1、1’:水冷頭 1, 1’: Water cooling head
2:殼體 2: shell
21:機電腔室 21: Electromechanical chamber
22、22’:第一進水通道 22, 22’: The first water inlet channel
23、23’:第二進水通道 23, 23’: The second water inlet channel
24:腔室 24: Chamber
241:導流槽 241: diversion groove
25、25’:排水通道 25, 25’: Drainage channel
26:通道 26: Channel
27:凹部 27: recess
28、29:凹槽 28, 29: Groove
3:上蓋 3: upper cover
4:底座 4: base
41:吸熱面 41: Endothermic surface
42:傳熱結構 42: Heat transfer structure
43:內側 43: inside
44:匯流區 44: Confluence area
45:凹槽 45: Groove
5:泵浦 5: Pump
51:電路板 51: circuit board
52:第一磁性元件 52: The first magnetic element
53:扇葉 53: fan blade
531:頂壁 531: top wall
532:底盤 532: Chassis
533:間隔牆 533: Partition Wall
534:軸套 534: Bushing
535:軸棒 535: Shaft
536:鏤空部 536: Hollow
537:肋條 537: rib
538:排水腔 538: Drain cavity
539:固定件 539: fixed parts
54:第二磁性元件 54: second magnetic element
55:電線 55: Wire
6:作用空間 6: Action space
61:吸熱空間 61: Endothermic space
62:排水空間 62: Drainage space
71、72、73:管路 71, 72, 73: pipeline
74:封蓋 74: cap
8:外蓋 8: Outer cover
9A、9B、9C:接頭 9A, 9B, 9C: Connector
θ:角度 θ: Angle
第1A及1B圖為本發明之水冷頭於不同視角之立體示意圖。 Figures 1A and 1B are three-dimensional schematic diagrams of the water block of the present invention from different viewing angles.
第1C圖為本發明之水冷頭之爆炸示意圖。 Figure 1C is an exploded schematic diagram of the water block of the present invention.
第2A至2D圖為本發明之水冷頭中殼體及泵浦於不同視角之立體示意圖。 2A to 2D are three-dimensional schematic diagrams of the housing and pump of the water block of the present invention from different viewing angles.
第3A圖為第1A圖中沿3A-3A剖面線之剖面示意圖。
Figure 3A is a schematic cross-sectional view taken along the
第3B圖為第1A圖中沿3B-3B剖面線之剖面示意圖。
Figure 3B is a schematic cross-sectional view taken along the
第3C圖為第1A圖中沿3C-3C剖面線之剖面示意圖。
Figure 3C is a schematic cross-sectional view taken along the
第3D圖為第1A圖中沿3D-3D剖面線之剖面示意圖。
Figure 3D is a schematic cross-sectional view taken along the
第4A圖為本發明之水冷頭中泵浦與底座之立體示意圖。 Figure 4A is a perspective view of the pump and the base of the water cooling head of the present invention.
第4B及4C圖為本發明之水冷頭中泵浦於不同視角之立體示意圖。 4B and 4C are three-dimensional schematic diagrams of the pump in different viewing angles in the water block of the present invention.
第5A及5B圖為本發明之水冷頭與其他水冷頭共同構成迴路時之示意圖。 Figures 5A and 5B are schematic diagrams when the water block of the present invention and other water blocks form a circuit together.
第6A圖為本發明之水冷頭之另一實施例之立體示意圖。 Fig. 6A is a perspective view of another embodiment of the water block of the present invention.
第6B圖為第6A圖中將外殼拆解後之立體示意圖。 Figure 6B is a perspective view of Figure 6A with the housing disassembled.
第6C及6D圖為第6B圖中將上蓋拆解後以外露腔室之於不同視角之立體示意圖。 Figures 6C and 6D are three-dimensional diagrams of the chamber exposed from different perspectives after the upper cover is disassembled in Figure 6B.
第6E圖為本發明之水冷頭之另一實施例之爆炸示意圖。 Figure 6E is an exploded schematic view of another embodiment of the water block of the present invention.
第7A及7B圖為本發明之水冷頭之另一實施例中,殼體與泵浦於組裝後及組裝前之立體示意圖。 Figures 7A and 7B are perspective schematic views of the housing and the pump after and before assembly in another embodiment of the water cooling head of the present invention.
第8A圖為第6A圖中沿8A-8A剖面線之剖面示意圖。
Figure 8A is a schematic cross-sectional view taken along the
第8B圖為第6A圖中沿8B-8B剖面線之剖面示意圖。
Figure 8B is a schematic cross-sectional view taken along
第8C圖為第6A圖中沿8C-8C剖面線之剖面示意圖。
Figure 8C is a schematic cross-sectional view taken along the
第9A及9B圖為本發明之水冷頭之另一實施例中,工作介質於殼體與底座之間流動的過程示意圖。 9A and 9B are schematic diagrams of the process of the working medium flowing between the housing and the base in another embodiment of the water cooling head of the present invention.
第9C至9E圖為本發明之水冷頭之另一實施例中,導流槽之不同實施態樣之示意圖。 Figures 9C to 9E are schematic diagrams of different implementations of the diversion groove in another embodiment of the water block of the present invention.
以下藉由特定之具體實施例加以說明本發明之實施方式,而熟悉此技術之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點和功效,亦可藉由其他不同的具體實施例加以施行或應用。 The following specific examples illustrate the implementation of the present invention, and those skilled in the art can easily understand the other advantages and effects of the present invention from the contents disclosed in this specification, as well as other different specific embodiments. To implement or apply.
本發明所提供的水冷頭可安裝於電腦主機或伺服器等電子裝置中,水冷頭內部可充填工作介質(例如冷卻液),該工作介質可吸收發熱源(例如晶片或是記憶體等電子元件)所產生的熱能,升溫後的工作介質可傳送至冷凝裝置予以降溫,而降溫後的工作介質可再傳回至水冷頭,以進行下一次的吸熱與循環流動。 The water cooling head provided by the present invention can be installed in electronic devices such as a computer host or a server. The inside of the water cooling head can be filled with a working medium (such as coolant), which can absorb heat sources (such as chips or electronic components such as memory). ) The heated working medium can be sent to the condensing device to cool down the heat generated, and the cooled working medium can be transferred back to the water block for the next heat absorption and circulating flow.
請同時參閱第1A至1C、2A至2D圖,本發明之水冷頭1可包括殼體2、上蓋3、底座4以及泵浦5。殼體2可作為水冷頭1主要的結構件,其上方與上蓋3結合,其下方與底座4結合,其側邊則可形成有第一進水通道22、第二進水通道23以及排水通道25。上述殼體2與各部件之結合,可在殼體2之不同部位上形成有例如螺孔、螺柱或扣具等固定結構,以利組裝時通過鎖固方式來結合各部件,但本發明並不限於此種結合方式。
Please refer to FIGS. 1A to 1C and 2A to 2D at the same time. The
在本實施例中,殼體2在結構上可界定出不同的腔室以及通道,包括機電腔室21、第一進水通道22、第二進水通道23、腔室24以及排水通道25等,其中,機電腔室21開口於殼體2的頂側並獨立於水冷頭1中工作介質流動的路徑,因而能夠保護設置在機電腔室21內的通電元件,避免因工作介質之介入而發生短路情況。
In this embodiment, the
在本實施例中,泵浦5可包括電路板51、第一磁性元件52、扇葉53以及第二磁性元件54,其中,電路板51與第一磁性元件52可設置在機電腔室21內,而扇葉53以及第二磁性元件54則設置在機電腔室21之另一側(例如位在
工作介質流經的路徑內,如第2C圖所示之凹槽28中),且其中,透過電路板51以提供泵浦5運轉所需的電力,例如利用電線55的有線連接方式(如第6A至6D圖所示),或是以電磁感應等其他無線連接方式來連接一電源(圖未示)。於本實施例中,電路板51及第一磁性元件52藉由殼體2而與扇葉53及第二磁性元件54分隔開來,但第一磁性元件52與第二磁性元件54仍是共軸設置。於一實施例中,第一磁性元件52與第二磁性元件54可以選自磁鐵或是其他可以被磁場所驅動或吸引的材料。此外,第二磁性元件54與扇葉53結合在一起,當泵浦5通電時,在電路板51、第一磁性元件52以及第二磁性元件54的共同作用下,與第二磁性元件54軸接的扇葉53即令為該第二磁性元件54所驅動而轉動,俾由扇葉53之轉動帶領工作介質流動。
In this embodiment, the
於本實施例中,底座4用以吸收熱能,其材質可選自金屬或其他導熱性良好的材料。底座4在結構上可以是一件式(一體成形)的結構,也可是複數層或複數個元件所組成的複合結構,本發明並不以此為限。底座4之外側(遠離殼體2之側)具有一吸熱面41,底座4的內側43(面向殼體2之側)上形成有(或可設置)一傳熱結構42,其中,吸熱面41可與熱源直接或間接接觸,使得吸熱面41可吸收熱源所產生之熱能後,將熱能傳遞至傳熱結構42,傳熱結構42則會再透過與工作介質之接觸,而將熱能傳遞至工作介質。
In this embodiment, the
於一實施例中,底座4的傳熱結構42可為切削式鰭片(skived fin),或是其他柱狀、片狀、甚至於是不規則的形狀的鰭片,只要能夠增加與工作介質接觸的面積,讓熱能更快傳遞至工作介質即可,本發明並不限制傳熱結構42之具體結構。
In one embodiment, the
請再配合參閱第3C及3D圖,當底座4結合至殼體2後,殼體2與底座4兩者可共同界定出一個作用空間6,該作用空間6可填充工作介質並供工作介質流動。於一實施例中,作用空間6可由泵浦5之扇葉53來區隔出一吸熱空間61以及一排水空間62,而不依靠其他的隔牆或是隔間等元件,因而能夠簡化水冷頭1內部的結構。於本實施例中,殼體2之第一進水通道22及第二進水通道23係與吸熱空間61連通,用以讓冷卻後的工作介質流入吸熱空間61內,使工作介質吸收由傳熱結構42所傳遞之熱能。扇葉53可將工作介質直接從吸熱空間61吸取到排水空間62。另外,排水通道25則與排水空間62連通,故可將已升溫的工作介質傳送至水冷頭1的外部來進行冷卻。此外,第一進水通道22、第二進水通道23與排水通道25可分別再向外延伸或是連接如第6A至6D圖所示之接頭9A、9B、9C,接頭9A、9B、9C則再藉由如第5A及5B之管路71、72、73來與冷凝裝置(例如水冷排、風扇等)做連通。接頭9A、9B、9C可垂直或水平地連接於殼體2上,或是採用彎頭的設置,以符合水冷頭1內部不同的空間配置需求,本發明並不以此為限。
Please refer to Figures 3C and 3D for cooperation. When the
以下進一步說明本發明水冷頭1中泵浦5之扇葉53的整體結構,請進一步同時參閱第4B及4C圖。如前所述,本發明之水冷頭1中的作用空間6係由泵浦5之扇葉53來區隔出吸熱空間61以及排水空間62,因此,扇葉53本身同時具備有吸取工作介質以及排出工作介質的雙重功能。為了達成上述的功能,扇葉53係設置在作用空間6內並鄰近排水通道25,用以將工作介質直接從吸熱空間61吸取到排水空間62後,經由排水通道25將工作介質排出水冷頭1。扇葉53包括頂壁531、底盤532、間隔牆533、軸套534以及軸棒535,而底盤532與軸套534之間形成有鏤空部536,並且底盤532與軸套534可透過在鏤空部536中之至少一肋條
537來連接。底盤532是扇葉53中主要將作用空間6劃分為吸熱空間61與排水空間62的結構,而吸熱空間61與排水空間62則藉由鏤空部536來進行液體的耦合(fluidly coupling),也就是工作介質得以從吸熱空間61經由鏤空部536而進入排水空間62。頂壁531與底盤532係間隔設置,兩者之間連接有複數個間隔牆533,因而能夠區隔出複數個排水腔538。當工作介質從吸熱空間61經由鏤空部536而向上傳遞至排水空間62的過程中,工作介質會先碰觸到頂壁531後轉向,往各個排水腔538移動,然後因為離心力的作用而讓各排水腔538內的工作介質依序被甩入排水通道25後排出水冷頭1。扇葉53的頂壁531除了具有可以改變流向的導引功能之外,同時也可防止間隔牆533直接碰觸到殼體2,降低磨耗發生的機會。
The following further describes the overall structure of the
於本實施例中,扇葉53是藉由第一磁性元件52與第二磁性元件54彼此間的電磁感應而被驅動,並非經由軸棒535來驅動,因此扇葉53與軸棒535之間沒有連動的關係。但為了能夠維持扇葉53的耐用度與穩定度,使其旋轉時不致偏軸或是碰觸到殼體2而產生磨耗,因此,扇葉53內部可設置有中空結構的軸套534,可供軸棒535套設。又,為了將軸棒535予以固定,軸棒535之一端可容設在作用空間6的頂部(也就是殼體2的內側)的凹槽28中,而另一端可藉由固定件539來加以固定,例如固定件539上設有供軸棒535容設之盲孔或穿孔等。此外,固定件539可收納並固定於殼體2底面的一凹槽29內(如第7A圖所示),或是將固定件539直接安裝在底座4的凹槽45內(如第1C圖所示),本發明並不以此為限。於一實施例中,當軸棒535安裝於作用空間6內時,較佳的方式是要與固定件539一起延伸或深入到吸熱空間61內,此舉將使得扇葉53轉動時更加穩固,但本發明並不以此為限。
In this embodiment, the
於一實施例中,考量到扇葉53本身的材質,若需要時可在軸套534內再套設並固定一軸管(圖未示),此軸管與軸套534跟軸棒535共軸設置,並且位於軸套534跟軸棒535之間。軸管的材質可選用抗磨耗或是較耐磨的材質,從而能降低扇葉53與軸棒535在相對轉動時的磨損,延長扇葉53的壽命。
In one embodiment, considering the material of the
為了讓水冷頭1內工作介質之供應不會中斷,殼體2內形成有腔室24。腔室24與第一進水通道22連通,以使工作介質通過第一進水通道22而流入腔室24。腔室24亦與第二進水通道23連通,以使工作介質可通過第二進水通道23而流入腔室24。在本實施例中,第一進水通道22及排水通道25可設置在殼體2之同一側(相鄰於泵浦5之側),而第二進水通道23則可設置在不同於第一進水通道22及排水通道25之殼體2的另一側(遠離泵浦5之側),亦即,第一進水通道22與第二進水通道23是設置在腔室24之相對側面,但本發明並不以此為限,第一進水通道22與第二進水通道23也可以根據產品結構之設計需求,而設置在腔室24之相鄰側面或同一側面,以增加使用者安裝彈性。
In order to prevent the supply of working medium in the
在本實施例中,腔室24基本上係與作用空間6物理分離(即腔室24與作用空間6藉由殼體2而獨立分隔開來),但腔室24可透過殼體2內之連通結構而與作用空間連通,此連通結構可例如為形成於殼體2內的通道26。具體而言,通道26係形成在腔室24之一側,並位於腔室24與第二進水通道23之間,故工作介質從第二進水通道23流入後會先經過通道26,才會再流入腔室24。
In this embodiment, the
如第2C及2D圖所示,殼體2與底座4組合之側上具有凹部27。在殼體2與底座4組合之後,凹部27可與底座4共同界定出作用空間6中的吸熱空間61,且此凹部27亦與通道26連通。在工作介質從第二進水通道23流入時,可先經過通道26後直接流入吸熱空間61中。
As shown in Figures 2C and 2D, the side where the
於一實施例中,腔室24係外露於殼體2與底座4組合之側的相對側,例如腔室24之外露方向可與機電腔室21的開口同一側,並可透過上蓋3而予以密封。上蓋3可藉由螺絲而鎖固於殼體2的螺孔,但亦可藉由加熱固接或其他接合手段來進行接合,本發明並不以此為限。於另一實施例中,上蓋3可為透明或透光材質所製成,以幫助使用者觀察工作介質的供給情況。
In one embodiment, the
在殼體2與底座4組合之後,通道26會位於傳熱結構42之周圍,凹部27則可容納傳熱結構42,且泵浦5會設於傳熱結構42之一部分上方(如第4A圖所示),這使得用來安裝泵浦5的機電腔室21與凹部27、腔室24分別位於相對於殼體2之不同水平位置,因而不會在垂直方向上有所重疊,可有效減少水冷頭1的高度,具備薄型化之設計。於一實施例中,如第1C、3B及4A圖所示,傳熱結構42的鰭片的高度可不等高,例如位於泵浦5下方之傳熱結構42的鰭片的高度可低於位於凹部27下方的傳熱結構42的鰭片的高度,此係為了降低工作介質離開傳熱結構42時的阻力。於其他實施例中,傳熱結構42之鰭片的高度亦可等高,但本發明並不以此為限。
After the
請參閱第3A至3D圖,進入水冷頭1之工作介質可從第一進水通道22沿箭頭A方向流入腔室24,亦可從第二進水通道23沿箭頭B方向流入腔室24或通道26。接著,在腔室24之工作介質或從第二進水通道23流入之工作介質可流入通道26,並在通道26中轉向,沿箭頭C方向流入吸熱空間61。之後,工作介質沿箭頭D方向通過傳熱結構42內部,以吸收傳熱結構42所吸取的熱能後流至泵浦5下方。最後,工作介質沿箭頭E方向被扇葉53從吸熱空間61吸取到排水空間62,並沿著箭頭F方向從與排水空間62連通的排水通道25排出至水冷頭1之外部,以進行進一步的冷卻。
Please refer to Figures 3A to 3D. The working medium entering the
本發明之水冷頭1在應用時,因第一進水通道22與第二進水通道23位於腔室24之不同側,故可將複數個水冷頭1、1’串接,來強化冷卻效率或同時對複數發熱源進行散熱。如第5A圖所示,管路71為工作介質之供給管路,連接至水冷頭1的第二進水通道23,而工作介質在吸收水冷頭1內部的熱能後,從水冷頭1之排水通道25排出,並進入管路72。管路72可再連接至另一水冷頭1’的第一進水通道22’,以供工作介質進入水冷頭1’。在工作介質吸收水冷頭1’內部的熱能後,可從水冷頭1’之排水通道25’排出,並將由管路73離開水冷頭1’至冷凝裝置(圖未示)。在上述實施例中,水冷頭1’之第二進水通道23’可用封蓋74來封閉,使得水冷頭1’可設置在靠近機殼的角落或緊鄰機殼的側壁,而不會受到空間的限制。
When the
於另一實施例中,水冷頭1、1’亦可使用如第5B圖的串接方式。管路71為工作介質之供給管路,連接至水冷頭1的第二進水通道23,而工作介質在吸收水冷頭1內部的熱能後,從水冷頭1之排水通道25排出,並進入管路72。管路72可再連接至另一水冷頭1’的第二進水通道23’,以供工作介質進入水冷頭1’。在工作介質吸收水冷頭1’內部的熱能後,可從水冷頭1’之排水通道25’排出,並經由管路73離開水冷頭1’至冷凝裝置(圖未示)。在上述實施例中,水冷頭1、1’之第一進水通道可用封蓋74來封閉。此實施例可讓管路71、73不用通過水冷頭1、1’上方,適合較扁平的空間。
In another embodiment, the
請參閱第6A至7B圖,其為本發明水冷頭1之另一實施例,本實施例與前述實施例之不同處在於殼體內之連通結構與傳熱結構之設計,其餘結構特徵大致相同。以下僅說明不同處,相同處於此不再贅述。
Please refer to Figures 6A to 7B, which is another embodiment of the
在本實施例中,連通結構為形成於殼體2中且貫通腔室24與作用空間6之導流槽241。具體而言,導流槽241為形成於腔室24之底部(或是殼體2的凹部27)上的開口,並位於傳熱結構42之一部分的上方。於一實施例中,導流槽241之延伸方向係不同於傳熱結構42之鰭片的延伸方向,例如導流槽241之延伸方向可垂直於傳熱結構42之鰭片的延伸方向,但本發明並不以此為限。導流槽241之延伸方向亦可與傳熱結構42之鰭片的延伸方向夾設一角度(例如30度、45度、60度等),如第9C圖所示,導流槽241之兩端可分別位於工作介質沿箭頭A、B之流入方向,而使得導流槽241之延伸方向與傳熱結構42之鰭片的延伸方向夾設了一角度θ,角度θ可根據產品結構之設計需求而有不同變化,本發明並不特定限制角度θ之值。另外,導流槽241之兩端之位置亦可根據產品結構之設計需求而有不同變化,本發明並不特定限制導流槽241之兩端之位置。
In this embodiment, the communicating structure is a
於一實施例中,導流槽241鄰近第一進水通道22之一端的寬度,可大於(或小於)鄰近第二進水通道23之一端的寬度,或是導流槽241之一端的寬度至導流槽241之另一端的寬度可逐漸縮小。本發明並不限制導流槽241較寬之一端的位置,如第9A圖所示,導流槽241較寬之一端可鄰近第一進水通道22,亦可如第9D圖所示,導流槽241較寬之一端可鄰近第二進水通道23。再於一實施例中,如第9E圖所示,導流槽241可為均等寬度。
In one embodiment, the width of an end of the
在本實施例中,腔室24除了可透過上蓋3予以密封外,更可再組合一外蓋8來強化整體結構。外蓋8可藉由螺孔、螺柱、卡勾、卡槽或扣具來結合至殼體2,且外殼8亦可為透明或透光材質,以利使用者觀察工作介質之供給或流動情況。
In this embodiment, the
請進一步參閱第8A至8C、9A至9B圖,進入水冷頭1之工作介質可從第一進水通道22沿箭頭A方向流入腔室24,或是從第二進水通道23沿箭頭B方向流入腔室24。由於腔室24之底部具有導流槽241,故腔室24內的工作介質會轉向沿箭頭C方向進入吸熱空間61,並沿著箭頭D方向通過傳熱結構42內部並帶走傳熱結構42所吸收的熱能。由於導流槽241之延伸方向係不同於傳熱結構42之鰭片的延伸方向,故在傳熱結構42之周圍的底座4之內側43上可凹陷形成匯流區44。匯流區44可將工作介質匯集並轉向(如沿著箭頭D方向),且沿著箭頭E方向匯集至泵浦5之扇葉53下方。接著,工作介質被扇葉53所吸引而從吸熱空間61沿箭頭F方向向上移動至排水空間62。最後,工作介質經由與排水空間62連通的排水通道25沿箭頭G方向而被排出水冷頭1之外部來進行冷卻。
Please further refer to Figures 8A to 8C and 9A to 9B. The working medium entering the
藉由本發明之水冷頭中所具有腔室之設計,可使工作介質有效地暫存殼體內,確保工作介質之供給不會中斷。此外,本發明水冷頭中與腔室及作用空間連通之連通結構之設計,更可有效地將腔室內所暫存之工作介質導引至傳熱結構來進行熱能之吸附。又,由於本發明之機電腔室、腔室及凹部分別位於殼體之不同水平位置,更可在有暫存工作介質之腔室下,同時具備水冷頭薄型化設計之功效。 With the design of the chamber in the water cooling head of the present invention, the working medium can be effectively temporarily stored in the shell, ensuring that the supply of the working medium will not be interrupted. In addition, the design of the communication structure in the water cooling head of the present invention that communicates with the chamber and the working space can effectively guide the working medium temporarily stored in the chamber to the heat transfer structure for heat absorption. In addition, since the electromechanical chamber, the chamber and the recess of the present invention are located at different horizontal positions of the housing, it can also be used under the chamber where the working medium is temporarily stored, and has the effect of a thinner water block design.
上述實施形態僅為例示性說明本發明之技術原理、特點及其功效,並非用以限制本發明之可實施範疇,任何熟習此技術之人士均可在不違背本發明之精神與範疇下,對上述實施形態進行修飾與改變。然任何運用本發明所教示內容而完成之等效修飾及改變,均仍應為下述之申請專利範圍所涵蓋。而本發明之權利保護範圍,應如下述之申請專利範圍所列。 The above-mentioned embodiments are only illustrative to illustrate the technical principles, features and effects of the present invention, and are not intended to limit the scope of the present invention. Anyone familiar with this technology can do the same without departing from the spirit and scope of the present invention. The above embodiments are modified and changed. However, any equivalent modifications and changes made by using the teachings of the present invention should still be covered by the following patent applications. The scope of protection of the rights of the present invention should be listed in the following patent scope.
1:水冷頭 1: water block
2:殼體 2: shell
21:機電腔室 21: Electromechanical chamber
22:第一進水通道 22: The first water inlet channel
23:第二進水通道 23: The second water inlet channel
24:腔室 24: Chamber
25:排水通道 25: Drainage channel
26:通道 26: Channel
3:上蓋 3: upper cover
4:底座 4: base
41:吸熱面 41: Endothermic surface
42:傳熱結構 42: Heat transfer structure
43:內側 43: inside
45:凹槽 45: Groove
5:泵浦 5: Pump
51:電路板 51: circuit board
52:第一磁性元件 52: The first magnetic element
53:扇葉 53: fan blade
539:固定件 539: fixed parts
54:第二磁性元件 54: second magnetic element
Claims (22)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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US201962866748P | 2019-06-26 | 2019-06-26 | |
US62/866,748 | 2019-06-26 | ||
US201962870864P | 2019-07-05 | 2019-07-05 | |
US62/870,864 | 2019-07-05 |
Publications (2)
Publication Number | Publication Date |
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TW202100929A true TW202100929A (en) | 2021-01-01 |
TWI726750B TWI726750B (en) | 2021-05-01 |
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ID=73760935
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW109121145A TWI726750B (en) | 2019-06-26 | 2020-06-22 | Cold plate |
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CN (2) | CN212183974U (en) |
TW (1) | TWI726750B (en) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2006249966A (en) * | 2005-03-09 | 2006-09-21 | Matsushita Electric Ind Co Ltd | Centrifugal pump and cooling device using the same |
TWI320452B (en) * | 2006-08-11 | 2010-02-11 | Foxconn Tech Co Ltd | Pump |
TWM460510U (en) * | 2013-03-18 | 2013-08-21 | Cooler Master Co Ltd | Water-cooling type heat dissipating device |
CN105992488A (en) * | 2015-01-28 | 2016-10-05 | 讯凯国际股份有限公司 | Liquid cooling-type radiating structure and manufacturing method thereof |
CN108227870B (en) * | 2016-12-09 | 2021-04-16 | 讯凯国际股份有限公司 | Cooling device for computing equipment |
WO2017124202A1 (en) * | 2016-01-19 | 2017-07-27 | 讯凯国际股份有限公司 | Liquid cooled heat radiator |
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2020
- 2020-06-22 CN CN202021172666.2U patent/CN212183974U/en active Active
- 2020-06-22 CN CN202010573720.2A patent/CN112153858A/en active Pending
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CN212183974U (en) | 2020-12-18 |
CN112153858A (en) | 2020-12-29 |
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