CN112119491A - 引线框配线构造和半导体模块 - Google Patents
引线框配线构造和半导体模块 Download PDFInfo
- Publication number
- CN112119491A CN112119491A CN201980029764.4A CN201980029764A CN112119491A CN 112119491 A CN112119491 A CN 112119491A CN 201980029764 A CN201980029764 A CN 201980029764A CN 112119491 A CN112119491 A CN 112119491A
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- Prior art keywords
- lead frame
- leg
- frame wiring
- joining
- disposed
- Prior art date
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Abstract
本发明减轻相对于半导体元件的应力集中。引线框配线(7)具有:第1接合部(71),其钎料接合于被配置在一侧的半导体元件;接合部(72),其钎料接合于被配置在另一侧的连接对象;以及连结部(73),其将接合部(71)和接合部(72)连结起来,连结部具有:连结面部(73a);第1腿部(73b),其从连结面部的一侧的端部向第1接合部侧延伸;以及第2腿部(73c),其从连结面部的另一侧的端部向第2接合部侧延伸。第1腿部同第1接合部中的在一侧的端部与另一侧的端部之间配置的、该第1接合部的外缘部的局部连接。
Description
技术领域
本发明涉及引线框配线构造和半导体模块。
背景技术
半导体模块设有IGBT(Insulated Gate Bipolar Transistor:绝缘栅双极型晶体管)、功率MOSFET(Metal Oxide Semiconductor Field Effect Transistor:金属-氧化物半导体场效应晶体管)、FWD(Free Wheeling Diode:续流二极管)等半导体元件,并在工业用途上被利用于电梯等中的马达驱动控制变换器等。另外,近年来,也被广泛利用于车载用马达驱动控制变换器。在车载用马达驱动控制变换器中,为了降低油耗而要求小型、轻量化,为了配置在发动机室内而要求高温工作环境下的长期可靠性。
以往,为了应对这样的小型、轻量化的要求、高温工作环境下的长期可靠性的要求,提出了利用引线框配线方式将半导体芯片(半导体元件)与电极图案之间连接起来的半导体模块(例如,参照专利文献1)。引线框配线方式是指,使用通过金属板的模具加工而成形的引线框配线,对半导体芯片进行支承固定并将半导体芯片和电极图案连接起来的方式。
现有技术文献
专利文献
专利文献1:日本特开2018-46164号公报
发明内容
发明要解决的问题
通常,在上述引线框配线的两端部设有L字状的弯折部,在该弯折部的水平面的下表面通过钎料接合于半导体芯片、电极图案的上表面。在利用钎料向半导体芯片等进行接合之际,可能产生钎料爬升到弯折部的下垂面部的情况。当钎料爬升到弯折部的下垂面部时,热变形引起的应力(应变)会集中于半导体芯片上表面,可能产生半导体芯片破损的情况。
本发明是鉴于上述问题而完成的,其目的之一在于提供能够减轻相对于半导体元件的应力集中的引线框配线构造和半导体模块。
用于解决问题的方案
本实施方式提供一种引线框配线构造,其将配置于引线框配线的一侧的半导体元件和配置于所述引线框配线的另一侧的连接对象电连接起来,该引线框配线构造的特征在于,该引线框配线构造具有:第1接合部,其钎料接合于所述半导体元件;第2接合部,其与所述第1接合部分开地配置,且钎料接合于所述连接对象;以及连结部,其将所述第1接合部和所述第2接合部连结起来,所述连结部具有:连结面部,其在上下方向上自所述第1接合部和所述第2接合部分开地配置;第1腿部,其从所述连结面部的所述一侧的端部向所述第1接合部侧延伸;以及第2腿部,其从所述连结面部的所述另一侧的端部向所述第2接合部侧延伸,所述第1腿部同所述第1接合部中的在所述一侧的端部与所述另一侧的端部之间配置的、该第1接合部的外缘部的局部连接。
发明的效果
采用本发明,能够减轻相对于半导体芯片的应力集中。
附图说明
图1是表示应用了本实施方式的引线框配线构造的半导体模块的结构的剖视图。
图2是本实施方式的半导体模块所具有的引线框配线的俯视图。
图3是本实施方式的引线框配线的立体图。
图4是本实施方式的引线框配线的加工前的展开图。
图5是本实施方式的引线框配线的加工过程的状态的立体图。
图6是本实施方式的引线框配线的加工过程的状态的立体图。
图7是本实施方式的引线框配线与半导体芯片的位置关系的说明图。
图8是本实施方式的变形例的引线框配线的立体图和加工前的展开图。
图9是本实施方式的变形例的引线框配线的立体图和加工前的展开图。
图10是以往的引线框配线的相对于半导体元件的接合部位的放大示意图。
具体实施方式
在被利用于车载用马达驱动控制变换器等的半导体模块中,为了应对小型、轻量化的要求、高温工作环境下的长期可靠性的要求,已知有一种利用引线框配线将半导体芯片与电极图案之间连接起来的引线框配线方式。以下,参照图10来说明以往的引线框配线的结构。图10是以往的引线框配线的相对于半导体元件的接合部位的放大示意图。
通常,如图10所示,在引线框配线的与半导体芯片等连接的部分,设有在侧面观察时大致垂直延伸的下垂面部101、以及从下垂面部101的端部呈L字状弯折且水平延伸的水平面部102。引线框配线的水平面部102的下表面通过钎料104接合于半导体芯片103的上表面。
配置在水平面部102的下方的钎料104在水平面部102的下表面均匀地摊开以有助于接合。另一方面,对于配置在下垂面部101的下方的钎料104,可能产生该钎料104爬升到下垂面部101的配置于与水平面部102所在侧相反的一侧的侧面101a的情况。在半导体芯片103中,随着通电的接通-断开的反复控制而反复产生热变形。钎料104的产生爬升部104a的部分与其他部分相比,钎料104更为集中,因此,热变形引起的应力(应变)会集中于半导体芯片103的上表面,可能成为半导体芯片103破损的原因。
本发明人关注到,随着对于引线框配线进行的弯曲加工而形成的圆角形状部(日文:R形状部)101b成为钎料爬升现象的主要原因。并且发现,使随着弯曲加工而形成的圆角形状部101b的表面积缩小的做法能抑制钎料爬升现象的产生,有助于减轻相对于半导体芯片的应力集中,从而想到了本发明。
即,本发明的要点在于,一种引线框配线构造,其具有:第1接合部,其钎料接合于被配置在引线框配线的一侧的半导体元件;第2接合部,其钎料接合于被配置在引线框配线的另一侧的连接对象;以及连结部,其将第1接合部和第2接合部连结起来,将沿上下方向延伸且与第1接合部接合的腿部设于连结部,并且将该腿部同第1接合部中的在一侧的端部与另一侧的端部之间配置的外缘部的局部连接。
采用本发明,腿部同第1接合部中的在一侧的端部与另一侧的端部之间配置的外缘部的局部连接。因此,能够减少腿部与用于将第1接合部接合于半导体元件的钎料相接触的接触面积。由此,即使在通过弯曲加工来形成腿部的情况下,也能够缩小随着弯曲加工而形成的圆角形状部的表面积,因此,能够抑制钎料爬升现象的产生,能够减轻相对于半导体芯片的应力集中。
以下,参照附图来说明本实施方式的半导体模块的结构。图1是表示应用了本实施方式的引线框配线构造的半导体模块1的结构的剖视图。以下,为了方便说明,将图1所示的上下方向和左右方向分别作为半导体模块1的上下方向和左右方向来说明。然而,在本说明书中使用的上下方向不是必须限定为重力方向。
如图1所示,半导体模块1包括在上表面和下表面设有电极图案2(2a~2c)的绝缘基板3。在绝缘基板3的上表面设有分开地配置的电极图案2a、2b。在绝缘基板3的下表面设有电极图案2c,该电极图案2c配置于绝缘基板3整个面。例如,电极图案2a~2c由铜(Cu)、铝(Al)等金属箔、金属板等构成。也可以在电极图案2设有镍(Ni)等镀层。以下,为了方便说明,将在上表面和下表面设有电极图案2的绝缘基板3称作层叠基板4。
在电极图案2a的上表面,借助钎料5a接合有半导体芯片6。例如,半导体芯片6由IGBT(Insulated Gate Bipolar Transistor)、功率MOSFET(Metal Oxide SemiconductorField Effect Transistor)等开关元件、FWD(Free Wheeling Diode)等二极管等半导体元件构成。半导体芯片6也可以由将IGBT和FWD一体化而成的RC(Reverse Conducting:反向导通)-IGBT、相对于反偏压具有充分的耐压的RB(Reverse Blocking:逆阻)-IGBT等半导体元件构成。半导体芯片6可以使用硅(Si)、碳化硅(SiC)、氮化镓(GaN)等半导体基板来形成。
在半导体芯片6的上表面和电极图案2b的上表面,作为电气连接用的配线而接合有引线框配线(以下,简称作“引线框”)7。引线框7通过对金属板实施弯曲加工而构成,具有大致沿左右方向延伸并且在其两端向下方侧弯曲的形状。在半导体芯片6的上表面,借助钎料5b接合有引线框7的一个接合部71。在电极图案2b的上表面,借助钎料5c接合有引线框7的另一个接合部72。这些接合部71和接合部72通过连结部73连结起来。此外,在后面叙述引线框7的结构。半导体芯片6构成半导体元件的一个例子,电极图案2b构成连接对象的一个例子。接合部72的连接对象并不限定于电极图案2b,还包含半导体模块1的外部端子等的结构。引线框7将配置在其一侧(图1所示的左侧)的半导体芯片6和配置在其另一侧(图1所示的右侧)的电极图案2b电连接起来。
在电极图案2c的下表面,借助钎料5d接合有金属基板8。换言之,在金属基板8的上表面借助钎料5d接合有层叠基板4。金属基板8起到对随着半导体模块1的驱动而产生的热进行散热的作用。金属基板8也可以具有未图示的散热片。以下,为了方便说明,将层叠有金属基板8、层叠基板4以及半导体芯片6的构件称作层叠组装体9。在层叠组装体9粘接有树脂壳体10。例如,树脂壳体10通过硅等粘接剂粘接于层叠组装体9。
在树脂壳体10的局部埋入有金属端子11。金属端子11沿上下方向延伸,并贯穿树脂壳体10。金属端子11的下端部11a在树脂壳体10内暴露。金属端子11的上端部11b向树脂壳体10的外侧突出。在金属端子11的暴露于树脂壳体10内的局部与半导体芯片6的上表面之间,连接有金属引线12。在如此配置了构成部件的状态下,在树脂壳体10的内部,为了对半导体芯片6进行绝缘保护而填充有环氧树脂等硬质树脂、由硅凝胶等构成的密封树脂13。
在此,参照图2和图3来说明本实施方式的半导体模块1所具有的引线框7的结构。图2是本实施方式的半导体模块1所具有的引线框7的俯视图。图3是本实施方式的引线框7的立体图。引线框7通过对整体具有相同厚度尺寸的金属板进行弯曲加工(模具加工)而成形。
如图2和图3所示,引线框7构成为包含由大致平面构成的接合部71、72和将这些接合部71、72连结起来的连结部73。接合部71构成第1接合部的一个例子,接合部72构成第2接合部的一个例子。另外,连结部73构成连结部的一个例子。接合部71和接合部72沿左右方向分开地配置。此外,接合部71、72和连结部73可以分别实质上为平板形状。另外,接合部71、72的角部可以被倒角。
接合部71具有配置在其一侧(图2所示的左侧)的窄幅部71b和配置在其另一侧(图2所示的右侧)的宽幅部71a。宽幅部71a在构成引线框的金属板的宽度方向(图2所示的上下方向)上具有第1宽度尺寸X。窄幅部71b具有比宽幅部71a窄的宽度尺寸Y,并形成为从宽幅部71a的侧缘部71c向左侧突出。
宽幅部71a和窄幅部71b俯视时均具有大致长方形状。例如,宽幅部71a和窄幅部71b这两者的左右方向上的宽度尺寸设定为相同。在该情况下,侧缘部71c配置于接合部71的左侧端部与右侧端部之间的中间位置。窄幅部71b俯视时配置于宽幅部71a的侧缘部71c的中央部分(图2所示的上下方向的中央部分)。接合部72由在图2所示的上下方向上相同宽度的平坦面构成。接合部71的宽幅部71a和接合部72具有与构成引线框7的金属板相同的宽度(宽度尺寸X)。
连结部73具有:连结面部73a,其在比接合部71、72靠上方侧的位置沿左右方向延伸;腿部73b,其从连结面部73a的一侧(图2所示的左侧)的端部(一端部)朝向接合部71侧(下方侧)延伸;以及腿部73c,其从连结面部73a的另一侧(图2所示的右侧)的端部(另一端部)向接合部72侧(下方侧)延伸。腿部73b构成第1腿部的一个例子,腿部73c构成第2腿部的一个例子。在本实施方式中,腿部73c具有在上下方向上比腿部73b长的尺寸。因此,接合部71在比接合部72靠上方侧的位置沿左右方向延伸。
在腿部73b设有一对连结腿部73b1、73b2。这些连结腿部73b1、73b2配置于连结面部73a的侧端部(图2所示的上方侧端部、下方侧端部)。这些连结腿部73b1、73b2同在接合部71中的一侧(图2所示的左侧)的端部(更具体而言为窄幅部71b的左端部)与接合部71中的另一侧(图2所示的右侧)的端部(更具体而言为宽幅部71a的右端部)之间配置的外缘部71d的局部连接。在此,配置在接合部71中的一侧的端部与接合部71中的另一侧的端部之间的外缘部71d指的是接合部71的除左右的端部以外的外缘部(即,图2所示的上方侧和下方侧的外缘部)。更具体而言,连结腿部73b1、73b2连接于宽幅部71a的突出有窄幅部71b的侧缘部71c的附近的未形成有窄幅部71b的区域。更具体而言,连结腿部73b1、73b2与宽幅部71a的配置于窄幅部71b的外侧(图2所示的上方侧和下方向侧)的局部连结。在一对连结腿部73b1、73b2之间形成有开口部74。腿部73c由与平面部73a相同宽度的平面构成。
接下来,参照图4~图6来说明具有上述结构的引线框7的各加工工序的状态。图4是本实施方式的引线框7的加工前的展开图。图5和图6是本实施方式的引线框7的加工过程的状态的立体图。在图4~图6中,示出图1所示的半导体模块1的上下方向和左右方向。如图4和图5A所示,构成加工前的引线框7的金属板70俯视时具有在左右方向上具有长度方向的实质上的长方形状。
在金属板70的靠近图4所示的右侧端部的位置形成有狭缝SA。狭缝SA是通过与金属板70的板面垂直地贯穿金属板70而形成的。狭缝SA俯视时具有:第1狭缝S1,其沿与金属板70的端面平行的方向(图4所示的上下方向)延伸;以及一对第2狭缝S2,该一对第2狭缝S2从第1狭缝S1的两端部向图4所示的右侧延伸。狭缝SA俯视时在整体上具有向图4所示的右侧开口的日文コ字形状。第1狭缝S1在金属板70的图4所示的中央部分延伸。第2狭缝S2分别形成于比金属板70的端面(图4所示的上下方向的端面)稍微靠内侧的位置,且相互平行地延伸。金属板70和狭缝SA也可以在角部设有倒角。
此外,在图4~图6中,为了方便说明,在对金属板70进行弯曲加工的位置示出了第1加工线BL1~第4加工线BL4。第1加工线BL1在第2狭缝S2的右侧端部附近配置于第2狭缝S2的外侧(图4所示的上方侧和下方侧)。第2加工线BL2配置于比第1狭缝S1稍微靠左侧的位置。第3加工线BL3配置于比金属板70的中央稍微靠左侧的位置。第4加工线BL4配置于金属板70的靠近图4所示的左侧端部的位置。这些第1加工线BL1~第4加工线BL4都设为与金属板70的左右方向的端面平行地延伸。
另外,在图4和图5A中,为了方便说明,示出了弯曲加工后的引线框7的结构部分的附图标记。如图4和图5A所示,由比狭缝SA和第1加工线BL1靠右侧的部分构成接合部71,由第1加工线BL1及狭缝SA这二者与第2加工线BL2之间的部分构成连结部73的腿部73b。另外,由第2加工线BL2与第3加工线BL3之间的部分构成连结部73的连结面部73a,由第3加工线BL3与第4加工线BL4之间的部分构成连结部73的腿部73c,由比第4加工线BL4靠左侧的部分构成接合部72。
在对引线框7进行加工之际,首先,沿着第1加工线BL1,以使金属板70的比狭缝SA靠左侧的左侧部分立起的方式进行弯曲加工。如图5B所示,金属板70弯折至相对于非加工部分垂直的位置。通过如此弯折金属板70,从而形成接合部71、连结部73的腿部73b和开口部74。
此时,金属板70的配置于狭缝SA的内侧的部分构成接合部71的窄幅部71b。金属板70的比第1加工线BL1靠右侧的部分构成接合部71的宽幅部71a。另外,宽幅部71a的沿着第1加工线BL1配置的局部构成侧缘部71c,窄幅部71b从该侧缘部71c突出形成。连结部73的与接合部71相对的腿部73b通过弯曲加工而形成于侧缘部71c附近的未形成有窄幅部71b的区域(非形成区域)。
接下来,沿着第2加工线BL2,以使金属板70的比第2加工线BL2靠上方的上方侧部分倒向右侧的方式进行弯曲加工。如图6A所示,金属板70的比第2加工线BL2靠上方侧的局部弯折至与接合部71平行的位置。通过如此弯折金属板70,从而形成连结部73的连结面部73a。
接下来,沿着第3加工线BL3,以使金属板70的比第3加工线BL3靠右侧的右侧部分倒向下方侧的方式进行弯曲加工。如图6B所示,金属板70的比第3加工线BL3靠右侧的局部弯折至与一对腿部73b的延伸方向平行的位置。通过如此弯折金属板70,从而形成连结部73的腿部73c。
最后,沿着第4加工线BL4,以使金属板70的比第4加工线BL4靠下方的下方侧部分向上方侧竖起的方式进行弯曲加工。如图3所示,金属板70的比第4加工线BL4靠下方侧的局部弯折至与接合部71平行的位置。通过如此弯折金属板70,从而形成接合部72。这样,完成图3所示的引线框7。
如此形成的引线框7钎料接合于半导体芯片6的上表面和电极图案2b的上表面。在此,参照图7来说明引线框7相对于半导体芯片6的位置关系。图7是本实施方式的引线框7和半导体芯片6的位置关系的说明图。在图7A、图7B中,分别示出了引线框7的立体图和俯视图。另外,在图7中,为了方便说明,用单点划线示出半导体芯片6的外缘部。
如图7A、图7B所示,在本实施方式中,以使引线框7的接合部71配置于半导体芯片6的中央区域的方式将接合部71钎料接合于半导体芯片6的上表面。更具体而言,引线框7以一对连结腿部73b1、73b2配置于包含半导体芯片6中的左侧端部61与右侧端部62之间的中间位置63在内的位置的方式接合于半导体芯片6(参照图7B)。
如图7A所示,在引线框7中,连结部73的腿部73b(一对连结腿部73b1、73b2)同接合部71中的在左侧端部与右侧端部之间配置的外缘部71d的局部连接。因此,能够减少腿部73b(一对连结腿部73b1、73b2)与用于将接合部71接合于半导体芯片6的钎料相接触的接触面积。由此,即使在通过弯曲加工来形成腿部73b的情况下,也能够缩小随着弯曲加工而形成的圆角形状部的表面积,因此,能够抑制钎料爬升现象的产生,能够减轻相对于半导体芯片的应力集中。
更具体而言,在引线框7中,成为钎料爬升现象的主要原因的圆角形状部仅限定于连结部73的腿部73b(一对连结腿部73b1、73b2)的下端部(更具体而言为一对连结腿部73b1、73b2的下端部的左侧面)。由此,与在接合部71的整个宽度方向上具有圆角形状部的情况相比,能够大幅地缩小圆角形状部的表面积,因此,能够抑制钎料爬升现象的产生,能够减轻相对于半导体芯片6的应力集中。
特别是,在本实施方式的引线框7中,连结部73的腿部73b(一对连结腿部73b1、73b2)配置于包含半导体芯片6中的左侧端部61与右侧端部62之间的中间位置63在内的位置。通常,半导体芯片6容易因相对于外周缘部附近的部分的应力集中而破损。对此,根据本实施方式的引线框7,由于腿部73b(一对连结腿部73b1、73b2)配置于包含半导体芯片6中的左右方向的中间位置63在内的位置,因此,即使在应力集中于一对连结腿部73b1、73b2周边的情况下,也能够将应力集中部位配置于半导体芯片6的中央附近,因此,能够使半导体芯片6不易破损。
另外,在本实施方式的引线框7中,一对连结腿部73b1、73b2从连结面部73a的左侧端部延伸并连接于接合部71的相对的外缘部71d。由此,即使在应力集中于一对连结腿部73b1、73b2的周边的情况下,也能够将该应力集中部位配置于分开的位置(图7B所示的在上下方向上分开的位置),因此,能够降低应力集中对半导体芯片6的影响。
另外,在本实施方式的引线框7中,腿部73b(一对连结腿部73b1、73b2)是通过对形成于金属板70的狭缝SA的周边部分实施弯曲加工而形成的(参照图5A和图5B)。因此,能够在不需要复杂结构的情况下简单地缩小随着弯曲加工而形成的圆角形状部的表面积。
并且,在本实施方式的引线框7中,腿部73b(一对连结腿部73b1、73b2)配置于包含接合部71的中左侧端部与右侧端部之间的中间位置(宽幅部71a的侧缘部71c)在内的位置(参照图7B)。因此,能够在接合部71的中央附近经由腿部73b来承受使引线框7接合时的负荷,因此,能够将接合部71平衡良好地接合于半导体芯片6。
此外,本发明不限于上述实施方式,而能够进行各种变更来实施。在上述实施方式中,附图所示的构成要件的大小、形状、功能等并不限定于此,能够在发挥本发明的效果的范围内进行适当变更。此外,只要不脱离本发明的目的的范围,就能够适当变更并实施。
例如,在上述实施方式中,说明了在构成引线框7的金属板70设置狭缝SA且设置一对腿部73b的情况。然而,引线框7的结构并不限定于此,而能够适当变更。图8是本实施方式的变形例的引线框7A的立体图(图8A)和加工前的展开图(图8B)。此外,在图8中,对于与上述实施方式共同的结构,标注相同的附图标记,并省略说明。
如图8B所示,在变形例的引线框7A中,在金属板70形成狭缝SB这点上与引线框7不同。狭缝SB是通过与金属板70的板面垂直地贯穿金属板而形成的。狭缝SB俯视时具有:第3狭缝S3,其与金属板70的端面平行(沿图8B所示的上下方向)地延伸;以及第4狭缝S4,其从图8B所示的第3狭缝S3的下端部向右侧延伸。第3狭缝S3从金属板70的图8B所示的上端部向下方侧延伸至比金属板70的中央稍微靠下方侧的位置。第4狭缝S4沿着金属板70的长度方向延伸。
通过对如此构成的金属板70实施与上述实施方式同样的弯曲加工,从而形成图8A所示的引线框7A。在引线框7A中,在连结部73的与接合部71连接的腿部73b具有单个连结腿部73b3这点上与上述实施方式的引线框7不同。此外,连结腿部73b3构成为宽度比连结腿部73b1或连结腿部73b2的宽度大。与一对连结腿部73b1、73b2同样地,连结腿部73b3同接合部71中的在左侧端部与右侧端部之间配置的外缘部71d的局部连接。
在具有这样的结构的引线框7A中,成为钎料爬升现象的主要原因的圆角形状部也是仅限定于连结部73的腿部73b(连结腿部73b3)的下端部。由此,与在接合部71的整个宽度方向上具有圆角形状部的情况相比,能够大幅地缩小圆角形状部的表面积,因此,能够抑制钎料爬升现象的产生,能够减轻相对于半导体芯片6的应力集中。
另外,在上述实施方式中,说明了在构成引线框7的的金属板70的板面上垂直地设置狭缝SA的情况。然而,引线框7的结构并不限定于此,而能够适当变更。图9是本实施方式的变形例的引线框7B的立体图(图9A)和加工前的展开图(图9B)。此外,在图9中,对于与上述实施方式共同的结构,标注相同的附图标记,并省略说明。
如图9B所示,在变形例的引线框7B中,在金属板70形成狭缝SC这点上与引线框7不同。狭缝SC在具有从第1狭缝S1的两端以不与金属板70的板面垂直的方式倾斜地形成的第5狭缝S5这点上与狭缝SA不同。狭缝SC的第5狭缝S5以朝向图9B所示的金属板70的上端部和下端部切入的方式形成。
通过对如此构成的金属板70实施与上述实施方式同样的弯曲加工,从而形成图9A所示的引线框7B。在引线框7B中,在接合部71的窄幅部71b的侧缘部形成倾斜面部71e这点上与上述实施方式的引线框7不同。倾斜面部71e在窄幅部71b的外侧形成为朝向下方侧去宽度方向的尺寸变大。倾斜面部71e构成对一对连结腿部73b1、73b2与用于使接合部71接合的钎料之间的接触进行限制的限制部的一个例子。
在具有这样结构的引线框7B中,在窄幅部71b的外侧朝向下方侧去宽度方向的尺寸变大的倾斜面部71e形成于接合部71。由此,限制了钎料与一对连结腿部73b1、73b2的左侧面的接触,因此能够抑制钎料相对于一对连结腿部73b1、73b2的左侧面的爬升现象的产生,因而能够有效地减轻相对于半导体芯片6的应力集中。
此外,在此,说明了将倾斜面部71e的下方侧端部配置在与宽幅部71a的端面(图9B所示的上下方向的端面)相同位置的情况。然而,倾斜面部71e的下方侧端部的位置并不限定于此。倾斜面部71e的下方侧端部的位置能够以配置于比窄幅部71b的上端部的位置靠外侧(图9B所示的上下方向侧)的位置为前提配置在任意的位置。
以下,整理上述实施方式中的特征点。
上述实施方式提供一种引线框配线构造,其将半导体元件和连接对象电连接起来,该引线框配线构造的特征在于,该引线框配线构造具有:第1接合部,其钎料接合于所述半导体元件;第2接合部,其与所述第1接合部分开地配置,且钎料接合于所述连接对象;以及连结部,其将所述第1接合部和所述第2接合部连结起来,所述连结部具有:连结面部,其在上下方向上自所述第1接合部和所述第2接合部分开地配置;第1腿部,其从所述连结面部的一侧的端部向所述第1接合部侧延伸;以及第2腿部,其从所述连结面部的另一侧的端部向所述第2接合部侧延伸,所述第1腿部同所述第1接合部中的在所述一侧的端部与所述另一侧的端部之间配置的外缘部的局部连接。根据该结构,第1腿部同第1接合部中的在一侧的端部与另一侧的端部之间配置的外缘部的局部连接。因此,能够减少第1腿部与用于将第1接合部接合于半导体元件的钎料相接触的接触面积。由此,即使在通过弯曲加工来形成第1腿部的情况下,也能够缩小随着弯曲加工而形成的圆角形状部的表面积,因此,能够抑制钎料爬升现象的产生,能够减轻相对于半导体芯片的应力集中。
在上述实施方式的引线框配线构造中,所述第1腿部配置于包含所述第1接合部的所述一侧的端部与所述第1接合部的所述另一侧的端部之间的中间位置的位置。根据该结构,第1腿部配置于包含第1接合部中的一侧的端部与另一侧的端部之间的中间位置在内的位置,因此,能够在第1接合部的中央附近经由第1腿部承受使引线框配线接合时的负荷,因此,能够使第1接合部平衡良好地接合于半导体元件。
在上述实施方式的引线框配线构造中,所述第1腿部是通过对在构成引线框配线的金属板上形成的狭缝的周边部分实施弯曲加工而形成的。根据该结构,通过对形成于金属板的狭缝的周边部分实施弯曲加工而形成第1腿部,因此能够在不需要复杂的结构的情况下简单地缩小随着弯曲加工而形成的圆角形状部的表面积。
在上述实施方式的引线框配线构造中,在所述第1接合部接合于所述半导体元件的状态下,所述第1腿部配置于包含所述半导体元件中的所述一侧的端部与所述另一侧的端部之间的中间位置在内的位置。根据该结构,由于第1腿部配置于包含半导体元件中的一侧的端部与另一侧的端部之间的中间位置在内的位置,因此,即使在应力集中于第1腿部的周边的情况下,也能够将应力集中部位配置于半导体元件的中央附近,而不配置于半导体元件的外周缘部附近,因此,能够使半导体元件不易破损。
在上述实施方式的引线框配线构造中,一对所述第1腿部从所述连结面部的所述一侧的端部向所述第1接合部侧延伸,并连接于所述第1接合部中的相对的外缘部。根据该结构,由于一对第1腿部连接于第1接合部中的相对的外缘部,因此即使在第1腿部的周边产生应力集中的情况下,也能够将该应力集中部位配置于分开的位置,因此,能够降低应力集中对半导体元件的影响。
在上述实施方式的引线框配线构造中,所述第1接合部具有限制部,该限制部对钎料与所述第1腿部中的所述一侧的面之间的接触进行限制。根据该结构,由于钎料与第1腿部中的一侧的面之间的接触被限制,因此,能够抑制钎料相对于第1腿部中的一侧的面的爬升现象的产生,因此能够有效地减轻相对于半导体芯片的应力集中。
上述实施方式的半导体模块的特征在于,该半导体模块具有上述任一种引线框配线构造。根据该结构,能够在半导体模块中得到上述引线框配线构造所产生的效果。
产业上的可利用性
本发明的半导体模块具有能够减轻相对于半导体芯片的应力集中这样的效果,适合于车载用马达驱动控制变换器等的要求小型、轻量化、高温工作环境下的长期可靠性的半导体模块。
本申请基于2018年11月5日申请的日本特愿2018-208087。这里包含其全部内容。
Claims (7)
1.一种引线框配线构造,其将配置于引线框配线的一侧的半导体元件和配置于所述引线框配线的另一侧的连接对象电连接起来,该引线框配线构造的特征在于,
该引线框配线构造具有:
第1接合部,其钎料接合于所述半导体元件;
第2接合部,其与所述第1接合部分开地配置,且钎料接合于所述连接对象;以及
连结部,其将所述第1接合部和所述第2接合部连结起来,
所述连结部具有:
连结面部,其在上下方向上自所述第1接合部和所述第2接合部分开地配置;
第1腿部,其从所述连结面部的所述一侧的端部向所述第1接合部侧延伸;以及
第2腿部,其从所述连结面部的所述另一侧的端部向所述第2接合部侧延伸,
所述第1腿部同所述第1接合部中的在所述一侧的端部与所述另一侧的端部之间配置的、该第1接合部的外缘部的局部连接。
2.根据权利要求1所述的引线框配线构造,其特征在于,
所述第1腿部配置于包含所述第1接合部中的所述一侧的端部与所述另一侧的端部之间的中间位置在内的位置。
3.根据权利要求1或2所述的引线框配线构造,其特征在于,
所述第1腿部是通过对在构成所述引线框配线的金属板上形成的狭缝的周边部分实施弯曲加工而形成的。
4.根据权利要求1至3中任一项所述的引线框配线构造,其特征在于,
在所述第1接合部接合于所述半导体元件的状态下,所述第1腿部配置于包含所述半导体元件中的所述一侧的端部与所述另一侧的端部之间的中间位置在内的位置。
5.根据权利要求1至4中任一项所述的引线框配线构造,其特征在于,
一对所述第1腿部从所述连结面部的所述一侧的端部向所述第1接合部侧延伸,并连接于所述第1接合部中的相对的外缘部。
6.根据权利要求1至5中任一项所述的引线框配线构造,其特征在于,
所述第1接合部具有限制部,该限制部对所述第1腿部与所述钎料之间的接触进行限制。
7.一种半导体模块,其特征在于,
该半导体模块具有权利要求1至6中任一项所述的引线框配线构造。
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