CN112095103A - 镀有金属膜层的工程塑料件及其镀膜方法 - Google Patents
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Abstract
一种镀有金属膜层的工程塑料件及其镀膜方法，涉及电气元件技术领域，所解决的是现有工程塑料件上的金属膜层易剥落的技术问题。该工程塑料件包括工程塑料基底件，所述工程塑料基底件上镀有金属复合膜层；所述金属复合膜层由至少一个合金膜层及至少一个铜膜层从下至上交替层叠而成，并且下起第一层为合金膜层，上起第一层为铜膜层；所述合金膜层的密度小于铜膜层的密度，并且大于工程塑料基底件的密度，合金膜层的热膨胀系数小于铜膜层的热膨胀系数，并且大于工程塑料基底件的热膨胀系数。本发明提供的工程塑料件及其镀膜方法，特别适合制作轻量化电气元件。
Description
技术领域
本发明涉及电气元件技术，特别是涉及一种镀有金属膜层的工程塑料件及其镀膜方法的技术。
背景技术
PPS（聚苯硫醚）、PA（聚酰胺）、PBT（聚对苯二甲酸丁二酯）、LCP（液晶高分子聚合物）、PEEK（聚醚醚酮）等工程塑料具有电磁屏蔽少、可塑性好的优点，在工程塑料件上镀上一定厚度、形状的金属膜层，可以制作出轻量化的无线信号增益器。
目前在工程塑料上镀金属膜层的方法主要有水电镀、真空蒸发镀、溅镀等，在工程塑料上镀的金属膜层通常是铜膜，由于铜与工程塑料的密度差异、热膨胀系数差异相对较大，而且两者的亲合度也不高，在工程塑料上镀的铜膜层达到一定厚度后很容易产生剥落，因此对工程塑料上镀的铜膜层厚度都有一定限制。
发明内容
针对上述现有技术中存在的缺陷，本发明所要解决的技术问题是提供一种金属膜层不易剥落的镀有金属膜层的工程塑料件及其镀膜方法。
为了解决上述技术问题，本发明所提供的一种镀有金属膜层的工程塑料件，包括工程塑料基底件，其特征在于：所述工程塑料基底件上镀有金属复合膜层；
所述金属复合膜层由至少一个合金膜层及至少一个铜膜层从下至上交替层叠而成，并且下起第一层为合金膜层，上起第一层为铜膜层；
所述合金膜层的密度小于铜膜层的密度，并且大于工程塑料基底件的密度，合金膜层的热膨胀系数小于铜膜层的热膨胀系数，并且大于工程塑料基底件的热膨胀系数。
进一步的，所述合金膜层及铜膜层的单层厚度都小于等于2微米。
进一步的，所述金属复合膜层中，上起第一层的铜膜层上表面镀有铜质的增厚膜层，并且增厚膜层的密度小于金属复合膜层中的铜膜层的密度。
进一步的，所述增厚膜层的厚度小于等于3微米。
进一步的，所述合金膜层采用铁铬镍合金或铬镍合金制成。
进一步的，所述工程塑料基底件的制作材料包括PPS、PA、PBT、LCP、PEEK中的任意一种。
进一步的，所述工程塑料基底件的制作材料中添加有质量百分比少于50%的辅助添加物，所述辅助添加物包括玻璃纤维、碳纤维、金属粉末中的任意一种。
本发明提供的镀有金属膜层的工程塑料件的镀膜方法，其特征在于，具体步骤如下：
步骤1，用遮蔽治具盖住工程塑料基底件，并使工程塑料基底件的被镀面外露，再将遮蔽治具盖住的工程塑料基底件放入真空容器；
步骤2，在真空容器中，利用氩气等离子轰击工程塑料基底件的被镀面，轰击时长在30秒至60秒之间；
步骤3，在真空容器中，采用真空镀方式在工程塑料基底件的被镀面上镀上一层合金膜层；
步骤4，在真空容器中，采用真空镀方式在合金膜层的上表面镀上一层铜膜层；
步骤5，如果已镀完金属复合膜层，则转至步骤7，反之则转至步骤6；
步骤6，在真空容器中，采用真空镀方式在铜膜层的上表面镀上一层合金膜层，然后再转至步骤4；
步骤7，从真空容器中取出工程塑料基底件，并移除遮蔽治具。
进一步的，所述步骤3、步骤4、步骤6中所采用的真空镀方式选用的是蒸发镀、溅射镀、离子镀中的一种或多种的组合。
进一步的，所述步骤7执行完毕后，再采用化学镀方式，在上起第一层的铜膜层上表面镀上一层铜质的增厚膜层。
进一步的，所述步骤1执行前，先用激光扫描工程塑料基底件的被镀面，使工程塑料基底件的被镀面碳化。
本发明提供的镀有金属膜层的工程塑料件及其镀膜方法，先在工程塑料基底件上镀一层与工程塑料亲合度较好的合金膜层，再将铜膜层镀在合金膜层上，由于合金膜层与工程塑料在密度、热膨胀系数上差异相对较小，合金膜层镀在工程塑料上的附着力较高，不易从工程塑料上剥落，而铜膜层与合金膜层在密度、热膨胀系数上差异也相对较小，铜膜层与合金膜层之间还存在着金属间的共用电子，因此铜膜层在合金膜层上的附着力也较高，也不易从合金膜层上剥落，相对现有的直接将铜膜层镀在工程塑料上的方式，本发明的金属膜层具有附着力好，不易剥落的特点，膜层也可以镀的相对较厚。
附图说明
图1是本发明实施例的镀有金属膜层的工程塑料件的膜层结构示意图。
具体实施方式
以下结合附图说明对本发明的实施例作进一步详细描述，但本实施例并不用于限制本发明，凡是采用本发明的相似结构及其相似变化，均应列入本发明的保护范围，本发明中的顿号均表示和的关系，本发明中的英文字母区分大小写。
如图1所示，本发明实施例所提供的一种镀有金属膜层的工程塑料件，包括工程塑料基底件1，其特征在于：所述工程塑料基底件1上镀有金属复合膜层；
所述金属复合膜层由至少一个合金膜层2及至少一个铜膜层3从下至上（近被镀面一侧为下侧）交替层叠而成，并且下起第一层为合金膜层2，上起第一层为铜膜层3；
所述合金膜层2的密度小于铜膜层3的密度，并且大于工程塑料基底件1的密度，合金膜层2的热膨胀系数小于铜膜层3的热膨胀系数，并且大于工程塑料基底件1的热膨胀系数。
本发明实施例中，所述金属复合膜层中的合金膜层2、铜膜层3均采用真空镀方法制作，并且合金膜层及铜膜层的单层厚度都小于等于2微米；所述真空镀方法可以选用蒸发镀、溅射镀、离子镀中的一种或多种的组合。
本发明实施例中，所述金属复合膜层中，上起第一层的铜膜层3上表面镀有铜质的增厚膜层4，并且增厚膜层4的密度小于金属复合膜层中的铜膜层3的密度，增厚膜层采用化学镀方法制作，增厚膜层的厚度小于等于3微米；真空镀方法制作的膜层密度较高，因此对膜层厚度有限制，膜层太厚了容易剥落，而且真空镀方法的镀膜时间要比化学镀方法的镀膜时间长，因此真空镀方法不适合镀较厚的增厚膜层，而化学镀方法制作的膜层密度较低，在膜层厚度限制方面要优于真空镀方法所制作的膜层，适合镀较厚的增厚膜层；本发明其它实施例中，也可以根据实际需要不用镀增厚膜层。
本发明实施例中，所述合金膜层采用铁铬镍合金制成，工程塑料的密度为1.4～1.6（单位g/cm³），铁铬镍合金的密度为7.4～7.9（单位g/cm³），真空镀铜的密度为8.9（单位g/cm³），化学镀铜的密度为8.7～8.8（单位g/cm³），工程塑料在20℃环境中的热膨胀系数为8～12（单位1E-6 /K），铁铬镍合金在20℃环境中的热膨胀系数为14.5～16（单位1E-6 /K），铜在20℃环境中的热膨胀系数为17.5（单位1E-6 /K），本发明其它实施例中，合金膜层也可以采用铬镍合金制作。
本发明实施例中，所述工程塑料基底件的制作材料包括PPS（聚苯硫醚）、PA（聚酰胺）、PBT（聚对苯二甲酸丁二酯）、LCP（液晶高分子聚合物）、PEEK（聚醚醚酮）中的任意一种，并且可在所选材料中添加质量百分比少于50%的辅助添加物，所述辅助添加物包括玻璃纤维、碳纤维、金属粉末中的任意一种。
本发明实施例所提供的镀有金属膜层的工程塑料件的镀膜方法的具体步骤如下：
步骤1，先用功率大于5W的激光扫描工程塑料基底件的被镀面，使工程塑料基底件的被镀面碳化，再用遮蔽治具盖住工程塑料基底件，并使工程塑料基底件的被镀面外露，再将遮蔽治具盖住的工程塑料基底件放入真空容器；
步骤2，在真空容器中，利用氩气等离子轰击工程塑料基底件的被镀面，轰击时长在30秒至60秒之间，轰击时长的优选值为30秒；
氩气等离子轰击可以在真空下以等离子能量打破工程塑料基底件被镀面的高分子表面，使其活化形成自由碳链，可以增加合金膜层的附着力；
步骤3，在真空容器中，采用真空镀方式在工程塑料基底件的被镀面上镀上一层合金膜层；
步骤4，在真空容器中，采用真空镀方式在合金膜层的上表面镀上一层铜膜层；
步骤5，如果已镀完金属复合膜层，则转至步骤7，反之则转至步骤6；
步骤6，在真空容器中，采用真空镀方式在铜膜层的上表面镀上一层合金膜层，然后再转至步骤4；
步骤7，从真空容器中取出工程塑料基底件，并移除遮蔽治具；
步骤8，采用化学镀方式，在上起第一层的铜膜层上表面镀上一层铜质的增厚膜层。
本发明实施例中，所述步骤3、步骤4、步骤6中所采用的真空镀方式选用的是蒸发镀、溅射镀、离子镀中的一种或多种的组合。
本发明其它实施例中，如果不需要镀增厚膜层，则可省略步骤8。
Claims (11)
1.一种镀有金属膜层的工程塑料件，包括工程塑料基底件，其特征在于：所述工程塑料基底件上镀有金属复合膜层；
所述金属复合膜层由至少一个合金膜层及至少一个铜膜层从下至上交替层叠而成，并且下起第一层为合金膜层，上起第一层为铜膜层；
所述合金膜层的密度小于铜膜层的密度，并且大于工程塑料基底件的密度，合金膜层的热膨胀系数小于铜膜层的热膨胀系数，并且大于工程塑料基底件的热膨胀系数。
2.根据权利要求1所述的镀有金属膜层的工程塑料件，其特征在于：所述合金膜层及铜膜层的单层厚度都小于等于2微米。
3.根据权利要求1所述的镀有金属膜层的工程塑料件，其特征在于：所述金属复合膜层中，上起第一层的铜膜层上表面镀有铜质的增厚膜层，并且增厚膜层的密度小于金属复合膜层中的铜膜层的密度。
4.根据权利要求3所述的镀有金属膜层的工程塑料件，其特征在于：所述增厚膜层的厚度小于等于3微米。
5.根据权利要求1所述的镀有金属膜层的工程塑料件，其特征在于：所述合金膜层采用铁铬镍合金或铬镍合金制成。
6.根据权利要求1所述的镀有金属膜层的工程塑料件，其特征在于：所述工程塑料基底件的制作材料包括PPS、PA、PBT、LCP、PEEK中的任意一种。
7.根据权利要求6所述的镀有金属膜层的工程塑料件，其特征在于：所述工程塑料基底件的制作材料中添加有质量百分比少于50%的辅助添加物，所述辅助添加物包括玻璃纤维、碳纤维、金属粉末中的任意一种。
8.根据权利要求1所述的镀有金属膜层的工程塑料件的镀膜方法，其特征在于，具体步骤如下：
步骤1，用遮蔽治具盖住工程塑料基底件，并使工程塑料基底件的被镀面外露，再将遮蔽治具盖住的工程塑料基底件放入真空容器；
步骤2，在真空容器中，利用氩气等离子轰击工程塑料基底件的被镀面，轰击时长在30秒至60秒之间；
步骤3，在真空容器中，采用真空镀方式在工程塑料基底件的被镀面上镀上一层合金膜层；
步骤4，在真空容器中，采用真空镀方式在合金膜层的上表面镀上一层铜膜层；
步骤5，如果已镀完金属复合膜层，则转至步骤7，反之则转至步骤6；
步骤6，在真空容器中，采用真空镀方式在铜膜层的上表面镀上一层合金膜层，然后再转至步骤4；
步骤7，从真空容器中取出工程塑料基底件，并移除遮蔽治具。
9.根据权利要求8所述的镀有金属膜层的工程塑料件的镀膜方法，其特征在于：所述步骤3、步骤4、步骤6中所采用的真空镀方式选用的是蒸发镀、溅射镀、离子镀中的一种或多种的组合。
10.根据权利要求8所述的镀有金属膜层的工程塑料件的镀膜方法，其特征在于：所述步骤7执行完毕后，再采用化学镀方式，在上起第一层的铜膜层上表面镀上一层铜质的增厚膜层。
11.根据权利要求8所述的镀有金属膜层的工程塑料件的镀膜方法，其特征在于：所述步骤1执行前，先用激光扫描工程塑料基底件的被镀面，使工程塑料基底件的被镀面碳化。
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4771366A (en) * | 1987-07-06 | 1988-09-13 | International Business Machines Corporation | Ceramic card assembly having enhanced power distribution and cooling |
| JPH10195668A (ja) * | 1996-12-28 | 1998-07-28 | Sumitomo Metal Mining Co Ltd | ２層フレキシブル基板の製造方法 |
| JP2007247026A (ja) * | 2006-03-17 | 2007-09-27 | Kakogawa Plastic Kk | ２層フィルム、２層フィルムの製造方法およびプリント基板の製造方法 |
| CN102254832A (zh) * | 2010-05-20 | 2011-11-23 | 禾伸堂企业股份有限公司 | 陶瓷基板制造方法 |
| CN108055790A (zh) * | 2017-12-06 | 2018-05-18 | 陈旺寿 | 一种电路板及其制作方法和应用 |
| US20180187323A1 (en) * | 2015-06-16 | 2018-07-05 | 3M Innovative Properties Company | Plated polymeric article including tin/copper tie/seed layer |
| CN108715992A (zh) * | 2018-06-05 | 2018-10-30 | 武汉大学 | 一种集成电路陶瓷电路板表面铜-石墨烯复合涂层及其制备方法 |
| CN212610902U (zh) * | 2020-07-27 | 2021-02-26 | 合肥镭士客微电路有限公司 | 镀有金属膜层的工程塑料件 |
-
2020
- 2020-10-19 CN CN202011116866.0A patent/CN112095103A/zh active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4771366A (en) * | 1987-07-06 | 1988-09-13 | International Business Machines Corporation | Ceramic card assembly having enhanced power distribution and cooling |
| JPH10195668A (ja) * | 1996-12-28 | 1998-07-28 | Sumitomo Metal Mining Co Ltd | ２層フレキシブル基板の製造方法 |
| JP2007247026A (ja) * | 2006-03-17 | 2007-09-27 | Kakogawa Plastic Kk | ２層フィルム、２層フィルムの製造方法およびプリント基板の製造方法 |
| CN102254832A (zh) * | 2010-05-20 | 2011-11-23 | 禾伸堂企业股份有限公司 | 陶瓷基板制造方法 |
| US20180187323A1 (en) * | 2015-06-16 | 2018-07-05 | 3M Innovative Properties Company | Plated polymeric article including tin/copper tie/seed layer |
| CN108055790A (zh) * | 2017-12-06 | 2018-05-18 | 陈旺寿 | 一种电路板及其制作方法和应用 |
| CN108715992A (zh) * | 2018-06-05 | 2018-10-30 | 武汉大学 | 一种集成电路陶瓷电路板表面铜-石墨烯复合涂层及其制备方法 |
| CN212610902U (zh) * | 2020-07-27 | 2021-02-26 | 合肥镭士客微电路有限公司 | 镀有金属膜层的工程塑料件 |
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