CN112071799A - Support claw, airlock chamber and plasma processing device host platform - Google Patents
Support claw, airlock chamber and plasma processing device host platform Download PDFInfo
- Publication number
- CN112071799A CN112071799A CN201910497710.2A CN201910497710A CN112071799A CN 112071799 A CN112071799 A CN 112071799A CN 201910497710 A CN201910497710 A CN 201910497710A CN 112071799 A CN112071799 A CN 112071799A
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- wafer
- supporting claw
- soft wear
- pallet
- soft
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- 210000000078 claw Anatomy 0.000 title claims abstract description 73
- 238000012545 processing Methods 0.000 title claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 34
- 239000002245 particle Substances 0.000 claims abstract description 25
- 235000012431 wafers Nutrition 0.000 claims description 78
- 238000000034 method Methods 0.000 claims description 25
- 239000011248 coating agent Substances 0.000 claims description 23
- 238000000576 coating method Methods 0.000 claims description 23
- 230000008569 process Effects 0.000 claims description 17
- 239000004809 Teflon Substances 0.000 claims description 16
- 229920006362 Teflon® Polymers 0.000 claims description 16
- 238000012546 transfer Methods 0.000 claims description 11
- 229920000642 polymer Polymers 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052710 silicon Inorganic materials 0.000 abstract description 4
- 239000010703 silicon Substances 0.000 abstract description 4
- 230000007547 defect Effects 0.000 abstract description 3
- 238000011109 contamination Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 239000013618 particulate matter Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
Abstract
The invention discloses a supporting claw, an airlock chamber and a plasma processing device host platform.A pair of two supporting claws are contacted with the edge part of a wafer to support the wafer; the supporting claw comprises a soft wear-resistant material, and the soft wear-resistant material is arranged on the supporting claw and used for reducing or avoiding particles generated when the wafer is in contact with the supporting claw. According to the invention, the soft contact between the supporting claw and the wafer is realized by arranging the soft wear-resistant material on the supporting claw, so that the friction generated by the hard contact between the silicon wafer and the supporting claw is effectively avoided, the generation of particles can be further prevented, and the defect rate of the wafer is greatly reduced.
Description
Technical Field
The invention relates to the field of semiconductor manufacturing, in particular to a support claw, an airlock chamber and a plasma processing device host platform.
Background
Particle contamination is often found in wafer transfer paths in existing plasma processing apparatuses. Particle contamination is one of the important metrics for plasma processing equipment performance, and particle fall on a wafer can cause process defects and even render the wafer useless.
Particularly, the susceptor for placing the wafer in the airlock chamber (loadlock) is one of the main sources of particle generation. Airlock chambers are used in plasma processing apparatus host platforms to provide unprocessed wafers to and receive processed wafers from a plurality of process modules. The airlock chambers are of cavity structures and connected with a transmission module, and each airlock chamber is provided with a plurality of supporting claws for placing wafers.
As shown in fig. 1 and 5, the particle contamination in the airlock 20 is caused because the ceramic susceptor 22 and the silicon wafer 10 are both very hard and brittle, and the particle contamination is easily caused by the friction or collision between the wafer 10 and the susceptor 22. Further, a robot arm 70(robot arm) for transferring the wafer 10 is disposed inside the transfer module 40 in the mainframe platform of the plasma processing apparatus. However, after the robot 70 supports the high-temperature wafer 10 in the plasma stripping apparatus (plasma stripping apparatus), the surface of the O-ring 71 of the robot 70 supporting the wafer 10 may be adhered to the composite organic matter in the plasma stripping apparatus, and then adhered to the lower surface of the wafer 10. When the robot arm 70 places the wafer 10 in the airlock 20, the robot arm 70 moves downward, and the complete detachment of the O-ring 71 stuck on the wafer 10 from the wafer 10 causes the wafer 10 to bounce and collide or rub against the chuck 22, eventually making particle contamination more serious.
Therefore, it is one of the most developed goals of the industry to reduce the particle contamination source in the airlock chamber to optimize the particle performance on the wafer surface.
Disclosure of Invention
The invention aims to provide a support claw, an air lock chamber and a plasma processing device host platform, which are used for reducing particle pollution sources in the air lock chamber and optimizing the performance of particles on the surface of a wafer.
In order to achieve the above object, the present invention provides a pair of supporting claws, two of which are in contact with an edge portion of a wafer to support the wafer; the supporting claw comprises a soft wear-resistant material, and the soft wear-resistant material is arranged on the supporting claw and used for reducing or avoiding particles generated when the wafer is in contact with the supporting claw.
In the above-mentioned supporting claw, the soft wear-resistant material is a soft wear-resistant coating covering the surface of the supporting claw.
The thickness of the soft wear-resistant coating is 10-120 μm.
The support claw is characterized in that the soft wear-resistant coating is obtained by spraying.
In the above-mentioned supporting claw, the soft wear-resistant material is a soft wear-resistant member embedded in or attached to the supporting claw.
In the above-mentioned supporting claw, the soft wear-resistant member is detachably connected to the supporting claw.
In the above-mentioned supporting claw, the soft wear-resistant material is a polymer.
The above-mentioned supporting claw, wherein, the polymer is teflon.
The invention further provides an airlock chamber, which comprises an airlock chamber cavity and a plurality of support claws arranged in the airlock chamber cavity, wherein two support claws in pair are contacted with the edge part of the wafer to support the wafer.
The invention further provides a plasma processing apparatus host platform, which comprises the airlock chamber, the equipment front end module, the transmission module and the process module.
In the plasma processing apparatus host platform, the transmission module is internally provided with the mechanical arm for transmitting the wafer between the airlock chamber and the process module, and the mechanical arm is provided with the O-ring for bearing the wafer.
In the above plasma processing apparatus mainframe platform, the process module is a plasma photoresist removing device.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, soft contact between the supporting claw and the wafer is realized by arranging the soft wear-resistant material (such as Teflon and other materials) on the supporting claw, so that friction and collision generated by direct hard contact between the wafer and the supporting claw are effectively avoided, further generation of particles can be prevented, and the performance of the particles on the surface of the wafer is greatly optimized. The invention can cover the soft wear-resistant coating on the surface of the supporting claw in the airlock by using methods such as spraying and the like, and can also be embedded or attached on the supporting claw by manufacturing an independent soft wear-resistant part, so that the process is simple and easy to realize.
Drawings
FIG. 1 is a schematic diagram of particle contamination in an airlock chamber of a conventional plasma processing apparatus;
FIG. 2 is a schematic diagram of a preferred embodiment of an airlock chamber of the present invention;
FIG. 3 is a schematic structural diagram of a preferred embodiment of a method for disposing a soft wear-resistant material on a supporting claw according to the present invention;
FIG. 4 is a schematic structural diagram of another preferred embodiment of the present invention for disposing the soft wear-resistant material on the supporting claw;
FIG. 5 is a block diagram of a plasma processing apparatus host platform according to a preferred embodiment of the present invention.
Detailed Description
The following describes in more detail embodiments of the present invention with reference to the schematic drawings. Advantages and features of the present invention will become apparent from the following description and claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
In the interest of clarity, not all features of an actual implementation are described. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. It will of course be appreciated that in the development of any such actual embodiment, numerous implementation-specific details must be set forth in order to achieve the developer's specific goals, such as compliance with system-related and business-related constraints, which will vary from one implementation to another. Moreover, it will be appreciated that such a development effort might be complex and time-consuming, but would nevertheless be a routine undertaking for those of ordinary skill in the art.
It is to be noted that the drawings are in a very simplified form and employ non-precise ratios for the purpose of facilitating and distinctly facilitating the description of one embodiment of the present invention.
As shown in fig. 2, the present invention provides an airlock chamber 20, which includes an airlock chamber body 21 and a plurality of pairs of holding claws 22 disposed therein, wherein two holding claws in a pair contact with an edge portion of a wafer to hold the wafer; the fingers 22 comprise a soft wear-resistant material disposed thereon for reducing or avoiding particles generated when the wafer contacts the fingers. In this embodiment, 4 pairs of the holding claws 22 are provided in the airlock chamber body 21, which can be used for temporary placement when transferring the wafer 10 between the front end module 30 of the plasma processing apparatus mainframe platform and the airlock chamber 20, and between the airlock chamber 20 and the transfer module 40. The airlock chamber 21 is also connected to a vacuum pump 23 for providing a vacuum environment within the airlock chamber 20 to allow for the exchange of wafers 10 within the airlock chamber 20 and the transfer module 40.
The supporting claws 22 are made of hard materials such as ceramics, so as to have enough strength to support and place the wafer 10, but hard contact with the wafer 10 is also caused correspondingly, and particle pollution is caused. The soft wear-resistant material is arranged on the supporting claw 22, so that the wafer 10 is prevented from being in direct contact with the supporting claw 22, the soft contact between the wafer 10 and the supporting claw 22 can be realized under the condition that the existing operation is not influenced, the particle pollution is further reduced, the particle performance on the surface of the wafer 10 is optimized, and the occurrence of process defects is prevented.
In the airlock 20 capable of reducing particle contamination provided by the present invention, the soft wear-resistant material may be disposed on the supporting claw 22 in different manners, as long as the supporting claw 22 is prevented from directly contacting the wafer 10, and the soft wear-resistant material is disposed between the supporting claw 22 and the wafer 10 and is in soft contact with the wafer 10.
In view of the technical problem to be solved by the present invention, the selected soft wear-resistant material can be any material that can achieve soft contact between the soft wear-resistant material and the wafer 10 as long as the soft wear-resistant characteristic is satisfied. For example, the soft wear resistant material may be selected to be a polymer having soft wear characteristics. Further, the polymer may be chosen to be a low cost teflon. The Teflon with the characteristics of softness and wear resistance can not generate particles after being rubbed with the silicon wafer, and experiments prove that the number of the particles on the surface of the wafer 10 is obviously reduced, thereby achieving the expected purpose of the invention.
The soft wear-resistant material may be selected as a soft wear-resistant coating covering the surface of the supporting jaw 22. In the embodiment shown in fig. 3, the soft abrasion resistant coating may preferably be a teflon coating 221. The coating may cover the entire surface of the supporting claw 22, or cover the upper surface of the supporting claw 22 contacting the wafer 10, or only provide a soft wear-resistant coating on the upper surface of the supporting claw 22 contacting only the wafer 10. The above methods can achieve the technical effects of the present invention, but in the actual processing process, covering the surface of the entire supporting claw 22 with a soft wear-resistant coating is a simple and easy method, and the increase in cost can be ignored.
The thickness of the soft wear-resistant layer in the above embodiments does not substantially affect the technical effect achieved by the present invention. However, considering the limitations of the specific process and the balance between practical effects and cost, a thickness of 10 μm to 120 μm is more preferable.
For the actual processing technology, the soft wear-resistant coating is obtained by spraying. In one embodiment, a teflon coating 221 may be selectively deposited on the surface of the supporting claw 22 in the airlock 20 to reduce the number of particles on the surface of the wafer 10. The following process steps can be specifically adopted:
(1) handling of the holding claw 22
In order to obtain sufficient surface adhesion of the surface of the prongs 22, all of the grease on the surface to be coated must be removed. The method comprises the following specific steps: firstly, dissolving oil and fat by using an organic solvent and heating to about 400 ℃ to completely volatilize the oil and fat; then, the surface of the supporting claw 22 is cleaned, and the bonding capability of the teflon coating 221 and the surface layer of the workpiece can be further improved by applying an adhesion aid (primer).
(2) Teflon coating 221 spray coating
Firstly, the teflon coating 221 material is uniformly distributed in the solvent to form a dispersion, and then the mixture is atomized and sprayed on the surface of the supporting claw 22 by high-pressure air. The sprayed coating material must be uniform.
(3) Drying
The wet teflon coating 221 is heated in an oven at a temperature controlled below 100 degrees until most of the solvent has evaporated.
(4) Sintering
The dried jaws 22 are heated to a higher temperature until an irreversible reaction occurs: the teflon coating 221 material melts and forms a network structure with the bonding aid.
The supporting claw 22 with the Teflon coating 221 can be obtained through the method, and the wafer 10 is effectively prevented from being in direct contact with the supporting claw 22. And the teflon coating 221 can be further modified to improve its wear resistance during practical application.
The soft wear-resistant material can be selectively designed into a three-dimensional single component with a certain shape and structure, and the soft wear-resistant component can be arranged on the supporting claw 22 in an embedding or attaching mode and the like. In the embodiment shown in fig. 4, a soft wear-resistant member 222 is inserted into the holder 22, and the tip of the soft wear-resistant member 222 protrudes from the upper end surface of the holder 22 to directly contact and support the wafer 10. Optionally, the soft abradable 222 is a teflon piece. The method is simple to manufacture, and the whole part of the supporting claw 22 does not need to be plated.
For example, a groove structure may be formed on the supporting claw 22, and a soft wear-resistant member having a shape matching the groove structure is inserted into the groove structure and is fixedly connected to the supporting claw 22, and a portion of the soft wear-resistant member protrudes from the groove structure to support the wafer 10, so that the supporting claw 22 is prevented from directly contacting the wafer 10.
For another example, the soft wear-resistant member may be adhered or attached to the surface of the supporting claw 22 so that the supporting claw 22 does not directly contact the wafer 10. Further, the soft wear resistant member is removably attached to the holder jaw 22 for replacement after a period of use.
According to the technical concept of the invention, the technical idea of solving the particle pollution in the airlock 20 provided by the invention can be applied to other positions of the main machine platform of the whole plasma processing device, and the technical idea provided by the invention can be adopted as long as the particle pollution source caused by friction or collision can still meet the original technical requirements after the soft wear-resistant material is arranged.
As shown in fig. 5, the present invention further provides a plasma processing apparatus mainframe platform comprising the airlock chamber 20, the mainframe platform comprising a front end of the apparatus module 30, the airlock chamber 20, a transfer module 40, and a plurality of process modules 50, for example, the process modules 50 are plasma strip apparatuses. The wafer 10 is brought into an atmospheric environment and placed on the equipment front end module 30. Subsequently, the wafer 10 needs to be transferred into the airlock chamber 20, and the function of the airlock chamber 20 is to transfer the wafer 10 from the atmospheric environment to the vacuum environment or vice versa. Mounted within the transport module 40 maintained in a vacuum environment is a robot 70 for removing wafers 10 to be processed from the airlock 20 and loading the wafers 10 into a plurality of process modules 50 through gate valves 60 located between the transport module 40 and each of the process chambers 50 for processing (e.g., etch/photoresist strip/chemical vapor deposition, etc.) of the wafers 10 to be processed. After the wafer 10 is processed, the robot 70 then removes the processed wafer 10 from the process module 50 and transfers it to the ambient atmosphere through the airlock 20.
Specifically, the airlock chamber 20 has two gate valves 60 that do not open simultaneously, one of the gate valves 60 communicating with the equipment front end module 30 and the other gate valve 60 communicating with the transfer module 40. When the gate valve 60 on the front end module 30 side is opened, the airlock chamber 20 is maintained in the atmospheric environment, and the wafer 10 in the airlock chamber 20 and the front end module 30 can be exchanged. When the gate valve 60 on the side of the transfer module 40 is opened, the airlock 20 is maintained in a vacuum environment by the vacuum pump 23, and the wafer 10 in the airlock 20 and the transfer module 40 can be exchanged.
The surface of a supporting claw 22 for placing a wafer 10 in an airlock 20 in a host platform of a plasma processing device provided by the invention is provided with a soft wear-resistant material so as to prevent the wafer 10 from directly contacting the supporting claw 22. Soft contact between the supporting claw 22 and the wafer 10 is realized by arranging soft wear-resistant materials (such as teflon and the like) on the supporting claw 22, friction generated by hard contact between the silicon wafer 10 and the supporting claw 22 is effectively avoided, further generation of particles can be prevented, and the performance of particles on the surface of the wafer 10 is greatly optimized. In addition, the problem that the O-shaped ring 71 at the position where the mechanical arm 70 supports the wafer 10 becomes sticky to increase the friction and the collision between the wafer 10 and the supporting claw 22 after the mechanical arm 70 supports the high-temperature wafer 10 from the plasma photoresist removing equipment is also avoided.
While the present invention has been described in detail with reference to the preferred embodiments, it should be understood that the above description should not be taken as limiting the invention. Various modifications and alterations to this invention will become apparent to those skilled in the art upon reading the foregoing description. Accordingly, the scope of the invention should be determined from the following claims.
Claims (12)
1. A pair of holding claws, wherein two holding claws are in contact with an edge portion of a wafer to hold the wafer; the supporting claw comprises a soft wear-resistant material, and the soft wear-resistant material is arranged on the supporting claw and used for reducing or avoiding particles generated when the wafer is in contact with the supporting claw.
2. The pallet of claim 1, wherein the soft wear-resistant material is a soft wear-resistant coating covering a surface of the pallet.
3. The pallet of claim 2, wherein the soft wear resistant coating has a thickness of 10 μm to 120 μm.
4. The pallet of claim 2, wherein the soft wear resistant coating is applied by spraying.
5. The pallet of claim 1, wherein the soft wear-resistant material is a soft wear-resistant member embedded in or attached to the pallet.
6. The pallet of claim 5, wherein the soft wear part is removably attached to the pallet.
7. The pallet of claim 1, wherein the soft, wear-resistant material is a polymer.
8. The pallet of claim 7, wherein the polymer is teflon.
9. An airlock chamber comprising an airlock chamber body and a plurality of the fingers of any one of claims 1 to 8 disposed within the airlock chamber body, wherein a pair of two fingers contact an edge portion of a wafer to hold the wafer.
10. A plasma processing apparatus mainframe platform comprising the airlock chamber of claim 9, an equipment front end module, a transport module, and a process module.
11. The plasma processing apparatus host platform of claim 10, wherein a robot is mounted within the transfer module for transferring wafers between the airlock and the process module, the robot having an O-ring disposed thereon for carrying the wafers.
12. The plasma processing apparatus host platform of claim 10, wherein the process module comprises a plasma strip tool.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910497710.2A CN112071799A (en) | 2019-06-10 | 2019-06-10 | Support claw, airlock chamber and plasma processing device host platform |
| TW109119244A TWI771695B (en) | 2019-06-10 | 2020-06-09 | Claw, air lock chamber and host platform of plasma processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910497710.2A CN112071799A (en) | 2019-06-10 | 2019-06-10 | Support claw, airlock chamber and plasma processing device host platform |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112071799A true CN112071799A (en) | 2020-12-11 |
Family
ID=73658173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910497710.2A Pending CN112071799A (en) | 2019-06-10 | 2019-06-10 | Support claw, airlock chamber and plasma processing device host platform |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112071799A (en) |
| TW (1) | TWI771695B (en) |
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| KR20100054243A (en) * | 2008-11-14 | 2010-05-25 | 주성엔지니어링(주) | Loadrock chamber for manufacturing semiconductor device and apparatus for manufacturing semiconductor device using the same |
| CN102610547A (en) * | 2011-01-25 | 2012-07-25 | 家登精密工业股份有限公司 | Front open type wafer box provided with inflatable support element module |
| JP2014154720A (en) * | 2013-02-08 | 2014-08-25 | Tokyo Electron Ltd | Processed body holding member, carrier device and processing unit |
| CN208923074U (en) * | 2018-10-26 | 2019-05-31 | 长鑫存储技术有限公司 | Transmit arm |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7055875B2 (en) * | 2003-07-11 | 2006-06-06 | Asyst Technologies, Inc. | Ultra low contact area end effector |
| US9881820B2 (en) * | 2015-10-22 | 2018-01-30 | Lam Research Corporation | Front opening ring pod |
-
2019
- 2019-06-10 CN CN201910497710.2A patent/CN112071799A/en active Pending
-
2020
- 2020-06-09 TW TW109119244A patent/TWI771695B/en active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020065984A (en) * | 2001-02-08 | 2002-08-14 | 삼성전자 주식회사 | Apparatus of transfering wafer with chuck |
| JP2004095942A (en) * | 2002-09-02 | 2004-03-25 | Kokusai Electric Semiconductor Service Inc | Wafer cassette |
| JP2004172287A (en) * | 2002-11-19 | 2004-06-17 | Fujitsu Ltd | Wafer carrier, inspecting wafer and method for regulating wafer insertion to wafer carrier |
| CN101404263A (en) * | 2007-10-04 | 2009-04-08 | Asm日本子公司 | Position sensor system for substrate transfer robot |
| KR20100054243A (en) * | 2008-11-14 | 2010-05-25 | 주성엔지니어링(주) | Loadrock chamber for manufacturing semiconductor device and apparatus for manufacturing semiconductor device using the same |
| CN201374321Y (en) * | 2009-02-26 | 2009-12-30 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Wafer frame cassette and semiconductor processing device |
| CN102610547A (en) * | 2011-01-25 | 2012-07-25 | 家登精密工业股份有限公司 | Front open type wafer box provided with inflatable support element module |
| JP2014154720A (en) * | 2013-02-08 | 2014-08-25 | Tokyo Electron Ltd | Processed body holding member, carrier device and processing unit |
| CN208923074U (en) * | 2018-10-26 | 2019-05-31 | 长鑫存储技术有限公司 | Transmit arm |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202046404A (en) | 2020-12-16 |
| TWI771695B (en) | 2022-07-21 |
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