CN201374321Y

CN201374321Y - Wafer frame cassette and semiconductor processing device

Info

Publication number: CN201374321Y
Application number: CN200920105579U
Authority: CN
Inventors: 雷跃刚
Original assignee: Beijing North Microelectronics Co Ltd
Current assignee: Beijing North Microelectronics Co Ltd
Priority date: 2009-02-26
Filing date: 2009-02-26
Publication date: 2009-12-30
Anticipated expiration: 2019-02-26

Abstract

The utility model discloses a wafer frame cassette and a semiconductor processing device, a buffer device is embedded on the upper surface of a carrying support of the wafer frame cassette, the buffer device can be shaped like a continuous long strip, a discontinuous long strip, an arrangement of points and the like, and the cross section of the buffer device can be shaped like a rectangle or an O and the like. The buffer device can be made of fluorine rubber or other flexible materials. A wafer can be placed on the buffer device, the wafer and the carrying support are difficult to collide during the handling process, thereby avoiding the generation of particles, reducing pollution source and improving the finished product rate of the wafer.

Description

Wafer carrying magazine and semiconductor processing equipment

Technical field

The utility model relates to a kind of semiconductor processing equipment parts, relates in particular to a kind of wafer carrying magazine and semiconductor processing equipment.

Background technology

Along with dwindling of semiconductor device critical size, in order to make the device function on the chip normal, avoid the pollution in the wafer fabrication processes, the requirement to pollutant sources control in the semiconductor fabrication processes is more and more stricter.Modern semiconductors processing is omnidistance to be finished in Clean room, and the pollution of Clean room mainly is divided into following 5 kinds: particle, metal impurities, organic substance are stained, natural oxidizing layer and static release etc.Wherein, particle control is the simplest control the most directly perceived in the semicon industry.In the semiconductor machining, the rough algorithm of acceptable particle size is that it must can cause the generation of defective chips less than half of minimum device characteristic size greater than the particle of this size.

The link that produces particle in chip manufacturing proces has a lot, and the particle that produces owing to error in the transmission course is a very important link.The all transmission of wafer before carrying out each step process all are placed in the wafer carrying magazine (also claiming wafer cassette) in the semicon industry.Though in wafer carrying magazine transmission course a large amount of use mechanical transfer, personnel's carrying operation also is absolutely necessary.

Shown in Fig. 1 a, Fig. 1 b, Fig. 1 c, in the prior art, the structure of the wafer carrying magazine 1 that uses in the semicon industry generally has 25 grooves, and each groove can be placed a wafer on loading support 2.In carrying wafer carrying box, require operating personnel to handle with care, avoid artificial strenuous vibration to produce a large amount of particles.

There is following shortcoming at least in above-mentioned prior art:

In the process of carrying wafer carrying box, the loading support of wafer and wafer carrying magazine collides easily, and produces particle at crystal column surface.

Summary of the invention

The purpose of this utility model provides a kind of in handling process, and wafer and loading support are not easy because of wafer carrying magazine and the semiconductor processing equipment of collision at the generation particle.

The purpose of this utility model is achieved through the following technical solutions:

Wafer carrying magazine of the present utility model comprises the loading support, and the upper surface of described loading support is embedded with buffer unit.

Semiconductor processing equipment of the present utility model, this semiconductor processing equipment comprise above-mentioned wafer carrying magazine.

The technical scheme that is provided by above-mentioned the utility model as can be seen, wafer carrying magazine described in the utility model and semiconductor processing equipment, because the upper surface of loading support is embedded with buffer unit, wafer can be placed on the buffer unit, in handling process, wafer and loading support are not easy producing particle because of collision.

Description of drawings

Fig. 1 a is the structural representation of wafer carrying magazine in the prior art;

Fig. 1 b is the A portion enlarged drawing of Fig. 1 a;

Fig. 1 c is the plan structure schematic diagram of loading support in the prior art;

Fig. 2 a is the plan structure schematic diagram one of loading support in the specific embodiment of the utility model;

Fig. 2 b is the plan structure schematic diagram two of loading support in the specific embodiment of the utility model;

Fig. 2 c is the plan structure schematic diagram three of loading support in the specific embodiment of the utility model;

Fig. 3 a is the cross section structure schematic diagram one of buffer unit in the specific embodiment of the utility model;

Fig. 3 b is the cross section structure schematic diagram two of buffer unit in the specific embodiment of the utility model.

Embodiment

Wafer carrying magazine of the present utility model, its preferable embodiment comprises loading support 2 shown in Fig. 2 a, Fig. 2 b, Fig. 2 c, the upper surface of loading support 2 is embedded with

buffer unit

31,32,33.Buffer unit can be continuous strip 31, and the also strip 32 that can be interrupted also can be for arranging shape 33 etc.

Shown in Fig. 3 a, Fig. 3 b, the cross section of buffer unit 3 can be square type or " O " type, also can adopt other shape.

Buffer unit 3 can be rubber buffer, as the fluorubber buffer unit etc., also can adopt other flexible material to make.

Semiconductor processing equipment of the present utility model, its preferable embodiment are that this semiconductor processing equipment comprises above-mentioned wafer carrying magazine.

Wafer carrying magazine of the present utility model can be to reduce since in the semiconductor fabrication processes because the particle contamination that carrying or other vibrations produce improves the product yield, thereby reach the purpose that the saving wafer reduces cost.

Concrete principle is:

In the wafer carrying magazine, embed one section elastomeric material on each layer loading support as padded coaming, even like this during wafer carrying magazine carrying, take place stronger collision can not make yet wafer and wafer carrying magazine loading support generation sharp impacts and produce a large amount of particle contaminations at crystal column surface.

Specific embodiment:

Shown in Fig. 3 a, Fig. 3 b, apart from edge 3mm place fluting, the dark 1mm of groove width 1.2mm, groove are embedded in rubber rectangle or " O " type padded coaming of one section 1.2mm * 1.2mm of corresponding length at the loading support.The upper surface of padded coaming and loading support lower surface between thickness h and the thickness of the wafer carrying magazine loading support of standard be consistent, can not cause that like this manipulator gets the sheet failure.

Padded coaming is preferably the Viton material, that the fluorubber material has is high temperature resistant, oil resistant, wear-resisting, characteristic that the medicine of anti-the number of chemical corrodes and surpasses cleanliness factor, is widely used in semicon industry.Carrying out when wafer cassette regularly cleans, can look the length of using fluorubber service time and select to take out the fluorubber material and clean respectively, or directly clean together.

The fluorubber material has the chemical stability of height, is present best a kind of of medium-resistance in all elastomers.Not only anti-petroleum base oils, di esters oil, silicon ethers oil, silicic acid class oil are gone back inorganic acid resistance, the organic and inorganic solvent of anti-majority etc.In addition, the fluorubber rectangle material of customization suitable size is more or less freely.

The utility model becomes to have embedded the form of one deck fluorubber rectangular strip as padded coaming with each layer loading support Design in the wafer carrying magazine, can effectively reduce the particle that produces because of collision because of the loading support of wafer and wafer carrying magazine, reduce pollutant sources, improved the rate of finished products of wafer.

The above; it only is the preferable embodiment of the utility model; but protection range of the present utility model is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; the variation that can expect easily or replacement all should be encompassed within the protection range of the present utility model.

Claims

1, a kind of wafer carrying magazine comprises the loading support, it is characterized in that, the upper surface of described loading support is embedded with buffer unit.

2, wafer carrying magazine according to claim 1 is characterized in that, described buffer unit is a rubber buffer.

3, wafer carrying magazine according to claim 2 is characterized in that, described rubber buffer is the fluorubber buffer unit.

4, wafer carrying magazine according to claim 1 is characterized in that, described buffer unit is continuous strip.

5, wafer carrying magazine according to claim 1 is characterized in that, the strip of described buffer unit for being interrupted.

6, wafer carrying magazine according to claim 1 is characterized in that, described buffer unit is arranged shape for point.

According to claim 4,5 or 6 described wafer carrying magazines, it is characterized in that 7, the cross section of described buffer unit is square type or " O " type.

8, a kind of semiconductor processing equipment is characterized in that, this semiconductor processing equipment comprises each described wafer carrying magazine of claim 1 to 7.