CN101399175B - Display substrate manufacturing method - Google Patents
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- CN101399175B CN101399175B CN2008101656826A CN200810165682A CN101399175B CN 101399175 B CN101399175 B CN 101399175B CN 2008101656826 A CN2008101656826 A CN 2008101656826A CN 200810165682 A CN200810165682 A CN 200810165682A CN 101399175 B CN101399175 B CN 101399175B
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Abstract
A display substrate manufacturing method includes a placing step of placing a dummy substrate on a clamping surface, an evacuating step of evacuating the interior of a space formed between the clamping surface and dummy substrate, in order to bring the dummy substrate into tight contact with the clamping surface, a heating step of heating a base in order to facilitate removing, from the clamping surface, foreign particles sticking to the clamping surface, a transferring step of transferring the foreign particles sticking to the clamping surface from the clamping surface to the dummy substrate in tight contact with the clamping surface, and a removing step of removing, from the clamping surface, the dummy substrate to which the foreign particles are transferred in the transferring step.
Description
Technical field
The present invention relates to make method and vacuum treatment device such as display base plates such as flat-panel monitors.
Background technology
Static sticking device is used as and is used for carrying out stationary device at the substrate that substrate processing apparatus such as semiconductor manufacturing facility or flat panel display manufacturing apparatus are handled.In such substrate processing apparatus, under being fixed on substrate state on this static sticking device, handles the static holding force by static sticking device.After finishing dealing with,, substrate is discharged from static sticking device by removing the static holding force.Therefore, in the substrate processing apparatus with static sticking device, substrate is by sticking and the release repeatedly of static sticking device.
On static sticking device and sticking face that substrate directly contacts, when sticking face during, compare with initial clean conditions repeatedly with substrate contacts, pollute little by little development.When the productivity ratio of equipment increases and the number of substrate to be processed when increasing, it is remarkable that this tendency becomes.
When pollutant adheres on the sticking face of static sticking device, the sticking degradation.By the sticking face of cleaning static sticking device, can recover the holding force of static sticking device.As the means that are used for this purpose, can pull down static sticking device from substrate processing apparatus, and with the manufacturing process of static sticking device in identical method cleaning static sticking device.
Unfortunately, owing to need huge workload, be unpractical so static sticking device is pulled down from the substrate processing apparatus of making.In addition, along with the size increase of substrate to be processed, recently, the size of static sticking device increases.This has further increased the shortcoming of the work of pulling down static sticking device.
And, the requirement that for the processing substrate speed that improves substrate processing apparatus and need cleaning to handle, having proposed need not any operator, clear up the surface of static sticking device automatically.For this reason, Japanese Patent Application Publication No.11-251417 has proposed a kind of by form special-purpose coat, measure in order to prevent that foreign particle from adhering on the static sticking face of static sticking device.
Fig. 3 is the diagram of expression according to the summary of the design of the static sticking device of disclosed prior art among the Japanese Patent Application Publication No.11-251417.Fig. 3 represents the base portion of static sticking device.This static sticking device can remain on substrate on the substrate maintenance face of being made by insulating barrier 1001 and a plurality of conductive layer 1002.In this design, with conductive layer 1002 stacked being dispersed on the sticking face.This can significantly reduce the substrate of sticking object of the adhesion conductivity foreign particle is wanted to(for) conduct.This can also suppress and prevent the reduction of the holding force that the existence owing to foreign particle causes.
Japanese Patent Application Publication No.2002-26115 discloses a kind of mechanism that is used for the temperature of the sticking face by static sticking device launching electromagnetic wave (thermal radiation) being improved static sticking device, as the constant maintaining body of surface state that is used to keep static sticking device, so that remove the residual charge of static sticking device.
Fig. 4 is the diagram of expression according to the summary of the design of the static sticking device of disclosed prior art among the Japanese Patent Application Publication No.2002-26115.As shown in Figure 4, static sticking device 2001 stickings and keep workpiece (substrate) 2002.Static sticking device 2001 shown in Figure 4 has such configuration: wherein, be installed in the locational lamp 2003 opposite with the sticking face of static sticking device 2001 and 2004 and send radiation to static sticking device 2001.If have residual charge on static sticking device 2001, then when discharging workpiece (substrate) 2002 from static sticking device 2001, this residual charge will play the effect of resistance.This makes it promptly not unload workpiece (substrate) 2002 from static sticking device 2001.On the contrary, the residual charge of the static sticking device 2001 shown in Fig. 4 can be removed by sending radiation from lamp 2003 and 2004 to static sticking device 2001.Therefore, can promptly workpiece (substrate) 2002 be unloaded from static sticking device 2001.
Unfortunately, has the static sticking device of the configuration shown in Fig. 3, owing to must in the configuration of static sticking device, form such as additional functions such as coatings, so increased equipment cost.As previously described, recently, along with the size increase of substrate to be processed, the size of static sticking device also increases.Thereby the cost of coating etc. also significantly increases.
And then being used for as shown in Figure 4 can obtain to remove the effect of the residual charge of static sticking device by the device that the surface emitting electromagnetic wave to static sticking device improves temperature.Yet, can expect that the foreign particle that is adsorbed onto for removal on the sticking face of static sticking device does not almost have effect.This is because the static sticking device shown in Fig. 4 does not have the path of the foreign particle that adheres to the corresponding removal of high-temperature process electric charge mobile route afterwards.That is,, the sticking face of static sticking device helps removing foreign particle on the sticking face that adheres to static sticking device although being applied external energy,, foreign particle does not leave the sticking face of static sticking device, but has been retained on the sticking face.Therefore, if stop to apply external energy to the sticking face of static sticking device, then foreign particle can adhere on the sticking face of static sticking device once more.
Summary of the invention
The purpose of this invention is to provide a kind of display substrate manufacturing method, and the vacuum treatment device that in such as the manufacturing process of display base plates such as flat-panel monitor, can remove the foreign particle on the sticking face that is bonded at static sticking device at short notice with simple method.
A scheme according to the present invention provides a kind of display substrate manufacturing method of display base plate manufacturing equipment, and described display base plate manufacturing equipment has: base portion, described base portion have the sticking face of being made by insulating material; Electrode, described electrode is formed in the described base portion, is used for the static holding force that sticking is placed on the substrate on the sticking face so that produce; Heater, described heater is formed in the described base portion, so that to described base portion heating; And air extractor, described air extractor is used for bleeding to being formed at the substrate that is placed on the described sticking face and the inside in the space between the described sticking face, and described method comprises: the placement step of placing the analog baseplate that is different from described substrate on the sticking face; Utilize described air extractor to be bled in the inside in described space so that the pump step that described analog baseplate and described sticking face are closely contacted; By described heater described base portion heating is removed the heating steps that adheres to the foreign particle on the described sticking face so that help from described sticking face; Transfer to transfer step on the described analog baseplate that closely contacts with described sticking face from described sticking face with adhering to foreign particle on the described sticking face; And, remove the step of removing that described transfer step foreign particle is transferred to described analog baseplate on it from described sticking face.
A kind of display substrate manufacturing method of display base plate manufacturing equipment is provided according to another aspect of the present invention, and described display base plate manufacturing equipment has: base portion, described base portion have the sticking face of being made by insulating material; Electrode, described electrode is formed in the described base portion, is used for the static holding force that sticking is placed on the substrate on the sticking face so that produce; Heater, described heater is formed in the described base portion, so that to described base portion heating; And air extractor, described air extractor is used for bleeding to being formed at the substrate that is placed on the described sticking face and the inside in the space between the described sticking face, and described method comprises: the placement step of placing the analog baseplate that is different from described substrate on the sticking face; By described heater described base portion heating is removed the heating steps that adheres to the foreign particle on the described sticking face so that help from described sticking face; Utilize described air extractor to be bled in the inside in described space so that the pump step that described analog baseplate and described sticking face are closely contacted; Transfer to transfer step on the described analog baseplate that closely contacts with described sticking face from described sticking face with adhering to foreign particle on the described sticking face; And, remove the step of removing that described transfer step foreign particle is transferred to described analog baseplate on it from described sticking face.
Another scheme according to the present invention provides a kind of vacuum treatment device, comprise: static sticking device, sticking power supply, heating power supply and vacuum pump, described static sticking device forms by a plurality of static sticking members are configured on the same plane, each static sticking member comprises: base portion, described base portion have the sticking face of being made by insulating material; Electrode, described electrode is formed in the described base portion, is used for the static holding force that sticking is placed on the substrate on the sticking face so that produce; Heater, described heater is formed in the described base portion, so that to described base portion heating; And the through hole of bleeding, the described through hole of bleeding connects described base portion, be communicated with described sticking face, described sticking power supply to be formed at described a plurality of static sticking members each in electrode application voltage, described heating power supply to be formed at described a plurality of static sticking members each in heater apply voltage, described vacuum pump is connected with the through hole of bleeding in being formed at each of described a plurality of static sticking members.
Display substrate manufacturing method of the present invention can be at short notice removed foreign particle on the sticking face that adheres to static sticking device with simple method.
To the description of exemplary embodiments, further feature of the present invention will become clearer by with reference to the accompanying drawings.
Description of drawings
Figure 1A is the cutaway view of summary of representing to form according to an embodiment of the invention the static sticking device of display base plate manufacturing equipment.
Figure 1B is used to illustrate the flow chart of the process of display substrate manufacturing method according to an embodiment of the invention.
Fig. 2 is the perspective view of summary of the configuration of expression flat-panel monitor film forming device (vacuum treatment device), and described flat-panel monitor film forming device is an example can using vacuum treatment device of the present invention.
Fig. 3 is the diagram of expression according to the summary of the configuration of the static sticking device of prior art.
Fig. 4 is the diagram of expression according to the summary of the configuration of the static sticking device of another prior art.
Embodiment
Below, embodiments of the invention are described with reference to the accompanying drawings.
Figure 1A is the cutaway view of summary of configuration of representing to form according to an embodiment of the invention the static sticking device of display base plate manufacturing equipment.
The base portion 10 that forms the static sticking device 100 of display base plate manufacturing equipment is equipped with retaining electrode 101 and internal heater 102, described retaining electrode 101 is used for producing the static holding force on sticking face 120, described internal heater 102 is used for 100 heating of static sticking device as heater.Retaining electrode 101 is electrically connected on the sticking power supply 150, and internal heater 102 is electrically connected on the internal heater power supply 160.These power supplys provide electric energy.Retaining electrode 101 and sticking power supply 150 play the effect of the static holding force generation device that is used to produce the static holding force, and described static holding force is used for the substrate on the sticking face that sticking is placed on static sticking device 100.In static sticking device 100, also form the through hole 111 of bleeding.The through hole 111 of bleeding extends perforation sticking face 120 and opposing face, thereby is communicated with sticking face 120.Bleed through hole 111 pipeline and static sticking device 100 with sticking face 120 away from face in opening be connected.Vacuum pump 170 is connected to the other end of this pipeline, thereby forms air extractor.
When receiving from voltage that sticking power supply 150 applies, retaining electrode 101 produces static, and described static produces the static holding force on sticking face 120.Therefore, the glass substrate 200 that is placed on the sticking face 120 of static sticking device 100 is fixed on the sticking face 120.
And glass substrate 200 specific insulation when being heated reduces.When the static sticking that utilizes static sticking device 100 fixes glass substrate 200, can produce powerful static holding force by this glass substrate 200 of heating.Internal heater 102 is used for the glass substrate 200 on the sticking face 120 that is placed on static sticking device 100 is heated.
In addition, the through hole 111 of bleeding is used for sticking face 120 that is formed on static sticking device 100 and the little space that is placed between the glass substrate 200 on this sticking face 120 are bled, thereby glass substrate 200 is fixed on the sticking face 120 by vacuum attraction, wherein, described little space is for example for being used to provide helium etc. so that improve the groove of cooling effect.Described vacuum attraction is often used in static sticking device 100 to carry out before the static sticking glass substrate 200 being temporarily fixed on the sticking face 120.
Retaining electrode 101, internal heater 102, bleed through hole 111 and vacuum pump 170 are main composition elements of static sticking device.According to the static sticking device method for cleaning of present embodiment, utilize these main composition elements of static sticking device, remove foreign particle on the sticking face 120 that adheres to static sticking device with simple method at short notice.Carry out by the controller (not shown) of for example operation of whole operations of display base plate manufacturing equipment and static sticking device 100 being controlled according to the static sticking method for cleaning of present embodiment.
Below, describe with reference to the process of the flow chart shown in Figure 1B static sticking method for cleaning.This static sticking method for cleaning is used as the process of a part that constitutes display substrate manufacturing method and carries out.
When reusing static sticking device 100 in such as substrate processing apparatus such as semiconductor manufacturing facility or flat-panel screens manufacturing equipments, the foreign particle that is produced by processing substrate adheres on the sticking face 120 of static sticking device 100 for example.These adhere to foreign particle on the sticking face 120 and have reduced holding force for glass substrate 200, and can produce glass substrate 200 move such unfavorable condition in the processing substrate process.Therefore, must remove the foreign particle that adheres on the sticking face 120.When by static sticking device 100 sticking glass substrates 200, carry out the holding force audit program.Do not have to obtain predetermined holding force if detect, then static sticking device 100 is cleared up.
In step S101, controller is carried out sticking device audit program, and whether the sticking device of definite static sticking device 100 is the holding force of being scheduled to.If do not have to obtain predetermined holding force, then program advances to step S102.On the other hand, if in step S101, determined to obtain predetermined holding force, then do not carry out any static sticking method for cleaning and finish program among Figure 1B.
When cleaning static sticking device 100 (being NO in step S101), simulate glass substrate (for example clean raw glass) is placed on the sticking face 120 of static sticking device 100 (S102).For the simulate glass substrate sticking that will be placed to sticking face 120, apply the voltage that produces by sticking power supply 150 to retaining electrode 101.By producing the static holding force with simulate glass substrate sticking (S102) to sticking face 120.
Then, operated vacuum pumps 170 is so that by the inside in the little space between 111 pairs of sticking faces 120 of through hole and the simulate glass substrate of bleeding bleed (S103).Suction pressure is set at for example 1Pa or littler.Bleed and make the simulate glass substrate closely contact with sticking face 120.
When bleeding as mentioned above, internal heater power supply 160 applies voltage to internal heater 102, so that the base portion 10 of static sticking device 100 is heated to predetermined temperature, for example 120 ℃, and, this is kept preset time (for example, being 120 minutes in the present embodiment) (S104) in the predetermined temperature heated state.This heating helps removing the foreign particle that adheres on the sticking face 120 from sticking face 120.
In step S105, the foreign particle that adheres on the sticking face 120 is transferred to from sticking face 120 on the simulate glass substrate that closely contacts with this sticking face 120.
Afterwards, by vacuum pump 170 is stopped, make the vacuum state that is formed at the little space between sticking face 120 and the simulate glass substrate turn back to atmosphere pressure state (S106), and, by making internal heater power supply 160 stop to apply voltage, make the temperature of the base portion 10 of static sticking device 100 reduce (S107).Then, catch the simulate glass substrate, and rise to static sticking device 100 tops carefully, thereby the simulate glass substrate is removed (S108) from the sticking face 120 of static sticking device 100 by the manipulator (not shown).By like this simulate glass substrate being removed from sticking face 120, the foreign particle of transferring on the simulate glass substrate is removed from sticking face 120, thereby cleared up sticking face 120.
As mentioned above, the method for cleaning of static sticking device 100 is finished.
According to the method for cleaning of the static sticking device 100 of present embodiment,, help removing the foreign particle that adheres on the sticking face 120 from the sticking face 120 of static sticking device 100 by base portion 10 with internal heater 102 heating static sticking devices 100.In this state, by being bled in the little space between sticking face 120 and the glass substrate 200, glass substrate 200 is closely contacted with sticking face 120, thereby the foreign particle that will adhere on the sticking face 120 is transferred on the glass substrate 200.
In this case, some foreign particles can be owing to be removed from sticking face 120 at the vacuum environment lower pumping.Adhere to the foreign particle on the sticking face 120 of static sticking device 100 and can remove from sticking face 120 owing to therefore be transferred on the glass substrate 200.This makes it not need from the substrate processing apparatus decomposition and dismantles the sticking face 120 that static sticking device 100 is cleared up static sticking device 100.Therefore, can carry out the cleaning operation of static sticking device 100 at short notice simply.
In the above-described embodiments, in the step of being bled in the inside that is formed at the little space between sticking face 120 and the glass substrate 200 (S103) afterwards, carry out the heating steps (S104) of the base portion 10 of static sticking device 100.Yet these sequence of steps are not limited to that this is a kind of; Also can carry out step (S104) before in the step of being bled in the inside that is formed at the little space between sticking face 120 and the simulate glass substrate 200 (S103) to base portion 10 heating of static sticking device 100.
Equally, in the above-described embodiments, whether the judged result of the holding force be scheduled to according to the holding force of static sticking device 100, carry out the processing of cleaning static sticking device 100, wherein, whether be that the judgement of the holding force be scheduled to is to carry out in the step S101 as the processing of a part that constitutes display substrate manufacturing method for the holding force of static sticking device 100.Yet the spirit and scope of the invention is not limited to this embodiment.Carry out when for example, the step of cleaning static sticking device 100 also can outnumber the predetermined reference number in the accumulative total of processed substrate.Can be set between the normal processing substrate step opportunity of carrying out, and perhaps, is set in the regular maintenance cycle of display base plate manufacturing equipment.That is, the processing of the cleaning static sticking device 100 of present embodiment can be carried out in idle any time of display base plate manufacturing equipment.
It should be noted that by in substrate processing apparatus, producing plasma, so that the disassociation foreign particle also can be removed the foreign particle on the sticking face 120 that adheres to static sticking device 100.Yet in this case, foreign particle is removed by the disassociation scattering in substrate processing apparatus, and adheres on inwall etc.This makes it need clear up the inside of substrate processing apparatus again.On the contrary, the method for cleaning of present embodiment can be removed them by foreign particle being transferred on the glass substrate 200.Therefore, almost do not have the scattering of foreign particle, can under the state of cleaning, clear up processing.And then the glass substrate 200 for foreign particle being transferred on it by foreign particle is washed off, can use arbitrarily repeatedly.The member of foreign particle is shifted in glass substrate 200 conducts that present embodiment adopts raw glass to make on it.Yet, also can adopt the member of making by other cheap material, as long as this member has the performance of heatproof degree rising recited above and is the smooth tabular component of cleaning.
In the described cleanup step, only glass substrate 200 is closely contacted with the sticking face 120 of static sticking device 100 in the above by bleeding with vacuum pump 170.Yet,, except adsorbing, can also utilize by retaining electrode 101 being applied the static holding force that voltage produces glass substrate 200 is contacted with the sticking face 120 of glass substrate 200 by bleeding in order to produce stronger contact force.
Although Figure 1A has represented to comprise the configuration of bipolar retaining electrode 101, but the structure of static sticking device 100 is not limited to this configuration.That is, also can adopt the structure that comprises the one pole retaining electrode.
It should be noted that if the sticking face 120 of static sticking device 100 can not be cleared up in the described in the above cleanup step well, then set and to bleed and the time of heating process kept 240 minutes, carry out above-mentioned same steps as.If still can not clear up sticking face 120 well, then set and will bleed and the time of heating process kept 720 minutes, carry out above-mentioned same steps as.By such repetition cleanup step, the sticking face 120 of static sticking device 100 can be cleared up well.
Fig. 2 is the perspective view of expression as the summary of the configuration of the flat-panel monitor film forming device of an example can using vacuum treatment device of the present invention.
In equipment shown in Figure 2, a plurality of static sticking member 100a that will have same size are configured on the static sticking configuration base portion 130 with rectangular, thereby form static sticking device 2100.Vacuum treatment device comprises the vacuum chamber (not shown) that holds static sticking device 2100 at least.
In described in the above this large scale equipment, the step that can clear up the sticking face 120 of static sticking device 2100 in the mode identical with the cleanup step of reference Figure 1A explanation.Therefore, by foreign particle being transferred on the glass substrate on the sticking face 120 that is placed on static sticking device 2100, the foreign particle that can remove on the sticking face 120 that adheres to static sticking device 2100 from sticking face 120.The advantage of the method for cleaning of this embodiment is, need be for the sticking face 120 of clearing up static sticking device 2100 static sticking device 2100 do not decomposed and pulls down from substrate processing apparatus.This advantage also is effective when cleaning is installed in static sticking device in the big equipment recited above.
Although described the present invention with reference to typical embodiment,, it will be appreciated that, the invention is not restricted to disclosed exemplary embodiments.The scope of following claim should be consistent with the wideest explanation, so that comprise all modification and 26S Proteasome Structure and Function of equal value.
Claims (10)
1. the display substrate manufacturing method of a display base plate manufacturing equipment, described display base plate manufacturing equipment has:
Base portion, described base portion have the sticking face of being made by insulating material;
Electrode, described electrode is formed in the described base portion, is used for the static holding force that sticking is placed on the substrate on the sticking face so that produce;
Heater, described heater is formed in the described base portion, so that to described base portion heating; And
Air extractor, described air extractor are used for bleeding to being formed at the substrate that is placed on the described sticking face and the inside in the space between the described sticking face,
Described method comprises:
On the sticking face, place the placement step of the analog baseplate that is different from described substrate;
Utilize described air extractor to be bled in the inside in described space so that the pump step that described analog baseplate and described sticking face are closely contacted;
By described heater described base portion heating is removed the heating steps that adheres to the foreign particle on the described sticking face so that help from described sticking face;
Transfer to transfer step on the described analog baseplate that closely contacts with described sticking face from described sticking face with adhering to foreign particle on the described sticking face; And,
Remove the step of removing that described transfer step foreign particle is transferred to described analog baseplate on it from described sticking face.
2. the method for claim 1 is characterized in that, described space is used to provide helium, in order to improve cooling effect.
3. the display substrate manufacturing method of a display base plate manufacturing equipment, described display base plate manufacturing equipment has:
Base portion, described base portion have the sticking face of being made by insulating material;
Electrode, described electrode is formed in the described base portion, is used for the static holding force that sticking is placed on the substrate on the sticking face so that produce;
Heater, described heater is formed in the described base portion, so that to described base portion heating;
And air extractor, described air extractor is used for bleeding to being formed at the substrate that is placed on the described sticking face and the inside in the space between the described sticking face,
Described method comprises:
On the sticking face, place the placement step of the analog baseplate that is different from described substrate;
By described heater described base portion heating is removed the heating steps that adheres to the foreign particle on the described sticking face so that help from described sticking face;
Utilize described air extractor to be bled in the inside in described space so that the pump step that described analog baseplate and described sticking face are closely contacted;
Transfer to transfer step on the described analog baseplate that closely contacts with described sticking face from described sticking face with adhering to foreign particle on the described sticking face; And,
Remove the step of removing that described transfer step foreign particle is transferred to described analog baseplate on it from described sticking face.
4. method as claimed in claim 3 is characterized in that described space is used to provide helium, in order to improve cooling effect.
5. the method for claim 1 is characterized in that, in described heating steps, with the state maintenance preset time of heating analog baseplate.
6. method as claimed in claim 3 is characterized in that, in described heating steps, with the state maintenance preset time of heating analog baseplate.
7. the method for claim 1, it is characterized in that, for with the analog baseplate sticking to described sticking face, described placement step comprise utilization by the static holding force that produces to described electrode application voltage with the analog baseplate sticking the placed step to the described sticking face.
8. method as claimed in claim 3, it is characterized in that, for with the analog baseplate sticking to described sticking face, described placement step comprise utilization by the static holding force that produces to described electrode application voltage with the analog baseplate sticking the placed step to the described sticking face.
9. the method for claim 1 is characterized in that, when the accumulated quantity of processed substrate surpasses predetermined reference quantity, implements described method.
10. method as claimed in claim 3 is characterized in that, when the accumulated quantity of processed substrate surpasses predetermined reference quantity, implements described method.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007246904 | 2007-09-25 | ||
| JP2007-246904 | 2007-09-25 | ||
| JP2007246904 | 2007-09-25 | ||
| JP2008239708A JP4469006B2 (en) | 2007-09-25 | 2008-09-18 | Manufacturing method of display substrate |
| JP2008-239708 | 2008-09-18 | ||
| JP2008239708 | 2008-09-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101399175A CN101399175A (en) | 2009-04-01 |
| CN101399175B true CN101399175B (en) | 2010-06-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101656826A Expired - Fee Related CN101399175B (en) | 2007-09-25 | 2008-09-24 | Display substrate manufacturing method |
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| JP (1) | JP4469006B2 (en) |
| CN (1) | CN101399175B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012048895A (en) * | 2010-08-25 | 2012-03-08 | Canon Inc | Manufacturing method for air tight container |
| JP5957248B2 (en) * | 2012-03-07 | 2016-07-27 | 株式会社アルバック | Method for regenerating substrate holding device |
| KR20140002470A (en) * | 2012-06-29 | 2014-01-08 | 삼성디스플레이 주식회사 | Display device, manufacturing method of the same and manufacturing device of the same |
| US9439315B2 (en) | 2012-06-29 | 2016-09-06 | Samsung Display Co., Ltd. | Display device, and method and apparatus for manufacturing the same |
| WO2016160322A1 (en) * | 2015-04-01 | 2016-10-06 | Sxaymiq Technologies Llc | Electrostatic cleaning device |
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| JPH08321447A (en) * | 1995-05-25 | 1996-12-03 | Hitachi Ltd | Wafer processing method with foreign matter eliminating function |
| JP2003051433A (en) * | 2001-08-03 | 2003-02-21 | Toto Ltd | Temperature control device for electrostatic chuck unit |
| JP2003315805A (en) * | 2002-04-24 | 2003-11-06 | Shin-Etsu Engineering Co Ltd | Panel alignment system of substrate for flat panel |
| JP4030350B2 (en) * | 2002-05-28 | 2008-01-09 | 株式会社アルバック | Split electrostatic chuck |
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- 2008-09-24 CN CN2008101656826A patent/CN101399175B/en not_active Expired - Fee Related
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| CN1275309C (en) * | 1999-12-09 | 2006-09-13 | 圣戈本陶瓷及塑料股份有限公司 | Electrostatic chuck, susseptor and method for fabrication |
| CN1591777A (en) * | 2003-08-25 | 2005-03-09 | 东京毅力科创株式会社 | Unit cleaning method and substrate treater for depressurizing chamber |
| CN1328780C (en) * | 2003-09-05 | 2007-07-25 | 大日本网目版制造株式会社 | Substrate treater and treating method |
| CN1835205A (en) * | 2005-03-18 | 2006-09-20 | 东京毅力科创株式会社 | Substrate mounting table, substrate processing apparatus and substrate processing method |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN101399175A (en) | 2009-04-01 |
| JP4469006B2 (en) | 2010-05-26 |
| JP2009099957A (en) | 2009-05-07 |
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