CN112040349A

CN112040349A - Multifunctional gateway

Info

Publication number: CN112040349A
Application number: CN202011042373.7A
Authority: CN
Inventors: 但宇航; 李倩; 魏志清; 徐剑锋
Original assignee: Qingyuan Deyuan Energy Development Co ltd
Current assignee: Qingyuan Deyuan Energy Development Co ltd
Priority date: 2020-09-28
Filing date: 2020-09-28
Publication date: 2020-12-04

Abstract

The invention provides a multifunctional gateway, which comprises a shell and a circuit board arranged in the shell, wherein an electric element and a plurality of data connectors are arranged on the circuit board, and the data connectors protrude out of the top surface of the shell; the shell comprises an upper shell and a lower shell which are matched with each other, a heat conducting plate is fixedly arranged on the bottom surface of the upper shell, the heat conducting plate plugs the bottom of the upper shell to form a closed cavity in the upper shell, and the circuit board is arranged in the closed cavity; the top surface of the upper shell is embedded with a control panel; the circuit board is provided with a plurality of through holes at vacant positions outside the electric elements, the top surface of the heat conducting plate is provided with a plurality of heat conducting columns corresponding to the through holes, and the heat conducting columns extend into the closed cavity through the through holes; the bottom surface of the heat conducting plate is provided with at least one semiconductor refrigerating piece, and the refrigerating surface of the semiconductor refrigerating piece is arranged close to the bottom surface of the heat conducting plate; the novel heat dissipation structure has the advantages of being novel in structure, convenient to disassemble and assemble, capable of providing good heat dissipation, effectively preventing the electric elements from being damaged and prolonging the service life of equipment.

Description

Multifunctional gateway

Technical Field

The invention relates to the field of gateway devices, in particular to a multifunctional gateway.

Background

With the continuous development of the internet of things technology, the demand for solving the last kilometer of data transmission is increasing, but the number of nodes contained in a single network is limited, so that a network device is needed to manage a plurality of wireless sensor networks, so that the nodes in the different networks can be interconnected and intercommunicated, and the device is just a gateway.

The Gateway (Gateway) is also called an internetwork connector and a protocol converter. The gateway realizes network interconnection above a network layer, is the most complex network interconnection equipment and is only used for interconnection of two networks with different high-level protocols. The gateway can be used for interconnection of both wide area networks and local area networks. A gateway is a computer system or device that acts as a switch-operative. The gateway is a translator used between two systems that differ in communication protocol, data format or language, or even in an entirely different architecture. Unlike the bridge which simply conveys information, the gateway repackages the received information to meet the needs of the destination system; the gateway device is used as a gateway of a network for coordinating network relationships of various devices, and has high working strength and more generated heat, however, the existing gateway device has limited heat dissipation performance, and the gateway can accumulate more heat after long-term operation, which causes overhigh heat of the gateway, even causes damage to elements and influences the service life of the devices.

Disclosure of Invention

In order to overcome the defects of the prior art, the invention aims to provide a multifunctional gateway which is novel in structure, convenient to disassemble and assemble, capable of providing good heat dissipation, effectively preventing electric elements from being damaged and prolonging the service life of equipment.

In order to achieve the purpose, the invention adopts the following technical scheme:

the invention provides a multifunctional gateway, which comprises a shell and a circuit board arranged in the shell, wherein an electric element and a plurality of data connectors are arranged on the circuit board, and the data connectors protrude out of the top surface of the shell; the shell comprises an upper shell and a lower shell which are matched with each other, a heat-conducting plate is fixedly arranged on the bottom surface of the upper shell, the heat-conducting plate plugs the bottom of the upper shell to form a closed cavity in the upper shell, and the circuit board is arranged in the closed cavity; the data connector penetrates through the top surface of the upper shell in a sealing mode; the top surface of the upper shell is provided with a mounting hole, an operation panel is mounted at the mounting hole, and the edge of the operation panel is connected with the mounting hole in a sealing manner; a plurality of through holes are formed in the circuit board at vacant positions outside the electric elements, a plurality of heat conduction columns are fixedly arranged on the top surface of the heat conduction plate corresponding to the through holes, and the heat conduction columns extend into the closed cavity through the through holes; the bottom surface of the heat conducting plate is provided with at least one semiconductor refrigerating piece, and the refrigerating surface of the semiconductor refrigerating piece is arranged close to the bottom surface of the heat conducting plate; the lower shell is provided with at least one exhaust fan blowing air outwards, and the exhaust fan is used for transferring heat emitted by the semiconductor refrigeration piece to the outside.

In a preferred technical scheme of the invention, a first supporting ring is fixedly arranged on the inner wall of the bottom of the upper shell, the first supporting ring is arranged along the contour of the inner wall of the upper shell, the circuit board is matched with the inner wall of the upper shell, the top surface of the circuit board is abutted against the bottom surface of the first supporting ring, the heat conducting plate is matched with the contour of the outer wall of the upper shell and seals the bottom of the upper shell, the top surface of the heat conducting plate is tightly attached to the bottom surface of the circuit board, and the circuit board and the heat conducting plate are fixed on the first supporting ring through screws.

In a preferred technical scheme of the invention, the inner wall of the lower shell is matched with the outer wall of the upper shell, a second support ring is fixedly arranged on the inner wall of the top of the lower shell, the second support ring is arranged along the contour of the inner wall of the lower shell, the bottom of the upper shell extends into the top of the lower shell, the side wall of the upper shell is fixed through a screw, and the bottom surface of the heat-conducting plate abuts against the top surface of the second support ring.

In a preferred technical scheme of the invention, a fan is installed in the closed cavity, and the fan is installed on the side wall of the upper shell and blows air towards the top surface of the circuit board.

In a preferred technical scheme of the invention, a plurality of radiating fins are fixedly arranged on the heating surface of the semiconductor chilling plate, and the radiating fins are distributed in a linear array along the length direction of the semiconductor chilling plate.

In a preferred technical scheme of the present invention, the heat sink is a copper or aluminum corrugated sheet structure, and a plurality of air holes are formed in the heat sink, and the air holes are uniformly distributed on the heat sink.

In a preferred technical scheme of the invention, the bottom of the lower shell is of a grid plate structure.

In a preferred technical scheme of the present invention, the number of the exhaust fans is 3, and the exhaust fans are all installed at the bottom of the lower casing, and exhaust air to the outside.

In a preferred technical scheme of the invention, the heat conducting plate and the heat conducting column are both made of graphene and are of an integral structure.

The invention has the beneficial effects that:

the invention provides a multifunctional gateway which is novel in structure, an upper shell and a lower shell are fixedly matched through screws, so that the multifunctional gateway is convenient to disassemble and assemble and is convenient for overhauling or replacing internal components; the design of the heat conducting plate can form a closed cavity with the inner part of the upper shell, thereby effectively preventing external dust from entering and preventing the dust from forming a power channeling condition between the electric elements; the heat conducting plate, the heat conducting column and the semiconductor refrigerating sheet are matched, so that heat in the closed cavity can be rapidly transferred and cooled; and the heat conducting plate is tightly attached to the circuit board, and the heat conducting columns penetrate through the circuit board, so that heat of the concentrated heating part can be transferred, good heat dissipation is provided, the electric elements are effectively prevented from being damaged, and the service life of the equipment is prolonged.

Drawings

Fig. 1 is a schematic internal structure diagram of a multifunctional gateway provided in an embodiment of the present invention.

In the figure:

100. a circuit board; 110. a control panel; 200. an upper housing; 210. a first support ring; 300. a lower housing; 310. a second support ring; 400. a heat conducting plate; 410. a heat-conducting column; 500. sealing the cavity; 600. a semiconductor refrigeration sheet; 610. a heat sink; 700. an exhaust fan; 800. a fan.

Detailed Description

The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.

As shown in fig. 1, the embodiment of the present invention discloses a multifunctional gateway, which includes a housing and a circuit board 100 disposed inside the housing, wherein an electrical component and a plurality of data connectors are mounted on the circuit board 100, and the data connectors protrude from a top surface of the housing; the housing comprises an upper shell 200 and a lower shell 300 which are matched with each other, a heat conducting plate 400 is fixedly mounted on the bottom surface of the upper shell 200, the heat conducting plate 400 seals the bottom of the upper shell 200 to form a closed cavity 500 in the upper shell 200, and the circuit board 100 is mounted in the closed cavity 500; the data connector is sealed through the top surface of the upper housing 100; a mounting hole is formed in the top surface of the upper shell 100, an operation panel 110 is mounted at the mounting hole, and the edge of the operation panel 110 is connected with the mounting hole in a sealing manner; a plurality of through holes are formed in the circuit board 100 at vacant positions outside the electric elements, a plurality of heat-conducting columns 410 are fixedly arranged on the top surface of the heat-conducting plate 400 corresponding to the through holes, and the heat-conducting columns 410 extend into the closed cavity 200 through the through holes; at least one semiconductor refrigerating sheet 600 is mounted on the bottom surface of the heat conducting plate 400, and the refrigerating surface of the semiconductor refrigerating sheet 600 is tightly attached to the bottom surface of the heat conducting plate 400; at least one exhaust fan 700 blowing air to the outside is installed on the lower case 300, and the exhaust fan 700 is used for transferring heat emitted from the semiconductor chilling plate 600 to the outside.

The multifunctional gateway is novel in structure, the upper shell 200 and the lower shell 300 are fixedly matched through screws, so that the multifunctional gateway is convenient to disassemble and assemble, and internal parts are convenient to overhaul or replace; the design of the heat conducting plate 400 can form a closed cavity 500 with the inside of the upper shell 200, which can effectively prevent external dust from entering and prevent the dust from forming a power-channeling situation between electrical elements; the heat conducting plate 400, the heat conducting columns 410 and the semiconductor refrigerating sheet 600 are matched with each other, so that heat in the closed cavity 500 can be rapidly transferred and cooled; the heat conducting plate 400 is tightly attached to the circuit board 100, and the heat conducting columns 410 penetrate through the circuit board 100, so that heat of the concentrated heating part can be transferred, good heat dissipation is provided, electric elements are effectively prevented from being damaged, and the service life of equipment is prolonged.

Further, a first support ring 210 is fixedly arranged on the inner wall of the bottom of the upper casing 200, the first support ring 210 is arranged along the contour of the inner wall of the upper casing 200, the circuit board 100 is adapted to the inner wall of the upper casing 200, the top surface of the circuit board 100 abuts against the bottom surface of the first support ring 210, the heat conducting plate 400 is adapted to the contour of the outer wall of the upper casing 200 and seals the bottom of the upper casing 200, the top surface of the heat conducting plate 400 is tightly attached to the bottom surface of the circuit board 100, and the circuit board 100 and the heat conducting plate 400 are fixed on the first support ring 210 through screws; this structural design can make things convenient for the installation of heat-conducting plate 400, circuit board 100, can make circuit board 100 centre gripping fix between heat-conducting plate 400 and first support ring 210, can prevent that circuit board 100 from taking place to rock or the pine takes off to can make heat-conducting plate 400 can carry out effective shutoff with the bottom of upper housing 200.

Further, the inner wall of the lower housing 300 is adapted to the outer wall of the upper housing 200, a second support ring 310 is fixedly arranged on the inner wall of the top of the lower housing 300, the second support ring 310 is arranged along the contour of the inner wall of the lower housing 300, the bottom of the upper housing 200 extends into the top of the lower housing 300, the side wall of the upper housing is fixed by screws, and the bottom surface of the heat conducting plate 400 abuts against the top surface of the second support ring 310; this structural design can make things convenient for the installation cooperation between upper casing 200 and the lower casing 300, the dismouting of being convenient for to accessible second support ring 310 realizes further centre gripping fixedly to heat-conducting plate 400.

Further, a fan 800 is installed in the closed cavity 500, and the fan 800 is installed on a side wall of the upper housing 200 and blows air towards the top surface of the circuit board 100; the fan 800 is designed to agitate the air inside the enclosed cavity 500, thereby allowing efficient heat transfer and dissipation, which further accelerates heat dissipation.

Further, a plurality of cooling fins 610 are fixedly arranged on the heating surface of the semiconductor chilling plate 600, and the cooling fins 610 are distributed in a linear array along the length direction of the semiconductor chilling plate 600; the heat sink 610 is a copper or aluminum corrugated sheet structure, and a plurality of air holes are formed in the heat sink 610 and are uniformly distributed on the heat sink 610; this structural design can carry out quick heat dissipation to the heat that produces in the semiconductor refrigeration piece 600 working process, guarantees semiconductor refrigeration piece 600's smooth work, prevents semiconductor refrigeration piece 600's damage.

Further, the bottom of the lower case 300 is of a grid plate structure; this structural design can guarantee the circulation of the inside gaseous of casing 300 down, the convenient heat dissipation.

Further, the number of the exhaust fans 700 is 3, and the exhaust fans 700 are all installed at the bottom of the lower case 300, and the exhaust fans 700 exhaust air to the outside, thereby performing effective heat dissipation.

Further, the heat-conducting plate 400 and the heat-conducting column 410 are made of graphene and are of an integral structure.

While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the invention. The present invention is not to be limited by the specific embodiments disclosed herein, and other embodiments that fall within the scope of the claims of the present application are intended to be within the scope of the present invention.

Claims

1. A multifunctional gateway comprises a shell and a circuit board (100) arranged in the shell, wherein an electric element and a plurality of data connectors are arranged on the circuit board (100), and the data connectors protrude out of the top surface of the shell; the method is characterized in that:

the shell comprises an upper shell (200) and a lower shell (300) which are matched with each other, a heat conducting plate (400) is fixedly installed on the bottom surface of the upper shell (200), the heat conducting plate (400) plugs the bottom of the upper shell (200) to enable the interior of the upper shell (200) to form a closed cavity (500), and the circuit board (100) is installed in the closed cavity (500); the data joint is sealed and penetrates through the top surface of the upper shell (100); the top surface of the upper shell (100) is provided with a mounting hole, an operation panel (110) is mounted at the mounting hole, and the edge of the operation panel (110) is connected with the mounting hole in a sealing manner;

a plurality of through holes are formed in the circuit board (100) at vacant positions outside the electric elements, a plurality of heat conducting columns (410) are fixedly arranged on the top surface of the heat conducting plate (400) corresponding to the through holes, and the heat conducting columns (410) extend into the closed cavity (200) through the through holes; at least one semiconductor refrigerating piece (600) is installed on the bottom surface of the heat conducting plate (400), and the refrigerating surface of the semiconductor refrigerating piece (600) is tightly attached to the bottom surface of the heat conducting plate (400); at least one exhaust fan (700) blowing outside is installed on the lower shell (300), and the exhaust fan (700) is used for transferring heat emitted by the semiconductor refrigeration piece (600) to the outside.

2. A multi-functional gateway as claimed in claim 1, wherein:

go up the fixed first support ring (210) that is equipped with of bottom inner wall of casing (200), first support ring (210) are followed the inner wall profile setting of last casing (200), circuit board (100) with the inner wall adaptation of going up casing (200), the top surface of circuit board (100) supports and holds the bottom surface of first support ring (210), heat-conducting plate (400) with the outer wall profile adaptation of last casing (200) and right the bottom of going up casing (200) forms the shutoff, the top surface of heat-conducting plate (400) is hugged closely the bottom surface of circuit board (100), circuit board (100) heat-conducting plate (400) are through the fix with screw in on first support ring (210).

3. A multi-functional gateway as claimed in claim 1, wherein:

the inner wall of lower casing (300) with the outer wall adaptation of last casing (200), the fixed second support ring (310) that is equipped with of top inner wall of lower casing (300), second support ring (310) are followed the inner wall profile setting of lower casing (300), the bottom of going up casing (200) stretches into the top of lower casing (300) and the lateral wall passes through the fix with screw, the bottom surface of heat-conducting plate (400) supports holds the top surface of second support ring (310).

4. A multi-functional gateway as claimed in claim 1, wherein:

a fan (800) is installed in the closed cavity (500), and the fan (800) is installed on the side wall of the upper shell (200) and blows air towards the top surface of the circuit board (100).

5. A multi-functional gateway as claimed in claim 1, wherein:

the heating surface of the semiconductor refrigerating plate (600) is fixedly provided with a plurality of radiating fins (610), and the radiating fins (610) are distributed in a linear array mode along the length direction of the semiconductor refrigerating plate (600).

6. The multifunction gateway of claim 5, wherein:

the radiating fin (610) is of a copper or aluminum wavy sheet structure, a plurality of air holes are formed in the radiating fin (610), and the air holes are uniformly distributed in the radiating fin (610).

7. A multi-functional gateway as claimed in claim 1, wherein:

the bottom of the lower shell (300) is of a grid plate structure.

8. A multi-functional gateway as claimed in claim 1, wherein:

the number of the exhaust fans (700) is 3, and the exhaust fans are all installed at the bottom of the lower shell (300), and the exhaust fans (700) exhaust air outwards.

9. A multi-functional gateway as claimed in claim 1, wherein:

the heat-conducting plate (400) and the heat-conducting columns (410) are both made of graphene and are of an integrated structure.