CN111988500B - 成像单元和成像装置 - Google Patents

成像单元和成像装置 Download PDF

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Publication number
CN111988500B
CN111988500B CN202010422946.2A CN202010422946A CN111988500B CN 111988500 B CN111988500 B CN 111988500B CN 202010422946 A CN202010422946 A CN 202010422946A CN 111988500 B CN111988500 B CN 111988500B
Authority
CN
China
Prior art keywords
circuit board
printed circuit
flexible printed
printed wiring
imaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202010422946.2A
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English (en)
Chinese (zh)
Other versions
CN111988500A (zh
Inventor
野口幸嗣
冈田有矢
长谷川光利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN111988500A publication Critical patent/CN111988500A/zh
Application granted granted Critical
Publication of CN111988500B publication Critical patent/CN111988500B/zh
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
    • H04N23/682—Vibration or motion blur correction
    • H04N23/685—Vibration or motion blur correction performed by mechanical compensation
    • H04N23/687—Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Studio Devices (AREA)
  • Adjustment Of Camera Lenses (AREA)
  • Combinations Of Printed Boards (AREA)
CN202010422946.2A 2019-05-22 2020-05-19 成像单元和成像装置 Active CN111988500B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-096334 2019-05-22
JP2019096334A JP7336261B2 (ja) 2019-05-22 2019-05-22 撮像ユニット及び撮像装置

Publications (2)

Publication Number Publication Date
CN111988500A CN111988500A (zh) 2020-11-24
CN111988500B true CN111988500B (zh) 2023-01-06

Family

ID=73441602

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010422946.2A Active CN111988500B (zh) 2019-05-22 2020-05-19 成像单元和成像装置

Country Status (3)

Country Link
US (1) US11317027B2 (https=)
JP (1) JP7336261B2 (https=)
CN (1) CN111988500B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020004975A1 (ko) * 2018-06-29 2020-01-02 엘지이노텍 주식회사 카메라 장치 및 광학기기
JP7406314B2 (ja) * 2019-06-24 2023-12-27 キヤノン株式会社 電子モジュール及び機器
DE102020203145B4 (de) * 2020-03-11 2023-02-09 Vitesco Technologies GmbH Leiterplattenanordnung
CN112788222B (zh) * 2021-02-07 2022-07-29 维沃移动通信有限公司 摄像模组及电子设备
JP7709298B2 (ja) * 2021-04-26 2025-07-16 キヤノン株式会社 フレキシブル配線板、モジュール、及び電子機器
CN117203582A (zh) * 2021-04-29 2023-12-08 三星电子株式会社 相机模块及包括相机模块的电子装置
JP7702334B2 (ja) * 2021-11-15 2025-07-03 ニデックインスツルメンツ株式会社 光学ユニット
US20250247973A1 (en) * 2024-01-31 2025-07-31 Rohde & Schwarz Gmbh & Co. Kg Microwave device for high frequency application

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005065014A (ja) * 2003-08-18 2005-03-10 Canon Inc 撮像装置
CN1778101A (zh) * 2003-04-22 2006-05-24 柯尼卡美能达精密光学株式会社 成像装置和安装该成像装置的便携式终端设备
JP2008140632A (ja) * 2006-11-30 2008-06-19 Toshiba Design & Manufacturing Service Corp Ｅｌ光源ユニット、イメージセンサおよびイメージセンサを有する画像形成装置
CN101601282A (zh) * 2007-12-03 2009-12-09 索尼株式会社 相机模块和摄像装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0738268A (ja) 1993-07-23 1995-02-07 Canon Inc フレキユニットの筐体組付構造
JP2002134860A (ja) 2000-10-23 2002-05-10 Matsushita Electric Ind Co Ltd フレキシブルプリント配線板
KR100609012B1 (ko) * 2004-02-11 2006-08-03 삼성전자주식회사 배선기판 및 이를 이용한 고체 촬상용 반도체 장치
JP2006081006A (ja) 2004-09-10 2006-03-23 Konica Minolta Photo Imaging Inc 振れ補正機構付きカメラ
JP2007147719A (ja) 2005-11-24 2007-06-14 Casio Comput Co Ltd 接続ユニット及び接続ユニットを用いたカメラ
JP5380849B2 (ja) 2008-02-07 2014-01-08 船井電機株式会社 撮像装置
KR101422954B1 (ko) * 2012-12-18 2014-07-23 삼성전기주식회사 카메라 모듈

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1778101A (zh) * 2003-04-22 2006-05-24 柯尼卡美能达精密光学株式会社 成像装置和安装该成像装置的便携式终端设备
JP2005065014A (ja) * 2003-08-18 2005-03-10 Canon Inc 撮像装置
JP2008140632A (ja) * 2006-11-30 2008-06-19 Toshiba Design & Manufacturing Service Corp Ｅｌ光源ユニット、イメージセンサおよびイメージセンサを有する画像形成装置
CN101601282A (zh) * 2007-12-03 2009-12-09 索尼株式会社 相机模块和摄像装置

Also Published As

Publication number Publication date
JP7336261B2 (ja) 2023-08-31
CN111988500A (zh) 2020-11-24
JP2020191565A (ja) 2020-11-26
US11317027B2 (en) 2022-04-26
US20200374462A1 (en) 2020-11-26

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