CN111978785A - 一种fpc用感光阻焊油墨及其制备方法和应用 - Google Patents
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Abstract
本发明属于油墨技术领域。一种FPC用感光阻焊油墨，包括以下按质量份数计算的组分：感光树脂35‑60份、柔性树脂5‑15份、活性稀释剂5‑10份、光引发剂5‑10份、填料0.1‑10份、颜料0.1‑10份、助剂0.1‑5份、有机溶剂10‑40份；其中，所述感光树脂包括质量比为1:3‑5的碱溶性光敏树脂和聚氨酯丙烯酸酯，所述柔性树脂为二醇或二酸改性的双酚A型环氧树脂。本发明油墨固化速度快，成膜性好，固化后漆膜硬度高，基材附着力好，具有良好的力学性能和耐抗性能，可用于柔性印刷线路板。
Description
技术领域
本发明属于油墨技术领域，具体涉及一种FPC用感光阻焊油墨及其制备方法和应用。
背景技术
阻焊油墨作为FPC制作的主要原材料之一，主要用于使电路免受蚀刻、氧化、擦伤，避免在焊锡过程中造成电路短路、断路，起到绝缘保护作用。因此，阻焊油墨必须具备优异的感光性、显影性、耐热性、低侧蚀性、高分辨率等性能才能满足FPC的制作工艺。目前传统的阻焊油墨往往存在着脆性大、分辨率低、侧蚀严重等问题，限制了阻焊油墨的应用范围。阻焊油墨性能主要取决于基体树脂的结构与性能，目前传统阻焊油墨用树脂主要是由酚醛环氧树脂分别 与丙酸、酸酐反应得到的碱溶性感光树脂，由于其交联密度高，使得固化材料性脆。目前传统的阻焊油墨多是针对硬板PCB开发，要求涂膜具备良好的硬度、附着力、耐抗性能，但并未对阻焊油墨的柔韧性做出要求，所得固化膜一般硬度大、脆性大、柔韧性差，无法适应FPC动态挠性上的应用。
发明内容
本发明所要解决的技术问题是提供一种FPC用感光阻焊油墨，该油墨固化速度快，成膜性好，固化后漆膜硬度高，基材附着力好，具有良好的力学性能和耐抗性能，可用于柔性印刷线路板。
本发明的技术方案如下：
一种FPC用感光阻焊油墨，包括以下按质量份数计算的组分：感光树脂35-60份、柔性树脂5-15份、活性稀释剂5-10份、光引发剂5-10份、填料0.1-10份、颜料0.1-10份、助剂0.1-5份、有机溶剂10-40份；其中，所述感光树脂包括质量比为1:3-5的碱溶性光敏树脂和聚氨酯丙烯酸酯，所述柔性树脂为二醇或二酸改性的双酚A型环氧树脂。
进一步的，所述碱溶性光敏树脂为叔碳酸缩水甘油酯改性碱溶性酚醛环氧丙烯酸树脂。改性碱溶性酚醛环氧丙烯酸树脂在分子侧链引入叔碳酸缩水甘油酯的支化脂肪链，可提高漆膜的硬度、柔韧性、耐热性和耐化学品性能。
进一步的，所述聚氨酯丙烯酸酯为六官能度脂肪族聚氨酯丙烯酸酯和三官能度脂肪族聚氨酯丙酸酯。二者搭配可提高漆膜的硬度、柔韧性和耐腐蚀性。
进一步的，所述二醇包括聚乙二醇、二缩三乙二醇，所述二酸包括丙二酸、丁二酸、己二酸、葵二酸。选用的二醇或二酸碳链长度适宜，改善树脂柔韧性的同时可保证树脂耐温性能良好。
进一步的，所述活性稀释剂为丙氧化甘油三丙烯酸酯、新戊二醇丙氧基(2)甲氧基醚单丙烯酸酯和2-羟乙基甲基丙烯酸酯磷酸酯。双官能度单体和三官能度单体协同，固化速度快，交联密度高，可提高漆膜的硬度、附着力和耐抗性能，稀释性好，不影响漆膜柔韧性。搭配磷酸酯功能单体提提高漆膜的附着力、柔韧性和耐水性，同时可提高填料和颜料在体系中的分散稳定性。
进一步的，所述光引发剂为2-羟基-2-甲基苯基丙酮、偶氮二异丁腈和苯基双(2,4,6-三甲基苯甲酰基)氧化膦。三种不同类型的光引发剂协同，有效提高了漆膜的固化速度和成膜性能，漆膜表里固化速度接近，漆膜可充分固化，保证了漆膜性能的稳定。
进一步的，所述填料为钛白粉、滑石粉和硫酸钡。滑石粉可在油墨中起骨架作用，可提高漆膜硬度，配合硫酸钡，赋予了漆膜良好的耐磨性、耐老化性、耐热性和耐化学品性能，钛白粉的加入，改善了漆膜的平整度和光泽度，同时进一步提高了漆膜的硬度和力学性能。
进一步的，所述助剂包括流平剂、分散剂、消泡剂、附着力促进剂、抗氧化剂。
一种所述的FPC用感光阻焊油墨的制备方法，包括以下步骤：将感光树脂、活性稀释剂、助剂、填料和颜料混合后，转速1000-1300r/min搅拌15-30min，得到混合物A；将柔性树脂、光引发剂和有机溶剂混合后，转速800-1000r/min搅拌15-30min，得到混合物B；将所述混合物A和混合物B混合均匀后分散至细度≤8μm即可。
一种所述的FPC用感光阻焊油墨在柔性印刷线路板上的应用。
本发明具有如下有益效果：
本发明选用碱溶性光敏树脂和聚氨酯丙烯酸酯作为光感树脂，可使涂料成膜后的漆膜具有良好的力学性能和耐抗性能，漆膜硬度高，附着力好。以二醇或二酸改性的双酚A型环氧树脂作为柔性树脂，在提高漆膜柔韧性的同时不影响漆膜的耐抗性能。搭配活性稀释剂和光引发剂，赋予了漆膜良好的成膜性能，固化速度快，固化均匀充分，保证了漆膜性能稳定。
具体实施方式
下面结合实施例对本发明进行详细的说明，实施例仅是本发明的优选实施方式，不是对本发明的限定。
实施例1
一种FPC用感光阻焊油墨，包括以下按质量份数计算的组分：的叔碳酸缩水甘油酯改性碱溶性酚醛环氧丙烯酸树脂7份、六官能度脂肪族聚氨酯丙烯酸酯15份、三官能度脂肪族聚氨酯丙酸酯13份、聚乙二醇改性双酚A型环氧树脂5份、丙氧化甘油三丙烯酸酯2份、新戊二醇丙氧基(2)甲氧基醚单丙烯酸酯2份、2-羟乙基甲基丙烯酸酯磷酸酯1份、2-羟基-2-甲基苯基丙酮2份、偶氮二异丁腈2份、苯基双(2,4,6-三甲基苯甲酰基)氧化膦1份、钛白粉1.5份、滑石粉0.5份、硫酸钡1份、颜料1份、流平剂0.5份、消泡剂0.5份、丙酮10份。
实施例2
一种FPC用感光阻焊油墨，包括以下按质量份数计算的组分：叔碳酸缩水甘油酯改性碱溶性酚醛环氧丙烯酸树脂9份、六官能度脂肪族聚氨酯丙烯酸酯16份、三官能度脂肪族聚氨酯丙酸酯20份、丙二酸改性双酚A型环氧树脂10份、丙氧化甘油三丙烯酸酯2份、新戊二醇丙氧基(2)甲氧基醚单丙烯酸酯2份、2-羟乙基甲基丙烯酸酯磷酸3份、2-羟基-2-甲基苯基丙酮2份、偶氮二异丁腈3份、苯基双(2,4,6-三甲基苯甲酰基)氧化膦2份、钛白粉、滑石粉和硫酸钡0.1-1份、颜料0.1-10份、流平剂、消泡剂0.1-5份、丙酮10-40份。
实施例3
一种FPC用感光阻焊油墨，包括以下按质量份数计算的组分：叔碳酸缩水甘油酯改性碱溶性酚醛环氧丙烯酸树脂10份、六官能度脂肪族聚氨酯丙烯酸酯25份、三官能度脂肪族聚氨酯丙酸酯25份、二缩三乙二醇改性双酚A型环氧树脂15份、丙氧化甘油三丙烯酸酯5份、新戊二醇丙氧基(2)甲氧基醚单丙烯酸酯3份、2-羟乙基甲基丙烯酸酯磷酸酯2份、2-羟基-2-甲基苯基丙酮4份、偶氮二异丁腈4份、苯基双(2,4,6-三甲基苯甲酰基)氧化膦2份、钛白粉6份、滑石粉2份、硫酸钡2份、颜料5份、流平剂2份、消泡剂3份、丙酮40份。
对比例1
对比例1与实施例1的区别在于：将聚乙二醇改性双酚A型环氧树脂替换为双酚A型环氧树脂。
对比例2
对比例2与实施例1的区别在于：所用活性稀释剂为丙氧化甘油三丙烯酸酯2.5份、新戊二醇丙氧基(2)甲氧基醚单丙烯酸酯2.5份。
对比例3
对比例3与实施例1的区别在于：所用光引发剂为2-羟基-2-甲基苯基丙酮3份、苯基双(2,4,6-三甲基苯甲酰基)氧化膦2份。
一种所述的FPC用感光阻焊油墨的制备方法，包括以下步骤：将感光树脂、活性稀释剂、助剂、填料和颜料混合后，转速1000-1300r/min搅拌15-30min，得到混合物A；将柔性树脂、光引发剂和有机溶剂混合后，转速800-1000r/min搅拌15-30min，得到混合物B；将所述混合物A和混合物B混合均匀后分散至细度≤8μm即可。
一种所述的FPC用感光阻焊油墨在柔性印刷线路板上的应用，方法为：将感光阻焊油墨印刷于FPC上，80℃烘15-20min，经波长为365nm的UV光照固化，照射距离20cm，135℃固化30min即可。
测试本发明FPC用感光阻焊油墨实施例和对比例的各项性能：
1.硬度：GB/T6739-1996；
2.附着力：GB/T1720 划圈法；
3.表干时间：涂抹于玻璃板上，涂膜于玻璃板上，在85℃恒温炉中预烘，记录开始到墨膜表面干燥所需时间，指触法测定；
4.耐酸碱及有机溶剂性：在室温条件下，将固化后的墨膜于10％H2SO4和10％NaOH以及三氯乙烯溶剂中浸泡30min，而后观察墨膜变化情况；
5.耐弯折性：对表面涂覆阻焊油墨固化后的FPC弯折5000次后，观察其上墨膜层的变化情况；
测试结果见下表：
| 测试项目 | 实施例1 | 实施例2 | 实施例3 | 对比例1 | 对比例2 | 对比例3 |
| 附着力 | 1级 | 1级 | 1级 | 2级 | 2级 | 1级 |
| 硬度 | 5H | 5H | 5H | 4H | 5H | 5H |
| 表干时间 | 20 | 21 | 23 | 30 | 24 | 22 |
| 耐酸性 | 漆膜无变化 | 漆膜无变化 | 漆膜无变化 | 漆膜无变化 | 漆膜无变化 | 漆膜无变化 |
| 耐碱性 | 漆膜无变化 | 漆膜无变化 | 漆膜无变化 | 漆膜无变化 | 漆膜无变化 | 漆膜无变化 |
| 耐三氯乙烯腐蚀性 | 漆膜无变化 | 漆膜无变化 | 漆膜无变化 | 漆膜无变化 | 漆膜无变化 | 漆膜无变化 |
| 耐弯折性 | 漆膜无变化 | 漆膜无变化 | 漆膜无变化 | 漆膜轻微开裂 | 漆膜无变化 | 漆膜无变化 |
可见，本发明阻焊油墨漆膜附着力好，硬度高，固化速度快，耐化学品性能优异，柔韧性好，可耐弯折。
本发明FPC用感光阻焊油墨固化速度快，成膜性好，固化后漆膜硬度高，基材附着力好，具有良好的力学性能和耐抗性能，可用于柔性印刷线路板。
Claims (10)
1.一种FPC用感光阻焊油墨，其特征在于，包括以下按质量份数计算的组分：感光树脂35-60份、柔性树脂5-15份、活性稀释剂5-10份、光引发剂5-10份、填料0.1-10份、颜料0.1-10份、助剂0.1-5份、有机溶剂10-40份；其中，所述感光树脂包括质量比为1:3-5的碱溶性光敏树脂和聚氨酯丙烯酸酯，所述柔性树脂为二醇或二酸改性的双酚A型环氧树脂。
2.根据权利要求1所述的FPC用感光阻焊油墨，其特征在于，所述碱溶性光敏树脂为叔碳酸缩水甘油酯改性碱溶性酚醛环氧丙烯酸树脂。
3.根据权利要求1所述的FPC用感光阻焊油墨，其特征在于，所述聚氨酯丙烯酸酯为六官能度脂肪族聚氨酯丙烯酸酯和三官能度脂肪族聚氨酯丙酸酯。
4.根据权利要求1所述的FPC用感光阻焊油墨，其特征在于，所述二醇包括聚乙二醇、二缩三乙二醇，所述二酸包括丙二酸、丁二酸、己二酸、葵二酸。
5.根据权利要求1所述的FPC用感光阻焊油墨，其特征在于，所述活性稀释剂为丙氧化甘油三丙烯酸酯、新戊二醇丙氧基(2)甲氧基醚单丙烯酸酯和2-羟乙基甲基丙烯酸酯磷酸酯。
6.根据权利要求1所述的FPC用感光阻焊油墨，其特征在于，所述光引发剂为2-羟基-2-甲基苯基丙酮、偶氮二异丁腈和苯基双(2,4,6-三甲基苯甲酰基)氧化膦。
7.根据权利要求1所述的FPC用感光阻焊油墨，其特征在于，所述填料为钛白粉、滑石粉和硫酸钡。
8.根据权利要求1所述的FPC用感光阻焊油墨，其特征在于，所述助剂包括流平剂、分散剂、消泡剂、附着力促进剂、抗氧化剂。
9.一种权利要求1-8任一项所述的FPC用感光阻焊油墨的制备方法，其特征在于，包括以下步骤：将感光树脂、活性稀释剂、助剂、填料和颜料混合后，转速1000-1300r/min搅拌15-30min，得到混合物A；将柔性树脂、光引发剂和有机溶剂混合后，转速800-1000r/min搅拌15-30min，得到混合物B；将所述混合物A和混合物B混合均匀后分散至细度≤8μm即可。
10.一种权利要求1-8任一项所述的FPC用感光阻焊油墨在柔性印刷线路板上的应用。
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112867280A (zh) * | 2021-02-26 | 2021-05-28 | 浙江柳市线路板有限公司 | 一种双面线路板的阻焊工艺 |
| CN115160882A (zh) * | 2022-06-17 | 2022-10-11 | 广东希贵光固化材料有限公司 | Hpe盖板用uv涂料 |
| CN115322690A (zh) * | 2022-09-20 | 2022-11-11 | 深圳市金泰科环保线缆有限公司 | 一种用于拖链粘并线的tpu胶水、拖链粘并线及其制作方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101134806A (zh) * | 2007-09-18 | 2008-03-05 | 天津大学 | 水性环氧树脂固化剂的制备方法 |
| CN104710871A (zh) * | 2014-05-28 | 2015-06-17 | 广东丹邦科技有限公司 | Fpc用碱显影感光阻焊油墨、制备方法、用途及产品 |
-
2020
- 2020-09-24 CN CN202011015563.XA patent/CN111978785A/zh active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101134806A (zh) * | 2007-09-18 | 2008-03-05 | 天津大学 | 水性环氧树脂固化剂的制备方法 |
| CN104710871A (zh) * | 2014-05-28 | 2015-06-17 | 广东丹邦科技有限公司 | Fpc用碱显影感光阻焊油墨、制备方法、用途及产品 |
Non-Patent Citations (2)
| Title |
|---|
| （日）大森英三著: "《功能性丙烯酸树脂》", 31 December 1993, 化学工业出版社 * |
| 曾晓鹰等: "《电子束固化涂料及应用》", 31 December 2014, 天津大学出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112867280A (zh) * | 2021-02-26 | 2021-05-28 | 浙江柳市线路板有限公司 | 一种双面线路板的阻焊工艺 |
| CN115160882A (zh) * | 2022-06-17 | 2022-10-11 | 广东希贵光固化材料有限公司 | Hpe盖板用uv涂料 |
| CN115322690A (zh) * | 2022-09-20 | 2022-11-11 | 深圳市金泰科环保线缆有限公司 | 一种用于拖链粘并线的tpu胶水、拖链粘并线及其制作方法 |
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