CN111975532B - Monocrystalline silicon wafer chamfering equipment with aligning device - Google Patents

Monocrystalline silicon wafer chamfering equipment with aligning device Download PDF

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Publication number
CN111975532B
CN111975532B CN202010863537.6A CN202010863537A CN111975532B CN 111975532 B CN111975532 B CN 111975532B CN 202010863537 A CN202010863537 A CN 202010863537A CN 111975532 B CN111975532 B CN 111975532B
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lower chassis
aligning
monocrystalline silicon
rotating shaft
disc
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CN202010863537.6A
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CN111975532A (en
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魏运秀
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Ye Yiqing
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition

Abstract

The invention discloses monocrystalline silicon wafer chamfering equipment with a centering device, which comprises a lower rotating shaft and a lower base plate on the chamfering equipment, wherein the lower rotating shaft is hinged on the lower base plate through a bearing, and the upper end of the lower rotating shaft is exposed out of the upper end surface of the lower base plate; the outer ring of the lower chassis is formed with a water retaining ring, the front end of the water retaining ring is formed with a cutter inlet, the upper end surface of the lower chassis is formed with a plurality of arc-shaped adjusting grooves, the adjusting grooves are uniformly distributed in an annular shape around the central axis of the lower rotating shaft, guide wheels are inserted into the adjusting grooves of the lower chassis, and vertical limiting stop levers are inserted and fixed on the guide wheels; the lower rotating shaft is sleeved with an aligning disc in an inserting mode, a plurality of guide grooves which are dispersed by the center of the aligning disc are formed in the aligning disc and abut against the lower chassis, and the upper end of the limiting stop lever penetrates through the guide grooves of the aligning disc and is sleeved with the fixed limiting stop ring.

Description

Monocrystalline silicon wafer chamfering equipment with aligning device
Technical Field
The invention relates to the technical field of monocrystalline silicon wafer production equipment, in particular to monocrystalline silicon wafer chamfering equipment with a centering device.
Background
At present, a semiconductor is generally referred to as a silicon wafer, and a finished product after the silicon wafer is processed and produced is generally referred to as a round wafer. The silicon wafer is from quartz sand, and the production process of the monocrystalline silicon wafer comprises single crystal pulling, outer ring grinding, slicing, annealing, chamfering, grinding or lapping and CMP. Chamfering is needed to be carried out on the monocrystalline silicon wafer: and polishing the annealed silicon wafer into an arc shape to prevent the edge of the silicon wafer from cracking and the generation of lattice defects and increase the flatness of the epitaxial layer and the photoresist layer. In the chamfering process, the existing chamfering equipment is provided with a positioning ferrule with fixed size to realize the centering of the monocrystalline silicon wafer; however, when the monocrystalline silicon wafers with different specifications are replaced, different positioning ferrules need to be replaced, and after the positioning ferrules are replaced, the replaced positioning ferrules need to be subjected to aligning installation, so that installation is troublesome.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides monocrystalline silicon wafer chamfering equipment with a centering device, which adopts the centering device with variable diameter to replace a positioning ferrule with fixed size, does not need to replace the positioning ferrule when replacing monocrystalline silicon wafers with different models and specifications, and is convenient for centering the monocrystalline silicon wafers.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a monocrystalline silicon piece chamfering device with a centering device comprises a lower rotating shaft and a lower base plate on the chamfering device, wherein the lower rotating shaft is hinged to the lower base plate through a bearing, and the upper end of the lower rotating shaft is exposed out of the upper end face of the lower base plate; the outer ring of the lower chassis is formed with a water retaining ring, the front end of the water retaining ring is formed with a cutter inlet, the upper end surface of the lower chassis is formed with a plurality of arc-shaped adjusting grooves, the adjusting grooves are uniformly distributed in an annular shape around the central axis of the lower chassis, guide wheels are inserted into the adjusting grooves of the lower chassis, and vertical limiting stop levers are inserted and fixed on the guide wheels; the lower rotating shaft is inserted and sleeved with an aligning disc, a plurality of guide grooves which are dispersed by the center of the aligning disc are formed on the aligning disc and abut against the lower chassis, and the guide grooves are uniformly distributed in an annular shape around the central axis of the aligning disc; the upper end of the limit stop lever penetrates through a guide groove insert sleeve of the center adjusting disc to fix the limit stop ring;
a driving plate is fixed on the outer ring of the centering plate, an L-shaped shifting plate is formed on the driving plate, a vertical fulcrum shaft is fixedly inserted into a water retaining ring extending out of the lower chassis at the outer end of the shifting plate, and a roller is inserted and sleeved on the shifting plate exposed out of the upper end of the fulcrum shaft; an ear seat is fixed on the outer wall of the lower chassis at one side of the poking plate, a support column is fixedly inserted on the lower end face of the ear seat, and two ends of a tension spring are respectively fixed on the support column and the support shaft; the upper end face of the lug seat is fixedly provided with a motor, a rotating shaft of the motor is fixedly provided with a cam in an inserting sleeve mode, and the roller abuts against the outer wall of the cam.
Preferably, the central axes of the lower chassis and the centering disc are coincident, and the diameter of the centering disc is smaller than that of the inner wall of the water retaining ring.
Preferably, the upper end face of the lower chassis is lower than the upper end face of the water retaining ring, and the upper end face of the limiting stop lever is higher than the upper end face of the lower chassis.
Preferably, the limiting stop lever is a round rod, and a roller sleeve is inserted and sleeved on the limiting stop lever on the upper side of the limiting check ring.
Preferably, the number of the guide grooves on the aligning disc is equal to that of the adjusting grooves on the lower chassis, and at least three adjusting grooves are formed in the lower chassis.
Preferably, the center distance from the limit stop lever adjacent to the cam is larger than the maximum center distance from the outer wall of the cam to the center of the cam.
Preferably, the water inlet edge and the driving plate on the water retaining ring are distributed on two sides of the lower rotating shaft.
Preferably, the diameter of the guide wheel is equal to the groove width of the adjusting groove on the lower chassis, and the diameter of the limiting stop rod is equal to the groove width of the guide groove on the adjusting disc.
The invention has the beneficial effects that: the centering device with variable diameter is adopted to replace a positioning ferrule with a fixed size, the positioning ferrule does not need to be replaced when monocrystalline silicon wafers with different models and specifications are replaced, and meanwhile, the centering of the monocrystalline silicon wafers is facilitated.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic top view of the present invention;
FIG. 3 is a front view of the present invention;
fig. 4 is a schematic sectional view at a-a in fig. 3.
In the figure: 1. a lower rotating shaft; 2. a support plate; 21. a water retaining ring; 22. a knife inlet; 23. adjusting the groove; 3. a guide wheel; 4. a limit stop lever; 5. a limit retainer ring; 6. an alignment plate; 61. a guide groove; 7. a drive plate; 71. a poking plate; 8. a fulcrum; 9. a roller; 10. an ear mount; 11. a pillar; 12. a tension spring; 13. a motor; 14. a cam; 15. and (4) a roller sleeve.
Detailed Description
Example (b): as shown in fig. 1 to 4, the monocrystalline silicon wafer chamfering equipment with the aligning device comprises a lower rotating shaft 1 and a lower chassis 2 on the chamfering equipment, wherein the lower rotating shaft 1 is hinged on the lower chassis 2 through a bearing, and the upper end of the lower rotating shaft 1 is exposed out of the upper end surface of the lower chassis 2; a water retaining ring 21 is formed on the outer ring of the lower chassis 2, a feed opening 22 is formed at the front end of the water retaining ring 21, a plurality of arc-shaped adjusting grooves 23 are formed on the upper end surface of the lower chassis 2, the adjusting grooves 23 are uniformly distributed in an annular shape around the central axis of the lower chassis 2, guide wheels 3 are inserted into the adjusting grooves 23 of the lower chassis 2, and vertical limiting stop rods 4 are inserted and fixed on the guide wheels 3; an aligning disk 6 is inserted and sleeved on the lower rotating shaft 1, a plurality of guide grooves 61 which are diverged by the center of the aligning disk 6 are formed on the aligning disk 6 and are abutted against the lower chassis 2, and the guide grooves 61 are uniformly distributed in an annular shape around the central axis of the aligning disk 6; the upper end of the limit stop lever 4 penetrates through a guide groove 61 of the center adjusting disc 6 and is inserted and sleeved with a fixed limit stop ring 5;
a driving plate 7 is fixed on the outer ring of the centering plate 6, an L-shaped shifting plate 71 is formed on the driving plate 7, a vertical fulcrum shaft 8 is fixedly inserted and connected with the outer end of the shifting plate 71 extending out of the water retaining ring 21 of the lower chassis 2, and a roller 9 is inserted and connected with the upper end of the fulcrum shaft 8 exposed out of the shifting plate 71; an ear seat 10 is fixed on the outer wall of the lower chassis 2 at one side of the poking plate 71, a support column 11 is fixedly inserted on the lower end face of the ear seat 10, and two ends of a tension spring 12 are respectively fixed on the support column 11 and the fulcrum shaft 8; a motor 13 is fixed on the upper end surface of the ear seat 10, a cam 14 is fixed on a rotating shaft of the motor 13 in an inserting and sleeving manner, and the roller 9 abuts against the outer wall of the cam 14.
The central axes of the lower chassis 2 and the aligning disc 6 are coincident, and the diameter of the aligning disc 6 is smaller than that of the inner wall of the water retaining ring 21.
The upper end surface of the lower chassis 2 is lower than the upper end surface of the water retaining ring 21, and the upper end surface of the limiting stop lever 4 is higher than the upper end surface of the lower chassis 2.
The limiting stop lever 4 adopts a round rod, and a roller sleeve 15 is inserted and sleeved on the limiting stop lever 4 on the upper side of the limiting check ring 5.
The number of the guide grooves 61 on the aligning disc 6 is equal to the number of the adjusting grooves 23 on the lower chassis 2, and at least three adjusting grooves 23 on the lower chassis 2 are arranged.
The center distance from the limit stop lever 4 adjacent to the cam 14 is larger than the maximum center distance from the outer wall of the cam 14 to the center of the cam 14.
The water inlet blade 22 and the driving plate 7 on the water retaining ring 21 are distributed on two sides of the lower rotating shaft 1.
The diameter of the guide wheel 3 is equal to the groove width of the adjusting groove 23 on the lower chassis 2, and the diameter of the limiting stop lever 4 is equal to the groove width of the guide groove 61 on the aligning disc 6.
The working principle is as follows: the invention relates to monocrystalline silicon wafer chamfering equipment with a centering device, which has the technical points that the centering device is modified, the centering device has good universality, and the centering of monocrystalline silicon wafers with various specifications can be met;
during centering, a monocrystalline silicon piece is placed on the lower rotating shaft 1, then the motor 14 is started, the cam 13 is used for stirring the stirring plate 71, so that the centering disc 6 rotates, the guide groove 61 on the centering disc 6 can drive the limiting stop rod 4 to move along the adjusting groove 23 on the lower base disc 2, and therefore the limiting stop rod 4 moves towards the central axis of the lower rotating shaft 1 and pushes the monocrystalline silicon piece, and the monocrystalline silicon piece is coincided with the centering disc 6; the monocrystalline silicon pieces with different specifications can be matched with the cams with different specifications, when the monocrystalline silicon pieces are replaced, the cams can be replaced, and the cams are convenient to install and detach.
The examples are intended to illustrate the invention, but not to limit it. The described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the present invention, and therefore, the scope of the appended claims should be accorded the full scope of the invention as set forth in the appended claims.

Claims (8)

1. A monocrystalline silicon piece chamfering device with a centering device comprises a lower rotating shaft (1) and a lower chassis (2) on the chamfering device, wherein the lower rotating shaft (1) is hinged to the lower chassis (2) through a bearing, and the upper end of the lower rotating shaft (1) is exposed out of the upper end face of the lower chassis (2); the outer lane shaping of lower chassis (2) has manger plate circle (21), and the front end shaping of manger plate circle (21) has into edge of a knife (22), its characterized in that: a plurality of arc-shaped adjusting grooves (23) are formed in the upper end face of the lower chassis (2), the adjusting grooves (23) are uniformly distributed in an annular shape around the central axis of the lower chassis (2), guide wheels (3) are inserted into the adjusting grooves (23) of the lower chassis (2), and vertical limiting stop rods (4) are inserted and fixed on the guide wheels (3); an aligning disc (6) is inserted and sleeved on the lower rotating shaft (1), a plurality of guide grooves (61) which are dispersed by the center of the aligning disc (6) are formed on the aligning disc (6) and abut against the lower chassis (2), and the guide grooves (61) are uniformly distributed in an annular shape around the central axis of the aligning disc (6); the upper end of the limit stop lever (4) penetrates through a guide groove (61) of the center adjusting disc (6) and is inserted and sleeved with a fixed limit stop ring (5);
a driving plate (7) is fixed on the outer ring of the centering plate (6), an L-shaped shifting plate (71) is formed on the driving plate (7), a vertical fulcrum shaft (8) is fixedly inserted into a water retaining ring (21) of the lower chassis (2) and extends out of the outer end of the shifting plate (71), and a roller (9) is inserted into the upper end of the fulcrum shaft (8) to be exposed out of the shifting plate (71); an ear seat (10) is fixed on the outer wall of the lower chassis (2) at one side of the poking plate (71), a support column (11) is fixedly inserted on the lower end face of the ear seat (10), and two ends of a tension spring (12) are respectively fixed on the support column (11) and the support shaft (8); a motor (13) is fixed on the upper end surface of the ear seat (10), a cam (14) is fixed on a rotating shaft of the motor (13) in an inserting and sleeving manner, and the roller (9) abuts against the outer wall of the cam (14).
2. The monocrystalline silicon wafer chamfering device with the aligning device according to claim 1, wherein: the central axes of the lower chassis (2) and the aligning disc (6) are overlapped, and the diameter of the aligning disc (6) is smaller than that of the inner wall of the water retaining ring (21).
3. The monocrystalline silicon wafer chamfering device with the aligning device according to claim 1, wherein: the upper end face of the lower chassis (2) is lower than the upper end face of the water retaining ring (21), and the upper end face of the limiting stop lever (4) is higher than the upper end face of the lower chassis (2).
4. The monocrystalline silicon wafer chamfering device with the aligning device according to claim 3, wherein: the limiting stop lever (4) adopts a round rod, and a roller sleeve (15) is inserted and sleeved on the limiting stop lever (4) on the upper side of the limiting check ring (5).
5. The monocrystalline silicon wafer chamfering device with the aligning device according to claim 1, wherein: the number of the guide grooves (61) on the aligning disc (6) is equal to that of the adjusting grooves (23) on the lower chassis (2), and at least three adjusting grooves (23) on the lower chassis (2) are arranged.
6. The monocrystalline silicon wafer chamfering device with the aligning device according to claim 1, wherein: the center distance from the limiting stop lever (4) adjacent to the cam (14) is larger than the maximum center distance from the outer wall of the cam (14) to the center of the cam (14).
7. The monocrystalline silicon wafer chamfering device with the aligning device according to claim 1, wherein: the water inlet (22) on the water retaining ring (21) and the driving plate (7) are distributed on two sides of the lower rotating shaft (1).
8. The monocrystalline silicon wafer chamfering device with the aligning device according to claim 4, wherein: the diameter of the guide wheel (3) is equal to the groove width of the adjusting groove (23) on the lower chassis (2), and the diameter of the limiting stop lever (4) is equal to the groove width of the guide groove (61) on the centering disc (6).
CN202010863537.6A 2020-08-25 2020-08-25 Monocrystalline silicon wafer chamfering equipment with aligning device Active CN111975532B (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69200745T2 (en) * 1991-06-12 1995-07-13 Shinetsu Handotai Kk Device for chamfering the notch of a plate.
CN101704218A (en) * 2009-12-14 2010-05-12 中国电子科技集团公司第四十五研究所 Silicon slice positioning and loading device of chemical mechanical polishing equipment
CN205325366U (en) * 2016-01-22 2016-06-22 浙江好亚能源股份有限公司 Silicon wafer stick chamfering apparatus
CN207810610U (en) * 2017-12-14 2018-09-04 鸿准精密模具(昆山)有限公司 Alignment positioning device
CN208601731U (en) * 2018-07-24 2019-03-15 洛阳市鼎晶电子材料有限公司 A kind of silicon wafer asymmetry facing attachment
CN209273123U (en) * 2018-11-09 2019-08-20 盐城盈信通科技有限公司 A kind of power electronic devices chip research and development wafer chamfer auxiliary device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69200745T2 (en) * 1991-06-12 1995-07-13 Shinetsu Handotai Kk Device for chamfering the notch of a plate.
CN101704218A (en) * 2009-12-14 2010-05-12 中国电子科技集团公司第四十五研究所 Silicon slice positioning and loading device of chemical mechanical polishing equipment
CN205325366U (en) * 2016-01-22 2016-06-22 浙江好亚能源股份有限公司 Silicon wafer stick chamfering apparatus
CN207810610U (en) * 2017-12-14 2018-09-04 鸿准精密模具(昆山)有限公司 Alignment positioning device
CN208601731U (en) * 2018-07-24 2019-03-15 洛阳市鼎晶电子材料有限公司 A kind of silicon wafer asymmetry facing attachment
CN209273123U (en) * 2018-11-09 2019-08-20 盐城盈信通科技有限公司 A kind of power electronic devices chip research and development wafer chamfer auxiliary device

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Address after: 317521 Ze Guo Zhen Zhu Li Cun, Wenling City, Taizhou City, Zhejiang Province

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Address before: 341003 Ganzhou yerun automation equipment Co., Ltd. north of Gongyi Road, Hong Kong Industrial Park, Ganzhou Economic Development Zone, Ganzhou City, Jiangxi Province

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