CN112223046B

CN112223046B - Chip abrasive disc machine

Info

Publication number: CN112223046B
Application number: CN202011133848.3A
Authority: CN
Inventors: 凌丹璐
Original assignee: Jiangsu Sesumg Technology Co ltd
Current assignee: Jiangsu Sesumg Technology Co ltd
Priority date: 2020-10-21
Filing date: 2020-10-21
Publication date: 2022-08-02
Anticipated expiration: 2040-10-21
Also published as: CN112223046A

Abstract

A chip grinding machine belongs to the technical field of chip manufacturing and comprises a base, a driving part and a grinding part, wherein the driving part is installed on the base, the grinding part is also installed on the base, the driving part forwards delivers a silicon chip, and the grinding part finishes strip grinding in the moving process of the silicon chip. The base includes mesa, stand, portal frame and spout, has two pairs of stands on the mesa, has two round holes of height configuration on the stand, and the round hole installation drive division on the stand, the inboard of two pairs of stands has two portal frames, installs grinding portion on the portal frame, and the portal frame both sides all have the spout. The driving part comprises a driving belt wheel, a supporting belt wheel, a driving belt, a driven belt wheel, a driven belt and a belt motor, the driving belt wheel and the supporting belt wheel are respectively installed in the low-level round holes of the pair of stand columns, the driving belt is erected between the driving belt wheel and the supporting belt wheel, the driven belt wheel is provided with a pair of driven belt wheels, and the pair of driven belt wheels are installed in the high-level round holes of the pair of stand columns.

Description

Chip abrasive disc machine

Technical Field

The invention belongs to the technical field of chip manufacturing, and particularly relates to a chip grinding machine.

Background

The grinding and dicing are important operation steps in the chip manufacturing process, and the sequence of grinding and dicing may be different in different production lines. For the thinning and slicing method, a mechanical or chemical mode is used for cutting a notch before thinning, and after the notch is thinned to a certain thickness by a grinding method, the residual processing amount is further removed by adopting a plasma etching technology, so that the automatic separation of the bare chip can be realized. Thus, mechanical lapping is still one of the longer used lapping methods. The current common wafer grinder generally grinds the whole silicon wafer, although the grinding operation can be realized, the operation is not necessarily too extensive, and a finer grinding mode can be provided, and of course, the finer grinding mode needs new special grinding equipment.

Disclosure of Invention

The invention provides a chip grinding machine, which aims to solve the problems in the background technology.

The technical problem solved by the invention is realized by adopting the following technical scheme:

a chip grinding machine comprises a base, a driving part and a grinding part, wherein the driving part is installed on the base, the grinding part is also installed on the base, the driving part forwards delivers a silicon chip, and the grinding part finishes strip grinding in the moving process of the silicon chip.

The base includes mesa, stand, portal frame and spout, has two pairs of stands on the mesa, has two round holes of height configuration on the stand, and the round hole installation drive division on the stand, the inboard of two pairs of stands has two portal frames, installs grinding portion on the portal frame, and the portal frame both sides all have the spout. The driving part comprises a driving belt wheel, a supporting belt wheel, a driving belt, a driven belt wheel, a driven belt and a belt motor, the driving belt wheel and the supporting belt wheel are respectively installed in the low-level round holes of the pair of stand columns, the driving belt is erected between the driving belt wheel and the supporting belt wheel, the driven belt wheel is provided with a pair of parts, the pair of driven belt wheels are installed in the high-level round holes of the pair of stand columns, the driven belt is erected between the pair of driven belt wheels, and a conveying space for silicon wafers is formed between the driving belt and the driven belt. The driven belt is a plurality of belts arranged at intervals, and the intervals are the size of the chip. The grinding portion is including initiative pivot, the grinding area, driven spindle, the shift fork, the pull rod, the nut, grinding motor and screw, the spaced grinding area that erects between initiative pivot and the driven spindle, the grinding area is a plurality of grinding areas of spaced, grinding area and driven belt staggered arrangement, the grinding area is corresponding to the silicon chip that needs the grinding, initiative pivot and driven spindle are installed respectively on a shift fork, the shift fork upwards has a pull rod, the pull rod is installed in the sleeve of portal frame, initiative pivot and driven spindle all extend to in the spout of portal frame from the shift fork, install two nuts on the pull rod of every shift fork, a nut is located the sleeve top of portal frame, another nut is located the sleeve below of portal frame. The driving rotating shaft is connected with a grinding motor outwards, the grinding motor is installed on the side portion of the portal frame through a sliding support and is fixed through four screws.

Furthermore, a cushion block is arranged on the side of the upright column on the front side of the table board, a belt motor is arranged on the cushion block, and meanwhile, the height compensation effect is achieved, so that the belt motor is convenient to install and is matched with the height of the driving belt wheel.

Furthermore, the center of the top of the portal frame is provided with a sleeve, and a shifting fork is arranged on the sleeve and plays a role in guiding the movement of the shifting fork.

The invention has the beneficial effects that:

the invention is used for lapping operation of chips, which has the driven pulleys arranged at intervals and the grinding belts arranged in a staggered way, can finely grind silicon chips, and in addition, the inclination angle of the grinding belts can be adjusted, and silicon chips with different thicknesses and lapping operation of different grinding beams can be used.

Drawings

FIG. 1 is a schematic of the present invention;

FIG. 2 is a right side view of the present invention;

FIG. 3 is an exploded view of the present invention;

FIG. 4 is a partial right side view of the present invention;

in the figure: 10. the grinding machine comprises a base, 11, a table board, 12, a column, 13, a cushion block, 14, a portal frame, 15, a sleeve, 16, a sliding groove, 20, a driving part, 21, a driving belt wheel, 22, a supporting belt wheel, 23, a driving belt, 24, a driven belt wheel, 25, a driven belt, 26, a belt motor, 30, a grinding part, 31, a driving rotating shaft, 32, a grinding belt, 33, a driven rotating shaft, 34, a shifting fork, 35, a pull rod, 36, a nut, 37, a grinding motor and 38 screws.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Referring to fig. 1 to 4, the wafer grinder includes a base 10, a driving part 20, and a grinding part 30, the driving part 20 being mounted on the base 10, the grinding part 30 also being mounted on the base 10, the driving part 20 delivering a silicon wafer forward, the grinding part 30 completing a strip grinding during the movement of the silicon wafer.

The base 10 comprises a table top 11, columns 12, cushion blocks 13, a portal frame 14, a sleeve 15 and a sliding groove 16, wherein two pairs of columns 12 are arranged on the table top 11, two round holes with high and low configurations are formed in the columns 12, a driving part 20 is installed in the round holes in the columns 12, the cushion block 13 is arranged on the side of the column 12 on the front side of the table top 11, a belt motor 26 is installed on the cushion block 13, the height compensation effect is achieved, and the installation of the belt motor 26 and the height matching with a driving belt wheel 21 are facilitated. The inner sides of the two pairs of upright posts 12 are provided with two portal frames 14, grinding parts 30 are arranged on the portal frames 14, a sleeve 15 is arranged in the center of the top of each portal frame 14, and a shifting fork 34 is arranged on each sleeve 15 and plays a role in guiding the movement of the shifting fork 34. The gantry 14 has sliding grooves 16 on both sides, and the sliding grooves 16 guide the adjustment of the driving rotating shaft 31 and the driven rotating shaft 33.

The driving part 20 includes a driving pulley 21, a supporting pulley 22, a driving belt 23, a driven pulley 24, a driven belt 25 and a belt motor 26, the driving pulley 21 and the supporting pulley 22 are respectively installed in the lower round holes of the pair of columns 12, the driving belt 23 is erected between the driving pulley 21 and the supporting pulley 22, the driven pulley 24 has a pair, the pair of driven pulleys 24 is installed in the upper round holes of the pair of columns 12, the driven belt 25 is erected between the pair of driven pulleys 24, and a silicon wafer conveying space is formed between the driving belt 23 and the driven belt 25, of course, a proper friction force should be provided for the silicon wafer between the driving belt 23 and the driven belt 25. Further, the driven belt 25 is a plurality of belts arranged at intervals of the size of a chip, that is, a portion of the silicon wafer where no lapping is required, and the portion where lapping is required is left to the grinding portion 30 for grinding operation.

The grinding part 30 comprises a driving rotating shaft 31, a grinding belt 32, a driven rotating shaft 33, shifting forks 34, pull rods 35, nuts 36, a grinding motor 37 and screws 38, the grinding belt 32 is erected between the driving rotating shaft 31 and the driven rotating shaft 33 at intervals, the grinding belt 32 is a plurality of grinding belts at intervals, the grinding belts 32 and the driven belts 25 are arranged in a staggered mode, the grinding belts 32 correspond to silicon wafers to be ground, the driving rotating shaft 31 and the driven rotating shaft 33 are respectively installed on one shifting fork 34, the shifting fork 34 is upwards provided with one pull rod 35, the pull rods 35 are installed in a sleeve 15 of the portal frame 14, the driving rotating shaft 31 and the driven rotating shaft 33 extend from the shifting fork 34 to a sliding chute 16 of the portal frame 14, two nuts 36 are installed on the pull rod 35 of each shifting fork 34, one nut 36 is located above the sleeve 15 of the portal frame 14, the other nut 36 is located below the sleeve 15 of the portal frame 14, and under the matching adjustment of the two nuts 36, the heights of the driving rotating shaft 31 and the driven rotating shaft 33 can be independently adjusted, namely the inclination angle of the grinding belt 32 is adjusted, and the grinding amount of the silicon wafer by the grinding belt 32 is also adjusted. One of the most common ways of adjustment is as shown in fig. 4, the grinding belt 32 is gradually declined from front to back, the front end of the grinding belt 32 corresponds to the thickness of the silicon wafer, and the back end of the grinding belt 32 is the thickness of the ground silicon wafer. Of course, it should be specifically noted that, in the present embodiment, the adjustment depression positions of the driving rotation shaft 31 and the driven rotation shaft 33 are the heights of the inner sides of the lower edges of the driven belts 25, and if an additional adjustment amount is required, the adjustment can be realized by fitting the grinding belt 32 with a proper thickness. The driving rotating shaft 31 is connected with a grinding motor 37 outwards, the grinding motor 37 is installed on the side portion of the portal frame 14 through a sliding support (shown in the figure but not labeled), and is fixed through four screws 38, when the driving rotating shaft 31 needs to be adjusted in height, the height of the grinding motor 37 is correspondingly adjusted, and after the adjustment is finished, the grinding motor 37 is fixed through four screws 38.

The working principle of the invention is as follows: the inclination angle of the grinding belt 32 is adjusted according to the thickness and grinding amount of the silicon wafer, and of course, the installation height of the grinding motor 37 is adjusted accordingly. Starting the belt motor 26 and the grinding motor 37, feeding the silicon wafer from the front end, and feeding the ground silicon wafer to the rear end for automatic output.

The above examples mainly illustrate the chip grinder of the present invention. While only a limited number of embodiments and features have been described, those skilled in the art will recognize that the invention can be embodied in many other forms without departing from the spirit or scope thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, and various modifications and alternative arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims.

Claims

1. A chip grinding machine comprises a base (10), a driving part (20) and a grinding part (30), and is characterized in that the driving part (20) is installed on the base (10), the grinding part (30) is also installed on the base (10), the base (10) comprises a table board (11), stand columns (12), portal frames (14) and sliding chutes (16), two pairs of stand columns (12) are arranged on the table board (11), two round holes in high-low configuration are formed in the stand columns (12), the driving part (20) is installed in the round holes in the stand columns (12), two portal frames (14) are arranged on the inner sides of the two pairs of stand columns (12), the grinding part (30) is installed on the portal frames (14), the sliding chutes (16) are formed in the two sides of each portal frame (14), the driving part (20) comprises a driving belt wheel (21), a supporting belt wheel (22), a driving belt (23), a driven belt wheel (24), a driven belt (25) and a belt motor (26), the grinding part (30) comprises a driving rotating shaft (31), a grinding belt (32), a driven rotating shaft (33), a shifting fork (34), a pull rod (35), a nut (36), a grinding motor (37) and a screw (38), the grinding belt (32) is erected between the driving rotating shaft (31) and the driven rotating shaft (33) at intervals, the grinding belt (32) is a plurality of grinding belts at intervals, the grinding belts (32) and the driven belt (25) are arranged in a staggered mode, the grinding belt (32) corresponds to a silicon wafer to be ground, the driving rotating shaft (31) and the driven rotating shaft (33) are respectively installed on a shifting fork (34), the shifting fork (34) is provided with a pull rod (35) upwards, the pull rod (35) is installed in the portal frame (14), the driving rotating shaft (31) and the driven rotating shaft (33) both extend into a sliding groove (16) of the portal frame (14) from the shifting fork (34), two nuts (36) are installed on the pull rod (35) of each shifting fork (34), one nut (36) is located above the portal frame (14), the other nut (36) is located below the portal frame (14), the driving rotating shaft (31) is outwards connected with a grinding motor (37), the grinding motor (37) is installed on the side portion of the portal frame (14) through a sliding support, and fixing is achieved through four screws (38).

2. The chip grinding machine according to claim 1, characterized in that the table top (11) is provided with a cushion block (13) at the side of the front side upright post (12), and the cushion block (13) is provided with a belt motor (26).

3. The chip grinder as set forth in claim 1, wherein the gantry (14) has a sleeve (15) at the top center, the sleeve (15) being mounted with a fork (34) and guiding the movement of the fork (34).