KR20120015992A - Grinding machine - Google Patents

Grinding machine Download PDF

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Publication number
KR20120015992A
KR20120015992A KR1020110043666A KR20110043666A KR20120015992A KR 20120015992 A KR20120015992 A KR 20120015992A KR 1020110043666 A KR1020110043666 A KR 1020110043666A KR 20110043666 A KR20110043666 A KR 20110043666A KR 20120015992 A KR20120015992 A KR 20120015992A
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KR
South Korea
Prior art keywords
grinding
grinding wheel
substrate
linear guides
chuck
Prior art date
Application number
KR1020110043666A
Other languages
Korean (ko)
Other versions
KR101397636B1 (en
Inventor
마사키 카나자와
Original Assignee
도쿄 세이미츄 코퍼레이션 리미티드
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Publication of KR20120015992A publication Critical patent/KR20120015992A/en
Application granted granted Critical
Publication of KR101397636B1 publication Critical patent/KR101397636B1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/01—Frames, beds, pillars or like members; Arrangement of ways
    • B23Q1/015—Frames, beds, pillars
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/01—Frames, beds, pillars or like members; Arrangement of ways
    • B23Q1/017—Arrangements of ways
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
    • B24B47/04—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by mechanical gearing only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)

Abstract

PURPOSE: A grinding machine is provided to curb yawing, chipping, and/or rolling in grinding since force is directly applied to the grinding part of a grinding wheel. CONSTITUTION: A grinding machine comprises three linear guides(31~33), a saddle, a grinding wheel(36), and a chuck(29). The three linear guides are arranged in a triangular shape. The saddle slides along the linear guide. The grinding wheel is installed on the lower end of the saddle and rotates around a sliding direction of the saddle. The chuck is arranged to face the grinding wheel and rotates holding a plate. The grinding part of the grinding wheel is arranged on a position corresponding to the center of gravity of a triangle formed by the linear guides.

Description

Grinding Machine {GRINDING MACHINE}

The present invention relates to a grinding machine for grinding a surface of a substrate, in particular a substrate made of a difficult material.

In the field of semiconductor manufacturing, silicon substrates tend to be enlarged year by year, and thinner substrates are being promoted in order to increase mounting density. In order to thin a substrate, what is called back grinding (back grinding) which grinds the back surface of a semiconductor substrate is performed.

Japanese Patent No. 2928218 discloses grinding a back surface of a substrate by adsorbing and holding the substrate on a chuck using a vacuum suction force. The grinding disc disclosed in Japanese Patent No. 2928218 is provided with three linear guides, and the rotary shaft of the grinding wheel is disposed at the triangular center of gravity formed by these three linear guides.

However, in recent years, as the demand for optical devices is increasing, the demand for grinding of sapphire substrates is increasing. In addition, it is also required to grind the silicon carbide substrate as a substitute for the silicon substrate. Such sapphire and silicon carbide has a high hardness, sapphire Vickers hardness is about 23GPa and silicon carbide reaches 24GPa. These materials are therefore difficult to grind and are generally referred to as "hard materials".

Conventional grinding wheels are cantilever-supported to the side of the grinding wheel unit of the grinding wheel. For this reason, when grinding a hard-grinding material with a normal grinding wheel, the rigidity of a grinding board may be inadequate. In such a case, there is a possibility that the grinding unit itself causes yawing, chipping and / or rolling on the grinding wheel.

Since the grinding wheel of the grinding disk disclosed in Japanese Patent No. 2928218 is supported by three linear guides, the rigidity of the grinding disk is relatively high. However, in Japanese Patent No. 2928218, the axis of rotation of the grinding wheel is arranged at a triangular center of gravity consisting of three columns, but the edge of the grinding wheel is at a position biased from the triangular center of gravity. Typically, since the edge of the grinding wheel grinds the substrate, the actual grinding portion is in a position displaced from the triangular center of gravity by the radius of the grinding wheel. Therefore, when grinding a hard material with the grinding disc disclosed in Japanese Patent No. 2928218, the rotation axis of the grinding wheel is inclined, which causes the grinding unit to roll.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a grinding plate having a high rigidity and capable of grinding the substrate with high rigidity without causing yawing or the like even when grinding a substrate made of a difficult material. do.

In order to achieve the above object, according to the first invention, three linear guides arranged in a triangular shape, shades slidably installed along these linear guides, and installed at the lower end of the shades and around the sliding direction of the shades And a rotatable grinding wheel and a chuck rotatable while facing the grinding wheel and holding the substrate, wherein the grinding portion at which the grinding wheel grinds the substrate corresponds to a triangular center of gravity formed by the linear guide. There is provided a grinding plate arranged at a position to be.

According to a second aspect of the invention, there is provided at least three linear guides arranged to form a polygon, a shade slidably mounted along the linear guides, a grinding wheel provided at a lower end of the shade and rotatable about a sliding direction of the shade; And a chuck rotatably disposed facing the grinding wheel and holding the substrate, wherein the grinding wheel is disposed at a position corresponding to the center of gravity of the polygon formed by the linear guide, wherein the grinding portion for grinding the substrate is disposed. Grinding machine is provided.

In the first and second inventions, the shades are slidably supported by three linear guides and at the same time correspond to the triangular center of gravity where the grinding portion of the grinding wheel, for example the annular region, is formed of three columns. Therefore, the force when sliding the grinding wheel downward acts directly on the grinding portion of the grinding wheel. Therefore, even when grinding the board | substrate which consists of a non-abrasive material, a board | substrate can be ground with high precision, without causing yaw etc., and the rigidity of a grinding board can be improved. In addition, the triangle formed by the three linear guides is preferably an isosceles triangle or an equilateral triangle, and in this case, the grinding can be performed more stably.

According to a third aspect of the present invention, there is further provided a grinding conveying portion for conveying the grinding wheel toward the chuck in the first or second invention, wherein the conveying direction for conveying the grinding wheel is the grinding wheel grinding the substrate. It was on a straight line connecting the site and the center of gravity.

Thereby, in 3rd invention, the rigidity of the grinding board at the time of grinding can be improved further. This is particularly advantageous when grinding a substrate made of a difficult material.

According to the fourth invention, in the first or second invention, the grinding portion for grinding the substrate of the grinding wheel is an edge of the grinding wheel.

In the fourth aspect of the invention, rolling can be prevented from occurring even when the radius of the grinding wheel is large.

According to the present invention, even when grinding a substrate made of a hard material, the substrate can be ground with high precision without causing yawing or the like, and a grinding plate with high rigidity can be provided.

These objects, features and advantages, and other objects, features and advantages of the present invention will become more apparent from the following detailed description of exemplary embodiments of the invention shown in the accompanying drawings.

1 is a schematic perspective view of a grinding machine according to the present invention.
2 is a side view of a grinding machine according to the present invention.
3 is a rear view of the grinding plate shown in FIG. 2.
FIG. 4 is a top view of the grinding plate shown in FIG. 2.
5 is a schematic view showing a top surface of a grinding machine according to the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the following drawings, like reference numerals refer to like elements. To aid in understanding, these figures have been scaled appropriately.

1 is a schematic perspective view of a grinding machine according to the present invention. As shown in FIG. 1, the grinding plate 10 mainly includes an arcuate column unit 12 having a grinding wheel 36 and a conveying unit 11 disposed below the column unit 12. have.

The apparatus 10 grinds the surface of the board | substrate W, for example, the board | substrate (opposite side to the surface in which the pattern was formed) which consists of a difficult material, such as sapphire or silicon carbide. As shown, a single groove 13 is formed in one side surface 12b of the column unit 12 in the longitudinal direction, and the groove 13 is formed in the downward passage (upper side) in the upper surface 12a of the main unit 12. 14) Moreover, the conveying unit 11 is comprised so that the said board | substrate W may be carried in to a grinding part and carried out from a grinding part after grinding.

As can be seen in FIG. 1, two linear guides 32 and 33 are provided on the side surface 12b, respectively, at or near both edges of the groove 13. Moreover, the linear guide 31 of the same shape is provided in parallel with the columns 32 and 33 in the bottom part of the groove 13. These columns 31, 32, 33 serve as guide rails for sliding a single shade.

Figure 2 is a side view of the grinding wheel according to the invention, Figure 3 is a front view of the grinding wheel shown in Figure 2, Figure 4 is a top view of the grinding wheel shown in Figure 2. As can be seen from these figures, the conveying unit 11 includes a conveying table 21 on which two rails 22 parallel to each other are arranged. On the rail 22, the slide body 25 is arrange | positioned so that a slide is possible. The slider 25 slides on the rail 22 by the motor 26 through the belt pulley mechanism 24. As shown in FIG.

As shown in FIG. 2, the chuck 29 holding the unshown substrate W is provided on the slide 25. The chuck 29 thus slides on the rail 22 integrally with the slider 25. In addition, the chuck 29 is connected to a vacuum source (not shown) and holds the substrate W by a vacuum action or the like. Moreover, the motor 27 is arrange | positioned under the conveyance base 21, and the chuck | zipper 29 rotates around a vertical axis, holding the board | substrate W. As shown in FIG.

2 and 3, the shade 34 is slidably installed in the linear guides 32 and 33 of the main unit 12. In addition, the shade 34 is slidably installed in the linear guide 31 via the nut 39 of the ball screw 38. As shown, a cup-shaped grinding wheel 36 is installed below the shade 34, and the grinding wheel 36 slides along the linear guides 31 to 33 integrally with the shade 34. The axis of rotation of the grinding wheel 36 is arranged in parallel with respect to the linear guides 31 to 33, and when the motor 35 provided in the shade 34 is driven, the grinding wheel 36 rotates around the axis of rotation.

As mentioned above, the ball screw 38 is disposed between the saddle 34 and the linear guide 31. The ball screw 38 is driven by the motor 37 disposed above, and serves as a grinding feed section for additionally transferring the grinding wheel 36 toward the substrate W of the chuck 29. As can be seen in FIGS. 2 and 4, the edge of the cup-shaped grinding wheel 36 is positioned on or adjacent to the conveying direction for conveying the grinding wheel 36 toward the substrate W. have.

5 is a schematic view showing a top surface of a grinding machine according to the present invention. As can be seen in FIG. 5, the three linear guides 31 to 33 of the grinding mill 10 are generally arranged at the vertices of an isosceles triangle, preferably an equilateral triangle. The vicinity of the edge of the grinding wheel 36 is positioned corresponding to the triangular center of gravity A. As shown in FIG. Since the grinding wheel 36 is in the form of a cup, the grinding portion where the grinding wheel 36 grinds the substrate W is located in the annular region B near the edge of the grinding wheel 36.

In addition, as mentioned above, the grinding feed part which consists of the motor 37, the ball screw apparatus 38, etc. is located in the vicinity of the annular area | region B of the grinding wheel 36. As shown in FIG. Therefore, in the present invention, the conveying direction for transferring the grinding wheel 36 toward the substrate W, the triangular center of gravity A and a part of the annular region B of the grinding wheel 36 are generally on the same straight line. Located (see FIG. 5).

At the time of operation, the board | substrate W which is not shown in FIG. 2 etc., for example, the board | substrate W which consists of a hard material is mounted on the chuck 29. When the chuck 29 holds the substrate W in a vacuum, the motor 26 is driven, so that the chuck 29 slides on the rail 22 together with the slide 25. The chuck 29 slides to the position shown in FIG. 2 and rotates about the vertical axis by the motor 27. In addition, in the position shown in FIG. 2, it should be noted that the annular area B near the edge of the grinding wheel 36 is arrange | positioned in the position corresponding to the center of the board | substrate W. FIG.

Next, as the motor 35 rotates the grinding wheel 36 around the vertical axis, the shade 34 slides downward along the three linear guides 31 to 33. In addition, the annular region B of the grinding wheel 36 contacts the substrate W to perform infeed grinding. When the thickness of the substrate W detected by the in-process gauge 43 reaches a predetermined value, the shade 34 slides upward and is spaced apart from the substrate W. FIG. Thereafter, the slider 25 slides on the rail 22 to return to the initial position, and the substrate W is separated from the chuck 29.

Referring again to FIG. 5, the three linear guides 31 to 33 are arranged at substantially equal intervals in the circumferential direction of the grinding wheel 36. Therefore, in the present invention, the grinding wheel 36 provided in the saddle 34 is stably provided in the grinding plate 10 to suppress the occurrence of yawing, chipping and / or rolling.

Moreover, in this invention, a part of annular area | region B of the grinding wheel 36 is arrange | positioned in the position corresponding to the triangular center of gravity formed by the three linear guides 31-33. Since the annular area | region B of the grinding wheel 36 is a site | part which grinds the board | substrate W by directly contacting the board | substrate W, the load at the time of grinding is most applied to the annular area | region B. FIG. In the present invention, since the annular area B of the grinding wheel 36 is located at a position corresponding to the triangular center of gravity, the force when sliding the grinding wheel 36 downward is directly applied to the grinding portion of the grinding wheel 36. It can act and can grind efficiently. By this structure, generation | occurrence | production of yawing, chipping, and / or rolling at the time of grinding is suppressed, and the board | substrate W can be ground with stable and high precision, while increasing the rigidity of the grinding board 10. FIG.

In the present invention, the grinding wheel 36 can be transferred using the motor 37 and the ball screw device 38 during grinding. And the conveyance direction which conveys the grinding wheel 36 exists in the straight line which connects the triangular center of gravity mentioned above and the annular area | region B of the grinding wheel 36. As shown in FIG. Therefore, in the present invention, it is possible to further increase the rigidity of the grinding plate 10, and as a result, even when grinding the substrate W made of a difficult material, smoothly grinding the substrate W without causing yawing, chipping and / or rolling. can do.

In the embodiment described with reference to the drawings, the shade 34 is disposed between three linear guides forming a triangle. However, the present invention is not limited to three linear guides, and more than three linear guides are arranged to form a polygon, and the annular region B of the grinding wheel 36 is located at a position corresponding to the center of gravity of the polygon. It may be arranged. Such a case is considered to be included in the scope of the present invention. Moreover, it is clear that the grinding board 10 of this invention can be applied also to the board | substrate W which consists of materials which are not a difficult material, for example, silicon.

Although the present invention has been described with reference to typical embodiments, those skilled in the art will understand that various other changes, omissions, and additions described above may be made without departing from the scope of the present invention.

Claims (4)

Three linear guides arranged in a triangle,
A saddle slidably installed along these linear guides,
A grinding wheel installed at the bottom of the shade and rotatable about a sliding direction of the shade;
It is disposed facing the grinding wheel, and provided with a rotatable chuck while holding a substrate,
And a grinding portion at which the grinding wheel grinds the substrate is disposed at a position corresponding to the center of gravity of the triangle formed by the linear guide. At least three linear guides arranged to form a polygon,
A saddle slidably installed along these linear guides,
A grinding wheel installed at the bottom of the shade and rotatable about a sliding direction of the shade;
A chuck rotatably disposed facing the grinding wheel and supporting a substrate;
And a grinding portion at which the grinding wheel grinds the substrate is disposed at a position corresponding to the center of gravity of the polygon formed by the linear guide. The method according to claim 1 or 2,
And a grinding feeder for feeding the grinding wheel toward the chuck, wherein the feeding direction for feeding the grinding wheel is on a straight line connecting the grinding portion and the center of gravity of the grinding wheel to grind the substrate. Grinding machine, characterized in that. The method according to claim 1 or 2,
And a grinding portion for grinding the substrate of the grinding wheel is an edge of the grinding wheel.
KR1020110043666A 2010-08-13 2011-05-09 Grinding machine KR101397636B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010181315A JP5582916B2 (en) 2010-08-13 2010-08-13 Grinder
JPJP-P-2010-181315 2010-08-13

Publications (2)

Publication Number Publication Date
KR20120015992A true KR20120015992A (en) 2012-02-22
KR101397636B1 KR101397636B1 (en) 2014-05-22

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KR1020110043666A KR101397636B1 (en) 2010-08-13 2011-05-09 Grinding machine

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JP (1) JP5582916B2 (en)
KR (1) KR101397636B1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3045263A4 (en) * 2013-09-13 2017-05-24 Makino Milling Machine Co., Ltd. Machine tool
EP2992994A4 (en) * 2013-05-03 2017-05-31 Byung Duk Min Numerically controlled machine tool
CN107186568A (en) * 2017-06-14 2017-09-22 沈攀 Edging device
CN109909849A (en) * 2019-04-10 2019-06-21 张朝辉 Material grinder

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JP6012303B2 (en) * 2012-07-06 2016-10-25 株式会社ディスコ Grinding equipment
JP6012302B2 (en) * 2012-07-06 2016-10-25 株式会社ディスコ Grinding equipment
CN103567461A (en) * 2012-07-20 2014-02-12 鸿准精密模具（昆山）有限公司 Turning device
WO2017057548A1 (en) 2015-09-30 2017-04-06 株式会社東京精密 Grinding machine
US10421172B2 (en) * 2015-12-01 2019-09-24 Tokyo Seimitsu Co. Ltd. Processing device
JP7369678B2 (en) 2020-09-28 2023-10-26 ヒロセ電機株式会社 Magnetic detection device and rotation detection device
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CN113793822B (en) * 2021-11-17 2022-04-12 乐山高测新能源科技有限公司 Silicon rod processing system
CN117754374B (en) * 2024-02-22 2024-04-30 伊川县恒昌轴承有限公司 Grinding equipment and grinding method for thrust bearing machining

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JP4309178B2 (en) * 2003-06-06 2009-08-05 日本電波工業株式会社 3-axis control type flat processing machine
JP5184910B2 (en) * 2008-02-13 2013-04-17 株式会社岡本工作機械製作所 Substrate surface grinding machine
JP5203740B2 (en) * 2008-02-19 2013-06-05 株式会社岡本工作機械製作所 Surface grinding head system for substrates
JP5342253B2 (en) * 2009-01-28 2013-11-13 株式会社ディスコ Processing equipment

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2992994A4 (en) * 2013-05-03 2017-05-31 Byung Duk Min Numerically controlled machine tool
EP3045263A4 (en) * 2013-09-13 2017-05-24 Makino Milling Machine Co., Ltd. Machine tool
US9878408B2 (en) 2013-09-13 2018-01-30 Makino Milling Machine Co., Ltd. Machine tool
CN107186568A (en) * 2017-06-14 2017-09-22 沈攀 Edging device
CN109909849A (en) * 2019-04-10 2019-06-21 张朝辉 Material grinder

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Publication number Publication date
KR101397636B1 (en) 2014-05-22
JP2012040620A (en) 2012-03-01
JP5582916B2 (en) 2014-09-03

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