KR20120015992A - Grinding machine - Google Patents
Grinding machine Download PDFInfo
- Publication number
- KR20120015992A KR20120015992A KR1020110043666A KR20110043666A KR20120015992A KR 20120015992 A KR20120015992 A KR 20120015992A KR 1020110043666 A KR1020110043666 A KR 1020110043666A KR 20110043666 A KR20110043666 A KR 20110043666A KR 20120015992 A KR20120015992 A KR 20120015992A
- Authority
- KR
- South Korea
- Prior art keywords
- grinding
- grinding wheel
- substrate
- linear guides
- chuck
- Prior art date
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/01—Frames, beds, pillars or like members; Arrangement of ways
- B23Q1/015—Frames, beds, pillars
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/01—Frames, beds, pillars or like members; Arrangement of ways
- B23Q1/017—Arrangements of ways
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
- B24B41/047—Grinding heads for working on plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
- B24B47/04—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by mechanical gearing only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
The present invention relates to a grinding machine for grinding a surface of a substrate, in particular a substrate made of a difficult material.
In the field of semiconductor manufacturing, silicon substrates tend to be enlarged year by year, and thinner substrates are being promoted in order to increase mounting density. In order to thin a substrate, what is called back grinding (back grinding) which grinds the back surface of a semiconductor substrate is performed.
Japanese Patent No. 2928218 discloses grinding a back surface of a substrate by adsorbing and holding the substrate on a chuck using a vacuum suction force. The grinding disc disclosed in Japanese Patent No. 2928218 is provided with three linear guides, and the rotary shaft of the grinding wheel is disposed at the triangular center of gravity formed by these three linear guides.
However, in recent years, as the demand for optical devices is increasing, the demand for grinding of sapphire substrates is increasing. In addition, it is also required to grind the silicon carbide substrate as a substitute for the silicon substrate. Such sapphire and silicon carbide has a high hardness, sapphire Vickers hardness is about 23GPa and silicon carbide reaches 24GPa. These materials are therefore difficult to grind and are generally referred to as "hard materials".
Conventional grinding wheels are cantilever-supported to the side of the grinding wheel unit of the grinding wheel. For this reason, when grinding a hard-grinding material with a normal grinding wheel, the rigidity of a grinding board may be inadequate. In such a case, there is a possibility that the grinding unit itself causes yawing, chipping and / or rolling on the grinding wheel.
Since the grinding wheel of the grinding disk disclosed in Japanese Patent No. 2928218 is supported by three linear guides, the rigidity of the grinding disk is relatively high. However, in Japanese Patent No. 2928218, the axis of rotation of the grinding wheel is arranged at a triangular center of gravity consisting of three columns, but the edge of the grinding wheel is at a position biased from the triangular center of gravity. Typically, since the edge of the grinding wheel grinds the substrate, the actual grinding portion is in a position displaced from the triangular center of gravity by the radius of the grinding wheel. Therefore, when grinding a hard material with the grinding disc disclosed in Japanese Patent No. 2928218, the rotation axis of the grinding wheel is inclined, which causes the grinding unit to roll.
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a grinding plate having a high rigidity and capable of grinding the substrate with high rigidity without causing yawing or the like even when grinding a substrate made of a difficult material. do.
In order to achieve the above object, according to the first invention, three linear guides arranged in a triangular shape, shades slidably installed along these linear guides, and installed at the lower end of the shades and around the sliding direction of the shades And a rotatable grinding wheel and a chuck rotatable while facing the grinding wheel and holding the substrate, wherein the grinding portion at which the grinding wheel grinds the substrate corresponds to a triangular center of gravity formed by the linear guide. There is provided a grinding plate arranged at a position to be.
According to a second aspect of the invention, there is provided at least three linear guides arranged to form a polygon, a shade slidably mounted along the linear guides, a grinding wheel provided at a lower end of the shade and rotatable about a sliding direction of the shade; And a chuck rotatably disposed facing the grinding wheel and holding the substrate, wherein the grinding wheel is disposed at a position corresponding to the center of gravity of the polygon formed by the linear guide, wherein the grinding portion for grinding the substrate is disposed. Grinding machine is provided.
In the first and second inventions, the shades are slidably supported by three linear guides and at the same time correspond to the triangular center of gravity where the grinding portion of the grinding wheel, for example the annular region, is formed of three columns. Therefore, the force when sliding the grinding wheel downward acts directly on the grinding portion of the grinding wheel. Therefore, even when grinding the board | substrate which consists of a non-abrasive material, a board | substrate can be ground with high precision, without causing yaw etc., and the rigidity of a grinding board can be improved. In addition, the triangle formed by the three linear guides is preferably an isosceles triangle or an equilateral triangle, and in this case, the grinding can be performed more stably.
According to a third aspect of the present invention, there is further provided a grinding conveying portion for conveying the grinding wheel toward the chuck in the first or second invention, wherein the conveying direction for conveying the grinding wheel is the grinding wheel grinding the substrate. It was on a straight line connecting the site and the center of gravity.
Thereby, in 3rd invention, the rigidity of the grinding board at the time of grinding can be improved further. This is particularly advantageous when grinding a substrate made of a difficult material.
According to the fourth invention, in the first or second invention, the grinding portion for grinding the substrate of the grinding wheel is an edge of the grinding wheel.
In the fourth aspect of the invention, rolling can be prevented from occurring even when the radius of the grinding wheel is large.
According to the present invention, even when grinding a substrate made of a hard material, the substrate can be ground with high precision without causing yawing or the like, and a grinding plate with high rigidity can be provided.
These objects, features and advantages, and other objects, features and advantages of the present invention will become more apparent from the following detailed description of exemplary embodiments of the invention shown in the accompanying drawings.
1 is a schematic perspective view of a grinding machine according to the present invention.
2 is a side view of a grinding machine according to the present invention.
3 is a rear view of the grinding plate shown in FIG. 2.
FIG. 4 is a top view of the grinding plate shown in FIG. 2.
5 is a schematic view showing a top surface of a grinding machine according to the present invention.
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the following drawings, like reference numerals refer to like elements. To aid in understanding, these figures have been scaled appropriately.
1 is a schematic perspective view of a grinding machine according to the present invention. As shown in FIG. 1, the
The
As can be seen in FIG. 1, two
Figure 2 is a side view of the grinding wheel according to the invention, Figure 3 is a front view of the grinding wheel shown in Figure 2, Figure 4 is a top view of the grinding wheel shown in Figure 2. As can be seen from these figures, the
As shown in FIG. 2, the
2 and 3, the
As mentioned above, the
5 is a schematic view showing a top surface of a grinding machine according to the present invention. As can be seen in FIG. 5, the three
In addition, as mentioned above, the grinding feed part which consists of the
At the time of operation, the board | substrate W which is not shown in FIG. 2 etc., for example, the board | substrate W which consists of a hard material is mounted on the
Next, as the
Referring again to FIG. 5, the three
Moreover, in this invention, a part of annular area | region B of the
In the present invention, the grinding
In the embodiment described with reference to the drawings, the
Although the present invention has been described with reference to typical embodiments, those skilled in the art will understand that various other changes, omissions, and additions described above may be made without departing from the scope of the present invention.
Claims (4)
A saddle slidably installed along these linear guides,
A grinding wheel installed at the bottom of the shade and rotatable about a sliding direction of the shade;
It is disposed facing the grinding wheel, and provided with a rotatable chuck while holding a substrate,
And a grinding portion at which the grinding wheel grinds the substrate is disposed at a position corresponding to the center of gravity of the triangle formed by the linear guide.
A saddle slidably installed along these linear guides,
A grinding wheel installed at the bottom of the shade and rotatable about a sliding direction of the shade;
A chuck rotatably disposed facing the grinding wheel and supporting a substrate;
And a grinding portion at which the grinding wheel grinds the substrate is disposed at a position corresponding to the center of gravity of the polygon formed by the linear guide.
And a grinding feeder for feeding the grinding wheel toward the chuck, wherein the feeding direction for feeding the grinding wheel is on a straight line connecting the grinding portion and the center of gravity of the grinding wheel to grind the substrate. Grinding machine, characterized in that.
And a grinding portion for grinding the substrate of the grinding wheel is an edge of the grinding wheel.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010181315A JP5582916B2 (en) | 2010-08-13 | 2010-08-13 | Grinder |
JPJP-P-2010-181315 | 2010-08-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20120015992A true KR20120015992A (en) | 2012-02-22 |
KR101397636B1 KR101397636B1 (en) | 2014-05-22 |
Family
ID=45838535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020110043666A KR101397636B1 (en) | 2010-08-13 | 2011-05-09 | Grinding machine |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5582916B2 (en) |
KR (1) | KR101397636B1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3045263A4 (en) * | 2013-09-13 | 2017-05-24 | Makino Milling Machine Co., Ltd. | Machine tool |
EP2992994A4 (en) * | 2013-05-03 | 2017-05-31 | Byung Duk Min | Numerically controlled machine tool |
CN107186568A (en) * | 2017-06-14 | 2017-09-22 | 沈攀 | Edging device |
CN109909849A (en) * | 2019-04-10 | 2019-06-21 | 张朝辉 | Material grinder |
Families Citing this family (9)
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JP6012302B2 (en) * | 2012-07-06 | 2016-10-25 | 株式会社ディスコ | Grinding equipment |
JP6012303B2 (en) * | 2012-07-06 | 2016-10-25 | 株式会社ディスコ | Grinding equipment |
CN103567461A (en) * | 2012-07-20 | 2014-02-12 | 鸿准精密模具(昆山)有限公司 | Turning device |
WO2017057548A1 (en) | 2015-09-30 | 2017-04-06 | 株式会社東京精密 | Grinding machine |
KR101924990B1 (en) * | 2015-12-01 | 2018-12-04 | 가부시키가이샤 토쿄 세이미쯔 | Processing device |
JP7369678B2 (en) | 2020-09-28 | 2023-10-26 | ヒロセ電機株式会社 | Magnetic detection device and rotation detection device |
JP7421459B2 (en) | 2020-09-28 | 2024-01-24 | ヒロセ電機株式会社 | Magnetic detection device and rotation detection device |
CN113793822B (en) * | 2021-11-17 | 2022-04-12 | 乐山高测新能源科技有限公司 | Silicon rod processing system |
CN117754374B (en) * | 2024-02-22 | 2024-04-30 | 伊川县恒昌轴承有限公司 | Grinding equipment and grinding method for thrust bearing machining |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0580632U (en) * | 1992-04-06 | 1993-11-02 | 株式会社椿本チエイン | Deflection prevention structure for column and lifting frame |
JP4309178B2 (en) * | 2003-06-06 | 2009-08-05 | 日本電波工業株式会社 | 3-axis control type flat processing machine |
JP5184910B2 (en) * | 2008-02-13 | 2013-04-17 | 株式会社岡本工作機械製作所 | Substrate surface grinding machine |
JP5203740B2 (en) * | 2008-02-19 | 2013-06-05 | 株式会社岡本工作機械製作所 | Surface grinding head system for substrates |
JP5342253B2 (en) * | 2009-01-28 | 2013-11-13 | 株式会社ディスコ | Processing equipment |
-
2010
- 2010-08-13 JP JP2010181315A patent/JP5582916B2/en active Active
-
2011
- 2011-05-09 KR KR1020110043666A patent/KR101397636B1/en active IP Right Grant
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2992994A4 (en) * | 2013-05-03 | 2017-05-31 | Byung Duk Min | Numerically controlled machine tool |
EP3045263A4 (en) * | 2013-09-13 | 2017-05-24 | Makino Milling Machine Co., Ltd. | Machine tool |
US9878408B2 (en) | 2013-09-13 | 2018-01-30 | Makino Milling Machine Co., Ltd. | Machine tool |
CN107186568A (en) * | 2017-06-14 | 2017-09-22 | 沈攀 | Edging device |
CN109909849A (en) * | 2019-04-10 | 2019-06-21 | 张朝辉 | Material grinder |
Also Published As
Publication number | Publication date |
---|---|
JP5582916B2 (en) | 2014-09-03 |
JP2012040620A (en) | 2012-03-01 |
KR101397636B1 (en) | 2014-05-22 |
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