CN111970880A - Closed cabinet - Google Patents
Closed cabinet Download PDFInfo
- Publication number
- CN111970880A CN111970880A CN202010976763.5A CN202010976763A CN111970880A CN 111970880 A CN111970880 A CN 111970880A CN 202010976763 A CN202010976763 A CN 202010976763A CN 111970880 A CN111970880 A CN 111970880A
- Authority
- CN
- China
- Prior art keywords
- substrate
- base plate
- fixedly connected
- heat
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 57
- 238000007789 sealing Methods 0.000 claims abstract description 31
- 230000017525 heat dissipation Effects 0.000 claims abstract description 24
- 238000004891 communication Methods 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 14
- 238000009434 installation Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/061—Hermetically-sealed casings sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
Abstract
The invention provides a closed chassis. This closed quick-witted case includes: the heat dissipation module comprises a shell, an electronic device, a heat conduction assembly and a heat dissipation module; a first mounting opening is formed in one surface of the machine shell, and a first sealing ring is arranged on the periphery of the first mounting opening; the heat dissipation module includes: the heat sink comprises a substrate and a plurality of heat radiating fins; the radiating fin and the heat conducting component are respectively positioned on one side opposite to the base plate, the radiating fin is fixedly connected with the base plate, the heat conducting component is fixedly connected with the base plate, the base plate is used for covering the first mounting opening, the base plate is fixedly connected with the machine shell, and the first sealing ring is clamped between the base plate and the machine shell; the electronic device is fixedly arranged in the shell, one surface of the heat conduction assembly is in contact with the electronic device, and one end, far away from the substrate, of the radiating fin is located on the outer side of the shell. The invention can radiate the electronic device in the closed case and ensure the waterproof and dustproof requirements of the closed case.
Description
Technical Field
The invention relates to the technical field of electronic equipment, in particular to a closed case.
Background
With the rapid development of science and technology, electronic devices are widely used in various industries. Because some electronic devices have high requirements on waterproof and dustproof grades and have extremely high requirements on the tightness of the electronic devices, the waterproof and dustproof protection grade is generally IP 65.
In the existing chassis of some electronic devices, electronic devices that generate heat, such as a processor, a bridge chip, a network chip, and a power module, are disposed inside the chassis. In order to ensure that these electronic devices normally work, ventilation openings or fans are usually required to be formed in the surface of the case so as to cool the electronic devices in the case, but corresponding waterproof and dustproof grades cannot be realized.
Disclosure of Invention
In order to solve the above problems, the present invention provides a sealed enclosure, which can radiate heat of electronic devices in the sealed enclosure and ensure waterproof and dustproof requirements of the sealed enclosure.
The present invention provides a closed chassis comprising: the heat dissipation module comprises a shell, an electronic device, a heat conduction assembly and a heat dissipation module;
a first mounting opening is formed in one surface of the machine shell, and a first sealing ring is arranged on the periphery of the first mounting opening;
the heat dissipation module includes: the heat sink comprises a substrate and a plurality of heat radiating fins;
the radiating fin and the heat conducting component are respectively positioned on one side opposite to the substrate, the radiating fin is fixedly connected with the substrate, the heat conducting component is fixedly connected with the substrate, the substrate is used for covering the first mounting opening, the substrate is fixedly connected with the machine shell, and the first sealing ring is clamped between the substrate and the machine shell;
the electronic device is fixedly arranged in the shell, one surface of the heat conduction component is in contact with the electronic device, and one end, far away from the substrate, of the radiating fin is located on the outer side of the shell.
Optionally, the housing comprises: a connecting plate and a fixing plate;
the connecting plate surrounds the outer side of the first mounting opening, one end of the connecting plate is fixedly connected with the machine shell in a sealing mode, and the other end of the connecting plate is fixedly connected with the fixing plate in a sealing mode;
the first sealing ring is clamped between the base plate and the fixing plate.
Optionally, the fixing plate is provided with a fixing through hole, the surface of the substrate facing the fixing plate is provided with a fixing blind hole, and the fixing plate and the substrate are fixedly connected through a screw;
the screw penetrates through the fixing plate through the fixing through hole and is fixedly connected with the base plate through a fixing blind hole in a threaded mode.
Optionally, the surface of the substrate facing the fixing plate is provided with a first clamping groove, and the first sealing ring is clamped with the substrate through the first clamping groove.
Optionally, an I/O carrier board and a motherboard are arranged in the housing;
the mainboard and the electronic device are positioned on one side of the I/O carrier plate facing the substrate;
the electronic device includes: the system comprises a power module, a bridge chip, a processor, memory particles and a network chip;
the power module and the network chip are both fixedly connected and in communication connection with the I/O carrier plate;
the bridge chip, the processor and the memory particles are fixedly connected and in communication connection with the mainboard.
Optionally, the thermally conductive assembly comprises: the heat conduction device comprises a first heat conduction block, a second heat conduction block and a third heat conduction block;
the first heat-conducting block includes: a first base plate and a first bump;
the first bump is fixedly connected with one side face of the first base plate, the first base plate is provided with a first mounting hole, the first mounting hole is positioned on one side of the first bulge, the first base plate is fixedly connected with the substrate through the first mounting hole, the surface of the first bump, which is far away from the first base plate, is in contact with the memory particles, and the surface of the first base plate, which faces the first bump, is in contact with the bridge chip and the processor;
the second heat conduction block includes: a second base plate and a second bump;
the second lug is fixedly connected with one side face of the second base plate, the second base plate is provided with a plurality of second mounting holes, the second mounting holes are positioned at least on two sides of the second bulge, the second base plate is fixedly connected with the substrate through the second mounting holes, and the surface of the second lug, which is far away from the second base plate, is in contact with the network chip;
the third heat-conducting block includes: a third base plate;
the third bottom plate is provided with a third mounting hole, the third bottom plate is fixedly connected with the substrate through the third mounting hole, and the surface of the third bottom plate, which is far away from the substrate, is in contact with the power module.
Optionally, a first support stud is fixedly arranged on the surface of the I/O carrier plate facing the main board, and the main board is fixedly connected to the I/O carrier plate through the first support stud.
Optionally, a second support stud is fixedly disposed on the surface of the substrate facing the I/O carrier, and the I/O carrier is fixedly connected to the substrate through the second support stud.
Optionally, the enclosure housing further comprises: a display screen;
the second installing port has been seted up on another surface of casing, the week side of second installing port is provided with the second sealing washer, the display screen pass through the screw with casing fixed connection and lid close the second installing port, the second sealing washer centre gripping is in the display screen with between the casing, the display screen with IO carrier plate communication connection.
Optionally, a mounting frame is fixedly arranged on the outer side of the casing.
According to the closed chassis provided by the embodiment of the invention, the first mounting opening is formed in the surface of the chassis, so that the heat dissipation module penetrates through the chassis to lead the heat generated by the electronic device in the chassis out of the chassis, the electronic device in the chassis can normally work without being influenced by temperature, and meanwhile, the first sealing ring is arranged on the peripheral side of the first mounting opening, so that the influence of the mounting of the heat dissipation module on the waterproof and dustproof performance of the closed chassis can be reduced.
Drawings
Fig. 1 is a structural diagram of a sealed enclosure according to an embodiment of the present application;
FIG. 2 is a block diagram of a housing according to an embodiment of the present application;
FIG. 3 is a block diagram of a substrate embodying a front-facing surface structure of the substrate according to one embodiment of the present application;
FIG. 4 is a block diagram of a substrate at a bottom view according to an embodiment of the present disclosure;
FIG. 5 is a block diagram of a first seal ring according to an embodiment of the present application;
FIG. 6 is a block diagram of a display screen embodying a rear facing surface configuration of the display screen in accordance with an embodiment of the present application;
fig. 7 is a structural diagram of a chassis and a heat dissipation module in a matching state according to an embodiment of the present application;
fig. 8 is a structural view of a sealed enclosure of an embodiment of the present application;
FIG. 9 is a partial block diagram of a hermetic enclosure embodying an installation location of a heat conducting assembly in accordance with an embodiment of the present application;
fig. 10 is a structural diagram of an I/O carrier embodying a surface structure of the I/O carrier facing backward according to an embodiment of the present application;
fig. 11 is a structural diagram of an I/O carrier embodying a surface structure of the I/O carrier facing forward according to an embodiment of the present application;
fig. 12 is a structural diagram of a motherboard according to an embodiment of the present application;
FIG. 13 is a block diagram of a first thermally conductive block according to one embodiment of the present application;
FIG. 14 is a block diagram of a second thermally conductive block according to an embodiment of the present application;
FIG. 15 is a block diagram of a third thermal block according to an embodiment of the present application;
fig. 16 is a partial structural view of a sealed enclosure embodying an I/O carrier mounting location according to an embodiment of the present application;
fig. 17 is a structural view of a closed enclosure in a bottom view according to an embodiment of the present application.
Reference numerals
1. A housing; 11 a housing; 111. folding edges; 12. a connecting plate; 13. a fixing plate; 131. a fixing through hole; 14. a first mounting port; 15. a second mounting opening; 2. an electronic device; 21. a power supply module; 22. a bridge chip; 23. a processor; 24. storing particles; 25. a network chip; 3. a heat conducting component; 31. a first heat-conducting block; 311. a first base plate; 312. a first mounting hole; 313. a first bump; 32. a second heat-conducting block; 321. a second base plate; 322. a second mounting hole; 323. a second bump; 33. a third heat-conducting block; 331. a third base plate; 332. a third mounting hole; 4. a heat dissipation module; 41. a substrate; 411. a boss; 412. fixing the blind hole; 413. a first card slot; 42. a heat sink; 5. a display screen; 51. a second card slot; 61. a first seal ring; 62. an I/O carrier plate; 621. an input/output interface; 63. a main board; 64. a first support stud; 65. a second support stud; 7. a mounting frame; 71. mounting a plate; 72. and (7) fixing holes.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The present embodiment provides a sealed enclosure, which combines fig. 1, 9 and 12, and includes: the electronic device comprises a machine shell 1, an electronic device 2, a heat conducting component 3, a heat dissipation module 4 and a display screen 5. The electronic device 2 is fixedly arranged in the casing 1, and one surface of the heat conducting component 3 is in contact with the electronic device 2.
In this embodiment, referring to fig. 2, a first mounting opening 14 is formed on a surface of the housing 1 facing the first direction. With reference to fig. 3, 4 and 5, a first seal ring 61 is provided on the circumferential side of the first mounting opening 14; the heat dissipation module 4 includes: a base plate 41 and a plurality of heat sinks 42. The heat dissipation fins 42 and the heat conduction assembly 3 are respectively located on the opposite sides of the substrate 41, and a plurality of heat dissipation fins 42 are arranged at intervals along the horizontal direction, and each heat dissipation fin 42 is placed along the vertical direction, so that the hot air around the heat dissipation fins 42 can directly rise and separate from the heat dissipation module 4; the heat conducting component 3 is fixedly connected with the substrate 41; the heat sink 42 and the substrate 41 are integrally formed and fixedly connected, and one end of the heat sink 42 away from the substrate 41 is located on the outer side of the casing 1. Base plate 41 through the screw with casing 1 fixed connection and lid close first installing port 14, first draw-in groove 413 has been seted up towards the surface of second direction to base plate 41, first draw-in groove 413 with first sealing washer 61 adaptation, first sealing washer 61 passes through first draw-in groove 413 with the base plate 41 joint. When the substrate 41 covers the first mounting opening 14, the first seal ring 61 is sandwiched between the substrate 41 and the housing 1.
With reference to fig. 6 and 7, a second mounting opening 15 is formed on a surface of the housing 1 facing the second direction. In this embodiment, the first direction is a backward direction, and the second direction is a forward direction. A second sealing ring is arranged on the periphery of the second mounting opening 15, and the display screen 5 is fixedly connected with the machine shell 1 through a screw and covers the second mounting opening 15; the surface of display screen 5 towards the back seted up with second draw-in groove 51, second draw-in groove 51 with second sealing washer adaptation, the second sealing washer passes through second draw-in groove 51 with 5 joints of display screen. When the display screen 5 is fixedly connected with the machine shell 1 through a screw, the second sealing ring is clamped between the display screen 5 and the machine shell 1.
According to the closed case, the first mounting hole 14 is formed in the surface of the case 1, so that the heat dissipation module 4 can penetrate through the case 1 to guide heat generated by the electronic device 2 in the case 1 out of the case 1, the electronic device 2 in the case 1 can work normally without being affected by temperature, and meanwhile, the first sealing ring 61 is arranged on the periphery of the first mounting hole 14, so that the influence of the mounting of the heat dissipation module 4 on the waterproof and dustproof performance of the closed case can be reduced. The display screen 5 is arranged on the surface of the machine shell 1, so that the functions of the sealed machine box are more diversified, and meanwhile, the second sealing ring is arranged on the periphery side of the second mounting opening 15, so that the influence of the installation of the display screen 5 on the waterproof and dustproof performance of the sealed machine box can be reduced.
Further, in conjunction with fig. 2 and 7, the housing 1 includes: a housing 11, a connecting plate 12 and a fixing plate 13. The shell 11 is a main component of the casing 1, and the shell 11 is used for forming the outer surface of the casing 1; the connecting plate 12 and the fixing plate 13 are both located inside the housing 11 or both located outside the housing 11.
In this embodiment, the connecting plate 12 and the fixing plate 13 may be both located in the housing 11. Wherein, the connecting plate 12 and the fixing plate 13 are integrally formed and fixedly connected; the cross sections of the connecting plate 12 and the fixing plate 13 are stepped, the fixing plate 13 forms one horizontal part of the step, and the connecting plate 12 forms the other horizontal part of the step and a vertical part connecting the two horizontal parts; the connecting plate 12 surrounds the outer side of the first mounting opening 14, one end face of the connecting plate 12 is fixedly connected with the inner surface of the machine shell 1 in a sealing mode in a butt-welding mode, and sealant is coated on the outer edge where the connecting plate 12 is connected with the machine shell 1. Therefore, the tightness of the connection between the connecting plate 12 and the shell 11 can be effectively ensured. The first seal ring 61 is sandwiched between the base plate 41 and the fixed plate 13.
The fixing plate 13 is provided with fourteen fixing through holes 131, the surface of the substrate 41 facing the fixing plate 13 is provided with fourteen fixing blind holes 412, and the fixing plate 13 is fixedly connected with the substrate 41 through screws; the screws penetrate through the fixing plate 13 through the fixing through holes 131 and are fixedly connected with the fixing plate 13 through threads, and are fixedly connected with the substrate 41 through the fixing blind holes 412 through threads, so that the substrate 41 and the fixing plate 13 are fixedly connected through the fixing through holes 131 and the fixing blind holes 412, and the sealing performance of the closed enclosure can be improved. By providing the connecting plate 12 and the fixing plate 13, a cavity is formed, and the substrate 41 is fixed by sinking into the inner side of the outer surface of the housing 11 through the cavity, thereby further improving the sealing performance of the sealed enclosure.
In this embodiment, with reference to fig. 8 and 9, the second mounting opening 15 is formed by enclosing a side wall of the housing 11, a front end of the side wall forming the second mounting opening 15 is turned over outwards to form a folded edge 111, the second sealing ring is clamped between the display screen 5 and the folded edge 111, and the display screen 5 is fixedly connected to the folded edge 111 through a screw.
Referring to fig. 10, 12 and 16, in the present embodiment, an I/O carrier board 62 and a main board 63 are disposed in the housing 11. Referring to fig. 11, an input/output interface 621 is fixedly disposed on a front surface of the I/O carrier 62, and the input/output interface 621 is communicatively connected to the electronic device 2; the display screen 5 is in communication connection with the I/O carrier board 62 through a cable; an input/output aviation interface is fixedly arranged on the shell 11 and is in communication connection with the input/output interface 621 through a cable; the main board 63 and the electronic device 2 are located on a side of the I/O carrier board 62 facing the substrate 41, and the main board 63 is communicatively connected to the I/O carrier board 62. By confining the I/O carrier 62 between the display 5 and the heat sink module 4, this facilitates both the connection of the internal cables of the enclosure and the conduction of heat from the electronic device 2 to the outside.
The electronic device 2 includes: power module 21, bridge chip 22, processor 23, memory granules 24 and network chip 25. Wherein, the power module 21 and the network chip 25 are both fixedly connected and communicatively connected to the I/O carrier 62; the bridge chip 22, the processor 23 and the memory granules 24 are all fixedly connected and communicatively connected with the motherboard 63.
Referring to fig. 4, in this embodiment, the surface of the substrate 41 facing the I/O carrier 62 protrudes into the chassis 1 to form a boss 411, and the boss 411 passes through an opening enclosed by the fixing plate 13, and the opening is matched with the boss 411. The heat conducting component 3 is detachably and fixedly connected with the boss 411.
Referring to fig. 9 and 13, the heat conducting assembly 3 includes: a first heat conduction block 31, a second heat conduction block 32, and a third heat conduction block 33. The first heat conduction block 31 includes: a first bottom plate 311 and a first bump 313. The first bump 313 is fixedly connected with the first bottom plate 311 in an integrated manner, the first bottom plate 311 is provided with a first mounting hole 312, the first mounting hole 312 is a countersunk hole, the first mounting hole 312 is located on one side of the first protrusion, the first bottom plate 311 is fixedly connected with the boss 411 through the first mounting hole 312, the surface of the first bottom plate 311, away from the first bump 313, is in contact with the memory particles 24, and the surface of the first bottom plate 311, facing the first bump 313, is in contact with the bridge chip 22 and the processor 23.
With reference to fig. 9 and 14, the second heat conduction block 32 includes: a second base plate 321 and a second protrusion 323. The second bump 323 is fixedly connected with the second base plate 321 in an integrally formed manner, the second base plate 321 is provided with two second mounting holes 322, the second mounting holes 322 are located on two opposite sides of the second protrusion, the second base plate 321 is fixedly connected with the boss 411 through the second mounting holes 322, and the surface of the second bump 323 away from the second base plate 321 is in contact with the network chip 25.
With reference to fig. 9 and 15, the third heat conduction block 33 includes: and a third base plate 331. The third base plate 331 is provided with two third mounting holes 332, the third base plate 331 is fixedly connected with the boss 411 through the third mounting holes 332, and the surface of the third base plate 331 away from the substrate 41 is in contact with the power module 21.
In this embodiment, the first heat conduction block 31, the second heat conduction block 32, and the third heat conduction block 33 are all made of aluminum. The first heat conduction block 31, the second heat conduction block 32, the third heat conduction block 33 and the boss 411 are coated with heat conduction paste to ensure stable heat conduction contact among the first heat conduction block 31, the second heat conduction block 32, the third heat conduction block 33 and the boss 411. Heat-conducting medium materials are filled between the first heat-conducting block 31, the second heat-conducting block 32 and the third heat-conducting block 33 and the corresponding electronic device 2, so as to ensure stable heat-conducting contact between the first heat-conducting block 31, the second heat-conducting block 32 and the third heat-conducting block 33 and the corresponding electronic device 2. Through setting up first heat conduction piece 31, second heat conduction piece 32 and third heat conduction piece 33 have shortened electronic device 2's heat conduction route, adopt aluminium as the material simultaneously, workable, the cost of manufacture is low, and the heat conduction is effectual.
Referring to fig. 10, four first support studs 64 are fixedly disposed on the surface of the I/O carrier 62 facing the main board 63, and the main board 63 is fixedly connected to the I/O carrier 62 through the first support studs 64. The distance between the I/O carrier board 62 and the main board 63 can be limited by arranging the first support studs 64, so that the heat dissipation effect of the main board 63 and the I/O carrier board 62 is ensured.
With reference to fig. 9 and 16, five second support studs 65 are fixedly disposed on the surface of the boss 411 facing the I/O carrier plate 62, and the I/O carrier plate 62 is fixedly connected to the substrate 41 through the second support studs 65. The second support studs 65 are arranged to ensure that the surface of the electronic device 2 is stably contacted with the corresponding heat conducting assembly 3, so that the heat conducting effect of the heat conducting assembly 3 is ensured.
Referring to fig. 17, in the present embodiment, two mounting brackets 7 are fixedly disposed on the outer side of the housing 11. Mounting bracket 7 is located respectively the both sides that radiating module 4 is relative, mounting bracket 7's one end pass through the screw with casing 11 fixed connection, mounting bracket 7's the other end outwards turns over a shape mounting panel 71, mounting panel 71 has seted up fixed orifices 72 to fix this airtight type quick-witted case. The heat sink 42 is located in front of the rear surface of the mounting plate 71, which not only facilitates the installation of the enclosed chassis and prevents the heat sink 42 from obstructing the installation of the mounting plate 71, but also ensures the heat dissipation effect of the heat sink 42.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A hermetic enclosure, comprising: the heat dissipation module comprises a shell, an electronic device, a heat conduction assembly and a heat dissipation module;
a first mounting opening is formed in one surface of the machine shell, and a first sealing ring is arranged on the periphery of the first mounting opening;
the heat dissipation module includes: the heat sink comprises a substrate and a plurality of heat radiating fins;
the radiating fin and the heat conducting component are respectively positioned on one side opposite to the substrate, the radiating fin is fixedly connected with the substrate, the heat conducting component is fixedly connected with the substrate, the substrate is used for covering the first mounting opening, the substrate is fixedly connected with the machine shell, and the first sealing ring is clamped between the substrate and the machine shell;
the electronic device is fixedly arranged in the shell, one surface of the heat conduction component is in contact with the electronic device, and one end, far away from the substrate, of the radiating fin is located on the outer side of the shell.
2. A hermetic enclosure as in claim 1, wherein the enclosure comprises: a connecting plate and a fixing plate;
the connecting plate surrounds the outer side of the first mounting opening, one end of the connecting plate is fixedly connected with the machine shell in a sealing mode, and the other end of the connecting plate is fixedly connected with the fixing plate in a sealing mode;
the first sealing ring is clamped between the base plate and the fixing plate.
3. The hermetic enclosure chassis according to claim 2, wherein the fixing plate has a fixing through hole, the surface of the substrate facing the fixing plate has a fixing blind hole, and the fixing plate is fixedly connected to the substrate by a screw;
the screw penetrates through the fixing plate through the fixing through hole and is fixedly connected with the base plate through a fixing blind hole in a threaded mode.
4. The hermetic enclosure box according to claim 1, wherein a first clamping groove is formed in a surface of the base plate facing the fixing plate, and the first sealing ring is clamped to the base plate through the first clamping groove.
5. A hermetic enclosure as in claim 2, wherein an I/O carrier and a motherboard are disposed within the enclosure;
the mainboard and the electronic device are positioned on one side of the I/O carrier plate facing the substrate;
the electronic device includes: the system comprises a power module, a bridge chip, a processor, memory particles and a network chip;
the power module and the network chip are both fixedly connected and in communication connection with the I/O carrier plate;
the bridge chip, the processor and the memory particles are fixedly connected and in communication connection with the mainboard.
6. The enclosure of claim 5, wherein the thermally conductive assembly comprises: the heat conduction device comprises a first heat conduction block, a second heat conduction block and a third heat conduction block;
the first heat-conducting block includes: a first base plate and a first bump;
the first bump is fixedly connected with one side face of the first base plate, the first base plate is provided with a first mounting hole, the first mounting hole is positioned on one side of the first bulge, the first base plate is fixedly connected with the substrate through the first mounting hole, the surface of the first bump, which is far away from the first base plate, is in contact with the memory particles, and the surface of the first base plate, which faces the first bump, is in contact with the bridge chip and the processor;
the second heat conduction block includes: a second base plate and a second bump;
the second lug is fixedly connected with one side face of the second base plate, the second base plate is provided with a plurality of second mounting holes, the second mounting holes are positioned at least on two sides of the second bulge, the second base plate is fixedly connected with the substrate through the second mounting holes, and the surface of the second lug, which is far away from the second base plate, is in contact with the network chip;
the third heat-conducting block includes: a third base plate;
the third bottom plate is provided with a third mounting hole, the third bottom plate is fixedly connected with the substrate through the third mounting hole, and the surface of the third bottom plate, which is far away from the substrate, is in contact with the power module.
7. The enclosure as in claim 5, wherein a first support stud is fixedly disposed on a surface of the I/O carrier facing the motherboard, and the motherboard is fixedly connected to the I/O carrier via the first support stud.
8. The enclosure of claim 5, wherein a second support stud is fixedly disposed on a surface of the substrate facing the I/O carrier, and the I/O carrier is fixedly connected to the substrate through the second support stud.
9. A hermetic enclosure as claimed in claim 5, further comprising: a display screen;
the second installing port has been seted up on another surface of casing, the week side of second installing port is provided with the second sealing washer, the display screen pass through the screw with casing fixed connection and lid close the second installing port, the second sealing washer centre gripping is in the display screen with between the casing, the display screen with IO carrier plate communication connection.
10. A hermetic enclosure cabinet as in claim 5, wherein a mounting bracket is fixedly arranged on the outside of the cabinet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010976763.5A CN111970880A (en) | 2020-09-16 | 2020-09-16 | Closed cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010976763.5A CN111970880A (en) | 2020-09-16 | 2020-09-16 | Closed cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111970880A true CN111970880A (en) | 2020-11-20 |
Family
ID=73391687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010976763.5A Pending CN111970880A (en) | 2020-09-16 | 2020-09-16 | Closed cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111970880A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3150523U (en) * | 2009-03-03 | 2009-05-21 | 奇▲こう▼科技股▲ふん▼有限公司 | Communication device case heat dissipation device |
| CN201490181U (en) * | 2009-07-29 | 2010-05-26 | 精伦电子股份有限公司 | Chip heat radiation device |
| DE202011107726U1 (en) * | 2011-11-10 | 2011-12-19 | Askey Computer Corp. | Heat dissipating housing unit for a communication device |
| CN106921289A (en) * | 2017-05-04 | 2017-07-04 | 张家港市江南科技有限公司 | A kind of heat-dissipating casing |
| CN210119749U (en) * | 2019-06-27 | 2020-02-28 | 研祥智能科技股份有限公司 | Heat dissipation device and notebook computer |
| CN210166721U (en) * | 2019-09-07 | 2020-03-20 | 苏州艾控电子科技有限公司 | Totally-enclosed dustproof heat dissipation industrial computer |
| CN210166695U (en) * | 2019-06-07 | 2020-03-20 | 苏州艾控电子科技有限公司 | Heat conduction piece integral type industrial computer machine case |
| CN210691218U (en) * | 2019-12-27 | 2020-06-05 | 艾讯科技(深圳)有限公司 | High dustproof high-efficient heat dissipation industrial computer |
| CN212660439U (en) * | 2020-09-16 | 2021-03-05 | 研祥智能科技股份有限公司 | Closed cabinet |
-
2020
- 2020-09-16 CN CN202010976763.5A patent/CN111970880A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3150523U (en) * | 2009-03-03 | 2009-05-21 | 奇▲こう▼科技股▲ふん▼有限公司 | Communication device case heat dissipation device |
| CN201490181U (en) * | 2009-07-29 | 2010-05-26 | 精伦电子股份有限公司 | Chip heat radiation device |
| DE202011107726U1 (en) * | 2011-11-10 | 2011-12-19 | Askey Computer Corp. | Heat dissipating housing unit for a communication device |
| CN106921289A (en) * | 2017-05-04 | 2017-07-04 | 张家港市江南科技有限公司 | A kind of heat-dissipating casing |
| CN210166695U (en) * | 2019-06-07 | 2020-03-20 | 苏州艾控电子科技有限公司 | Heat conduction piece integral type industrial computer machine case |
| CN210119749U (en) * | 2019-06-27 | 2020-02-28 | 研祥智能科技股份有限公司 | Heat dissipation device and notebook computer |
| CN210166721U (en) * | 2019-09-07 | 2020-03-20 | 苏州艾控电子科技有限公司 | Totally-enclosed dustproof heat dissipation industrial computer |
| CN210691218U (en) * | 2019-12-27 | 2020-06-05 | 艾讯科技(深圳)有限公司 | High dustproof high-efficient heat dissipation industrial computer |
| CN212660439U (en) * | 2020-09-16 | 2021-03-05 | 研祥智能科技股份有限公司 | Closed cabinet |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2013197405A (en) | Electronic control device | |
| WO2018076396A1 (en) | Active heat dissipation type led display screen panel | |
| US9867313B2 (en) | Transmitter and electronic device | |
| US20190045674A1 (en) | Electromagnetic shielding structure and electronic device having the same | |
| WO2019163528A1 (en) | Electrical junction box | |
| CN112074112B (en) | Electronic equipment and extension assembly | |
| CN212660439U (en) | Closed cabinet | |
| JP2018160962A (en) | Inverter device | |
| JP2001168560A (en) | Electronic circuit unit | |
| JP2021504942A (en) | Centerboard unit and unmanned aerial vehicle | |
| CN111970880A (en) | Closed cabinet | |
| JP2016174488A (en) | Electric power conversion system | |
| CN208029221U (en) | A kind of lightweight shell enhancing shielding for unmanned plane figure transmission module and reinforce radiating | |
| CN211128745U (en) | Motor controller | |
| CN212341791U (en) | Memory dustproof heat dissipation device and CPU server | |
| KR101278633B1 (en) | Heat dissipation system for a server | |
| JP6514795B2 (en) | Electronic control unit | |
| CN211607093U (en) | Shell of controller | |
| JP2017151381A (en) | Display device | |
| CN213818775U (en) | Shielding case with good heat dissipation performance | |
| CN218526633U (en) | Heat dissipation box and have its bathroom heater | |
| JP2000252657A (en) | Heat dissipation unit for control apparatus | |
| CN213073424U (en) | Gate inhibition machine | |
| CN218100144U (en) | Computer with a memory card | |
| CN219247880U (en) | Access switch for wind power control system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20230627 Address after: 518057 1701, Yanxiang science and technology building, 31 Gaoxin middle Fourth Road, Maling community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Applicant after: Yanxiang smart IOT Technology Co.,Ltd. Address before: No.1, Yanxiang Zhigu chuangxiangdi, No.11, Gaoxin Road, Guangming New District, Shenzhen, Guangdong 518107 Applicant before: EVOC INTELLIGENT TECHNOLOGY Co.,Ltd. |