CN111902237B - 用于在热脆性基板上固化焊膏的方法 - Google Patents

用于在热脆性基板上固化焊膏的方法 Download PDF

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CN111902237B
CN111902237B CN201880086970.4A CN201880086970A CN111902237B CN 111902237 B CN111902237 B CN 111902237B CN 201880086970 A CN201880086970 A CN 201880086970A CN 111902237 B CN111902237 B CN 111902237B
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solder paste
absorbing layer
brittle substrate
light
light absorbing
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CN111902237A (zh
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R·J·亨德里克斯
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NCC Nano LLC
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NCC Nano LLC
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • H05K2201/01—Dielectrics
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    • H05K2201/0104—Properties and characteristics in general
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Abstract

本申请公开了一种用于在热脆性基板上固化焊膏的方法。该方法包括：将光反射层和光吸收层印刷在热脆性基板上；在该光反射层和该光吸收层上选择性地沉积多个导电迹线；然后在与该光吸收层的位置相对应的选择性位置上施加焊膏；在将组件放置在该焊膏上之后，从一侧对该热脆性基板照射均匀的脉冲光。该光吸收层吸收该脉冲光并被加热，随后该热量通过热传导传递至该焊膏和该组件，以加热和熔化该焊膏。

Description

用于在热脆性基板上固化焊膏的方法
技术领域
本发明总体上涉及固化过程，尤其涉及一种使用脉冲光在热脆性基板上固化焊膏的方法。
背景技术
在印刷电子领域，当前的趋势是不再将基于陶瓷、玻璃或环氧纤维玻璃的电路板(例如FR4)作为基板材料，而是考虑到降低成本和外形灵活等因素而日渐趋于相对便宜的基板。但是，新的基板材料(例如PEN、PET、聚碳酸酯和纸)比之前的材料显得更易碎。当需要高温来处理薄膜或将离散的组件粘附到基板上时，这可能会导致问题出现。例如，把多个组件焊接到热脆性基板上的过程将变得非常困难，因为处理常规焊料需要的温度比那些热脆性基板能够承受的温度要高得多。
本公开提供了一种用于在热脆性基板上固化焊膏的改进方法。
发明内容
根据优选实施例，将光反射层和光吸收层印刷在热脆性基板上。多个导电迹线选择性地沉积在该光反射层和光吸收层上。接着，将焊膏施加在与光吸收层的位置相对应的选择性位置上。在将组件放置在焊膏上之后，用均匀的脉冲光从一侧照射该基板。光吸收层吸收该脉冲光并被加热，随后热量通过热传导传递到焊膏和组件，以加热和熔化该焊膏。
在以下详细的书面描述中，本发明的所有特征和优点将变得显而易见。
附图说明
当结合附图阅读时，通过参考以下对示例性实施例的详细描述，将能最好地理解本发明本身及其优选的使用方式、以及其他目的和优点，其中：
图1A-图1D描绘了根据第一实施例的使用脉冲光在热脆性基板上固化焊膏的方法；和
图2A-图2E描绘了根据第二实施例的使用脉冲光在热脆性基板上固化焊膏的方法。
具体实施方式
当使用热脆性基板作为电路板时，需要克服的一个主要障碍是芯片连接。通常，将芯片粘附到热脆性基板上只有两种方法。第一种方法是使用低温焊料来粘附组件，第二种方法是使用导电环氧树脂来粘附组件。第一种方法的问题在于，低温焊料的性能远不如高温常规焊料的性能强健，并且热循环将可能导致低温焊料破裂。第二种方法的问题则是其成本会比使用常规焊料更昂贵。此外，导电环氧树脂的机械性更脆弱，并且第二种方法中使用的导电粘合剂的电阻率比低温焊料差得多。因此，由于性能低和/或成本高，上述两种方法都不是优选的。
一般而言，优选使用标准的兼容于《关于限制在电子电气设备中使用某些有害成分的指令》(RoHS)规定的焊料，例如Sn 96.5/Ag 3.0/Cu 0.5合金或Sn 96.5/Ag 3.5合金。这些焊料的液相线温度约为219℃。典型的烤箱回流焊接温度条件是在200℃以上的温度下保持5分钟。不幸的是，烤箱回流焊接技术无法使用热脆性基板(例如PEN(最高工作温度为180℃)、PET(最高工作温度为150℃)、聚碳酸酯(最高工作温度为115-130℃)或纸(最高工作温度为150℃))。
过去，光子固化技术已被用于在热脆性基板上处理薄膜。基本上，短脉冲光所具有的较高温度和较低热预算的组合可用于处理薄膜而不会损坏热脆性基板。现在，光子固化技术具有减轻在热脆性基板上热处理焊膏的问题的潜力。从理论上讲，可以在很短的时间内加热焊料，以使热脆性基板也可以加热至超过其最大的工作温度。然而，实际上，这不能解决上述问题，因为光子固化技术通常适用于在相对较厚的基板上处理薄膜。在光子固化技术中热脆性基板上的薄膜被闪光灯发出的脉冲光以非常快的速度加热到超过通常不至于损坏热脆性基板的温度。经过脉冲光加热之后，薄膜将通过由薄膜到热脆性基板的热传导而迅速冷却。这是可能实现的，因为热脆性基板比薄膜厚得多，并且具有比薄膜更大的热质量。热脆性基板的较大热质量和热量从薄膜到热脆性基板的热传导相结合，可通过最大限度地减少在高温下花费的时间来帮助防止对热脆性基板造成损害，即使峰值温度通常高于热脆性基板公布的最高工作温度。
然而，在附接组件的情况下，这些组件以及焊膏通常比热脆性基板厚。因此，用脉冲光对这些组件进行焊接所需能量的量也将在该过程中扭曲该热脆性基板。例如，加工焊膏所需的辐射量为3至30J/cm2之间。能量的该量值通常高于大多数导电迹线的损坏阈值，这些导电迹线会吸收闪光灯的一些脉冲光，从而沉积在热脆性基板上。发生这种情况时，导电迹线可能会变热，并可能在导电迹线下方或附近烧蚀或局部扭曲该热脆性基板。此外，快速加热会释放焊膏中的挥发物，从而导致焊膏的内聚被破坏。换句话说，快速加热产生的气体会使焊膏爆炸，并且无法建立起良好的焊接连接。
使用来自闪光灯的脉冲光来加热焊膏的另一个问题是，不同面积和厚度的组件需要不同的辐射照射。由于半导体组件是导热的，因此需要将其加热到与需要加热焊膏相同的温度，因为它们的导热率远高于基板的导热率。这意味着不同厚度或面积的组件因其热质量不同而需要不同的辐射照射量。当不同尺寸的组件位于同一基板上时，不可能同时固化所有焊料连接，而不过度固化某些焊料且其他焊料又不会固化不足。
为了解决与光子固化技术相关的上述问题，本发明提供了一种用于将电子组件焊接到热脆性基板上的改进方法。
现在参考附图，特别是参考图1A-图1D，其示出了根据第一实施例的使用脉冲光在热脆性基板上固化焊膏的方法。首先，如图1A所示，将光反射层11和光吸收层12选择性地印刷在热脆性基板10上。光吸收层12的位置对应于将被用于连接到组件的焊膏的未来位置。优选地，该热脆性基板10是光学透明的，其可以是PEN、PET、聚碳酸酯或纸。
接下来，如图1B所示，将多个导电迹线15选择性地沉积在光反射层11和光吸收层12上。然后如图1C所示，将焊膏16a-16d施加到对应于光吸收层12的位置。例如，焊膏16a位于光吸收层12a的上方、焊膏16b位于光吸收层12b的上方、焊膏16c位于光吸收层12c的上方、以及焊膏16d位于光吸收层12d的上方。
在将组件18a放置在焊膏16a、16b上并且将组件18b放置在焊膏16c、16d上之后，如图1D所示，使用均匀的脉冲光自热脆性基板10的底部(非组件侧)照射整个结构。光反射层11反射该脉冲光，而光吸收层12吸收脉冲光并被加热。该热量随后经由热传导传递到焊膏16a-16d和组件18a、18b，以对焊膏16a-16d进行加热，从而熔化焊膏16a-16d。
即使组件18a和18b具有不同的尺寸并且需要不同量的能量，也可以向每个焊膏16a-16d传递精确量的能量。这是由位于焊膏16a-16d下面的各个光吸收层12的各种尺寸来控制的。另外，通常会被烧蚀或加热到足以使它们的温度扭曲基板10的导电迹线15将由光反射层11保护。
现在参考图2A-图2E，其示出了根据第二实施例的使用脉冲光在热脆性基板上固化焊膏的方法。类似于第一实施例，如图2A所示，将光反射层21和光吸收层22选择性地印刷在热脆性基板20上。光吸收层22的位置对应于将被用于连接到组件的焊膏的未来位置。优选地，该热脆性基板20是光学透明的，其可以是PEN、PET、聚碳酸酯或纸。
接下来，如图2B所示，将多个导电迹线25选择性地沉积在光反射层21和光吸收层22上。然后如图2C所示，将焊膏26a-26d施加到对应于光吸收层22的位置。然后如图2D所示，将第二光反射层23沉积在照射的(未被焊膏覆盖的)导电迹线25上和照射的(未被焊膏覆盖的)光反射层21上。
在将组件28a放置在焊膏26a、26b上并且将组件28b放置在焊膏26c、26d上之后，如图2E所示，使用均匀的脉冲光自顶部和底部照射整个结构。光反射层21和23反射脉冲光，而光吸收层22吸收脉冲光并被加热。该热量随后经由热传导传递到焊膏26a-26d和组件28a、28b，以对焊膏26a-26d进行加热，从而熔化焊膏26a-26d。
在图1A-图1D所示的第一实施例中，光反射层11不需要选择性地施加。可以简单地将其涂覆在基板10和光吸收层12上。当用脉冲光加热光吸收层12时，来自光吸收层12的热量将传导通过光反射层11以加热焊膏15。在图2A-图2E所示的第二实施例中，在面向光反射层11的基板10上也是如此。在第二实施例中，组件28A-28B用作堆叠的顶面侧上的吸收剂，以加热焊膏26a-26d。
如前所述，本发明提供了一种改进的方法，该方法通过将一个或多个印刷掩膜施加到热脆性基板上以允许选择性地吸收来自闪光灯的脉冲光，从而在空间上调节从闪光灯发出的辐射照射，以选择性地加热焊膏而不会损坏相邻的结构或热脆性基板。可以使用相同的脉冲光将大小和厚度不同的组件连接到热脆性基板上。整个过程可以在一秒钟之内完成。除了固化焊膏外，本发明的方法还可用于热固化多种材料，例如导电环氧树脂、粘合剂或其他材料。
本发明方法的一个优点是标准的RoHS兼容焊料可以与热脆性基板一起使用。本发明方法的另一个优点是不需要光固化源的配准(registration)。配准由印刷的掩膜提供。
尽管已经参照优选实施例具体示出和描述了本发明，但是本领域技术人员将理解，在不脱离本发明的精神和范围的情况下，可以在形式和细节上进行各种改变。

Claims (21)

1.一种用于在热脆性基板上固化焊膏的方法，所述方法包括：
将光反射层和光吸收层印刷在热脆性基板上；
在所述光反射层和所述光吸收层上选择性地沉积多个导电迹线；
在与所述光吸收层的位置相对应的选择性位置上施加焊膏；
将组件放置在所述焊膏上；以及从底部对所述热脆性基板照射均匀的脉冲光，其中，所述光吸收层吸收所述脉冲光并被加热，热量随后通过热传导传递至所述焊膏和所述组件，以熔化所述焊膏。
2.根据权利要求1所述的方法，其特征在于，所述光吸收层的位置对应于将被用于连接至所述组件的所述焊膏的位置。
3.根据权利要求1所述的方法，其特征在于，所述热脆性基板是光学透明的。
4.根据权利要求1所述的方法，其特征在于，所述热脆性基板是PEN。
5.根据权利要求1所述的方法，其特征在于，所述热脆性基板是PET。
6.根据权利要求1所述的方法，其特征在于，所述热脆性基板是聚碳酸酯。
7.根据权利要求1所述的方法，其特征在于，所述热脆性基板是纸。
8.根据权利要求1所述的方法，其特征在于，所述光吸收层的面积与所述组件的热质量和所述焊膏的热质量成正比。
9.根据权利要求1所述的方法，其特征在于，所述焊膏符合RoHS指令的要求。
10.根据权利要求1所述的方法，其特征在于，用于处理所述焊膏的所述脉冲光的能量在3至30J/cm2之间。
11.一种用于在热脆性基板上固化焊膏的方法，所述方法包括：
将第一光反射层和光吸收层印刷在热脆性基板上；
在所述光反射层和所述光吸收层上选择性地沉积多个导电迹线；
在与所述光吸收层的位置相对应的选择性位置上施加焊膏；
在所述导电迹线上和所述光吸收层上选择性地沉积第二光反射层；
将组件放置在所述焊膏上；以及
从顶部和底部对所述热脆性基板照射均匀的脉冲光，其中，所述光吸收层和所述组件吸收所述脉冲光并被加热，热量随后通过热传导传递至所述焊膏，以熔化所述焊膏。
12.根据权利要求11所述的方法，其特征在于，所述光吸收层的位置对应于将被用于连接到所述组件的所述焊膏的位置。
13.根据权利要求11所述的方法，其特征在于，所述热脆性基板是光学透明的。
14.根据权利要求11所述的方法，其特征在于，所述热脆性基板是PEN。
15.根据权利要求11所述的方法，其特征在于，所述热脆性基板是PET。
16.根据权利要求11所述的方法，其特征在于，所述热脆性基板是聚碳酸酯。
17.根据权利要求11所述的方法，其特征在于，所述热脆性基板是纸。
18.根据权利要求11所述的方法，其特征在于，所述光吸收层的面积与所述组件的热质量和所述焊膏的热质量成正比。
19.根据权利要求11所述的方法，其特征在于，所述焊膏符合RoHS指令的要求。
20.根据权利要求11所述的方法，其特征在于，用于处理所述焊膏的所述脉冲光的能量在3至30J/cm2之间。
21.一种用于在热脆性基板上固化焊膏的方法，所述方法包括：
将光反射层和光吸收层印刷在热脆性基板上；
在所述光反射层和所述光吸收层上选择性地沉积多个导电迹线；
在与所述光吸收层的位置相对应的选择性位置上施加导电环氧树脂；
将组件放置在所述导电环氧树脂上；以及
从一侧对所述热脆性基板照射均匀的脉冲光，其中，所述光吸收层吸收所述脉冲光并被加热，热量随后通过热传导传递至所述导电环氧树脂和所述组件，以熔化所述导电环氧树脂。
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