CN111883455A - Rotary table type automatic sorting and assembling equipment and method for chip elements with semiconductor refrigerating sheets - Google Patents
Rotary table type automatic sorting and assembling equipment and method for chip elements with semiconductor refrigerating sheets Download PDFInfo
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- CN111883455A CN111883455A CN202010492602.9A CN202010492602A CN111883455A CN 111883455 A CN111883455 A CN 111883455A CN 202010492602 A CN202010492602 A CN 202010492602A CN 111883455 A CN111883455 A CN 111883455A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 26
- 238000005452 bending Methods 0.000 claims abstract description 19
- 238000005520 cutting process Methods 0.000 claims abstract description 19
- 238000005057 refrigeration Methods 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 5
- 238000012546 transfer Methods 0.000 claims description 30
- 239000003292 glue Substances 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000007599 discharging Methods 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 5
- 230000000712 assembly Effects 0.000 claims description 4
- 238000000429 assembly Methods 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 claims description 3
- 238000009417 prefabrication Methods 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims 2
- 238000003756 stirring Methods 0.000 claims 1
- 238000013461 design Methods 0.000 abstract description 2
- 238000003892 spreading Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
Abstract
The invention relates to a rotary table type automatic sorting and assembling device and a rotary table type automatic sorting and assembling method for chip elements with semiconductor refrigerating sheets, which are used for respectively bonding a first chip accessory and a second chip accessory on the semiconductor refrigerating sheets and connecting the first chip accessory and the second chip accessory into an integrated chip element through a bolt piece and a nut piece; comprises a frame assembly. A chip component automatic assembly method comprises the steps of firstly, respectively feeding a first chip accessory and a second chip accessory; then, bending is respectively carried out; secondly, respectively cutting and leveling; thirdly, feeding the materials into a turntable; gluing the first chip assembly and the second chip assembly; later, the semiconductor refrigeration piece is bonded and the bolt piece is installed; secondly, feeding the nut piece into the nut piece and connecting the nut piece and the bolt piece into a whole; and outputting the finished product. The invention has the advantages of reasonable design, low cost, firmness, durability, safety, reliability, simple operation, time and labor saving, capital saving, compact structure and convenient use.
Description
Technical Field
The invention relates to a turntable type automatic sorting and assembling device and method for chip elements with semiconductor refrigerating sheets.
Background
High-precision process and system are needed for assembling and manufacturing chip accessories, but the existing accessories generally radiate heat through aluminum alloy radiating fins, but the radiating effect is poor, the occupied area is large, and the ventilation effect is poor. How to realize improving current heat dissipation technology, go on going up unloading, bonding, technology such as pile up neatly becomes the technical problem that needs to solve urgently with radiator unit and accessory.
Particularly, the problems are solved by the current reasonable technical scheme which is easy to deform and thin in wall thickness.
Disclosure of Invention
The invention aims to solve the technical problem of providing a turntable type automatic sorting and assembling device and method for chip elements with semiconductor refrigerating sheets.
In order to solve the problems, the technical scheme adopted by the invention is as follows:
a chip element turntable type automatic sorting and assembling device with a semiconductor refrigerating piece is used for respectively bonding a first chip fitting and a second chip fitting on the semiconductor refrigerating piece and connecting the first chip fitting and the second chip fitting into an integrated chip element through a bolt piece and a nut piece; comprises a frame assembly.
A chip component automatic assembly method with semiconductor refrigeration chip, at first, carry on the material loading to the first chip fittings and second chip fittings separately; then, bending is respectively carried out; secondly, respectively cutting and leveling; thirdly, feeding the materials into a turntable; gluing the first chip assembly and the second chip assembly; later, the semiconductor refrigeration piece is bonded and the bolt piece is installed; secondly, feeding the nut piece into the nut piece and connecting the nut piece and the bolt piece into a whole; and outputting the finished product.
The invention has the advantages of reasonable design, low cost, firmness, durability, safety, reliability, simple operation, time and labor saving, capital saving, compact structure and convenient use.
Drawings
FIG. 1 is a schematic view of the use structure of the clamping fixture of the present invention;
FIG. 2 is a schematic structural view of the present invention;
FIG. 3 is a schematic structural view of a feeding system of the present invention;
FIG. 4 is a schematic view of another aspect of the loading system of the present invention;
FIG. 5 is a schematic view of the foot-making use configuration of the present invention;
FIG. 6 is a schematic view of the feed configuration of the present invention;
FIG. 7 is a schematic illustration of a relay structure according to the present invention;
FIG. 8 is a schematic view of the glue application structure of the present invention;
FIG. 9 is a schematic view of the assembled use configuration of the present invention;
FIG. 10 is a schematic diagram of an output use configuration of the present invention;
wherein: 1. a semiconductor refrigeration sheet; 2. a first chip fitting; 3. a second chip fitting; 4. a bolt member; 5. a nut member; 6. a first feeding system; 7. a second feeding system; 8. a pin making device; 9. rotating the station disc; 10. a station mould; 11. a mould positioning opening; 12. a mould block; 13. a mould telescopic rod; 14. a lower guide hole of the mould; 15. pushing the inclined plane backwards by the mould; 16. a first feeding station; 17. a second feeding station; 18. a gluing station; 19. a bonding station; 20. a first assembly station; 21. a second assembly station; 22. an output station; 23. outputting an opening wedge; 24. a feeding falling channel; 25. a feeding transverse outlet; 26. a feeding clamping pin piece; 27. a feeding ejector pin push rod; 28. a feeding and pin dropping channel; 29. a feeding and discharging guide channel; 30. the feeding rotating ratchet wheel bracket; 31. a feeding indexing swing arm; 32. the pawl is driven by feeding indexing; 33. a feeding indexing driving rod; 34. a feeding transfer station; 35. a feeding transverse push rod; 36. a foot-making device; 37. a foot-making longitudinal moving frame; 38. a foot-making pushing baffle; 39. manufacturing a foot expansion spring; 40. a foot making inlet station; 41. a foot-making bending station; 42. a foot making and cutting station; 43. a foot making outlet station; 44. preparing an underfoot forming pressure head; 45. manufacturing an underfoot forming die; 46. preparing a foot pressing head; 47. manufacturing a foot lower cutter; 48. feeding into a manipulator; 49. feeding into a moving frame; 50. feeding into a suction nozzle A; 51. feeding into a suction nozzle B; 52. feeding into a side-push wedge; 53. a second transfer indexing bracket; 54. a second transfer inlet/outlet; 55. a second transfer positioning port; 56. a gluing brush head; 57. a gluing cleaning roller; 58. the nut vibrates the feeding assembly; 59. the upper end of the nut is hollow; 60. processing a screw driver by using a nut; 61. and outputting the sucker manipulator.
Detailed Description
As shown in fig. 1 to 10, the turntable type automatic sorting and assembling apparatus for chip components with semiconductor chilling plates of the present embodiment is used for respectively bonding a first chip fitting part 2 and a second chip fitting part 3 on a semiconductor chilling plate 1 and connecting the first chip fitting part and the second chip fitting part into an integrated chip component through a bolt member 4 and a nut member 5; comprises a frame assembly.
On the machine frame assembly, the machine frame assembly is provided with a machine frame,
a first feeding system 6 for feeding the first chip assemblies 2 one by one; sorting the parts by estimating and conveying the parts one by one;
a second feeding system 7 for conveying the second chip assemblies 3 one by one; sorting the parts by estimating and conveying the parts one by one;
the pin manufacturing device 8 is used for bending, aligning and cutting pins of the first chip accessory 2 or the second chip accessory 3;
the rotary station disc 9 is provided with a first feeding station 16 and/or a second feeding station 17, a gluing station 18, a bonding station 19, a first assembling station 20 and/or a second assembling station 21 and an output station 22;
a first feed-in station 16, which receives the feed-in of the first chip fitting 2;
a second feeding station 17 for receiving the feeding of the second chip component 3;
a glue application station 18 for applying glue to the upper surface of the first chip part 2 or the second chip part 3;
the bonding station 19 is used for manually or mechanically bonding the semiconductor refrigeration piece 1 of the prefabricated bolt piece 4 to the upper surface of the first chip assembly 2 or the second chip assembly 3; the bolt member 4 is inserted under the first chip fitting 2 or the second chip fitting 3 and exposed from the lower end;
a first assembling station 20 for connecting the nut member 5 with the bolt member 4;
a second assembling station 21 for connecting the nut member 5 with the bolt member 4;
an output station 22 that outputs the chip components mounted with the nut members 5;
each of the units has a station mold 10; a mould positioning opening 11 is formed in the station mould 10, mould stop blocks 12 are respectively arranged on at least two sides of the mould positioning opening 11, and mould telescopic rods 13 used for pushing a first assembly station 20 or a second assembly station 21 to the side surfaces of the corresponding mould stop blocks 12 are respectively arranged on at least the other side of the mould positioning opening 11;
a lower mould guide hole 14 is arranged on the station mould 10, and a mould rear push inclined plane 15 with a through hole and a mould corresponding to the lower mould guide hole 14 is arranged on the mould telescopic rod 13; a return spring is arranged between the mould telescopic rod 13 and the station mould 10;
the mold expansion link 13 is moved away from the corresponding first chip fitting 2 or second chip fitting 3 by pressing down the mold and pushing the slope 15 backward.
The first feeding system 6 and the second feeding system 7 have the same structure, the first feeding system 6 comprises a feeding falling channel 24 pre-loaded with a first chip fitting 2, a feeding transverse outlet 25 is arranged at the lower outlet of the feeding falling channel 24, a feeding clamping pin 26 is transversely inserted into the feeding transverse outlet 25 and used for blocking the first chip fitting 2 which is not output, a feeding ejector pin push rod 27 is arranged at one side of the feeding transverse outlet 25, a feeding falling pin channel 28 used for receiving the feeding clamping pin 26 is arranged at the other side of the feeding transverse outlet 25, and the feeding ejector pin push rod 27 transversely pushes the feeding ejector pin push rod 27 into the feeding falling pin channel 28 to open the feeding falling channel 24;
a plurality of feeding falling channels 24 are circumferentially distributed on a feeding rotating ratchet wheel bracket 30 arranged on the rack assembly;
a feeding outlet guide channel 29 is arranged below the opened feeding falling channel 24 and receives the falling first chip fitting 2;
the root part of a feeding indexing swing arm 31 is sleeved on the feeding rotary ratchet bracket 30, and a feeding indexing driving pawl 32 for unidirectionally shifting the feeding rotary ratchet bracket 30 is arranged on the outer head part of the feeding indexing swing arm 31; the outer head part of the feeding indexing swing arm 31 is connected with a feeding indexing driving rod 33;
a feeding transfer station 34 is arranged at the lower output end of the feeding and discharging guide channel 29;
a feeding transverse push rod 35 is arranged at one transverse end of the feeding transfer station 34 and used for pushing the first chip fitting 2 out of the feeding transfer station 34 and sending the first chip fitting to the foot making device 36;
the foot-making device 36 comprises a foot-making longitudinal moving frame 37 arranged in the rack assembly track; a foot-making pushing baffle 38 which is arranged in a lifting way is connected to the foot-making longitudinal moving frame 37 through a foot-making telescopic spring 39; the upper end of the foot-making pushing baffle 38 has an inclined back surface;
the pin making longitudinal moving frame 37 drives the first chip fitting 2 or the second chip fitting 3 output by the feeding transfer station 34 to move among a pin making inlet station 40, a pin making bending station 41, a pin making cutting station 42 and a pin making outlet station 43 of the rack assembly in sequence;
a foot making bending station 41 is provided with a foot making forming pressure head 44 for pressing down the first chip fitting 2 or the second chip fitting 3 for prefabrication and a foot making forming die 45 supported below;
a pin making pressing head 46 for pressing the bent first chip fitting 2 or second chip fitting 3 and a pin making cutter 47 for cutting the pins of the first chip fitting 2 or second chip fitting 3 to be flush are arranged at the pin making cutting station 42;
a feeding mechanical arm 48 is arranged between the foot making outlet station 43 and the first feeding station 16 or the second feeding station 17, and a feeding moving frame 49 is arranged on the feeding mechanical arm 48; the feeding moving frame 49 is provided with a feeding suction nozzle A50 and a feeding suction nozzle B51; a feeding side push wedge 52 is arranged between the feeding suction nozzle A50 and the feeding suction nozzle B51;
the feeding side pushing wedge 52 is used for being inserted into the through hole through the lower mould guiding hole 14, pushing the mould to push the inclined plane 15 backwards, so that the mould telescopic rod 13 is separated from the first chip accessory 2 or the second chip accessory 3, and the feeding suction nozzle A50 and the feeding suction nozzle B51 can suck the first chip accessory 2 or the second chip accessory 3;
when the feeding direction of the second feeding system 7 has an angle, a second transfer indexing bracket 53 is arranged between the pin-making outlet station 43 and the second feeding station 17, and a second transfer positioning port 55 with a second transfer inlet/outlet 54 is arranged on the second transfer indexing bracket 53;
the in-feed nozzle a50 feeds the second chip component 3 from the pin-making exit station 43 into the relay positioning port 55, and the in-feed nozzle B51 feeds the second chip component 3 from the relay positioning port 55 into the second in-feed station 17;
a glue-spreading brush head 56 for spreading glue on the first chip part 2 or the second chip part 3 is arranged at the glue-spreading station 18, and a glue-spreading cleaning roller 57 for cleaning the glue-spreading brush head 56 is arranged at the glue-spreading station 18;
the first assembly station 20 and/or the second assembly station 21 are/is respectively connected with corresponding nut vibration feeding assemblies 58; the output end of the nut vibration feeding assembly 58 is provided with a nut upper end hollow support 59 so as to receive the corresponding nut piece 5; the nut upper end hollow bracket 59 is positioned below the first assembly station 20 and/or the second assembly station 21 and corresponds to the bolt piece 4;
an upper ejector rod is arranged below the hollow support 59 at the upper end of the nut so as to push the nut member 5 to the bolt member 4;
a nut processing screwdriver 60 is arranged above the first assembling station 20 and/or the second assembling station 21 so as to connect the screwed bolt piece 4 with the nut piece 5;
the carry-out station 22 has a carry-out suction cup robot 61, and the carry-out suction cup robot 61 is provided with a carry-out opening cam 23 having the same structure as the carry-in side pushing cam 52.
In the automatic assembly method of chip components of the present embodiment, first, the first chip component 2 and the second chip component 3 are respectively loaded; then, bending is respectively carried out; secondly, respectively cutting and leveling; thirdly, feeding the materials into a turntable; subsequently, the first chip component 2 and the second chip component 3 are glued; later, the semiconductor refrigeration piece 1 is bonded and the bolt piece 4 is installed; secondly, feeding the nut member 5 and connecting the nut member and the bolt member 4 into a whole; and outputting the finished product.
An automated assembly line by means of chip components; the method specifically comprises the following steps;
step one, the first feeding system 6 conveys the first chip fittings 2 one by one, and the second feeding system 7 conveys the second chip fittings 3 one by one;
step two, the pin manufacturing device 8 bends the pins of the first chip accessory 2 or the second chip accessory 3, aligns and cuts the pins;
thirdly, receiving the feeding of the first chip fittings 2 through the first feeding station 16, and receiving the feeding of the second chip fittings 3 through the second feeding station 17;
gluing the upper surface of the first chip assembly 2 or the second chip assembly 3 through a gluing station 18;
firstly, manually or mechanically bonding the semiconductor refrigeration sheet 1 of the prefabricated bolt piece 4 on the upper surface of the first chip fitting 2 or the second chip fitting 3 at a bonding station 19; then, the bolt member 4 is inserted under the first chip fitting 2 or the second chip fitting 3 and exposed from the lower end;
step six, connecting the nut member 5 with the bolt member 4 at a first assembling station 20 and a second assembling station 21;
and step seven, outputting the chip elements provided with the nut members 5 at the output station 22.
In step one, first, the loading ejector pin push rod 27 is pushed laterally into the loading drop pin passage 28 by the loading ejector pin push rod 27 to open the loading drop passage 24; then, the feeding and discharging guide channel 29 receives the first chip fitting 2 falling and sends the first chip fitting to the feeding transfer station 34; secondly, after one group of feeding falling channels 24 is emptied, the feeding indexing driving rod 33 drives the feeding indexing swing arm 31 to drive the feeding indexing driving pawl 32 to swing, and the feeding rotating ratchet bracket 30 is driven in a single direction, so that the next group of feeding falling channels 24 is rotated to be above the feeding outlet guide channel 29; thirdly, the feeding transverse push rod 35 pushes the first chip fitting 2 out of the feeding transfer station 34 and sends the first chip fitting 2 to the foot making inlet station 40, the foot making longitudinal moving frame 37 drives the first chip fitting 2 to move forwards in sequence among the foot making inlet station 40, the foot making bending station 41, the foot making cutting station 42 and the foot making outlet station 43, and the reverse resetting of the foot making longitudinal moving frame 37 is realized by utilizing the oblique back surface and the foot making telescopic spring 39;
step two, firstly, at the pin-making bending station 41, the pin-making forming press head 44 and the pin-making forming die 45 are matched to bend and form the pins of the first chip accessory 2; afterwards, at a pin-making cutting station 42, a pin-making lower pressure head 46 presses down the bent and formed pin, and a pin-making lower cutter 47 cuts the pin to be flush; thereafter, the feeding robot 48 feeds the first chip assembly 2 from the footer outlet station 43 to the first feeding station 16, and when the feeding direction of the second feeding system 7 is angled, the feeding suction nozzle a50 feeds the first chip assembly 2 from the footer outlet station 43 to the intermediate positioning port 55; then, the feeding suction nozzle B51 sucks the first chip fitting 2 to be fed from the transfer positioning port 55 to the first feeding station 16, and meanwhile, the feeding side pushing wedge 52 is inserted into the through hole downwards through the lower guiding hole 14 of the clamping fixture, so as to push the clamping fixture to push the inclined surface 15 backwards, and the telescopic rod 13 of the clamping fixture is separated from the first chip fitting 2;
in step four, first, at the glue station 18, the glue brush head 56 glues the first chip part 2 or the second chip part 3; then, the glue brush head 56 is cleaned by a glue cleaning roller 57;
in the sixth step, firstly, the nut vibration feeding assembly 58 outputs the nut piece 5 to the hollow support 59 at the upper end of the nut and receives the nut piece; then, the nut member 5 is pushed against the bolt member 4 by the upper ejector rod; secondly, a nut processing screwdriver 60 screws the bolt member 4 to be connected with the nut member 5;
in the seventh step, firstly, the output opening wedge 23 is opened to enable the mold telescopic rod 13 to be far away from the corresponding first chip fitting 2 and second chip fitting 3; then, the output chuck robot 61 takes out the finished product.
The semiconductor refrigeration piece is loaded on the first chip fitting part 2 and the second chip fitting part 3, and is connected with the nut part 5 into a whole through the bolt part 4, so that the semiconductor refrigeration piece is efficient and intelligent, and is particularly suitable for easily deformed or thin-walled parts.
The basic structure of the first feeding system 6 is the same as that of the second feeding system 7, a pin manufacturing device 8 bends a diode and other sheet-shaped parts with pins and cuts the pins to be flush, a working procedure connection is realized by rotating a working position disc 9, a working position clamping tool 10 serves as a carrier for connection of all working positions to realize passive clamping of a workpiece, a clamping tool positioning opening 11 and a clamping tool blocking position block 12 realize clamping, a clamping tool telescopic rod 13 realizes clamping of the workpiece, a clamping tool lower guide hole 14 facilitates insertion of a wedge and push the clamping tool to push an inclined plane 15, a first feeding working position 16, a second feeding working position 17, a gluing working position 18, a bonding working position 19, a first assembling working position 20, a second assembling working position 21 and an output working position 22 are clear. The feeding falling channel 24 realizes the pre-storage of workpieces, the feeding transverse outlet 25 outputs a feeding clamping pin 26, the feeding ejector pin push rod 27 moves transversely, the feeding pin falling channel 28 receives a discharged clamping pin, the feeding piece outlet guide channel 29 realizes guide output, the feeding rotating ratchet wheel bracket 30 is arranged in a rotating mode, the feeding indexing swing arm 31 swings, the feeding indexing driving pawl 32 realizes fixed-angle driving bracket rotation, the feeding indexing driving rod 33 provides unidirectional rotation power, the feeding transfer station 34 and the feeding transverse push rod 35 realize turning output of a single workpiece, the pin making device 36 has bending and cutting functions, the pin making longitudinal moving frame 37 realizes forward output by the pin making pushing baffle 38, descending by the pin making spring extension 39 and returning by an inclined plane, and the gluing cleaning roller 57 prevents glue heads from accumulating glue.
Claims (6)
1. The utility model provides a chip component revolving stage formula automatic sorting equipment with semiconductor refrigeration piece which characterized in that: the semiconductor refrigeration chip is characterized in that the semiconductor refrigeration chip (1) is respectively bonded with a first chip fitting part (2) and a second chip fitting part (3) and connected into a chip element through a bolt part (4) and a nut part (5) in an integrated manner; comprises a frame assembly.
2. The turret-type automatic assembly and sorting apparatus for chip components with semiconductor cooling plates as claimed in claim 1, wherein: on the machine frame assembly, the machine frame assembly is provided with a machine frame,
a first feeding system (6) for feeding the first chip parts (2) one by one;
a second feeding system (7) for conveying the second chip assemblies (3) one by one;
the pin manufacturing device (8) is used for bending, aligning and cutting pins of the first chip accessory (2) or the second chip accessory (3);
the rotary station disc (9) is provided with a first feeding station (16) and/or a second feeding station (17), a gluing station (18), a bonding station (19), a first assembling station (20) and/or a second assembling station (21) and an output station (22);
a first feeding station (16) for receiving the feeding of the first chip fitting (2);
a second feeding station (17) for receiving the feeding of the second chip fittings (3);
a gluing station (18) for gluing the upper surface of the first chip assembly (2) or the second chip assembly (3);
the bonding station (19) is used for manually or mechanically bonding the semiconductor refrigeration piece (1) of the prefabricated bolt piece (4) to the upper surface of the first chip fitting (2) or the second chip fitting (3); the lower part of the bolt piece (4) is inserted into the first chip fitting (2) or the second chip fitting (3) and then is exposed from the lower end;
a first assembly station (20) for connecting the nut member (5) with the bolt member (4);
a second assembly station (21) for connecting the nut member (5) with the bolt member (4);
an output station (22) for outputting the chip components mounted with the nut members (5);
each of the units is provided with a station clamping fixture (10); a mould positioning opening (11) is formed in the station mould (10), mould stop blocks (12) are arranged on at least two sides of the mould positioning opening (11) respectively, and mould telescopic rods (13) used for pushing the first assembly station (20) or the second assembly station (21) to the side face of the corresponding mould stop block (12) are arranged on at least the other side of the mould positioning opening (11) respectively;
a lower guide hole (14) of the mould is arranged on the station mould (10), and a through hole of which a mould rear pushing inclined plane (15) corresponding to the lower guide hole (14) of the mould is arranged on the telescopic rod (13) of the mould; a return spring is arranged between the mould telescopic rod (13) and the station mould (10);
the mould telescopic rod (13) is far away from the corresponding first chip accessory (2) or second chip accessory (3) by pressing down the mould and pushing the inclined plane (15) backwards.
3. The turret-type automatic assembly and sorting apparatus for chip components with semiconductor cooling plates as claimed in claim 1, wherein: the first feeding system (6) and the second feeding system (7) have the same structure, the first feeding system (6) comprises a feeding falling channel (24) pre-loaded with a first chip accessory (2), a feeding transverse outlet (25) is arranged at the lower outlet of the feeding falling channel (24), a feeding clamping pin piece (26) is transversely inserted into the feeding transverse outlet (25) and used for blocking the first chip accessory (2) which is not output, a feeding ejector pin push rod (27) is arranged on one side of the feeding transverse outlet (25), a feeding falling pin channel (28) used for bearing the feeding clamping pin piece (26) is arranged on the other side of the feeding transverse outlet (25), and the feeding ejector pin push rod (27) transversely pushes the feeding ejector pin push rod (27) into the feeding falling pin channel (28) to open the feeding falling channel (24);
a plurality of feeding falling channels (24) are circumferentially distributed on a feeding rotating ratchet wheel bracket (30) arranged on the rack assembly;
a feeding and discharging guide channel (29) is arranged below the opened feeding and dropping channel (24) and used for receiving the falling first chip fittings (2);
the root part of a feeding indexing swing arm (31) is sleeved on the feeding rotary ratchet wheel bracket (30), and a feeding indexing driving pawl (32) for unidirectionally stirring the feeding rotary ratchet wheel bracket (30) is arranged on the outer head part of the feeding indexing swing arm (31); a feeding indexing driving rod (33) is connected to the outer head part of the feeding indexing swing arm (31);
a feeding transfer station (34) is arranged at the lower output end of the feeding outlet guide channel (29);
a feeding transverse push rod (35) is arranged at one transverse end of the feeding transfer station (34) and used for pushing the first chip fitting (2) out of the feeding transfer station (34) and sending the first chip fitting to the foot making device (36);
the foot making device (36) comprises a foot making longitudinal moving frame (37) arranged in the rack assembly track; a foot-making pushing baffle (38) which is arranged in a lifting way is connected to the foot-making longitudinal moving frame (37) through a foot-making telescopic spring (39); the upper end of the foot-making pushing baffle (38) is provided with an inclined back surface;
the foot making longitudinal moving frame (37) drives the first chip accessory (2) or the second chip accessory (3) output by the feeding transfer station (34) to move among a foot making inlet station (40), a foot making bending station (41), a foot making cutting station (42) and a foot making outlet station (43) of the frame assembly in sequence;
a foot making bending station (41) is provided with a foot making lower forming pressure head (44) for pressing down the first chip accessory (2) or the second chip accessory (3) for prefabrication and a foot making lower forming die (45) supported below;
a pin making pressing head (46) for pressing down and bending the first chip fitting (2) or the second chip fitting (3) and a pin making lower cutter (47) for cutting the pins of the first chip fitting (2) or the second chip fitting (3) to be flush are arranged at the pin making cutting station (42);
a feeding mechanical arm (48) is arranged between the foot making outlet station (43) and the first feeding station (16) or the second feeding station (17), and a feeding moving frame (49) is arranged on the feeding mechanical arm (48); a feeding suction nozzle A (50) and a feeding suction nozzle B (51) are arranged on the feeding moving frame (49); a feeding-in side push wedge (52) is arranged between the feeding-in suction nozzle A (50) and the feeding-in suction nozzle B (51);
the feeding side pushing wedge (52) is used for being inserted into the through hole through the lower guide hole (14) of the mould, pushing the mould to push the inclined surface (15) backwards, so that the telescopic rod (13) of the mould is separated from the first chip accessory (2) or the second chip accessory (3), and the feeding suction nozzle A (50) and the feeding suction nozzle B (51) can suck the first chip accessory (2) or the second chip accessory (3);
when the feeding direction of the second feeding system (7) has an angle, a second transfer indexing bracket (53) is arranged between the pin-making outlet station (43) and the second feeding station (17), and a second transfer positioning port (55) with a second transfer inlet/outlet (54) is arranged on the second transfer indexing bracket (53);
the feeding suction nozzle A (50) feeds the second chip fittings (3) into the transfer positioning port (55) from the pin making outlet station (43), and the feeding suction nozzle B (51) feeds the second chip fittings (3) into the second feeding station (17) from the transfer positioning port (55);
a gluing brush head (56) used for gluing the first chip accessory (2) or the second chip accessory (3) is arranged at the gluing station (18), and a gluing cleaning roller (57) used for cleaning the gluing brush head (56) is arranged at the gluing station (18);
the first assembly station (20) and/or the second assembly station (21) are/is respectively connected with a corresponding nut vibration feeding assembly (58); a nut upper end hollow support (59) is arranged at the output end of the nut vibration feeding assembly (58) so as to be convenient for receiving a corresponding nut piece (5); the nut upper end hollow support (59) is positioned below the first assembly station (20) and/or the second assembly station (21) and corresponds to the bolt piece (4);
an upper ejector rod is arranged below the hollow support (59) at the upper end of the nut so as to eject the nut piece (5) to the bolt piece (4);
a nut processing screwdriver (60) is arranged above the first assembling station (20) and/or the second assembling station (21) so as to facilitate the connection of the screwing bolt piece (4) and the nut piece (5);
and the output station (22) is provided with an output sucker manipulator (61), and the output sucker manipulator (61) is provided with an output opening wedge (23) which has the same structure as the feeding side pushing wedge (52).
4. A chip element automatic assembly method with semiconductor refrigeration piece, its characteristic is: firstly, respectively feeding a first chip accessory (2) and a second chip accessory (3); then, bending is respectively carried out; secondly, respectively cutting and leveling; thirdly, feeding the materials into a turntable; subsequently, gluing the first chip assembly (2) and the second chip assembly (3); later, the semiconductor refrigeration piece (1) is bonded and the bolt piece (4) is installed; secondly, feeding the nut piece (5) and connecting the nut piece and the bolt piece (4) into a whole; and outputting the finished product.
5. The automatic assembling method of chip element with semiconductor chilling plate according to claim 4, wherein: automatic sorting and assembling equipment with the aid of a turntable of chip elements with semiconductor refrigerating sheets; the method specifically comprises the following steps;
step one, the first feeding system (6) conveys the first chip accessories (2) one by one, and the second feeding system (7) conveys the second chip accessories (3) one by one;
secondly, bending and aligning and cutting pins of the first chip accessory (2) or the second chip accessory (3) by the pin manufacturing device (8);
thirdly, receiving the feeding of the first chip fittings (2) through a first feeding station (16), and receiving the feeding of the second chip fittings (3) through a second feeding station (17);
gluing the upper surface of the first chip accessory (2) or the second chip accessory (3) through a gluing station (18);
firstly, manually or mechanically bonding the semiconductor refrigeration piece (1) of the prefabricated bolt piece (4) on the upper surface of the first chip fitting (2) or the second chip fitting (3) at a bonding station (19); then, inserting the bolt piece (4) into the first chip fitting (2) or the second chip fitting (3) and exposing the bolt piece from the lower end;
sixthly, connecting the nut member (5) with the bolt member (4) at a first assembly station (20) and a second assembly station (21);
and seventhly, outputting the chip element provided with the nut piece (5) at an output station (22).
6. The automatic assembling method of chip element with semiconductor chilling plate according to claim 5, wherein:
in the first step, firstly, the feeding ejector pin push rod (27) is transversely pushed into the feeding falling pin channel (28) through the feeding ejector pin push rod (27), and the feeding falling channel (24) is opened; then, the feeding and discharging guide channel (29) receives the falling first chip fittings (2) and sends the first chip fittings to a feeding transfer station (34); secondly, after one group of feeding falling channels (24) is emptied, a feeding indexing driving rod (33) drives a feeding indexing swing arm (31) to drive a feeding indexing driving pawl (32) to swing, and a feeding rotating ratchet wheel bracket (30) is driven in a single direction, so that the next group of feeding falling channels (24) is shifted to the upper part of a feeding outlet guide channel (29); thirdly, the first chip fitting (2) is pushed out of the feeding transfer station (34) by a feeding transverse push rod (35) and is sent to a foot making inlet station (40), a foot making longitudinal moving frame (37) drives the first chip fitting (2) to move forwards in sequence among the foot making inlet station (40), a foot making bending station (41), a foot making cutting station (42) and a foot making outlet station (43), and reverse resetting of the foot making longitudinal moving frame (37) is realized by utilizing an oblique back surface and a foot making telescopic spring (39);
step two, firstly, a pin-making bending station (41), a pin-making forming pressure head (44) and a pin-making forming die (45) are matched for bending and forming the pin of the first chip accessory (2); afterwards, a pin making cutting station (42) presses the bent and formed pin downwards by a pin making pressing head (46), and a pin making cutter (47) cuts the pin to be flush; afterwards, the feeding mechanical arm (48) feeds the first chip accessory (2) of the pin making outlet station (43) to the first feeding station (16), and when the feeding direction of the second feeding system (7) is angled, the feeding suction nozzle A (50) feeds the first chip accessory (2) from the pin making outlet station (43) to the transfer positioning opening (55); then, the feeding suction nozzle B (51) sucks the first chip accessory (2) from the transfer positioning port (55) to be fed to the first feeding station (16), meanwhile, the feeding side pushing wedge (52) downwards is inserted into the through hole through the lower guide hole (14) of the clamping fixture, the clamping fixture is pushed to push the inclined surface (15) backwards, and the telescopic rod (13) of the clamping fixture is separated from the first chip accessory (2);
in the fourth step, firstly, in a gluing station (18), a gluing brush head (56) glues the first chip assembly (2) or the second chip assembly (3); then, cleaning the gluing brush head (56) through a gluing cleaning roller (57);
in the sixth step, firstly, the nut vibrating and feeding assembly (58) outputs the nut piece (5) to a hollow support (59) at the upper end of the nut and receives the nut piece; then, the nut piece (5) is jacked to the bolt piece (4) by the upper jacking rod; secondly, a nut processing screwdriver (60) screws the bolt piece (4) to be connected with the nut piece (5);
in the seventh step, firstly, the output opening wedge (23) is opened to enable the mould telescopic rod (13) to be far away from the corresponding first chip accessory (2) and second chip accessory (3); then, the output chuck robot (61) takes out the finished product.
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| CN202010492602.9A CN111883455B (en) | 2020-06-03 | 2020-06-03 | Rotary table type automatic sorting and assembling equipment and method for chip elements with semiconductor refrigerating sheets |
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Effective date of registration: 20220309 Address after: 221000 intersection of Shuangta road and Suhang Road, Shuanggou Town, Suining County, Xuzhou City, Jiangsu Province Patentee after: Jiangsu Fengyuan Electronic Technology Co.,Ltd. Address before: 325000 Wenzhou City National University Science Park incubator, No. 38 Dongfang South Road, Ouhai District, Wenzhou, Zhejiang Patentee before: WENZHOU VOCATIONAL & TECHNICAL College |