CN111873070B - Film cutting device and film cutting method - Google Patents
Film cutting device and film cutting method Download PDFInfo
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- CN111873070B CN111873070B CN201911181511.7A CN201911181511A CN111873070B CN 111873070 B CN111873070 B CN 111873070B CN 201911181511 A CN201911181511 A CN 201911181511A CN 111873070 B CN111873070 B CN 111873070B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/007—Control means comprising cameras, vision or image processing systems
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
- B26D7/018—Holding the work by suction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/3866—Cutting-out; Stamping-out specially adapted for rubber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Control Of Cutting Processes (AREA)
Abstract
An embodiment of the present invention provides a film cutting apparatus that cuts a protruding portion of a film protruding outward from an edge of a substrate having a film attaching portion to which the film is attached and an exposed portion to which the film is not attached, and a film cutting method, and may include: an imaging unit configured to image the substrate and the film; a control unit including a detection module detecting a substrate edge line extending along an edge of the substrate based on the image photographed by the photographing unit and detecting an intersection point where a corresponding edge of the film opposite to the exposed portion of the substrate and the substrate edge line intersect, and a setting module setting a cutting start point at which cutting of the film starts and a cutting end point at which cutting of the film ends with reference to the intersection point and setting a film cutting line of the cut film with reference to the substrate edge line, the cutting start point, and the cutting end point; and a film cutting unit cutting the film along the film cutting line.
Description
Technical Field
The present invention relates to a film cutting device and a film cutting method configured to cut a protruding portion of a film protruding outward from an edge of a substrate to which the film is attached.
Background
In general, in the manufacture of liquid crystal display panels, organic electroluminescence display panels, inorganic electroluminescence display panels, transmissive projection substrates, reflective projection substrates, and the like used for flat panel displays, brittle mother glass panels (hereinafter referred to as "substrates") such as glass are used, and various films such as optical films, polarizing films, and protective films are attached to such substrates.
Depending on the process performed on the substrate, a process of attaching the film not on the entire surface of the substrate but only on a part of the substrate may be performed. Thus, the substrate has a film-attached portion to which the film is attached and an exposed portion to which the film is not attached. On the other hand, the film has a large area compared to the area of the substrate, and thus, if the film is attached to the substrate, the edge of the film protrudes from the edge of the substrate. Therefore, it is necessary to cut and remove the projections of the film from the edge of the substrate so that the width (length) of the film and the width (length) of the substrate coincide or correspond to each other.
According to the conventional technique, in order to remove the film protrusion, edge lines (positions (coordinate positions) of the edge lines, extending directions, and the like) of the substrate with respect to positions (coordinate positions) of alignment marks formed on the substrate are detected based on information set in advance for the size of the substrate, and then the film is cut along the detected edge lines of the substrate.
On the other hand, the film is not attached to a certain position on the substrate, and the position (posture) of the film attached to the substrate may fluctuate. Further, the substrate is not mounted at a predetermined position on the table, and the position (posture) of the substrate mounted on the table may vary. This may change the areas of the film adhesion portion and the exposed portion of the substrate.
However, according to the conventional technology, since the film is cut based on the edge of the substrate after the edge of the substrate is detected based only on the alignment mark formed on the substrate without considering such a variation in the position (posture) of the film, a variation in the position (posture) of the substrate, and/or the areas of the film-attached portion and the exposed portion of the substrate, etc., in the case of the variation in the position on the substrate to which the film is attached, the cutter does not reach the corresponding edge of the film opposite to the exposed portion of the substrate, and thus there is a problem that the film is not partially cut, and there is a problem that the cutter exceeds the corresponding edge of the film and invades the exposed portion of the substrate to damage the substrate.
Disclosure of Invention
The invention aims to provide a film cutting device and a film cutting method, which can prevent the problem that the local part of a film is not cut because a cutter does not reach the corresponding edge of the film opposite to the exposed part of a substrate in the process of cutting the protruding part of the film protruding outwards from the edge of the substrate with the film attached part and the exposed part without the film attached by the cutter.
Another object of the present invention is to provide a film cutting apparatus and a film cutting method that can prevent a cutter from cutting a protruding portion of a film protruding outward from an edge of a substrate having a film-attached portion to which the film is attached and an exposed portion to which the film is not attached, and from damaging the substrate by penetrating the exposed portion of the substrate.
The film cutting apparatus of an embodiment of the present invention for achieving the above object may cut a protruding portion of a film protruding outward from an edge of a substrate having a film attaching portion to which the film is attached and an exposed portion to which the film is not attached, the film cutting apparatus including: an imaging unit configured to image the substrate and the film; a control unit including a detection module detecting a substrate edge line extending along an edge of the substrate based on the image photographed by the photographing unit and detecting an intersection point where a corresponding edge of the film opposite to the exposed portion of the substrate and the substrate edge line intersect, and a setting module setting a cutting start point at which cutting of the film starts and a cutting end point at which cutting of the film ends with reference to the intersection point and setting a film cutting line of the cut film with reference to the substrate edge line, the cutting start point, and the cutting end point; and a film cutting unit cutting the film along the film cutting line.
For example, the cutting start point and the cutting end point may be set to coincide with the intersection point. In this case, it may be that the film cutting line is set to overlap with the substrate edge line.
As another example, the cutting start point and the cutting end point may be set on the corresponding sides, respectively, so as to be spaced apart from the intersection point. In this case, the film cutting line may be set to be spaced apart from the substrate edge line.
In addition, the film cutting method of the embodiment of the present invention for achieving the above object may cut a protruding portion of a film protruding outward from an edge of a substrate having a film attaching portion to which the film is attached and an exposed portion to which the film is not attached, the film cutting method including: shooting a substrate and a film; detecting a substrate edge line extending along an edge of the substrate based on the photographed image; detecting, based on the photographed image, an intersection at which a corresponding edge of the film opposing the exposed portion of the substrate intersects with an edge line of the substrate; setting a cutting start point at which cutting of the film starts and a cutting end point at which cutting of the film ends, with the intersection point as a reference; setting a film cutting line for cutting the film by taking the edge line of the substrate, the cutting starting point and the cutting end point as references; and cutting the film along the film cutting line.
For example, the step of setting the cutting start point and the cutting end point may set the cutting start point and the cutting end point to coincide with the intersection point, respectively. In this case, it may be that the step of setting the film cutting line sets the film cutting line to overlap with the substrate edge line.
As another example, the step of setting the cutting start point and the cutting end point may set the cutting start point and the cutting end point on the corresponding sides, respectively, so as to be spaced apart from the intersection point. In this case, it may be that the step of setting the film cutting line sets the film cutting line in a manner spaced apart from the substrate edge line.
According to the film cutting apparatus and the film cutting method of the embodiment of the present invention, in the process of cutting the protruding portion of the film protruding outward from the edge of the substrate having the film attaching portion to which the film is attached and the exposed portion to which the film is not attached by using the cutter, the cutting start point and the cutting end point are set with reference to the intersection point between the corresponding edge of the film opposite to the exposed portion of the substrate and the substrate edge line, and after the film cutting line is set with reference to the substrate edge line, the cutting start point and the cutting end point, the film is cut along the film cutting line. Therefore, the cutter can be prevented from reaching the corresponding edge of the film and partially cutting the film, and the cutter can be prevented from exceeding the corresponding edge of the film and cutting the substrate beyond the exposed portion of the substrate, thereby cutting the protruding portion of the film more precisely and accurately without damaging the substrate.
Drawings
Fig. 1 is a diagram schematically showing a film cutting apparatus of an embodiment of the present invention.
Fig. 2 is a control block diagram of the film cutting apparatus of the embodiment of the present invention.
Fig. 3 is a diagram briefly showing a substrate to which a film is attached to be cut by the film cutting apparatus of the embodiment of the present invention.
Fig. 4 is a sequence diagram schematically showing a film cutting method according to an embodiment of the present invention.
Description of the reference numerals
20: a substrate; 21: an exposed portion; 22: a film attachment section; 25: a substrate edge line; 231. 232: an intersection point; 30: a film; 31: a projection; 32: a corresponding edge; 35: a film cutting line; 351: cutting an initial point; 352: a cutting end point; 40: a work table; 60: a shooting unit; 70: a control unit; 71: a detection module; 72: a setting module; 80: a film cutting unit; 81: and (4) a cutter.
Detailed Description
Hereinafter, a film cutting apparatus according to an embodiment of the present invention will be described with reference to the drawings.
Referring to fig. 1 to 3, a plane parallel to a plane on which the substrate 20 is placed is referred to as an X-Y plane, and a direction perpendicular to the X-Y plane is defined as a Z-axis direction.
The film cutting apparatus according to the embodiment of the present invention is configured to cut the protruding portion 31 of the film 30 protruding outward from the edge of the substrate 20 on a plane in a state where the film 30 is attached to the substrate 20. In particular, the film cutting apparatus according to the embodiment of the present invention is configured to cut the protruding portion 31 of the film 30 protruding outward from the edge of the substrate 20 having the film attached portion 22 to which the film 30 is attached and the exposed portion 21 to which the film is not attached.
In addition, a virtual line extending along the edge of the substrate 20 is defined as a substrate edge line 25 on a plane. Further, a virtual line set for cutting the convex portion 31 of the film 30 is defined as a film cutting line 35. The film cutting line 35 may be a line along which the cutter 81 moves. The film cutting line 35 may cut and remove the outline (contour) of the film 30 remaining in an attached state on the substrate 20 after the projection 31 of the film 30 is formed.
Here, the film cutting line 35 may coincide with the substrate edge line 25. As another example, the film cutting line 35 may be spaced apart from the substrate edge line 25 in a direction toward the outside of the substrate 20. Thereby, the film cutting line 35 may be located outside the substrate 20. As still another example, the film cutting line 35 may be spaced apart from the substrate edge line 25 in a direction toward the inside of the substrate 20. Thus, the film cutting line 35 may be located inside the substrate 20. The positional relationship between such film cutting lines 35 and substrate edge lines 25 may vary depending on the characteristics of the substrate 20 and/or the characteristics of the film 30.
The film 30 to be cut by the film cutting device may be various films such as an optical film, a polarizing film, and a protective film.
As shown in fig. 1 to 3, the film cutting apparatus of the embodiment of the present invention may include: a base 10; a stage 40 which is provided on the base 10 and supports the substrate 20 to which the film 30 is attached; a support frame 50 located above the table 40 and extending in the X-axis direction; an imaging unit 60 provided on the support frame 50 and configured to image the substrate 20 and the film 30; a control unit 70 that sets the film cutting line 35 of the cut film 30 based on the image captured by the capturing unit 60; and a film cutting unit 80 provided to the support frame 50 and cutting the convex portion 31 of the film 30 along the film cutting line 35 set by the control unit 70.
The stage 40 can support the substrate 20 having the film attaching portion 22 to which the film 30 is attached and the exposed portion 21 to which the film 30 is not attached. The table 40 has a support surface 41 on which the substrate 20 is placed. A plurality of suction holes 42 may be formed in the supporting surface 41 of the table 40, and the plurality of suction holes 42 may be connected to a negative pressure source 45 such as a vacuum pump. When the negative pressure source 45 is operated in a state where the substrate 20 is mounted on the supporting surface 41 of the table 40, the negative pressure acts on the plurality of suction holes 42, and thereby the substrate 20 can be firmly and stably sucked on the supporting surface 41 of the table 40.
The support frame 50 may be attached to the support frame transfer unit 11 provided on the base frame 10. The support frame transfer unit 11 may be configured to transfer the support frame 50 in the Y-axis direction. For example, the supporting frame transfer unit 11 may be constituted by an actuator that operates under air pressure or hydraulic pressure, a linear movement mechanism such as a linear motor or a ball screw mechanism that operates under electromagnetic interaction, or the like.
As the support frame 50 is transferred in the Y-axis direction by the support frame transfer unit 11, the imaging unit 60 and the film cutting unit 80 provided on the support frame 50 can be moved in the Y-axis direction, and thus the positions of the imaging unit 60 and the film cutting unit 80 with respect to the substrate 20 in the Y-axis direction can be determined. However, the configuration for determining the position of the imaging unit 60 and the film cutting unit 80 in the Y-axis direction with respect to the substrate 20 is not limited to the configuration in which the support frame 50 is transferred in the Y-axis direction, and a configuration in which the table 40 is transferred in the Y-axis direction may be applied. As another example, a combination of a structure in which the support frame 50 is transferred in the Y-axis direction and a structure in which the table 40 is transferred in the Y-axis direction may be applied.
The support frame 50 may be provided with a guide rail 51 extending in the X-axis direction, and the photographing unit 60 and the film cutting unit 80 may move in the X-axis direction along the guide rail. Between the photographing unit 60 and the guide rail 51, a linear moving mechanism such as an actuator operating under air pressure or hydraulic pressure, a linear motor operating under electromagnetic interaction, or a ball screw mechanism may be provided. Further, between the film cutting unit 80 and the guide rail 51, a linear moving mechanism such as an actuator operating under air pressure or hydraulic pressure, a linear motor operating under electromagnetic interaction, or a ball screw mechanism may be provided. As the imaging unit 60 and the film cutting unit 80 move along the support frame 50 in the X-axis direction, the positions of the imaging unit 60 and the film cutting unit 80 with respect to the substrate 20 in the X-axis direction can be determined. However, the configuration for determining the positions of the imaging unit 60 and the film cutting unit 80 in the X-axis direction with respect to the substrate 20 is not limited to the configuration in which the imaging unit 60 and the film cutting unit 80 move in the X-axis direction, and a configuration in which the table 40 is transferred in the X-axis direction may be applied. As another example, a combination of a structure in which the imaging unit 60 and the film cutting unit 80 are transferred in the X-axis direction and a structure in which the table 40 is transferred in the X-axis direction may be applied.
The photographing unit 60 may include a camera 61 and an illumination 62. For example, the imaging unit 60 may be configured to image the edge of the substrate 20 while moving along the edge of the substrate 20 to which the film 30 is attached. As another example, the photographing unit 60 may be configured to photograph the entire appearance of the substrate 20 to which the film 30 is attached at once. As still another example, the imaging unit 60 may be configured to image only a part of the entire area of the substrate 20.
As shown in fig. 1, the photographing unit 60 and the film cutting unit 80 may be separately manufactured and mounted on the support frame 50. The present invention is not limited to this configuration, and the present invention can be applied to a configuration in which the imaging unit 60 and the film cutting unit 80 are integrally assembled in one head body and are attached to the support frame 50 so as to be movable together in the X-axis direction.
The film cutting unit 80 may include a cutter 81. For example, the cutter 81 may be configured to physically press the film 30 along the film cutting line 35, such as a tool having a cutting edge, a cutting wheel, or a cutting blade, and cut the film 30 along the film cutting line 35. As another example, the cutter 81 may be configured to cut the film 30 by irradiating the film 30 with laser light generated by a laser light source along the film cutting line 35 to form a laser spot on the film 30.
The control unit 70 may include a detection module 71 and a setting module 72.
The detection module 71 may detect the substrate edge line 25 extending along the edge of the substrate 20 based on the image photographed by the photographing unit 60. For example, the detection module 71 can detect the substrate edge line 25 by a process of setting a plurality of points along the edge of the substrate 20 based on the photographed image of the substrate 20 and then connecting the plurality of points to each other in one line.
In addition, the detection module 71 is capable of detecting the intersections 231, 232 where the corresponding sides 32 of the film 30 opposite the exposed portions 21 of the substrate 20 intersect the substrate edge lines 25.
The setting module 72 may set a cutting start point 351 at which the cutting of the film 30 starts and a cutting end point 352 at which the cutting of the film 30 ends, based on the intersection points 231, 232 detected by the detection module 71.
In addition, the setting module 72 may set the film cutting line 35 for cutting the film 30 based on the substrate edge line 25, the cutting start point 351, and the cutting end point 352.
For example, the cutting start point 351 and the cutting end point 352 may be set to coincide with the intersections 231 and 232, respectively. In this case, the film cutting line 35 may be set to overlap the substrate edge line 25.
As another example, the cutting start point 351 and/or the cutting end point 352 may be set on the corresponding edge 32 of the film 30 in a manner spaced apart from the intersection points 231, 232, respectively. At this time, the cutting start point 351 and/or the cutting end point 352 may be spaced apart from the intersection points 231 and 232 toward the inner side or the outer side of the substrate 20 with reference to the substrate edge line 25. Thus, the cutting start point 351 and/or the cutting end point 352 may be located inside or outside the substrate 20. In this case, the film cutting line 35 may be set to be spaced apart from the substrate edge line 25. At this time, the film cutting line 35 may be spaced inward or outward of the substrate 20 from the substrate edge line 25. Thus, the film cutting line 35 may be located inside or outside the substrate 20.
In this way, the cutting start point 351 and the cutting end point 352 are set to coincide with the intersection points 231, 232 at which the corresponding edge 32 of the film 30 and the substrate edge line 25 intersect or to be set on the corresponding edge 32 of the film 30 in a spaced manner from the intersection points 231, 232, and therefore the cutting knife 81 moves from the cutting start point 351 along the film cutting line 35 to the cutting end point 352 and can cut the convex portion 31 of the film 30. Therefore, it is possible to prevent the problem that the cutting blade 81 does not reach the corresponding edge 32 of the film 30 and the part of the film 30 is not cut, and the problem that the cutting blade 81 exceeds the corresponding edge 32 of the film 30 and invades the exposed portion 21 of the substrate 20 to damage the substrate 20.
Hereinafter, a film cutting method according to an embodiment of the present invention will be described with reference to fig. 4.
First, the imaging unit 60 images the substrate 20 and the film 30 (S10). For example, the imaging unit 60 images the substrate 20 and the film 30 while moving in the X-axis direction and the Y-axis direction. As another example, the photographing unit 60 may photograph the entire appearance of the substrate 20 to which the film 30 is attached at once.
Then, the detection module 71 of the control unit 70 detects the substrate edge line 25 based on the images of the substrate 20 and the film 30 captured by the imaging unit 60 (S20). The detection module 71 may detect the substrate edge line 25 using various well-known image analysis methods.
Based on the images of the substrate 20 and the film 30 photographed by the photographing unit 60, the detection module 71 of the control unit 70 detects the corresponding side 32 of the film 30, and detects the intersections 231, 232 between the substrate edge line 25 and the corresponding side 32 of the film 30 (S30). The detection module 71 may detect the corresponding edge 32 and the intersection points 231 and 232 using various well-known image analysis methods.
Then, the setting module 72 sets the cutting start point 351 and the cutting end point 352 based on the intersections 231 and 232 detected by the detection module 71 (S40). The detection module 71 sets the cutting start point 351 and the cutting end point 352 on the corresponding edge 32. Here, the cutting start point 351 and the cutting end point 352 may coincide with the intersection points 231, 232, respectively, or may be spaced apart from the intersection points 231, 232, respectively.
Further, the setting module 72 sets the film cutting line 35 based on the substrate edge line 25, the cutting start point 351, and the cutting end point 352 (S50). Here, the film cutting line 35 may coincide with the substrate edge line 25 or may be spaced apart from the substrate edge line 25. In addition, the film cutting line 35 may be parallel to the substrate edge line 25.
Also, the cutter 81 of the film cutting unit 80 cuts the convex portion 31 of the film 30 while moving along the film cutting line 35 (S60). Thus, the film 30 can have a contour defined by the film cutting line 35.
Thereby, the convex portion 31 of the film 30 is cut and removed from the edge of the substrate 20, and the substrate 20 with the film 30 from which the convex portion 31 is removed is transferred to a subsequent process.
According to the film cutting apparatus and the film cutting method of the embodiment of the present invention, the intersections 231, 232 between the substrate edge line 25 and the corresponding side 32 of the film 30 are detected, the cutting start point 351 and the cutting end point 352 are set based on the detected intersections 231, 232, and the film cutting line 35 is set based on the substrate edge line 25, the cutting start point 351 and the cutting end point 352, and then the protrusion of the film 30 is cut along the film cutting line 35. Therefore, in the process of cutting the protruding portion 31 of the film 30 protruding outward from the edge of the substrate 20 having the exposed portion 21 to which the film 30 is not attached, it is possible to prevent the cutter (cutting edge or laser spot) from invading the exposed portion 21 of the substrate 20 to damage the substrate 20.
The preferred embodiments of the present invention have been described as examples, and the scope of the present invention is not limited to the specific embodiments, and may be modified as appropriate within the scope described in the claims.
Claims (10)
1. A film cutting device cuts a protruding portion of a film protruding outward from an edge of a substrate having a film attaching portion to which the film is attached and an exposed portion to which the film is not attached, wherein,
the film cutting device includes:
an imaging unit configured to image the substrate and the film;
a control unit including a detection module that detects a substrate edge line extending along an edge of the substrate based on the image photographed by the photographing unit and detects an intersection at which a corresponding side of the film opposite to the exposed portion of the substrate and the substrate edge line intersect, and a setting module that sets a cutting start point at which cutting of the film starts and a cutting end point at which cutting of the film ends with reference to the intersection, and sets a film cutting line that cuts the film with reference to the substrate edge line, the cutting start point, and the cutting end point, wherein the film cutting line does not include the corresponding side of the film opposite to the exposed portion of the substrate; and
a film cutting unit cutting the film along the film cutting line.
2. The film cutting apparatus according to claim 1,
the cutting start point and the cutting end point are set to coincide with the intersection points, respectively.
3. The film cutting apparatus according to claim 2,
the film cutting line is set to overlap with the substrate edge line.
4. The film cutting apparatus according to claim 1,
the cutting start point and the cutting end point are respectively set on the corresponding sides in a manner of being spaced apart from the intersection point.
5. The film cutting apparatus according to claim 4,
the film cutting line is set in a manner spaced apart from the substrate edge line.
6. A film cutting method of cutting a protruding portion of a film protruding outward from an edge of a substrate having a film attaching portion to which the film is attached and an exposed portion to which the film is not attached, wherein,
the film cutting method includes the steps of:
photographing the substrate and the film;
detecting a substrate edge line extending along an edge of the substrate based on the photographed image;
detecting, based on the photographed image, an intersection at which a corresponding side of the film opposing the exposed portion of the substrate and the substrate edge line intersect;
setting a cutting start point at which cutting of the film starts and a cutting end point at which cutting of the film ends, with the intersection point as a reference;
setting a film cutting line for cutting the film, based on the substrate edge line, the cutting start point, and the cutting end point, wherein the film cutting line does not include a corresponding edge of the film opposite to the exposed portion of the substrate; and
cutting the film along the film cutting line.
7. The film cutting method according to claim 6,
the step of setting the cutting start point and the cutting end point sets the cutting start point and the cutting end point to coincide with the intersection point, respectively.
8. The film cutting method according to claim 7,
the step of setting the film cutting line sets the film cutting line to overlap with the substrate edge line.
9. The film cutting method according to claim 6,
the step of setting the cutting start point and the cutting end point sets the cutting start point and the cutting end point on the corresponding sides, respectively, in a manner spaced apart from the intersection point.
10. The film cutting method according to claim 9,
the step of setting the film cutting line sets the film cutting line in a manner spaced apart from the substrate edge line.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020190052459A KR102267731B1 (en) | 2019-05-03 | 2019-05-03 | Apparatus and method for cutting film |
| KR10-2019-0052459 | 2019-05-03 |
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| JP2006259542A (en) * | 2005-03-18 | 2006-09-28 | Sharp Corp | Method for manufacturing liquid crystal display panel |
| JP2007288010A (en) * | 2006-04-19 | 2007-11-01 | Lintec Corp | Device and method for cutting sheet |
| JP5037849B2 (en) * | 2006-04-28 | 2012-10-03 | リンテック株式会社 | Sheet cutting method |
| JP2011199056A (en) * | 2010-03-19 | 2011-10-06 | Hitachi High-Technologies Corp | Assembling device for fpd module |
| WO2012063320A1 (en) * | 2010-11-09 | 2012-05-18 | 富士通フロンテック株式会社 | Process for production of film substrate |
| KR20110018400A (en) * | 2011-01-11 | 2011-02-23 | 주식회사 고려반도체시스템 | Method of dicing solar cell wafer using laser beam and apparatus using therefor |
| KR101047334B1 (en) * | 2011-02-23 | 2011-07-07 | 노바테크 (주) | Protection film automatic cutting system of substrate and method of the same |
| CN104854502B (en) * | 2013-01-10 | 2017-08-15 | 住友化学株式会社 | The manufacture device of optical display means and the production system of optical display means |
| JP6037564B2 (en) * | 2013-06-24 | 2016-12-07 | 住友化学株式会社 | Optical display device production system |
| JP5943354B2 (en) * | 2013-07-23 | 2016-07-05 | 住友化学株式会社 | Optical display device production system |
| KR101893372B1 (en) * | 2016-09-27 | 2018-09-04 | 주식회사 제이스텍 | Method for manufacturing laser cutting for film surface glass |
| CN207888087U (en) * | 2018-02-10 | 2018-09-21 | 福建省飞阳光电股份有限公司 | A kind of touch screen protective film laser cutting device |
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| KR20200127742A (en) | 2020-11-11 |
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