CN111867243A - 一种高频线路板新型材料层结构的制备方法及其制品 - Google Patents
一种高频线路板新型材料层结构的制备方法及其制品 Download PDFInfo
- Publication number
- CN111867243A CN111867243A CN202010849617.6A CN202010849617A CN111867243A CN 111867243 A CN111867243 A CN 111867243A CN 202010849617 A CN202010849617 A CN 202010849617A CN 111867243 A CN111867243 A CN 111867243A
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- film
- circuit board
- tfp
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- 239000000463 material Substances 0.000 title claims abstract description 69
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000011889 copper foil Substances 0.000 claims abstract description 27
- 239000007788 liquid Substances 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000007731 hot pressing Methods 0.000 claims abstract description 10
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims description 14
- 239000000945 filler Substances 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 abstract description 65
- 238000004519 manufacturing process Methods 0.000 abstract description 19
- 230000005540 biological transmission Effects 0.000 abstract description 9
- 239000002356 single layer Substances 0.000 abstract description 5
- 239000002131 composite material Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 96
- 239000004642 Polyimide Substances 0.000 description 46
- 229920001721 polyimide Polymers 0.000 description 46
- 229920000106 Liquid crystal polymer Polymers 0.000 description 16
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 15
- 230000008054 signal transmission Effects 0.000 description 12
- 239000000758 substrate Substances 0.000 description 11
- 230000006854 communication Effects 0.000 description 8
- 238000004891 communication Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Abstract
Description
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910785103.6A CN110572933A (zh) | 2019-08-23 | 2019-08-23 | 一种高频线路板新型材料层结构的制备方法及其制品 |
CN2019107851036 | 2019-08-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN111867243A true CN111867243A (zh) | 2020-10-30 |
Family
ID=68775962
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910785103.6A Pending CN110572933A (zh) | 2019-08-23 | 2019-08-23 | 一种高频线路板新型材料层结构的制备方法及其制品 |
CN202010849617.6A Pending CN111867243A (zh) | 2019-08-23 | 2020-08-21 | 一种高频线路板新型材料层结构的制备方法及其制品 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910785103.6A Pending CN110572933A (zh) | 2019-08-23 | 2019-08-23 | 一种高频线路板新型材料层结构的制备方法及其制品 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20220304161A1 (zh) |
JP (1) | JP3239180U (zh) |
KR (1) | KR102619075B1 (zh) |
CN (2) | CN110572933A (zh) |
IL (1) | IL290807A (zh) |
WO (1) | WO2021035918A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114025516A (zh) * | 2021-11-19 | 2022-02-08 | 深圳玛斯兰电路科技实业发展有限公司 | 高频混压板的制作方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4700332B2 (ja) * | 2003-12-05 | 2011-06-15 | イビデン株式会社 | 多層プリント配線板 |
US20070291440A1 (en) * | 2006-06-15 | 2007-12-20 | Dueber Thomas E | Organic encapsulant compositions based on heterocyclic polymers for protection of electronic components |
TWI398350B (zh) * | 2008-02-05 | 2013-06-11 | Du Pont | 高黏著性聚醯亞胺銅箔積層板及其製造方法 |
KR101301337B1 (ko) * | 2010-03-30 | 2013-08-29 | 코오롱인더스트리 주식회사 | 폴리이미드 필름 |
CN102304228A (zh) * | 2011-04-03 | 2012-01-04 | 广东生益科技股份有限公司 | 聚酰胺酸、用其制成的二层法单面挠性覆铜板及其制作方法 |
CN103660490A (zh) * | 2013-11-25 | 2014-03-26 | 昆山永翔光电科技有限公司 | 一种二层法双面挠性覆铜板的制作方法 |
-
2019
- 2019-08-23 CN CN201910785103.6A patent/CN110572933A/zh active Pending
- 2019-10-23 WO PCT/CN2019/112807 patent/WO2021035918A1/zh active Application Filing
- 2019-10-23 US US17/753,127 patent/US20220304161A1/en active Pending
- 2019-10-23 JP JP2022600027U patent/JP3239180U/ja active Active
- 2019-10-23 KR KR1020227005579A patent/KR102619075B1/ko active IP Right Grant
-
2020
- 2020-08-21 CN CN202010849617.6A patent/CN111867243A/zh active Pending
-
2022
- 2022-02-22 IL IL290807A patent/IL290807A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN110572933A (zh) | 2019-12-13 |
KR102619075B1 (ko) | 2023-12-27 |
WO2021035918A1 (zh) | 2021-03-04 |
KR20220035240A (ko) | 2022-03-21 |
US20220304161A1 (en) | 2022-09-22 |
JP3239180U (ja) | 2022-09-26 |
IL290807A (en) | 2022-04-01 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
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TA01 | Transfer of patent application right |
Effective date of registration: 20210810 Address after: 518000 3rd floor, building A1, 9 songzikeng Reservoir Road, Laokeng community, Longtian street, Pingshan District, Shenzhen City, Guangdong Province Applicant after: Shida new material (Shenzhen) Co.,Ltd. Address before: 516000 room 3202, unit 4, block 1, No. 11, Huizhou Avenue, Huicheng District, Huizhou City, Guangdong Province Applicant before: Li Longkai |
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TA01 | Transfer of patent application right | ||
CB02 | Change of applicant information |
Country or region after: China Address after: B113, Comprehensive Building, 3rd Branch of Leibai Zhongcheng Life Science Park, No. 22 Jinxiu East Road, Jinsha Community, Kengzi Street, Pingshan District, Shenzhen City, Guangdong Province, 518118 Applicant after: Shida new material (Shenzhen) Co.,Ltd. Address before: 518000 3rd floor, building A1, 9 songzikeng Reservoir Road, Laokeng community, Longtian street, Pingshan District, Shenzhen City, Guangdong Province Applicant before: Shida new material (Shenzhen) Co.,Ltd. Country or region before: China |
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CB02 | Change of applicant information |