CN212463642U - 一种高频线路板新型材料层结构 - Google Patents
一种高频线路板新型材料层结构 Download PDFInfo
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- CN212463642U CN212463642U CN202021764990.3U CN202021764990U CN212463642U CN 212463642 U CN212463642 U CN 212463642U CN 202021764990 U CN202021764990 U CN 202021764990U CN 212463642 U CN212463642 U CN 212463642U
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000011889 copper foil Substances 0.000 claims abstract description 21
- 239000010410 layer Substances 0.000 abstract description 53
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- 230000008054 signal transmission Effects 0.000 abstract description 12
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- 239000004642 Polyimide Substances 0.000 description 37
- 229920001721 polyimide Polymers 0.000 description 37
- 229920000106 Liquid crystal polymer Polymers 0.000 description 16
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 16
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- 239000000853 adhesive Substances 0.000 description 3
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- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
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- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
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- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
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Application Number | Priority Date | Filing Date | Title |
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CN201921381330 | 2019-08-23 | ||
CN2019213813304 | 2019-08-23 |
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CN212463642U true CN212463642U (zh) | 2021-02-02 |
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CN202021764990.3U Active CN212463642U (zh) | 2019-08-23 | 2020-08-21 | 一种高频线路板新型材料层结构 |
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GR01 | Patent grant | ||
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TR01 | Transfer of patent right |
Effective date of registration: 20211015 Address after: 518000 3rd floor, building A1, 9 songzikeng Reservoir Road, Laokeng community, Longtian street, Pingshan District, Shenzhen City, Guangdong Province Patentee after: Shida new material (Shenzhen) Co.,Ltd. Address before: 516000 room 3202, unit 4, block 1, No. 11, Huizhou Avenue, Huicheng District, Huizhou City, Guangdong Province Patentee before: Li Longkai |
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TR01 | Transfer of patent right | ||
CP03 | Change of name, title or address |
Address after: B113, Comprehensive Building, 3rd Branch of Leibai Zhongcheng Life Science Park, No. 22 Jinxiu East Road, Jinsha Community, Kengzi Street, Pingshan District, Shenzhen City, Guangdong Province, 518118 Patentee after: Shida new material (Shenzhen) Co.,Ltd. Country or region after: China Address before: 518000 3rd floor, building A1, 9 songzikeng Reservoir Road, Laokeng community, Longtian street, Pingshan District, Shenzhen City, Guangdong Province Patentee before: Shida new material (Shenzhen) Co.,Ltd. Country or region before: China |
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CP03 | Change of name, title or address |