CN111849388B - 一种耐高压绝缘的不干性防水密封胶 - Google Patents
一种耐高压绝缘的不干性防水密封胶 Download PDFInfo
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Abstract
一种耐高压绝缘的不干性防水密封胶,按重量份,组成为50‑100份聚异丁烯、20‑60份增塑剂、5‑20份疏水型气相二氧化硅、50‑200份无机填料、0.5‑10份聚丁二烯聚氨酯改性烷基硅油、20‑50份树脂改性空心玻璃微珠。以聚异丁烯为基材提高了密封胶的不干性和粘附力;加入聚丁二烯聚氨酯改性烷基硅油提高了憎水性;加入树脂改性空心玻璃微珠,改善分散性,提升了耐高压绝缘性。本发明用于高压输电线路用的针式聚烯烃绝缘子等结构空隙的填充密封。
Description
技术领域
本发明属于密封胶的技术领域,具体涉及一种耐高压绝缘的不干性密封胶。
背景技术
不干密封胶主要由主体树脂、增塑剂、功能填料、增粘剂等按不同比例配制而成,调整助剂种类和比例使得制成的密封胶性能各不相同,如发明专利申请(CN102702996A)公开了一种具有干燥能力的不干性防腐密封胶,主要成份包括:丁基橡胶、聚异丁烯、吸水剂、阻蚀剂、粘接促进剂等,采用不同分子量的聚异丁烯配合使用,提高不干性密封胶的施工性能,加入吸水剂提高产品的干燥能力及抗腐蚀性能等。发明专利申请(CN110819011A)公开了一种三元乙丙绝缘胶料,以提高绝缘材料与半导电材料之间的粘接面的平滑度和粘结性,使终端结构始终保持优良的电气性能;上述胶料成份包括三元乙丙生胶、补强剂、填充剂、氧化锌、增粘剂、软化剂、交联促进剂、硫化剂等,增粘剂为液体乙丙橡胶、液体聚异丁烯或石油树脂中的至少一种,胶料硫化后拉伸强度约10MPa,体积电阻率在1014-1015Ωm。
目前,高压输电线路用的一些绝缘子存在着结构空隙,例如已大量用于6-35kV输电线路的针式聚烯烃绝缘子,在绝缘子伞裙里面顶部和钢脚之间存在着少量空隙,需要在施工安装钢脚前,将密封胶填入伞裙里面顶部,否则会导致水汽进入,或线路高压运行时在空隙中产生电晕,影响着绝缘子的实际运行安全。但现有密封胶技术不能满足要求:(1)对于不干性密封胶来说,现有技术的憎水性不强、耐高压绝缘性不够,用于聚烯烃绝缘子,在100-150kV就会被击穿;(2)对于绝缘性密封胶来说,现有技术需要硫化或固化成弹性体,不能在绝缘子安装现场即时使用,或硫化粘接伞裙后不能取下,对绝缘子维修或安装工艺不可行。
发明内容
本发明的目的在于克服现有技术中存在的不足,提供一种耐高压绝缘的不干性防水密封胶,用于绝缘子结构间隙的填充密封或其他高压绝缘设备的绝缘密封,能够同时具备耐高压绝缘性、优异憎水性、不流挂、长期保持粘弹性和粘合性等综合特性,适用于绝缘子结构空隙填充。本发明的技术原理是:
(1)以聚异丁烯为基材、疏水型气相二氧化硅为触变剂、邻苯二甲酸酯类或对苯二甲酸酯类为增塑剂,大幅度提高密封胶不干性和粘附力,同时具有100℃高温不流挂、-40℃低温不开裂、绝缘性好的综合效果。(2)在密封胶中加入聚丁二烯聚氨酯改性烷基硅油。聚丁二烯聚氨酯改性后,聚丁二烯聚氨酯烷基硅油提高了与无机填料、聚异丁烯树脂的相互作用,利用硅油包裹填料起到了更好的憎水作用;部分聚丁二烯聚氨酯烷基硅油迁移到密封胶表面,富集形成致密的硅油膜,起到封闭作用,进一步降低了材料的吸水性。(3)加入树脂改性空心玻璃微珠,提升密封胶的耐高压绝缘性,利用辛基硅烷和异氰酸酯硅烷改性,并接枝到聚丁二烯树脂后,空心玻璃微珠悬浮在聚异丁烯不干密封胶中,长期分散均匀、不团聚。这样分散均匀的空心玻璃微珠,防止了因空心玻璃微珠团聚造成的绝缘性不均匀,避免高电压从密封胶局部绝缘性较弱处击穿的现象,从而大幅度提高了密封胶耐高压绝缘性。
为了实现上述的目的,本发明采用以下的技术方案:
一种耐高压绝缘的不干性防水密封胶,组成及重量份数比例如下:50-100份聚异丁烯、20-60份增塑剂、5-20份疏水型气相二氧化硅、50-200份无机填料、0.5-10份聚丁二烯聚氨酯改性烷基硅油、20-50份树脂改性空心玻璃微珠。
所述的耐高压绝缘的不干性防水密封胶制备方法:在混合机中依次加入聚异丁烯、增塑剂和改性烷基硅油,升温至100-120℃,混合均匀;加入树脂改性空心玻璃微珠,搅拌1-2小时,再加入无机填料和疏水气相二氧化硅搅拌,其中疏水气相二氧化硅可以分批次加入,分散均匀后冷却制成不干性密封胶。
所述的聚异丁烯分子量为1000-100000。优选地,选择分子量为3000-6000和30000-60000的两种聚异丁烯混合物,用以调控密封胶的粘附性。
所述的增塑剂为邻苯二甲酸酯类或对苯二甲酸酯类的任意一种或一种以上的混合物。优选地,增塑剂为邻苯二甲酸二辛酯、邻苯二甲酸二异葵酯、邻苯二甲酸二异壬酯的一种或一种以上的混合物。
所述的无机填料为轻质碳酸钙、滑石粉等一种或一种以上的混合物,用于调控密封胶粘度和降低成本。
所述的聚丁二烯聚氨酯改性烷基硅油,按重量份,由5-10份醇羟基单封端长链烷基硅油、1-5份端羟基聚丁二烯、0.1-0.5份异佛尔酮二异氰酸酯等原料室温搅拌3-6小时反应而成。优选地,端羟基聚丁二烯分子量为1000-3000,醇羟基单封端长链烷基硅油分子量1000-3000。
所述的树脂改性空心玻璃微珠,按重量份,由10份端羟基聚丁二烯、0.05-0.5份异氰酸丙基三乙氧基硅烷、0.05-0.1份辛基三乙氧基硅烷、4-10份空心玻璃微珠等原料制备而成。优选地,空心玻璃微珠壁厚1-2微米,粒径30-90微米;端羟基聚丁二烯分子量为1000-3000。
进一步,所述的树脂改性空心玻璃微珠的制备步骤:在反应瓶中按比例加入端羟基聚丁二烯和空心玻璃微珠,100-120℃下真空脱水3小时及以上,冷却至50-60℃,加入异氰酸丙基三乙氧基硅烷和辛基三乙氧基硅烷,搅拌反应3-5小时,冷却后制得。
本发明有益效果:
(1)同时具有不干性、防水、耐高压绝缘效果。(2)采用非极性聚异丁烯作基材,提高密封胶不干性和粘附力,提升了与聚烯烃等绝缘子的粘附力。
(2)烷基硅油用聚丁二烯聚氨酯接枝改性后,起到了与聚异丁烯主体树脂更好的相容作用、进一步降低了材料吸水性。(3)利用树脂改性空心玻璃微珠均匀稳定地分散在聚异丁烯树脂中,显著提升密封胶的耐高压绝缘性,防止因空心玻璃微珠团聚造成的绝缘性不均匀,以较少的空心微珠使用量制备出优异的耐高压绝缘的不干性密封胶。(4)使用简单方便:可在绝缘子安装现场使用,或在绝缘子伞裙出厂时,预先取一定量不干胶填充于内顶部,施工时直接可以安装旋上钢脚;多余的不干胶会被挤压填充在钢脚螺纹上,进一步起到了密封作用。(5)应用效果显著:本发明的不干性密封胶的体积电阻率为1014-1015Ωm,填充于6-35kV针式聚烯烃绝缘子的内部结构空隙密封,密封胶填充厚度为4-5mm,施加200kV电压试验,绝缘子不被击穿。对比市场上现有的不干性密封胶,试验施加至100-150kV电压,绝缘子就被击穿。
具体实施方式
下面通过实施例对本发明作进一步说明,但并不以任何方式限制本发明。
实施例1
本发明的一种耐高压绝缘的不干性防水密封胶,主要组分及重量份数比例如下:10份聚异丁烯(3000分子量)、50份聚异丁烯(50000分子量)、60份邻苯二甲酸二辛酯、20份疏水型气相二氧化硅、150份滑石粉、6份聚丁二烯聚氨酯改性烷基硅油,40份树脂改性空心玻璃微珠。
所述的聚丁二烯聚氨酯改性烷基硅油,按重量份,由2份端羟基聚丁二烯、0.2份异佛尔酮二异氰酸酯、5份醇羟基单封端长链烷基硅油反应而成。
所述的树脂改性空心玻璃微珠,由10份端羟基聚丁二烯、0.15份异氰酸丙基三乙氧基硅烷、0.05份辛基三乙氧基硅烷、5份空心玻璃微珠混合改性而成。
所述的树脂改性空心玻璃微珠的制备步骤:在反应瓶中按比例加入端羟基聚丁二烯和空心玻璃微珠,100℃下真空脱水3小时,冷却至50-60℃,加入异氰酸丙基三乙氧基硅烷和辛基三乙氧基硅烷,搅拌反应5小时,冷却后制得。
本发明的不干性密封胶,体积电阻率为4.2 1014Ωm,填充于6-35kV针式聚烯烃绝缘子的内部结构空隙密封,密封胶填充厚度4.5mm,施加200kV电压试验,绝缘子不被击穿。
实施例2
本发明的一种耐高压绝缘的不干性防水密封胶,主要组分及重量份数比例如下:10份聚异丁烯(3000分子量)、60份聚异丁烯(50000分子量)、50份邻苯二甲酸二异葵酯、15份疏水型气相二氧化硅、200份轻质碳酸钙、8份聚丁二烯聚氨酯改性烷基硅油、50份树脂改性空心玻璃微珠。
所述的聚丁二烯聚氨酯改性烷基硅油,按重量份,由2份端羟基聚丁二烯、0.15份异佛尔酮二异氰酸酯、6份醇羟基单封端长链烷基硅油反应而成。
所述的树脂改性空心玻璃微珠,按重量份,由10份端羟基聚丁二烯、0.15份异氰酸丙基三乙氧基硅烷、0.1份辛基三乙氧基硅烷、6份空心玻璃微珠混合改性而成。
所述的树脂改性空心玻璃微珠的制备步骤:在反应瓶中按比例加入端羟基聚丁二烯和空心玻璃微珠,110℃下真空脱水3小时,冷却至55℃,加入异氰酸丙基三乙氧基硅烷和辛基三乙氧基硅烷,搅拌反应4小时,冷却后制得。
本发明的不干性密封胶,体积电阻率为5.1 1014Ωm,填充于6-35kV针式聚烯烃绝缘子的内部结构空隙密封,密封胶填充厚度5mm,施加200kV电压试验,绝缘子不被击穿。
Claims (1)
1.一种耐高压绝缘的不干性防水密封胶,按重量份,组成包含:50-100份聚异丁烯、20-60份增塑剂、5-20份疏水型气相二氧化硅、50-200份无机填料、0.5-10份聚丁二烯聚氨酯改性烷基硅油和20-50份树脂改性空心玻璃微珠,其特征在于:所述的聚丁二烯聚氨酯改性烷基硅油,按重量份,由5-10份醇羟基单封端长链烷基硅油、1-5份端羟基聚丁二烯、0.1-0.5份异佛尔酮二异氰酸酯在室温搅拌3-6小时反应制备;所述的树脂改性空心玻璃微珠,按重量份,由10份端羟基聚丁二烯、0.05-0.5份异氰酸丙基三乙氧基硅烷、0.05-0.1份辛基三乙氧基硅烷、4-10份空心玻璃微珠反应制备。
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