CN111843229A

CN111843229A - Substrate cutting device

Info

Publication number: CN111843229A
Application number: CN202010608241.XA
Authority: CN
Inventors: 袁明峰; 朱鹏程; 凌步军; 滕宇; 赵有伟; 孙月飞; 冷志斌; 冯高俊; 吕金鹏
Original assignee: Jiangsu Yawei Aosi Laser Technology Co ltd
Current assignee: Jiangsu Yawei Aosi Laser Technology Co ltd
Priority date: 2020-06-29
Filing date: 2020-06-29
Publication date: 2020-10-30

Abstract

The invention provides a substrate cutting device, which comprises a feeding area, a cutting area and a cutting area, wherein the feeding area is used for conveying a substrate; the cutting area is arranged on one side of the feeding area and used for cutting the substrate to cut the substrate into a plurality of sub-substrates, and a laser is arranged in the cutting area; an inspection area disposed at one side of the cutting area for detecting a state of the laser beam; the blanking area is arranged on one side of the cutting area, which is far away from the feeding area, and is used for conveying the plurality of sub-substrates; a moving component disposed between the cutting region and the inspection region to move the laser from the cutting region to the inspection region. The substrate cutting device provided by the invention can improve the processing quality.

Description

Substrate cutting device

Technical Field

The invention relates to the technical field of laser processing, in particular to a substrate cutting device.

Background

The substrate cutting apparatus is used to cut a glass-based base substrate of a flat panel display into a desired product size. The flat panel display includes an organic light emitting diode display, a liquid crystal display, and the like. Flat panel displays are advantageous because they have a thin profile, and thus are increasingly demanded. In recent years, there has been an increasing demand for flat panel displays including a glass substrate having a thickness of 0.3mm or less.

In the substrate cutting apparatus, the substrate is cut by a laser beam, and the laser beam is generally emitted from a laser, and when the laser is in an operating state for a long time, the state of the laser beam (the size of the circular surface of the laser beam or the energy state of the laser beam) changes, so that the processing accuracy of the substrate cutting apparatus is lowered, and the quality of the cut substrate is degraded.

Disclosure of Invention

In view of the above-mentioned drawbacks of the prior art, the present invention provides a substrate cutting apparatus, which can detect a laser, thereby improving the quality of the laser and the processing precision of the substrate cutting apparatus.

To achieve the above and other objects, the present invention provides a substrate cutting apparatus including:

a loading area for transporting the substrate;

the cutting area is arranged on one side of the feeding area and used for cutting the substrate to cut the substrate into a plurality of sub-substrates, and a laser is arranged in the cutting area;

an inspection area disposed at one side of the cutting area for detecting a state of the laser beam;

the blanking area is arranged on one side of the cutting area, which is far away from the feeding area, and is used for conveying the plurality of sub-substrates;

a moving component disposed between the cutting region and the inspection region to move the laser from the cutting region to the inspection region.

Further, a moving means for moving the laser from the cutting zone to the inspection zone is included.

Further, the laser lifting device further comprises a driving component, and the driving component is used for lifting the laser.

Further, the examination region includes a reflection assembly, an attenuation assembly, an additive assembly, a sensing assembly, and a control assembly.

Further, the reflection assembly is disposed at a position of a laser beam emitted from the laser, and converts a direction of the laser beam from a first direction to a second direction.

Further, the attenuation component is arranged on one side of the reflection component, the attenuation component is arranged in the second direction, and the attenuation component is used for attenuating the energy of the laser beam.

Further, the additional assembly is disposed on one side of the attenuation assembly, and the attenuation assembly is disposed between the reflection assembly and the additional assembly.

Further, the sensing assembly is disposed on one side of the dispensing assembly, and the dispensing assembly is disposed between the attenuation assembly and the sensing assembly.

Further, a sensing area is arranged in the sensing assembly and used for sensing the laser beam.

Further, the control component is arranged on one side of the sensing component and used for distinguishing the position of the laser beam.

Further, the present invention also provides a substrate cutting apparatus, comprising:

a loading area for transporting the substrate;

the cutting area is arranged on one side of the feeding area and used for cutting the substrate so as to cut the substrate into a plurality of sub-substrates;

the blanking area is arranged on one side, far away from the feeding area, of the cutting area and used for conveying the plurality of sub-substrates, and conveying belts are arranged in the feeding area and the blanking area;

a moving means disposed between the cutting region and the inspection region to move the laser from the cutting region to the inspection region;

wherein, include in the cutting zone:

a laser for emitting a laser beam;

an optical path system that directs the laser beam to a steering assembly that directionally adjusts the laser beam so that the laser beam cuts the substrate;

the direction adjusting assembly comprises a plane reflecting mirror and a focusing mirror; the plane mirror is rotatably arranged and is used for receiving the laser beam emitted by the optical path system and reflecting the laser beam so as to adjust and change the direction of the laser beam; and the focusing lens focuses the laser beam with the changed direction and acts a focusing point on the substrate.

In summary, the present invention provides a substrate cutting apparatus, wherein an inspection area is disposed at one side of a cutting area, and the inspection area is used for detecting a state of a laser beam emitted by a laser, so as to ensure that the laser beam is always in the same state, thereby improving a processing precision of the substrate cutting apparatus and improving a processing quality of a substrate.

Drawings

FIG. 1: the substrate cutting apparatus according to the present embodiment is schematically illustrated.

FIG. 1A: the substrate in this embodiment is schematically illustrated.

FIG. 2: the present embodiment is a schematic diagram of a cutting zone.

FIG. 3: a schematic illustration of the examination zone in this embodiment.

FIG. 4: single-sided view of the laser beam through the additive package in this embodiment.

FIG. 5: the position dislocation pattern of the laser beam perceived in this example.

FIG. 6: the energy distribution of the single face of the laser beam in this embodiment is in a normal and abnormal pattern.

FIG. 7: in this embodiment, the laser is driven by the driving unit to adjust the size of the laser.

FIG. 8: another structure of the inspection area in this embodiment.

FIG. 9: the structure schematic diagram of the optical path system and the direction adjusting component.

Detailed Description

The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.

It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the drawings only show the components related to the present invention rather than being drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of each component in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.

As shown in fig. 1, the present embodiment provides a substrate cutting apparatus 10, and the substrate cutting apparatus 10 includes a loading area 100, a cutting area 200, a blanking area 300, and an inspection area 400. The feeding area 100, the cutting area 200 and the discharging area 300 are sequentially connected, the feeding area 200 is used for conveying a substrate a, the cutting area 200 is used for cutting the substrate a to form a plurality of sub-substrates, and the discharging area 300 is used for conveying a plurality of sub-substrates. Conveyer belts are arranged in the feeding area 100 and the blanking area 300, and the conveyer belts are used for conveying the substrate A or the sub-substrate under the action of the driving rollers.

As shown in fig. 1A, in the present embodiment, the substrate a is, for example, an Organic Light-Emitting Diode (OLED) display panel, and includes a two-layer structure connected as a whole: a first structural layer 1 and a second structural layer 2. The first structural layer 1 comprises a Polyethylene Terephthalate material (PET) with a thickness of, for example, 100 and 150 μm. The second structural layer 2 comprises a Polyimide material (PI) with a thickness of, for example, 20 μm. The polyimide material layer of the second structural layer 2 is provided with a functional circuit and is a functional area of the OLED display panel, and the polyethylene glycol terephthalate material layer of the first structural layer 1 is a protective layer and is used for packaging and protecting the functional circuit and the light-transmitting display in the second structural layer 2. The substrate a further comprises a base layer 3, said base layer 3 being a layer of encapsulating glass, for example 500 μm thick. The other side of the second structural layer 2 opposite to the first structural layer 1 is combined with the base layer 3, so that the second structural layer 2 is in an intermediate layer state, and a functional circuit in the second structural layer 2 is in a packaging protection state.

As shown in fig. 1, in the present embodiment, the inspection region 400 is disposed at one side of the cutting region 200 and connected to the cutting region 200. Between the inspection area 400 and the cutting area 200, there is also provided a moving means (not shown) by which the laser in the cutting area 200 can be moved into the inspection area 400 for inspection thereof.

As shown in fig. 2, in the present embodiment, a laser 201 is disposed in the cutting area 200, the laser 201 can emit a laser beam, and the substrate a can be scribed or cut by the laser beam, and the laser beam emitted by the laser 201 has a dot size of, for example, 30 to 40 microns, such as, for example, 35 microns. The cutting area 200 further includes a protection unit 202, the protection unit 202 is used for protecting the laser 201, the cutting area 200 further includes a cooling unit 203, the cooling unit 203 is used for cooling the laser 201, the cutting area 200 further includes a monitoring unit 204, the monitoring unit 204 is connected with the laser 201, and therefore the cutting process of the laser 201 can be known in real time through the monitoring unit 204.

As shown in fig. 1 and 3, in the present embodiment, after the laser 201 enters the inspection area 400 by moving parts, the inspection area 400 starts to detect the laser 201. The examination region 400 includes a reflection assembly 401, an attenuation assembly 402, an augmentation assembly 403, a sensing assembly 404, and a control assembly 405. The reflection component 401, the attenuation component 402, the additional distribution component 403, the sensing component 404 and the control component 405 are connected in sequence.

As shown in fig. 3, in the present embodiment, the laser 201 is located above the reflection assembly 401, that is, the laser beam emitted by the laser 201 exits from a first direction, and after the laser beam encounters the reflection assembly 401, the direction of the laser beam changes to a second direction, and the first direction is perpendicular to the second direction. In this embodiment, the attenuation module 402, the dispensing module 403, the sensing module 404 and the control module 405 are sequentially disposed in the second direction of the laser beam. In this embodiment, the reflection component 401 is used for reflecting the laser beam so that the direction of the laser beam is converted from the first direction to the second direction, and the reflection component 401 may be a mirror, for example.

As shown in fig. 3, in the present embodiment, an attenuation unit 402 is disposed on one side of the reflection unit 401, and the attenuation unit 402 is used for attenuating the energy of the laser beam, and if the attenuation unit 402 is not disposed, the sensing member 404 may be damaged due to the excessively high energy of the laser beam.

As shown in fig. 3, in the present embodiment, a matching component 403 is disposed on the other side of the attenuation component 402, that is, the attenuation component 402 is located between the reflection component 401 and the matching component 403. The dispensing assembly 403 is used to dispense a single size of laser beam. In the present embodiment, the spot size of the laser beam is, for example, 20 to 50 μm, and thus there is a limitation in checking the laser beam state such as the energy distribution of the laser beam. Therefore, the state of the laser beam can be checked by increasing the dot size, but the dot size of the laser beam suitable for the cutting work of the substrate a is controlled to be 20 to 50 μm, and if the dot size of the laser beam is increased, the energy distribution of the laser beam is deformed and the like unlike the initial state of the laser beam for cutting the substrate a, the energy distribution of the laser beam cannot maintain the distribution state, and the processing accuracy is lowered. Thus, while maintaining the spot size of the laser beam, the additive package may be used to increase only a single side of the laser beam. In this embodiment, the laser beam is increased in size on one side by the increasing unit 403, and the state of the laser beam can be checked while maintaining the dot size of the laser beam, so that the energy distribution state of the laser beam is maintained, and the reduction in the processing accuracy can be prevented.

As shown in fig. 3, in the present embodiment, a sensing component 404 is disposed on one side of the additive component 403, that is, the additive component 403 is located between the attenuation component 402 and the sensing component 404. In this embodiment, the sensing assembly 404 includes a plurality of pixels 404a, and a portion of the pixels 404a form a sensing region for sensing the added laser beam. Specifically, the sensing field is a single side for sensing the added laser beam, and the sensing field is formed according to the size of the single side of the added laser beam, namely the sensing field and the added laser beam have the same size.

As shown in fig. 3-4, the size of the pixel 404a is, for example, 5 micrometers, and the dot size of the laser beam is, for example, 20-50 micrometers, because the dot size of the laser beam is small, so that the laser beam can be sensed. As can be seen from fig. 4(a), the single side of the laser beam incident on the sensing unit 404 is relatively small, and the first sensing region 4041 capable of sensing the single side of the laser beam is also relatively small because the single side of the laser beam is relatively small in size, and the first sensing region is relatively small, so that information for checking the state of the laser beam is lacking. Therefore, since the state of the laser beam cannot be precisely checked, the laser beam having an increased size on one side can be sensed. As can be seen from fig. 4(b), the laser beam incident on the sensing unit 404 is a single-sided laser beam that is added by the adding unit 403, and as the single-sided size of the laser beam becomes larger, the second sensing region 4042 also becomes larger, so that information of the laser beam can be sufficiently inspected, and therefore, the sensing region senses the added laser beam to inspect the state of the laser beam. In this embodiment, the sensing component 404 is, for example, a digital camera, and further is, for example, a CCD camera using a Charge Coupled Device (CCD).

As shown in fig. 3, in the present embodiment, the control component 405 is located at one side of the sensing component 404, that is, the sensing component 404 is located between the control component 405 and the additional assembly 403. The control component 405 will recognize the position, single-sided energy distribution or size of the laser beam as sensed by the sensing component 404. Specifically, the control unit 405 calculates a position error of the sensing region from the sensing unit 404, thereby determining a single-sided energy distribution state of the laser beam added to the sensing region.

As shown in fig. 5, in the present embodiment, the control unit 405 defines the power supply value at which the laser beam is set at the central portion 404b of the sensing unit 404 as a standard value, and calculates the difference in position between the central portion 404b of the sensing unit 404 and the sensing area. For example, if the laser beam is positioned at the center portion 404b of the sensing unit 404 and the set power value is 0V, the laser 201 recognizes 0V, reflects the laser beam onto the sensing unit 404, calculates the distance between the center portion 404b of the sensing unit and the center portion of the sensing area and the pixel, and calculates the position error of the center portion of the sensing area from the center portion 404b of the sensing unit 404. As can be seen in fig. 5 (a). When the laser 201 recognizes 0V, when the sensing unit 404 reflects the laser beam, if the central portion 404b of the sensing unit 404 is coincident with the central portion of the sensing region 4043, the sensing unit 404 does not have a position error of the sensing region 4043, and the control unit 4045 determines that the laser is in a normal state. As can be seen from fig. 5(b), when the laser 201 recognizes 0V, when the laser beam is reflected by the sensing component 404, if the central portion 404b of the sensing component 404 is not coincident with the central portion of the sensing region 4043, the distance (dx, dy) between the pixels between the central portion 404b of the sensing component 404 and the central portion of the sensing region 4043 is calculated, and the position error is calculated. Therefore, the control module 405 may determine that the laser 201 is in an abnormal state, and may perform maintenance on the laser 201 so that the state of the laser 201 is in a normal state. Therefore, the control module 405 can calculate the position error of the sensing region 4043 from the sensing module 404, thereby determining the working state of the laser 201 and effectively preventing the processing precision of the laser from being reduced.

As shown in fig. 6, in the present embodiment, the process of the single-sided energy distribution state of the added laser beam is described by the sensing region. In this embodiment, the difference in brightness of pixels is calculated in a contour line form in the sensing region, and whether the single-sided energy distribution of the laser beam is normal is determined by whether the contour lines are symmetrical to each other. For example, in the sensing area, the denser the energy is used, the brighter the pixel brightness is, the single-sided energy distribution of the laser beam for calculation and addition is formed by contour lines, and when the brightness difference of the pixel is calculated in the contour line form, if the single-sided energy distribution of the laser beam is symmetrical, the laser beam is judged to be normal, and if the single-sided energy distribution of the laser beam is asymmetrical, the laser beam is judged to be abnormal. As can be seen from fig. 6(a), the single-sided energy distribution of the laser beam is bilaterally symmetric, and the single-sided energy distribution state of the laser beam is normal, so the substrate a can be processed using the normal laser beam. As can be seen from fig. 6(b), if the single-sided energy distribution of the laser beam is left-right asymmetric, the single-sided energy distribution state of the laser beam is abnormal, and thus the substrate a cannot be processed with the abnormal laser beam. The control module 405 can check the state of the laser beam by distinguishing the single-sided energy distribution state of the laser beam added in the sensing region to determine whether the laser is in a normal state.

As shown in fig. 3 to 7, in the present embodiment, a driving means (not shown) for raising and lowering the laser 201 to adjust the size of the circular surface of the laser beam is provided in the inspection area 400. Note that a first laser 201a and a second laser 201b are provided in the dicing area 200, and fig. 7 does not show other parts such as an attenuation module. In this embodiment, the first laser 201a and the second laser 201b can be moved up and down by the driving member. In this embodiment, in the process of assembling the first laser 201a and the second laser 201b, the distances between the first laser 201a, the second laser 201b and the substrate a may be different, and if the distances between the first laser 201a, the second laser 201b and the substrate a are different, the laser quality of the substrate a processed by the first laser 201a and the second laser 202b may also be different. As can be seen from fig. 7(a), the distance D1 between the first laser 201a and the reflective member 401, the distance D2 between the second laser 201b and the reflective member 401, and D2 are greater than D1, and the size of the sensing region 406a formed by the first laser 201a and the size of the sensing region 406b formed by the second laser 201b are different, so that it can be determined that the distance D1 between the first laser 201a and the reflective member 401, and the distances D2, D2, and D1 between the second laser 201b and the reflective member 401 are different. That is, the distances between the first laser 201a and the second laser 202b and the substrate a are also different, and therefore, adjustment is required so that the distances between the first laser 201a and the second laser 202b and the substrate a are kept uniform. In this embodiment, the control component 405 may calculate the number of pixels within the perception region 406a and the perception region 406 b. As can be seen from fig. 7(a), the sensing region 406a formed by the first laser 201a and the sensing region 406b formed by the second laser 201b are equal in size, so that it can be determined that the distance D1 between the first laser 201a and the reflective component 401 is equal to the distance D2 between the second laser 201b and the reflective component 401, that is, the distances between the first laser 201a and the second laser 201b and the substrate a are the same, and therefore, the processing precision of the first laser 201a and the second laser 201b is the same. Of course, in other embodiments, a third laser, a fourth laser, etc. may be provided, and the third laser and the fourth laser may also be respectively submitted to the driving component to move up and down.

As shown in fig. 3 and 8, fig. 8 is another structural diagram of the inspection area in the present embodiment, and fig. 8 is different from fig. 3 in that two attenuation components, namely, a first attenuation component 402a and a second attenuation component 402b are arranged in fig. 8, the first attenuation component 402a is located between the reflection component 410 and the additional distribution component 403, and the second attenuation component 402b is located between the additional distribution component 403 and the sensing component 404. The first attenuation component 402a and the second attenuation component 402b may attenuate the energy of the laser beam, preventing the sensing component 404 from being damaged.

As shown in fig. 9, in the present embodiment, an optical path system 205 and a direction-adjusting component 206 may be further disposed in the cutting area 200, the laser beam emitted by the laser 201 enters the optical path system 205, and the optical path system 205 guides the laser beam to the direction-adjusting component 206. In this embodiment, the laser 201 may be a carbon dioxide laser, and the laser beam emitted by the laser 201 has a wavelength of 8-15 μm.

As shown in fig. 9, the optical path system 205 employs optical components so that the laser beam emitted from the laser 201 can be directed to the steering assembly 205. The optical path system 205 includes a beam expander 205a, and the beam expander 205a can expand and collimate the laser beam emitted from the laser 201, so that a backward optical path can be focused to obtain a smaller light spot, and the light spot can act on the cutting line on the substrate a. The optical path system 205 further includes a reflecting mirror 205b, and the reflecting mirror 205b can perform path change on the laser beam emitted from the beam expander 205 a. In order to obtain a better laser beam path, a plurality of lenses or mirrors may be added to the optical path system 205.

As shown in fig. 9, the direction adjustment component 206 is used for adjusting the direction of the laser beam emitted from the optical path system 205. Optionally, the steering assembly 206 includes a plane mirror 206 a. The plane mirror 206a is rotatably disposed to receive the laser beam emitted from the optical path system 205 and reflect the laser beam. The plane mirror 206a is rotationally adjusted, and the direction of the laser beam reflected by the plane mirror 206a is changed, thereby realizing direction adjustment. The plane mirror 206a can make the direction of the laser beam change greatly, and the plane mirror 206a is adjusted by rotating a small angle, so that the laser beam can change along with the large direction, and the adjustment of the direction of the laser beam is sensitive and convenient.

In some embodiments, the steering assembly 206 includes a plurality of planar mirrors 206 a. Combined by a plurality of plane mirrors 206a to make the laser beam steering more convenient and flexible. Of course, in yet another embodiment, the direction-adjusting component 206 may further include one or more lenses, which may not only be used for changing the direction of the laser beam light path, but may also shape the laser beam to collimate and stabilize the laser beam propagation.

As shown in fig. 9, the direction-adjusting assembly 206 further includes a focusing mirror 206 b. The laser beam emitted through the plane mirror 206a is focused by the focusing mirror 206b, and a focusing point is applied to the substrate a. And focusing the laser beam to ensure that the laser beam has small facula, high energy density and small cutting trace, has low additional influence on the substrate A and ensures the quality of a cut product.

In summary, the invention provides a substrate cutting device, which is provided with an inspection area, and the inspection area can inspect a laser in the cutting area, so that the laser always keeps a normal working state, thereby preventing the laser from being abnormal, effectively improving the processing precision of the substrate cutting device, and improving the processing quality.

The above description is only a preferred embodiment of the present application and a description of the applied technical principle, and it should be understood by those skilled in the art that the scope of the present invention related to the present application is not limited to the technical solution of the specific combination of the above technical features, and also covers other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the inventive concept, for example, the technical solutions formed by mutually replacing the above features with (but not limited to) technical features having similar functions disclosed in the present application.

Other technical features than those described in the specification are known to those skilled in the art, and are not described herein in detail in order to highlight the innovative features of the present invention.

Claims

1. A substrate cutting apparatus, comprising,

a loading area for transporting the substrate;

2. The substrate cutting apparatus according to claim 1, wherein a driving means for lifting and lowering the laser is provided in the inspection area.

3. The substrate cutting apparatus of claim 1, wherein the inspection zone comprises a reflection assembly, an attenuation assembly, a dispensing assembly, a sensing assembly, and a control assembly.

4. The substrate cutting apparatus according to claim 3, wherein the reflection assembly is disposed at a position of the laser beam emitted from the laser and converts a direction of the laser beam from a first direction to a second direction.

5. The substrate cutting apparatus according to claim 4, wherein the attenuation member is disposed at a side of the reflection member, the attenuation member being disposed in the second direction, the attenuation member being configured to attenuate energy of the laser beam.

6. The substrate cutting apparatus of claim 4, wherein the additive assembly is disposed to one side of the attenuation assembly, the attenuation assembly being disposed between the reflection assembly and the additive assembly.

7. The substrate cutting apparatus of claim 4, wherein the sensing assembly is disposed on a side of the additive assembly, the additive assembly being disposed between the attenuation assembly and the sensing assembly.

8. The apparatus according to claim 4, wherein a sensing region is disposed in the sensing assembly, and the sensing region is configured to sense the laser beam.

9. The apparatus of claim 4, wherein the control assembly is disposed at a side of the sensing assembly, the control assembly being configured to identify a position of the laser beam.

10. A substrate cutting apparatus, comprising:

a loading area for transporting the substrate;

wherein, include in the cutting zone:

a laser for emitting a laser beam;