CN111834817A

CN111834817A - Interposer of sorter for electronic component test

Info

Publication number: CN111834817A
Application number: CN202010173117.5A
Authority: CN
Inventors: 崔僖峻; 权纯吾
Original assignee: Techwing Co Ltd
Current assignee: Techwing Co Ltd
Priority date: 2019-04-18
Filing date: 2020-03-13
Publication date: 2020-10-27
Also published as: KR20200122469A; CN115284533A; TWI729743B; TW202040149A

Abstract

The present invention relates to an interposer of a handler for testing electronic components. The insert according to the invention has at least one supporting projection which projects inwardly from the wall surface in the following manner: the side surface of the electronic component placed on the placement space is supported by protruding inward from at least any one of the four wall surfaces so that the positions of the electronic components can be aligned. According to the present invention, it is possible to appropriately guide the lowering movement of the electronic component mounted on the interposer, and to accurately set the position of the electronic component mounted on the interposer, thereby minimizing the insertion phenomenon or minimizing the occurrence of a failure in the removal work by reducing the insertion force.

Description

Interposer of sorter for electronic component test

Technical Field

The present invention relates to a handler for testing electronic components, and more particularly, to a technique for accurately arranging electronic components for electrical connection between the electronic components and a tester.

Background

The produced electronic components are separated into good products and defective products after being tested by the testing machine, and then only the good products are shipped. In the process of delivering only good products after electronic components are produced in this manner, a handler for electronic component testing (hereinafter, simply referred to as "handler") performs operations such as electrically connecting the electronic components to a tester or sorting the electronic components.

The handler can be manufactured and supplied in various forms according to the kind of electronic components, the purpose of testing, and the like.

In addition, observing the semiconductor element in the electronic component, due to the development of integration technology and the like, when the semiconductor element in a wafer state is packaged, the number of terminals of the semiconductor element connected to external terminals increases. In addition, various packaging technologies such as a Package On Package (POP) in which a plurality of semiconductor elements are formed into one Package, a Multi Chip Package (MCP) in which a plurality of semiconductor elements in a wafer state are formed into one Package, and the like have been developed, and thus the number of terminals of a semiconductor element to be finally produced has been further increased. On the contrary, since the smaller the size of the semiconductor device as a final product, the higher the degree of flexibility thereof, manufacturers producing the semiconductor device are trying to form a larger number of terminals in a limited area. Therefore, in a manner of reducing the terminal size of the semiconductor element and the interval between the terminals, it is desired to further reduce the terminal size of the semiconductor element and the interval between the terminals later due to such a technical direction. In addition, tolerance management of the external dimensions of the semiconductor element as a final finished product is also becoming finer and finer. Therefore, there is an increasing demand for more precise electrical connection between the semiconductor element and a test socket provided in a tester.

If the terminals of the semiconductor element and the terminals of the test socket cannot be precisely matched, the test may be defective due to the sensible heat, and the semiconductor element or the test socket may be damaged during the electrical connection between the semiconductor element and the test socket.

Accordingly, the most important technique for all sorts that perform the work of electrically connecting electronic components with test sockets is the precise electrical connection of the electronic components with the tester.

Many types of sorting machines electrically connect electronic components to a testing machine in a state where the electronic components are mounted on an interposer (may be called a loading module, an insertion module, a component slot, or the like, in addition to the interposer). In this way, when the electronic component is electrically connected to the tester in a state of being mounted on the interposer, the placement state of the electronic component mounted on the interposer determines the quality of the electrical connection between the electronic component and the tester. With respect to the above, reference may be made to the technology proposed by korean laid-open patent No. 10-2008-0062970 (hereinafter referred to as "prior art").

The related art adopts a structure in which electronic components mounted on an interposer (referred to as an "interposer module" in the related art) are aligned using an advancing and retreating member that elastically advances and retreats. However, the prior art has problems in that the structure is complicated, a large number of parts are required, and the production cost is increased due to the complicated assembly process which must be performed.

Due to the problems of the prior art as described above, the conventional insert cannot have an advancing and retreating member capable of elastically swimming. The tolerances or quality of the insert are more carefully managed in correspondence with the accuracy of the electronic components.

In order to achieve a precise connection between the electronic components and the test socket, the electronic components must be arranged precisely in the installation space of the insert, and the tolerance or quality control of the insert for this purpose means the control of the tolerance or quality of the wall surfaces which ultimately form the installation space of the body.

Typically, the body of the insert is produced by injection molding. But has problems as described below.

First, the wall surface constituting the seating space may be irregularly formed due to deformation of the body during cooling after injection molding due to the presence of burrs (burr) in the injection-molded body or uneven mixing of injection raw materials. In this case, after the electronic component mounted on the interposer is inserted into the wall surface constituting the mounting space, the pickup may fail to take out the electronic component due to insufficient suction force of the pickup. Further, the electronic component guided and lowered by the wall surface may be poorly guided in its movement, which may cause the electronic component to be improperly seated on the interposer, which may cause malfunction of a latch for fixing the electronic component seated on the interposer, poor electrical connection between the electronic component and the tester, and damage to the electronic component. In order to solve this problem, the following additional processing is performed: the injection molding apparatus is configured to remove burrs existing on a wall surface constituting a housing space of an injection molded body, or to smoothly polish the entire wall surface constituting the housing space. Of course, the additional machining must be carried out carefully, thus consuming a very large amount of time and resulting in a corresponding increase in the production costs of the insert. Also, it may be difficult to remove burrs existing at the main body (e.g., burrs existing at corners of the seating space) according to circumstances, and thus the main body itself may have to be discarded.

Secondly, since the width of the mounting space and the outer dimensions or shape of the electronic component are also managed within a fine tolerance, there is a possibility that the width of the mounting space does not reach the width required for the outer dimensions or shape of the electronic component, and in this case, since the electronic component is firmly inserted into the wall surface constituting the mounting space, the electronic component is not sufficiently gripped and taken out only by the suction force of the pickup, and therefore, there is a possibility that a failure occurs in the work of taking out the electronic component from the interposer.

Disclosure of Invention

The object of the present invention is as follows.

First, there is provided a technology capable of appropriately guiding the descent of an electronic component during a descending movement of the electronic component for seating on an interposer and capable of minimizing contact between the electronic component and the interposer.

Second, a technique is provided that enables precise placement of electronic components mounted on an interposer and easy removal of the electronic components from the interposer.

Third, a technique is provided that can minimize the number of management sites that require precision in the manufacture of the interposer.

An interposer of a handler for testing electronic components according to a first aspect of the present invention includes: a main body having a placement space in which electronic components can be placed so as to move from above to below; and a support portion which supports the electronic component to prevent the electronic component placed in the placement space from falling downward, and is coupled to the main body portion or is formed integrally with the main body portion, wherein the main body portion includes: four wall surfaces forming the seating space; and at least one guide rail protruding inward from at least any one of the four wall surfaces to guide a downward movement of the electronic component, wherein the guide rail is long in a vertical direction which is a mounting movement direction of the electronic component mounted in the mounting space.

The guide rail is provided in plurality on each wall surface.

The distance between the guide rails formed by two wall surfaces facing each other among the four wall surfaces decreases downward.

The guide rail is formed integrally with the wall surface by injection molding using the same material as the wall surface.

The guide rails are provided two per wall surface, and a distance between the two guide rails is greater than a distance from the guide rails to corners of the seating space.

The guide rail is spaced apart from corners of the seating space.

The guide rail is formed to continuously extend from an upper end of the seating space to a lower end of the seating space.

The width of the guide rail in the horizontal direction is smaller than the width of the wall surface in the horizontal direction.

The guide rail includes: a first guide section on the upper side for guiding the placement of the electronic component moving downward; and a second guide section for supporting a side surface of the mounted electronic component, wherein, in two wall surfaces facing each other, the interval between the first guide sections facing each other is smaller toward the lower side, and the interval between the second guide sections is kept uniform even toward the lower side.

The length of the first guide section is greater than the length of the second guide section.

The upper and lower length of the second guide section is at least equal to or greater than the upper and lower length of the electronic component.

According to a second aspect of the present invention, an interposer for a handler for testing electronic components includes: a main body having a placement space in which electronic components can be placed so as to move from above to below; and a support portion which supports the electronic component to prevent the electronic component placed in the placement space from falling downward, and is coupled to the main body portion or is formed integrally with the main body portion, wherein the main body portion includes: four wall surfaces forming the seating space; and a support protrusion protruding inward from the wall surface in such a manner that: and a support protrusion protruding inward from at least any one of the four wall surfaces to support a side surface of the electronic component placed on the placement space so that positions of the electronic component can be aligned, wherein the support protrusion is fixed to the wall surface so as to inhibit play of a lower end.

The support protrusion is long in a vertical direction which is a mounting moving direction of the electronic component mounted in the mounting space, an upper end of the support protrusion is located on an upper side with respect to a middle point of a vertical length of the wall surface, and a lower end of the support protrusion is located on a lower side with respect to the middle point.

The invention has the following effects:

first, since it is possible to appropriately guide the lowering of the electronic component and minimize interference between the electronic component and the interposer during the lowering movement of the electronic component, it is possible to minimize the distortion of the electronic component itself during the lowering movement, so that the probability that the electronic component can be appropriately seated on the interposer is increased.

Second, it is possible to precisely arrange the electronic components mounted on the interposer and minimize the phenomenon that the electronic components are inserted into the wall surfaces constituting the mounting space of the interposer, and thus it is possible to easily take out the electronic components from the interposer, thereby reducing the probability of occurrence of a failure in the work of taking out the electronic components from the interposer.

Third, since the number of management parts requiring precision is greatly reduced, post-processing is simple and time consumption is reduced after injection molding the body, thereby reducing production costs.

Drawings

Fig. 1 is a schematic and exaggerated plan view of an interposer of a handler for electronic parts test according to the present invention.

Fig. 2 is a sectional perspective view taken along line I-I of fig. 1.

Fig. 3 is a reference diagram for explaining a support function of the guide rail GR.

Fig. 4 to 6 are reference views for illustrating various forms of guide rails equipped to an insert according to the present invention.

Fig. 7 is a reference view for explaining a support portion (a support portion having a different form from that of fig. 1) provided as an insert according to the present invention.

Fig. 8 shows an insert according to the invention having a different configuration than that of fig. 1.

Fig. 9 is a reference view for explaining a plurality of forms of a guide rail equipped to an insert according to the present invention.

Fig. 10 is a schematic perspective view of a test tray relating to the present invention.

Description of the symbols

TT: the test tray 10: insert piece

11: a main body section (S): arrangement space

WF: wall surface GR: guide rail

12: support portion 20: setting frame

Detailed Description

Preferred embodiments according to the present invention are described with reference to the accompanying drawings, and descriptions of overlapping or substantially identical structures are omitted or compressed as much as possible for the sake of simplicity of description.

Fig. 1 is a schematic and exaggerated plan view of an interposer 10 (hereinafter, simply referred to as "interposer") of a handler for electronic parts test according to the present invention.

As shown in fig. 1, the insert 10 includes a main body portion 11, a support portion 12, and a latch portion 13.

The main body 11 is injection molded from a synthetic resin material and has a mounting space S in which electronic components can be mounted. The housing space S is formed by four wall surfaces WF.

Conventionally, when the electronic component is mounted on the interposer, the four wall surfaces perform a function of guiding the descending movement of the electronic component and a function of supporting and aligning the side surfaces of the electronic component, but with the interposer 10 according to the present invention, the four wall surfaces WF do not perform such a function but perform a function for providing a guide rail GR described later.

The guide rail GR guides a descending movement of the electronic parts disposed at the seating space S. For this purpose, the guide rail GR is formed to protrude inward from the wall surface WF. Here, the inward projection from the wall surface WF means a projection from the wall surface WF toward the installation space S.

As shown in a side sectional perspective view of fig. 2 (taken along line I-I of fig. 1), in the present embodiment, the upper end of the guide rail GR is integrally attached to the upper end of the wall surface WF, and the lower end of the guide rail GR is integrally attached to the upper end portion of the wall surface WF. That is, the guide rail GR is formed to continuously extend from the upper end TT of the installation space S to the lower end BT of the installation space S. Here, the upper end TT is a position where the seating space S starts, and the lower end BT represents a position where the lower surface of the electronic component contacts the upper surface of the support portion 12. Therefore, the guide rail GR has a vertically long shape in the placement moving direction of the electronic component placed in the placement space S. Here, the insert 10 according to the present embodiment is formed to be inclined at a predetermined angle so that the distance between the facing wall surfaces WF decreases downward, and the guide rails GR formed to be protruded on the facing wall surfaces WF are also formed to be inclined at a predetermined angle so that the distance between the facing wall surfaces WF decreases downward.

In the present embodiment, two guide rails GR are arranged on each wall surface WF. However, according to the embodiment, the width of the guide rail GR in the horizontal direction may be further increased so as to be provided one for each wall surface WF within a limit that the downward movement of the electronic component can be appropriately guided, and conversely, three or more guide rails may be provided. In a specific embodiment, it is also conceivable to omit the guide rail GR on a part of the wall surface WF side. Of course, if it is considered that the descending movement of the electronic parts is appropriately guided while minimizing the contact interference between the electronic parts descending on the seating space S and the interposer 10, the guide rails GR are preferably arranged two by two per wall surface WF, as in the present embodiment. In order to guide the downward movement of the electronic component in a balanced and stable manner, it is preferable that the two guide rails GR provided together with the one wall surface WF are spaced apart as far as possible from each other symmetrically with respect to the center line of the wall surface WF, but are preferably spaced apart from the corners E of the mounting space S. This is because the corner E of the mounting space S is a point where the two wall surfaces WF meet, and the probability of burrs being present is high, and the corner of the electronic component is also highly likely to be present, so that it is an object to prevent interference between the corner of the electronic component mounted on the interposer 10 and the corner E of the mounting space S as much as possible. If the corner E of the placement space S and the corner E of the electronic component placed on the interposer 10 are spaced from each other as described above, it is also preferable to ensure a working space for a tool required for performing post-processing for making the guide rail GR smooth and flat. Of course, the horizontal width of the guide rail GR is smaller than the horizontal width of the wall surface WF in terms of minimizing the management area.

However, as described above, the greater the distance between the two guide rails GR, the more stably the descending movement of the electronic parts by the guide rails GR can be performed, and thus the distance between the two guide rails GR is preferably greater than the distance from the guide rails GR to the corner E of the seating space S. Here, the distance from the guide rail GR to the corner E of the installation space S indicates the distance between the specific guide rail GR and the corner E closest to the specific guide rail GR.

Further, since the main body 11 is injection molded, the guide rail GR is preferably integrally injection molded from the same synthetic resin material as the wall surface WF. Of course, according to the embodiment, the guide rail GR may be formed of a separate metal, inserted into the body portion 11, and injection-molded by an injection molding method. If the guide rail GR is made of metal, the injection molding cost increases, but the step of polishing the guide rail GR can be omitted in the post-processing.

Also, as shown in the exaggerated fig. 3, the lower end of the guide rail GR forms a chuck J together with the support portion 12, thus supporting the side of the electronic component D placed on the seating space S, thereby serving to maintain the precise position of the electronic component D. The guide rail GR may also be named a support protrusion for supporting a side of the electronic component D in terms of maintaining the position of the electronic component D seated in the seating space S as described above. Also, in order to appropriately guide the descending movement of the falling electronic component D, as described above, the distance between the guide rails GR formed by the two wall surfaces WF facing each other is preferably implemented to be smaller as going downward. However, the present invention is not limited to the embodiment shown in fig. 3, and thus, the embodiment shown in fig. 4 or fig. 5 may be exaggerated.

For reference, in fig. 4, the guide rail GR is provided in an almost vertical state, and in fig. 5, although the guide rail GR is formed obliquely, a lower end portion thereof may be converted into a vertical state to be able to more reliably support a side surface of the electronic component D.

With further reference to the example of fig. 5, the guide rail GR may be divided into a first guide section S1 on the upper side and a second guide section S2 on the lower side. The first guide section S1 is configured to guide the electronic component D moving downward from above, and the second guide section S2 is configured to stably support the mounted electronic component D. Therefore, in the two wall surfaces facing each other, the distance between the first guide sections S1 facing each other decreases downward, and the distance between the second guide sections S2 is kept uniform even when the distance decreases downward. The reason for this is to ensure stability in making electrical contact between the electronic component D mounted on the interposer 10 and the test socket of the tester. This can be understood by exaggeratedly comparing fig. 6 (a) and fig. 6 (b).

If the electronic component D is seated in the interposer 10, the interposer 10 is forced to move downward in order to maintain proper electrical contact between the electronic component D and the test socket TS. At this time, the electronic component D may be in a state of being relatively slightly tilted due to the repulsive force of the test socket TS. However, when the electronic component D is in a relatively tilted state, one side of the electronic component D may be tilted from the other side as shown in fig. 6 (a) due to various mechanical errors of the test socket TS, the electronic component D, and the interposer 10. When the electronic component is in the state shown in fig. 6 (a), the terminal T of the electronic component D is brought into contact with the terminal T₁Terminal T of test socket TS₂Cannot be properly contacted with each other, and at the terminal T₁、T₂May be further magnified in the trend towards smaller and smaller dimensions and spacings due to the development of integration technology. In contrast, referring to the example of fig. 6 (b) having the second guide section S2, even if the electronic component D is relatively tilted due to the repulsive force of the test socket TS, since the second guide section S2 stably supports the side of the electronic component D so that the electronic component D maintains the balance and is tilted, the terminals T of the electronic component D₁Terminal T of test socket TS₂Maintaining proper contact state therebetween. Of course, it is necessary to make the degree to which the electronic component D is tilted small and to minimize the section into which the electronic component D can be inserted, and thus the length of the second guide section S2 is much smaller than the length of the first guide section S1, and the up-down length of the second guide section S2 is at least equal to or greater than the up-down length (thickness) of the electronic component D.

The support portion 12 supports the bottom surface of the electronic component D, thereby preventing the electronic component D placed in the installation space S from falling downward. In the present embodiment, as the support portion 12, a support film formed with an exposure hole H capable of exposing the terminal of the electronic component D downward is provided. Therefore, the support portion 12 can be coupled to the main body portion 11 through a separate process. However, according to the embodiment, as shown in fig. 7, the support portion 12 may be provided in the form of a support base that is integrally injection-molded with the main body portion 11. Various techniques related to such a support portion of fig. 7 or other forms are already known from many patent documents, and therefore, description thereof is omitted.

The latch 13 fixes or releases the electronic component D mounted on the interposer 10. Fig. 1 shows a state where the electronic component D is fixed by the latch 13. Various techniques related to such a latch portion 13 are also known from many patent documents, and therefore, detailed description of functions and configurations thereof will be omitted.

With the insert 10 according to the invention as described above, the post-machining is very simple and takes little time. This is because only the inner surface of the guide rail GR is a management portion requiring precision. Therefore, if there is no particular reason, the operator can finish the post-processing of the main body 11 by simply smoothing the inner surface of the guide rail GR.

According to the present invention, since the lower ends of the guide rails GR perform a function of supporting protrusions that support the side surfaces of the electronic components D mounted on the interposer 10 fixed to the wall surface WF in a manner of inhibiting play, the electronic components D mounted on the interposer 10 may be inserted between the guide rails GR facing each other due to a tolerance. However, since the contact portion to be inserted is a very narrow portion, the strength of insertion is weak, and therefore, when the electronic component D is thereafter sucked and held by a pickup (not shown) and taken out from the interposer 10, the suction force of the pickup is larger than the insertion frictional force of the electronic component D, and therefore, the occurrence of a failure in the work of taking out the electronic component D from the interposer 10 can be minimized.

As shown in the modification of fig. 8, the guide rail GR may be formed only in a portion below the wall surface WF with reference to the vertical direction. In this case, in order to appropriately guide the downward movement of the falling electronic component D by the guide rail GR, it is preferable that an upper end T of the guide rail GR is located above a midpoint C of the vertical length of the wall surface WF, and a lower end of the guide rail GR is located below the midpoint C. That is, the guide rail GR can prevent improper guidance or the like that may occur due to the wall surface WF that can come into contact with all the side surfaces of the electronic component due to its four peripheral sides, the further upward the point where the guide rail GR follows the guide function from the wall surface WF. In particular, in the case of designing such that the width of the seating space S becomes smaller as going downward, the upper end of the guide rail GR is preferably disposed higher. Of course, the lower end of the guide rail GR must support the side surface of the electronic component D that is prohibited from falling off downward by the support portion 12, and therefore is preferably in contact with or attached to the support portion 12.

For reference, in the above-described embodiment, the guide rail GR has a rectangular shape when viewed from the plane, and the inner side surface of the guide rail GR has a flat surface, but in order to minimize the contact portion with the electronic component D, a trapezoidal shape may be provided in which the width in the horizontal direction decreases toward the inside, as shown in fig. 9 (a), or a rounded shape may be provided in which the width in the horizontal direction decreases toward the inside, as shown in fig. 9 (b).

Also, as shown in fig. 10, the insert 10 according to the present invention constitutes a test tray TT together with the setting frame 20 provided with the insert 10.

As described above, although the present invention has been specifically described based on the embodiments with reference to the accompanying drawings, the above-described embodiments are merely illustrative of the preferred embodiments of the present invention, and thus it should not be construed that the present invention is limited to the above-described embodiments, and the scope of the present invention should be construed in accordance with the scope of the claims and their equivalents.

Claims

1. An interposer of a handler for testing electronic parts, comprising:

a main body having a placement space in which electronic components can be placed so as to move from above to below; and

a support part which supports the electronic component to prevent the electronic component arranged in the arrangement space from falling downwards and is combined with the main body part or is integrally formed with the main body part,

wherein the main body portion includes:

four wall surfaces forming the seating space; and

at least one guide rail protruding inward from at least any one of the four wall surfaces to guide a downward movement of the electronic component,

wherein the guide rail is long in the vertical direction which is the mounting moving direction of the electronic component mounted in the mounting space.

2. The interposer of a handler for testing electronic parts according to claim 1,

the guide rail is provided in plurality on each wall surface.

3. The interposer of a handler for testing electronic parts according to claim 1,

4. The interposer of a handler for testing electronic parts according to claim 1,

5. The interposer of a handler for testing electronic parts according to claim 1,

the guide rails are provided with two in each wall,

the distance between the two guide rails is greater than the distance from the guide rails to the corners of the seating space.

6. The interposer of a handler for testing electronic parts according to claim 1,

the guide rail is spaced apart from corners of the seating space.

7. The interposer of a handler for testing electronic parts according to claim 1,

8. The interposer of a handler for testing electronic parts according to claim 1,

9. The interposer of a handler for testing electronic parts according to claim 1,

the guide rail includes:

a first guide section on the upper side for guiding the placement of the electronic component moving downward; and

a second guide section for supporting a side surface of the mounted electronic component,

in the two wall surfaces facing each other, the interval between the first guide sections facing each other is smaller toward the lower side, and the interval between the second guide sections is kept uniform even toward the lower side.

10. The interposer of a handler for testing electronic parts according to claim 9,

11. The interposer of a handler for testing electronic parts according to claim 10,

the upper and lower length of the second guide section is equal to or greater than the upper and lower length of the electronic component.

12. An interposer of a handler for testing electronic parts, comprising:

wherein the main body portion includes:

four wall surfaces forming the seating space; and

a support protrusion protruding inward from the wall surface in such a manner that: a side surface of the electronic component placed on the placement space is supported by protruding inward from at least any one of the four wall surfaces so that the positions of the electronic components can be aligned,

wherein the support protrusion is fixed to the wall surface so as to inhibit play of the lower end.

13. The interposer of a handler for testing electronic parts according to claim 12,

the support projection is long along the up-down direction of the arrangement moving direction of the electronic component arranged in the arrangement space,

the upper end of the support protrusion is located at an upper side with respect to a middle point of the vertical length of the wall surface, and the lower end of the support protrusion is located at a lower side with respect to the middle point.