CN111788254A - 液状有机硅化合物及掺合所述化合物的热硬化性树脂组合物 - Google Patents

液状有机硅化合物及掺合所述化合物的热硬化性树脂组合物 Download PDF

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Publication number
CN111788254A
CN111788254A CN201980013920.8A CN201980013920A CN111788254A CN 111788254 A CN111788254 A CN 111788254A CN 201980013920 A CN201980013920 A CN 201980013920A CN 111788254 A CN111788254 A CN 111788254A
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CN
China
Prior art keywords
resin composition
thermosetting resin
general formula
hydrocarbon group
organosilicon compound
Prior art date
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Withdrawn
Application number
CN201980013920.8A
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English (en)
Chinese (zh)
Inventor
石川健太郎
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JNC Corp
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JNC Corp
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Filing date
Publication date
Application filed by JNC Corp filed Critical JNC Corp
Publication of CN111788254A publication Critical patent/CN111788254A/zh
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
CN201980013920.8A 2018-02-20 2019-02-15 液状有机硅化合物及掺合所述化合物的热硬化性树脂组合物 Withdrawn CN111788254A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018-027674 2018-02-20
JP2018027674A JP2019143026A (ja) 2018-02-20 2018-02-20 液状有機ケイ素化合物、およびそれを配合した熱硬化性樹脂組成物
PCT/JP2019/005719 WO2019163686A1 (ja) 2018-02-20 2019-02-15 液状有機ケイ素化合物、およびそれを配合した熱硬化性樹脂組成物

Publications (1)

Publication Number Publication Date
CN111788254A true CN111788254A (zh) 2020-10-16

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Family Applications (1)

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CN201980013920.8A Withdrawn CN111788254A (zh) 2018-02-20 2019-02-15 液状有机硅化合物及掺合所述化合物的热硬化性树脂组合物

Country Status (5)

Country Link
JP (1) JP2019143026A (ja)
KR (1) KR20200123123A (ja)
CN (1) CN111788254A (ja)
TW (1) TW201934619A (ja)
WO (1) WO2019163686A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113039233A (zh) * 2018-12-04 2021-06-25 捷恩智株式会社 有机硅化合物、有机硅化合物的制造方法、热硬化性树脂组合物、成形体、及光半导体装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019143026A (ja) * 2018-02-20 2019-08-29 Jnc株式会社 液状有機ケイ素化合物、およびそれを配合した熱硬化性樹脂組成物
CN109867894B (zh) * 2018-12-28 2021-03-09 广西大学 一种耐高温uv聚合型本体发泡阻尼材料及其制备方法
JP7450218B2 (ja) 2020-05-11 2024-03-15 国立大学法人 熊本大学 架橋型ポリシロキサン接着剤

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007119627A1 (ja) * 2006-04-10 2007-10-25 Ube Industries, Ltd. 硬化性組成物、シルセスキオキサン硬化物、及びこれらの製造方法
JP2010116464A (ja) * 2008-11-12 2010-05-27 Chisso Corp 架橋性ケイ素化合物、その製造方法、架橋性組成物、シロキサンポリマー、シリコーン膜、該架橋性ケイ素化合物の原料となるケイ素化合物、及びその製造方法
WO2011145638A1 (ja) * 2010-05-18 2011-11-24 Jnc株式会社 新規有機ケイ素化合物、該有機ケイ素化合物を含む熱硬化性樹脂組成物、硬化樹脂および光半導体用封止材料
US20130320264A1 (en) * 2011-02-18 2013-12-05 Jnc Corporation Hardening resin composition and color conversion material using the same
WO2014193177A2 (ko) * 2013-05-31 2014-12-04 주식회사 동진쎄미켐 오픈 구조의 폴리헤드랄 올리고머릭 실세스퀴옥산(poss) 및 이를 포함하는 조성물
CN104781345A (zh) * 2012-11-13 2015-07-15 捷恩智株式会社 热硬化性树脂组合物
JP2015172146A (ja) * 2014-03-12 2015-10-01 Jnc株式会社 熱硬化性樹脂組成物及びそれを用いた物品
JP2017014320A (ja) * 2015-06-26 2017-01-19 国立大学法人 熊本大学 架橋性ケイ素化合物の製造方法
WO2017110468A1 (ja) * 2015-12-24 2017-06-29 Jnc株式会社 熱硬化性樹脂組成物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012102167A (ja) 2010-11-05 2012-05-31 Nitto Denko Corp シリコーン樹脂、封止材料および光半導体装置
JP2019143026A (ja) * 2018-02-20 2019-08-29 Jnc株式会社 液状有機ケイ素化合物、およびそれを配合した熱硬化性樹脂組成物

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007119627A1 (ja) * 2006-04-10 2007-10-25 Ube Industries, Ltd. 硬化性組成物、シルセスキオキサン硬化物、及びこれらの製造方法
JP2010116464A (ja) * 2008-11-12 2010-05-27 Chisso Corp 架橋性ケイ素化合物、その製造方法、架橋性組成物、シロキサンポリマー、シリコーン膜、該架橋性ケイ素化合物の原料となるケイ素化合物、及びその製造方法
WO2011145638A1 (ja) * 2010-05-18 2011-11-24 Jnc株式会社 新規有機ケイ素化合物、該有機ケイ素化合物を含む熱硬化性樹脂組成物、硬化樹脂および光半導体用封止材料
US20130320264A1 (en) * 2011-02-18 2013-12-05 Jnc Corporation Hardening resin composition and color conversion material using the same
CN104781345A (zh) * 2012-11-13 2015-07-15 捷恩智株式会社 热硬化性树脂组合物
WO2014193177A2 (ko) * 2013-05-31 2014-12-04 주식회사 동진쎄미켐 오픈 구조의 폴리헤드랄 올리고머릭 실세스퀴옥산(poss) 및 이를 포함하는 조성물
JP2015172146A (ja) * 2014-03-12 2015-10-01 Jnc株式会社 熱硬化性樹脂組成物及びそれを用いた物品
JP2017014320A (ja) * 2015-06-26 2017-01-19 国立大学法人 熊本大学 架橋性ケイ素化合物の製造方法
WO2017110468A1 (ja) * 2015-12-24 2017-06-29 Jnc株式会社 熱硬化性樹脂組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113039233A (zh) * 2018-12-04 2021-06-25 捷恩智株式会社 有机硅化合物、有机硅化合物的制造方法、热硬化性树脂组合物、成形体、及光半导体装置

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TW201934619A (zh) 2019-09-01
KR20200123123A (ko) 2020-10-28
JP2019143026A (ja) 2019-08-29
WO2019163686A1 (ja) 2019-08-29

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Application publication date: 20201016