CN111776719B - Automatic marking, detecting and packaging integrated machine for chips - Google Patents
Automatic marking, detecting and packaging integrated machine for chips Download PDFInfo
- Publication number
- CN111776719B CN111776719B CN202010515491.9A CN202010515491A CN111776719B CN 111776719 B CN111776719 B CN 111776719B CN 202010515491 A CN202010515491 A CN 202010515491A CN 111776719 B CN111776719 B CN 111776719B
- Authority
- CN
- China
- Prior art keywords
- assembly
- platform
- marking
- turntable
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 41
- 230000007246 mechanism Effects 0.000 claims abstract description 80
- 238000012360 testing method Methods 0.000 claims abstract description 62
- 238000012937 correction Methods 0.000 claims abstract description 41
- 238000001514 detection method Methods 0.000 claims abstract description 33
- 238000010330 laser marking Methods 0.000 claims abstract description 25
- 230000002950 deficient Effects 0.000 claims abstract description 20
- 238000009954 braiding Methods 0.000 claims abstract description 11
- 238000007789 sealing Methods 0.000 claims abstract description 9
- 230000006698 induction Effects 0.000 claims abstract description 4
- 238000004804 winding Methods 0.000 claims abstract description 4
- 230000000712 assembly Effects 0.000 claims abstract description 3
- 238000000429 assembly Methods 0.000 claims abstract description 3
- 210000000078 claw Anatomy 0.000 claims description 23
- 239000002994 raw material Substances 0.000 claims description 7
- 230000008602 contraction Effects 0.000 claims description 6
- 238000011056 performance test Methods 0.000 claims description 4
- 239000000523 sample Substances 0.000 claims description 3
- 238000010009 beating Methods 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 8
- 238000009434 installation Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009955 peripheral mechanism Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010626 work up procedure Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G27/00—Jigging conveyors
- B65G27/04—Load carriers other than helical or spiral channels or conduits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
Abstract
The invention discloses an automatic marking, detecting and packaging integrated machine for chips, which comprises a platform and a rack arranged below the platform; the feeding mechanism and the main body working mechanism are sequentially arranged on the platform and electrically connected with the man-machine cooperation mechanism to form an electric driving connection structure; the main body working mechanism comprises a turntable leading mechanism and a braiding mechanism; the turntable main guide mechanism comprises an image detection assembly, a rotating assembly, a correction platform assembly, a testing assembly, a laser marking assembly, a suction nozzle alignment assembly and a defective product collecting assembly which are sequentially arranged around the turntable all-in-one machine, and the assemblies sequentially work under the condition that the turntable all-in-one machine rotates up and down; the braiding mechanism comprises a loading induction mechanism, an image detection mechanism, a heat sealing mechanism and a winding mechanism which are linearly arranged along the tape moving main body.
Description
Technical Field
The invention relates to the technical field of chip production and processing, in particular to an automatic marking, detecting and packaging integrated machine for chips.
Background
The LED patch braider is mainly applied to packaging reels of LED materials, and the process is that the LED materials are sealed on a carrier tape and are wound on the reels, wherein the packaging comprises heat sealing and cold sealing, generally speaking, the heat sealing has better packaging effect and higher speed than the cold sealing, so the heat sealing packaging is generally adopted to seal the LED materials, the LED patch braider has the problems of poor quality or abnormal filling of the LED materials and the like in the braiding process, but the problems are difficult to find, if the problems are found, people usually adopt a manual detection or operation method to solve the problems, but the method causes the original packaging to have low working speed and low accuracy, so various problems are brought to the production work.
The utility model discloses a LED paster braider of No. CN104369893A, it is especially a carry-out program after the input programming with automatic feed, location, inspection, encapsulation and accomplish a full-automatic high-speed paster LED braider of braid work smoothly, mainly include control system, motion, detecting system and work cabinet, the work cabinet includes the work cabinet body and work counter, detecting system mainly comprises test computer and display, motion mainly comprises automatic feed system, carousel mechanism, carousel peripheral mechanism and braid main part mechanism, automatic feed system, carousel mechanism, braid main part mechanism install in proper order on the surface of work counter from a left side to a right side, carousel peripheral mechanism is around installing the peripheral position at carousel mechanism.
However, the LED chip is packaged after being mounted, and in the process, the difference of pins of the LED chip is not considered, and the LED chip supplied in the automatic feeding system may be positioned incorrectly.
Disclosure of Invention
The invention aims at the defects in the prior art and particularly provides an automatic marking, detecting and packaging integrated machine for chips.
The invention discloses an automatic chip marking, detecting and packaging integrated machine, which comprises a platform and a rack arranged below the platform; the feeding mechanism and the main body working mechanism are sequentially arranged on the platform and electrically connected with the man-machine cooperation mechanism to form an electric driving connection structure; the main body working mechanism comprises a turntable leading mechanism and a braiding mechanism; the turntable main guide mechanism comprises an image detection assembly, a rotating assembly, a correction platform assembly, a testing assembly, a laser marking assembly, a suction nozzle alignment assembly and a defective product collecting assembly which are sequentially arranged around the turntable all-in-one machine, and the assemblies sequentially work under the condition that the turntable all-in-one machine rotates up and down; the braiding mechanism comprises a loading induction mechanism, an image detection mechanism, a heat sealing mechanism and a winding mechanism which are linearly arranged along the tape moving main body; the method is characterized in that: the turntable all-in-one machine comprises a turntable and a rotary cylinder arranged at the axis of the upper part of the turntable; a first indexing divider which enables the turntable to move up and down and rotate clockwise is fixedly arranged at the axis of the lower part of the turntable; a plurality of stations which are uniformly distributed are arranged around the turntable, and a flexible suction nozzle mechanism for controlling a chip to be processed is arranged on each station in a matched manner; the flexible suction nozzle mechanism is connected with the rotary cylinder in a matched mode through the vacuum emitter, and comprises an air nozzle arranged on a station and a suction nozzle connected with the air nozzle in a matched mode, wherein the air nozzle is fixed on the station through a guide seat, and the guide seat is fixed on the station through a screw rod with a spring and completes flexible work of the flexible suction nozzle mechanism.
Preferably, the turntable all-in-one machine is arranged right above the platform in a matching manner through a first indexing divider; the feeding assembly is arranged in the platform in an embedded mode and is arranged below the turntable all-in-one machine through the chip placement structure, the image detection assembly is arranged in the upward detection direction and penetrates into the platform, the detection lens is located below the turntable all-in-one machine, and the image detection assembly is close to the feeding assembly; the method comprises the steps of detecting whether a flexible suction nozzle mechanism sucks a chip and accurately transmits information to a next component; the rotating assembly is arranged on the platform and positioned below the turntable all-in-one machine, and the rotating assembly is close to the image detection assembly; the image detection component receives the information of the detection chip and rotates/does not rotate the detection chip; the correcting platform assembly is arranged on the platform and is positioned below the turntable all-in-one machine, the correcting platform is close to the rotating assembly, and the correcting platform is used for correcting the position of the chip passing through the rotating assembly; the test component is arranged on the platform and positioned below the turntable all-in-one machine, and the test box component is close to the correction platform; the chip processed by the correction platform is subjected to performance test and data of the chip is uploaded; the laser marking assembly is arranged above the platform in a matched mode through a second indexing divider and is positioned below the turntable all-in-one machine, the platform is further provided with a laser coding assembly for marking a product on the laser marking platform and a pre-printing correction assembly for correcting the position of the product on the laser marking platform, and the laser marking platform is close to the test box assembly; marking the chip which passes the performance test; the suction nozzle alignment component is arranged on the platform and is positioned below the turntable all-in-one machine, and the suction nozzle alignment component is close to the laser marking platform; the flexible suction nozzle mechanism without the chip is subjected to position alignment; the defective product collecting assembly is arranged on the platform and is positioned below the turntable all-in-one machine, and the defective product removing assembly is close to the suction nozzle alignment assembly; classifying chips which fail to pass the test of the test component; the raw material belt assembly is arranged below the platform and is matched and connected with the feeding assembly; the method comprises the following steps of conveying a blank raw material belt into a braiding mechanism; a frame enclosing and securing the raw material strip assembly therein and disposed below the platform.
Preferably, the first indexing divider adopts a twelve-indexing divider, so that the turntable all-in-one machine can move up and down in a twelve-indexing mode and rotate clockwise.
Preferably, the feeding assembly comprises a vibration disc, and a conveying belt of the vibration disc is matched and connected with the chip placement structure.
Preferably, the rotating assembly comprises a supporting seat arranged on the platform, a rotating cylinder arranged in the supporting seat and a rotating tool arranged at the rotating output end of the rotating cylinder;
preferably, the correction platform assembly comprises a correction aligning seat for placing a chip and correction claws arranged on the periphery of the correction aligning seat; the correcting claw controls the contraction and release actions of the correcting claw through a clamping cylinder; the clamping cylinder is fixedly arranged on the platform through a cylinder fixing seat.
Preferably, the test assembly comprises a test supporting plate and a plurality of test tables arranged on the test supporting plate, and the test supporting plate is fixedly arranged on the platform through a plurality of test supporting columns; the test bench is provided with a plurality of test probes for testing the performance of the chip.
Preferably, the laser marking platform comprises a marking rotary turntable, a marking correction platform assembly and a marking machine; a marking rotary cylinder is arranged at the upper axle center of the marking rotary turntable; a second divider which enables the marking rotary turntable to move up and down and rotate clockwise is fixedly arranged at the axis of the lower part of the marking rotary turntable; the marking rotary turntable is provided with a plurality of chip attracting and fixing stations which are uniformly distributed, the chip attracting and fixing stations are provided with air holes for attracting and fixing chips, and the chip attracting and fixing stations are matched and connected with the marking rotary cylinder through air pipes; the marking correcting platform assembly comprises four marking correcting claws for clamping a chip, a marking clamping cylinder for controlling the contraction and loosening of the four marking correcting claws, and a servo motor arranged on the marking clamping cylinder and used for rotating the four marking correcting claws by 180 degrees.
Preferably, the second dividing divider adopts an eight-dividing divider, so that the turntable all-in-one machine can move up and down in an eight-dividing mode and rotate clockwise.
Preferably, the defective product collecting assembly comprises a base arranged on the platform, a conveying belt arranged on the base, and a plurality of collecting boxes arranged on the conveying belt; the conveying belt is driven by a motor; the collecting box collects the chips tested by the testing component for classified collection.
Has the advantages that: compared with the prior art, the automatic marking, detecting and packaging integrated machine for the chips is provided with the image detection assembly, the rotating assembly, the correction platform assembly, the test assembly, the laser marking assembly, the suction nozzle alignment assembly and the defective product collection assembly, the image detection assembly can detect and analyze an output result after the chips are fed, the rotating assembly can adjust the positions of the chips, the positions of the chips are accurately positioned on the correction platform assembly, and therefore the following test assembly and the laser marking assembly can work efficiently, and defective products can be classified and collected on the defective product collection assembly according to actual conditions.
Drawings
FIG. 1 is a schematic perspective view of an automatic marking, detecting and packaging integrated machine for chips according to the present invention;
FIG. 2 is a schematic view of a top view structure of an automatic marking, detecting and packaging integrated machine for chips according to the present invention;
FIG. 3 is a schematic structural diagram of a front view of an automatic marking, detecting and packaging integrated machine for chips according to the present invention;
FIG. 4 is a schematic perspective view of a turntable all-in-one machine of the chip automatic marking, detecting and packaging all-in-one machine of the invention;
FIG. 5 is a schematic axial view of a turntable all-in-one machine for automatically marking, detecting and packaging chips according to the invention;
FIG. 6 is a schematic structural diagram of the flexible suction nozzle mechanism and the rotary cylinder of the integrated machine for automatically marking, detecting and packaging chips of the invention;
FIG. 7 is a schematic perspective view of a feeding assembly of an automatic chip marking, detecting and packaging integrated machine according to the present invention;
FIG. 8 is a schematic perspective view of an image detection assembly of an automatic marking, detecting and packaging integrated machine for chips according to the present invention;
FIG. 9 is a schematic side view of a rotating assembly of the automatic marking, detecting and packaging integrated machine for chips according to the present invention;
FIG. 10 is a schematic top view of a rotating assembly of the integrated automatic marking, detecting and packaging machine for chips according to the present invention;
FIG. 11 is a schematic structural diagram of a correction platform assembly of the automatic chip marking, detecting and packaging all-in-one machine according to the invention in a front view;
FIG. 12 is a schematic perspective view of a correction platform assembly of the integrated machine for automatically marking, detecting and packaging chips according to the present invention;
FIG. 13 is a schematic perspective view of a testing assembly of the automatic marking, detecting and packaging integrated machine for chips according to the present invention;
FIG. 14 is an enlarged view of the structure A of FIG. 13;
fig. 15 is a schematic top view of a testing assembly of the integrated automatic marking, detecting and packaging machine for chips according to the present invention;
FIG. 16 is a schematic three-dimensional structure diagram of a laser marking platform of the integrated automatic chip marking, detecting and packaging machine of the invention;
fig. 17 is a schematic front view structural diagram of a laser marking platform of the integrated automatic chip marking, detecting and packaging machine of the invention;
fig. 18 is a schematic top view of a marking rotary table of an automatic chip marking, detecting and packaging integrated machine according to the present invention;
fig. 19 is a schematic perspective view of a marking rotary table of an automatic chip marking, detecting and packaging integrated machine according to the present invention;
fig. 20 is a schematic structural view of a marking correction platform assembly of the integrated automatic marking, detecting and packaging machine for chips according to the present invention;
FIG. 21 is a schematic front view of a defective product collecting assembly of the automatic chip marking, detecting and packaging machine according to the present invention;
fig. 22 is a schematic view of a three-dimensional structure of a defective product collecting assembly of the automatic chip marking, detecting and packaging all-in-one machine.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
As shown in fig. 1, fig. 2 and fig. 3, the automatic marking, detecting and packaging integrated machine for chips of the present invention comprises a platform 1 and a frame 13 disposed under the platform 1; the feeding mechanism 3 and the main body working mechanism (not marked in the figure) are sequentially arranged on the platform 1 and electrically connected with the man-machine cooperation mechanism 101 to form an electric driving connection structure; the main body working mechanism (not shown) comprises a turntable master mechanism (not shown) and a braiding mechanism 7; the turntable leading mechanism (not marked in the figure) comprises an image detection component 4, a rotating component 5, a correction platform component 6, a testing component 8, a laser marking component 9, a suction nozzle alignment component 10 and a defective product collection component which are sequentially arranged around the turntable all-in-one machine, and the components sequentially work under the condition that the turntable all-in-one machine 2 rotates up and down; the braiding mechanism 7 comprises a loading induction mechanism 71, an image detection mechanism 72, a heat sealing mechanism 73 and a winding mechanism 74 which are linearly arranged along the tape moving body;
as shown in fig. 4, 5 and 6, the turntable all-in-one machine 2 includes a turntable 22, a rotary cylinder 21 disposed at the upper axial center of the turntable 22; a first indexing divider (not shown in the figure) which enables the turntable 22 to move up and down and rotate clockwise is fixedly arranged at the lower axle center of the turntable 22; in this embodiment, sixteen stations (not labeled in the figure) are uniformly distributed around the turntable 22, the turntable 22 is fixedly connected with the divider flange 25 through the heightening block 24 by a bolt, and the output end of the twelve-division divider 26 is sleeved with the divider flange 25, so that the turntable can be driven to perform up-down and rotation operations, wherein the twelve-division divider 26 is driven by a first servo motor 27, an output shaft of the first servo motor 27 is provided with a first belt 28, and the first belt 28 is respectively embedded in the rotating end of the twelve-division divider 26 and the output shaft of the first servo motor 27;
a flexible suction nozzle mechanism 23 for controlling a chip to be processed is arranged on the station (not marked in the figure) in a matching way; the flexible suction nozzle mechanism 23 comprises a vacuum emitter 231 and an air nozzle 235 communicated with the vacuum emitter 231 through an air pipe and connected in a matching manner, the lower end of the air nozzle 235 is connected with a suction nozzle 237, the suction nozzle 237 is provided at the end thereof with an air hole (not shown) for allowing the vacuum of the vacuum emitter 231 to suck the chip to be processed under the operation of the vacuum emitter, the air nozzle 235 is fixed to a working position (not shown) by a guide seat 236, which is fitted with a screw 233 with a spring 234, wherein the screw 233 is arranged below the turntable 22 through a guide seat 236 and a work station (not shown) in turn, one end of the spring 234 abuts against the screw 233, and the other end abuts against the guide seat 236, so that the flexible nozzle mechanism 23 can utilize the spring 234 to realize flexible operation up and down, and the service life of the nozzle 237 is longer.
As shown in fig. 7, the feeding assembly 3 is embedded in the platform 1 and is disposed below the turntable all-in-one machine 2 through the chip placement structure 30; the feeding assembly 3 comprises a vibration disc 31 and a vibration supporting plate 32 for supporting the vibration disc 31; a vibration plate baffle 33 is arranged at the matching position of the vibration supporting plate 32 and the vibration plate 31, a plurality of vibration plate pillars 34 are arranged on the periphery of the vibration supporting plate 32, the lower ends of the vibration plate pillars 34 are fixedly arranged on the vibration supporting plate 32, the upper ends of the vibration plate pillars are abutted against the lower surface of the platform 1, and the plurality of vibration plate pillars 34 are supported in such a way, so that the vibration sense generated by the vibration plate 31 can be diluted, and the platform 1 cannot resonate; the chip placement structure 30 is arranged on a material receiving mechanism 301 on the conveyor belt 35, a pressing sheet 302 which is arranged on the material receiving mechanism 301 and is provided with a chip placement hole, and an installation block 303 for fixing the position of the material receiving mechanism 301, wherein the installation block 303 is fixedly arranged on the platform 1 through a chip placement base 304;
during feeding, the chip to be processed is transported in two states, one of which is an accurate position state and the other is an inaccurate position state, and during this feeding, the chip to be processed in the accurate position state and the inaccurate position state is transported to the chip placing structure 30 together to prepare for the next work.
As shown in fig. 2 and 8, the image detection assembly 4 includes a CCD lens 41, the CCD lens 41 is fixedly disposed at the lower side of the platform 1 through a lens fixing and mounting plate 42, the CCD lens 41 can take a picture of the chip to be processed which is adsorbed by the flexible suction nozzle mechanism 23, transmit the picture to the system, and make a decision through judgment and recognition, if the chip to be processed is correctly positioned, the rotating assembly 5 is skipped to work to the next working operation; if the position of the chip to be processed is incorrect, the next working operation is carried out after the rotating assembly 5 adjusts the chip to be processed to the correct position.
As shown in fig. 2, 9 and 10, the rotating assembly 5 includes a rotating tool 51 for rotating the chip to be processed, and a rotating cylinder 52 for rotating the rotating tool 51; the rotary cylinder 52 is installed in a rectangular installation fixing frame 53, the installation fixing frame 53 is fixed on the platform 1 through bolts, a motor plate 54 is sleeved around the rotary tool 51, a group of support screws 55 for rotation are arranged below the motor plate 54, the support screws 55 for rotation penetrate through the installation fixing frame 53 through guide blocks 56 and are abutted against the lower side of the motor plate 54, a spring 57 for rotation is further arranged at the matching part of the support screws 55 for rotation and the guide blocks 56, and the motor plate 54 has certain flexibility by arranging a group of springs 57 for rotation; in addition, the motor plate 54 is also provided with a dial indicator assembly 58 on one side, the dial indicator assembly 58 is fixedly arranged on one side of the installation fixing frame 53 through a dial indicator fixing seat 59, and the motor plate 54 can check the distance between the motor plate and the installation fixing frame 53 through the dial indicator assembly 58, so that the motor plate can be checked integrally, and has high operability and good practicability.
As shown in fig. 2, 11 and 12, the correcting platform assembly 6 includes a correcting aligning seat 61 for placing a chip, and correcting claws 62 arranged around the correcting aligning seat 61; four mutually perpendicular correcting claws 62 control the contraction and release actions thereof by a clamping cylinder 63; the lower end of the clamping cylinder 63 is fixedly connected with a cylinder fixing seat 64 through a clamping fixing table 65, the cylinder fixing seat 64 is fixedly arranged on the platform 1 through bolts, the clamping fixing table 65 supports the correction aligning seat 61 among the four mutually perpendicular correction claws 62 through a group of vertical rods 66, gaps are kept between the upper part and the lower part of a supporting plate 611 of the correction aligning seat 61 and the four mutually perpendicular correction claws 62 and are not contacted with each other, the interference problem is solved, the resistance of the four mutually perpendicular correction claws 62 and the supporting plate 611 during movement is reduced, meanwhile, the abrasion of the four mutually perpendicular correction claws 62 and the supporting plate 611 is reduced, and the position accuracy of a chip to be processed is improved.
As shown in fig. 2, 13, 14 and 15, the test assembly 8 includes a test pallet 81, and three test stations 82 disposed on the test pallet 81, wherein the test pallet 81 is fixedly disposed on the platform 1 through a plurality of test support columns 83; the test platform 82 includes a test box 821 fixed on the test tray 81, and a test cover 822 covering the test box 821; the testing cover 822 is provided with a testing cavity 8221 with the size of a chip, and the testing cavity 8221 is embedded with a plurality of testing probes 84 for testing the performance of the chip; in this embodiment, the test board 82 increases or decreases the number of the test boards according to actual needs, and is flexible to control, complete in test data, and good in operability.
As shown in fig. 2 and 16, the laser marking platform 9 includes a marking rotary turntable 90, a marking correction platform assembly 91 and a marking machine 92;
as shown in fig. 18 and 19, the marking rotary turntable 90 is designed with eight uniformly distributed stations, each station is a chip attracting and fixing station 902, the upper axis of the chip attracting and fixing station is provided with a marking rotary cylinder 901, and the chip attracting and fixing station 902 is provided with an air hole 903 for attracting and fixing a chip.
As shown in fig. 17, an eight-division divider 93 for enabling the marking rotary turntable 90 to move up and down and rotate clockwise is fixedly arranged at the lower axis of the marking rotary turntable 90, and the eight-division divider 93 is adopted to adapt to the working requirement according to the design requirement; the marking rotary turntable 90 is fixedly connected with a marking slicer flange 931 through a bolt, and the output end of the eight-index slicer 93 is sleeved with the marking slicer flange 931, so that the marking rotary turntable 90 can be driven to work up and down and rotate, wherein the eight-index slicer 93 is driven by a second servo motor 932, a second belt 933 is arranged on the output shaft of the second servo motor 932, and the second belt 933 is respectively embedded into the rotating end of the eight-index slicer 93 and the output shaft of the second belt 933;
as shown in fig. 18 and fig. 19, the chip attracting fixing station 902 is connected to the marking rotary cylinder 901 through an air pipe (not identified in the figures), wherein the marking rotary turntable 90 includes a placing chip attracting fixing station 904 and a sucking chip attracting fixing station 905 which are matched with the flexible suction nozzle mechanism 23, a marking correction chip attracting fixing station 906 which is matched with the marking correction platform assembly 91, and a marking chip attracting fixing station 907 which is matched with the marking machine 92, wherein the four chip attracting fixing stations account for four of eight stations of the marking rotary turntable 90, and the other four chip attracting fixing stations 902 are respectively located between the two operations;
as shown in fig. 20, the marking correcting platform assembly 91 includes four marking correcting claws 911 for clamping a chip, a marking clamping cylinder 912 for controlling the contraction and release of the four marking correcting claws 911, a rotary cylinder seat 913 fixed to the end of the marking clamping cylinder 912, the rotary cylinder seat 913 disposed in the clamp lock seat 914 in a matching manner, a servo motor 915 passing through the clamp lock seat 914 for controlling the rotary cylinder seat 913 to rotate 180 degrees, the other end of the clamp lock seat 914 is fixed to a correcting support 916 through a bolt, the correcting support 916 is sleeved on a correcting support 917, the correcting support 917 is fixed to the platform 1 through a correcting base 918, two positioning sleeves 919 and first springs 920 respectively fitted at the upper and lower ends of the correcting support 917 are sleeved in the correcting support 917, and the upper end of the first spring 920 abuts against the lower wall of the positioning sleeve 919, the lower ends of the two positioning sleeves 919 abut against the positioning sleeves 919 below, and the two positioning sleeves 919 are of the same type; the four marking correction claws 911, the marking clamping cylinder 912 and the rotary cylinder seat 913 are a rotatable whole, and the rotary cylinder seat 913 can rotate along with the marking correction claws while being driven by the servo motor 915 to rotate, so that the position of a chip to be processed can be rotated by 180 degrees; wherein four marking correction claws 911 are lowered downward.
As shown in fig. 2, the suction nozzle alignment component 10 is disposed on the platform 1 and below the turntable all-in-one machine 2, and the suction nozzle alignment component 10 is close to the laser marking platform 9; the flexible suction nozzle mechanism 23 without a chip is positionally aligned, and the positions of the suction nozzles 237 in the flexible suction nozzle mechanism 23 in the turntable 22 are deviated to a certain extent, and the positions thereof are restored to the original positions by the adjustment of the suction nozzle aligning unit 10.
As shown in fig. 2, 21 and 22, the defective product collecting assembly 102 is disposed on the platform 1 and below the turntable all-in-one machine 2, and the defective product removing assembly 102 is next to the nozzle alignment assembly 10; collecting and classifying chips which do not pass the test of the test component; the device also comprises a base 1021 arranged on the platform 1, a conveying belt 1023 arranged on the base 1021, and a plurality of collecting boxes 1024 arranged on the conveying belt 1023; the conveyor belt 1023 is driven by a motor 1022; the collection box 1024 collects chips tested by the testing component 8 for sorting.
Compared with the prior art, the automatic marking, detecting and packaging integrated machine for the chips is provided with the image detection assembly, the rotating assembly, the correction platform assembly, the test assembly, the laser marking assembly, the suction nozzle alignment assembly and the defective product collection assembly, the image detection assembly can detect and analyze an output result after the chips are fed, the rotating assembly can adjust the positions of the chips, the positions of the chips are accurately positioned on the correction platform assembly, and therefore the following test assembly and the laser marking assembly can work efficiently, and defective products can be classified and collected on the defective product collection assembly according to actual conditions.
The above is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, it is possible to make several improvements and modifications without departing from the technical principle of the present invention, and these improvements and modifications should also be considered as the protection scope of the present invention.
Claims (6)
1. The utility model provides an automatic mark detection packaging all-in-one of beating of chip which characterized in that: the automatic feeding device comprises a platform and a rack arranged below the platform, wherein a feeding mechanism, a main body working mechanism and a man-machine cooperation mechanism are arranged on the platform, the feeding mechanism and the main body working mechanism are sequentially arranged on the platform and are electrically connected with the man-machine cooperation mechanism to form an electric drive connecting structure, the main body working mechanism comprises a turntable main guide mechanism and a braiding mechanism, the turntable main guide mechanism comprises an image detection assembly, a rotating assembly, a correction platform assembly, a test assembly, a laser marking assembly, a suction nozzle alignment assembly and a defective product collection assembly which are sequentially arranged around a turntable all-in-one machine, the assemblies sequentially work under the vertical rotation of the turntable all-in-one machine, and the braiding mechanism comprises a loading induction mechanism, an image detection mechanism, a heat sealing mechanism and a winding mechanism which are linearly arranged along;
the turntable all-in-one machine comprises a turntable and a rotary cylinder arranged at the axle center of the upper part of the turntable, wherein a first indexing divider which enables the turntable to move up and down and rotate clockwise is fixedly arranged at the axle center of the lower part of the turntable, a plurality of uniformly distributed stations are arranged around the turntable, a flexible suction nozzle mechanism used for controlling a chip to be processed is arranged on each station in a matched manner, the flexible suction nozzle mechanism is connected with the rotary cylinder in a matched manner through a vacuum emitter and comprises an air nozzle arranged on each station and a suction nozzle connected with the air nozzle in a matched manner, the air nozzle is fixed on each station through a guide seat, the guide seats are fixed on the stations through screws with springs and flexible work of the flexible suction nozzle mechanism is completed, and the turntable all-in-one machine is arranged right above a platform in;
the feeding assembly is arranged in the platform in an embedded mode and is arranged below the turntable all-in-one machine through the chip placement structure;
the image detection assembly is arranged in the upward detection direction and penetrates into the platform, the detection lens is positioned below the turntable all-in-one machine, the image detection assembly is close to the feeding assembly, and the image detection assembly detects whether the chip is accurately sucked by the flexible suction nozzle mechanism and transmits information to the next assembly;
the rotating assembly is arranged on the platform and positioned below the turntable all-in-one machine, is close to the image detection assembly, and receives information of a detection chip of the image detection assembly to rotate/not rotate the detection chip;
the correcting platform assembly is arranged on the platform and is positioned below the turntable all-in-one machine, is close to the rotating assembly and corrects the position of the chip passing through the rotating assembly;
the test component is arranged on the platform and positioned below the turntable all-in-one machine, is close to the correction platform component, and is used for carrying out performance test on the chip processed by the correction platform component and uploading data of the chip;
the laser marking assembly is arranged above the platform in a matched mode through a second indexing divider and is positioned below the turntable all-in-one machine, the platform is further provided with a laser marking assembly for marking a product on the laser marking platform and a pre-printing correction assembly for correcting the position of the product on the laser marking platform, the laser marking assembly is close to the testing assembly and marks a chip which passes a performance test;
the suction nozzle alignment component is arranged on the platform and positioned below the turntable all-in-one machine, is close to the laser marking platform and aligns the position of the flexible suction nozzle mechanism without the chip;
the defective product collecting assembly is arranged on the platform and is positioned below the turntable all-in-one machine, the defective product collecting assembly is close to the suction nozzle alignment assembly, and chips which do not pass the test of the test assembly are classified;
the raw material belt assembly is arranged below the platform and is matched and connected with the feeding assembly, and the raw material belt assembly conveys blank raw material belts into the braiding mechanism;
a frame enclosing and fixing the raw material belt assembly therein and arranged below the platform;
the first indexing divider adopts a twelve-indexing divider to enable the turntable all-in-one machine to move up and down and rotate clockwise in a twelve-indexing mode;
the feeding assembly comprises a vibrating disc, and a conveying belt of the vibrating disc is matched and connected with the chip placing structure;
the laser marking platform comprises a marking rotary turntable, a marking correction platform assembly and a marking machine, wherein a marking rotary cylinder is arranged at the upper axle center of the marking rotary turntable, a second subdivision divider which enables the marking rotary turntable to move up and down and rotate clockwise is fixedly arranged at the lower axle center of the marking rotary turntable, a plurality of chip suction fixing stations which are uniformly distributed are arranged on the marking rotary turntable, air holes for sucking fixed chips are formed in the chip suction fixing stations, the chip suction fixing stations are connected with the marking rotary cylinder in a matched manner through air pipes, the marking rotary turntable comprises a chip placing suction fixing station and a chip suction fixing station which are matched with a flexible suction nozzle mechanism, a marking correction chip suction fixing station which is matched with the marking correction platform assembly, and a marking chip suction fixing station which is matched with the marking machine, the marking correcting platform assembly comprises four marking correcting claws for clamping a chip, a marking clamping cylinder for controlling the contraction and loosening of the four marking correcting claws, and a servo motor arranged on the marking clamping cylinder and used for rotating the four marking correcting claws by 180 degrees.
2. The automatic marking, detecting and packaging integrated machine for chips as claimed in claim 1, wherein: the rotating assembly comprises a supporting seat arranged on the platform, a rotating cylinder arranged in the supporting seat and a rotating tool arranged at the rotating output end of the rotating cylinder.
3. The automatic marking, detecting and packaging integrated machine for chips as claimed in claim 1, wherein: the correction platform assembly comprises a correction alignment seat for placing a chip and correction claws arranged on the periphery of the correction alignment seat; the correcting claw controls the contraction and release actions of the correcting claw through a clamping cylinder; the clamping cylinder is fixedly arranged on the platform through a cylinder fixing seat.
4. The automatic marking, detecting and packaging integrated machine for chips as claimed in claim 1, wherein: the test assembly comprises a test supporting plate and a plurality of test tables arranged on the test supporting plate, and the test supporting plate is fixedly arranged on the platform through a plurality of test supporting columns; the test bench is provided with a plurality of test probes for testing the performance of the chip.
5. The automatic marking, detecting and packaging integrated machine for chips as claimed in claim 1, wherein: the second divider adopts an eight-division divider to enable the turntable all-in-one machine to move up and down in an eight-division mode and rotate clockwise.
6. The automatic marking, detecting and packaging integrated machine for chips as claimed in claim 1, wherein: the defective product collecting assembly comprises a base arranged on the platform, a conveying belt arranged on the base and a plurality of collecting boxes arranged on the conveying belt; the transmission belt is driven by a motor; the collecting box collects the chips tested by the testing component for classified collection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010515491.9A CN111776719B (en) | 2020-06-09 | 2020-06-09 | Automatic marking, detecting and packaging integrated machine for chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010515491.9A CN111776719B (en) | 2020-06-09 | 2020-06-09 | Automatic marking, detecting and packaging integrated machine for chips |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111776719A CN111776719A (en) | 2020-10-16 |
| CN111776719B true CN111776719B (en) | 2021-06-11 |
Family
ID=72753534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010515491.9A Active CN111776719B (en) | 2020-06-09 | 2020-06-09 | Automatic marking, detecting and packaging integrated machine for chips |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111776719B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112517434A (en) * | 2020-11-18 | 2021-03-19 | 济南凯镭迪精密仪器有限公司 | Device and method for effectively identifying and marking density ends of springs |
| CN113814189B (en) * | 2021-10-13 | 2023-06-02 | 东阳东磁自动化科技有限公司 | Automatic testing equipment for large magnetic ring and implementation method thereof |
| CN113804928B (en) * | 2021-11-22 | 2022-02-22 | 深圳市伟盛丰科技有限公司 | Mobile phone CPU chip template electrical variable continuous detection jig |
| CN115327350B (en) * | 2022-09-13 | 2023-08-25 | 江苏芯安集成电路设计有限公司 | Chip test classifier |
| CN115608626B (en) * | 2022-10-31 | 2023-04-28 | 厦门柯尔自动化设备有限公司 | High-speed multi-head chip sorting device |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0781761A (en) * | 1993-09-20 | 1995-03-28 | R C D Eng:Kk | Work charging device with mechanism to prevent formation flaw, such as, strike mark |
| DE19610125C1 (en) * | 1996-03-14 | 1997-06-12 | Siemens Ag | Semiconductor mfr. device, e.g. tape and reel handler, esp. for integrated circuit |
| JP2003229339A (en) * | 2002-02-06 | 2003-08-15 | Shibasoku:Kk | Processing apparatus for integrated circuit element |
| CN101989535B (en) * | 2009-08-05 | 2013-09-18 | 深圳市远望工业自动化设备有限公司 | All-in-one machine of semiconductor device for testing, sorting, marking and braiding and one-stop processing method |
| CN103366912B (en) * | 2013-07-15 | 2016-06-22 | 深圳市众之城电子科技有限公司 | A kind of resistance molding, test, mark all-in-one and operation method thereof |
| CN104476360B (en) * | 2014-12-10 | 2017-01-11 | 东莞市瀛通电线有限公司 | Automatic insertion pin grinding method and grinding machine |
| CN107324043A (en) * | 2017-06-12 | 2017-11-07 | 温州职业技术学院 | Robot assisted connector assembles flexible manufacturing production line |
| CN111136016B (en) * | 2018-11-06 | 2022-08-30 | 深圳市大族封测科技股份有限公司 | Light splitting and braiding integrated LED detection method and device |
-
2020
- 2020-06-09 CN CN202010515491.9A patent/CN111776719B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN111776719A (en) | 2020-10-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111776719B (en) | Automatic marking, detecting and packaging integrated machine for chips | |
| CN105775289B (en) | For monitoring the electric-control system and method for label absorption situation at labeller head | |
| CN109434401B (en) | Assembling device and elastic sheet assembling machine | |
| CN109262220A (en) | Modular assembly production line | |
| CN109552874A (en) | A kind of automatic electric logging device | |
| CN211281608U (en) | Inductance automatic test spouts a yard equipment for packing | |
| CN108637664A (en) | The full-automatic package system of the high-accuracy heat dissipation bearing fan of one kind and assembly method | |
| JP2011119364A (en) | Position correction apparatus, and handler therewith | |
| CN110587502A (en) | Automatic forming, picking and inspecting integrated system and method for grinding wheel mesh | |
| CN208787941U (en) | A kind of high-accuracy radiator fan automatic production line | |
| KR100740232B1 (en) | Defective single unit replacement device for PCC panel | |
| CN210847224U (en) | Novel workpiece dimension testing and classifying device | |
| CN209157573U (en) | Modular assembly production line | |
| CN115258234A (en) | Resonator testing, marking and packaging integrated machine | |
| CN111761350B (en) | Junction box assembling equipment | |
| CN215827110U (en) | Defective product blanking assembly and inductance coil detection packaging device | |
| CN212674058U (en) | CCD quick size detection mechanism | |
| TWI543917B (en) | Electronic equipment for reproducing equipment | |
| CN112918739A (en) | Electronic components detects encapsulation all-in-one | |
| CN210108255U (en) | Electromagnetic clutch flatness detection device | |
| CN211768717U (en) | Automatic detector for electronic element performance | |
| CN208505911U (en) | Shielding part detection device | |
| CN112133651A (en) | Automatic wafer sorting and separating machine | |
| CN220761354U (en) | Automatic printing resistance tester | |
| CN216470686U (en) | Off-line focusing feeding device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220309 Address after: 221000 intersection of Shuangta road and Suhang Road, Shuanggou Town, Suining County, Xuzhou City, Jiangsu Province Patentee after: Jiangsu Fengyuan Electronic Technology Co.,Ltd. Address before: 325036 science and technology incubator of Wenzhou National University, 38 Dongfang South Road, Ouhai District, Wenzhou City, Zhejiang Province Patentee before: WENZHOU VOCATIONAL & TECHNICAL College |