CN115608626B - High-speed multi-head chip sorting device - Google Patents
High-speed multi-head chip sorting device Download PDFInfo
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- CN115608626B CN115608626B CN202211351586.7A CN202211351586A CN115608626B CN 115608626 B CN115608626 B CN 115608626B CN 202211351586 A CN202211351586 A CN 202211351586A CN 115608626 B CN115608626 B CN 115608626B
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- 230000007246 mechanism Effects 0.000 claims abstract description 134
- 239000013078 crystal Substances 0.000 claims description 185
- 230000001681 protective effect Effects 0.000 claims description 4
- 230000009471 action Effects 0.000 abstract description 9
- 230000003749 cleanliness Effects 0.000 abstract description 6
- 244000309464 bull Species 0.000 abstract description 3
- 230000003028 elevating effect Effects 0.000 abstract description 2
- 239000000428 dust Substances 0.000 description 14
- 230000006835 compression Effects 0.000 description 13
- 238000007906 compression Methods 0.000 description 13
- 238000001514 detection method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000003139 buffering effect Effects 0.000 description 4
- 239000003595 mist Substances 0.000 description 4
- 239000000779 smoke Substances 0.000 description 4
- 239000012535 impurity Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
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- 239000000463 material Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B17/00—Methods preventing fouling
- B08B17/02—Preventing deposition of fouling or of dust
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/914—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems incorporating rotary and rectilinear movements
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The application discloses high-speed bull chip sorting unit, including solenoid valve subassembly, the vacuum manometer, camera positioning module, stroke adjustment subassembly, rotatory get brilliant unit and the protection dustcoat of putting, rotatory get brilliant unit and put brilliant unit and include direct drive motor, chip pickup mechanism and actuating assembly, rotatory get brilliant unit and put brilliant unit on be provided with 18 chip pickup mechanism, set for the position of two stations and be getting brilliant position and put brilliant position respectively, carry out the chip sorting during operation, stroke adjustment subassembly sets up and is getting brilliant position top, the chip pickup mechanism who gets brilliant position is pushed down in the drive, actuating assembly drives chip pickup mechanism and is elevating movement, solenoid valve subassembly control carries out the pick-up and the placing of chip, utilize the vacuum gauge head to carry out the passback of signal, camera positioning module chip carries out the location and shoots, be convenient for next time pick-up brilliant and put brilliant smooth going on of action, the chip sorting unit of this application selects efficiently, the cleanliness factor is high, get brilliant platform and put brilliant platform and can be upper and lower floor setting, occupation space is little.
Description
Technical Field
The invention relates to the technical field of chip production equipment, in particular to a high-speed multi-head chip sorting device.
Background
With the development of technology, chips are widely applied in multiple fields, so that the quality of the chips is required to be detected, the yield of the chips is ensured, in actual production, the chip size is small, so that manual detection is difficult and time-consuming, a chip detection device is required to be applied to detect the quality, the chips are picked up by a sorting device and are carried on a test workbench, the traditional sorting device utilizes a motor to drive a chip pick-up mechanism to rotate for picking up crystals, but the number of the chip pick-up mechanisms is small; the size of the sorting device directly influences the linear distance between the crystal taking position and the crystal positioning position, the larger the distance between the crystal taking position and the crystal positioning position is, the more easily the material dropping phenomenon is generated, the time consumed by crystal taking and crystal positioning is longer, and the problem of lower efficiency of picking up chips exists. The traditional chip sorting device adopts a crystal taking position and a crystal position setting mode, so that the occupied space of the device is larger, the size of a required direct-drive motor is larger, and the traditional sorting device also has the problem of chip pollution caused by no external protection, so that the device which can improve the crystal taking efficiency, occupies smaller space and can keep high cleanliness for chip sorting is designed to be a problem to be solved urgently.
Disclosure of Invention
The invention provides a high-speed multi-head chip sorting device, which solves the problems in the prior art, and in order to achieve the purposes, the invention provides the following scheme:
according to the embodiment of the invention, the high-speed multi-head chip sorting device comprises a rotary crystal taking and placing unit, a stroke adjusting component and a protective outer cover, wherein the stroke adjusting component is fixedly arranged on the outer side of the rotary crystal taking and placing unit, the rotary crystal taking and placing unit comprises a direct-drive motor, a plurality of chip pickup mechanisms and a plurality of driving components, the bottom of the rotary crystal taking and placing unit is provided with the plurality of chip pickup mechanisms, one station on a crystal taking platform is designated as a crystal taking position, one station on the crystal placing platform is designated as a crystal placing position, the direct-drive motor drives the plurality of chip pickup mechanisms to rotate on the circumference, and when the crystal taking position and the driving components above the crystal placing position work, the chip pickup mechanisms reaching the crystal taking position and the crystal placing position are respectively driven to do lifting motion in the vertical direction, and the stroke adjusting component drives the chip pickup mechanisms reaching the crystal taking position to be pressed down so that the crystal taking position and the crystal placing position form a height difference.
The direct-drive motor drives the chip pick-up mechanism fixedly arranged at the bottom of the rotary crystal taking and placing unit to rotate in a circular motion period, when the chip pick-up mechanism reaches a crystal taking position, a distance is pressed downwards in the vertical direction under the action of the stroke adjusting component, and the driving component on the crystal taking position drives the chip pick-up mechanism which rotates to reach the crystal taking position under the drive of the direct-drive motor to do lifting motion in the vertical direction, so that the chip pick-up mechanism adapts to the requirement of chip pick-up, and the chip is picked up and collected from the crystal taking platform; further, when the chip picking mechanism with the chip reaches the crystal position, the driving component above the crystal position drives the chip picking mechanism to lift in the vertical direction, so that the picked chip is placed on the crystal platform;
the setting of stroke adjustment subassembly makes chip picking mechanism reach get when the crystal position carries out the chip and picks up when the mechanism reaches to put the crystal position and carries out the chip and place, there is the difference in height on original height, owing to the existence of difference in height, can be with putting brilliant platform and getting brilliant platform and set up according to the mode of upper and lower floor, the space that the device occupy has been saved, be provided with a plurality of chip picking mechanisms on the rotatory crystal unit of getting, the motor of directly driving just can realize picking up and placing of a plurality of chips every round, and can carry out the pick up and the placing of chip in step, the efficiency of chip selection has been improved greatly, the setting of protecting the dustcoat makes whole group's device be a semi-closed state, further, can guarantee through inside bleed, oil mist and dust pollution free below product, make the selection work of chip have the characteristics of high cleanliness.
In a specific embodiment, 18 chip pick-up mechanisms are arranged on the rotary crystal taking and placing unit at equal intervals.
The rotary crystal taking and placing unit is provided with 18 chip picking mechanisms, the distance between each chip picking mechanism and the adjacent chip picking mechanism is fixed and the distance between each chip picking mechanism and the adjacent chip picking mechanism is the same, the direct-drive motor only needs to rotate 20 degrees each time, the chip picking mechanism can reach the position of the adjacent chip picking mechanism, the corresponding time is 1/18 of the time used by the direct-drive motor in one rotation, the next crystal taking and placing actions can be realized rapidly, the work of multi-time chip sorting can be realized in the period of one rotation of the direct-drive motor, and the work efficiency of chip sorting is greatly improved.
In a specific embodiment, the high-speed multi-head chip sorting device further comprises a crystal taking and positioning camera assembly and a crystal placing and positioning camera assembly, wherein the crystal taking and positioning camera assembly is fixedly arranged right above the crystal taking position, and the crystal placing and positioning camera assembly is fixedly arranged right above the crystal placing position.
The crystal taking and positioning camera component is used for positioning and detecting the chip on the crystal taking platform, so that the chip picking mechanism reaching the crystal taking position can accurately pick up the chip, after the chip picking mechanism finishes the picking action, the direct-drive motor continues to rotate, and after the chip picking mechanism leaves the crystal taking position, the crystal taking and positioning camera component continues to take a picture of the chip on the crystal taking platform so as to provide accurate information for the next picking work; the die placement positioning camera component is used for positioning and detecting the chip on the die placement platform, so that the chip can be accurately placed when the chip pickup mechanism with the chip reaches the die placement position.
In a further embodiment, the stroke adjustment assembly is fixedly connected with the driving assembly above the wafer taking position.
The stroke adjusting component is fixedly connected with the driving component above the crystal taking position, when the stroke adjusting component drives the chip picking mechanism above the crystal taking position to push down, the driving component on the stroke adjusting component descends synchronously along with the stroke adjusting component, so that when the subsequent driving component drives the chip picking mechanism above the crystal taking position to do lifting motion, the height adjustment is not required additionally, and further, the driving component above the crystal taking position drives the chip picking mechanism above the crystal taking position to do lifting motion in the vertical direction, so that the chip is picked up.
In a specific embodiment, the stroke adjustment assembly comprises a servo connecting rod assembly, a cam and a lifting assembly, wherein the servo connecting rod assembly is arranged on one side of the lifting assembly, the cam is fixedly arranged below the lifting assembly, and the servo connecting rod assembly drives the lifting assembly to move up and down so as to drive the cam to do lifting motion in the vertical direction.
In a further embodiment, the driving component above the crystal taking position is fixedly arranged on the cam, and when the stroke adjusting component works, the up-and-down motion of the cam drives the driving component to lift in the vertical direction, and further, when the driving component above the crystal taking position works, the chip picking mechanism below the driving component is driven to lift or press in the vertical direction.
In specific embodiment, lifting unit includes fixed plate, connecting plate, linear slide rail and extension spring, the linear slide rail is fixed to be set up on the fixed plate, the fixed slider that sets up on the linear slide rail of connecting plate, extension spring one end is fixed to be set up on the fixed plate, extension spring's the other end is fixed to be set up on the connecting plate, connecting plate and servo link mechanism fixed connection, servo link mechanism includes servo motor, crank and connecting rod, the one end and the cranked border of connecting rod rotate to be connected, the other end rotates to be connected with the connecting plate, servo motor drives the crank and rotates, drive the connecting plate up-and-down motion through the connecting rod, and then drive cam up-and-down motion.
When the servo connecting rod assembly works, the connecting plate on the lifting assembly is driven to move up and down in the vertical direction, the cam is driven to move up and down, at the moment, the linear sliding rail guides the lifting movement of the connecting plate in the vertical direction, further, the lifting movement of the cam arranged below the connecting plate is guided, the tension of the extension spring ensures that the cam does not fall down in a power-off state, when the chip picking mechanism finishes the picking work of the chip and leaves the crystal picking position, the connecting plate and the cam arranged below the connecting plate return to the original high position under the tension of the extension spring, the arrangement of the extension spring also enables the cam to be adjustable in pressing down of the chip picking mechanism, and the chip is prevented from being impacted by too large pressure, so that the chip is damaged.
In a specific embodiment, the cam is of an arc structure with a high bottom and a low middle and two low ends, and when the rotary crystal taking and placing unit works, the chip pickup mechanism which rotates to a crystal taking position reaches the middle of the cam along the arc structure.
The cam is the arc structure that high both ends are low in the middle of the bottom, the intermediate position of bottom corresponds with getting the brilliant position, the intermediate position setting of cam bottom just over getting the brilliant position promptly, will reach the chip pickup mechanism that gets the brilliant position under curved direction, gradually by the roll-down to the low level, and under the drive of the drive assembly who gets the brilliant position top, by the roll-down to get the brilliant position and carry out the pick-up of chip, the cam sets up with the arc structure, make the chip pickup mechanism that is close to getting the brilliant position go up and down in the vertical direction gradually the realization, avoid chip pickup mechanism to rise suddenly and fall and produce too big impact force to getting the chip on the brilliant platform, thereby make the chip damage, influence the efficiency that the chip was selected.
In a further embodiment, the tension spring is a shackle tension spring, wherein a shackle at the upper end of the shackle tension spring is connected with a shackle fixing base on the fixing plate, and a shackle at the lower end of the shackle tension spring is connected with a shackle fixing base on the connecting plate.
The shackle extension spring is connected with the fixed plate and the shackle fixed seat on the connecting plate, so that the movement speed of the connecting plate and the cam below the connecting plate is slowed down, and after the picking work is completed, the connecting plate and the cam can return to the original high position by virtue of the tension of the extension spring, so that the next chip picking work can be matched smoothly.
In a further embodiment, the stroke adjustment assembly further comprises an outer cover, wherein the outer cover is used for protecting the motion of the servo link assembly from being influenced by smoke, dust and other impurities, so that the pollution to the chip is prevented, and the yield is improved.
In a specific embodiment, the chip pickup mechanism comprises a suction nozzle unit, an elastic unit and a bracket arm support, wherein the elastic unit is arranged below the pressure head unit and fixedly connected with the bracket arm support, and the suction nozzle unit is fixedly arranged at the front end of the bracket arm support.
The elastic unit regulates and controls the pressure of the chip picking mechanism, so that the whole downward pressing and rising speed and strength of the chip picking mechanism are controlled, the situation that the chip is damaged due to overlarge impact force is avoided, the bracket arm support enables the suction nozzle unit to extend out of the direct stress range of the downward pressing of the driving assembly, and the suction nozzle unit can take and place the crystal in the photographing range of the crystal taking and positioning camera assembly and the crystal placing and positioning camera assembly.
In a further embodiment, the nozzle unit comprises a nozzle, a nozzle stem and an air duct, the air duct being fixedly connected to the nozzle stem, the nozzle stem being detachably connected to the nozzle.
Suction is generated by vacuumizing through an air pipe, the chip is adsorbed on the suction nozzle, and the suction nozzle rod and the suction nozzle can be detached independently, so that the die change is easy.
In a further embodiment, the chip pick-up mechanism comprises a precision ball slide group, the suction nozzle units are fixedly connected through the precision ball slide group, and the precision ball slide group plays a role in guiding the up-and-down movement of the suction nozzle units.
In a further embodiment, the elastic unit comprises a spring and an oil-free linear slide.
The oilless linear slide rail is used for guiding, so that the whole chip pickup mechanism can move in the vertical direction, and the spring has the buffering effect and is used for adjusting the pressing force.
In a further embodiment, the elastic unit is externally provided with an outer cover, and the outer cover is used for protecting lifting movement of the elastic unit from being influenced by smoke, dust and other impurities, so that pollution to the chip is prevented, and the yield is improved.
In a specific embodiment, the driving assembly comprises a servo motor, a cam unit and a pressure head unit, wherein the servo motor, the cam unit and the pressure head unit are fixedly connected from top to bottom, and the servo motor drives the cam unit to move and drives the pressure head unit to do lifting motion in the vertical direction.
The servo motor, the cam unit and the pressure head unit are fixed through the fixing seat, the combination of the servo motor and the cam unit can effectively improve the downward pressing speed and stability, and the pressure head unit is used for pushing the chip pick-up mechanism to descend or ascend in the vertical direction, so that the chip pick-up mechanism is driven to move up and down in the vertical direction, and the chip pick-up work can be smoothly carried out.
In a further embodiment, the cam unit comprises a cam connected to the rotating shaft of the servo motor and a cam follower in contact with the lower surface of the cam, the lower surface of the cam having different height dimensions.
When the servo motor moves, cams with different height sizes on the lower surface are driven to rotate, so that the cam follower below the cams is driven to ascend or descend in the vertical direction, and the pressure head unit below the cam unit is further driven to ascend or descend.
In a further embodiment, the pressure head unit comprises a pressure rod, a pressure head and a compression spring, wherein the compression spring is fixedly arranged between the cam unit and the fixed seat, the pressure rod is arranged inside the compression spring, and the pressure head is fixedly connected with the pressure rod.
When the servo motor is matched with the cam unit to drive the pressure head unit to ascend or descend, the compression spring arranged in the pressure head unit plays a role in compressing and buffering, lifting movement of the pressure head unit in the vertical direction can be controlled, and lifting movement of the cam follower in the vertical direction is also matched with the compression spring.
In a specific embodiment, the crystal taking camera positioning assembly and the crystal placing camera positioning assembly comprise a CCD, a light source, a lens and an XYZ manual adjusting mechanism, and the CCD, the XYZ manual adjusting mechanism, the lens and the light source are sequentially connected from top to bottom.
The CCD has higher sensitivity, high detection precision and high-speed detection efficiency, is convenient to output and is not easy to be interfered by the outside, the light source and the lens are necessary components which cannot be absent for carrying out chip positioning detection, and the XYZ manual adjusting mechanism enables the crystal taking positioning camera component and the crystal placing positioning camera component to have the adjustability in the directions, so that the requirements of taking a crystal and placing the crystal in work for photographing, positioning and detecting the chip are further met.
In a specific embodiment, a solenoid valve assembly and a vacuum pressure gauge are also included.
The electromagnetic valve assembly comprises a vacuum electromagnetic valve and a vacuum breaking electromagnetic valve, when the chip picking mechanism reaches the crystal taking position, the crystal taking driving assembly presses down the chip picking mechanism, the vacuum electromagnetic valve acts to absorb the chip, the crystal taking driving assembly ascends after the vacuum gauge head returns a signal, and when the chip picking mechanism with the chip reaches the crystal placing position, the crystal placing driving assembly presses down, and the vacuum breaking electromagnetic valve acts to place the chip.
The utility model provides a high-speed bull chip sorting unit, including rotatory crystal taking and put brilliant unit and stroke adjustment subassembly, rotatory crystal taking and put brilliant unit includes stroke adjustment subassembly, actuating assembly and chip pickup mechanism, rotatory crystal taking and put brilliant unit is provided with 18 chip pickup mechanisms, appointed one station on getting brilliant platform is for getting the brilliant position, appointed the position of one station on putting brilliant platform is for putting the brilliant position, direct drive motor is rotatory 20 at every turn, when the brilliant position is got to chip pickup mechanism arrival, stroke adjustment subassembly pushes down, make the actuating assembly below get the chip pickup mechanism on the brilliant position and put the chip pickup machine stroke difference on the brilliant position, be convenient for get brilliant platform and put the brilliant platform and carry out the layering setting, save occupation space, get brilliant and put brilliant during operation, actuating assembly motion makes chip pickup mechanism go on elevating movement in the vertical direction, thereby accomplish the pick up and place of chip pickup mechanism and place the action by solenoid valve assembly and vacuum gauge, still be provided with locating component on the brilliant position and get brilliant position camera, be convenient for get brilliant platform and put the chip below and put the brilliant platform and put and detect the chip and take out the difference in the brilliant position, the dust rate of dust, the dust of the chip is reduced, the dust of the outside has been separated from the product is high, and has reduced and has high dust and has been separated and has high dust and has high protection. The utility model provides a high-speed bull chip sorting unit can realize that high-speed, high accuracy, high efficiency get brilliant, and whole group's dustcoat protection, inside bleed, guarantees that oil mist and dust pollution free below product has realized high cleanliness factor, and it is lower floor setting to get brilliant platform and put brilliant platform, and occupation of land space is little, reduce cost.
Drawings
The accompanying drawings are included to provide a further understanding of the embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and together with the description serve to explain the principles of the invention. Many of the intended advantages of other embodiments and embodiments will be readily appreciated as they become better understood by reference to the following detailed description. The elements of the drawings are not necessarily to scale relative to each other. Like reference numerals designate corresponding similar parts.
FIG. 1a is a perspective view of a high-speed multi-head chip sorting apparatus according to the present invention;
FIG. 1b is a top view of a high-speed multi-head chip sorting apparatus according to the present invention
FIG. 1c is a schematic diagram of the internal structure of a high-speed multi-head chip sorting device according to the present invention;
fig. 2 is a schematic structural diagram of a rotary crystal taking and placing unit of a high-speed multi-head chip sorting device according to the technical scheme of the invention;
FIGS. 3a-b are schematic views of a stroke adjusting assembly of a high-speed multi-head chip sorting apparatus according to the present invention;
FIG. 4 is a schematic diagram of a driving assembly of a high-speed multi-head chip sorting apparatus according to the present invention;
FIG. 5 is a schematic diagram of a chip pick-up mechanism of a high-speed multi-head chip sorting apparatus according to the present invention;
fig. 6 is a schematic structural diagram of a crystal picking and positioning camera assembly of the high-speed multi-head chip sorting device according to the technical scheme of the invention.
Detailed Description
In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. For this, directional terms, such as "top", "bottom", "left", "right", "upper", "lower", and the like, are used with reference to the orientation of the described figures. Because components of embodiments can be positioned in a number of different orientations, the directional terminology is used for purposes of illustration and is in no way limiting. It is to be understood that other embodiments may be utilized or logical changes may be made without departing from the scope of the present invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.
Fig. 1a shows a perspective view of a high-speed multi-head chip sorting apparatus according to the technical scheme of the present invention, fig. 1b shows a bottom view of the high-speed multi-head chip sorting apparatus according to the technical scheme of the present invention, fig. 1c shows an internal structure schematic view of the high-speed multi-head chip sorting apparatus according to the technical scheme of the present invention, as shown in fig. 1a-c, a high-speed multi-head chip sorting apparatus comprises a rotary die-taking and placing unit 1, a stroke adjusting assembly 3 and a protective housing 2, the stroke adjusting assembly 3 is fixedly arranged at the outer side of the rotary die-taking and placing unit 1, the rotary die-taking and placing unit 1 comprises a direct driving motor 11, a plurality of die pick-up mechanisms 13 and a plurality of driving assemblies 12, a plurality of die pick-up mechanisms 13 are arranged at the bottom of the rotary die-taking and placing unit 1, designating a station on the crystal taking platform as a crystal taking position, designating a station on the crystal placing platform as a crystal placing position (the crystal taking platform and the crystal placing platform are not shown in the drawings and can be arranged according to actual requirements), driving the plurality of chip pickup mechanisms 13 to rotate on the circumference by the direct drive motor 11, respectively arranging two driving components 12 above the crystal taking position and the crystal placing position, respectively driving the chip pickup mechanisms 13 reaching the crystal taking position and the crystal placing position to do lifting motion in the vertical direction when the driving components 12 above the crystal taking position and the crystal placing position work, and driving the chip pickup mechanisms 13 reaching the crystal taking position to press down by the stroke adjusting component 3 so as to ensure that the crystal taking position and the crystal placing position form a height difference.
The direct-drive motor 11 drives the chip pickup mechanism 13 fixedly arranged at the bottom of the rotary crystal taking and placing unit 1 to rotate in a circular motion period, when the chip pickup mechanism 13 reaches a crystal taking position, a distance is pressed down in the vertical direction under the action of the stroke adjusting component 3, and the driving component 12 on the crystal taking position drives the chip pickup mechanism 13 which rotates under the drive of the direct-drive motor 11 and reaches the crystal taking position to do lifting motion in the vertical direction, so that the chip pickup requirement is met, and chips are picked and collected from the crystal taking platform; further, when the chip picking mechanism 13 with the chip reaches the crystal position, the driving component 12 above the crystal position drives the chip picking mechanism 13 to lift in the vertical direction, so that the picked chip is placed on the crystal platform;
the setting of stroke adjustment subassembly 3 makes chip picking mechanism 13 reach get the crystal position when carrying out the chip and pick up with chip picking mechanism 13 reach put the crystal position when carrying out the chip and place, there is the difference in height in original height, owing to the existence of difference in height, can be with putting the crystal platform and get the crystal platform and set up according to the mode of upper and lower floor, the space that the device occupy has been saved, rotatory get the crystal and put be provided with a plurality of chip picking mechanism 13 on the brilliant unit 1, the motor 11 just can realize picking up and placing of a plurality of chips of every rotation, and can carry out the pick up and placing of chip in step, the efficiency that the chip was selected separately has been improved greatly, the setting of protecting cover 2 makes whole group's device be a semi-closed state, further, can be through inside bleed, guarantee oil mist and dust pollution free below product for the sorting work of chip has the characteristics of high cleanliness factor.
In a further embodiment, the crystal taking and positioning camera assembly 41 and the crystal placing and positioning camera assembly 42 are further included, the crystal taking and positioning camera assembly 41 is fixedly arranged right above the crystal taking position, and the crystal placing and positioning camera assembly 42 is fixedly arranged right above the crystal placing position.
The crystal taking and positioning camera component 41 is used for positioning and detecting chips on the crystal taking platform, so that the chip picking mechanism 13 reaching the crystal taking position can accurately pick up the chips, after the chip picking mechanism 13 finishes a picking action, the direct-drive motor 11 continues to rotate, and after the chip picking mechanism 13 leaves the crystal taking position, the crystal taking and positioning camera component continues to take a picture of the chips on the crystal taking platform to position so as to provide accurate information for the next picking work; the die placement positioning camera assembly 12 is used for positioning and detecting the chip on the die placement platform, so that the chip can be accurately placed when the chip pickup mechanism 13 with the chip reaches the die placement position.
In a further embodiment, a solenoid valve assembly 5 and a vacuum pressure gauge 6 are also included.
The electromagnetic valve assembly 5 comprises a vacuum electromagnetic valve 51 and a vacuum breaking electromagnetic valve 52 (the vacuum electromagnetic valve 51 and the vacuum breaking electromagnetic valve 52 are not marked in the figure), when the chip picking mechanism 13 reaches a crystal picking position, the driving assembly 12 on the crystal picking position presses down the chip picking mechanism 13, the vacuum electromagnetic valve 51 acts to suck chips, the driving assembly 12 rises after the vacuum gauge outfit 6 returns a signal, when the chip picking mechanism 12 with the chips reaches a crystal placing position, the driving assembly 12 on the crystal placing position presses down, and the vacuum breaking electromagnetic valve 52 acts to place the chips.
In a further embodiment, the stroke adjustment assembly 3 is fixedly connected to the driving assembly 12 above the wafer taking position.
The stroke adjusting component 3 is fixedly connected with the driving component 12 above the crystal taking position, when the stroke adjusting component 3 drives the chip picking mechanism 13 above the crystal taking position to be pressed down, the driving component 12 on the stroke adjusting component 3 descends synchronously with the stroke adjusting component 3, so that in the follow-up work, when the driving component 12 drives the chip picking mechanism 13 above the crystal taking position to do lifting motion, the driving component 12 does not need to additionally adjust the height, and further, the driving component 12 above the crystal taking position drives the chip picking mechanism 13 above the crystal taking position to do lifting motion in the vertical direction so as to pick up the chip.
Fig. 2 shows a schematic structural diagram of a rotary die-picking and die-placing unit of a high-speed multi-head chip sorting device according to the technical scheme of the present invention, and as shown in fig. 2, 18 chip pick-up mechanisms are equidistantly arranged on the rotary die-picking and die-placing unit 1.
The rotary crystal taking and placing unit 1 is provided with 18 chip picking mechanisms 13, the distance between each chip picking mechanism 13 and the adjacent chip picking mechanism 13 is the same, the direct-drive motor 11 only needs to rotate 20 degrees each time, the chip picking mechanism 13 can reach the position of the adjacent chip picking mechanism 13, the corresponding time is 1/18 of the time used by the direct-drive motor 11 to rotate for one circle, the next crystal taking and placing actions can be realized rapidly, therefore, the work of sorting chips for many times can be realized in the period of the direct-drive motor 11 rotating for one circle, and the work efficiency of sorting chips is greatly improved.
Fig. 3a-b show a schematic view of a stroke adjusting assembly of a high-speed multi-head chip sorting device according to the technical scheme of the present invention, as shown in fig. 3a-b, the stroke adjusting assembly 3 includes a servo link assembly 31, a cam 33 and a lifting assembly 32, the servo link assembly 31 is disposed at one side of the lifting assembly 32, the cam 33 is fixedly disposed below the lifting assembly 32, and the servo link assembly 31 drives the lifting assembly 32 to move up and down so as to drive the cam 33 to do lifting motion in a vertical direction.
In a further embodiment, the driving component 12 above the crystal taking position is fixedly arranged on the cam 33, when the stroke adjusting component 12 works, the up-and-down movement of the cam 33 drives the driving component 12 to lift in the vertical direction, and further, when the driving component 12 above the crystal taking position works, the chip picking mechanism 13 below the driving component is driven to lift or press in the vertical direction.
In a specific embodiment, the lifting assembly 32 includes a fixed plate 321, a connecting plate 325, a linear sliding rail 322, a sliding block 323 and an extension spring 324, the linear sliding rail 322 is fixedly arranged on the fixed plate 321, the connecting plate 325 is fixedly arranged on the sliding block 323 on the linear sliding rail 322, one end of the extension spring 324 is fixedly arranged on the fixed plate 321, the other end of the extension spring 324 is fixedly arranged on the connecting plate 325, the connecting plate 325 is fixedly connected with the servo link mechanism 31, the servo link mechanism 31 includes a servo motor 311, a crank 313 and a connecting rod 312, one end of the connecting rod 312 is rotationally connected with the edge of the crank 313, the other end is rotationally connected with the connecting plate 325, the servo motor 311 drives the crank 313 to rotate, and the connecting plate 325 is driven to move up and down through the connecting rod 312, so as to drive the cam 33 to move up and down.
When the servo connecting rod assembly 31 works, the connecting plate 325 on the lifting assembly 32 is driven to move up and down in the vertical direction, the cam 33 is driven to move up and down, at the moment, the linear sliding rail 322 guides the lifting movement of the connecting plate 325 in the vertical direction, further, the lifting movement of the cam 33 arranged below the connecting plate 325 is guided, the tension of the tension spring 324 ensures that the cam 33 does not fall down in a power-off state, when the chip picking mechanism 13 finishes the chip picking work and leaves a crystal picking position, the connecting plate 325 and the cam 33 below the connecting plate 325 return to an original high position under the tension of the tension spring 324, the tension spring 324 also ensures that the cam 33 presses down the chip picking mechanism 13 with adjustable force, and the chip is prevented from being damaged due to the fact that the pressure is too large.
In a specific embodiment, the cam 33 has an arc structure with a middle high and two low ends, and when the rotary crystal taking and placing unit 1 works, the chip picking mechanism 13 which is about to rotate to reach the crystal taking position reaches the middle of the cam 33 along the arc structure.
The cam 33 is of an arc-shaped structure with high middle and low two ends, the middle position of the bottom corresponds to the crystal taking position, namely, the middle position of the bottom of the cam 33 is arranged right above the crystal taking position, the chip picking mechanism 13 reaching the crystal taking position is gradually pressed down to a low position under the arc-shaped guide, and is driven by the driving assembly 12 above the crystal taking position to be pressed down to the crystal taking position to pick up chips, the cam 33 is arranged in an arc-shaped structure, so that the chip picking mechanism 13 close to the crystal taking position is gradually lifted in the vertical direction, the chip picking mechanism 13 is prevented from generating excessive impact force on the chip on the crystal taking platform due to sudden lifting and suddenly falling, and the chip damage is avoided, and the chip sorting efficiency is influenced.
In a further embodiment, the tension spring 324 is a shackle tension spring, wherein a shackle at the upper end of the shackle tension spring 324 is connected to a shackle mounting base on the mounting plate 321, and a shackle at the lower end of the shackle tension spring 324 is connected to a shackle mounting base on the connecting plate 325.
The shackle extension spring 324 is connected with the shackle fixing base on the fixing plate 321 and the connection plate 325, so that the movement speed of the connection plate 325 and the cam 33 below the connection plate 325 is slowed down, and after the picking up work is completed, the connection plate 325 and the cam 33 can return to the original high position by virtue of the tension of the extension spring 324, so that the next chip picking up work can be matched smoothly.
In a further embodiment, the stroke adjustment assembly 3 further includes a housing 34, where the housing 34 is used to protect the movement of the servo link assembly 31 from smoke, dust, etc., to prevent chip contamination and improve yield.
Fig. 4 shows a schematic structural diagram of a driving assembly of a high-speed multi-head chip sorting device according to the technical scheme of the present invention, as shown in fig. 4, the driving assembly 12 includes a servo motor 121, a cam unit 122 and a ram unit 123, wherein the servo motor 121, the cam unit 122 and the ram unit 123 are fixedly connected from top to bottom, and the servo motor 121 drives the cam unit 122 to move and drives the ram unit 123 to do lifting motion in a vertical direction. The servo motor 121, the cam unit 122 and the pressing head unit 123 are fixed through the fixing seat 124, the combination of the servo motor 121 and the cam unit 122 can effectively improve the pressing speed and stability, and the pressing head unit 123 is used for pushing the chip picking mechanism 13 to descend or ascend in the vertical direction, so that the chip picking mechanism 13 is driven to move up and down in the vertical direction, and the chip picking work can be smoothly carried out.
In a further embodiment, the cam unit 122 includes a cam 1221 and a cam follower 1222, the cam 1221 is connected to the rotating shaft of the servo motor 121, the cam follower 1222 is in contact with the lower surface of the cam 1221, and the lower surface of the cam 1221 has different height dimensions.
When the servo motor 121 moves, the cams 1221 having different height dimensions on the lower surface are driven to rotate, so that the cam followers 1222 below the cams 1221 are driven to ascend or descend in the vertical direction, and the ram unit 123 below the cam unit 122 is further driven to ascend or descend.
In a further embodiment, the ram unit 123 includes a compression bar 1231, a ram 1232, and a compression spring 1233, the compression spring 1233 being fixedly disposed between the cam unit 122 and the fixing base 124, the compression bar 1231 being disposed inside the compression spring 1233, the ram 1232 being fixedly connected to the compression bar 1231.
When the servo motor 121 cooperates with the cam unit 122 to drive the ram unit 123 to ascend or descend, the compression spring 1233 disposed in the ram unit 123 plays a role in compressing and buffering, and can control the lifting motion of the ram unit 123 in the vertical direction, and the arrangement of the compression spring 1233 also cooperates to complete the lifting motion of the cam follower 1222 in the vertical direction.
As shown in fig. 5, the chip pick-up mechanism 13 includes a suction nozzle unit 131, an elastic unit 132 and a bracket arm bracket 133, the elastic unit 132 is disposed below the ram unit 123, the elastic unit 132 is fixedly connected to the bracket arm bracket 133, and the suction nozzle unit 131 is fixedly disposed at a front end of the bracket arm bracket 133. The elastic unit 132 regulates and controls the pressure of the chip pickup mechanism 13, so as to control the overall downward pressing and upward pressing speed and force of the chip pickup mechanism 13, avoid the occurrence of chip damage caused by overlarge impact force, enable the suction nozzle unit 131 to extend out of the direct stress range of the downward pressing of the driving assembly 12 by the bracket arm support 133, and enable the suction nozzle unit 131 to perform the actions of picking up and placing the chip in the photographing range of the chip picking-up and positioning camera assembly 41 and the chip placing and positioning camera assembly 42.
In a further embodiment, the nozzle unit 131 includes a nozzle 1311, a nozzle stem 1312, and an air tube 1313, the air tube 1313 being fixedly connected to the nozzle stem 1312, the nozzle stem 1312 being detachably connected to the nozzle 1311.
Suction is generated by vacuumizing through the air pipe 1313, the chip is adsorbed on the suction nozzle 1311, and the suction nozzle rod 1312 and the suction nozzle 1311 can be independently detached, so that the die change is easy.
In a further embodiment, the chip pick-up mechanism 13 includes a precision ball slide group 113134, the nozzle units 131 are fixedly connected by a precision ball slide group 134, and the precision ball slide group 134 plays a role in guiding the up-and-down movement of the nozzle units 131.
In a further embodiment, the elastic unit 132 includes a spring 1321 and an oilless linear slide 1322.
The oilless linear slide 1322 is used for guiding so that the chip pickup mechanism 13 as a whole can move in the vertical direction, and the spring 1321 plays a role of buffering for adjusting the pressing force.
In a further embodiment, the outer cover 135 is disposed outside the elastic unit 132, and the outer cover 135 is used to protect the lifting movement of the elastic unit 132 from the influence of smoke, dust and other impurities, prevent the chip from being polluted, and improve the yield.
As shown in fig. 6, the crystal taking machine positioning assembly 41 includes a CCD411, a light source 414, a lens 413, and an XYZ manual adjustment mechanism 412, and the CCD411, the XYZ manual adjustment mechanism 412, the lens 413, and the light source 414 are sequentially connected from top to bottom.
In a further embodiment, the die attach positioning assembly 42 has the same structure as the die attach positioning assembly.
The CCD has higher sensitivity, high detection precision and high-speed detection efficiency, is convenient to output and is not easy to be interfered by the outside, the light source and the lens are necessary components which cannot be absent for carrying out chip positioning detection, and the XYZ manual adjusting mechanism 412 enables the crystal taking positioning camera component 41 and the crystal placing positioning camera component 42 to have the adjustability in the directions, so that the requirements of taking a crystal and placing the crystal for shooting, positioning and detecting the chip in the work are further met.
The working flow of the high-speed multi-head chip sorting device provided by the technical scheme of the invention is as follows: the chip picking up and positioning camera component shoots and positions the chip on the chip picking up platform, the direct drive motor rotates after receiving signals, one chip picking up mechanism reaches the chip picking up position, the stroke adjusting component presses down the chip picking up mechanism to a certain height, the driving component drives the chip picking up mechanism to do lifting motion in the vertical direction, at the moment, under the cooperation of the electromagnetic valve component and the vacuum pressure gauge, the chip picking up mechanism performs picking up work, after the picking up work is completed, the chip picking up and positioning camera performs new round shooting and positioning on the chip picking up platform, the direct drive motor continues to rotate, and the adjacent chip picking up mechanism performs the chip picking up work of the next round; when the chip picking mechanism with the chip reaches the crystal picking position, the driving component on the crystal picking position drives the chip picking mechanism to do lifting motion in the vertical direction, at the moment, under the cooperation of the electromagnetic valve component and the vacuum pressure gauge, the chip picking mechanism performs placing work, the chip is placed on the crystal placing platform, the crystal placing positioning camera performs photographing positioning on the chip on the crystal picking platform, the direct driving motor continues to rotate, and the adjacent chip picking mechanism with the chip performs the chip placing work of the next round.
According to the high-speed multi-head chip sorting device, the rotary crystal taking and placing unit, the stroke adjusting component and the protective outer cover are arranged, 18 chip picking mechanisms are arranged on the rotary crystal taking and placing unit, the chip sorting operation can be carried out for many times in a circle of rotation period of the direct-drive motor, high-speed, high-precision and high-efficiency crystal taking is achieved, the whole group of outer covers are protected, internal air extraction is carried out, oil mist and dust are guaranteed to not pollute products below, high cleanliness is achieved, the stroke adjusting component is arranged, when the chip picking mechanisms take crystals and place crystals, the chip picking mechanisms have height differences, the crystal taking platform and the crystal placing platform can be arranged on the upper layer and the lower layer, occupied space is small, and cost is reduced.
It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments of the present invention without departing from the spirit and scope of the invention. In this manner, the invention is also intended to cover such modifications and variations as come within the scope of the appended claims and their equivalents. The word "comprising" does not exclude the presence of other elements or steps than those listed in a claim. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims shall not be construed as limiting the scope.
Claims (7)
1. The high-speed multi-head chip sorting device is characterized by comprising a rotary crystal taking and placing unit, a stroke adjusting assembly and a protective outer cover, wherein the stroke adjusting assembly is arranged on the outer side of the rotary crystal taking and placing unit in a lifting manner, the stroke adjusting assembly comprises a servo connecting rod assembly, a cam and a lifting assembly, the servo connecting rod assembly is arranged on one side of the lifting assembly, the cam is fixedly arranged below the lifting assembly, and the servo connecting rod assembly drives the lifting assembly to move up and down so as to drive the cam to do lifting motion in the vertical direction; the lifting assembly comprises a fixed plate, a connecting plate, a linear sliding rail and an extension spring, wherein the linear sliding rail is fixedly arranged on the fixed plate, the connecting plate is fixedly arranged on a sliding block on the linear sliding rail, one end of the extension spring is fixedly arranged on the fixed plate, the other end of the extension spring is fixedly arranged on the connecting plate, the connecting plate is fixedly connected with the servo connecting rod assembly, the servo connecting rod assembly comprises a servo motor, a crank and a connecting rod, one end of the connecting rod is rotationally connected with the edge of the crank, the other end of the connecting rod is rotationally connected with the connecting plate, the servo motor drives the crank to rotate, and the connecting rod drives the connecting plate to move up and down so as to drive the cam to move up and down; the cam is of an arc-shaped structure with the middle high and the two low ends of the bottom; the rotary crystal taking and placing unit comprises a direct-drive motor, a plurality of chip picking mechanisms and a plurality of driving components, the bottom of the rotary crystal taking and placing unit is provided with the plurality of chip picking mechanisms, one station on the crystal taking platform is designated as a crystal taking position, one station on the crystal placing platform is designated as a crystal placing position, the direct-drive motor drives the plurality of chip picking mechanisms to rotate on the circumference, and when the rotary crystal taking and placing unit works, the chip picking mechanism which is about to rotate to reach the crystal taking position reaches the middle part of the cam along an arc-shaped structure; the driving components above the crystal taking position and the crystal placing position can respectively drive the chip picking mechanism reaching the crystal taking position and the crystal placing position to do lifting motion in the vertical direction; the stroke adjusting component drives the chip pickup mechanism reaching the upper part of the crystal taking position to be pressed down so as to enable the crystal taking position and the crystal placing position to form a height difference.
2. The high-speed multi-head chip sorting apparatus according to claim 1, wherein 18 chip pick-up mechanisms are provided at equal intervals on the rotary die-picking and-placing unit.
3. The high-speed multi-head chip sorting device according to claim 1, further comprising a crystal taking and positioning camera assembly and a crystal placing and positioning camera assembly, wherein the crystal taking and positioning camera assembly is fixedly arranged right above the crystal taking position, and the crystal placing and positioning camera assembly is fixedly arranged right above the crystal placing position.
4. The high-speed multi-head chip sorting device according to claim 1, wherein the driving assembly comprises a servo motor, a cam unit and a pressure head unit, the servo motor, the cam unit and the pressure head unit are fixedly connected from top to bottom, and the servo motor drives the cam unit to move and drives the pressure head unit to do lifting movement in the vertical direction.
5. The high-speed multi-head chip sorting device according to claim 4, wherein the chip pick-up mechanism comprises a suction nozzle unit, an elastic unit and a bracket arm support, the elastic unit is arranged below the pressing head unit and fixedly connected with the bracket arm support, and the suction nozzle unit is fixedly arranged at the front end of the bracket arm support.
6. The high-speed multi-head chip sorting device according to claim 3, wherein the crystal taking and positioning camera assembly and the crystal placing and positioning camera assembly comprise a CCD, a light source, a lens and an XYZ manual adjusting mechanism, and the CCD, the XYZ manual adjusting mechanism, the lens and the light source are sequentially connected from top to bottom.
7. The high-speed multi-headed chip sorting apparatus of claim 1 further comprising a solenoid valve assembly and a vacuum pressure gauge.
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| CN202211351586.7A CN115608626B (en) | 2022-10-31 | 2022-10-31 | High-speed multi-head chip sorting device |
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| CN202211351586.7A CN115608626B (en) | 2022-10-31 | 2022-10-31 | High-speed multi-head chip sorting device |
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Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3384236A (en) * | 1966-08-31 | 1968-05-21 | Corning Glass Works | Machine for automatically testing and orienting miniature semiconductor chips |
| US4202435A (en) * | 1978-08-30 | 1980-05-13 | Emerson Electric Co. | Automatic reciprocating, indexing and picking assembly apparatus |
| JP2009064938A (en) * | 2007-09-06 | 2009-03-26 | Shinkawa Ltd | Pickup device of semiconductor die and pickup method |
| CN103247562B (en) * | 2013-05-17 | 2015-11-25 | 嘉兴景焱智能装备技术有限公司 | Crystal grain rotary type tower fetching device |
| CN108029237B (en) * | 2015-10-01 | 2020-02-07 | 雅马哈发动机株式会社 | Mounting head and surface mounting machine |
| CN209109645U (en) * | 2018-10-12 | 2019-07-16 | 江苏信息职业技术学院 | A kind of IC chip test sorting unit |
| CN111776719B (en) * | 2020-06-09 | 2021-06-11 | 温州职业技术学院 | Automatic marking, detecting and packaging integrated machine for chips |
| CN216154911U (en) * | 2021-02-23 | 2022-04-01 | 马丁科瑞半导体技术(南京)有限公司 | Novel consistent quick-witted steering station |
| CN113998207B (en) * | 2021-11-30 | 2023-06-20 | 厦门成飞自动化设备有限公司 | Packaging equipment |
| CN115196347A (en) * | 2022-05-23 | 2022-10-18 | 广州诺顶智能科技有限公司 | Turret device |
| CN115228767A (en) * | 2022-07-26 | 2022-10-25 | 苏州思铂创半导体科技有限公司 | Buffering power adjustable Z axle pushes down mechanism |
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Address after: Unit 1, 1st Floor, No. 670 Hong'an Road, Xiang'an Industrial Zone, Xiamen Torch High tech Zone, Xiamen, Fujian Province, 361000 Patentee after: Koer Microelectronics Equipment (Xiamen) Co.,Ltd. Address before: 361103 unit 1, floor 1, No. 670, Honglong Road, torch high tech Zone (Xiang'an) Industrial Zone, Xiamen, Fujian Patentee before: COER AUTOMATION EQUIPMENT CO.,LTD. |
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Denomination of invention: A high-speed multi head chip sorting device Granted publication date: 20230428 Pledgee: Agricultural Bank of China Limited by Share Ltd. Xiamen Xiangan branch Pledgor: Koer Microelectronics Equipment (Xiamen) Co.,Ltd. Registration number: Y2024980005972 |