CN216528812U

CN216528812U - Die bonding head angle correction mechanism and die bonding equipment

Info

Publication number: CN216528812U
Application number: CN202122996094.0U
Authority: CN
Inventors: 梁杰坤; 杨行志
Original assignee: Dongguan Meng Tuo Intelligent Technology Co ltd
Current assignee: Dongguan Meng Tuo Intelligent Technology Co ltd
Priority date: 2021-11-30
Filing date: 2021-11-30
Publication date: 2022-05-13
Anticipated expiration: 2031-11-30

Abstract

The utility model discloses a die bonder head angle correction mechanism and die bonder equipment, and relates to the field of semiconductor equipment; wherein, solid crystal first angle correction mechanism includes: the wafer adsorption device comprises an adsorption mechanism, a first driving module and a control mechanism, wherein the adsorption mechanism is provided with a rotating shaft, and one end of the rotating shaft is used for adsorbing a wafer; the first driving module is connected with the adsorption mechanism and used for driving the rotating shaft to rotate to a preset angle so as to correct the angle of the wafer; the control mechanism is electrically connected with the adsorption mechanism and the first driving module respectively. After the wafer is adsorbed to the one end of adsorption apparatus's rotation axis, through the rotation axis rotation of control adsorption apparatus of mutually supporting of control mechanism and first drive module to this rectifies the wafer angle, this kind of solid crystal first angle correction mechanism can save material and assembly cost, further promotes the efficiency that solid crystal first angle was rectified.

Description

Die bonding head angle correction mechanism and die bonding equipment

Technical Field

The utility model relates to the field of semiconductor equipment, in particular to a die bonding head angle correcting mechanism and die bonding equipment.

Background

The die bonder is a key device in an LED packaging production line, and the die bonding process comprises the following steps: the dispensing device firstly dispenses the glue on the die bonding station of the substrate, then the swing arm (also called a wafer picking arm) takes the wafer out of the wafer ring, and then the wafer is transferred to the die bonding station dispensed with the glue. When all the qualified wafers on the wafer ring are taken out, the wafer ring is taken down from the wafer table, and a wafer ring is put on the wafer table again, the angle is calibrated, and then the wafer fixing is started.

At present, LED wafer angle aligning gear, take out the wafer from the wafer ring, the level is placed at ceramic vacuum platform upper surface, under the effect of the fixed effective location that realizes of ceramic vacuum platform's vacuum adsorption, and the accurate control motor rotates under response piece and the inductor are mutually supported, and then the turned angle of accurate control ceramic vacuum platform to this wafer angle of rectifying, after the completion of proofreading, absorb the wafer after proofreading through getting the crystalline substance arm, shift it to solid brilliant station again on. However, the correction flow of such an angle correction mechanism is cumbersome, and such a configuration leads to an increase in production cost and a low correction efficiency.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to solving at least one of the problems of the prior art. Therefore, the utility model provides a die bonding head angle correction mechanism and die bonding equipment, which can save materials and assembly cost and further improve the die bonding head angle correction efficiency.

According to the solid crystal head angle correction mechanism of the embodiment of the utility model, the solid crystal head angle correction mechanism comprises:

the adsorption mechanism is provided with a rotating shaft, and one end of the rotating shaft is used for adsorbing the wafer;

the first driving module is connected with the adsorption mechanism and used for driving the rotating shaft to rotate to a preset angle so as to correct the angle of the wafer;

and the control mechanism is electrically connected with the adsorption mechanism and the first driving module respectively.

The die bonding head angle correction mechanism provided by the embodiment of the utility model at least has the following beneficial effects: after one end of the rotating shaft of the adsorption mechanism adsorbs the wafer, the rotation of the rotating shaft of the adsorption mechanism is controlled through the mutual matching of the control mechanism and the first driving module, and the angle of the wafer is corrected. The solid crystal head angle correcting mechanism can save materials and assembly cost and further improve the efficiency of solid crystal head angle correction.

According to some embodiments of the present invention, the adsorption mechanism includes a bearing mounting seat, at least one first bearing, a bearing fixing plate and a nut, the at least one first bearing is disposed in the bearing mounting seat, the rotating shaft is disposed through the bearing mounting seat, and the at least one first bearing, the bearing fixing plate and the nut are sequentially sleeved on the rotating shaft.

According to some embodiments of the utility model, the die bonder head angle correction mechanism further comprises a vertical driving device and a mounting seat, the first driving module is arranged on the mounting seat, the adsorption mechanism and the vertical driving device are respectively connected with the mounting seat, and the vertical driving device is used for driving the adsorption mechanism and the first driving module to move up and down.

According to some embodiments of the utility model, the adsorption mechanism further comprises: first response subassembly, first response subassembly includes origin sensor, first response piece and first fixing base, origin sensor with the mount pad is connected, first response piece with first fixing base overlaps in proper order and locates on the other end of rotation axis, first response piece can with origin sensor corresponds the setting, so that origin sensor acquires the origin position of rotation axis, origin sensor with control mechanism electric connection.

According to some embodiments of the utility model, the vertical driving device comprises a slider-crank mechanism and a second driving module, one end of the slider-crank mechanism is connected with the mounting seat, the other end of the slider-crank mechanism is connected with the second driving module, and the second driving module is used for driving the slider-crank mechanism to move up and down so as to drive the mounting seat to move up and down.

According to some embodiments of the present invention, the die attach head angle correction mechanism further comprises a second sensing assembly, wherein the mount comprises a cross rail, a first rail mount, a second rail mount, and a base; the cross guide rail is positioned between the first guide rail mounting seat and the second guide rail mounting seat and is respectively and fixedly connected with the first guide rail mounting seat and the second guide rail mounting seat, the second guide rail mounting seat and the first driving module are both arranged on the base, the second guide rail mounting seat is connected with one end of the slider-crank mechanism, and the adsorption mechanism is connected with the first guide rail mounting seat; the second induction assembly is electrically connected with the control mechanism, the second driving module is used for driving the slider-crank mechanism to move downwards to a preset position, one end of the rotating shaft is used for adsorbing a wafer and enabling the first guide rail mounting seat to move relative to the second guide rail mounting seat, and the second induction assembly can detect the preset movement position of the first guide rail mounting seat so as to enable the control mechanism to control the second driving module to drive the slider-crank mechanism to move upwards.

According to some embodiments of the present invention, the second sensing assembly includes a first sensor, a second sensing piece, at least one buffer member, and a fixing plate, the fixing plate is disposed on the second guide rail mounting seat, and one side of the fixing plate is fixedly connected to the slider-crank mechanism, and the other side of the fixing plate is fixedly connected to the second sensing piece, the first sensor is connected to the first guide rail mounting seat, the first guide rail mounting seat is provided with a first groove corresponding to the buffer member, one end of the buffer member is disposed in the first groove, and the other end of the buffer member abuts against the fixing plate; when the first guide rail mounting seat moves relative to the second guide rail mounting seat, the buffer piece is compressed to enable the first sensor to be arranged corresponding to the second sensing piece.

According to some embodiments of the present invention, the die bonding head angle correction mechanism further includes a transmission device, one end of the transmission device is connected to the first driving module, and the other end of the transmission device is connected to the rotating shaft, and the transmission device is configured to drive the rotating shaft to rotate.

According to some embodiments of the present invention, the die bonder head angle calibration mechanism includes a driving module fixing seat, the driving module fixing seat is disposed on the base, the first driving module is disposed on the driving module fixing seat, a driving shaft of the first driving module penetrates through the driving module fixing seat and the base, and the driving shaft is in driving connection with one end of the conveying device.

The die bonding equipment according to the embodiment of the second aspect of the present invention comprises the die bonding head angle correction mechanism according to the embodiment of the first aspect of the present invention, and further comprises a transverse driving device, wherein the transverse driving device is used for driving the die bonding head angle correction mechanism to transversely move.

The die bonding equipment provided by the embodiment of the utility model at least has the following beneficial effects: by adopting the solid crystal head angle correction mechanism, after a wafer is adsorbed at one end of the rotating shaft of the adsorption mechanism, the solid crystal head angle correction mechanism is moved through the transverse driving device, the rotation of the rotating shaft of the adsorption mechanism can be controlled through the mutual matching of the control mechanism and the first driving module while moving, so that the angle of the wafer is corrected, and after the correction is completed, the wafer is transferred to a solid crystal station. The die bonding equipment can save material and assembly cost and further improve the die bonding head angle correction efficiency.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model.

Fig. 1 is a side view of a die attach head angle calibration mechanism according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a die attach head angle calibration mechanism according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of a rotating shaft and a device mounted thereon according to an embodiment of the present invention;

fig. 4 is a detailed schematic view of a cross rail and its mounting base of an embodiment of the present invention.

Reference numerals:

a die bonder head angle correction mechanism 10, a second driving module 100, and a support plate 110;

a third sensing piece 120, a third sensing piece fixing seat 121 and a second sensor 122;

a linear guide 130, a slider 131, an eccentric block 132, a first arm 133, and a second arm 134;

cross rail 140, first rail mount 141, second rail mount 142;

a first sensor 150, a second sensing piece 151, a fixing plate 152 and a buffer member 153;

a base 160;

a first driving module 200;

a first sensing piece 210, a first fixing base 211, and an origin sensor 212;

a bearing mount 220, a first bearing 221, a bearing fixing piece 222, a nut 223;

a driving wheel 230, a driven wheel 231 and a synchronous belt 232;

a rotary shaft 240 and an adsorbing member 241;

the driving module fixing base 250.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

In the description of the present invention, "a plurality" means two or more unless otherwise specified. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the term "connected" is to be interpreted broadly, and may be, for example, a fixed connection or a movable connection, a detachable connection or a non-detachable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or may be connected through one or more other elements or indirectly connected through one or more other elements or in an interactive relationship between two elements.

In the description of the present invention, unless otherwise specifically limited, terms such as set forth, mounted, connected and the like should be construed broadly, and specific meanings of the above terms in the utility model may be understood in specific instances by those skilled in the art.

Therefore, the utility model provides a die bonding head angle correction mechanism 10 and a die bonding device, which can save materials and assembly cost and further improve the die bonding head angle correction efficiency.

A die attach head angle correction mechanism 10 according to an embodiment of the present invention is described below with reference to fig. 1 to 3.

Referring to fig. 1, the die bonding head angle correction mechanism 10 includes: the wafer adsorption device comprises an adsorption mechanism, a first driving module 200 and a control mechanism, wherein the adsorption mechanism is provided with a rotating shaft 240, and one end of the rotating shaft 240 is used for adsorbing a wafer; the first driving module 200 is connected to the adsorption mechanism, and the first driving module 200 is configured to drive the rotation shaft 240 to rotate to a preset angle, so as to perform angle correction on the wafer; the control mechanism is electrically connected to the adsorption mechanism and the first driving module 200, respectively. After the wafer is adsorbed by one end of the rotating shaft of the adsorption mechanism, the rotation of the rotating shaft of the adsorption mechanism is controlled through the mutual matching of the control mechanism and the first driving module 200, so that the angle of the wafer is corrected, and the solid crystal head angle correction mechanism 10 can save materials and assembly cost and further improve the efficiency of solid crystal head angle correction.

In the embodiment of the present invention, an adsorption member 241 is disposed at one end of the rotation shaft 240 for adsorbing the wafer, a rotation air pipe joint for introducing vacuum gas to provide vacuum suction force for the adsorption member 241 is disposed above the rotation shaft 240, and the rotation air pipe joint is electrically connected to the control mechanism; in some embodiments, a magnetic structure is disposed at one end of the rotating shaft 240 for attracting the wafer, for attracting the wafer; in other embodiments, the end of the rotation shaft 240 for sucking the wafer is provided with a suction cup for sucking the wafer; this is not limited to the present embodiment.

The preset angle is an angle at which the sucked wafer can be corrected.

It should be noted that the first driving module 200 may be a pneumatic motor or an electric motor, or may be another driving module, and the embodiment of the present invention is not limited herein.

Referring to fig. 1 and 3, it can be understood that the adsorption mechanism includes a bearing mount 220, at least one first bearing 221, a bearing fixing plate 222, and a nut 223, the at least one first bearing 221 is disposed in the bearing mount 220, the rotating shaft 240 is disposed through the bearing mount 220, and the at least one first bearing 221, the bearing fixing plate 222, and the nut 223 are sequentially sleeved on the rotating shaft 240. The bearing mount 220 is used for mounting a bearing, i.e., a first bearing 221, a bearing fixing plate 222 and a nut 223 for fixing the bearing, and the bearing is provided to allow the control mechanism and the first driving module 200 to be engaged with each other, thereby rotating the rotation shaft 240 and further correcting the wafer angle.

In this embodiment, there are two first bearings 221, and the two first bearings 221 are both disposed in the bearing mount 220 and sequentially sleeved on the rotating shaft 240; in some embodiments, the number of the first bearings 221 may be one or other, and is not limited to the present embodiment.

The bearing fixing piece 222 and the nut 223 are both fitted on the rotary shaft 240, the bearing fixing piece 222 is provided on the bearing mount 220, and the nut 223 is provided on the bearing fixing piece 222.

It can be understood that the die bonder head angle correction mechanism 10 further includes a vertical driving device and a mounting seat, the first driving module 200 is disposed on the mounting seat, the adsorption mechanism and the vertical driving device are respectively connected with the mounting seat, and the vertical driving device is used for driving the adsorption mechanism and the first driving module 200 to move up and down. The adsorption mechanism is driven to move downwards by the vertical driving device, one end of the rotating shaft 240 adsorbs the wafer, after the wafer is adsorbed, the adsorption mechanism is driven to move upwards by the vertical driving device, and the rotating shaft 240 is driven to rotate by the first driving module 200, so that the angle of the wafer is corrected.

Referring to fig. 2, it can be understood that the adsorption mechanism further includes: first response subassembly, first response subassembly include origin sensor 212, first response piece 210 and first fixing base 211, origin sensor 212 is connected with the mount pad, first response piece 210 overlaps in proper order with first fixing base 211 and locates on the other end of rotation axis 240, first response piece 210 can correspond the setting with origin sensor 212 to make origin sensor 212 acquire the origin position of rotation axis 240, origin sensor 212 and control mechanism electric connection. The rotation axis 240 can be returned to the origin position each time before or after the wafer is corrected by the first sensing piece 210 and the origin sensor 212.

In this embodiment, the first sensing piece 210 is semicircular, the first sensing piece 210 and the first fixing seat 211 are both provided with through holes corresponding to the rotating shaft 240, so that the first fixing seat 211 and the first sensing piece 210 are sequentially sleeved on the driving shaft of the second driving module 100, the first fixing seat 211 and the first sensing piece 210 are both sleeved on the rotating shaft 240, the first fixing seat 211 is arranged on the nut 223, and the first sensing piece 210 is arranged on the first fixing seat 211; it should be noted that the first sensing piece 210 may also have other shapes, and is not limited to the embodiment.

In some embodiments, after the wafer is adsorbed by one end of the rotation shaft 240, the rotation shaft 240 is driven to rotate by the first driving module 200, so that the first sensing piece 210 can be disposed corresponding to the origin sensor 212, and at this time, the origin sensor 212 senses the first sensing piece 210, so as to obtain the origin position of the rotation shaft 240. It can be understood that, when the origin sensor 212 senses the first sensing piece 210, the current position corresponding to the rotation shaft 240 is the origin position, so that after the wafer is adsorbed by one end of the rotation shaft 240, the rotation shaft can further rotate to the origin position, and then the angle correction of the wafer is realized.

In other embodiments, the first driving module 200 drives the rotating shaft 240 to rotate, so that the first sensing piece 210 can be disposed corresponding to the origin sensor 212, and at this time, the origin sensor 212 senses the first sensing piece 210, so as to acquire the origin position of the rotating shaft 240. When the rotation axis 240 is at the origin position, one end of the rotation axis 240 is controlled again to suck the wafer. So set up, be convenient for solid crystal head angle correction mechanism 10 is adsorbing the wafer in-process, through the initial point position that predetermines, comes the rotation of accurate control rotation axis 240 to guarantee the accuracy of wafer angle correction.

It can be understood that the vertical driving device includes a slider-crank mechanism and a second driving module 100, one end of the slider-crank mechanism is connected to the mounting base, the other end of the slider-crank mechanism is connected to the second driving module 100, and the second driving module 100 is used for driving the slider-crank mechanism to move up and down so as to drive the mounting base to move up and down. Because adsorption apparatus constructs, first drive module 200 all is connected with the mount pad, consequently reciprocates through second drive module 100 drive slider-crank mechanism, can drive mount pad, first drive module 200 and adsorption apparatus and wholly reciprocate to the one end that drives rotation axis 240 among the adsorption apparatus reciprocates, in order to realize the absorption or the placing to the wafer.

Referring to fig. 1 and 2, in the present embodiment, the crank-slider mechanism includes a support plate 110, an eccentric block 132, a slider 131, a first arm 133, a second arm 134, a second bearing, a third bearing, and a linear guide 130, a circular hole corresponding to a driving shaft of the second driving module 100 is formed on the support plate 110, the second driving module 100 is fixedly connected to the support plate 110, and the driving shaft of the second driving module 100 is inserted into the circular hole; a driving shaft of the second driving module 100 is fixedly arranged on the eccentric block 132 in a penetrating manner, a sliding block 131 is fixedly arranged on one side of the second arm 134, a linear guide 130 is fixedly arranged on one side of the supporting plate 110 facing the second arm 134, and the sliding block 131 is slidably arranged on the linear guide 130; one end of the first arm 133 is movably connected to one end of the second arm 134 through a second bearing, the other end of the first arm 133 is movably connected to the eccentric block 132 through a third bearing, and the second arm 134 is further fixedly connected to the mounting base.

Referring to fig. 1 and 2, in the present embodiment, the apparatus further includes a third sensing element, and the third sensing element is electrically connected to the control mechanism.

The third sensing assembly comprises a third sensing piece 120, a third sensing piece fixing seat 121 and a second sensor 122, the third sensing piece fixing seat 121 is fixedly sleeved on the driving shaft of the second driving module 100, and the third sensing piece 120 is connected with the third sensing piece fixing seat 121; the second sensor 122 is fixedly connected to the supporting plate 110, and the second sensor 122 can be disposed corresponding to the third sensing piece 120, so that the second sensor 122 can obtain a moving position of the slider-crank mechanism, and the second sensor 122 is electrically connected to the control mechanism. The third sensing piece 120 is semicircular, and the third sensing piece 120 and the third sensing piece fixing seat 121 are both provided with through holes corresponding to the driving shaft of the second driving module 100, so that the third sensing piece fixing seat 121 and the third sensing piece 120 are sequentially sleeved on the driving shaft of the second driving module 100.

In some embodiments, the crank-slider mechanism comprises a crank and a rocker, and the crank may be active or the rocker may be active when the second driving module 100 drives the crank-slider mechanism to move up and down.

It should be noted that the second driving module 100 may be a pneumatic motor or an electric motor, or may be other driving devices, and the embodiment of the utility model is not limited herein.

Referring to fig. 1 and 4, it can be understood that the die attach head angle calibration mechanism 10 further includes a second sensing assembly, and the mounting base includes a cross rail 140, a first rail mounting base 141, a second rail mounting base 142, and a base 160; the cross guide rail 140 is located between the first guide rail mounting seat 141 and the second guide rail mounting seat 142 and is fixedly connected with the first guide rail mounting seat 141 and the second guide rail mounting seat 142 respectively, the second guide rail mounting seat 142 and the first driving module 200 are both arranged on the base 160, the second guide rail mounting seat 142 is connected with one end of the slider-crank mechanism, and the adsorption mechanism is connected with the first guide rail mounting seat 141; the second sensing assembly is electrically connected to the control mechanism, when the second driving module 100 is used for driving the slider-crank mechanism to move downward to a preset position, one end of the rotating shaft 240 is used for adsorbing a wafer and enabling the first guide rail mounting base 141 to move relative to the second guide rail mounting base 142, and the second sensing assembly can detect the preset movement position of the first guide rail mounting base 141 so that the control mechanism controls the second driving module 100 to drive the slider-crank mechanism to move upward. The cross guide 140, the first guide mount 141 and the second guide mount 142 are configured to protect the wafer when the wafer is attracted to one end of the rotation shaft 240 by the interaction with the second sensing element.

It should be noted that, the second driving module 100 can drive the slider-crank mechanism to move up and down under the control of the control mechanism, and the second sensing assembly can detect the preset movement position of the first rail mounting seat 141, so that the control mechanism controls the second driving module 100 to drive the slider-crank mechanism to move up.

In this embodiment, the bearing mounting seat 220 is fixedly connected to the first guide rail mounting seat 141, when one end of the rotating shaft 240 is used for adsorbing the wafer, since the second driving module 100 drives the slider-crank mechanism to move downward to the preset position, the preset position may be a lowest point position corresponding to the downward movement, and by adsorbing the wafer, a downward pressure is generated on the wafer, so that the whole adsorption mechanism generates an upward thrust relative to the wafer. Because the cross guide rail 140 is arranged between the first guide rail mounting seat 141 and the second guide rail mounting seat 142, and the bearing mounting seat 220 in the adsorption mechanism is fixedly connected with the first guide rail mounting seat 141, the generated thrust pushes the adsorption mechanism to move upwards, and the first guide rail mounting seat 141 also gradually moves upwards relative to the second guide rail mounting seat 142, so that the second sensing assembly can detect the preset moving position of the first guide rail mounting seat 141, i.e. the preset lifting position of the embodiment. When the first guide rail mounting seat 141 reaches the preset movement position, the second sensing assembly sends a detection signal to the control mechanism, and after the control mechanism receives the detection signal, the control mechanism controls the second driving module 100 to drive the slider-crank mechanism to move upwards, so that the adsorption of the wafer is completed, and the wafer is protected.

It should be noted that the preset position is the lowest position that the crank-slider mechanism can reach when moving vertically; the preset movement position is a movement position that enables the second sensing assembly to detect when the first rail mounting base 141 moves relative to the second rail mounting base 142.

Referring to fig. 1 and 2, it can be understood that the second sensing assembly includes a first sensor 150, a second sensing piece 151, at least one buffer member 153 and a fixing plate 152, the fixing plate 152 is disposed on the second guide rail mounting seat 142, one side of the fixing plate 152 is fixedly connected to the slider-crank mechanism, the other side of the fixing plate 152 is fixedly connected to the second sensing piece 151, the first sensor 150 is connected to the first guide rail mounting seat 141, a first groove corresponding to the buffer member 153 is disposed on the first guide rail mounting seat 141, one end of the buffer member 153 is disposed in the first groove, and the other end of the buffer member 153 abuts against the fixing plate 152; when the first rail mounting base 141 moves relative to the second rail mounting base 142, the first sensor 150 can be disposed to correspond to the second sensing piece 151 by compressing the buffer member 153.

When the first rail mounting base 141 of this embodiment moves relative to the second rail mounting base 142, the buffer member 153 is subjected to a compressive force, and when the first rail mounting base 141 moves to a predetermined movement position, the first sensor 150 on the first rail mounting base 141 can sense the second sensing piece 151, so that the control mechanism controls the second driving module 100 to drive the slider-crank mechanism to move upward. By providing the buffer member 153, when the wafer is sucked to the end of the rotation shaft 240, a buffer force is applied to the suction of the wafer, thereby protecting the wafer from being crushed and preventing the first rail mounting base 141 from hitting the fixing plate 152. It is understood that the present embodiment may be configured in such a manner that one end of the rotation shaft 240 adsorbs the wafer by vacuum adsorption.

It should be noted that, in the present embodiment, the second sensing piece 151 is rectangular, and the second sensing piece 151 may also be in other shapes, but is not limited to the present embodiment.

It should be noted that the buffer 153 may be a spring, a buffer glue, or other buffer objects with a buffer function; the fixing plate 152 serves to fix and limit the buffer 153.

It should be noted that, when there are a plurality of buffering members 153, the first guide rail mounting seat 141 is respectively provided with first grooves corresponding to the plurality of buffering members 153 one to one, one end of each of the plurality of buffering members 153 is disposed in the corresponding first groove, and the other end of each of the plurality of buffering members 153 abuts against the fixing plate 152; in this embodiment, the buffer member 153 is a spring and has two springs, two first grooves corresponding to the two springs are respectively disposed on the first rail mounting base 141, one ends of the two springs are disposed in the first grooves, and the other ends of the two springs are abutted to the fixing plate 152.

It can be understood that the die bonder head angle calibration mechanism 10 further includes a transmission device, one end of the transmission device is connected to the first driving module 200, and the other end of the transmission device is connected to the rotating shaft 240, and the transmission device is configured to drive the rotating shaft 240 to rotate. The first driving module 200 drives the rotation shaft 240 to rotate through the transmission device, so as to correct the angle of the wafer.

Referring to fig. 1, in the present embodiment, the transmission device includes a driving wheel 230, a driven wheel 231 and a timing belt 232, the driving wheel 230 is sleeved on the driving shaft of the first driving module 200 and is located at the lower end of the base 160, the driven wheel 231 is sleeved on one end of the rotating shaft 240, and the timing belt 232 is sleeved on the driving wheel 230 and the driven wheel 231. The first driving module 200, such as a motor, drives the driving pulley 230 to rotate, and the driving pulley 230 drives the driven pulley 231 to rotate through the timing belt 232, so as to drive the rotating shaft 240 to rotate, thereby correcting the angle of the wafer.

It should be noted that the first driving module 200 may also directly drive the rotating shaft 240 to rotate, or drive the rotating shaft 240 to rotate through gear engagement in a gear driving manner, or drive the rotating shaft 240 to rotate through other first driving modules 200, which is not limited to this embodiment and is not described herein again.

Referring to fig. 1, it can be understood that the die bonder head angle calibration mechanism 10 includes a driving module fixing base 250, the driving module fixing base 250 is disposed on the base 160, the first driving module 200 is disposed on the driving module fixing base 250, a driving shaft of the first driving module 200 penetrates through the driving module fixing base 250 and the base 160, and the driving shaft is in driving connection with one end of the conveying device. The driving module fixing base 250 is used to mount and fix the first driving module 200.

It should be noted that through holes corresponding to the driving shaft of the first driving module 200 are disposed on the base 160 and the driving module fixing base 250, so that the driving shaft of the first driving module 200 is inserted into the driving module fixing base 250 and the base 160.

Another embodiment of the present invention further provides a die bonding apparatus, which includes the die bonding head angle correction mechanism 10 as in any of the above embodiments, and further includes a lateral driving device, where the lateral driving device is configured to drive the die bonding head angle correction mechanism 10 to move laterally.

By adopting the die bonder head angle correction mechanism 10, after a wafer is adsorbed at one end of the rotating shaft 240 of the adsorption mechanism, the die bonder head angle correction mechanism 10 is moved through the transverse driving device, and the rotating shaft 240 of the adsorption mechanism is controlled to rotate through mutual matching of the control mechanism and the first driving module 200 while moving, so that the angle of the wafer is corrected, and after the correction is completed, the wafer is transferred to a die bonder station. The die bonder head angle correction mechanism 10 can be driven to transversely reciprocate through a transverse driving device, and then the functions of adsorption, angle correction and placement of the wafer are achieved.

The die bonding equipment can save material and assembly cost and further improve the die bonding head angle correction efficiency.

In another embodiment, a visual detection mechanism may also be provided. For example, the visual detection mechanism is a camera. The vision detection mechanism is electrically connected with a master control device in the die bonding equipment, after a wafer is adsorbed by one end of a rotating shaft 240 of the adsorption mechanism, the original point position of the rotating shaft 240 is obtained by an original point sensor 212 in a first induction assembly, namely, the rotating shaft 240 is controlled to return to the original point position, and then a transverse driving device drives the die bonding head angle correction mechanism 10 to transversely move, so that one end of the rotating shaft 240 is positioned above the vision detection mechanism. The vision detection mechanism is used for acquiring image information corresponding to the wafer adsorbed on one end of the rotating shaft 240 and sending the image information to the master control device, the master control device receives the image information and then performs data processing on the image information to obtain angle information corresponding to the current wafer adsorbed by the rotating shaft 240, and then a preset angle corresponding to the wafer is acquired according to the target angle and the angle information, namely the preset angle is an angle to be corrected corresponding to the wafer. The master control device sends a preset angle to the control mechanism, and the control mechanism controls the first driving module 200 to drive the rotating shaft 240 to rotate to the preset angle, so as to correct the angle of the wafer.

It will be appreciated that the transverse drive means is electrically connected to the overall control means.

In an embodiment, the control mechanism in the die bonding head angle calibration mechanism 10 may also be an overall control device of the die bonding apparatus, and is not limited herein.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the utility model.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the utility model, the scope of which is defined by the claims and their equivalents.

Claims

1. A solid crystal head angle correction mechanism is characterized by comprising:

2. The die attach head angle correction mechanism of claim 1, wherein the adsorption mechanism comprises a bearing mount, at least one first bearing, a bearing fixing plate and a nut, the at least one first bearing is disposed in the bearing mount, the rotating shaft penetrates through the bearing mount, and the at least one first bearing, the bearing fixing plate and the nut are sequentially sleeved on the rotating shaft.

3. The die bonder head angle correction mechanism of claim 1, wherein the die bonder head angle correction mechanism further comprises a vertical driving device and a mounting base, the first driving module is disposed on the mounting base, the adsorption mechanism and the vertical driving device are respectively connected with the mounting base, the vertical driving device is electrically connected with the control mechanism, and the vertical driving device is used for driving the adsorption mechanism and the first driving module to move up and down.

4. The die attach head angle correction mechanism of claim 3, wherein the suction mechanism further comprises: first response subassembly, first response subassembly includes origin sensor, first response piece and first fixing base, origin sensor with the mount pad is connected, first response piece with first fixing base overlaps in proper order and locates on the other end of rotation axis, first response piece can with origin sensor corresponds the setting, so that origin sensor acquires the origin position of rotation axis, origin sensor with control mechanism electric connection.

5. The die attach head angle correction mechanism of claim 3, wherein the vertical driving device comprises a slider-crank mechanism and a second driving module, one end of the slider-crank mechanism is connected to the mounting base, the other end of the slider-crank mechanism is connected to the second driving module, and the second driving module is used for driving the slider-crank mechanism to move up and down so as to drive the mounting base to move up and down.

6. The die attach head angle correction mechanism of claim 5, further comprising a second sensing assembly, wherein the mount comprises a cross rail, a first rail mount, a second rail mount, and a base; the cross guide rail is positioned between the first guide rail mounting seat and the second guide rail mounting seat and is respectively and fixedly connected with the first guide rail mounting seat and the second guide rail mounting seat, the second guide rail mounting seat and the first driving module are both arranged on the base, the second guide rail mounting seat is connected with one end of the slider-crank mechanism, and the adsorption mechanism is connected with the first guide rail mounting seat; the second induction assembly is electrically connected with the control mechanism, the second driving module is used for driving the slider-crank mechanism to move downwards to a preset position, one end of the rotating shaft is used for adsorbing a wafer and enabling the first guide rail mounting seat to move relative to the second guide rail mounting seat, and the second induction assembly can detect the preset movement position of the first guide rail mounting seat so as to enable the control mechanism to control the second driving module to drive the slider-crank mechanism to move upwards.

7. The die attach head angle correction mechanism of claim 6, wherein the second sensing assembly comprises a first sensor, a second sensing plate, at least one buffer member and a fixing plate, the fixing plate is disposed on the second guide rail mounting seat, one side of the fixing plate is fixedly connected to the slider-crank mechanism, the other side of the fixing plate is fixedly connected to the second sensing plate, the first sensor is connected to the first guide rail mounting seat, a first groove corresponding to the buffer member is disposed on the first guide rail mounting seat, one end of the buffer member is disposed in the first groove, and the other end of the buffer member abuts against the fixing plate; when the first guide rail mounting seat moves relative to the second guide rail mounting seat, the buffer piece is compressed to enable the first sensor to be arranged corresponding to the second sensing piece.

8. The die attach head angle correction mechanism of claim 6, further comprising a transmission device, wherein one end of the transmission device is connected to the first driving module, and the other end of the transmission device is connected to the rotating shaft, and the transmission device is configured to drive the rotating shaft to rotate.

9. The die attach head angle correction mechanism of claim 8, wherein the die attach head angle correction mechanism comprises a driving module fixing seat, the driving module fixing seat is disposed on the base, the first driving module is disposed on the driving module fixing seat, a driving shaft of the first driving module penetrates through the driving module fixing seat and the base, and the driving shaft is drivingly connected to one end of the transport device.

10. A die bonding apparatus, comprising:

a lateral drive device;

the solid crystal head angle correcting mechanism according to any one of claims 1 to 9, wherein the lateral driving device is configured to drive the solid crystal head angle correcting mechanism to move laterally.