CN111771163B - 负型感光性着色组合物、固化膜、使用了它们的触摸面板 - Google Patents

负型感光性着色组合物、固化膜、使用了它们的触摸面板 Download PDF

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CN111771163B
CN111771163B CN201980015528.7A CN201980015528A CN111771163B CN 111771163 B CN111771163 B CN 111771163B CN 201980015528 A CN201980015528 A CN 201980015528A CN 111771163 B CN111771163 B CN 111771163B
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substrate
barrier ribs
negative photosensitive
coloring composition
photosensitive coloring
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CN111771163A (zh
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小林秀行
诹访充史
饭冢英祐
东后行伦
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Toray Industries Inc
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Toray Industries Inc
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Liquid Crystal (AREA)
  • Polymerisation Methods In General (AREA)
  • Optical Filters (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN201980015528.7A 2018-03-14 2019-03-08 负型感光性着色组合物、固化膜、使用了它们的触摸面板 Active CN111771163B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2018-046394 2018-03-14
JP2018046394 2018-03-14
JP2018113520 2018-06-14
JP2018-113520 2018-06-14
JP2018-128004 2018-07-05
JP2018128004 2018-07-05
PCT/JP2019/009397 WO2019176785A1 (ja) 2018-03-14 2019-03-08 ネガ型感光性着色組成物、硬化膜、それを用いたタッチパネル

Publications (2)

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CN111771163A CN111771163A (zh) 2020-10-13
CN111771163B true CN111771163B (zh) 2023-06-02

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Country Status (5)

Country Link
JP (1) JP7306264B2 (ko)
KR (1) KR102617582B1 (ko)
CN (1) CN111771163B (ko)
TW (1) TWI808137B (ko)
WO (1) WO2019176785A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230056225A1 (en) * 2019-11-28 2023-02-23 Tokyo Ohka Kogyo Co., Ltd. Photosensitive composition, cured product, and method for producing cured product
CN113025306B (zh) * 2019-12-09 2023-07-21 上海航空电器有限公司 自带复合抛物面集光能力的荧光体及其制备方法
KR20230015425A (ko) * 2020-05-22 2023-01-31 샌트랄 글래스 컴퍼니 리미티드 발광 소자의 제조 방법
KR102541836B1 (ko) * 2020-09-02 2023-06-09 삼성전자주식회사 디스플레이 장치
KR20220122372A (ko) * 2021-02-26 2022-09-02 동우 화인켐 주식회사 격벽 형성용 감광성 수지 조성물, 이를 이용하여 제조된 격벽 구조물 및 상기 격벽 구조물을 포함하는 표시 장치
CN117957494A (zh) * 2021-09-24 2024-04-30 东丽株式会社 树脂组合物、遮光膜及带有间隔壁的基板
KR20230072570A (ko) * 2021-11-17 2023-05-25 삼성디스플레이 주식회사 감광성 수지 조성물, 이를 이용하여 제조된 표시 패널 및 이의 제조 방법

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JP4671338B2 (ja) * 2005-06-27 2011-04-13 日本化薬株式会社 フッ素含有ポリシロキサン、それを用いる感光性樹脂組成物及びその硬化物
US20090105360A1 (en) * 2005-10-28 2009-04-23 Toray Industries, Inc. Siloxane resin composition and production method thereof
JP5617476B2 (ja) * 2010-09-22 2014-11-05 Jsr株式会社 シロキサンポリマー組成物、硬化膜及び硬化膜の形成方法
WO2012057058A1 (ja) * 2010-10-29 2012-05-03 住友化学株式会社 感光性樹脂組成物、パターン構造物、表示装置および隔壁
JP5910629B2 (ja) * 2011-04-28 2016-04-27 旭硝子株式会社 ネガ型感光性樹脂組成物、硬化膜、隔壁およびブラックマトリックスとその製造方法、カラーフィルタならびに有機ｅｌ素子
JP2012242928A (ja) 2011-05-17 2012-12-10 Toppan Printing Co Ltd 加飾透明保護基板一体型タッチパネル
JP2013050549A (ja) * 2011-08-30 2013-03-14 Asahi Glass Co Ltd ネガ型感光性樹脂組成物、隔壁、光学素子
JP6065497B2 (ja) * 2011-09-29 2017-01-25 Jsr株式会社 パターン形成方法及びポリシロキサン組成物
CN104969126B (zh) * 2013-02-14 2019-10-01 东丽株式会社 负型感光性着色组合物、固化膜、触摸面板用遮光图案和触摸面板的制造方法
WO2015012228A1 (ja) * 2013-07-25 2015-01-29 東レ株式会社 タッチパネル用ネガ型感光性白色組成物、タッチパネル及びタッチパネルの製造方法
TWI577739B (zh) * 2015-05-25 2017-04-11 奇美實業股份有限公司 白色感光性樹脂組成物及其應用
JP6418248B2 (ja) * 2015-09-30 2018-11-07 東レ株式会社 ネガ型感光性樹脂組成物、硬化膜、硬化膜を具備する素子及び表示装置、並びにその製造方法
JP6688875B2 (ja) * 2016-03-14 2020-04-28 富士フイルム株式会社 組成物、膜、硬化膜、光学センサおよび膜の製造方法
JP6701324B2 (ja) * 2016-04-06 2020-05-27 富士フイルム株式会社 組成物、膜、硬化膜、光学センサおよび膜の製造方法

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Publication number Publication date
TW201939164A (zh) 2019-10-01
WO2019176785A1 (ja) 2019-09-19
CN111771163A (zh) 2020-10-13
JP7306264B2 (ja) 2023-07-11
JPWO2019176785A1 (ja) 2021-01-14
KR102617582B1 (ko) 2023-12-27
KR20200132843A (ko) 2020-11-25
TWI808137B (zh) 2023-07-11

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