CN111755366B - Substrate processing apparatus - Google Patents
Substrate processing apparatus Download PDFInfo
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- CN111755366B CN111755366B CN202010081318.2A CN202010081318A CN111755366B CN 111755366 B CN111755366 B CN 111755366B CN 202010081318 A CN202010081318 A CN 202010081318A CN 111755366 B CN111755366 B CN 111755366B
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- 239000000758 substrate Substances 0.000 title claims abstract description 196
- 238000012545 processing Methods 0.000 title claims abstract description 87
- 238000001514 detection method Methods 0.000 claims abstract description 75
- 239000007788 liquid Substances 0.000 claims abstract description 64
- 239000012530 fluid Substances 0.000 claims abstract description 54
- 238000000034 method Methods 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 14
- 238000011084 recovery Methods 0.000 claims 4
- 238000007599 discharging Methods 0.000 claims 2
- 238000012546 transfer Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
Abstract
The invention provides a substrate processing device capable of improving the detection precision of a substrate without damaging the substrate. A substrate processing apparatus (10) according to an embodiment comprises: a conveying section (30) for conveying the substrate (W) along a conveying path (A1); a processing unit (40) for processing the substrate (W) conveyed by the conveying unit (30) by using a processing liquid; a substrate detection unit (50) having a nozzle (53 a) for ejecting a fluid from the lower surface side of the substrate (W) being transported, and a sensor unit (52) for detecting that the processing liquid from the nozzle (53 a) has reached the swing unit (51); and a control unit (60) for detecting the substrate (W) on the basis of the detection signal outputted from the substrate detection unit (50).
Description
Technical Field
Embodiments of the present invention relate to a substrate processing apparatus.
Background
In a process for manufacturing a liquid crystal display device, a semiconductor device, or the like, a substrate processing device is used that conveys a substrate such as glass for a liquid crystal panel or glass for a photomask, and ejects a processing liquid (for example, a chemical liquid) onto the moving substrate to process the substrate.
Such a substrate processing apparatus includes a substrate detection device that detects the presence or absence of a substrate conveyed along a conveyance path. The substrate detection device has a contact type and a non-contact type. The contact type substrate detection device includes, for example, a vibrator type sensor. This is a type in which the vibrator swings by the contact of the conveyed substrate with the vibrator, and the sensor senses the swing. The non-contact substrate detection device is, for example, a type in which a sensor detects the presence or absence of a substrate by projecting or receiving light.
However, in the contact type substrate detection apparatus, since a part of the substrate detection apparatus is in contact with the substrate, a crack or the like may occur in the tip portion of the substrate, and the substrate may be damaged. In addition, the noncontact substrate detection device may cause erroneous detection due to diffuse reflection of light caused by adhesion of a processing liquid used in the substrate processing device.
Disclosure of Invention
The invention aims to improve the detection accuracy of a substrate without damaging the substrate.
The substrate processing apparatus according to an embodiment of the present invention is characterized in that,
the device comprises:
a conveying section for conveying the substrate along a conveying path;
a processing unit configured to process the substrate conveyed by the conveying unit with a processing liquid; and
a substrate detection unit configured to detect the substrate conveyed by the conveyance unit,
the substrate detection unit includes an ejection unit that ejects a fluid from a lower surface side of the substrate conveyed by the conveyance unit, and a detection unit that detects arrival of the fluid from the ejection unit at a position facing the ejection unit through the conveyance path.
According to the embodiment of the invention, the detection accuracy of the substrate can be improved without damaging the substrate.
Drawings
Fig. 1 is a view showing a first embodiment of a substrate processing apparatus according to the present invention.
Fig. 2 is a diagram showing a configuration example and an operation example of a substrate detection section provided in the substrate processing apparatus shown in fig. 1.
Fig. 3 is a side view of the substrate detection section as viewed from the CR direction shown in fig. 2 (a).
Detailed Description
< embodiment 1 >
A first embodiment of the present invention will be described with reference to fig. 1 to 3.
(basic structure)
As shown in fig. 1, the substrate processing apparatus 10 according to the first embodiment includes a processing chamber 20, a conveying unit 30, a processing unit 40, a substrate detecting unit 50, and a control unit 60.
The processing chamber 20 is a processing bath for processing the substrate W, and is a frame in which a conveyance path A1 for moving the substrate W is formed. The processing chamber 20 is formed with a carry-in port 21 and a carry-out port 22. The transfer path A1 extends horizontally from the carry-in port 21 to the carry-out port 22, and is located at the substantially center in the vertical direction of the process chamber 20. As the substrate W to be processed, for example, a rectangular glass substrate is used.
The conveying section 30 includes a plurality of rollers 31 and a plurality of (11 in fig. 1) rotating shafts 32, and conveys the substrate W along the conveying path A1 in the conveying direction A2 by the rollers 31 and the rotating shafts 32. The rollers 31 are fixed to the rotation shafts 32 at predetermined intervals, and rotate together by the rotation of the rotation shafts 32. Each of the rotating shafts 32 is formed longer than a length (width direction length) of the substrate W in a direction orthogonal to the conveyance direction A2, and is rotatably provided so as to be aligned in parallel along the conveyance direction A2 of the substrate W. These rotation shafts 32 are configured to be rotated in synchronization with each other by a common driving mechanism (not shown), and form a conveyance path A1 of the substrate W together with the rollers 31. The transport section 30 supports the substrate W by the rollers 31, and transports the supported substrate W in a predetermined transport direction A2 by rotation of the rollers 31.
The processing unit 40 includes a plurality of showers 41, and processes (for example, development process) the substrate W by supplying a processing liquid (for example, a developing liquid) to the substrate W moving along the conveyance path A1 through the showers 41. A plurality of (7 in fig. 1) showers 41 are provided above and below the conveyance path A1 so as to sandwich the conveyance path A1. Of these showers 41, each shower 41a located above the conveyance path A1 ejects the processing liquid from above to the conveyance path A1. The showers 41b located below the conveyance path A1 discharge the processing liquid from below to the conveyance path A1. Each of the showers 41a, 41b has a plurality of nozzles (not shown) arranged in a direction orthogonal to the conveyance direction A2 of the substrate W in a horizontal plane, and ejects the processing liquid from each nozzle toward the substrate W moving in the conveyance path A1 at a high pressure to supply the processing liquid to the substrate W.
Each shower 41a is connected to the tank 43 via a liquid supply pipe 42a, and each shower 41b is connected to the tank 43 via a liquid supply pipe 42 b. These showers 41a and 41b are pumped from the tank 43 by a pump (not shown) to discharge the treatment liquid supplied through the liquid supply pipes 42a and 42 b. The processing liquid discharged from the respective shower heads 41a and 41b is collected in the tank 43 via a collection pipe 44 connected to the bottom of the processing chamber 20, and is stored. The treatment liquid recovered in the tank 43 is supplied again to the sprayers 41a and 41b via the liquid supply pipes 42a and 42b by pressure-feeding.
The substrate detection unit 50 detects the substrate W moving through the conveyance path A1. In the present embodiment, two substrate detection units 50a and 50b are provided in the processing chamber 20. The substrate detection unit 50a is provided near the carry-in port 21 of the process chamber 20. The substrate detection section 50b is located near the carry-out port 22 of the process chamber 20. Then, the end of the substrate W in the width direction orthogonal to the conveying direction, which is conveyed along the conveying path A1, is detected.
Here, the substrate detection units 50 (50 a, 50 b) will be described with reference to fig. 2 and 3. The substrate detection units 50a and 50b have the same structure.
Fig. 2 (a) shows a state in which the substrate detection unit 50 does not detect the substrate W, fig. 2 (b) shows a state in which the substrate detection unit 50 detects the substrate W, and fig. 3 is a side view as seen from the CR direction of fig. 2 (a).
The substrate detection section 50 includes a swing section 51, a sensor section 52, and a fluid ejection section (ejection section) 53. The swinging portion 51 and the sensor portion 52 function as a detection portion.
The swinging portion 51 includes a rotation shaft 1 (see fig. 3) rotatably supported by the frame 20a of the processing chamber 20 and the like, and a swinging plate 2 fixedly supported by the rotation shaft 1. The swing plate 2 is, for example, a metal plate, and includes a main body 2a supported by the rotation shaft 1 and a support plate 2b supported at one end of the main body 2a at an obtuse angle with respect to the main body 2 a. The support plate 2b is, for example, a resin plate, and is a member having liquid resistance to the treatment liquid described above. A weight 2c is mounted on the support plate 2b. In fig. 2, a clockwise rotation moment about the rotation shaft 1 is applied to the swing plate 2 itself by the weight 2c. And, 2d, 2 e. The swing plate 2 receives the clockwise rotation moment described above, but as shown in fig. 2 (b), when the swing plate 2 abuts against the stopper 2d, the rotation (swing) thereof is restricted. On the other hand, as shown in fig. 2 (a), when the liquid discharged from the fluid discharge portion 53 described later collides with the support plate 2b, the swing plate 2 receives a counterclockwise rotational moment about the rotation shaft 1, but when the stopper 2e abuts against the swing plate 2, the rotation (swing) thereof is restricted.
The sensor unit 52 detects the presence or absence of the swing plate 2. As shown in fig. 3, a detection plate 2g having a built-in magnet 2f is fixedly supported at the other end of the swing plate 2. The presence or absence of the swing of the detection plate 2g is detected by the magnetic sensor 52a fixed to the frame 20 a. That is, the magnetic sensor 52a outputs an OFF signal to the control unit 60 in the state of fig. 2 (a), and outputs an ON signal to the control unit 60 in the state of fig. 2 (b).
The fluid ejection portion 53 has a nozzle 53a. The nozzle 53a is disposed so as to face the support plate 2b of the swing plate 2 through the conveyance path A1. In the present embodiment, the nozzle 53a is disposed below the conveyance path A1 of the substrate W and opposite to the lower surface of one end portion in the width direction of the substrate W conveyed along the conveyance path A1. The support plate 2b described above is provided above the conveyance path A1 so as to face the nozzle 53a. As shown in fig. 2 (a) and (b), the fluid m is ejected from the nozzle 53a from below the conveyance path A1 toward the conveyance path A1, that is, upward in fig. 2. For example, the ejection of the fluid m from the nozzle 53a is continued not only during the processing of the substrate W by the substrate processing apparatus 10 but also during the processing standby. In the present embodiment, the nozzle 53a is connected to the liquid supply pipe 42b, and the fluid m discharged from the nozzle 53a is the same as a processing liquid (for example, a developing liquid) used for processing a substrate. The discharge diameter of the nozzle 53a is, for example, 1 to 5mm. When the fluid m ejected from the nozzle 53a collides with the support plate 2b of the swing plate 2, a counterclockwise rotational moment about the rotation shaft 1 is generated in the swing plate 2 as shown in fig. 2 (a). Then, the hydraulic pressure of the fluid m discharged from the nozzle 53a is set so that the counterclockwise rotational moment becomes equal to or greater than the clockwise rotational moment generated by the swing plate 2 itself having the weight 2c. The hydraulic pressure can be set based on the hydraulic pressure obtained by an experiment or the like. Further, as already described, the swing plate 2 receiving the counterclockwise rotational moment is restricted from rotating when the stopper 2e abuts against the swing plate 2.
As described above, fig. 2 (a) shows a state in which the substrate detection unit 50 does not detect the substrate W, and fig. 2 (b) shows a state in which the substrate detection unit 50 detects the substrate W. In fig. 2, the conveyance direction of the substrate is a direction perpendicular to the paper surface.
In fig. 2 (a), the fluid m ejected from the nozzle 53a reaches the support plate 2b without being blocked by the substrate W. Thereby, the swing plate 2 rotates counterclockwise about the rotation shaft 1, and the rotation is stopped after the swing plate 2 abuts against the stopper 2e, and this state is maintained. At this time, the magnetic sensor 52a does not detect the magnet 2f, and thus outputs an OFF signal to the control unit 60. On the other hand, in fig. 2 (b), the fluid m ejected from the nozzle 53a is blocked by the substrate W, and thus cannot reach the support plate 2b. Thereby, the swing plate 2 rotates clockwise around the rotation shaft 1, and the rotation is stopped after the swing plate 2 abuts against the stopper 2d, and this state is maintained. At this time, the magnetic sensor 52a detects the magnet 2f and outputs an ON signal to the control unit 60.
The substrate detection units 50a and 50b are disposed so as to avoid the rotation shaft 32 constituting the conveying unit 30.
Returning to fig. 1, the control unit 60 includes a microcomputer for centrally controlling the respective units, and a storage unit (not shown) for storing processing information, various programs, and the like. The control unit 60 controls the conveyance unit 30, the processing unit 40, and the substrate detection unit 50 based on various information and various programs.
(substrate treatment)
Next, a substrate process (substrate processing step) performed by the substrate processing apparatus 10 will be described.
In the substrate processing, the rollers 31 of the conveying unit 30 rotate, and the substrate W on these rollers 31 is conveyed in a predetermined conveying direction A2 and moves along the conveying path A1. In the liquid supply range of the transfer path A1, the processing liquid is discharged from each shower 41a located above the transfer path A1 in advance before the substrate W is transferred, and the processing liquid is discharged from each shower 41b located below the transfer path A1. The same processing liquid as the processing liquid supplied from the showers 41a, 41b is also discharged from the nozzle 53a. When the substrate W passes through the liquid supply range in a state in which the processing liquid is discharged from the respective showers 41a, 41b to the liquid supply range in the conveyance path A1, the processing liquid is supplied to the upper and lower surfaces (front and rear surfaces) of the substrate W, and the upper and lower surfaces of the substrate W are processed with the processing liquid.
In this substrate processing, the substrate W moving through the conveyance path A1 is detected by the substrate detection unit 50a on the conveyance port 21 side, and the detection signal is input to the control unit 60. That is, when the substrate W carried in the substrate W from the carry-in port 21 reaches the upper side of the nozzle 53a constituting the substrate detection section 50a, the fluid m ejected from the nozzle 53a does not reach the support plate 2b any more, and the state shown in fig. 2 (a) is changed to the state shown in fig. 2 (b). Thereby, an ON signal is input from the magnetic sensor 52a to the control unit 60. Thereafter, the substrate W is moved and processed by the processing liquid supplied from the showers 41a and 41b as described above. When the substrate W reaches the substrate detection unit 50b on the carry-out port 22 side, the substrate W is similarly detected, and the detection signal is input to the control unit 60. Then, when the next substrate W to be processed moves along the transfer path A1, the substrate W is detected by the substrate detection unit 50a on the carry-in port 21 side and then by the substrate detection unit 50b on the carry-out port 22 side, as described above. These detection signals are also input to the control unit 60. The same applies to the substrates W to be processed thereafter.
The control unit 60 receives the detection signals from the substrate detection units 50a and 50b, and detects whether or not the substrate W is present on the conveyance path A1 based on the detection signals.
Further, the control unit 60 determines whether or not the substrate W is stably conveyed based on the presence or absence of the substrate W. For example, the control unit 60 determines whether or not the time from the detection signal of the substrate detection unit 50a to the detection of the absence of the substrate W is within a predetermined allowable range after the detection of the presence of the substrate W by the substrate detection unit 50a, and confirms the conveyance speed of the substrate W. Further, the control unit 60 determines whether or not the time until the next substrate W is grasped based on the detection signal of the substrate detection unit 50a is within a predetermined allowable range, after grasping that no substrate W is present based on the detection signal of the substrate detection unit 50a, and confirms the conveyance interval of the substrate W. Such confirmation is performed similarly based on the detection signal of the substrate detection unit 50b on the carry-out port 22 side. When it is determined that the time is not within the predetermined allowable range, the control unit 60 determines that the conveyance speed and the conveyance interval of the substrates W during conveyance are abnormal, and reports the conveyance abnormality by, for example, sound, display, or the like, and stops the conveyance of the substrates W. On the other hand, when it is determined that the respective times are within the predetermined allowable range, it is determined that the conveyance is normal, and the conveyance is continued. The predetermined allowable ranges are preset in the storage unit of the control unit 60.
As described above, according to the first embodiment, since the substrate detection unit 50 detects whether or not the fluid m ejected from the nozzle 53a reaches the support plate 2b, the arrival of the substrate W can be detected without directly contacting the swing plate 2 or the like constituting the substrate detection unit 50 with the substrate W. Therefore, the arrival of the substrate W can be detected without damaging the substrate W.
Further, since the substrate detection unit 50 detects the arrival of the substrate W based on whether or not the fluid m discharged from the nozzle 53a has reached the support plate 2b, erroneous detection due to the attachment of the processing liquid to the light receiver or the like can be suppressed, for example, as compared with the case where the light projector and the light receiver are disposed via the conveyance path A1, and the substrate detection accuracy can be improved.
The fluid m ejected from the nozzle 53a of the substrate detection unit 50 is the same as the processing liquid used in the processing unit 40. Thus, even if the treatment liquid discharged from the showers 41a, 41b and the fluid m discharged from the nozzles 53a are collected in the same tank 43, the concentration of the treatment liquid does not change or different treatment liquids are not mixed. This allows the treatment liquid recovered in the tank 43 to be reused for the treatment by the treatment unit 40.
The fluid m having a sufficient amount and flow rate to swing the swing plate 2 may be ejected from the nozzle 53a, and the fluid m ejected from the nozzle 53a may not be in contact with the entire support plate 2b, but may be in contact with a part of the support plate 2b. Therefore, the amount of the fluid m used can be reduced. If the amount of the fluid m discharged from the nozzle 53a is reduced, the conveyance of the substrate W is not hindered by the substrate W being discharged from the nozzle 53a.
In a state where the fluid m from the nozzle 53a does not reach the support plate 2b as shown in fig. 2 (b), the support plate 2b is inclined toward the conveyance path A1 with respect to the connection portion with the main body 2 a. Therefore, when the fluid m ejected from the nozzle 53a by the substrate detection unit 50 reaches at least the first stage of the support plate 2b, the fluid m mainly flows toward the connection portion between the main body 2a and the support plate 2b. Therefore, the fluid m reaching the support plate 2b can be effectively used to generate a moment in the counterclockwise direction with respect to the swing plate 2.
In general, however, in a substrate processing apparatus, a central portion on the upper surface side of a substrate often serves as a surface to be used as a final product. That is, the lower surface (back surface) of the substrate, particularly, the lower surface of the end portion in the width direction of the substrate, often does not require precise processing as compared with the central portion of the upper surface of the substrate. In the present embodiment, the fluid m ejected from the nozzle 53a is not in collision with the upper surface of the substrate W but in collision with the lower surface of the substrate W, and thus the fluid m supplied from the nozzle 53a can be prevented from varying the supply amount of the processing liquid supplied to the upper surface side of the substrate W. This makes it possible to uniformly perform the processing on the upper surface side of the substrate W.
Further, the swing portion 51 and the fluid ejection portion 53 constituting the substrate detection portion 50 are preferably located as close to the conveyance path A1 as possible. For example, the nozzle 53a is provided directly below the conveyance path A1 (for example, at the same height as the roller 31), and the support plate 2b in the state shown in fig. 2 (b) is provided directly above the conveyance path A1 (for example, at a position slightly higher than the thickness of the substrate W conveyed by the roller 31). This can suppress the amount of fluid m ejected from the nozzle 53a.
It is also advantageous to suppress the amount of the fluid m ejected from the nozzle 53a in the following aspects. In the substrate processing apparatus 10 illustrated in the above-described embodiment, a tool for ejecting the processing liquid such as the shower 41 is often not provided near the carry-in port 21 and the carry-out port 22 of the processing chamber 20. This is to prevent the process liquid discharged from the shower 41 from entering other process chambers adjacent to the process chamber 20. If the amount of the fluid m ejected from the nozzle 53a can be suppressed, the fluid m ejected from the nozzle 53a can be prevented from entering other processing chambers.
< other embodiments >
The above embodiment may be modified as follows.
The nozzle 53a is connected to the liquid supply pipe 42b, but the present invention is not limited thereto, and a liquid supply pipe dedicated to the nozzle 53a may be provided.
In addition, the nozzle 53a used in the substrate detection unit 50 may be replaced with a nozzle of the shower 41b used for processing the lower surface (back surface) of the substrate W, instead of the nozzle 53a.
The fluid m discharged from the nozzle 53a is not necessarily required to be the same as the treatment liquid, and may be a different type of liquid from the treatment liquid.
The fluid m (for example, the developer) is discharged from the nozzle 53a constituting the fluid discharge portion 53, but the present invention is not limited thereto, and a gas may be discharged.
The magnetic sensor 52a detects the magnet 2f and outputs an ON signal to the control unit 60, but may output an OFF signal to the control unit 60 when the magnetic sensor 52a detects the magnet 2f and output an ON signal to the control unit 60 when the magnetic sensor 52a does not detect the magnet 2 f.
The rotation moment is obtained by attaching the weight 2c to the swinging plate 2, but the present invention is not limited to this, and a torsion spring may be interposed between the rotation shaft 1 and the frame 20 a.
Further, the case where 1 conveying roller is constituted by providing the plurality of rollers 31 to the rotation shaft 32 is exemplified, but the present invention is not limited thereto, and for example, 1 cylindrical conveying roller may be used for 1 rotation shaft 32.
Although the shower 41 is illustrated as being disposed above and below the conveyance path A1, the present invention is not limited thereto, and may be disposed only above the conveyance path A1, for example, in the case of treating only the upper surface of the substrate W.
In addition, as each substrate detection unit 50, a swinging unit 51 is provided, and the sensor unit 52 detects swinging of the swinging unit 51, but not limited thereto, for example, a rotating body that rotates with the fluid supplied from the fluid ejection unit 53 may be provided instead of the swinging unit 51, and the substrate W may be detected by detecting whether the rotating body rotates or not or a difference in rotation speed of the rotating body.
While the present invention has been described with reference to several embodiments, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other modes, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and spirit of the invention, and are included in the invention described in the claims and their equivalents.
Claims (14)
1. A substrate processing apparatus, characterized in that,
the device comprises:
a conveying section for conveying the substrate along a conveying path;
a processing unit configured to process the substrate conveyed by the conveying unit with a processing liquid; and
a substrate detection unit configured to detect the substrate conveyed by the conveyance unit,
the substrate detection unit includes: a discharge unit for discharging a fluid from the lower surface side of the substrate conveyed by the conveyance unit; and a detection unit for detecting arrival of the fluid from the ejection unit at a position facing the ejection unit through the conveyance path,
the detection part is provided with a swinging part and a sensor part,
the swing portion swings by the fluid ejected from the ejection portion,
the sensor portion detects the swing of the swing portion.
2. The substrate processing apparatus according to claim 1, wherein,
the fluid is the same treatment fluid as the treatment fluid.
3. The substrate processing apparatus according to claim 1 or 2, wherein,
the device is provided with:
a recovery pipe for recovering the treatment liquid used in the treatment section; and
a tank for storing the treatment liquid recovered by the recovery pipe,
the treatment section reuses the treatment liquid recovered and stored in the tank for treatment by the treatment section.
4. The substrate processing apparatus according to claim 1 or 2, wherein,
the swinging part is provided with a swinging plate which swings around an axis parallel to the conveying direction of the substrate.
5. The substrate processing apparatus according to claim 4, wherein,
the swing plate has a main body and a support plate supported at one end of the main body at an obtuse angle.
6. The substrate processing apparatus according to claim 5, wherein,
a weight is attached to the support plate, and a rotational moment on the base plate side centered on the shaft is applied to the swing plate by the weight.
7. The substrate processing apparatus according to claim 5, wherein,
the support plate is inclined toward the conveyance path side with respect to a connection portion with the main body in a state where the fluid discharged from the discharge portion is blocked by the substrate and cannot reach the support plate.
8. The substrate processing apparatus according to claim 1 or 2, wherein,
the ejection of the fluid from the ejection portion is started before the substrate reaches above the ejection portion.
9. The substrate processing apparatus according to claim 1 or 2, wherein,
the processing unit is provided with:
a plurality of sprayers disposed along a conveyance direction of the substrate; and
a liquid supply pipe through which the treatment liquid supplied to the shower flows,
the ejection section has a nozzle connected to the liquid supply pipe.
10. A substrate processing apparatus, characterized in that,
the device comprises:
a conveying section for conveying the substrate along a conveying path;
a processing unit configured to process the substrate conveyed by the conveying unit with a processing liquid; and
a substrate detection unit configured to detect the substrate conveyed by the conveyance unit,
the substrate detection unit includes: a discharge unit for discharging a fluid from the lower surface side of the substrate conveyed by the conveyance unit; and a detection unit for detecting arrival of the fluid from the ejection unit at a position facing the ejection unit through the conveyance path,
the detecting section has a rotating body rotated by the fluid supplied from the ejecting section,
the substrate detection unit detects the arrival of the fluid from the rotation state of the rotating body.
11. The substrate processing apparatus according to claim 10, wherein,
the fluid is the same treatment fluid as the treatment fluid.
12. The substrate processing apparatus according to claim 10 or 11, wherein,
the device is provided with:
a recovery pipe for recovering the treatment liquid used in the treatment section; and
a tank for storing the treatment liquid recovered by the recovery pipe,
the treatment section reuses the treatment liquid recovered and stored in the tank for treatment by the treatment section.
13. The substrate processing apparatus according to claim 10 or 11, wherein,
the ejection of the fluid from the ejection portion is started before the substrate reaches above the ejection portion.
14. The substrate processing apparatus according to claim 10 or 11, wherein,
the processing unit is provided with:
a plurality of sprayers disposed along a conveyance direction of the substrate; and
a liquid supply pipe through which the treatment liquid supplied to the shower flows,
the ejection section has a nozzle connected to the liquid supply pipe.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-065819 | 2019-03-29 | ||
| JP2019065819A JP6857682B2 (en) | 2019-03-29 | 2019-03-29 | Board processing equipment |
Publications (2)
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|---|---|
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| Publication number | Publication date |
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| TWI711103B (en) | 2020-11-21 |
| TW202036748A (en) | 2020-10-01 |
| CN111755366A (en) | 2020-10-09 |
| JP6857682B2 (en) | 2021-04-14 |
| JP2020167260A (en) | 2020-10-08 |
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