＜第1實施例＞
對於本發明的第1實施例參照第1圖～第3圖進行說明。
(基本構成)
如第1圖所示，第1實施例的基板處理裝置10，是具備：處理室20、及搬運部30、及處理部40、及基板檢出部50、及控制部60。
處理室20，是將基板W處理用的處理槽，在內部形成有讓基板W移動的搬運路A1的框體。在此處理室20中，形成有搬入口21及搬出口22。搬運路A1，是從搬入口21至搬出口22為止朝水平延伸，位於處理室20的上下方向的大致中央。又，處理對象的基板W，是使用例如矩形狀的玻璃基板。
搬運部30，是具有：複數滾子31及複數根(在第1圖中為11根)的旋轉軸32，藉由那些的滾子31及旋轉軸32將基板W在搬運路A1上沿著搬運方向A2搬運。各滾子31，是由規定間隔被固定在各旋轉軸32，旋轉軸32是藉由旋轉而一起旋轉。各旋轉軸32，是各別比與基板W中的搬運方向A2垂直交叉的方向中的長度(寬度方向長度)更長地形成，並列地沿著基板W的搬運方向A2被排列，可旋轉地被設置。這些的旋轉軸32，是藉由共通的驅動機構(無圖示)，彼此之間同步旋轉，與各滾子31一起形成基板W的搬運路A1。此搬運部30，是藉由各滾子31將基板W支撐，將支撐的基板W藉由各滾子31的旋轉而朝規定的搬運方向A2搬運。
處理部40，是具有：複數噴灑器41，藉由那些的噴灑器41，對於在搬運路A1移動的基板W供給處理液(例如顯像液)將基板W處理(例如顯像處理)。各噴灑器41，是隔著搬運路A1地在搬運路A1的上方及下方各別設置複數個(在第1圖中為7個)。這些的噴灑器41之中，位於搬運路A1的上方的各噴灑器41a，是對於搬運路A1從上方將處理液吐出。且，位於搬運路A1的下方的各噴灑器41b，是對於搬運路A1從下方將處理液吐出。各噴灑器41a、41b，是具有在與基板W的搬運方向A2垂直交叉的水平面內的方向排列的複數噴嘴(無圖示)，從各噴嘴朝向在搬運路A1移動的基板W將處理液由高壓吐出朝基板W供給處理液。
各噴灑器41a，是透過液供給管42a與槽桶43連接，各噴灑器41b，是透過液供給管42b與槽桶43連接。這些的噴灑器41a、41b，是藉由從槽桶43的由泵(無圖示)所產生壓送，透過液供給管42a、42b將被供給的處理液吐出。從各噴灑器41a、41b被吐出的處理液，是透過與處理室20的底部連接的回收管44朝槽桶43被回收且被貯留。被回收至槽桶43的處理液，是藉由壓送再度透過各液供給管42a、42b被供給至各噴灑器41a、41b。
基板檢出部50，是檢出在搬運路A1移動的基板W。在本實施例中，在處理室20內具有2個基板檢出部50a、50b。基板檢出部50a，是被設於處理室20的搬入口21的附近。基板檢出部50b，是位於處理室20的搬出口22的附近。且，檢出沿著搬運路A1被搬運的基板W中的與搬運方向垂直交叉的寬度方向的端部。
在此使用第2圖、第3圖，說明基板檢出部50(50a、50b)。又，基板檢出部50a及50b，是成為相同構成。
第2圖(a)是顯示基板檢出部50未檢出基板W的狀態，第2圖(b)是顯示基板檢出部50檢出基板W的狀態，第3圖，是從第2圖(a)的CR方向所見的側面圖。
基板檢出部50，是具有：擺動部51、及感測器部52、及流體吐出部(吐出部)53。擺動部51及感測器部52，是作為檢出部的功能。
擺動部51，是具有：可旋轉自如地被支撐於處理室20的框架20a等的旋轉軸1(第3圖參照)、及被固定支撐於旋轉軸1的擺動板2。此擺動板2是例如金屬板，具有：被支撐於旋轉軸1的本體2a、及在本體2a的一方端對於本體2a具有鈍角地被支撐的受板2b。受板2b是例如樹脂製的板，對於先前述及的處理液具有耐液性的構件。在受板2b中，安裝有錘2c。藉由此錘2c，使擺動板2本身，在第2圖中，被賦予以旋轉軸1為中心的順時針的旋轉力矩。又，2d、2e是止動器。擺動板2，雖是受到先前述及的順時針的旋轉力矩，但是如第2圖(b)所示，在擺動板2與止動器2d抵接之處，其轉動(擺動)被限制。另一方面，如第2圖(a)所示，藉由使從後述的流體吐出部53被吐出的液體與受板2b抵接，在擺動板2中，雖受到以旋轉軸1為中心的逆時針的旋轉力矩，但是止動器2e與擺動板2抵接之處，其轉動(擺動)被限制。
感測器部52，是檢出擺動板2的擺動的有無。如第3圖所示，將磁鐵2f內藏的檢出板2g是被固定支撐在擺動板2的另一方端中。此檢出板2g的擺動的有無，是藉由被固定於框架20a的磁性感測器52a而被檢出。即，磁性感測器52a，是第2圖(a)的狀態時將斷開(OFF)訊號朝控制部60輸出，第2圖(b)的狀態時將導通(ON)訊號朝控制部60輸出。
流體吐出部53，是具有噴嘴53a。此噴嘴53a、及擺動板2的受板2b，是隔著搬運路A1相面對地配置。在本實施例中，噴嘴53a，是在基板W的搬運路A1的下方，且與沿著搬運路A1被搬運的基板W的寬度方向的一方的端部的下面相面對地配置。對於此，先前述及的受板2b，是在搬運路A1的上方，與噴嘴53a相面對地設置。如第2圖(a)、(b)所示，流體m是從搬運路A1的下方朝向搬運路A1，即在第2圖中朝向上方，從噴嘴53a被吐出。例如，來自噴嘴53a的流體m的吐出，不是只有由基板處理裝置10所進行的基板W的處理中，處理待機中也被持續。在本實施例中，噴嘴53a與液供給管42b連接，從噴嘴53a被吐出的流體m，是與基板的處理所使用的處理液(例如顯像液)相同。噴嘴53a的吐出口徑，是例如1-5mm。從噴嘴53a被吐出的流體m是與擺動板2的受板2b抵接時，如第2圖(a)所示，在擺動板2中，會發生以旋轉軸1為中心的逆時針的旋轉力矩。且從噴嘴53a被吐出的流體m的液壓是被設定成：使此逆時針的旋轉力矩，成為在具有錘2c的擺動板2本身發生的時鐘方向的旋轉力矩以上。此液壓的設定，可以依據藉由實驗等求得的液壓進行。又已經述及，受到逆時針的旋轉力矩的擺動板2，是在止動器2e與擺動板2抵接之處，其轉動被限制。
如前述，第2圖(a)是顯示基板檢出部50未檢出基板W的狀態，第2圖(b)是顯示基板檢出部50檢出基板W的狀態。又在第2圖中基板的搬運方向，是紙面的垂直交叉方向。
在第2圖(a)中，從噴嘴53a被吐出的流體m，是不會被基板W遮到地到達受板2b。由此，擺動板2，是以旋轉軸1為中心朝逆時針方向轉動，其轉動是在擺動板2與止動器2e抵接之處停止，使此狀態被維持。此時，磁性感測器52a，因為未檢出磁鐵2f，所以將斷開(OFF)訊號朝控制部60輸出。另一方面在第2圖(b)中，從噴嘴53a被吐出的流體m，因為是被基板W遮住所以無法到達受板2b。由此，擺動板2，是以旋轉軸1為中心朝順時針方向轉動，其轉動是在擺動板2與止動器2d抵接之處停止，使此狀態被維持。此時，磁性感測器52a，是檢出磁鐵2f，將導通(ON)訊號朝控制部60輸出。
又，基板檢出部50a、50b，是將構成搬運部30的旋轉軸32迴避地配置。
返回至第1圖，控制部60，是具備：將各部集中地控制的微電腦、及將處理資訊和各種程式等記憶的記憶部(皆無圖示)。此控制部60，是依據各種資訊和各種程式，將搬運部30、處理部40、基板檢出部50控制。
(基板處理)
接著說明，前述的基板處理裝置10所進行的基板處理(基板處理過程)。
在基板處理中，搬運部30的各滾子31旋轉，使那些的滾子31上的基板W朝規定的搬運方向A2被搬運，沿著搬運路A1移動。在此搬運路A1中的液供給範圍中，從基板W的搬運之前，預先從位於搬運路A1的上方的各噴灑器41a使處理液被吐出，進一步，從位於搬運路A1的下方的各噴灑器41b使處理液被吐出。且，從噴嘴53a也被吐出與從各噴灑器41a、41b被供給的處理液相同的處理液。在從各噴灑器41a、41b使處理液朝搬運路A1中的液供給範圍被吐出的狀態下，基板W通過該液供給範圍的話，朝基板W的上下面(表背面)被供給處理液，使基板W的上下面藉由處理液被處理。
在此基板處理中，將搬運路A1移動的基板W，是藉由搬入口21側的基板檢出部50a而被檢出，使其檢出訊號朝控制部60被輸入。即，從搬入口21被搬入的基板W，若到達構成基板檢出部50a的噴嘴53a的上方的話，從噴嘴53a被吐出的流體m，就無法到達受板2b，從第2圖(a)所示的狀態朝第2圖(b)所示的狀態變化。藉此從磁性感測器52a使導通(ON)訊號被輸入至控制部60。其後，基板W移動，藉由如前述從各噴灑器41a、41b被供給的處理液而被處理。且，基板W若到達搬出口22側的基板檢出部50b的話，同樣地基板W被檢出，其檢出訊號被輸入至控制部60。其後，下一個處理對象的基板W若從搬運路A1移動來的話，與前述同樣地，藉由搬入口21側的基板檢出部50a被檢出，其後，藉由搬出口22側的基板檢出部50b被檢出。這些的檢出訊號也被輸入至控制部60。之後的處理對象的基板W也同樣。
控制部60，是收訊來自各基板檢出部50a、50b的檢出訊號，將依據此搬運路A1上的基板W的有無檢出。
進一步控制部60，是對應基板W的有無，判斷基板W是否穩定地被搬運。例如，控制部60，是依據搬入口21側的基板檢出部50a的檢出訊號把握到有基板W之後，藉由依據基板檢出部50a的檢出訊號判斷直到把握到沒有基板W為止的時間是否為規定的容許範圍內，來確認基板W的搬運速度。進一步，控制部60，是依據基板檢出部50a的檢出訊號把握到沒有基板W之後，藉由依據基板檢出部50a的檢出訊號判斷直到把握到有下一個基板W為止的時間是否為規定的容許範圍內，來確認基板W的搬運間隔。這種確認，也依據搬出口22側的基板檢出部50b的檢出訊號同樣地被實行。控制部60，是判斷為這些的時間不是規定的容許範圍內的情況時，就判別為搬運中的基板W的搬運速度和搬運間隔不正常，搬運異常發生，藉由例如音和顯示等將搬運異常報知，將基板W的搬運停止。另一方面，前述的各時間是被判斷為規定的容許範圍內的情況時，就判別為搬運是正常，繼續搬運。又，前述的各規定的容許範圍是各別預先被設定在控制部60的記憶部。
如以上說明，依據第1實施例的話，基板檢出部50，因為是檢出來自噴嘴53a的被吐出的流體m是否到達受板2b，所以構成基板檢出部50的擺動板2等不需要與基板W直接接觸就可以將基板W的到來檢出。因此，可以不會造成基板W損傷地將基板W的到來檢出。
且基板檢出部50，因為是藉由從噴嘴53a被吐出的流體m是否到達受板2b，來檢出基板W的到達，所以例如，與隔著搬運路A1配置投光器及受光器的情況時比較的話，起因於附著在受光器等的處理液的誤檢出被抑制，可以提高基板的檢出精度。
且從基板檢出部50的噴嘴53a被吐出的流體m，是與處理部40所使用的處理液相同者。由此，即使將從噴灑器41a、41b被吐出的處理液、及從噴嘴53a被吐出的流體m回收至同一的槽桶43，處理液的濃度也不會變化，不同的處理液也不會混合。由此，可以將被回收至槽桶43的處理液，再度使用在處理部40中的處理。
且從噴嘴53a吐出足夠讓擺動板2擺動的量及流速的流體m即可，且從噴嘴53a吐出的流體m，沒有必要與受板2b的整體接觸，只要接觸受板2b的一部分即可。因此，可以減少流體m的使用量。將從噴嘴53a吐出的流體m的使用量減少的話，基板W的搬運也不會起因於基板W受到從噴嘴53a吐出的流體m而被妨害。
且第2圖(b)所示，在來自噴嘴53a的流體m無法到達受板2b的狀態下，受板2b，是成為對於與本體2a的連接部朝搬運路A1側傾斜的狀態。因此，基板W通過基板檢出部50，從噴嘴53a吐出的流體m到達受板2b的至少最初，流體m主要是朝本體2a及受板2b的連接部側流動。因此，到達了受板2b的流體m，可以有效地活用在對於擺動板2的逆時針方向的力矩的生成。
但是一般，在基板處理裝置中，基板的上面側中央部分多是作為最終的製品被使用的面。即，基板的下面(背面)，特別是基板的寬度方向的端部中的下面，與基板上面的中央部分相比精密的處理多不被要求。在本實施例中，從噴嘴53a被吐出的流體m，因為不是與基板W的上面，而是與基板W的下面抵接，所以可防止從噴嘴53a被供給的流體m被供給至基板W的上面側的處理液的供給量變動。從此可知，可以將基板W的上面側的處理均一地進行。
且構成基板檢出部50的擺動部51及流體吐出部53，是儘可能地，接近搬運路A1較佳。例如，將噴嘴53a設於搬運路A1的正下方(例如與滾子31相同高度位置)，將如第2圖(b)所示的狀態的受板2b設於搬運路A1的正上方(例如比被滾子31搬運的基板W的厚度分更略高的位置)。由此，可以抑制從噴嘴53a吐出的流體m的量。
抑制從噴嘴53a吐出的流體m的量，對於以下的點也有利。在上述的實施例中所例示的基板處理裝置10中，通常，多不會將如噴灑器41的將處理液吐出的工具設置在處理室20的搬入口21和搬出口22的附近。這是為了防止從噴灑器41吐出的處理液侵入與處理室20相鄰接的其他的處理室。可以抑制從噴嘴53a吐出的流體m的量的話，就可防止從噴嘴53a吐出的流體m侵入其他的處理室。
＜其他的實施例＞
對於前述的實施例，加上如下的變更也無妨。
噴嘴53a，雖是與液供給管42b連接地構成，但是不限定於此，具備噴嘴53a專用的液供給管也可以。
且不特別設置基板檢出部50用的噴嘴53a，可取代噴嘴53a，而利用被使用在基板W的下面(背面)的處理的噴灑器41b所具有的噴嘴也可以。
且從噴嘴53a被吐出的流體m沒有必要是與處理液相同者，與處理液不同種類的液體也可以。
且雖從構成流體吐出部53的噴嘴53a，將流體m(例如顯像液)吐出，但是不限定於此，將氣體吐出也可以。
且磁性感測器52a，雖是檢出磁鐵2f，將導通(ON)訊號朝控制部60輸出，但是磁性感測器52a檢出磁鐵2f的話將斷開(OFF)訊號朝控制部60輸出，磁性感測器52a未檢出磁鐵2f的情況時將導通(ON)訊號朝控制部60輸出也可以。
且雖藉由將錘2c安裝在擺動板2來獲得旋轉力矩，但是不限定於此，在旋轉軸1及框架20a之間隔著扭轉彈簧也可以。
且雖例示了將複數根的滾子31設於旋轉軸32地構成1根搬運滾子，但是不限定於此，例如，對於1根旋轉軸32，使用1根圓筒狀的搬運滾子也可以。
且雖例示了將噴灑器41設於搬運路A1的上方及下方，但是不限定於此，例如，只有將基板W的上面處理的情況，只有設於搬運路A1的上方也可以。
且各基板檢出部50，雖是設置擺動部51，將此擺動部51的擺動由感測器部52檢出地構成，但是不限定於此，例如，可取代擺動部51，設置由從流體吐出部53被供給的流體而旋轉的旋轉體，藉由檢出此旋轉體的旋轉的有無，或是旋轉體的旋轉速度的差，來檢出基板W也可以。
以上，雖說明了本發明的一些的實施例，但是這些的實施例，只是例示者，未意圖限定發明的範圍。這些新穎的實施例，可由其他的各式各樣的形態被實施，在不脫離發明的實質範圍內，可以進行各種的省略、置換、變更。這些實施例和其變形，是被包含於發明的範圍和實質，並且被包含於申請專利範圍的發明及其均等的範圍。
<First Example>
The first embodiment of the present invention will be described with reference to FIGS. 1 to 3.
(Basic composition)
As shown in FIG. 1, the substrate processing apparatus 10 of the first embodiment includes a processing chamber 20, a conveying unit 30, a processing unit 40, a substrate detection unit 50, and a control unit 60.
The processing chamber 20 is a processing tank for processing the substrate W, and a frame of a conveyance path A1 for moving the substrate W is formed inside. In this processing chamber 20, an import port 21 and an export port 22 are formed. The conveyance path A1 extends horizontally from the import port 21 to the export port 22 and is located at the approximate center of the processing chamber 20 in the vertical direction. In addition, as the substrate W to be processed, for example, a rectangular glass substrate is used.
The conveying unit 30 has a plurality of rollers 31 and a plurality of (11 in the first figure) rotating shafts 32, and the substrate W is moved along the conveying path A1 by these rollers 31 and rotating shafts 32 Transport direction A2. Each roller 31 is fixed to each rotating shaft 32 at a predetermined interval, and the rotating shaft 32 rotates together by rotation. The rotating shafts 32 are each formed to be longer than the length (width direction length) in the direction perpendicular to the conveyance direction A2 of the substrate W, and are arranged side by side along the conveyance direction A2 of the substrate W, and are rotatable be set to. These rotating shafts 32 are rotated in synchronization with each other by a common drive mechanism (not shown), and together with the rollers 31, form a transport path A1 for the substrate W. This conveyance section 30 supports the substrate W by the rollers 31, and conveys the supported substrate W in the predetermined conveyance direction A2 by the rotation of the rollers 31.
The processing unit 40 includes a plurality of sprayers 41, and by these sprayers 41, a processing liquid (for example, a developing liquid) is supplied to the substrate W moving on the conveyance path A1 to process the substrate W (for example, a development process). A plurality of sprayers 41 are respectively provided above and below the conveying path A1 across the conveying path A1 (seven in the first figure). Among these sprayers 41, each sprayer 41a located above the conveyance path A1 discharges the processing liquid from above with respect to the conveyance path A1. In addition, each sprayer 41b located below the conveyance path A1 discharges the processing liquid from below with respect to the conveyance path A1. Each sprayer 41a, 41b has a plurality of nozzles (not shown) arranged in a horizontal plane perpendicular to the conveyance direction A2 of the substrate W, and the processing liquid is discharged from each nozzle toward the substrate W moving on the conveyance path A1. The high-pressure discharge supplies the processing liquid to the substrate W.
Each sprayer 41a is connected to the tank 43 with a permeate supply pipe 42a, and each sprayer 41b is connected to the tank 43 with a permeate supply pipe 42b. These sprayers 41a and 41b are pumped from the tank 43 by a pump (not shown), and the permeate supply pipes 42a and 42b discharge the supplied processing liquid. The processing liquid discharged from each sprayer 41a, 41b is recovered and stored in the tank 43 through the recovery pipe 44 connected to the bottom of the processing chamber 20. The processing liquid collected in the tank 43 is supplied to the sprayers 41a and 41b through the liquid supply pipes 42a and 42b again by pressure feeding.
The board detection unit 50 detects the board W moving on the conveyance path A1. In this embodiment, there are two substrate detection sections 50a and 50b in the processing chamber 20. The substrate detection unit 50 a is provided in the vicinity of the import port 21 of the processing chamber 20. The substrate detection unit 50b is located in the vicinity of the export port 22 of the processing chamber 20. And, the end part of the width direction orthogonal to the conveyance direction in the board|substrate W conveyed along the conveyance path A1 is detected.
2 and 3 are used here, and the board|substrate detection part 50 (50a, 50b) is demonstrated. In addition, the substrate detection sections 50a and 50b have the same structure.
Figure 2 (a) shows the state where the substrate W is not detected by the substrate detection section 50, Figure 2 (b) shows the state where the substrate W is detected by the substrate detection section 50, and Figure 3 is from Figure 2 (a) A side view from the CR direction.
The substrate detection unit 50 includes a swing unit 51, a sensor unit 52, and a fluid discharge unit (discharge unit) 53. The swing part 51 and the sensor part 52 function as a detection part.
The swing part 51 has a rotating shaft 1 (refer to FIG. 3) that is rotatably supported by the frame 20 a of the processing chamber 20 and the like, and a swing plate 2 fixedly supported on the rotating shaft 1. This swing plate 2 is, for example, a metal plate, and has a main body 2a supported by the rotating shaft 1 and a receiving plate 2b supported at an obtuse angle to the main body 2a at one end of the main body 2a. The receiving plate 2b is, for example, a resin-made plate, and is a member having liquid resistance to the aforementioned processing liquid. In the receiving plate 2b, a hammer 2c is installed. With this hammer 2c, the swing plate 2 itself is given a clockwise rotation moment centered on the rotation shaft 1 in FIG. 2. In addition, 2d and 2e are stoppers. Although the swing plate 2 receives the aforementioned clockwise rotational torque, as shown in Figure 2(b), the rotation (swing) of the swing plate 2 is restricted where the swing plate 2 abuts the stopper 2d. On the other hand, as shown in Fig. 2(a), the liquid discharged from the fluid discharge part 53 described later is brought into contact with the receiving plate 2b, so that the swing plate 2 receives the center of the rotating shaft 1 The rotation torque is counterclockwise, but where the stopper 2e abuts the swing plate 2, its rotation (swing) is restricted.
The sensor part 52 detects the presence or absence of the swing of the swing plate 2. As shown in FIG. 3, the detection plate 2g in which the magnet 2f is built-in is fixedly supported in the other end of the swing plate 2. The presence or absence of the swing of the detection plate 2g is detected by the magnetic sensor 52a fixed to the frame 20a. That is, the magnetic sensor 52a outputs an OFF signal to the control unit 60 when it is in the state of Fig. 2(a), and outputs an ON signal to the control unit 60 in the state of Fig. 2(b). Output.
The fluid discharge part 53 has a nozzle 53a. The nozzle 53a and the receiving plate 2b of the swing plate 2 are arranged to face each other across the conveyance path A1. In this embodiment, the nozzle 53a is arranged below the conveyance path A1 of the substrate W, and is arranged to face the lower surface of one end in the width direction of the substrate W conveyed along the conveyance path A1. In this regard, the receiving plate 2b mentioned above is provided above the conveyance path A1 facing the nozzle 53a. As shown in Fig. 2 (a) and (b), the fluid m is directed from below the conveyance path A1 toward the conveyance path A1, that is, upward in Fig. 2, and is discharged from the nozzle 53a. For example, the discharge of the fluid m from the nozzle 53a is continued not only during the processing of the substrate W by the substrate processing apparatus 10, but also during the processing standby. In this embodiment, the nozzle 53a is connected to the liquid supply pipe 42b, and the fluid m discharged from the nozzle 53a is the same as the processing liquid (for example, the developing liquid) used for processing the substrate. The discharge port diameter of the nozzle 53a is, for example, 1-5 mm. When the fluid m discharged from the nozzle 53a comes into contact with the receiving plate 2b of the swing plate 2, as shown in Figure 2(a), the swing plate 2 rotates counterclockwise with the rotation axis 1 as the center. Moment. In addition, the hydraulic pressure of the fluid m discharged from the nozzle 53a is set such that the counterclockwise rotational torque becomes equal to or greater than the rotational torque in the clock direction generated by the swing plate 2 itself having the weight 2c. This hydraulic pressure can be set based on the hydraulic pressure obtained through experiments. As already mentioned, the rotation of the swing plate 2 subjected to the counterclockwise rotation torque is restricted where the stopper 2e and the swing plate 2 abut.
As described above, Fig. 2(a) shows a state where the substrate W is not detected by the substrate detection section 50, and Fig. 2(b) shows a state where the substrate W is detected by the substrate detection section 50. In Figure 2, the transport direction of the substrate is the vertical cross direction of the paper.
In Fig. 2(a), the fluid m discharged from the nozzle 53a reaches the receiving plate 2b without being blocked by the substrate W. As a result, the swing plate 2 rotates counterclockwise with the rotation shaft 1 as the center, and its rotation stops at the point where the swing plate 2 abuts the stopper 2e, and this state is maintained. At this time, since the magnetic sensor 52a does not detect the magnet 2f, it outputs an OFF signal to the control unit 60. On the other hand, in Fig. 2(b), the fluid m discharged from the nozzle 53a is blocked by the substrate W and cannot reach the receiving plate 2b. Thereby, the swing plate 2 rotates in the clockwise direction with the rotation shaft 1 as the center, and its rotation is stopped at the point where the swing plate 2 abuts the stopper 2d, and this state is maintained. At this time, the magnetic sensor 52a detects the magnet 2f and outputs an ON signal to the control unit 60.
In addition, the board detection units 50a and 50b are arranged so as to avoid the rotating shaft 32 constituting the transport unit 30.
Returning to Fig. 1, the control unit 60 is provided with a microcomputer that centrally controls each unit, and a memory unit that stores processing information, various programs, etc. (none of which is shown). The control unit 60 controls the transport unit 30, the processing unit 40, and the substrate detection unit 50 based on various information and various programs.
(Substrate processing)
Next, the substrate processing (substrate processing process) performed by the aforementioned substrate processing apparatus 10 will be described.
In the substrate processing, the rollers 31 of the conveying section 30 rotate, and the substrates W on those rollers 31 are conveyed in the predetermined conveying direction A2 and moved along the conveying path A1. In the liquid supply range in this transport path A1, before the substrate W is transported, the processing liquid is ejected from each sprayer 41a located above the transport path A1, and further, from each spray located below the transport path A1. The device 41b discharges the treatment liquid. In addition, the same processing liquid as the processing liquid supplied from the sprayers 41a and 41b is also discharged from the nozzle 53a. In a state where the processing liquid is discharged from the sprayers 41a and 41b to the liquid supply range in the conveyance path A1, when the substrate W passes through the liquid supply range, the processing liquid is supplied to the upper and lower surfaces (front and back) of the substrate W. The upper and lower surfaces of the substrate W are processed by the processing liquid.
In this substrate processing, the substrate W moving the conveyance path A1 is detected by the substrate detection section 50 a on the side of the carry-in port 21, and its detection signal is input to the control section 60. That is, if the substrate W carried in from the carry-in port 21 reaches above the nozzle 53a constituting the substrate detection unit 50a, the fluid m discharged from the nozzle 53a cannot reach the receiving plate 2b, as shown in Figure 2(a) The state shown changes to the state shown in Figure 2(b). Thereby, an ON signal from the magnetic sensor 52a is input to the control unit 60. After that, the substrate W moves and is processed by the processing liquid supplied from the sprayers 41a and 41b as described above. When the substrate W reaches the substrate detection unit 50 b on the export port 22 side, the substrate W is similarly detected, and the detection signal is input to the control unit 60. After that, if the next substrate W to be processed moves from the transport path A1, it is detected by the substrate detection section 50a on the side of the carry-in port 21 in the same manner as described above, and thereafter, by the side of the carry-out port 22 The substrate detection unit 50b is detected. These detection signals are also input to the control unit 60. The same applies to the substrate W to be processed later.
The control unit 60 receives detection signals from the respective board detection units 50a, 50b, and detects the presence or absence of the board W on the conveyance path A1.
Furthermore, the control unit 60 determines whether the substrate W is stably conveyed in accordance with the presence or absence of the substrate W. For example, the control unit 60 determines that there is a substrate W based on the detection signal of the substrate detection portion 50a on the side of the carry-in port 21, and then judges that there is no substrate W based on the detection signal of the substrate detection portion 50a. Whether or not the time is within the predetermined allowable range, the transfer speed of the substrate W is checked. Furthermore, the control section 60 determines whether there is no substrate W based on the detection signal of the substrate detection section 50a, and then determines whether the time until the next substrate W is grasped based on the detection signal of the substrate detection section 50a is Check the transfer interval of the substrate W within the predetermined allowable range. This confirmation is also carried out in the same way based on the detection signal of the substrate detection section 50b on the export port 22 side. When the control unit 60 judges that these times are not within the prescribed allowable range, it judges that the conveying speed and the conveying interval of the substrate W being conveyed are abnormal, and the conveying abnormality has occurred. For example, the conveying is carried out by sound and display. The abnormality is notified, and the transportation of the substrate W is stopped. On the other hand, when each of the aforementioned times is determined to be within the predetermined allowable range, it is determined that the conveyance is normal, and the conveyance is continued. In addition, the aforementioned predetermined allowable ranges are individually set in the memory unit of the control unit 60 in advance.
As explained above, according to the first embodiment, the substrate detection unit 50 detects whether the fluid m discharged from the nozzle 53a reaches the receiving plate 2b, so the swing plate 2 and the like constituting the substrate detection unit 50 are not required Direct contact with the substrate W can detect the arrival of the substrate W. Therefore, the arrival of the substrate W can be detected without causing damage to the substrate W.
In addition, the substrate detection unit 50 detects the arrival of the substrate W by whether the fluid m discharged from the nozzle 53a reaches the receiving plate 2b. Therefore, for example, when the light projector and the light receiver are arranged across the conveying path A1 In comparison, erroneous detection of the processing liquid caused by adhering to the light receiver or the like is suppressed, and the detection accuracy of the substrate can be improved.
The fluid m discharged from the nozzle 53 a of the substrate detection unit 50 is the same as the processing liquid used in the processing unit 40. Thus, even if the treatment liquid discharged from the sprayers 41a and 41b and the fluid m discharged from the nozzle 53a are recovered into the same tank 43, the concentration of the treatment liquid will not change, and different treatment liquids will not change. mixing. Thereby, the processing liquid recovered in the tank 43 can be reused for processing in the processing unit 40.
The fluid m that is sufficient to swing the swing plate 2 and the flow rate may be ejected from the nozzle 53a, and the fluid m ejected from the nozzle 53a does not need to be in contact with the entire receiving plate 2b, but only needs to contact a part of the receiving plate 2b. Therefore, the amount of fluid m used can be reduced. If the usage amount of the fluid m discharged from the nozzle 53a is reduced, the transportation of the substrate W will not be hindered by the substrate W receiving the fluid m discharged from the nozzle 53a.
In addition, as shown in Fig. 2(b), in a state where the fluid m from the nozzle 53a cannot reach the receiving plate 2b, the receiving plate 2b is inclined toward the conveyance path A1 side with respect to the connection portion with the main body 2a. Therefore, the substrate W passes through the substrate detection portion 50, and at least the first time the fluid m discharged from the nozzle 53a reaches the receiving plate 2b, the fluid m mainly flows toward the connecting portion side of the main body 2a and the receiving plate 2b. Therefore, the fluid m that has reached the receiving plate 2b can be effectively used for the generation of the counterclockwise moment to the swing plate 2.
However, in general, in a substrate processing apparatus, the central part of the upper surface side of the substrate is often the surface used as the final product. That is, the lower surface (rear surface) of the substrate, particularly the lower surface in the widthwise end of the substrate, is not required to be processed more precisely than the central portion of the upper surface of the substrate. In this embodiment, since the fluid m discharged from the nozzle 53a does not contact the upper surface of the substrate W but the lower surface of the substrate W, it is possible to prevent the fluid m supplied from the nozzle 53a from being supplied to the substrate W. The supply amount of the processing liquid on the upper side fluctuates. From this, it is understood that the processing on the upper surface side of the substrate W can be uniformly performed.
In addition, the swing portion 51 and the fluid discharge portion 53 constituting the substrate detection portion 50 are as close as possible to the conveyance path A1. For example, the nozzle 53a is provided directly below the conveying path A1 (for example, the same height position as the roller 31), and the receiving plate 2b in the state shown in Figure 2 (b) is provided directly above the conveying path A1 (for example, (A position slightly higher than the thickness of the substrate W conveyed by the roller 31). Thereby, the amount of fluid m discharged from the nozzle 53a can be suppressed.
Suppressing the amount of fluid m discharged from the nozzle 53a is also advantageous for the following points. In the substrate processing apparatus 10 exemplified in the above-mentioned embodiment, usually, a tool for discharging the processing liquid such as the sprayer 41 is not installed in the vicinity of the import port 21 and the export port 22 of the processing chamber 20. This is to prevent the treatment liquid discharged from the sprayer 41 from entering another treatment chamber adjacent to the treatment chamber 20. If the amount of fluid m discharged from the nozzle 53a can be suppressed, the fluid m discharged from the nozzle 53a can be prevented from entering other processing chambers.
<Other examples>
For the foregoing embodiment, the following changes may be added.
The nozzle 53a is configured to be connected to the liquid supply pipe 42b, but it is not limited to this, and a liquid supply pipe dedicated to the nozzle 53a may be provided.
In addition, the nozzle 53a for the substrate detection unit 50 is not particularly provided, and instead of the nozzle 53a, the nozzle of the sprayer 41b used for the treatment of the lower surface (back surface) of the substrate W may be used.
In addition, the fluid m discharged from the nozzle 53a does not need to be the same as the treatment liquid, and may be a different kind of liquid from the treatment liquid.
In addition, the fluid m (for example, a developing liquid) is ejected from the nozzle 53a constituting the fluid ejection portion 53, but the invention is not limited to this, and gas may be ejected.
In addition, although the magnetic sensor 52a detects the magnet 2f and outputs an ON signal to the control unit 60, when the magnetic sensor 52a detects the magnet 2f, it outputs an OFF signal to the control unit 60. When the magnet 2f is not detected by the magnetic sensor 52a, an ON signal may be output to the control unit 60.
In addition, the rotating moment is obtained by attaching the hammer 2c to the swing plate 2, but it is not limited to this, and a torsion spring may be provided between the rotating shaft 1 and the frame 20a.
In addition, although a plurality of rollers 31 are provided on the rotating shaft 32 to constitute one conveying roller, it is not limited to this. For example, for one rotating shaft 32, a cylindrical conveying roller may be used. can.
Although the sprayer 41 is exemplified as being provided above and below the conveying path A1, it is not limited to this. For example, when only the upper surface of the substrate W is processed, it may be provided only above the conveying path A1.
In addition, each substrate detection portion 50 is configured to provide a swing portion 51, and the swing of the swing portion 51 is detected by the sensor portion 52, but it is not limited to this. For example, the swing portion 51 may be replaced by a The rotating body rotated by the fluid supplied from the fluid ejection unit 53 may detect the substrate W by detecting the presence or absence of rotation of the rotating body or the difference in the rotation speed of the rotating body.
Although some examples of the present invention have been described above, these examples are merely illustrative and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the essential scope of the invention. These embodiments and their modifications are included in the scope and essence of the invention, and are included in the scope of the patent application and their equivalent scope.
