CN111755366A

CN111755366A - Substrate processing apparatus

Info

Publication number: CN111755366A
Application number: CN202010081318.2A
Authority: CN
Inventors: 大森圭悟
Original assignee: Shibaura Mechatronics Corp
Current assignee: Shibaura Mechatronics Corp
Priority date: 2019-03-29
Filing date: 2020-02-06
Publication date: 2020-10-09
Anticipated expiration: 2040-02-06
Also published as: JP6857682B2; TWI711103B; JP2020167260A; CN111755366B; TW202036748A

Abstract

The invention provides a substrate processing apparatus capable of improving detection precision of a substrate without damaging the substrate. A substrate processing apparatus (10) according to an embodiment includes: a conveying part (30) for conveying the substrate (W) along a conveying path (A1); a processing unit (40) for processing the substrate (W) conveyed by the conveying unit (30) with a processing liquid; a substrate detection unit (50) having a nozzle (53a) for ejecting fluid from the lower surface side of the substrate (W) to be conveyed and a sensor unit (52) for detecting that the processing liquid from the nozzle (53a) has reached the swing unit (51); and a control unit (60) that detects the substrate (W) on the basis of the detection signal output from the substrate detection unit (50).

Description

Substrate processing apparatus

Technical Field

Embodiments of the present invention relate to a substrate processing apparatus.

Background

In a manufacturing process of a liquid crystal display device, a semiconductor device, or the like, a substrate processing apparatus is used which carries a substrate such as glass for a liquid crystal panel or glass for a photomask and processes the substrate by discharging a processing liquid (e.g., a chemical liquid) onto the moving substrate.

Such a substrate processing apparatus includes a substrate detection device that detects the presence or absence of a substrate conveyed along a conveyance path. The substrate detection device has a contact type and a non-contact type. Examples of the contact type substrate detection device include a vibrator sensor. This is a type in which the vibrator is oscillated by bringing the substrate to be conveyed into contact with the vibrator, and the sensor senses the oscillation. The non-contact substrate detection device is, for example, a type in which a sensor detects the presence or absence of a substrate by light projection and light reception.

However, in the contact type substrate detection apparatus, since a part of the substrate detection apparatus is in contact with the substrate, a crack or the like may be generated at a tip portion of the substrate, and the substrate may be damaged. In addition, in the non-contact substrate detection apparatus, the processing liquid used in the substrate processing apparatus adheres to the substrate detection apparatus, and light is diffusely reflected, thereby causing erroneous detection.

Disclosure of Invention

The invention aims to improve the detection precision of a substrate without damaging the substrate.

The substrate processing apparatus according to the embodiment of the present invention is characterized in that,

comprising:

a conveying part for conveying the substrate along a conveying path;

a processing unit configured to process the substrate conveyed by the conveying unit with a processing liquid; and

a substrate detection unit for detecting the substrate carried by the carrying unit,

the substrate detection unit includes a discharge unit that discharges a fluid from a lower surface side of the substrate conveyed by the conveying unit, and a detection unit that detects arrival of the fluid from the discharge unit at a position facing the discharge unit via the conveying path.

According to the embodiments of the present invention, the detection accuracy of the substrate can be improved without damaging the substrate.

Drawings

Fig. 1 is a diagram showing a substrate processing apparatus according to a first embodiment of the present invention.

Fig. 2 is a diagram showing a structural example and an operation example of a substrate detection unit provided in the substrate processing apparatus shown in fig. 1.

Fig. 3 is a side view of the substrate detection unit as viewed from the CR direction shown in fig. 2 (a).

Detailed Description

< embodiment 1 >

A first embodiment of the present invention will be described with reference to fig. 1 to 3.

(basic structure)

As shown in fig. 1, a substrate processing apparatus 10 according to the first embodiment includes a processing chamber 20, a conveying unit 30, a processing unit 40, a substrate detection unit 50, and a control unit 60.

The processing chamber 20 is a processing tank for processing the substrate W, and is a housing having a conveyance path a1 formed therein for moving the substrate W. The processing chamber 20 has a transfer port 21 and a transfer port 22. The conveyance path a1 extends horizontally from the loading port 21 to the unloading port 22, and is located substantially at the center in the vertical direction of the processing chamber 20. For example, a rectangular glass substrate is used as the substrate W to be processed.

The conveying unit 30 has a plurality of rollers 31 and a plurality of (11 in fig. 1) rotating shafts 32, and the substrate W is conveyed on the conveying path a1 in the conveying direction a2 by the rollers 31 and the rotating shafts 32. The rollers 31 are fixed to the respective rotating shafts 32 at predetermined intervals, and rotate together as the rotating shafts 32 rotate. Each of the rotary shafts 32 is formed to be longer than the length (width direction length) of the substrate W in the direction orthogonal to the conveyance direction a2, and is provided to be rotatable in parallel and aligned along the conveyance direction a2 of the substrate W. The rotary shafts 32 are configured to rotate in synchronization with each other by a common drive mechanism (not shown), and form a conveyance path a1 for the substrate W together with the rollers 31. The conveying unit 30 supports the substrate W by the rollers 31, and conveys the supported substrate W in a predetermined conveying direction a2 by rotation of the rollers 31.

The processing unit 40 includes a plurality of showers 41, and processes (e.g., development processes) the substrate W by supplying a processing liquid (e.g., a developing liquid) to the substrate W moving through the transfer path a1 by the showers 41. A plurality of showers 41 (7 in fig. 1) are provided above and below the conveyance path a1 with the conveyance path a1 interposed therebetween. Of these showers 41, each shower 41a located above the conveyance path a1 discharges the processing liquid from above into the conveyance path a 1. The showerers 41b located below the conveyance path a1 discharge the treatment liquid from below to the conveyance path a 1. Each of the

showers

41a and 41b has a plurality of nozzles (not shown) arranged in a direction orthogonal to the conveyance direction a2 of the substrate W in a horizontal plane, and supplies the processing liquid to the substrate W by discharging the processing liquid at high pressure from each nozzle toward the substrate W moving in the conveyance path a 1.

Each shower 41a is connected to the tank 43 via a liquid supply pipe 42a, and each shower 41b is connected to the tank 43 via a liquid supply pipe 42 b. These

showers

41a and 41b are pumped from the tank 43 by a pump (not shown) to discharge the processing liquid supplied through the

liquid supply pipes

42a and 42 b. The treatment liquid discharged from the

heads

41a and 41b is collected into a tank 43 through a collection pipe 44 connected to the bottom of the treatment chamber 20, and is stored therein. The treatment liquid collected in the tank 43 is supplied to the

showers

41a and 41b by pressure feeding again through the

liquid supply pipes

42a and 42 b.

The substrate detection unit 50 detects the substrate W moving through the conveyance path a 1. In the present embodiment, the processing chamber 20 includes two

substrate detection units

50a and 50 b. The substrate detection unit 50a is disposed near the transfer port 21 of the processing chamber 20. The substrate detection unit 50b is located near the transfer port 22 of the processing chamber 20. Then, the end of the substrate W in the width direction orthogonal to the conveyance direction conveyed along the conveyance path a1 is detected.

Here, the substrate detection unit 50(50a, 50b) will be described with reference to fig. 2 and 3. The

substrate detection units

50a and 50b have the same configuration.

Fig. 2(a) shows a state where the substrate detection unit 50 does not detect the substrate W, fig. 2(b) shows a state where the substrate detection unit 50 detects the substrate W, and fig. 3 is a side view seen from the CR direction of fig. 2 (a).

The substrate detection unit 50 includes a swing unit 51, a sensor unit 52, and a fluid ejection unit (ejection unit) 53. The swinging portion 51 and the sensor portion 52 function as a detection portion.

The swing portion 51 includes a rotating shaft 1 (see fig. 3) rotatably supported by the frame 20a of the processing chamber 20 and the like, and a swing plate 2 fixedly supported by the rotating shaft 1. The swing plate 2 is, for example, a metal plate, and includes a main body 2a supported by the rotating shaft 1 and a support plate 2b supported at one end of the main body 2a at an obtuse angle with respect to the main body 2 a. The support plate 2b is, for example, a resin plate, and is a member having liquid resistance to the treatment liquid described above. A weight 2c is attached to the support plate 2 b. In fig. 2, the weight 2c applies a clockwise rotation moment about the rotation axis 1 to the swing plate 2 itself. 2d, 2e are stoppers. The swing plate 2 receives the clockwise rotational moment described above, but as shown in fig. 2(b), when the swing plate 2 abuts against the stopper 2d, the rotation (swing) thereof is restricted. On the other hand, as shown in fig. 2(a), the swing plate 2 receives a counterclockwise rotational moment about the rotation shaft 1 by the liquid discharged from the fluid discharge portion 53 described later coming into contact with the support plate 2b, but when the stopper 2e comes into contact with the swing plate 2, the rotation (swing) thereof is restricted.

The sensor unit 52 detects the presence or absence of the swing plate 2. As shown in fig. 3, a detection plate 2g having a built-in magnet 2f is fixedly supported at the other end of the swing plate 2. The presence or absence of the swing of the detection plate 2g is detected by a magnetic sensor 52a fixed to the frame 20 a. That is, the magnetic sensor 52a outputs an OFF signal to the control unit 60 in the state of fig. 2(a), and outputs an ON signal to the control unit 60 in the state of fig. 2 (b).

The fluid ejection portion 53 has a nozzle 53 a. The nozzle 53a is disposed opposite the support plate 2b of the swing plate 2 via the conveyance path a 1. In the present embodiment, the nozzle 53a is disposed below the conveyance path a1 of the substrate W and facing the lower surface of one end in the width direction of the substrate W conveyed along the conveyance path a 1. The support plate 2b described above is provided above the conveyance path a1 so as to face the nozzle 53 a. As shown in fig. 2(a) and (b), the fluid m is discharged from the nozzle 53a from below the conveyance path a1 toward the conveyance path a1, i.e., upward in fig. 2. For example, the ejection of the fluid m from the nozzle 53a is continued not only during the processing of the substrate W by the substrate processing apparatus 10 but also during the standby of the processing. In the present embodiment, the nozzle 53a is connected to the liquid supply pipe 42b, and the fluid m discharged from the nozzle 53a is the same as a processing liquid (e.g., a developing liquid) used for processing a substrate. The discharge aperture of the nozzle 53a is, for example, 1 to 5 mm. When the fluid m discharged from the nozzle 53a collides with the support plate 2b of the swing plate 2, a counterclockwise rotational moment about the rotation axis 1 is generated in the swing plate 2 as shown in fig. 2 (a). Then, the hydraulic pressure of the fluid m discharged from the nozzle 53a is set so that the counterclockwise rotational moment becomes equal to or greater than the clockwise rotational moment generated in the swing plate 2 itself having the counterweight 2 c. The hydraulic pressure can be set based on a hydraulic pressure obtained by an experiment or the like. As described above, when the stopper 2e abuts against the swing plate 2, the swing plate 2 receiving the counterclockwise rotational moment is restricted from rotating.

As described above, fig. 2(a) shows a state in which the substrate detection unit 50 does not detect the substrate W, and fig. 2(b) shows a state in which the substrate detection unit 50 detects the substrate W. In fig. 2, the substrate conveyance direction is a direction perpendicular to the paper surface.

In fig. 2(a), the fluid m discharged from the nozzle 53a reaches the support plate 2b without being blocked by the substrate W. As a result, the swing plate 2 rotates counterclockwise about the rotation shaft 1, and the rotation is stopped after the swing plate 2 abuts against the stopper 2e, and the state is maintained. At this time, the magnetic sensor 52a does not detect the magnet 2f, and therefore outputs an OFF signal to the control unit 60. On the other hand, in fig. 2(b), the fluid m discharged from the nozzle 53a is blocked by the substrate W and therefore cannot reach the support plate 2 b. As a result, the swing plate 2 rotates clockwise about the rotation shaft 1, and the rotation is stopped after the swing plate 2 abuts against the stopper 2d, and the state is maintained. At this time, the magnetic sensor 52a detects the magnet 2f and outputs an ON signal to the control unit 60.

The

substrate detection units

50a and 50b are disposed so as to avoid the rotation axis 32 constituting the conveying unit 30.

Returning to fig. 1, the control unit 60 includes a microcomputer that centrally controls the respective units, and a storage unit (neither of which is shown) that stores processing information, various programs, and the like. The control unit 60 controls the conveying unit 30, the processing unit 40, and the substrate detection unit 50 based on various information and various programs.

(substrate treatment)

Next, substrate processing (substrate processing step) performed by the substrate processing apparatus 10 will be described.

In the substrate processing, the rollers 31 of the conveying unit 30 rotate, and the substrate W on the rollers 31 is conveyed in the predetermined conveying direction a2 and moves along the conveying path a 1. In the liquid supply range of the conveyance path a1, the processing liquid is discharged from the showerers 41a located above the conveyance path a1 before the substrate W is conveyed, and the processing liquid is discharged from the showerers 41b located below the conveyance path a 1. The same treatment liquid as the treatment liquid supplied from each of the

showers

41a and 41b is also discharged from the nozzle 53 a. In a state where the processing liquid is discharged from the

showers

41a and 41b to the liquid supply range in the transfer path a1, when the substrate W passes through the liquid supply range, the processing liquid is supplied to the upper and lower surfaces (front and rear surfaces) of the substrate W, and the upper and lower surfaces of the substrate W are processed by the processing liquid.

In this substrate processing, the substrate W moving on the conveyance path a1 is detected by the substrate detection unit 50a on the conveyance port 21 side, and a detection signal thereof is input to the control unit 60. That is, when the substrate W loaded with the substrate W from the loading port 21 reaches above the nozzle 53a constituting the substrate detection unit 50a, the fluid m discharged from the nozzle 53a does not reach the support plate 2b any longer, and changes from the state shown in fig. 2(a) to the state shown in fig. 2 (b). Thereby, the ON signal is input from the magnetic sensor 52a to the control unit 60. Thereafter, the substrate W is moved and processed by the processing liquid supplied from the

showers

41a and 41b as described above. When the substrate W reaches the substrate detection unit 50b on the carrying-out port 22 side, the substrate W is similarly detected, and a detection signal thereof is input to the control unit 60. Thereafter, when the next substrate W to be processed moves along the transfer path a1, it is detected by the substrate detector 50a on the carrying-in port 21 side and then detected by the substrate detector 50b on the carrying-out port 22 side, as described above. These detection signals are also input to the control unit 60. The same applies to the substrate W to be processed later.

The controller 60 receives the detection signals from the

substrate detectors

50a and 50b, and detects the presence or absence of the substrate W on the conveyance path a1 based on the detection signals.

Further, the control unit 60 determines whether or not the substrate W is stably conveyed based on the presence or absence of the substrate W. For example, the controller 60 recognizes the presence of the substrate W based on the detection signal of the substrate detector 50a on the carry-in port 21 side, and then determines whether or not the time until the absence of the substrate W is within a predetermined allowable range based on the detection signal of the substrate detector 50a, thereby confirming the transfer speed of the substrate W. Further, the control unit 60 recognizes that there is no substrate W based on the detection signal of the substrate detection unit 50a, and then determines whether or not the time until the presence of the next substrate W is within a predetermined allowable range based on the detection signal of the substrate detection unit 50a, and confirms the conveyance interval of the substrate W. The confirmation is similarly performed based on the detection signal of the substrate detector 50b on the carrying-out port 22 side. When determining that the time is not within the predetermined allowable range, the control unit 60 determines that the conveyance speed and conveyance interval of the substrate W being conveyed are not normal and that conveyance abnormality occurs, and notifies conveyance abnormality by, for example, sound, display, or the like, and stops conveyance of the substrate W. On the other hand, when it is determined that the respective times are within the predetermined allowable ranges, it is determined that the conveyance is normal, and the conveyance is continued. The predetermined allowable ranges are preset in the storage unit of the control unit 60.

As described above, according to the first embodiment, the substrate detection unit 50 detects whether or not the fluid m ejected from the nozzle 53a reaches the support plate 2b, and therefore, the arrival of the substrate W can be detected without the swinging plate 2 or the like constituting the substrate detection unit 50 directly contacting the substrate W. Therefore, the arrival of the substrate W can be detected without damaging the substrate W.

Further, since the substrate detection unit 50 detects the arrival of the substrate W based on whether or not the fluid m discharged from the nozzle 53a has reached the support plate 2b, it is possible to suppress erroneous detection due to the processing liquid adhering to the light receiver or the like, and improve the detection accuracy of the substrate, as compared with a case where, for example, the light projector and the light receiver are arranged with the conveyance path a1 therebetween.

The fluid m ejected from the nozzle 53a of the substrate detection unit 50 is the same as the processing liquid used in the processing unit 40. Thus, even if the treatment liquid discharged from the

showers

41a and 41b and the fluid m discharged from the nozzle 53a are collected in the same tank 43, the concentration of the treatment liquid does not change or different treatment liquids are not mixed. This enables the treatment liquid collected in the tank 43 to be reused for the treatment in the treatment unit 40.

The fluid m ejected from the nozzles 53a may be ejected in an amount and at a flow velocity sufficient to cause the swing plate 2 to swing, and the fluid m ejected from the nozzles 53a need not be in contact with the entire support plate 2b, but may be in contact with a part of the support plate 2 b. Therefore, the amount of the fluid m used can be reduced. If the amount of the fluid m ejected from the nozzles 53a is reduced, the conveyance of the substrate W is not hindered by the substrate W receiving the ejection of the fluid m from the nozzles 53 a.

In a state shown in fig. 2(b) in which the fluid m from the nozzle 53a does not reach the support plate 2b, the support plate 2b is inclined toward the conveyance path a1 with respect to the connection portion with the main body 2 a. Therefore, at least first when the fluid m ejected from the nozzle 53a by the substrate W passing through the substrate detection unit 50 reaches the support plate 2b, the fluid m mainly flows toward the connection portion side between the main body 2a and the support plate 2 b. Therefore, the fluid m that reaches the support plate 2b can be effectively used to generate a moment in the counterclockwise direction with respect to the swing plate 2.

However, in general, in a substrate processing apparatus, the central portion of the upper surface of the substrate often serves as a surface to be used as a final product. That is, the lower surface (back surface) of the substrate, particularly the lower surface of the end portion in the width direction of the substrate, is often less likely to require precise processing than the central portion of the upper surface of the substrate. In the present embodiment, the fluid m discharged from the nozzle 53a does not collide with the upper surface of the substrate W but with the lower surface of the substrate W, and therefore, the fluid m supplied from the nozzle 53a can be prevented from varying the supply amount of the processing liquid supplied to the upper surface side of the substrate W. This enables uniform processing of the upper surface side of the substrate W.

The swing portion 51 and the fluid ejection portion 53 constituting the substrate detection portion 50 are preferably as close as possible to the conveyance path a 1. For example, the nozzle 53a is provided directly below the conveyance path a1 (e.g., at the same height as the roller 31), and the support plate 2b in the state shown in fig. 2(b) is provided directly above the conveyance path a1 (e.g., at a position slightly higher than the thickness of the substrate W conveyed by the roller 31). This can suppress the amount of the fluid m discharged from the nozzle 53 a.

Suppressing the amount of the fluid m ejected from the nozzle 53a is also advantageous in the following respects. In the substrate processing apparatus 10 exemplified in the above-described embodiment, a tool for ejecting the processing liquid such as the shower 41 is not usually provided in the vicinity of the transfer port 21 and the transfer port 22 of the processing chamber 20 in many cases. This is to prevent the treatment liquid discharged from the shower unit 41 from entering another treatment chamber adjacent to the treatment chamber 20. If the amount of the fluid m discharged from the nozzle 53a can be suppressed, the fluid m discharged from the nozzle 53a can be prevented from entering another processing chamber.

< other embodiment >

The above-described embodiment may be modified as follows.

The nozzle 53a is connected to the liquid supply pipe 42b, but the present invention is not limited thereto, and a liquid supply pipe dedicated to the nozzle 53a may be provided.

In addition, the nozzle 53a may be replaced with a nozzle provided in the shower 41b used for processing the lower surface (back surface) of the substrate W, without providing the nozzle 53a for the substrate detection unit 50.

The fluid m discharged from the nozzle 53a does not necessarily have to be the same as the treatment liquid, and may be a different type of liquid from the treatment liquid.

Further, the fluid m (for example, the developer) is discharged from the nozzle 53a constituting the fluid discharge portion 53, but the present invention is not limited thereto, and the gas may be discharged.

Further, the magnetic sensor 52a detects the magnet 2f and outputs the ON signal to the control unit 60, but an OFF signal may be output to the control unit 60 when the magnetic sensor 52a detects the magnet 2f, or an ON signal may be output to the control unit 60 when the magnetic sensor 52a does not detect the magnet 2 f.

The rotating moment is obtained by attaching the weight 2c to the swing plate 2, but the present invention is not limited to this, and a torsion spring may be interposed between the rotating shaft 1 and the frame 20 a.

Further, although the case where 1 conveying roller is configured by providing the plurality of rollers 31 on the rotating shaft 32 is exemplified, the present invention is not limited to this, and for example, 1 cylindrical conveying roller may be used for 1 rotating shaft 32.

Further, although the shower 41 is illustrated as being provided above and below the transfer path a1, the present invention is not limited to this, and may be provided only above the transfer path a1, for example, when only the upper surface of the substrate W is processed.

Further, each substrate detection unit 50 is configured to have a swinging portion 51 and the sensor portion 52 detects the swinging of the swinging portion 51, but the present invention is not limited to this, and for example, a rotating body that rotates by the fluid supplied from the fluid ejection portion 53 may be provided instead of the swinging portion 51, and the presence or absence of the rotation of the rotating body or the difference in the rotational speed of the rotating body may be detected to detect the substrate W.

Although several embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in other various forms, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and spirit of the invention, and are included in the invention described in the claims and the equivalent scope thereof.

Claims

1. A substrate processing apparatus is characterized in that,

comprising:

a conveying part for conveying the substrate along a conveying path;

the substrate detection unit includes: a discharge unit that discharges a fluid from a lower surface side of the substrate conveyed by the conveying unit; and a detection unit that detects arrival of the fluid from the ejection unit at a position facing the ejection unit with the conveyance path therebetween.

2. The substrate processing apparatus according to claim 1,

the fluid is the same treatment fluid as the treatment fluid.

3. The substrate processing apparatus according to claim 1 or 2,

the disclosed device is provided with:

a recovery pipe for recovering the treatment liquid used in the treatment section; and

a tank for storing the treatment liquid recovered by the recovery pipe,

the treatment section reuses the treatment liquid collected and stored in the tank for treatment in the treatment section.

4. The substrate processing apparatus according to claim 1 or 2,

the detection portion has a swinging portion and a sensor portion,

the swing portion swings by the fluid ejected from the ejection portion,

the sensor portion detects the swing of the swing portion.

5. The substrate processing apparatus according to claim 4,

the swing portion has a swing plate that swings about an axis parallel to the substrate conveyance direction.

6. The substrate processing apparatus according to claim 5,

the swing plate has a main body and a support plate supported at one end of the main body at an obtuse angle.

7. The substrate processing apparatus according to claim 6,

a weight is attached to the support plate, and a rotational moment on the substrate side centered on the shaft is applied to the swing plate by the weight.

8. The substrate processing apparatus according to claim 6,

the support plate is inclined toward the conveyance path with respect to a connection portion with the main body in a state where the fluid ejected from the ejection portion is blocked by the substrate and does not reach the support plate.

9. The substrate processing apparatus according to claim 1 or 2,

the ejection of the fluid from the ejection portion is started before the substrate reaches above the ejection portion.

10. The substrate processing apparatus according to claim 1 or 2,

the processing unit includes:

a plurality of showers provided along a transfer direction of the substrate; and

a liquid supply pipe through which the processing liquid supplied from the shower flows,

the ejection section has a nozzle connected to the liquid supply pipe.

11. The substrate processing apparatus according to claim 1 or 2,

the detection part has a rotating body which rotates by the fluid supplied from the ejection part,

the substrate detection unit detects the arrival of the fluid from the rotation state of the rotating body.