CN111732902A - 一种双面电池用抗极化封装胶膜及其制备方法 - Google Patents
一种双面电池用抗极化封装胶膜及其制备方法 Download PDFInfo
- Publication number
- CN111732902A CN111732902A CN202010627546.5A CN202010627546A CN111732902A CN 111732902 A CN111732902 A CN 111732902A CN 202010627546 A CN202010627546 A CN 202010627546A CN 111732902 A CN111732902 A CN 111732902A
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- Prior art keywords
- adhesive film
- double
- polarization
- parts
- packaging adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000002313 adhesive film Substances 0.000 title claims abstract description 43
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 27
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 18
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 10
- 239000011159 matrix material Substances 0.000 claims abstract description 7
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 6
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 6
- 239000007822 coupling agent Substances 0.000 claims abstract description 6
- 239000004611 light stabiliser Substances 0.000 claims abstract description 6
- 230000010287 polarization Effects 0.000 claims abstract description 6
- 150000002978 peroxides Chemical class 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims abstract description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 15
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 15
- 239000000155 melt Substances 0.000 claims description 10
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
- -1 di-tert-butylperoxy diisopropylbenzene Chemical compound 0.000 claims description 8
- 229920006213 ethylene-alphaolefin copolymer Polymers 0.000 claims description 8
- 238000003490 calendering Methods 0.000 claims description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 claims description 5
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 claims description 5
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 5
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 4
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- GNTDGMZSJNCJKK-UHFFFAOYSA-N divanadium pentaoxide Chemical compound O=[V](=O)O[V](=O)=O GNTDGMZSJNCJKK-UHFFFAOYSA-N 0.000 claims description 4
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical group 0.000 claims description 4
- 239000004408 titanium dioxide Substances 0.000 claims description 4
- KNSXNCFKSZZHEA-UHFFFAOYSA-N [3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical class C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C KNSXNCFKSZZHEA-UHFFFAOYSA-N 0.000 claims description 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 3
- AFNRRBXCCXDRPS-UHFFFAOYSA-N tin(ii) sulfide Chemical compound [Sn]=S AFNRRBXCCXDRPS-UHFFFAOYSA-N 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- PFNQVRZLDWYSCW-UHFFFAOYSA-N (fluoren-9-ylideneamino) n-naphthalen-1-ylcarbamate Chemical compound C12=CC=CC=C2C2=CC=CC=C2C1=NOC(=O)NC1=CC=CC2=CC=CC=C12 PFNQVRZLDWYSCW-UHFFFAOYSA-N 0.000 claims description 2
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 claims description 2
- RIQSLGAADRJNSG-UHFFFAOYSA-N 2-ethylhexoxycarbonyloxyperoxy 2-ethylhexyl carbonate Chemical compound CCCCC(CC)COC(=O)OOOOC(=O)OCC(CC)CCCC RIQSLGAADRJNSG-UHFFFAOYSA-N 0.000 claims description 2
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 2
- 239000005751 Copper oxide Substances 0.000 claims description 2
- 229910002475 Cu2ZnSnS4 Inorganic materials 0.000 claims description 2
- 229910002601 GaN Inorganic materials 0.000 claims description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 2
- 229910052980 cadmium sulfide Inorganic materials 0.000 claims description 2
- 239000002041 carbon nanotube Substances 0.000 claims description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 2
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 2
- 229910000431 copper oxide Inorganic materials 0.000 claims description 2
- MABAWBWRUSBLKQ-UHFFFAOYSA-N ethenyl-tri(propan-2-yloxy)silane Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)C=C MABAWBWRUSBLKQ-UHFFFAOYSA-N 0.000 claims description 2
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 claims description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052981 lead sulfide Inorganic materials 0.000 claims description 2
- 229940056932 lead sulfide Drugs 0.000 claims description 2
- 229910052976 metal sulfide Inorganic materials 0.000 claims description 2
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 230000000737 periodic effect Effects 0.000 claims description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 2
- 229910000077 silane Inorganic materials 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 238000010345 tape casting Methods 0.000 claims description 2
- DLSMLZRPNPCXGY-UHFFFAOYSA-N tert-butylperoxy 2-ethylhexyl carbonate Chemical compound CCCCC(CC)COC(=O)OOOC(C)(C)C DLSMLZRPNPCXGY-UHFFFAOYSA-N 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 238000004132 cross linking Methods 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 claims 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims 1
- 239000012528 membrane Substances 0.000 claims 1
- 150000004763 sulfides Chemical class 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 5
- 239000003292 glue Substances 0.000 description 13
- 239000000758 substrate Substances 0.000 description 7
- 239000012752 auxiliary agent Substances 0.000 description 6
- 238000005266 casting Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- OSIVCXJNIBEGCL-UHFFFAOYSA-N bis(2,2,6,6-tetramethyl-1-octoxypiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)N(OCCCCCCCC)C(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)N(OCCCCCCCC)C(C)(C)C1 OSIVCXJNIBEGCL-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- NZYMWGXNIUZYRC-UHFFFAOYSA-N hexadecyl 3,5-ditert-butyl-4-hydroxybenzoate Chemical compound CCCCCCCCCCCCCCCCOC(=O)C1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NZYMWGXNIUZYRC-UHFFFAOYSA-N 0.000 description 3
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 3
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 2
- XOUQAVYLRNOXDO-UHFFFAOYSA-N 2-tert-butyl-5-methylphenol Chemical compound CC1=CC=C(C(C)(C)C)C(O)=C1 XOUQAVYLRNOXDO-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical class C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- YWDBZVIHZORXHG-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-1-yl) decanedioate Chemical compound CC1(C)CCCC(C)(C)N1OC(=O)CCCCCCCCC(=O)ON1C(C)(C)CCCC1(C)C YWDBZVIHZORXHG-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- PKYCTRXXOZUHFK-UHFFFAOYSA-N tris(1,2,2,6,6-pentamethylpiperidin-4-yl) phosphite Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OP(OC1CC(C)(C)N(C)C(C)(C)C1)OC1CC(C)(C)N(C)C(C)(C)C1 PKYCTRXXOZUHFK-UHFFFAOYSA-N 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- ODJQKYXPKWQWNK-UHFFFAOYSA-L 3-(2-carboxylatoethylsulfanyl)propanoate Chemical compound [O-]C(=O)CCSCCC([O-])=O ODJQKYXPKWQWNK-UHFFFAOYSA-L 0.000 description 1
- SBVKVAIECGDBTC-UHFFFAOYSA-N 4-hydroxy-2-methylidenebutanamide Chemical compound NC(=O)C(=C)CCO SBVKVAIECGDBTC-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- OKOBUGCCXMIKDM-UHFFFAOYSA-N Irganox 1098 Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NCCCCCCNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 OKOBUGCCXMIKDM-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 1
- 229940088644 n,n-dimethylacrylamide Drugs 0.000 description 1
- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 description 1
- GLDOVTGHNKAZLK-UHFFFAOYSA-N n-octadecyl alcohol Natural products CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 238000013082 photovoltaic technology Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C09J123/0815—Copolymers of ethene with aliphatic 1-olefins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
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Abstract
本发明涉及封装胶膜技术领域,尤其是涉及一种具有提升双面组件抗PID性能的封装胶膜及其制备方法;其质量份组成如下:基体树脂100份、N型半导体0.1~20份、过氧化物交联剂0.01~2份、助交联剂0.1~10份、光稳定剂0.01~5份、抗氧剂剂0.05~5份;偶联剂0.1~5质量份;本发明中的双面电池用抗极化封装胶膜,该胶膜中添加有N型半导体材料,使得胶膜带有一定的电子,可中和双面电池在PID过程中产生的极化正电荷,从而避免PID的产生,显著提高了胶膜的抗PID性能;本发明中的双面电池用抗极化封装胶膜的制备方法,制备工艺简单,生产成本低。
Description
技术领域
本发明涉及封装胶膜技术领域,尤其是涉及一种具有提升双面组件抗PID性能封装胶膜及其制备方法。
背景技术
根据2020年国际光伏技术路线的预测(ITRPV),到2026年,双面电池的市场份额将超过50%。双面电池由于特殊的电池结构,组件在负偏压、85℃的温蒂,85%的湿度条件下,电池片表面会产生一层正电荷,称之为极化电荷,破坏了电池片的钝化效果,使少子与多子发生复合,造成电流及开压损失,从而导致功率损失(PID衰减)。
这种极化导致的PID衰减,目前主要在组件端通过封装胶膜解决。目前封装胶膜的量产方案,主要是在POE,或者是EVA/POE复合胶膜中添加带有双键的多官能团丙烯酸酯或丙烯酰胺,如专利CN109810639A中提到的,使用了N,N'-亚甲基双丙烯酰胺、羟甲基丙烯酰胺、羟乙基丙烯酰胺、羟乙基丙烯酰胺或N,N-二甲基丙烯酰胺中的一种或多种。CN109337599A中提到的多官能团的丙烯酸酯或甲基丙烯酸酯类助剂。CN110964447A专利中提到的乙氧化季戊四醇三丙烯酸酯、丙氧基化新戊二醇二丙烯酸酯、乙氧化三羟甲基丙烷三丙烯酸酯。
但是这类助剂都极性比较大,而POE极性小,因此相容性较差,在温度较低时易析出,导致胶膜使用过程存在滑移,气泡等情况。而在EVA胶膜中使用这类助剂,仍然无法满足双面电池组件的PID要求。
发明内容
本发明的目的是:克服现有技术中的不足,提供一种抗极化性能优异的双面电池用抗极化封装胶膜。
为解决上述技术问题,本发明采用的技术方案如下:
一种双面电池用抗极化封装胶膜,其质量份组成如下:基体树脂100份、N型半导体0.1~20份、过氧化物交联剂0.01~2份、助交联剂0.1~10份、光稳定剂0.01~5份、抗氧剂0.05~5份、偶联剂0.1~1质量份。
进一步的,所述基体树脂由乙烯-醋酸乙烯酯共聚物、乙烯-α烯烃共聚物、乙烯-甲基丙烯酸甲酯共聚物、聚乙烯醇缩丁醛中的任意一种或多种按照任意配比组成。
进一步的,所述乙烯-醋酸乙烯酯共聚物的熔体流动速率为2~27g/min,VA含量为26%~32%,乙烯-α烯烃共聚物熔体流动速率为5~25。
进一步的,所述N型半导体的粒径小于700nm。
进一步的,所述N型半导体的材料为金属氧化物,金属硫化物,或者是含有位于元素周期表IV族的复合物。
进一步的,所述N型半导体的材料选用二氧化钛,铟锡氧化物,掺铝氧化锌,氧化铜,氧化铬,五氧化二钒,三氧化二铁等金属氧化物,硫化镉,硫化锡,硫化铅,CdIn2S4,Cu2ZnSnS4等硫化物,碳纳米管,氮化镓,碳化硅,硒化锌,二氧化硅中的任意一种或多种按照任意配比组成。
进一步的,所述交联剂为过氧化二异丙苯、双叔丁基过氧化二异丙基苯、过氧化-2-乙基己基碳酸叔丁酯、2,5-二甲基-2,5-双(叔丁基过氧基)己烷、叔丁基过氧化碳酸-2-乙基己酯中的一种或几种。
进一步的,所述助交联剂为三丙烯基异氰脲酸酯、三羟甲基丙烷三丙烯酸酯、乙氧基化三羟甲基丙烷三丙烯酸酯、丙氧化三羟甲基丙烷三丙烯酸酯、季戊四醇三丙烯酸酯、季戊四醇四丙烯酸酯、乙氧化季戊四醇四丙烯酸酯中的一种或几种。
进一步的,所述光稳定剂为3,5-二叔丁基-4-羟基-苯甲酸十六烷基酯、双(2,2,6,6-四甲基哌啶基)癸二酸酯、三(1,2,2,6,6-五甲基-4-哌啶基)亚磷酸酯、双(1-辛氧基-2,2,6,6-四甲基-4-哌啶基)癸二酸酯中的一种或几种。
进一步的,所述抗氧剂为四[β-(3,5-二叔丁基-4-羟基苯基)丙酸]季戊四醇酯、β-(3,5-二叔丁基-4-羟基苯基)丙酸正十八碳醇酯、N,N'-双-(3-(3,5-二叔丁基-4-羟基苯基)丙酰基)己二胺、2,6-二叔丁基对甲酚、4,4'-硫代双(3-甲基-6-叔丁基苯酚)、硫代二丙酸二月桂酸酯、三(2,4-二叔丁基苯基)亚磷酸酯中的一种或几种。
进一步的,所述偶联剂为乙烯基三乙氧基硅烷、乙烯基三甲氧基硅烷、乙烯基三(b-甲氧基乙氧基)硅烷、γ-甲基丙烯酰氧基丙基三甲氧基硅烷、乙烯基三异丙氧基硅烷中的一种或几种
本发明的另一个目的是:克服现有技术中的不足,提供一种生产工艺简单、生产成本低的双面电池用抗计划封装胶膜的制备方法。
为解决上述技术问题,本发明采用的技术方案如下:
一种双面电池用抗极化封装胶膜的制备方法,所述制备方法如下:将基体树脂、N型半导体、过氧化物交联剂、助交联剂、光稳定剂、抗氧剂、偶联剂混合均匀后,用单螺杆挤出机挤出流延成膜,或是压延成膜,所述胶膜厚度优选为50~800μm。
采用本发明的技术方案的有益效果是:
本发明中的双面电池用抗极化封装胶膜,该胶膜中添加有N型半导体材料,使得胶膜带有一定的电子,可中和双面电池在PID过程中产生的极化正电荷,从而避免PID的产生,显著提高了胶膜的抗PID性能。
本发明中的双面电池用抗极化封装胶膜,通过上述原理,可使用乙烯-醋酸乙烯酯的共聚物作为主体树脂,满足双面双玻的抗PID需求,这是目前其它厂家无法实现的。使用乙烯-醋酸乙烯酯作为主体树脂,解决了助剂相容性差的问题,可降低光伏组件制造过程中的气泡、串偏移等不良,提高光伏组件的层压良率。
本发明中的双面电池用抗极化封装胶膜的制备方法,制备工艺简单,生产成本低,适合工业化生产。
具体实施方式
下面的实施例可以使本专业技术人员更全面地理解本发明,但是这些实施例不是对本发明保护范围的限制。此处所称的“一个实施例”或“实施例”是指可包含于本发明至少一个实现方式中的特定特征、结构或特性。在本说明书中不同地方出现的“在一个实施例中”并非均指同一个实施例,也不是单独的或选择性的与其他实施例互相排斥的实施例。
实施例1
本实施例提供的胶膜基材为乙烯-醋酸乙烯酯共聚物,所述共聚物的熔体流动速率为25g/10min,醋酸乙烯酯的质量含量为28%,胶膜基材乙烯-醋酸乙烯酯共聚物的质量为100份,二氧化钛半导体材料的添加量为7质量份,硫化锡3质量份,其它助剂含量如下:过氧化二异丙苯为0.5质量份;乙氧基化三羟甲基丙烷三丙烯酸酯为0.4质量份;3,5-二叔丁基-4-羟基-苯甲酸十六烷基酯为0.04质量份;四[β-(3,5-二叔丁基-4-羟基苯基)丙酸]季戊四醇酯为0.05质量份;乙烯基三乙氧基硅烷为0.6质量份。
将上述物质预混合后用单螺杆挤出机挤出流延成膜,或是压延成膜,胶膜厚度为50~800μm,本实施例中胶膜厚度为500μm。
实施例2
本实施例提供的胶膜基材为乙烯-醋酸乙烯酯共聚物,所述共聚物的熔体流动速率为20g/10min,醋酸乙烯酯含量28%。胶膜基材乙烯-醋酸乙烯酯共聚物的质量为100份,掺铝氧化锌半导体材料的添加量为13质量份,其它助剂含量如下:双叔丁基过氧化二异丙基苯为0.6质量份;丙氧化三羟甲基丙烷三丙烯酸酯为0.3质量份;双(2,2,6,6-四甲基哌啶基)癸二酸酯为0.03质量份;β-(3,5-二叔丁基-4-羟基苯基)丙酸正十八碳醇酯为0.07质量份;乙烯基三甲氧基硅烷为0.9质量份。
将上述物质预混合后用单螺杆挤出机挤出流延成膜,或是压延成膜,胶膜厚度为50~800μm,本实施例中胶膜厚度为100μm。
实施例3
本实施例提供的胶膜基材为乙烯-α烯烃共聚物,所述共聚物的熔体流动速率为15g/10min。添加10质量份二氧化钛半导体材料。其它助剂含量如下:2,5-二甲基-2,5-双(叔丁基过氧基)己烷为0.4质量份;季戊四醇三丙烯酸酯为0.3质量份;三(1,2,2,6,6-五甲基-4-哌啶基)亚磷酸酯为0.05质量份;N,N'-双-(3-(3,5-二叔丁基-4-羟基苯基)丙酰基)己二胺为0.06质量份;;乙烯基三(b-甲氧基乙氧基)硅烷为0.4质量份。
将上述物质预混合后用单螺杆挤出机挤出流延成膜,或是压延成膜,胶膜厚度为50~800μm,本实施例中胶膜厚度为800μm。
实施例4
本实施例提供的胶膜基材为乙烯-α烯烃共聚物,所述共聚物的熔体流动速率为10g/10min。添加11质量份铟锡氧化物半导体材料,3质量份的氮化硅。其它助剂含量如下:2,5-二甲基-2,5-双(叔丁基过氧基)己烷为0.65质量份;乙氧化季戊四醇四丙烯酸酯为0.3质量份;双(1-辛氧基-2,2,6,6-四甲基-4-哌啶基)癸二酸酯为0.03质量份;4,4'-硫代双(3-甲基-6-叔丁基苯酚)为0.09质量份;γ-甲基丙烯酰氧基丙基三甲氧基硅烷为0.6质量份。
将上述物质预混合后用单螺杆挤出机挤出流延成膜,或是压延成膜,胶膜厚度为50~800μm,本实施例中胶膜厚度为多少50μm。
对比例1
本实施例提供的胶膜基材为乙烯-醋酸乙烯酯共聚物,所述树脂的熔体流动速率为25g/10min,醋酸乙烯酯的质量含量为28%,胶膜基材乙烯-醋酸乙烯酯共聚物的质量为100份,其它助剂含量如下:过氧化二异丙苯为0.5质量份;乙氧基化三羟甲基丙烷三丙烯酸酯为0.4质量份;3,5-二叔丁基-4-羟基-苯甲酸十六烷基酯为0.04质量份;四[β-(3,5-二叔丁基-4-羟基苯基)丙酸]季戊四醇酯为0.05质量份;乙烯基三乙氧基硅烷为0.6质量份。
将上述物质预混合后用单螺杆挤出机挤出流延成膜,或是压延成膜,本实施例中胶膜厚度为多500μm。
对比例2
本实施例提供的胶膜基材为乙烯-α烯烃共聚物,所述乙烯-α烯烃共聚物的熔体流动速率为10g/10min。其它助剂含量如下:2,5-二甲基-2,5-双(叔丁基过氧基)己烷为0.65质量份;三丙烯基异氰脲酸酯为0.3质量份;双(1-辛氧基-2,2,6,6-四甲基-4-哌啶基)癸二酸酯为0.03质量份;4,4'-硫代双(3-甲基-6-叔丁基苯酚)为0.09质量份;γ-甲基丙烯酰氧基丙基三甲氧基硅烷为0.2质量份。
将上述物质预混合后用单螺杆挤出机挤出流延成膜,或是压延成膜,本实施例中胶膜厚度为500μm。
本发明中的流延成膜和压延成膜的具体工艺采用现有技术,本发明中不再赘述。
对实施例1-4以及对比例中制得的封装胶膜进行性能检测,包括拉伸强度、断裂伸长率、可见区透光率、胶膜与玻璃的剥离强度、紫外老化黄变指数以及PID后衰减,具体性能测试数据见表1。
表1
实验项目 | 实施例1 | 实施例2 | 实施例3 | 实施例4 | 对比例2 | 对比例1 | 测试标准或方法 |
拉伸强度/MPa | 10.73 | 9.46 | 20.53 | 8.52 | 8.52 | 9.15 | GB/T13022-1991 |
断裂伸长率/% | 871.54 | 810.32 | 692.88 | 892.10 | 892.10 | 831.76 | GB/T13022-1991 |
可见区透光率/% | >90 | >90 | >90 | >90 | >90 | >89 | ASTM D1003-13 |
胶膜与玻璃的剥离强度(N/cm) | 201.10 | 223.39 | 183.41 | 267.73 | 267.73 | 116.04 | ASTMD903-98 |
紫外老化黄变指数(ΔYI) | <2 | <1 | <2 | <1 | <1 | <1 | GBT 16422.2-2014 |
PID后衰减 | 4.3% | 3.7% | 2.3% | 3.0% | 22% | 7.8% | IEC62804-2015 |
综述所述,在体系中加入N型半导体粉末,可利用N型半导体产生的电子,中和双面电池在PID过程中产生的极化正电荷,从而避免PID的产生,显著提高了胶膜的抗PID性能,该方法不仅适用于乙烯-α烯烃共聚物,同样适用于乙烯-醋酸乙烯酯共聚物。而且由表1可以看出,当胶膜基材选用EVA且不添加N型半导体材料时,封装胶膜的PID衰减比较厉害,显然是不适用于双面电池组件的。
以上述依据本发明的理想实施例为启示,通过上述的说明内容,相关工作人员完全可以在不偏离本项发明技术思想的范围内,进行多样的变更以及修改。凡在本发明的精神和原则之内,所做的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。本项发明的技术性范围并不局限于说明书上的内容,必须要根据权利要求范围来确定其技术性范围。
Claims (9)
1.一种双面电池用抗极化封装胶膜,其特征在于:其质量份组成如下:基体树脂100份、N型半导体0.1~20份、过氧化物交联剂0.01~2份、助交联剂0.1~10份、光稳定剂0.01~5份、抗氧剂0.05~5份、偶联剂0.1~1质量份。
2.根据权利要求1所述的一种双面电池用抗极化封装胶膜,其特征在于:所述基体树脂由乙烯-醋酸乙烯酯共聚物、乙烯-α烯烃共聚物、乙烯-甲基丙烯酸甲酯共聚物、聚乙烯醇缩丁醛中的任意一种或多种按照任意配比组成。
3.根据权利要求2所述的一种双面电池用抗极化封装胶膜,其特征在于:所述乙烯-醋酸乙烯酯共聚物的熔体流动速率为2~27g/min,VA含量为26%~32%,乙烯-α烯烃共聚物熔体流动速率为5~25g/min。
4.根据权利要求1所述的一种双面电池用抗极化封装胶膜,其特征在于:所述N型半导体的粒径小于700nm。
5.根据权利要求1所述的一种双面电池用抗极化封装胶膜,其特征在于:所述N型半导体的材料为金属氧化物,金属硫化物,或者是含有位于元素周期表IV族的复合物
根据权利要求5所述的一种双面电池用抗极化封装胶膜,其特征在于:所述N型半导体的材料选用二氧化钛,铟锡氧化物,掺铝氧化锌,氧化铜,氧化铬,五氧化二钒,三氧化二铁等金属氧化物,硫化镉,硫化锡,硫化铅,CdIn2S4,Cu2ZnSnS4等硫化物,碳纳米管,氮化镓,碳化硅,硒化锌,二氧化硅中的任意一种或多种按照任意配比组成。
6.根据权利1所述的一种双面电池用抗极化封装胶膜,其特征在于:所述交联剂为过氧化二异丙苯、双叔丁基过氧化二异丙基苯、过氧化-2-乙基己基碳酸叔丁酯、2,5-二甲基-2,5-双(叔丁基过氧基)己烷、叔丁基过氧化碳酸-2-乙基己酯中的一种或几种。
7.根据权利1所述的一种双面电池用抗极化封装胶膜,其特征在于,所述助交联剂为三丙烯基异氰脲酸酯、三羟甲基丙烷三丙烯酸酯、乙氧基化三羟甲基丙烷三丙烯酸酯、丙氧化三羟甲基丙烷三丙烯酸酯、季戊四醇三丙烯酸酯、季戊四醇四丙烯酸酯、乙氧化季戊四醇四丙烯酸酯中的一种或几种。
8.根据权利1所述的一种双面电池用抗极化封装胶膜,其特征在于,所述偶联剂为乙烯基三乙氧基硅烷、乙烯基三甲氧基硅烷、乙烯基三(b-甲氧基乙氧基) 硅烷、γ-甲基丙烯酰氧基丙基三甲氧基硅烷、乙烯基三异丙氧基硅烷中的一种或几种。
9.一种双面电池用抗极化封装胶膜的制备方法,其特征在于:所述制备方法如下:将基体树脂、N型半导体、过氧化物交联剂、助交联剂、交联促进剂、光稳定剂、抗氧剂剂混合均匀后,用单螺杆挤出机挤出流延成膜,或是压延成膜,胶膜厚度为50~800μm。
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