CN111683469A - PCB manufacturing method for improving open circuit of blind hole - Google Patents
PCB manufacturing method for improving open circuit of blind hole Download PDFInfo
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- CN111683469A CN111683469A CN202010461328.9A CN202010461328A CN111683469A CN 111683469 A CN111683469 A CN 111683469A CN 202010461328 A CN202010461328 A CN 202010461328A CN 111683469 A CN111683469 A CN 111683469A
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- manufacturing
- blind hole
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a PCB manufacturing method for improving open circuit of blind holes, which comprises the following steps: s1, cutting an inner layer and manufacturing a circuit; s2, browning and laminating; and S3, cutting the inner blind hole layer, drilling, depositing copper, electroplating and manufacturing a circuit. The step S1 further includes etching and post-processing. The invention provides a new manufacturing scheme for a blind hole plate laminated by PP with small glue flow quantity, such as Rogers 4450PP and the like. The production process of the board is complex, special boards are generally used, the manufacturing cost is high, the production process of the board can be optimized, the product yield is improved, and the production cost is saved.
Description
Technical Field
The invention belongs to the technical field of circuit board processing, and particularly relates to a PCB manufacturing method for improving open circuit of blind holes.
Background
In the prior art, for manufacturing a PCB blind hole plate by using rocky 4450PP or other PP with a relatively small glue content for laminating and filling, a positive sheet process is generally adopted in the industry, namely: drilling, copper deposition, plate electricity, circuit, pattern electricity, etching and post-processing. However, the manufacturing method has the problems that the glue content of Rogers 4450PP and the like is low, when glue is pressed and filled, glue in partial blind holes is not filled, blind hole depressions exist, bubbles are formed in the depressions during tin electroplating, tin cannot be plated, and open circuits of the blind holes occur after etching or open circuits occur after the blind holes are etched and copper at the blind holes is bitten and is thin in post processing or application.
Disclosure of Invention
In view of the above, the present invention provides a method for manufacturing a PCB capable of improving open circuit of blind holes, which reduces the problem of open circuit of blind holes after etching due to the blind holes after lamination being recessed and the blind holes after etching occurring due to the fact that tin is not plated at the recessed position during tin electroplating; the qualification rate of the product is improved.
The technical scheme of the invention is as follows:
a PCB manufacturing method for improving open circuit of blind holes is characterized by comprising the following steps:
s1, cutting an inner layer and manufacturing a circuit;
s2, browning and laminating;
and S3, cutting the inner blind hole layer, drilling, depositing copper, electroplating and manufacturing a circuit.
Further, the step S1 includes etching and post-processing.
Further, the method comprises the following specific steps: cutting the inner layer, manufacturing a circuit pattern of the inner core plate for the first time, then pressing the inner core plate, and pressing the core plates with the layers to be conducted; brown-oxidizing the core plate of the inner layer; cutting an inner blind hole layer, mechanically drilling the inner blind hole, wherein the inner blind hole is formed from the surface layer to the layer to be conducted, and carrying out metallization treatment on the blind hole and the inner blind hole; plating copper on the inner wall of the inner blind hole, and then performing inner hole plating to ensure that the thickness of copper in the inner blind hole meets the product requirement; and manufacturing the inner layer circuit for the second time, and etching to manufacture the circuit of the core plate layer at the bottom of the inner layer blind hole.
Further, the method also comprises the step of slicing and analyzing the copper thickness in the inner blind hole.
Furthermore, the thickness of the hole copper is 10-50 μm.
Further, before the inner layer plated hole, the method further comprises the step of manufacturing an inner layer plated hole pattern, wherein the inner layer plated hole pattern is used for covering the position which does not need to be plated with copper with a dry film, and the inner layer blind hole which needs to be plated with copper is exposed through windowing.
Further, the second time of inner layer circuit manufacturing is carried out, a negative film is used for pattern transfer, and the circuit is compensated through the negative film according to the thickness of the surface copper.
Further, the line compensation amount is 0.05-0.15 mm.
Furthermore, the inner layer circuit is manufactured by completing the exposure of the inner layer circuit by a 6-grid or 21-grid exposure ruler, and etching the circuit graph by adjusting etching parameters according to the thickness of the copper layer after development.
The invention reduces the blind hole plate sinking after lamination, and the open circuit problem of the etched blind hole due to the fact that tin is not plated at the sinking position during the tin electroplating of the picture; the qualification rate of the product is improved. The invention has simple operation and is convenient for the field operation of the board.
The invention provides a new manufacturing scheme for a blind hole plate laminated by PP with small glue flow quantity, such as Rogers 4450PP and the like. The production process of the board is complex, special boards are generally used, the manufacturing cost is high, the production process of the board can be optimized, the product yield is improved, and the production cost is saved.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Example 1
A PCB manufacturing method for improving open circuit of blind holes is characterized by comprising the following steps:
s1, cutting an inner layer and manufacturing a circuit;
s2, browning and laminating;
and S3, cutting the inner blind hole layer, drilling, depositing copper, electroplating and manufacturing a circuit.
Further, the step S1 includes etching and post-processing.
Further, the method comprises the following specific steps: cutting the inner layer, manufacturing a circuit pattern of the inner core plate for the first time, then pressing the inner core plate, and pressing the core plates with the layers to be conducted; brown-oxidizing the core plate of the inner layer; cutting an inner blind hole layer, mechanically drilling the inner blind hole, wherein the inner blind hole is formed from the surface layer to the layer to be conducted, and carrying out metallization treatment on the blind hole and the inner blind hole; plating copper on the inner wall of the inner blind hole, and then performing inner hole plating to ensure that the thickness of copper in the inner blind hole meets the product requirement; and manufacturing the inner layer circuit for the second time, and etching to manufacture the circuit of the core plate layer at the bottom of the inner layer blind hole.
Further, the method also comprises the step of slicing and analyzing the copper thickness in the inner blind hole.
Further, the hole copper thickness was 30 μm.
Further, before the inner layer plated hole, the method further comprises the step of manufacturing an inner layer plated hole pattern, wherein the inner layer plated hole pattern is used for covering the position which does not need to be plated with copper with a dry film, and the inner layer blind hole which needs to be plated with copper is exposed through windowing.
Further, the second time of inner layer circuit manufacturing is carried out, a negative film is used for pattern transfer, and the circuit is compensated through the negative film according to the thickness of the surface copper.
Further, the line compensation amount is 0.1 mm.
Furthermore, the inner layer circuit is manufactured by using a 6-grid exposure ruler to complete the exposure of the inner layer circuit, and etching parameters are adjusted according to the thickness of a copper layer after development to etch a circuit pattern.
The invention reduces the blind hole plate sinking after lamination, and the open circuit problem of the etched blind hole due to the fact that tin is not plated at the sinking position during the tin electroplating of the picture; the qualification rate of the product is improved. The invention has simple operation and is convenient for the field operation of the board.
The invention provides a new manufacturing scheme for a blind hole plate laminated by PP with small glue flow quantity, such as Rogers 4450PP and the like. The production process of the board is complex, special boards are generally used, the manufacturing cost is high, the production process of the board can be optimized, the product yield is improved, and the production cost is saved.
Example 2
A PCB manufacturing method for improving open circuit of blind holes is characterized by comprising the following steps:
s1, cutting an inner layer and manufacturing a circuit;
s2, browning and laminating;
and S3, cutting the inner blind hole layer, drilling, depositing copper, electroplating and manufacturing a circuit.
Further, the step S1 includes etching and post-processing.
Further, the method comprises the following specific steps: cutting the inner layer, manufacturing a circuit pattern of the inner core plate for the first time, then pressing the inner core plate, and pressing the core plates with the layers to be conducted; brown-oxidizing the core plate of the inner layer; cutting an inner blind hole layer, mechanically drilling the inner blind hole, wherein the inner blind hole is formed from the surface layer to the layer to be conducted, and carrying out metallization treatment on the blind hole and the inner blind hole; plating copper on the inner wall of the inner blind hole, and then performing inner hole plating to ensure that the thickness of copper in the inner blind hole meets the product requirement; and manufacturing the inner layer circuit for the second time, and etching to manufacture the circuit of the core plate layer at the bottom of the inner layer blind hole.
Further, the method also comprises the step of slicing and analyzing the copper thickness in the inner blind hole.
Further, the thickness of the copper via was 15 μm.
Further, before the inner layer plated hole, the method further comprises the step of manufacturing an inner layer plated hole pattern, wherein the inner layer plated hole pattern is used for covering the position which does not need to be plated with copper with a dry film, and the inner layer blind hole which needs to be plated with copper is exposed through windowing.
Further, the second time of inner layer circuit manufacturing is carried out, a negative film is used for pattern transfer, and the circuit is compensated through the negative film according to the thickness of the surface copper.
Further, the line compensation amount is 0.05 mm.
Furthermore, the inner layer circuit is manufactured by using a 6-grid exposure ruler to complete the exposure of the inner layer circuit, and etching parameters are adjusted according to the thickness of a copper layer after development to etch a circuit pattern.
The invention reduces the blind hole plate sinking after lamination, and the open circuit problem of the etched blind hole due to the fact that tin is not plated at the sinking position during the tin electroplating of the picture; the qualification rate of the product is improved. The invention has simple operation and is convenient for the field operation of the board.
The invention provides a new manufacturing scheme for a blind hole plate laminated by PP with small glue flow quantity, such as Rogers 4450PP and the like. The production process of the board is complex, special boards are generally used, the manufacturing cost is high, the production process of the board can be optimized, the product yield is improved, and the production cost is saved.
Example 3
A PCB manufacturing method for improving open circuit of blind holes is characterized by comprising the following steps:
s1, cutting an inner layer and manufacturing a circuit;
s2, browning and laminating;
and S3, cutting the inner blind hole layer, drilling, depositing copper, electroplating and manufacturing a circuit.
Further, the step S1 includes etching and post-processing.
Further, the method comprises the following specific steps: cutting the inner layer, manufacturing a circuit pattern of the inner core plate for the first time, then pressing the inner core plate, and pressing the core plates with the layers to be conducted; brown-oxidizing the core plate of the inner layer; cutting an inner blind hole layer, mechanically drilling the inner blind hole, wherein the inner blind hole is formed from the surface layer to the layer to be conducted, and carrying out metallization treatment on the blind hole and the inner blind hole; plating copper on the inner wall of the inner blind hole, and then performing inner hole plating to ensure that the thickness of copper in the inner blind hole meets the product requirement; and manufacturing the inner layer circuit for the second time, and etching to manufacture the circuit of the core plate layer at the bottom of the inner layer blind hole.
Further, the method also comprises the step of slicing and analyzing the copper thickness in the inner blind hole.
Further, the hole copper thickness was 40 μm.
Further, before the inner layer plated hole, the method further comprises the step of manufacturing an inner layer plated hole pattern, wherein the inner layer plated hole pattern is used for covering the position which does not need to be plated with copper with a dry film, and the inner layer blind hole which needs to be plated with copper is exposed through windowing.
Further, the second time of inner layer circuit manufacturing is carried out, a negative film is used for pattern transfer, and the circuit is compensated through the negative film according to the thickness of the surface copper.
Further, the line compensation amount is 0.15 mm.
Furthermore, the inner layer circuit is manufactured by using a 21-grid exposure ruler to complete the exposure of the inner layer circuit, and etching parameters are adjusted according to the thickness of a copper layer after the development to etch a circuit pattern.
The invention reduces the blind hole plate sinking after lamination, and the open circuit problem of the etched blind hole due to the fact that tin is not plated at the sinking position during the tin electroplating of the picture; the qualification rate of the product is improved. The invention has simple operation and is convenient for the field operation of the board.
The invention provides a new manufacturing scheme for a blind hole plate laminated by PP with small glue flow quantity, such as Rogers 4450PP and the like. The production process of the board is complex, special boards are generally used, the manufacturing cost is high, the production process of the board can be optimized, the product yield is improved, and the production cost is saved.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art in the field.
Claims (9)
1. A PCB manufacturing method for improving open circuit of blind holes is characterized by comprising the following steps:
s1, cutting an inner layer and manufacturing a circuit;
s2, browning and laminating;
and S3, cutting the inner blind hole layer, drilling, depositing copper, electroplating and manufacturing a circuit.
2. The method for manufacturing a PCB with an improved open via of claim 1, wherein the step S1 further comprises etching and post-processing.
3. The method for manufacturing a PCB with an improved open circuit of blind holes according to claim 2, comprising the following specific steps: cutting the inner layer, manufacturing a circuit pattern of the inner core plate for the first time, then pressing the inner core plate, and pressing the core plates with the layers to be conducted; brown-oxidizing the core plate of the inner layer; cutting an inner blind hole layer, mechanically drilling the inner blind hole, wherein the inner blind hole is formed from the surface layer to the layer to be conducted, and carrying out metallization treatment on the blind hole and the inner blind hole; plating copper on the inner wall of the inner blind hole, and then performing inner hole plating to ensure that the thickness of copper in the inner blind hole meets the product requirement; and manufacturing the inner layer circuit for the second time, and etching to manufacture the circuit of the core plate layer at the bottom of the inner layer blind hole.
4. The method of claim 3, further comprising the step of slicing the copper thickness in the inner layer via.
5. The method of claim 4, wherein the via copper thickness is 10-50 μm.
6. The method for manufacturing a PCB with an improved blind via opening as claimed in claim 5, further comprising a step of manufacturing an inner layer plated via pattern before the inner layer plated via, wherein the inner layer plated via pattern is used for covering the position without copper plating with a dry film, and the inner layer blind via opening needing copper plating is exposed.
7. The method for manufacturing a PCB with an improved blind via opening as claimed in claim 6, wherein the second inner layer circuit manufacturing uses a negative film for pattern transfer, and the negative film compensates the circuit according to the thickness of the surface copper.
8. The method for manufacturing a PCB with an improved open circuit of blind holes as claimed in claim 7, wherein the line compensation amount is 0.05-0.15 mm.
9. The method of claim 8, wherein the inner layer circuit is exposed with 6-grid or 21-grid exposure rule, and the etching parameters are adjusted according to the thickness of copper layer after developing to etch the circuit pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010461328.9A CN111683469A (en) | 2020-05-27 | 2020-05-27 | PCB manufacturing method for improving open circuit of blind hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010461328.9A CN111683469A (en) | 2020-05-27 | 2020-05-27 | PCB manufacturing method for improving open circuit of blind hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111683469A true CN111683469A (en) | 2020-09-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010461328.9A Pending CN111683469A (en) | 2020-05-27 | 2020-05-27 | PCB manufacturing method for improving open circuit of blind hole |
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| Country | Link |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020108776A1 (en) * | 2001-02-13 | 2002-08-15 | Fujitsu Limited | Multilayer printed circuit board and method of making the same |
| US20040080052A1 (en) * | 2002-10-24 | 2004-04-29 | Advanced Semiconductor Engineering, Inc. | Circuit substrate and fabrication method thereof |
| CN105263274A (en) * | 2015-10-28 | 2016-01-20 | 深圳崇达多层线路板有限公司 | Manufacture method of high density interconnection board |
| CN105848419A (en) * | 2016-05-06 | 2016-08-10 | 鹤山市中富兴业电路有限公司 | Manufacturing method for circuit board having POFV resin plug via and unfilled laser via |
-
2020
- 2020-05-27 CN CN202010461328.9A patent/CN111683469A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020108776A1 (en) * | 2001-02-13 | 2002-08-15 | Fujitsu Limited | Multilayer printed circuit board and method of making the same |
| US20040080052A1 (en) * | 2002-10-24 | 2004-04-29 | Advanced Semiconductor Engineering, Inc. | Circuit substrate and fabrication method thereof |
| CN105263274A (en) * | 2015-10-28 | 2016-01-20 | 深圳崇达多层线路板有限公司 | Manufacture method of high density interconnection board |
| CN105848419A (en) * | 2016-05-06 | 2016-08-10 | 鹤山市中富兴业电路有限公司 | Manufacturing method for circuit board having POFV resin plug via and unfilled laser via |
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Application publication date: 20200918 |
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| RJ01 | Rejection of invention patent application after publication |