CN111675491A - Processing method of infrared narrow-band coated filter with extremely small size - Google Patents
Processing method of infrared narrow-band coated filter with extremely small size Download PDFInfo
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- CN111675491A CN111675491A CN202010518121.0A CN202010518121A CN111675491A CN 111675491 A CN111675491 A CN 111675491A CN 202010518121 A CN202010518121 A CN 202010518121A CN 111675491 A CN111675491 A CN 111675491A
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/001—General methods for coating; Devices therefor
- C03C17/002—General methods for coating; Devices therefor for flat glass, e.g. float glass
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/15—Deposition methods from the vapour phase
- C03C2218/154—Deposition methods from the vapour phase by sputtering
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Abstract
The invention belongs to the technical field of optical element processing, and particularly relates to a processing method of an infrared narrow-band coated optical filter with an extremely small size. The optical filter prepared by the method has high yield (the edge breakage reject ratio is controlled within 3% approximately), is simple to operate (only film pasting, glue dissolving and film uncovering are needed), and can perfectly avoid the problem of substrate cracking caused by the fact that a glass substrate is too thin and cannot bear large coating stress; the problem of cracking of the substrate in the film coating or film discharging process caused by large warping due to too thick film layer in the single-side film coating and film forming process of the substrate can be perfectly solved, the design limitation of the film system is broken through, and the film layer is deposited on the side surface, so that the interference of external light rays can be prevented.
Description
[ technical field ] A method for producing a semiconductor device
The invention belongs to the technical field of optical element processing, and particularly relates to a processing method of an infrared narrow-band coated filter with a very small size.
[ background of the invention ]
In recent two years, the TWS real wireless Bluetooth headset market is gradually heated, the shipment volume is doubled and increased all the time, according to IDC data, the shipment volume in 2018 reaches 4,600 ten thousand parts, and the average annual composite increase reaches 124%. In the third quarter before 2019, the worldwide TWS headset shipment reaches 7,750 ten thousands, which is far beyond the last year and the whole industry shows high popularity and high growth. The high growth of the market has also brought about an increasingly intense competition, and the choice of products will be influenced by important parameters, one of which is the battery endurance. How to prolong the service time after charging as much as possible, one way is to automatically stop playing when the earplug is taken off and start again when the earplug is worn, and if the function needs to be realized, a close-range proximity sensing technology is needed. The optical filter component is an indispensable extremely-small infrared narrow-band optical filter component of the close-range proximity sensing module, and has wide market space. In addition, in the smart phone, an Infrared (IR) proximity sensor module may also use an infrared narrowband coated filter.
The infrared narrow-band film-coating filter mainly uses the central wavelengths of 850nm, 960nm, 1100nm, 1380nm and the like. After the coating is completed, most manufacturers preferably perform cutting by Laser cutting with a wavelength of 1064nm for yield and yield considerations. If a customer requires optical filters with spectral center wavelengths of 850nm, 960nm and 1380nm, in combination with the high requirements of the customer on optical performance of the optical filters, when a manufacturer designs a film system, in order to meet the high OD requirement in a cut-off band, the optical characteristic that light with wavelength of 1064nm can penetrate through has to be abandoned, which directly results in that a Laser cutting processing technology cannot be adopted, and Disco cutter wheels have to be adopted for cutting. In order to improve the yield, the optical filter manufacturer uses a thin blade, for example, a blade with a thickness of 0.15mm for cutting. Taking the example of cutting 150 mm-150 mm coated large sheets into 1 mm-1 mm small sheets, if a Laser cutting technology is adopted, the output of the finished product is about 22500pcs, while the output of the finished product cut by a Disco cutter wheel is about 16800-17000 pcs, the output of the finished product cut by the latter method is only about 75% of that of the former Laser cutting method, and the output of the small sheet finished product is about 75%The rate is low. In addition, the infrared narrow-band coating film layer generally adopts high-temperature sputtering coating SiH4And SiO2The film layer is thick and the stress is large, the cutter wheel is directly cut to the surface of the optical filter at a high rotating speed by using Disco cutter wheel cutting, the optical filter is cracked (as shown in figure 1) and the edge breakage problem (as shown in figure 2) is caused after cutting, and the yield is lower compared with the laser cutting. The Disco cutting process needs to adopt a blade, a knife sharpening plate, DI water auxiliary materials and the like, and the laser cutting does not need the auxiliary materials, so that the cutting cost is lower.
Due to the trend of miniaturization of the TWS true wireless bluetooth headset, the optical filter is inevitably required to be miniaturized and thinned. The optical filter industry generally adopts a processing technology as shown in fig. 5 for processing an infrared narrowband coated filter.
In the glass scribing process, each filter manufacturer typically scribes the glass stock into either medium (77mm by 77mm) or large (150 mm, 200mm) sheets based on product yield and sputter coating efficiency considerations. In the process of sputtering the A surface of the coating film, the deposition thickness of the infrared narrow-band coating film layer is more than 3000nm, and in order to ensure good reliability test, high temperature 120-180 ℃ coating film is adopted, the stress generated on the surface of the glass substrate in the coating process of the processing technology is extremely large, only the substrate with the thickness of 0.21mm or more can be processed, and if the thickness of the glass substrate is as thin as 0.145mm or less, the glass can be directly crushed in the coating process or in the film-discharging process after the coating is finished. In general, this process has not been able to achieve the processing of thinner ir narrowband filters.
Aiming at the existing process of coating film and then carrying out Disco knife flywheel cutting or Laser cutting, the side surface of the glass is in a state without film layer coverage after cutting, so that in the working process of optical action of the optical filter, external light can very easily enter the optical filter through the side surface, and the optical performance is influenced (as shown in figures 3 and 4).
In combination with the above three technical problems, a processing technology specially for an infrared narrow-band coated filter with a very small size is urgently needed to be developed so as to meet the high requirement of an electronic device on the quality of the filter.
[ summary of the invention ]
In order to solve the technical problem, the invention provides a processing method of an infrared narrow-band coated filter with an extremely small size.
In order to achieve the purpose, the invention provides the following technical scheme: a processing method of an infrared narrow-band coated filter with an extremely small size comprises the following steps:
s1, selecting a chip: selecting a glass substrate, carrying out ultrasonic cleaning on the glass substrate, and then attaching a common UV adhesive tape on the glass substrate;
s2, cutting: carrying out laser cutting on the glass substrate, and breaking the glass substrate into a plurality of small glass pieces;
s3, expanding the membrane: spreading a common UV adhesive tape adhered with a plurality of small glass pieces to expand the space between the small glass pieces;
s4, single-side film coating:
s4.1, fixing a plurality of small glass pieces on a first substrate bearing disc through a first double-sided high-temperature-resistant UV (ultraviolet) adhesive tape;
s4.2, glue dissolving adhesive tape: debonding the common UV adhesive tape, and removing the common UV adhesive tape from the plurality of glass chips;
s4.3, sputtering coating: carrying out high-temperature sputtering coating on one surface of the plurality of small glass pieces fixed on the first substrate bearing disc to form a first coating film layer;
s5, double-sided film coating:
s5.1, fixing the plurality of small glass pieces plated with the first film coating film layer on a second substrate bearing disc through a second double-sided high-temperature-resistant UV tape by taking the first film coating film layer as a contact surface;
s5.2, secondary dispergation: debonding the first double-sided high-temperature resistant UV tape, and removing the first substrate carrying disc and the first double-sided high-temperature resistant UV tape from the plurality of glass chips;
s5.3, sputtering coating: performing high-temperature sputtering coating on the other surfaces of the plurality of small glass pieces fixed on the second substrate bearing disc to form a second coating film layer;
s6, third glue dissolving: debonding the second double-sided high-temperature resistant UV tape, and removing the second substrate carrying disc and the second double-sided high-temperature resistant UV tape from the plurality of glass chips;
s7, quality inspection: and carrying out quality inspection on the plurality of small glass pieces with the coating film layers plated on both sides.
Preferably, the thickness of the glass substrate is 0.08mm to 0.30 mm.
Preferably, the thickness of the glass substrate is 0.145mm to 0.21 mm.
Preferably, the common UV adhesive tape, the first double-sided high-temperature resistant UV adhesive tape and the second double-sided high-temperature resistant UV adhesive tape have different debonding wave bands.
Preferably, the first double-sided high temperature resistant UV tape and the second double-sided high temperature resistant UV tape can resist high temperature of 180 ℃ and above.
Preferably, the working temperature of the sputtering coating is 120-180 ℃.
Preferably, the length, width or diameter of the glass substrate is in the range of 120mm to 190 mm.
Preferably, the length, width or diameter of the glass flake is less than or equal to 2 mm.
Preferably, the length, width or diameter of the glass flake is less than or equal to 1 mm.
Preferably, the glass substrate is D263T schottky optical glass in step S1.
The beneficial effects of the invention at least comprise: the method adopts the sequential process of firstly cutting the glass substrate into small glass pieces by laser and then sputtering for coating, and has the advantages of stable yield, simple operation, high yield and the like; the technical problems that a thin (0.145-0.21 mm) glass substrate is difficult to process and easy to crack and the side surface of the optical filter is not covered by a film are solved.
The optical filter prepared by the method has high yield (the edge breakage reject ratio is controlled within 3% approximately), is simple to operate (only film pasting, glue dissolving and film uncovering are needed), and can perfectly avoid the problem of substrate cracking caused by the fact that a glass substrate is too thin and cannot bear large coating stress; the problem of cracking of the substrate in the film coating or film discharging process caused by large warping due to too thick film layer in the single-sided film coating and film forming process can be perfectly solved, the design limitation of the film system is broken through, and the film layer deposition is arranged on the side surface, so that the interference of external light rays can be prevented (as shown in figure 13).
The invention relates to processing of an infrared narrow-band coated optical filter with an extremely small size, which is applied to the fields of TWS true wireless Bluetooth headsets, smart phone biological identification modules and the like. According to the method, a phi (120-180) mm glass substrate is subjected to laser cutting to be small glass pieces with extremely small sizes (the length and the width are not more than 2mm), then the small glass pieces can be subjected to high-temperature sputtering film forming at one time through the assistance of a common UV adhesive tape and a high-temperature resistant UV adhesive tape, the processing of a plurality of infrared narrow-band film-coated optical filters is completed, and the efficiency and the yield can be greatly increased. The processing technology can effectively solve the problems of chip breaking and edge breakage of Laser cutting or Disco cutting products caused by high temperature of a coated film and warping of the coated film layer due to the fact that the coated film layer is thick and has a thickness of 0.145-0.21 mm, achieves the effects of strong film layer firmness and high yield, and is simple in processing technological process.
[ description of the drawings ]
FIG. 1 is a first schematic diagram of a glass substrate cut with a Disco knife wheel.
FIG. 2 is a second schematic diagram of a glass substrate cut with a Disco knife wheel.
Fig. 3 is a side view of a glass substrate cut with Laser (side surface not covered with a film layer, external light can enter).
FIG. 4 is a side view of a glass substrate cut with a Disco cutter wheel (side is frosted and not covered with a film, and external light can enter).
Fig. 5 is a conventional process flow of the optical filter.
FIG. 6 is a process flow of the method of the present invention for processing an optical filter.
FIG. 7 is a schematic diagram of cutting, breaking and film expanding of a glass substrate.
FIG. 8 is a first process flow diagram of the present invention.
FIG. 9 is a second process flow diagram of the present invention.
FIG. 10 is a third process flow diagram of the present invention.
FIG. 11 is a fourth process flow diagram of the present invention.
FIG. 12 is a fifth process flow diagram of the present invention.
Fig. 13 is a side film deposition diagram of the optical filter manufactured by the method of the present invention.
The glass substrate comprises 101-a glass substrate, 1-a glass small piece, 2-a common UV adhesive tape, 3-a first double-sided high-temperature resistant UV adhesive tape, 4-a first substrate bearing disc, 5-a first coating film layer, 6-a second double-sided high-temperature resistant UV adhesive tape, 7-a second substrate bearing disc and 8-a second coating film layer.
[ detailed description ] embodiments
The present invention will be described in further detail below with reference to specific embodiments and drawings, but the present invention is not limited to the specific embodiments below.
The following examples are not provided to limit the scope of the present invention, nor are the steps described to limit the order of execution, and the directions described are limited to the drawings. Modifications of the invention which are obvious to those skilled in the art in view of the prior art are also within the scope of the invention as claimed.
Example 1
A processing method of an infrared narrow-band coated filter with an extremely small size is shown in figures 6-13 and comprises the following specific steps:
s1, selecting a chip: selecting D263T Schottky optical glass with the thickness of 0.21mm, scribing the Schottky optical glass, cutting a glass substrate 101 with the length and the width of 190mm, then carrying out ultrasonic cleaning on the glass substrate 101 to remove surface stains, and attaching a layer of common UV adhesive tape 2 on one surface of the glass substrate 101, wherein the common UV adhesive tape 2 can generally only resist the temperature below 60 ℃, and can be debonded when the temperature is over-high.
S2, cutting: the glass substrate 101 is laser cut by existing equipment such as a laser cutting machine, and then is physically broken along the laser cutting trace by the edge of a blade, so that the glass substrate 101 is broken into a plurality of small glass pieces 1 with the length and the width of 2mm, and the broken small glass pieces 1 are small in size, so that the glass pieces cannot be directly cut by using laser. The glass substrate 101 is cut by laser cutting, which can greatly increase the yield of the glass pieces 1, and the cutting process is simpler, easier to operate and has high precision (see fig. 7).
S3, expanding the membrane: and stretching and expanding the film of the common UV adhesive tape 2 adhered with the plurality of small glass pieces 1 by a film expanding machine to expand the distance between the plurality of adjacent small glass pieces 1 so that gaps exist between the adjacent small glass pieces 1.
S4, single-side film coating:
s4.1, referring to the figure 8, a plurality of small glass pieces 1 are fixed on a first substrate bearing disc 4 through a first double-sided high-temperature-resistant UV adhesive tape 3. Specifically, a first double-sided high-temperature resistant UV tape 3 is attached and fixed on a first substrate bearing disc 4, then a plurality of glass pieces 1 are directly covered on the surface of the first double-sided high-temperature resistant UV tape 3 at one time by taking the surface of the glass piece 1 which is not attached with a common UV tape 2 as a contact surface, and the glass pieces 1 are all fixed on the first substrate bearing disc 4 by lightly and uniformly pressing, so that the adhesion efficiency of the glass pieces 1 can be greatly increased, and the common UV tape 2 can fix and position the glass pieces 1 in the process of covering and adhering to the surface of the first double-sided high-temperature resistant UV tape 3 because the other surfaces of the glass pieces 1 are all fixed on the same common UV tape 2, so that the glass pieces 1 cannot relatively move, and the original distance between the glass pieces 1 can be well kept, the layout is kept uniform, and multiple purposes are achieved.
S4.2, glue dissolving adhesive tape: referring further to fig. 8, a general UV tape 2 is photolyzed by UV of a specific wavelength band, and the general UV tape 2 is removed from a plurality of the glass chips 1, and the glass chips 1 are spin-washed and dried.
S4.3, sputtering coating: the plurality of small glass pieces 1 fixed on the first substrate bearing disc 4 are placed into a coating chamber of a sputtering coating machine, and the surfaces of the plurality of small glass pieces 1 are subjected to high-temperature sputtering coating at 120 ℃, so that a first coating film layer 5 is formed on the surfaces of the small glass pieces 1 (as shown in fig. 9).
S5, double-sided coating
S5.1, referring to the figure 10, the surface of the first coating film layer 5 is taken as a contact surface, and the plurality of small glass pieces 1 plated with the first coating film layer 5 are fixed on a second substrate bearing disc 7 through a second double-sided high-temperature resistant UV adhesive tape 6. Specifically, firstly, the second double-sided high-temperature resistant UV tape 6 is attached and fixed to the second substrate bearing disc 7, then the surface of the first coating film layer 5 is used as a contact surface, the plurality of glass pieces 1 are directly covered on the surface of the second double-sided high-temperature resistant UV tape 6 at one time, and the plurality of glass pieces 1 are gently and uniformly pressed, so that the plurality of glass pieces 1 are all fixed on the second substrate bearing disc 7.
S5.2, secondary dispergation: and (2) photolyzing the first double-sided high-temperature resistant UV adhesive tapes 3 on the glass small pieces 1 through UV light with a specific waveband, removing the first substrate bearing disc 4 and the first double-sided high-temperature resistant UV adhesive tapes 3 from the glass small pieces 1, and spin-washing and drying the glass small pieces 1.
S5.3, secondary sputtering coating: the plurality of glass pieces 1 fixed on the second substrate bearing disc 7 through the second double-sided high-temperature resistant UV adhesive tape 6 are placed into a coating chamber of a sputtering coating machine again, and the other surfaces of the plurality of glass pieces 1 are subjected to high-temperature sputtering coating at 120 ℃, so that a second coating film layer 8 (shown in figure 11) is formed on the surfaces of the glass pieces 1, and the front and back surfaces of the glass pieces 1 are covered by the film layers.
S6, third glue dissolving: referring to fig. 12, the second double-sided high temperature UV tape 6 on the plurality of glass chips 1 is photolyzed by UV of a specific wavelength band, and the second substrate carrier tray 7 and the second double-sided high temperature UV tape 6 are removed from the plurality of glass chips 1, and the glass chips 1 are spin-washed and dried.
S7, quality inspection: and (3) carrying out quality inspection on the plurality of glass pieces 1 with the coating film layers plated on both sides.
In this embodiment, the common UV tape 2, the first double-sided high temperature resistant UV tape 3, and the second double-sided high temperature resistant UV tape 6 are different in debonding waveband through UV photolysis, wherein the debonding waveband of the selected common UV tape 2 is 365nm, the specific model is Nitto-UE-111AJR, the debonding waveband of the first double-sided high temperature resistant UV tape 3 is 200nm to 300nm, the specific model is SELFA HW01 tape, the debonding waveband of the second double-sided high temperature resistant UV tape 6 is 400 mm to 450mm, and the specific model is a SELFA HW01 tape. By means of the arrangement, when one adhesive tape is debonded, the influence on the other adhesive tape can be avoided or reduced.
In the embodiment, both the first double-sided high temperature resistant UV tape 3 and the second double-sided high temperature resistant UV tape 6 can resist high temperature of 180 ℃ or more. Therefore, when the high-temperature sputtering coating is carried out on the glass small piece 1, the melting and the failure of the high-temperature resistant UV adhesive tape can be avoided.
Example 2
A processing method of an infrared narrow-band coated filter with an extremely small size comprises the following specific steps:
s1, selecting a chip: selecting D263T Schottky optical glass with the thickness of 0.145mm, scribing the Schottky optical glass, cutting a glass substrate 101 with the length and the width of 120mm, then carrying out ultrasonic cleaning on the glass substrate 101 to remove surface stains, and attaching a layer of common UV adhesive tape 2 on one surface of the glass substrate 101, wherein the common UV adhesive tape 2 can generally only resist the temperature below 60 ℃, and can be debonded when the temperature is over-high.
S2, cutting: the glass substrate 101 is laser cut by existing equipment such as a laser cutting machine, and then physically crushed along the laser cutting trace by the blade edge of the blade, so that the glass substrate 101 is broken into a plurality of glass pieces 1 with the length and width of 1 mm. The glass substrate 101 is cut in a laser cutting mode, the yield of the glass small pieces 1 can be greatly increased, and the cutting process is simpler, easy to operate and high in precision.
S3, expanding the membrane: and stretching and expanding the film of the common UV adhesive tape 2 adhered with the plurality of small glass pieces 1 by a film expanding machine to expand the distance between the plurality of adjacent small glass pieces 1 so that gaps exist between the adjacent small glass pieces 1.
S4, single-side film coating:
s4.1, fixing the plurality of small glass pieces 1 on a first substrate bearing disc 4 through a first double-sided high-temperature-resistant UV adhesive tape 3. Specifically, a first double-sided high-temperature resistant UV tape 3 is attached and fixed on a first substrate bearing disc 4, then a plurality of glass pieces 1 are directly covered on the surface of the first double-sided high-temperature resistant UV tape 3 at one time by taking the surface of the glass piece 1 which is not attached with a common UV tape 2 as a contact surface, and the glass pieces 1 are all fixed on the first substrate bearing disc 4 by lightly and uniformly pressing, so that the adhesion efficiency of the glass pieces 1 can be greatly increased, and the common UV tape 2 can fix and position the glass pieces 1 in the process of covering and adhering to the surface of the first double-sided high-temperature resistant UV tape 3 because the other surfaces of the glass pieces 1 are all fixed on the same common UV tape 2, so that the glass pieces 1 cannot relatively move, and the original distance between the glass pieces 1 can be well kept, the layout is kept uniform, and multiple purposes are achieved.
S4.2, glue dissolving adhesive tape: and (3) photolyzing a common UV adhesive tape 2 by UV with a specific waveband, removing the common UV adhesive tape 2 from a plurality of glass small pieces 1, and spin-washing and drying the glass small pieces 1.
S4.3, sputtering coating: putting a plurality of glass small pieces 1 fixed on a first substrate bearing disc 4 into a coating chamber of a sputtering coating machine, and carrying out high-temperature sputtering coating on the surfaces of the plurality of glass small pieces 1 at the temperature of 180 ℃ so as to form a first coating film layer 5 on the surfaces of the glass small pieces 1.
S5, double-sided coating
S5.1, fixing the plurality of glass small pieces 1 plated with the first coating film layers 5 on a second substrate bearing disc 7 through a second double-sided high-temperature resistant UV tape 6 by taking the surfaces of the first coating film layers 5 as contact surfaces. Specifically, firstly, the second double-sided high-temperature resistant UV tape 6 is attached and fixed to the second substrate bearing disc 7, then the surface of the first coating film layer 5 is used as a contact surface, the plurality of glass pieces 1 are directly covered on the surface of the second double-sided high-temperature resistant UV tape 6 at one time, and the plurality of glass pieces 1 are gently and uniformly pressed, so that the plurality of glass pieces 1 are all fixed on the second substrate bearing disc 7.
S5.2, secondary dispergation: and (2) photolyzing the first double-sided high-temperature resistant UV adhesive tapes 3 on the glass small pieces 1 through UV light with a specific waveband, removing the first substrate bearing disc 4 and the first double-sided high-temperature resistant UV adhesive tapes 3 from the glass small pieces 1, and spin-washing and drying the glass small pieces 1.
S5.3, secondary sputtering coating: and placing the plurality of glass small pieces 1 fixed on the second substrate bearing disc 7 through the second double-sided high-temperature-resistant UV adhesive tape 6 into a coating chamber of a sputtering coating machine again, and carrying out high-temperature sputtering coating on the other surfaces of the plurality of glass small pieces 1 at 180 ℃ so as to form a second coating film layer 8 on the surfaces of the glass small pieces 1, so that the front and back surfaces of the glass small pieces 1 are covered by the film layers.
S6, third glue dissolving: and (3) photolyzing a second double-sided high-temperature resistant UV adhesive tape 6 on the plurality of glass small pieces 1 through UV light with a specific waveband, removing a second substrate bearing disc 7 and the second double-sided high-temperature resistant UV adhesive tape 6 from the plurality of glass small pieces 1, and spin-washing and drying the glass small pieces 1.
S7, quality inspection: and (3) carrying out quality inspection on the plurality of glass pieces 1 with the coating film layers plated on both sides.
In this embodiment, the common UV tape 2, the first double-sided high temperature resistant UV tape 3, and the second double-sided high temperature resistant UV tape 6 are different in debonding waveband through UV photolysis, wherein the debonding waveband of the selected common UV tape 2 is 365nm, the specific model is Nitto-UE-111AJR, the debonding waveband of the first double-sided high temperature resistant UV tape 3 is 200nm to 300nm, the specific model is SELFA HW01 tape, the debonding waveband of the second double-sided high temperature resistant UV tape 6 is 400 mm to 450mm, and the specific model is a SELFA HW01 tape. By means of the arrangement, when one adhesive tape is debonded, the influence on the other adhesive tape can be avoided or reduced.
In the embodiment, both the first double-sided high temperature resistant UV tape 3 and the second double-sided high temperature resistant UV tape 6 can resist high temperature of 180 ℃ or more. Therefore, when the high-temperature sputtering coating is carried out on the glass small piece 1, the melting and the failure of the high-temperature resistant UV adhesive tape can be avoided.
Example 3
A processing method of an infrared narrow-band coated filter with an extremely small size comprises the following specific steps:
s1, selecting a chip: selecting D263T Schottky optical glass with the thickness of 0.10mm, scribing the Schottky optical glass, cutting a glass substrate 101 with the length and the width of 150mm, then carrying out ultrasonic cleaning on the glass substrate 101 to remove surface stains, and attaching a layer of common UV adhesive tape 2 on one surface of the glass substrate 101, wherein the common UV adhesive tape 2 can generally only resist the temperature below 60 ℃, and can be debonded when the temperature is over-high.
S2, cutting: the glass substrate 101 is laser cut by existing equipment such as a laser cutting machine, and then physically crushed along the laser cutting trace by the blade edge of the blade, so that the glass substrate 101 is broken into a plurality of small glass pieces 1 with the length and width of 0.8 mm. The glass substrate 101 is cut in a laser cutting mode, the yield of the glass small pieces 1 can be greatly increased, and the cutting process is simpler, easy to operate and high in precision.
S3, expanding the membrane: and stretching and expanding the film of the common UV adhesive tape 2 adhered with the plurality of small glass pieces 1 by a film expanding machine to expand the distance between the plurality of adjacent small glass pieces 1 so that gaps exist between the adjacent small glass pieces 1.
S4, single-side film coating:
s4.1, fixing the plurality of small glass pieces 1 on a first substrate bearing disc 4 through a first double-sided high-temperature-resistant UV adhesive tape 3. Specifically, first double-sided high temperature resistant UV tape 3 is attached and fixed to first substrate bearing disc 4, then one side of glass piece 1, which is not attached with common UV tape 2, is used as a contact surface, a plurality of glass pieces 1 are directly covered on the surface of first double-sided high temperature resistant UV tape 3 at one time, and the glass pieces 1 are lightly and uniformly pressed, so that the glass pieces 1 are all fixed on first substrate bearing disc 4.
S4.2, glue dissolving adhesive tape: and (3) photolyzing a common UV adhesive tape 2 by UV with a specific waveband, removing the common UV adhesive tape 2 from a plurality of glass small pieces 1, and spin-washing and drying the glass small pieces 1.
S4.3, sputtering coating: putting a plurality of glass small pieces 1 fixed on a first substrate bearing disc 4 into a coating chamber of a sputtering coating machine, and carrying out high-temperature sputtering coating on the surfaces of the plurality of glass small pieces 1 at the temperature of 150 ℃ so as to form a first coating film layer 5 on the surfaces of the glass small pieces 1.
S5, double-sided coating
S5.1, fixing the plurality of glass small pieces 1 plated with the first coating film layers 5 on a second substrate bearing disc 7 through a second double-sided high-temperature resistant UV tape 6 by taking the surfaces of the first coating film layers 5 as contact surfaces. Specifically, firstly, the second double-sided high-temperature resistant UV tape 6 is attached and fixed to the second substrate bearing disc 7, then the surface of the first coating film layer 5 is used as a contact surface, the plurality of glass pieces 1 are directly covered on the surface of the second double-sided high-temperature resistant UV tape 6 at one time, and the plurality of glass pieces 1 are gently and uniformly pressed, so that the plurality of glass pieces 1 are all fixed on the second substrate bearing disc 7.
S5.2, secondary dispergation: and (2) photolyzing the first double-sided high-temperature resistant UV adhesive tapes 3 on the glass small pieces 1 through UV light with a specific waveband, removing the first substrate bearing disc 4 and the first double-sided high-temperature resistant UV adhesive tapes 3 from the glass small pieces 1, and spin-washing and drying the glass small pieces 1.
S5.3, secondary sputtering coating: and placing the plurality of glass small pieces 1 fixed on the second substrate bearing disc 7 through the second double-sided high-temperature resistant UV adhesive tape 6 into a coating chamber of a sputtering coating machine again, and carrying out high-temperature sputtering coating on the other surfaces of the plurality of glass small pieces 1 at 150 ℃ so as to form a second coating film layer 8 on the surfaces of the glass small pieces 1, so that the front and back surfaces of the glass small pieces 1 are covered by the film layers.
S6, third glue dissolving: and (3) photolyzing a second double-sided high-temperature resistant UV adhesive tape 6 on the plurality of glass small pieces 1 through UV light with a specific waveband, removing a second substrate bearing disc 7 and the second double-sided high-temperature resistant UV adhesive tape 6 from the plurality of glass small pieces 1, and spin-washing and drying the glass small pieces 1.
S7, quality inspection: and (3) carrying out quality inspection on the plurality of glass pieces 1 with the coating film layers plated on both sides.
In this embodiment, the common UV tape 2, the first double-sided high temperature resistant UV tape 3, and the second double-sided high temperature resistant UV tape 6 are different in debonding waveband through UV photolysis, wherein the debonding waveband of the selected common UV tape 2 is 365nm, the specific model is Nitto-UE-111AJR, the debonding waveband of the first double-sided high temperature resistant UV tape 3 is 200nm to 300nm, the specific model is SELFA HW01 tape, the debonding waveband of the second double-sided high temperature resistant UV tape 6 is 400 mm to 450mm, and the specific model is a SELFA HW01 tape. By means of the arrangement, when one adhesive tape is debonded, the influence on the other adhesive tape can be avoided or reduced.
In the embodiment, both the first double-sided high temperature resistant UV tape 3 and the second double-sided high temperature resistant UV tape 6 can resist high temperature of 180 ℃ or more. Therefore, when the high-temperature sputtering coating is carried out on the glass small piece 1, the melting and the failure of the high-temperature resistant UV adhesive tape can be avoided.
Example 4
A processing method of an infrared narrow-band coated filter with an extremely small size comprises the following specific steps:
s1, selecting a chip: selecting D263T Schottky optical glass with the thickness of 0.3mm, scribing the Schottky optical glass, cutting a glass substrate 101 with the length and the width of 160mm, then carrying out ultrasonic cleaning on the glass substrate 101 to remove surface stains, and attaching a layer of common UV adhesive tape 2 on one surface of the glass substrate 101, wherein the common UV adhesive tape 2 can generally only resist the temperature below 60 ℃, and can be debonded when the temperature is over-high.
S2, cutting: the glass substrate 101 is laser cut by existing equipment such as a laser cutting machine, and then physically crushed along the laser cutting trace by the blade edge of the blade, so that the glass substrate 101 is broken into a plurality of glass pieces 1 with the length and width of 1.5 mm. The glass substrate 101 is cut in a laser cutting mode, the yield of the glass small pieces 1 can be greatly increased, and the cutting process is simpler, easy to operate and high in precision.
S3, expanding the membrane: and stretching and expanding the film of the common UV adhesive tape 2 adhered with the plurality of small glass pieces 1 by a film expanding machine to expand the distance between the plurality of adjacent small glass pieces 1 so that gaps exist between the adjacent small glass pieces 1.
S4, single-side film coating:
s4.1, fixing the plurality of small glass pieces 1 on a first substrate bearing disc 4 through a first double-sided high-temperature-resistant UV adhesive tape 3. Specifically, a first double-sided high-temperature resistant UV tape 3 is attached and fixed on a first substrate bearing disc 4, then a plurality of glass pieces 1 are directly covered on the surface of the first double-sided high-temperature resistant UV tape 3 at one time by taking the surface of the glass piece 1 which is not attached with a common UV tape 2 as a contact surface, and the glass pieces 1 are all fixed on the first substrate bearing disc 4 by lightly and uniformly pressing, so that the adhesion efficiency of the glass pieces 1 can be greatly increased, and the common UV tape 2 can fix and position the glass pieces 1 in the process of covering and adhering to the surface of the first double-sided high-temperature resistant UV tape 3 because the other surfaces of the glass pieces 1 are all fixed on the same common UV tape 2, so that the glass pieces 1 cannot relatively move, and the original distance between the glass pieces 1 can be well kept, the layout is kept uniform, and multiple purposes are achieved.
S4.2, glue dissolving adhesive tape: and (3) photolyzing a common UV adhesive tape 2 by UV with a specific waveband, removing the common UV adhesive tape 2 from a plurality of glass small pieces 1, and spin-washing and drying the glass small pieces 1.
S4.3, sputtering coating: putting a plurality of glass small pieces 1 fixed on a first substrate bearing disc 4 into a coating chamber of a sputtering coating machine, and carrying out high-temperature sputtering coating on the surfaces of the plurality of glass small pieces 1 at 160 ℃ so as to form a first coating film layer 5 on the surfaces of the glass small pieces 1.
S5, double-sided coating
S5.1, fixing the plurality of glass small pieces 1 plated with the first coating film layers 5 on a second substrate bearing disc 7 through a second double-sided high-temperature resistant UV tape 6 by taking the surfaces of the first coating film layers 5 as contact surfaces. Specifically, firstly, the second double-sided high-temperature resistant UV tape 6 is attached and fixed to the second substrate bearing disc 7, then the surface of the first coating film layer 5 is used as a contact surface, the plurality of glass pieces 1 are directly covered on the surface of the second double-sided high-temperature resistant UV tape 6 at one time, and the plurality of glass pieces 1 are gently and uniformly pressed, so that the plurality of glass pieces 1 are all fixed on the second substrate bearing disc 7.
S5.2, secondary dispergation: and (2) photolyzing the first double-sided high-temperature resistant UV adhesive tapes 3 on the glass small pieces 1 through UV light with a specific waveband, removing the first substrate bearing disc 4 and the first double-sided high-temperature resistant UV adhesive tapes 3 from the glass small pieces 1, and spin-washing and drying the glass small pieces 1.
S5.3, secondary sputtering coating: and placing the plurality of glass small pieces 1 fixed on the second substrate bearing disc 7 through the second double-sided high-temperature resistant UV adhesive tape 6 into a coating chamber of a sputtering coating machine again, and carrying out high-temperature sputtering coating on the other surfaces of the plurality of glass small pieces 1 at 160 ℃ so as to form a second coating film layer 8 on the surfaces of the glass small pieces 1, so that the front and back surfaces of the glass small pieces 1 are covered by the film layers.
S6, third glue dissolving: and (3) photolyzing a second double-sided high-temperature resistant UV adhesive tape 6 on the plurality of glass small pieces 1 through UV light with a specific waveband, removing a second substrate bearing disc 7 and the second double-sided high-temperature resistant UV adhesive tape 6 from the plurality of glass small pieces 1, and spin-washing and drying the glass small pieces 1.
S7, quality inspection: and (3) carrying out quality inspection on the plurality of glass pieces 1 with the coating film layers plated on both sides.
In this embodiment, the common UV tape 2, the first double-sided high temperature resistant UV tape 3, and the second double-sided high temperature resistant UV tape 6 are different in debonding waveband through UV photolysis, wherein the debonding waveband of the selected common UV tape 2 is 365nm, the specific model is Nitto-UE-111AJR, the debonding waveband of the first double-sided high temperature resistant UV tape 3 is 200nm to 300nm, the specific model is SELFA HW01 tape, the debonding waveband of the second double-sided high temperature resistant UV tape 6 is 400 mm to 450mm, and the specific model is a SELFA HW01 tape. By means of the arrangement, when one adhesive tape is debonded, the influence on the other adhesive tape can be avoided or reduced.
In the embodiment, both the first double-sided high temperature resistant UV tape 3 and the second double-sided high temperature resistant UV tape 6 can resist high temperature of 180 ℃ or more. Therefore, when the high-temperature sputtering coating is carried out on the glass small piece 1, the melting and the failure of the high-temperature resistant UV adhesive tape can be avoided.
Claims (10)
1. A processing method of an infrared narrow-band coated filter with an extremely small size is characterized by comprising the following steps:
s1, selecting a chip: selecting a glass substrate, carrying out ultrasonic cleaning on the glass substrate, and then attaching a common UV adhesive tape on the glass substrate;
s2, cutting: carrying out laser cutting on the glass substrate, and breaking the glass substrate into a plurality of small glass pieces;
s3, expanding the membrane: spreading a common UV adhesive tape adhered with a plurality of small glass pieces to expand the space between the small glass pieces;
s4, single-side film coating:
s4.1, fixing a plurality of small glass pieces on a first substrate bearing disc through a first double-sided high-temperature-resistant UV (ultraviolet) adhesive tape;
s4.2, glue dissolving adhesive tape: debonding the common UV adhesive tape, and removing the common UV adhesive tape from the plurality of glass chips;
s4.3, sputtering coating: carrying out high-temperature sputtering coating on one surface of the plurality of small glass pieces fixed on the first substrate bearing disc to form a first coating film layer;
s5, double-sided film coating:
s5.1, fixing the plurality of small glass pieces plated with the first film coating film layer on a second substrate bearing disc through a second double-sided high-temperature-resistant UV tape by taking the first film coating film layer as a contact surface;
s5.2, secondary dispergation: debonding the first double-sided high-temperature resistant UV tape, and removing the first substrate carrying disc and the first double-sided high-temperature resistant UV tape from the plurality of glass chips;
s5.3, sputtering coating: performing high-temperature sputtering coating on the other surfaces of the plurality of small glass pieces fixed on the second substrate bearing disc to form a second coating film layer;
s6, third glue dissolving: debonding the second double-sided high-temperature resistant UV tape, and removing the second substrate carrying disc and the second double-sided high-temperature resistant UV tape from the plurality of glass chips;
s7, quality inspection: and carrying out quality inspection on the plurality of small glass pieces with the coating film layers plated on both sides.
2. The processing method of the infrared narrow-band coated filter with extremely small size as claimed in claim 1, wherein: the thickness of the glass substrate is 0.08 mm-0.30 mm.
3. The processing method of the infrared narrow-band coated filter with extremely small size as claimed in claim 2, characterized in that: the thickness of the glass substrate is 0.145 mm-0.21 mm.
4. The processing method of the infrared narrow-band coated filter with extremely small size as claimed in claim 1, wherein: the common UV adhesive tape, the first double-sided high-temperature resistant UV adhesive tape and the second double-sided high-temperature resistant UV adhesive tape have different debonding wave bands.
5. The processing method of the infrared narrow-band coated filter with extremely small size as claimed in claim 1, wherein: the first double-sided high-temperature resistant UV adhesive tape and the second double-sided high-temperature resistant UV adhesive tape can resist high temperature of 180 ℃ and above.
6. The processing method of the infrared narrow-band coated filter with extremely small size as claimed in claim 1, wherein: the working temperature of the sputtering coating is 120-180 ℃.
7. The processing method of the infrared narrow-band coated filter with extremely small size as claimed in claim 1, wherein: the length, width or diameter range of the glass substrate is 120 mm-190 mm.
8. The method for processing the infrared narrow-band coated filter with the extremely small size according to claim 1 or 7, which is characterized in that: the length, width or diameter of the small glass pieces are less than or equal to 2 mm.
9. The method for processing the infrared narrowband coated filter with the extremely small size according to claim 8, wherein the method comprises the following steps: the length, width or diameter of the glass flakes are less than or equal to 1 mm.
10. The processing method of the infrared narrow-band coated filter with extremely small size as claimed in claim 1, wherein: the glass substrate in the S1 is D263T Schottky optical glass.
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| CN115028371A (en) * | 2022-05-09 | 2022-09-09 | 东莞南玻工程玻璃有限公司 | Method for producing small-size Low-E coated glass and application thereof |
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