JP2009103714A - Probe substrate for inspecting flat display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe substrate for inspecting a flat display panel that prevents expansion and contraction due to the heat or humidity of the probe substrate, made of a conventional resin film and the pitch error of a bump for pressurization contact due to this, prevents variations in the height of the bump, allows sound pressurization-contact with the electrode of the flat display panel, and allows appropriate alignment of the bump for pressurization-contact and the electrode. <P>SOLUTION: The probe substrate 6D is formed of a transparent glass-made plate 6C, fine irregularities 10 are formed in the front end surface 13 of the glass-made plate 6C that provides a half-translucent surface; the front edge 7 of the transparent glass-made probe substrate 6D and a side edge of the flat display panel 2 form an overlap state, the transparent glass-made plate front edge 7 inside the half-translucent surface is tranmitted; and the bump 14 for pressurization-contact of the probe substrate 6D and the electrode of the flat display panel are aligned. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a probe substrate used for inspection of a flat display panel represented by a liquid crystal panel display, a plasma display panel, and an EL display panel.

  As a conventional flat display panel inspection jig, as shown in FIG. 1B, on the surface of a synthetic resin film 1A typified by polyimide resin, a number of wiring paths having the same pitch as the electrodes 3 of the flat display panel 2 are provided. 4 is arranged in parallel, and a flexible probe film 1B having a pressure contact portion 5 provided at the front end of the wiring path 4 at a pitch equal to the pitch of the electrode 3 is widely used. The pressure contact portion 5 is disposed along the front edge of the.

  On the other hand, as shown in FIG. 1A, the flat display panel 2 is provided with electrodes 3 in the pixel portion, that is, electrode pads 3, along the surface of the side edge, as shown in FIG. The front end edge of the probe film 1B made of the flexible synthetic resin film 1A is pushed over the side edge of the flat display panel in an overlapping state, and the front end edge of the probe film 1B made of the flexible synthetic resin film 1A Using a microscope, the pressure contact portion 5 and the electrode 3 are aligned by being transmitted while being illuminated. The illumination is performed from above the front edge of the film 1B or from below the side edge of the panel 2.

  Usually, a method is adopted in which bumps 5 a are provided on the pressure contact portion 5 to make point contact with the electrode 3.

  Thus, it is difficult for the probe film 1B made of the flexible synthetic resin film 1A such as polyimide resin to maintain the pressure contact surface of the pressure contact portion 5 on one plane due to its flexibility. In addition, there is a problem that the bump pitch (pitch of the pressure contact portion) changes due to expansion and contraction and expansion due to temperature and humidity, and the correspondence with the pitch of the electrodes 3 is impaired.

  The probe film 1B made of a flexible synthetic resin film 1A such as polyimide resin has a high light refractive index and a very low light transmittance. Therefore, the front end edge of the probe film 1B is illuminated at the overlap portion. However, when alignment is achieved through transmission, it is an obstacle to accurate alignment setting.

  Most of flat display panels 2 such as liquid crystal display panels are made of glass. However, since the thermal expansion coefficient is remarkably different between glass and synthetic resin film, the problem of pitch deviation of the pressure contact portion 5 has been pointed out. Yes.

  In addition, since the optical refractive index is remarkably different between the glass and the synthetic resin film, there is a problem that accurate alignment is difficult.

  In recent years, the flat display panel 2 has become increasingly larger and the pitch of the electrodes 3 tends to become a minimum pitch. The increase in the size of the panel 2 and the minimum pitch of the electrodes 3 have made the above problem more apparent.

  On the other hand, since the flexible synthetic resin film 1A has high strength against impact, it is inexpensive, easy to handle, and easy to carry and store. Moreover, since polyimide resin can form a wiring path by an additive method, it is the fact that it is employ | adopted as a base material of the said probe film 1B.

  According to the present invention, the front edge of the probe substrate is overlapped with the side edge of the flat display panel, and the pressure contact portion arranged along the surface of the front edge of the probe substrate is replaced with the surface of the side edge of the flat display panel. In a flat display panel inspection probe substrate that performs inspection by press-contacting the electrodes arranged along the surface, the probe substrate is formed of a transparent glass plate, and fine irregularities are formed on the front end surface of the glass plate. A semi-transparent surface, and the front edge of the transparent glass probe substrate and the side edge of the flat display panel form the overlap state, and the transparent glass plate front end inside the semi-translucent surface A probe substrate for inspecting a flat display panel configured to align the pressure contact portion and the electrode through the edge. It is intended to provide.

  As a specific example, the front end surface of the glass plate is a projecting curved surface, and fine projections and depressions are formed on the projecting curved surface to make a semi-translucent surface, and transparent glass inside the semi-transparent surface (inside the projecting curved surface) It is set as the structure which aims at the alignment of the said pressurization contact part and an electrode permeate | transmitting the plate front edge.

  Further, the front end surface of the glass plate is a surface substantially perpendicular to the surface, and fine irregularities corresponding to abrasive grains having a particle size of 40 to 60 μm are formed on the front end surface of the right angle to make the semi-transparent surface.

  Further, fine irregularities are formed on the front end surface of the glass plate to form a semi-translucent surface, and the upper and lower corners of the front end surface are slightly removed.

  The surface of the glass plate on which the pressure contact portion is disposed is covered with a transparent or translucent protective coat, and the pressure contact portion protrudes from the outer surface of the protective coat so as to achieve the pressure contact. It can be.

  The glass probe substrate according to the present invention solves the above-mentioned problems of the probe substrate made of a flexible synthetic resin film such as polyimide resin very effectively.

  That is, the glass probe substrate according to the present invention can keep the pressure contact surface of the pressure contact portion as flat as possible, and is made of a glass flat that is subject to inspection for expansion and contraction due to temperature and humidity. It can be suppressed to the same extent as a display panel.

  Therefore, the pitch error of the pressure contact part (pressure contact bump) due to temperature and humidity can be greatly reduced, and an accurate correspondence with the electrode pitch that is difficult to obtain with the probe film can be realized.

  In addition, the glass probe substrate is extremely transparent compared to a probe film made of a flexible synthetic resin film such as polyimide resin, and has a low light refractive index, and the front edge of the probe substrate is illuminated at the overlap portion. However, when the alignment operation is performed while passing through, the positions of the electrode and the pressure contact portion can be easily grasped, and accurate alignment can be performed quickly.

  Most flat display panels such as liquid crystal display panels are made of glass, but the glass probe substrate matches the expansion coefficient, light transmittance, light refractive index, etc. of the two as much as possible, and the alignment settings are accurate. Is further improved.

  In particular, an overlap state is formed between the front edge of the glass probe substrate and the side edge of the flat display panel, and the front edge of the glass probe substrate is illuminated and transmitted through the local area of the probe substrate front edge with a microscope. According to the present invention, the front end surface of the glass probe substrate formed with the fine irregularities to be a semi-transparent surface causes a diffused light reflection effect. The front end face is revealed in a strip shape.

  As a result, the pressure contact portion on the probe substrate side and the electrode on the flat display panel side can be distinguished very easily, and the alignment work is facilitated.

  In addition, during the alignment operation, the front edge of the probe board is pushed out onto the side edge of the flat display panel to form an overlap state. At this time, the front edge is clearly defined because it is transparent glass. As shown in FIG. 3, there is a concern that the front end edge of the probe substrate may be mistakenly placed on the pixel portion and the glass probe substrate may be broken or the flat display panel may be broken.

  However, according to the present invention, the front end surface is revealed as a band due to the light irregular reflection effect of the semi-transparent surface on which the fine unevenness is formed on the front end surface of the glass probe substrate, and the front end surface is exposed to the pixel portion at the time of the protrusion. The problem can be effectively prevented, and the damage can be prevented.

  Further, the glass probe substrate has a drawback that it is easily broken by an impact. In addition to being able to enjoy the advantage of functioning effectively for maintaining the bump pitch and ensuring the flatness due to its rigidity, the glass probe substrate has By subjecting the front end surface to a fine unevenness, sharp corners are removed, the strength against impact applied to the corners can be increased, and the defects of the glass probe substrate can be compensated.

  This effect can be further improved by making the front end surface of the glass plate a projecting curved surface and forming the fine irregularities on the projecting curved surface.

A is a top view of the electrode arrangement | positioning part of the side edge of a flat display panel, B is a top view of the pressurization contact part arrangement | positioning part of the conventional probe film. Sectional drawing which shows the state which has overlapped the front-end edge of the said probe film or the front-end edge of a glass-made probe board | substrate with the side edge of a flat display panel, and is inspecting. FIG. 3 is a cross-sectional view assuming a state in which the front edge of the glass probe substrate is placed on the pixel portion of the flat display panel in FIG. 2. The top view of the glass-made probe board showing the basic idea of this invention. FIG. 5 is an enlarged plan view of a pressure contact wiring path formed with bumps in FIG. 4. AA line sectional view in Drawing 5. BB sectional drawing in FIG. The expanded sectional view of the glass-made probe board | substrate which outlines the state which formed the fine unevenness | corrugation in the front end surface. FIG. 3 is an enlarged cross-sectional view of a glass probe substrate that outlines a state in which a front end surface is a projecting curved surface and fine irregularities are formed on the projecting curved surface. Sectional drawing which shows the state which gave the protective coat to the glass probe board | substrate. The microscope picture (500 times imaging | photography) which planarly views the fine uneven surface formed in the protruding curved surface of the front end surface of the said glass probe board | substrate. FIG. 12 to FIG. 23 are views showing the manufacturing method of the glass probe substrate in the order of steps, and FIG. 12 is a plan view of a large transparent glass plate as a starting material. The top view of the circular transparent glass plate cut out from the said transparent glass plate. A and B show a state in which a wiring path forming layer and a bump forming layer are deposited on the surface of the circular transparent glass plate, and A shows a state in which a four-part wiring path pattern is formed on the circular transparent glass plate. The top view and B are the principal part expanded sectional views. FIG. 15A is a plan view showing one section in a state where a bump forming resist is applied on the film-forming layer of FIG. 14, and FIG. A is a top view which shows one division of the state which gave the resist for bump formation, and gave the primary etching, B is the principal part expanded sectional view. A is a plan view showing a section in a state where the resist for bump formation is removed after the primary etching, and B is an enlarged cross-sectional view of the main part. A is a top view which shows one division in the state which gave the resist for wiring path pattern formation, B is the principal part expanded sectional view. A is a plan view showing a section in a state where secondary etching according to the resist is performed, and B is an enlarged cross-sectional view of the main part. A is a plan view showing one section in a state where the wiring path pattern forming resist is removed after the secondary etching, and B is an enlarged cross-sectional view of the main part. The top view which shows the state which formed four divisions on the circular transparent glass plate with the said wiring path pattern. A is a plan view showing a state in which the circular transparent glass plate is divided according to the section and a glass probe substrate is formed, and B is divided using a dicing saw, and fine irregularities are formed on the front end surface of the glass probe substrate. The top view which shows the state which forms A, C is the sectional drawing. A is a top view which shows the state which forms a fine uneven surface, forming a front-end surface of the said glass probe board | substrate into a projecting curved surface using a chamfering grindstone, B is the same sectional drawing.

  The best mode for carrying out the present invention will be described below with reference to FIGS. As described above, the present invention relates to a probe substrate used for inspection of a flat display panel 2 typified by a liquid crystal display panel, a plasma display panel, and an EL display panel, and the front edge 7 of the probe substrate 6D, that is, a glass plate 6C. Is pushed out onto the side edge 8 of the flat display panel 2 to form an overlapping state, and the pressure contact portion 9 arranged along the surface of the front edge 7 of the probe substrate 6D is placed on the side of the flat display panel 2 An improvement target is a probe substrate for flat display panel inspection in which inspection is performed by press-contacting the electrodes 3 arranged along the surface of the edge 8.

  In the present invention, the probe substrate 6D is formed of a transparent glass plate 6C as shown in FIGS. 4 to 11, and the front end face 13 of the glass plate 6C is fine as shown in FIGS. An unevenness 10 is formed to make a semi-transparent surface, and the overlap state is formed by the front edge 7 of the transparent glass probe substrate 6D and the side edge 8 of the flat display panel 2, and the semi-transparent surface In this configuration, the pressure contact portion 9 and the electrode 3 are aligned through the inner transparent glass plate front edge 7.

  The probe substrate 6D uses a thin glass plate 6C having a thickness of 0.3 to 2.0 mm, and has a slight bending elasticity when the pressure contact portion 9 is brought into pressure contact with the electrode 3.

  As a preferable example of the uneven surface 10, as shown in FIG. 9, the front end surface 13 of the glass plate 6 </ b> C is a protruding surface 11, the uneven surface 10 is formed on the protruding surface 11 to make a semi-transparent surface, It is set as the structure which permeate | transmits the transparent glass plate front end edge 7 inside a semi-translucent surface, and aims at the said alignment.

  In FIG. 8, the front end surface 13 of the glass plate 6C, that is, the glass probe substrate 6D is a plane that is substantially perpendicular to the surface of the plate 6C, and fine irregularities 10 are formed on the plane to form a semi-translucent surface. 1 shows a case where the alignment is achieved by transmitting the transparent glass plate front end edge 7 inside the semi-translucent surface.

  As shown in FIGS. 4 to 7, the pressure contact portion 9 is formed at the front end of the wiring path 12 for electrically connecting the inspection portion and the electrodes 3 of the flat display panel 2.

  As described above, in the conventional probe film, the wiring paths 4 having the same pitch as the electrodes 3 are extended in parallel from the front end edge to the rear end edge of the synthetic resin film 1A. Bumps 5a are formed, the bumps 5a are arranged along the front edge of the probe film 1B, and the pixel portion three primary color inspection of all the electrodes 3, that is, RGB inspection is performed.

  Therefore, the relay circuit board connected to the rear end of each wiring path 4 has a configuration in which the R terminal group, the G terminal group, and the B terminal group in all the bumps 5a are connected together and relayed to the inspection unit. .

  Thus, in the embodiment of the present invention, as shown in FIGS. 4 and 5, the surface of the glass plate 6C is for a single R inspection extending from the front edge 7 to the rear edge. A wiring path 12a, a single G inspection wiring path 12b, and a single B inspection wiring path 12c are formed.

  Further, the single R inspection wiring path 12a, the single G inspection wiring path 12b, and the front half edge of the single B inspection wiring path 12c toward the front end edge 7 and the front end face 13 of the glass plate 6C. The pressure contact wiring paths 12 a ′, 12 b ′, and 12 c ′ are formed in parallel with the existing portion in parallel with the front end surface 13 of the plate 6 </ b> C. In the example shown in the figure, a case is shown in which three pressure contact wiring paths 12a ', 12b' and 12c 'are arranged in parallel.

  More specifically, one of the wiring paths 12a, 12b, and 12c has a second half extending portion extending from the front edge 7 to the rear edge on one side edge side of the glass plate 6C. The first half extending portion is bent substantially parallel to the front end face 13 of the glass plate 6C to form a pressurizing wiring path 12a '.

  Similarly, the other one of the wiring paths 12a, 12b, and 12c has a second half extending part extending from the front end edge to the rear end edge on the other side edge side of the glass plate 6C. The extending portion is bent in parallel with the front end face 13 of the glass plate 6C and in parallel with the pressure contact wiring path 12a '.

  In other words, the second half extending portions of the wiring paths 12a and 12b toward the rear end surface of the glass plate 6C are extended along the vicinity of the left side edge and the right side edge of the plate 6C, respectively. The pressure contact wiring lines 12a ′ and 12b ′ are extended substantially in the opposite direction at right angles, and are arranged in parallel.

  In other words, the latter half of the wiring path 12a extends from one end of the pressure contact wiring path 12a ', and the second half of the wiring path 12b extends from the other end of the pressure contact wiring path 12b'. Extend toward the rear edge of 6C.

  Similarly, the pressure contact wiring path 12c ′ formed in the first half extending portion of the wiring path 12c is parallel to the pressure contact wiring paths 12a ′ and 12b ′ and substantially parallel to the front end face 13 of the glass plate 6C. In parallel, the second-half extended portion extends toward the rear edge of the glass plate 6C.

  Accordingly, the pressure contact wiring paths 12a ', 12b', 12c 'are arranged in parallel on the front edge of the glass plate 6C.

  As shown in the drawing, the latter half of the pressure contact wiring path 12c 'extends from the center of the wiring path 12c', or, like the wiring paths 12a 'and 12b', the pressure contact wiring path. 12c 'extends from either end to the rear edge of the plate 6C.

  According to the above configuration, the three wiring paths 12a, 12b, and 12c for RGB inspection extend on the surface of the probe substrate 6D, and the interval between the three wiring paths 12a, 12b, and 12c, in particular, the second half extended portion. Can be sufficiently expanded.

  In the flat display panel inspection probe substrate 6D, the plurality of wiring paths extend from the rear end edge of the transparent glass plate 6C toward the front end edge with a sufficient interval, and the left edge side of the transparent glass plate 6C. A pressure contact wiring path extending in a direction opposite to each other along the front end face 13 of the plate 6C and substantially parallel to the front end face 13 from each front end of the wiring path existing on the right edge side. In addition, a large number of the bumps 14 are provided at intervals in each pressure contact wiring path.

  As described above, in the conventional probe film 1B, when the same number of wiring paths 4 with the same number as the electrodes 3 with the minimum pitch are formed, the line intervals are very close to each other, and the insulation resistance maintenance is greatly reduced. However, it is easy to cause a short circuit due to foreign matter. In addition, there is a limit in manufacturing technology for minimizing the pitch of wiring lines by the additive method or the like.

  Thus, according to the wiring path formation pattern, the parallel pitch of the pressure contact wiring paths 12a ′, 12b ′, and 12c ′ is a minimum pitch, but at least the interval of the second half extension portion of the wiring path is extended. It is possible and the problems of short circuit and insulation resistance can be greatly reduced. As a result, the work of forming the wiring path becomes extremely easy.

  Further, the connection with the above-described relay circuit board is extremely simplified and facilitated. In addition, when a short circuit occurs due to foreign matter, the short circuit point is located between the pressure contact wiring paths 12a ', 12b', 12c '. You can clearly see what is happening.

  The pressure contact wiring path 12a 'is integrally provided with bumps having the same pitch as the electrode 3 group to be subjected to R inspection, and similarly, the electrode contact group 12 to be subjected to G inspection is disposed on the pressure contact wiring path 12b'. Bumps with an equal pitch are integrally provided, and bumps 14 with an equal pitch and a group of electrodes 3 to be inspected for B are integrally provided on the pressure contact wiring path 12c ′. Accordingly, the bumps are arranged with a pitch shifted from each other in the longitudinal direction of each pressure contact wiring path 12a ', 12b', 12c '.

  Further, in the embodiment, both ends or one end of the bump 14 protrudes from the edge of the terminal width of the pressure contact wiring paths 12a ′, 12b ′, 12c ′ to form an extended portion 15, and the upper end surface of the bump The pressure contact surface 16 is a substantially flat surface.

  The bump 14 forming the pressure contact portion 9 is intended to achieve contact per parallel surface with the electrode 3 with the pressure contact surface 16 formed of the plane.

  The configuration in which the pressing contact surface 16 of the bump 14 group is made flat and in contact with the surface is effectively achieved by forming the probe substrate 6D with the glass plate 6C.

  Thus, at least the pressure contact wiring path 12b 'of the G inspection wiring path 12b, the pressure contact wiring path 12c' of the B inspection wiring path 12c, and the pressure contact wiring of the R inspection wiring path 12a. The path 12a ′ is arranged in parallel with the front end face 13 on the surface of the front end edge 7 of the probe substrate 6D, that is, the glass plate 6C.

  In particular, the configuration in which the wiring path 12a 'and the wiring path 12b' extend in opposite directions and are arranged in parallel can effectively achieve the purpose of extending the line interval extending in the front-rear direction on the glass plate 6C.

  The present invention is not limited to the case where only the above-described inspection wiring paths 12a, 12b, and 12c are provided, and includes cases where inspection wiring paths such as voltage application wiring paths are provided.

  The inspection wiring paths 12a, 12b, and 12c have been described for RGB inspection, but include cases where they are used as lines for other display panel image quality inspections, wiring inspections, and the like.

  As shown in FIG. 10, the surface of the glass plate 6 </ b> C on the side where the pressure contact portion 9 is disposed is covered with a transparent or translucent protective coat 17. That is, most of the inspection wiring paths 12 a, 12 b, 12 c are covered with the protective coat 17, and the pressure contact portion 9 is projected on the outer surface of the protective coat 17 to be used for pressure contact with the electrode 3.

  The protective coat 17 prevents a short circuit between lines due to foreign matter. The protective coat 17 is formed by applying a thermosetting resin paste such as polyimide and thermosetting.

  Next, a method for manufacturing the flat display panel inspection probe substrate 6D will be described with reference to FIGS. 12 to 21, and the structure will be further described. The number of electrodes of the flat display panel is about 400 to 10,000 according to the size and application, and is arranged at a minimum pitch of about 20 to 300 μm.

  Accordingly, in the probe substrate 6D according to the present invention, the same number of bumps 14 (pressure contact portions 9) as the electrodes 3 are arranged at the same minimum pitch as the electrodes 3. Further, the thickness of the wiring path 12 is about 0.1 to 1.0 μm and the height of the bump 14 is about 1.0 to 6.0 μm. For the sake of simplicity, the number of electrodes, the pitch, the dimensions of the wiring path 12 and the like are ignored, and are enlarged conceptually.

  As shown in FIG. 12, a large transparent glass plate 6A is prepared. As shown in FIG. 13, a plurality of circular transparent glass plates 6B are cut out from the transparent glass plate 6A.

  A plurality of rectangular glass probe substrates 6D are formed by the one circular transparent glass plate 6B, that is, a plurality of sheets are obtained. As shown in FIGS. 14A and 14B, the circular transparent glass plate A wiring path forming layer 18 made of a conductive metal is deposited on the surface of 6B, and a bump forming layer 19 made of a good conductive metal is further deposited on the surface of the wiring path forming layer 18. The bump forming layer 19 can be a single layer or multiple layers to obtain a certain height.

  As a method for depositing the wiring path forming layer 18 and the bump forming layer 19, a known sputtering method, vacuum vapor deposition method, plating method or the like can be employed. In particular, the sputtering method has a higher adhesion strength to glass than a vacuum deposition method or the like, and can form a film with a uniform thickness compared to a plating method.

  Next, as shown in FIGS. 15A and 15B, a resist 20 is applied to the bump forming layer 19 on the surface where the bumps 14 on the pressure contact wiring paths 12a ′, 12b ′, 12c ′ are to be formed.

  Next, as shown in FIGS. 16A and 16B, the bump forming layer 19 is subjected to primary etching, and the portion to which the resist 20 is applied is left to form the bumps 14.

  Next, as shown in FIGS. 17A and 17B, the resist 20 is removed.

  Next, as shown in FIGS. 18A and 18B, a resist 21 corresponding to the wiring path 12 pattern and the bump 14, that is, a resist pattern is applied.

  Next, as shown in FIGS. 19A and 19B, the wiring path forming layer 18 is subjected to secondary etching to form a wiring path 12 pattern corresponding to the resist pattern.

  Next, as shown in FIGS. 20A and 20B, the resist 21 is removed.

  Therefore, the wiring path 12 pattern with bumps 14 in a plurality of sections is formed on the surface of one circular transparent glass plate 6B shown in FIG.

  Next, as shown in FIG. 22A, the pattern of the plurality of sections is divided into sections to obtain a plurality of glass probe substrates 6D.

  As a method for dividing the glass, a method using a diamond cutter is generally used, but a fusing method using a laser beam, a method using a water jet, and the like are also employed.

  In the semiconductor manufacturing industry, a cutting method using a dicing saw 22 is employed as a method of cutting an IC chip from an IC wafer.

  As described above, in the present invention, the fine irregularities 10 are formed on the front end surface 13 of the glass plate 6C forming the probe substrate 6D to form a semi-translucent surface, and the front end edge 7 of the transparent glass probe substrate 6D and the flat plate are formed. The overlap state is formed with the side edge of the display panel 2, and the pressure contact portion 9 and the electrode 3 are aligned by passing through the transparent glass plate front edge 7 inside the semi-translucent surface. In this configuration, a cutting method using a dicing saw 22 used in the semiconductor manufacturing industry is applied as a method of imparting fine irregularities 10 to the front end face 13.

  The dicing saw 22 is a thin disk formed by solidifying fine abrasive grains typified by diamond of 40 to 60 μm with an adhesive, and as shown in FIGS. 22B and 22C, while rotating the dicing saw 22 at a high speed, Cutting is performed according to the pattern partition lines, and the substrate is divided into a plurality of glass probe substrates 6D.

  Thus, as shown in FIG. 8, the front end face 13 of the glass plate 6C forming the probe substrate 6D is formed in a plane perpendicular to the surface, and the grain size of the abrasive grains of the dicing saw 22 is formed on the front end face perpendicular to the surface. The fine irregularities 10 corresponding to the above are formed, and a semi-transparent surface is formed.

  At the same time, with the progress of cutting by the dicing saw 22, the upper and lower corners of the front end face 13 are slightly removed by the abrasive grains, thereby preventing breakage from the corners and generation of progressive cracks from the corners.

  As an example of a preferred embodiment, the front end surface 13 of the glass plate 6C is a projecting curved surface 11, the fine irregularities 10 are formed on the projecting curved surface 11 to form a semi-translucent surface, and the transparent inside the semi-transparent surface is formed. The glass plate front end edge 7 is transmitted to achieve the above alignment.

  As an example, the probe substrate 6D is divided by a dicing saw 22 shown in FIG. 22, and the front end surface 13 is provided with the fine unevenness 10 and then the front end having the fine unevenness 10 is shown in FIGS. 23A and 23B. The surface 13 is finished into a projecting curved surface 11 using a chamfering grindstone 23.

  The chamfering grindstone 23 is formed by thinning a fine disc shape by hardening fine abrasive grains typified by diamond of 20 to 30 μm with an adhesive, and forming an annular groove 24 having a concave curved shape on the outer peripheral surface thereof. The chamfering grindstone 23 is rotated while bringing the front end surface 13 of the substrate 6D into pressure contact, and the front end surface 13 of the probe substrate 6D is shaped into the projecting surface 11 that follows the concave surface of the annular groove 24, while being formed on the projecting surface 11. Fine irregularities 10 corresponding to the grain size of the abrasive grains are formed to make a semi-translucent surface.

  As a preferable example, the particle diameter of the fine abrasive grains of the chamfering grindstone 23 is made smaller than that of the dicing saw 22, and an uneven surface having a large surface roughness is first formed by the dicing saw 22, and then the chamfering grindstone 23 is used. A method of finishing the unevenness 10 having a small surface roughness is adopted.

  The projecting curved surface 11 on which the fine irregularities 10 are formed satisfactorily prevents the occurrence of breakage due to corner contact and progressive cracks from the corner.

  The fine unevenness 10 surface and the projecting curved surface 11 need to be formed at least on the front end surface 13 of the glass probe substrate 6D, and while forming the fine unevenness 10 and the projecting curved surface on the front end surface 13, This does not exclude the case where a similar projecting surface 11 or fine irregularities 10 are formed on the rear end surface.

  2 ... Flat display panel, 3 ... Electrode, 6A ... Large transparent glass plate, 6B ... Circular transparent glass plate, 6C ... Transparent glass plate, 6D ... Probe substrate, 7 ... Front edge of glass plate or probe substrate 8 ... side edge of flat display panel, 9 ... pressure contact portion, 10 ... irregularities, 11 ... projecting curved surface, 12 ... wiring path, 12a, 12b, 12c ... inspection wiring path, 12a ', 12b', 12c '... Pressure contact wiring path, 13 ... Front end surface of glass plate, 14 ... Bump, 15 ... Overhang, 16 ... Pressure contact surface, 17 ... Protective coat, 18 ... Wiring path forming layer, 19 ... Bump formation Layers 20 ... resist, 21 ... resist, 22 ... dicing saw, 23 ... chamfering grindstone, 24 ... annular groove.

Claims (3)

A large number of pressure contact portions are arranged along the surface of the front edge of the probe substrate, the front edge of the probe substrate is overlapped with the side edge of the flat display panel, and is arranged along the surface of the front edge of the probe substrate. In the flat display panel inspection probe substrate for performing inspection by applying pressure contact to the electrodes arranged along the surface of the side edge of the flat display panel, the probe substrate is made of a transparent glass plate. And forming a semi-transparent surface by forming fine irregularities on the front end surface of the glass plate, and forming the overlap state between the front edge of the transparent glass probe substrate and the side edge of the flat display panel The transparent glass plate front end edge inside the semi-translucent surface is transmitted to align the pressure contact portion with the electrode. Flat display panel inspection probe substrate, characterized in that. The front end surface of the glass plate is a surface substantially perpendicular to the surface, and fine irregularities corresponding to abrasive grains having a particle size of 40 to 60 μm are formed on the front end surface of the right angle to form the semi-translucent surface. The flat display panel inspection probe substrate according to claim 1, wherein: 3. The flat display panel inspection probe substrate according to claim 1, wherein the upper and lower corners of the front end surface of the glass plate formed with fine irregularities to form a semi-transparent surface are slightly removed.