CN111668579A - 一种5g通讯滤波器介质陶瓷件半成品及其成型方法 - Google Patents

一种5g通讯滤波器介质陶瓷件半成品及其成型方法 Download PDF

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CN111668579A
CN111668579A CN202010482705.7A CN202010482705A CN111668579A CN 111668579 A CN111668579 A CN 111668579A CN 202010482705 A CN202010482705 A CN 202010482705A CN 111668579 A CN111668579 A CN 111668579A
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dielectric ceramic
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郭忠臣
张亮
白珍敏
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Huizhou Weibo Precision Technology Co ltd
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Abstract

本发明涉及一种5G通讯滤波器介质陶瓷件半成品及其成型方法，包括主体，所述主体设有十字型通孔和一字型通孔，所述十字型通孔位于所述主体的边缘，所述主体的正面设有第一盲孔，所述主体的背面设有第二盲孔，所述主体设有延伸部，所述延伸部位于所述主体上靠近所述十字型通孔的一侧，所述延伸部为圆弧形结构；所述成型方法步骤包括设计模具，制造喂料，注射成型，溶剂脱脂，热脱脂以及烧结。本发明在主体薄壁处增加了延伸部，并且可以一次注射成型，有效地改善了5G通讯滤波器介质陶瓷件注射成型的缺陷，保证了产品的质量，从而提高了良品率，并且加工过程简单，适合批量生产。

Description

一种5G通讯滤波器介质陶瓷件半成品及其成型方法
技术领域
本发明涉及陶瓷注射成型技术领域，特别是关于一种5G通讯滤波器介质陶瓷件半成品及其成型方法。
背景技术
5G通讯滤波器介质陶瓷件是5G微波通讯的核心部件，其结构复杂，要求较高，现有制造方法是：采用粉末压制成型的方法制造成半成品，后续经过镀银等一系列处理制造成成品。由于粉末压制成型厚度方向上尺寸难以控制，并且压制成型毛坯的密度也不均匀，烧结后容易产生产品的变形，以上缺点必须通过烧结后的机械加工得以弥补，因此生产成本高，效率低。不但如此，此产品由于孔位较多，并且双面都有孔位，压制成型过程中产品非常容易出现开裂和潜在的微裂纹而影响产品的良率，成本增加。
发明内容
有鉴于此，本发明为解决上述技术问题，提供一种采用注射成型的5G通讯滤波器介质陶瓷件半成品及其成型方法。
本发明的目的通过以下技术方案实现：
一种5G通讯滤波器介质陶瓷件半成品，包括主体，所述主体设有十字型通孔和一字型通孔，所述十字型通孔位于所述主体的边缘，所述主体的正面设有第一盲孔，所述主体的背面设有第二盲孔，所述主体设有延伸部，所述延伸部位于所述主体上靠近所述十字型通孔的一侧，所述延伸部为圆弧形结构。
进一步的，所述延伸部沿所述主体的宽度方向延伸，所述延伸部与主体的两侧光滑过渡，所述延伸部的厚度小于所述主体的厚度。
一种5G通讯滤波器介质陶瓷件半成品的成型方法，包括如下步骤：
步骤一：设计模具，所述模具的设计包括5G通讯滤波器介质陶瓷件半成品结构的设计、以及型腔尺寸的设计；
步骤二：制造喂料，选取陶瓷粉末和粘结剂，将陶瓷粉末和粘结剂按预设的体积比置入密炼机密炼，并由造粒机造粒制成喂料；
步骤三：注射成型，由注射机将所述喂料注射进所述模具得到注射毛坯；
步骤四：溶剂脱脂，将所述注射毛坯置于萃取油中进行浸泡，脱除部分粘结剂，制成萃取坯；
步骤五：热脱脂，将所述萃取坯至于热脱脂炉内加热脱去剩余粘结剂，制成脱脂坯；
步骤六：烧结：将所述脱脂坯置于陶瓷烧结炉进行烧结。
进一步的，所述陶瓷粉末和粘结剂按质量分数的占比分别为60％和40％。
进一步的，所述陶瓷粉末为钛酸钙和钛酸镁混合粉末，所述陶瓷粉末的平均粒度为9.9微米。
进一步的，所述粘结剂为油溶性粘结剂，所述粘结剂由PE、PP、POM、EVA、PW、SA以及PVA分别按25%、5%、5%、5%、52%、3%以及5%的质量分数混合制成。
进一步的，所述步骤二中密炼的时间为40分钟；所述步骤三中注射机的注射温度为185℃，压力为80Mpa，模具温度为75℃。
进一步的，所述步骤四中的浸泡时间为5小时，浸泡温度为55℃。
进一步的，所述步骤五中热脱脂炉内的温度参数为，先将室温升温到350℃，时间4小时，保温2小时，然后2小时升温到550℃，保温2小时。
进一步的，所述步骤六中的烧结的温度为1360℃，保温3小时。
本发明相较于现有技术的有益效果是：
一、本发明在5G通讯滤波器介质陶瓷件薄壁处进行了厚度增加，注射成型完成后通过CNC加工去除增加部分，有效地改善了5G通讯滤波器介质陶瓷件注射成型的缺陷，保证了产品的内在和外在质量，从而提高了良品率，并且加工过程简单，适合批量生产。
二、本发明的5G通讯滤波器介质陶瓷件的成型方法，通过对模具的设计以及喂料的制造，使其在成型时可一次注射成型，减少对5G通讯滤波器介质陶瓷件半成品的外形结构的多次加工，降低制作难度，节省成本，提高加工效率，节省材料。
附图说明
图1为本发明实施例5G通讯滤波器介质陶瓷件半成品的结构示意图。
图2为本发明实施例5G通讯滤波器介质陶瓷件成品的正面结构示意图。
图3为本发明实施例5G通讯滤波器介质陶瓷件成品的背面结构示意图。
具体实施方式
为了便于本领域技术人员理解，下面将结合具体实施例及附图对本发明作进一步详细描述。
请参考图1-图2，本发明一较佳实施例为。
通过本实施例5G通讯滤波器介质陶瓷件半成品制成的5G通讯滤波器介质陶瓷件可被固定于5G通讯滤波器机壳体内，用于微波通讯信号的过滤处理。具体的，一种5G通讯滤波器介质陶瓷件半成品，包括主体1，主体1设有十字型通孔22和一字型通孔3，十字型通孔22位于主体1的边缘，主体1的正面设有第一盲孔4，主体1的背面设有第二盲孔5，主体1设有延伸部6，延伸部6位于主体1上靠近十字型通孔22的一侧，延伸部6为圆弧形结构。
在本实施例中，主体11呈四方体结构板状，其上正面方向有七个圆形第一盲孔4，一个一字型通孔3，一个十字型通孔，背面在十字型通孔两侧有两个圆形第二盲孔5。由于该5G通讯滤波器介质陶瓷件主体1的孔位和沟槽较多，因此，相应的模具型腔突出的型芯多。另外，由于十字型通孔22靠近主体1边缘处为薄壁，且由于本介质陶瓷件喂料粘度高，流动性差，陶瓷材料的比热小，熔融状态后的喂料含热量低冷却块，在注射成型时不容易充满模具，易造成缺料、流痕、夹层缺陷。因此在上述薄壁处增加延伸部6，以此来改善注射成型的充模质量，提高产品的良率。
在本实施例中，为保证主体1两侧R角和厚度方向C角的完整性，延伸部6的结构为圆弧形向主体1的宽度方向延伸，与主体1两侧的R角光滑过渡连接，厚度低于主体1两侧的C角。使得延伸部6在进行粉末注射时与介质陶瓷件本体一起成型，材料相同，收缩率也一致。注射成型完成后，通过CNC加工去除增加部分后即可得到成品的介质陶瓷件，加工过程简单且良品率高，适合批量生产。
上述5G通讯滤波器介质陶瓷件半成品的成型方法，包括如下步骤：
步骤一：设计模具，模具的设计包括5G通讯滤波器介质陶瓷件半成品结构的设计、以及型腔尺寸的设计；具体的，可依据上述5G通讯滤波器介质陶瓷件半成品的结构确定模具的分型面、浇口以及顶出方式等。
步骤二：制造喂料，选取陶瓷粉末和粘结剂，将陶瓷粉末和粘结剂按预设的体积比置入密炼机密炼40分钟，并由造粒机造粒制成喂料；其中，陶瓷粉末和粘结剂按质量分数的占比分别为60％和40％。陶瓷粉末为钛酸钙和钛酸镁混合粉末，其平均粒度尺寸D50为9.9微米。粘结剂为油溶性粘结剂。粘结剂的配方为，PE：25%、PP：5%、POM：5%、EVA：5%、PW：52%、SA：3%以及PVA：5%，其中，PE为聚乙烯，PP为聚丙烯，POM为聚甲醛，EVA为乙烯和乙酸乙烯的共聚材料，PW为石蜡，SA为硬脂酸，PVA为聚乙烯醇树脂。该粘结剂一方面价格低廉、易于获取，且无毒无环境污染，另一方面其粘度低，制成喂料的流动性好，且容易脱除，脱除后无残留。另外，该粘结剂不会与陶瓷粉末发生化学反应。粘结剂在制造时，在混料前首先将比例分数的PE、PP、POM、EVA、PW、PVA、SA用塑料混合用的高速混机混合打碎，以便于喂料制作时更容易是粘结剂混合均匀，混料时间会更短，也能减少粘结剂的挥发。
步骤三：注射成型，由注射机将喂料注射进模具得到注射毛坯；其中，注射机的注射温度为185℃，压力为80Mpa，模具温度为75℃，使得喂料在加热塑化状态下注入模腔内固化成型。
步骤四：溶剂脱脂，将注射毛坯置于萃取油中进行浸泡，脱除部分粘结剂，制成萃取坯；其中，萃取油的温度控制在55℃，浸泡的时间为5小时。
步骤五：热脱脂，将萃取坯至于热脱脂炉内加热脱去剩余粘结剂，制成脱脂坯；将萃取坯置于热脱脂炉中，进行程序升温，将热脱脂炉控制在室温升温到350℃，时间4小时，保温2小时，然后2小时升温到550℃，保温暖2小时，以脱除注射毛坯中的全部粘结剂。
步骤六：烧结，将脱脂坯置于陶瓷烧结炉进行烧结。其中，陶瓷烧结炉为真空脱脂一体炉，烧结温度为1360℃，并保温3小时。
通过上述步骤注射成型制造制得的5G通讯滤波器介质陶瓷件半成品可一次成型，减少对5G通讯滤波器介质陶瓷件半成品的外形结构的多次加工，降低制作难度，节省成本，提高加工效率，节省材料；同时通过模具设计，使产品精度更高，保证了产品的一致性和互换性。
虽然对本发明的描述是结合以上具体实施例进行的，但是，熟悉本技术领域的人员能够根据上述的内容进行许多替换、修改和变化、是显而易见的。因此，所有这样的替代、改进和变化都包括在附后的权利要求的精神和范围内。

Claims (10)

1.一种5G通讯滤波器介质陶瓷件半成品，包括主体，所述主体设有十字型通孔和一字型通孔，所述十字型通孔位于所述主体的边缘，所述主体的正面设有第一盲孔，所述主体的背面设有第二盲孔，其特征在于，所述主体设有延伸部，所述延伸部位于所述主体上靠近所述十字型通孔的一侧，所述延伸部为圆弧形结构。
2.根据权利要求1所述的一种5G通讯滤波器介质陶瓷件半成品及其成型方法，其特征在于，所述延伸部沿所述主体的宽度方向延伸，所述延伸部与主体的两侧光滑过渡，所述延伸部的厚度小于所述主体的厚度。
3.一种5G通讯滤波器介质陶瓷件半成品的成型方法，其特征在于，包括如下步骤：
步骤一：设计模具，所述模具的设计包括5G通讯滤波器介质陶瓷件半成品结构的设计、以及型腔尺寸的设计；
步骤二：制造喂料，选取陶瓷粉末和粘结剂，将陶瓷粉末和粘结剂按预设的体积比置入密炼机密炼，并由造粒机造粒制成喂料；
步骤三：注射成型，由注射机将所述喂料注射进所述模具得到注射毛坯；
步骤四：溶剂脱脂，将所述注射毛坯置于萃取油中进行浸泡，脱除部分粘结剂，制成萃取坯；
步骤五：热脱脂，将所述萃取坯至于热脱脂炉内加热脱去剩余粘结剂，制成脱脂坯；
步骤六：烧结，将所述脱脂坯置于陶瓷烧结炉进行烧结。
4.根据权利要求3所述的一种5G通讯滤波器介质陶瓷件半成品的成型方法，其特征在于，所述陶瓷粉末和粘结剂按质量分数的占比分别为60％和40％。
5.根据权利要求4所述的一种5G通讯滤波器介质陶瓷件半成品的成型方法，其特征在于，所述陶瓷粉末为钛酸钙和钛酸镁混合粉末，所述陶瓷粉末的平均粒度为9.9微米。
6.根据权利要求4所述的一种5G通讯滤波器介质陶瓷件半成品的成型方法，其特征在于，所述粘结剂为油溶性粘结剂，所述粘结剂由PE、PP、POM、EVA、PW、SA以及PVA分别按25%、5%、5%、5%、52%、3%以及5%的质量分数混合制成。
7.根据权利要求3所述的一种5G通讯滤波器介质陶瓷件半成品的成型方法，其特征在于，所述步骤二中密炼的时间为40分钟；所述步骤三中注射机的注射温度为185℃，压力为80Mpa，模具温度为75℃。
8.根据权利要求3所述的一种5G通讯滤波器介质陶瓷件半成品的成型方法，其特征在于，所述步骤四中的浸泡时间为5小时，浸泡温度为55℃。
9.根据权利要求3所述的一种5G通讯滤波器介质陶瓷件半成品的成型方法，其特征在于，所述步骤五中热脱脂炉内的温度参数为，先将室温升温到350℃，时间4小时，保温2小时，然后2小时升温到550℃，保温2小时。
10.根据权利要求3所述的一种5G通讯滤波器介质陶瓷件半成品的成型方法，其特征在于，所述步骤六中的烧结的温度为1360℃，保温3小时。
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