CN111656540B - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN111656540B
CN111656540B CN201880087698.1A CN201880087698A CN111656540B CN 111656540 B CN111656540 B CN 111656540B CN 201880087698 A CN201880087698 A CN 201880087698A CN 111656540 B CN111656540 B CN 111656540B
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China
Prior art keywords
light receiving
light
light emitting
receiving element
emitting element
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CN201880087698.1A
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Chinese (zh)
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CN111656540A (zh
Inventor
黑羽淳史
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Aoi Electronics Co Ltd
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Aoi Electronics Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto

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  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Bipolar Transistors (AREA)
  • Noodles (AREA)
CN201880087698.1A 2018-01-29 2018-12-21 半导体装置 Active CN111656540B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018012842A JP6620176B2 (ja) 2018-01-29 2018-01-29 半導体装置
JP2018-012842 2018-01-29
PCT/JP2018/047287 WO2019146339A1 (ja) 2018-01-29 2018-12-21 半導体装置

Publications (2)

Publication Number Publication Date
CN111656540A CN111656540A (zh) 2020-09-11
CN111656540B true CN111656540B (zh) 2023-06-13

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ID=67395853

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CN201880087698.1A Active CN111656540B (zh) 2018-01-29 2018-12-21 半导体装置

Country Status (5)

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JP (1) JP6620176B2 (cg-RX-API-DMAC7.html)
KR (1) KR102459822B1 (cg-RX-API-DMAC7.html)
CN (1) CN111656540B (cg-RX-API-DMAC7.html)
TW (1) TWI785195B (cg-RX-API-DMAC7.html)
WO (1) WO2019146339A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7189994B2 (ja) * 2021-04-16 2022-12-14 アオイ電子株式会社 半導体装置およびその製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001250978A (ja) * 2000-03-08 2001-09-14 Sharp Corp 光結合素子
JP2004063764A (ja) * 2002-07-29 2004-02-26 Toshiba Corp 光結合半導体装置、およびその製造方法
JP3684823B2 (ja) * 1998-03-26 2005-08-17 松下電工株式会社 半導体リレー
JP2005283457A (ja) * 2004-03-30 2005-10-13 Olympus Corp 光学式エンコーダ及びその製造方法
CN101872761A (zh) * 2009-04-23 2010-10-27 欧姆龙株式会社 光耦合装置
CN104396026A (zh) * 2012-06-20 2015-03-04 青井电子株式会社 光源一体型光传感器
JP2015095584A (ja) * 2013-11-13 2015-05-18 ローム株式会社 光学装置、光学装置の製造方法
CN104916728A (zh) * 2014-03-14 2015-09-16 株式会社东芝 光耦合装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6132535A (ja) * 1984-07-25 1986-02-15 Sanyo Electric Co Ltd センサの製造方法
JPH06204508A (ja) * 1992-12-28 1994-07-22 Canon Inc 光学式検出装置
JP3573400B2 (ja) * 1997-07-16 2004-10-06 シャープ株式会社 光学式入力装置
JP4812189B2 (ja) * 2001-06-15 2011-11-09 オリンパス株式会社 光学式検出装置
EP1376960A1 (en) 2002-06-29 2004-01-02 Deutsche Thomson-Brandt Gmbh Data link layer device with two transmission modes for a serial communication bus
JP2005038956A (ja) * 2003-07-17 2005-02-10 Matsushita Electric Ind Co Ltd 光部品とその製造方法
JP4021382B2 (ja) * 2003-07-28 2007-12-12 オリンパス株式会社 光学式エンコーダ及びその製造方法並びに光学レンズモジュール
KR101069197B1 (ko) * 2009-09-25 2011-09-30 전자부품연구원 발광 및 수광 소자가 일체로 형성된 패키지 모듈
EP2860497B2 (de) * 2013-10-09 2019-04-10 SICK STEGMANN GmbH Optoelektronischer Sensor und Verfahren zur Herstellung eines solchen
US10199412B2 (en) * 2014-07-25 2019-02-05 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules including an image sensor having regions optically separated from one another

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3684823B2 (ja) * 1998-03-26 2005-08-17 松下電工株式会社 半導体リレー
JP2001250978A (ja) * 2000-03-08 2001-09-14 Sharp Corp 光結合素子
JP2004063764A (ja) * 2002-07-29 2004-02-26 Toshiba Corp 光結合半導体装置、およびその製造方法
JP2005283457A (ja) * 2004-03-30 2005-10-13 Olympus Corp 光学式エンコーダ及びその製造方法
CN101872761A (zh) * 2009-04-23 2010-10-27 欧姆龙株式会社 光耦合装置
CN104396026A (zh) * 2012-06-20 2015-03-04 青井电子株式会社 光源一体型光传感器
JP2015095584A (ja) * 2013-11-13 2015-05-18 ローム株式会社 光学装置、光学装置の製造方法
CN104916728A (zh) * 2014-03-14 2015-09-16 株式会社东芝 光耦合装置

Also Published As

Publication number Publication date
JP2019133994A (ja) 2019-08-08
TW201941447A (zh) 2019-10-16
TWI785195B (zh) 2022-12-01
WO2019146339A1 (ja) 2019-08-01
JP6620176B2 (ja) 2019-12-11
KR102459822B1 (ko) 2022-10-26
CN111656540A (zh) 2020-09-11
KR20200090239A (ko) 2020-07-28

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