CN111653856A - Ceramic rectangular terahertz waveguide tube core, waveguide assembly and preparation method thereof - Google Patents
Ceramic rectangular terahertz waveguide tube core, waveguide assembly and preparation method thereof Download PDFInfo
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- CN111653856A CN111653856A CN202010589104.6A CN202010589104A CN111653856A CN 111653856 A CN111653856 A CN 111653856A CN 202010589104 A CN202010589104 A CN 202010589104A CN 111653856 A CN111653856 A CN 111653856A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/12—Hollow waveguides
- H01P3/14—Hollow waveguides flexible
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/002—Manufacturing hollow waveguides
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Abstract
The invention provides a ceramic rectangular terahertz waveguide tube core, a waveguide assembly and a preparation method thereof, and belongs to the technical field of terahertz device preparation. The invention adopts the stacking and pressing process of three ceramic substrates to prepare the waveguide core, and assembles the waveguide core into the gold-plated metal tube shell containing the appearance of the waveguide component and the flange to form the complete waveguide component, wherein the width and the height of the open cavity of the waveguide are separately controlled and prepared, thereby effectively avoiding the problem that the right angle of the inner cavity of the waveguide is arc-shaped, adopting the array processing method, improving the processing and manufacturing efficiency, and greatly improving the consistency of the electrical performance of each unit waveguide, thereby having good value of practical application.
Description
Technical Field
The invention belongs to the technical field of terahertz device preparation, and particularly relates to a ceramic rectangular terahertz waveguide tube core, a waveguide assembly and a preparation method thereof.
Background
The information in this background section is only for enhancement of understanding of the general background of the invention and is not necessarily to be construed as an admission or any form of suggestion that this information forms the prior art that is already known to a person of ordinary skill in the art.
Terahertz (THz) has a frequency range in the electromagnetic spectrum of approximately 0.1THz to 10 THz. THz waves have unique transients, broadband, coherence and low energy. In recent years, THz waves are more and more concerned by countries in the world due to their unique performance and wide potential application value, and with the deepening of application research and the expansion of interdisciplinary fields, the research and application of THz waves will be in a vigorous development stage.
Because the processing size of the microwave device is gradually reduced along with the improvement of the working frequency, the size processing precision breaks through the limit of the conventional mechanical processing equipment in the terahertz frequency band, and higher requirements are provided for the processing means and the processing precision. Therefore, the terahertz miniature metal part has the contradiction between the large size of the whole part and the requirements of the small size and micron-sized geometric tolerance of the waveguide, and has the problem that the three-dimensional and curved-surface three-dimensional structure is difficult to form. The inventor finds that the conventional milling process is unstable, the service life of the micro-diameter milling cutter is short, the form and position precision is difficult to guarantee, the problems that a horn mouth and a right-angle position of a waveguide inner cavity are in a circular arc shape and the like exist, and the traditional processing technology can only process a single part and has the defects that the form and position size consistency among waveguide tube cores is poor and the processing efficiency is low.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a ceramic rectangular terahertz waveguide tube core, a waveguide assembly and a preparation method thereof. The waveguide tube core is prepared by adopting a three-ceramic-substrate stacking and pressing process, and is assembled into a gold-plated metal tube shell containing the appearance of the waveguide component and a flange to form a complete waveguide component, wherein the width and the height of an open cavity of the waveguide are separately controlled and prepared, so that the problem that the right-angle corner of the inner cavity of the waveguide is arc-shaped is effectively avoided, the array processing method is adopted, the processing and manufacturing efficiency is improved, and the consistency of the electrical performance of each unit waveguide is also greatly improved.
In order to achieve the technical purpose, the technical scheme of the invention is as follows:
in a first aspect of the invention, a ceramic rectangular terahertz waveguide tube core is provided, and is formed by stacking and pressing a plurality of layers of alumina ceramic substrates;
the alumina ceramic substrate is three layers; wherein, the three layers of alumina ceramic substrates are respectively defined as an upper cover ceramic layer, a tube core ceramic layer and a lower bottom ceramic layer.
The tube core ceramic layer is provided with a waveguide cavity, and the waveguide cavity is obtained through laser opening.
In a second aspect of the present invention, a preparation method of the ceramic rectangular terahertz waveguide tube core is provided, where the preparation method includes:
s1, processing each ceramic substrate by adopting a laser processing technology, and ensuring that the shapes and the mutual position relations of the ceramic substrates are consistent so as to realize accurate alignment of the ceramic substrates; preferably, an alignment mark technology is adopted to ensure that the shapes and the mutual position relations of the ceramic substrates of all layers are consistent, so as to realize accurate alignment of all layers;
s2, performing surface metallization treatment on each ceramic substrate by adopting a magnetron sputtering technology, and electroplating gold to a certain total thickness d of the metallization layer by taking the metallization layer as a seed layer and adopting an electroplating technology so as to reduce waveguide loss caused by a skin effect;
s3, stacking the ceramic substrates in sequence, adjusting the relative positions of the layers, aligning the layers through the alignment marks of the layers, and performing stacking and pressing treatment by pressurizing and heating; the invention enables the surface gold plating layer to complete the full pressing between the ceramic substrates through the diffusion effect by the pressurizing and heating process;
s4, processing the waveguide core shape by using the positioning mark as a reference by adopting a laser processing technology;
and S5, performing surface sputtering and gold electroplating treatment on the waveguide core to enable each surface of the waveguide core to be covered by metal.
In a third aspect of the invention, the application of the ceramic rectangular terahertz waveguide tube core in the preparation of a waveguide assembly is provided.
In a fourth aspect of the invention, a waveguide assembly is provided, which comprises the ceramic rectangular terahertz waveguide tube core.
Specifically, the waveguide assembly includes: the ceramic rectangular terahertz waveguide tube core is arranged in the upper cavity assembly and the lower cavity assembly; the upper cavity assembly and the lower cavity assembly can be used for assembling and fixing the waveguide core; the waveguide component has the appearance structure and the flange structure of the waveguide component, and the waveguide component is convenient to use.
In a fifth aspect of the present invention, there is provided an assembling method of the above waveguide assembly, the assembling method comprising: arranging the ceramic rectangular terahertz waveguide tube core into the upper cavity assembly and the lower cavity assembly; and (5) arranging the positioning pin, namely completing assembly.
The beneficial technical effects of one or more technical schemes are as follows:
(1) in the technical scheme, the critical indexes of the waveguide open cavity width and the open cavity height are controlled separately, the open cavity width is controlled by adopting a method of opening a through cavity by laser while considering the total thickness of the metalized layer, the open cavity height is controlled by adopting a method of selecting the thickness of the middle-layer ceramic piece and considering the total thickness of the surface metalized layer, and the problem that the right-angle part of the waveguide inner cavity is in a circular arc shape can be effectively avoided by adopting the through cavity method, so that the waveguide inner cavity is in a standard right angle;
(2) in the technical scheme, a method of simultaneous pressurization and heating is adopted during stacking and pressing, so that the gold-plated layer on the surface can complete full pressing among the ceramic substrates through diffusion, and the problem of electromagnetic signal leakage of the waveguide cavity can be effectively avoided;
(3) according to the technical scheme, the movement of each axis of x, y, z and theta and the automatic programming function of the wafer bearing table of the laser processing equipment are fully utilized to carry out array processing on each unit waveguide tube core, the shape, position and height of each unit waveguide tube core are kept consistent, the processing and manufacturing efficiency is improved, and the consistency of the electrical performance of each unit waveguide is greatly improved.
In conclusion, compared with the original traditional machining method, the technical scheme can effectively avoid the problem that the right angle of the waveguide inner cavity is arc-shaped; the method of simultaneous pressurization and heating is adopted during stacking and laminating, so that the gold-plated layer on the surface can complete full lamination among the ceramic substrates through diffusion, and the problem of electromagnetic signal leakage of the waveguide cavity can be effectively avoided; the array processing method is adopted, the processing and manufacturing efficiency is improved, and the consistency of the electrical performance of each unit waveguide is greatly improved, so that the method has good practical application value.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings according to the provided drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a waveguide assembly in an embodiment of the present invention; wherein, 1 is an upper cavity component, 2 is a lower cavity component, and 3 is a waveguide core;
FIG. 2 is a schematic view of a three-layer ceramic process in an embodiment of the present invention; wherein, 4 is upper cover ceramic, 5 is tube core ceramic, 6 is lower bottom ceramic, 4-1 is upper cover ceramic alignment mark, 5-1 is tube core ceramic alignment mark, and 6 is lower bottom ceramic alignment mark;
FIG. 3 is a schematic view of a three-layer ceramic metallized surface treatment according to an embodiment of the present invention, and FIG. 7 is a waveguide cavity;
FIG. 4 is a schematic diagram of a three-layer ceramic implementation stack in an embodiment of the present invention;
FIG. 5 illustrates the fabrication of a waveguide die profile in an embodiment of the present invention; 8 is a schematic shape diagram of a processed waveguide tube core;
FIG. 6 is a schematic view of a waveguide die in an embodiment of the invention;
FIG. 7 is a schematic illustration of the dimensions of the cavity of the waveguide cavity in an embodiment of the invention;
FIG. 8 is a diagram of a processed waveguide die profile in an embodiment of the present invention;
FIG. 9 is a schematic view of an assembly of a waveguide assembly in an embodiment of the invention; wherein, 9 is the dowel, 10 is the dowel, 11 is the dowel, 12 is the dowel.
Detailed Description
It is to be understood that the following detailed description is exemplary and is intended to provide further explanation of the invention as claimed. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise. It is to be understood that the scope of the invention is not to be limited to the specific embodiments described below; it is also to be understood that the terminology used in the examples is for the purpose of describing particular embodiments only, and is not intended to limit the scope of the present invention.
As mentioned above, the terahertz miniature metal part has the contradiction between the large size of the whole part and the small size of the waveguide and micron-sized geometric tolerance requirements, and has the problems that the three-dimensional and curved-surface three-dimensional structure is difficult to form and the like.
In view of the above, in one embodiment of the present invention, a ceramic rectangular terahertz waveguide die is provided, which is formed by stacking and pressing a plurality of layers of alumina ceramic substrates; the alumina ceramic substrate can be selected from common alumina ceramic substrates with the color of more than 96%.
Preferably, the alumina ceramic substrate is three layers; wherein, the three layers of alumina ceramic substrates are respectively defined as an upper cover ceramic layer, a tube core ceramic layer and a lower bottom ceramic layer.
The tube core ceramic layer is provided with a waveguide cavity, and the waveguide cavity is obtained through laser opening.
Each layer of alumina ceramic substrate adopts metallization treatment; in order to satisfy the adhesion of the metallized layer, a multilayer metallization treatment is preferably employed.
Wherein, magnetron sputtering technology can be selected for metallization treatment.
In another embodiment of the present invention, in order to meet the requirement of conductor loss of the waveguide in transmitting electromagnetic signals, the outermost layer of the metallization layer is gold, and the thickness of the gold layer is set according to the actual requirement.
The gold layer is performed by an electroplating technique.
In another embodiment of the invention, a method for preparing the ceramic rectangular terahertz waveguide die is provided, and the method comprises the following steps:
s1, processing each ceramic substrate by adopting a laser processing technology, and ensuring that the shapes and the mutual position relations of the ceramic substrates are consistent so as to realize accurate alignment of the ceramic substrates; preferably, an alignment mark technology is adopted to ensure that the shapes and the mutual position relations of the ceramic substrates of all layers are consistent, so as to realize accurate alignment of all layers;
s2, performing surface metallization treatment on each ceramic substrate by adopting a magnetron sputtering technology, and electroplating gold to a certain total thickness d of the metallization layer by taking the metallization layer as a seed layer and adopting an electroplating technology so as to reduce waveguide loss caused by a skin effect;
s3, stacking the ceramic substrates in sequence, adjusting the relative positions of the layers, aligning the layers through the alignment marks of the layers, and performing stacking and pressing treatment by pressurizing and heating; the invention enables the surface gold plating layer to complete the full pressing between the ceramic substrates through the diffusion effect by the pressurizing and heating process;
s4, processing the waveguide core shape by using the positioning mark as a reference by adopting a laser processing technology;
and S5, performing surface sputtering and gold electroplating treatment on the waveguide core to enable each surface of the waveguide core to be covered by metal.
In step S1, processing a waveguide cavity in the core ceramic layer by using a laser technique;
in another embodiment of the present invention, the preparation is completed by separately controlling the cavity opening width and the cavity opening height of the waveguide cavity, and the cavity opening width of the waveguide cavity is compensated in advance according to the requirement, i.e. the inner cavity width taking into account the total thickness of the metalized layer after surface treatment meets the requirement; the open cavity height is achieved by choosing the thickness of the ceramic sheet of the die ceramic layer while taking into account the total thickness of the metallization layer, i.e. compensating similar to the open cavity width.
In another embodiment of the present invention, when the width of the cavity of the waveguide cavity is W, the height of the cavity is H, and the total thickness of the metallization layer is d, the ceramic thickness H 'of the die ceramic layer is H-2d, and the cavity opening size W' of the waveguide cavity is W +2 d.
In still another embodiment of the present invention, in the step S3, the specific conditions of the pressure and heat treatment are as follows: the pressurizing pressure is controlled to be more than 8000mbar (containing 8000mbar), the heating temperature is controlled to be 300-400 ℃ (350 ℃ is preferred), and the treatment time is 0.2-1 hour, preferably 0.5 hour.
In another embodiment of the invention, the application of the ceramic rectangular terahertz waveguide tube core in preparing a waveguide assembly is provided.
In yet another embodiment of the present invention, there is provided a waveguide assembly comprising the ceramic rectangular terahertz waveguide die described above.
Specifically, the waveguide assembly includes: the ceramic rectangular terahertz waveguide tube core is arranged in the upper cavity assembly and the lower cavity assembly; the upper cavity assembly and the lower cavity assembly can be used for assembling and fixing the waveguide core; the waveguide component has the appearance structure and the flange structure of the waveguide component, and the waveguide component is convenient to use.
In another embodiment of the present invention, there is provided a method of assembling the waveguide assembly, the method comprising: arranging the ceramic rectangular terahertz waveguide tube core into the upper cavity assembly and the lower cavity assembly; and (5) arranging the positioning pin, namely completing assembly.
The invention is further illustrated by the following examples, which are not to be construed as limiting the invention thereto. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention.
Examples
Waveguide assembly structure as shown in fig. 1, the structure includes an upper cavity assembly 1, a lower cavity assembly 2, and a waveguide die 3.
In the embodiment, an upper cavity component 1 and a lower cavity component 2 are designed for assembling and fixing a waveguide core 3, wherein the upper cavity component 1 and the lower cavity component 2 have an appearance structure and a flange structure of the waveguide component, the waveguide component is convenient to use, and the waveguide core is formed by stacking three layers of 96% alumina ceramic plates. The waveguide assembly manufacturing process is detailed as follows:
firstly, ceramic substrates with proper thickness and shape specification are selected as an upper layer, a middle layer and a lower layer, wherein the upper layer is defined as an upper cover ceramic 4, the middle layer is defined as a tube core ceramic 5, and the lower layer is defined as a lower bottom ceramic 6.
Secondly, the upper layer ceramic, the middle layer ceramic and the lower layer ceramic are respectively processed by a laser processing technology, and the processing pattern is as shown in figure 2. The upper cover ceramic 4 and the lower base ceramic 6 are respectively provided with four interlayer alignment marks 4-1 and 6-1, the tube core ceramic 5 is provided with a waveguide cavity 7 besides the interlayer alignment mark 5-1, and the four interlayer alignment marks 4-1, 5-1 and 6-1 on the three layers of ceramics are consistent in shape and position with each other so as to realize accurate alignment between the three layers.
Thirdly, the three layers of ceramics respectively adopt magnetron sputtering technology to realize surface metallization, and the metallization layer is used as a seed layer to be electroplated with gold by adopting electroplating technology to reach a certain total thickness d of the metallization layer, so that the waveguide loss caused by skin effect is reduced.
Fourthly, the upper cover ceramic 4, the tube core ceramic 5 and the lower base ceramic 6 are stacked together in order from top to bottom, the relative positions of the layers are adjusted, the alignment of the layers is realized by the alignment marks between the layers, the stacked body is applied with a pressure of more than 8000mbar, and is heated to 350 ℃ and is kept warm for half an hour, and then is naturally cooled to room temperature.
Fifthly, the laser processing technology is adopted, the four positioning marks 4-1 are taken as reference, the outer shape of the waveguide tube core 3 is processed according to the shape 8 shown in fig. 5, and the schematic diagram of the waveguide tube core 3 after the outer shape processing is shown in fig. 6.
As can be seen from the cross-sectional views H-H, the inner walls of the waveguide cavity 7 all have the metallization layers, and the cavity size of the waveguide cavity 7 has a direct relationship with the cavity opening size W ', the total thickness d of the metallization layers, and the thickness H' of the die ceramic 5, and as shown in fig. 7, assuming that the width of the rectangular waveguide cavity is W and the height of the cavity is H, the thickness H 'of the die ceramic 5 is H-2d, and the cavity opening size W' of the rectangular waveguide cavity 7 is W +2 d.
Sixthly, the waveguide core 3 is subjected to surface sputtering and gold electroplating treatment, so that each surface is covered with metal, as shown in fig. 8.
Finally, the waveguide core 3 is assembled into the upper and lower cavity assemblies 1, 2 and the alignment pins 9, 10, 11, 12 are assembled to form the waveguide assembly, as shown in fig. 9.
It should be noted that the above examples are only used for illustrating the technical solutions of the present embodiment and not for limiting the same. Although the present embodiment has been described in detail with reference to the examples given, those skilled in the art may make modifications or equivalent substitutions as necessary without departing from the spirit and scope of the present embodiment.
Claims (10)
1. A ceramic rectangular terahertz waveguide tube core is characterized in that the ceramic rectangular terahertz waveguide tube core is formed by stacking and pressing three layers of alumina ceramic substrates;
wherein, the three layers of alumina ceramic substrates are respectively defined as an upper cover ceramic layer, a tube core ceramic layer and a lower bottom ceramic layer;
the tube core ceramic layer is provided with a waveguide cavity, and the waveguide cavity is obtained through laser opening.
2. The ceramic rectangular terahertz waveguide die of claim 1, wherein each layer of alumina ceramic substrate is metallized; preferably, a multilayer metallization treatment is adopted;
wherein, magnetron sputtering technology is selected for metallization treatment;
preferably, the outermost layer of the metallization layer is gold.
Further preferably, the gold layer is applied by electroplating.
3. The preparation method of the ceramic rectangular terahertz waveguide die of claim 1 or 2, wherein the preparation method comprises the following steps:
s1, processing each ceramic substrate by adopting a laser processing technology, and keeping the shapes of the ceramic substrates and the position relation between the ceramic substrates consistent;
s2, performing surface metallization treatment on each ceramic substrate by adopting a magnetron sputtering technology, and electroplating gold to a certain total thickness d of the metallization layer by taking the metallization layer as a seed layer and adopting an electroplating technology;
s3, stacking the ceramic substrates in sequence, adjusting the relative positions of the layers, aligning the layers through the alignment marks of the layers, and performing stacking and pressing treatment by pressurizing and heating;
s4, processing the waveguide core shape by using the positioning mark as a reference by adopting a laser processing technology;
and S5, performing surface sputtering and gold electroplating treatment on the waveguide core.
4. The method according to claim 3, wherein in step S1, an alignment mark technique is used.
5. The method according to claim 3, wherein in step S1, the waveguide cavity is formed in the ceramic core layer by laser technique; the preparation of the waveguide cavity is finished by separately controlling the cavity opening width and the cavity opening height;
preferably, when the cavity width of the waveguide cavity is W and the cavity height is H, the ceramic thickness H 'of the die ceramic layer is H-2d, and the cavity opening size W' of the waveguide cavity is W +2 d.
6. The method according to claim 3, wherein in step S3, the specific conditions of the pressure-heat treatment are as follows: the pressurizing pressure is controlled to be more than 8000mbar (containing 8000mbar), the heating temperature is controlled to be 300-400 ℃ (350 ℃) and the treatment time is 0.2-1 hour (preferably 0.5 hour).
7. The application of the ceramic rectangular terahertz waveguide tube core in claim 1 or 2 and/or the ceramic rectangular terahertz waveguide tube core prepared by the preparation method in any one of claims 3 to 6 in preparing a waveguide assembly.
8. A waveguide assembly, which comprises the ceramic rectangular terahertz waveguide tube core according to claim 1 or 2 and/or the ceramic rectangular terahertz waveguide tube core prepared by the preparation method according to any one of claims 3 to 6.
9. The waveguide assembly of claim 8, comprising: the ceramic rectangular terahertz waveguide tube core is arranged in the upper cavity assembly and the lower cavity assembly;
preferably, the upper cavity assembly and the lower cavity assembly have an outer shape structure and a flange structure of the waveguide assembly.
10. A method of assembling a waveguide assembly according to claim 8 or 9, the method comprising: mounting the ceramic rectangular terahertz waveguide tube core into the upper cavity assembly and the lower cavity assembly; and positioning pins are arranged.
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| CN114649684A (en) * | 2020-12-21 | 2022-06-21 | 上海航天电子通讯设备研究所 | Method and device for stacking corrugated feed source loudspeaker lamination |
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Application publication date: 20200911 |