SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that to prior art not enough, provide a novel individual layer dielectric waveguide filter negative coupling structure.
The utility model provides an above-mentioned technical problem's technical scheme as follows:
a novel negative coupling structure for a single-layer dielectric waveguide filter, comprising:
the first negative coupling window is arranged on the side surface of the first dielectric waveguide resonant cavity; the second negative coupling window is arranged on the side surface of the second dielectric waveguide resonant cavity;
the first dielectric waveguide resonant cavity comprises an electromagnetic shielding layer on the side of the first negative coupling window and is connected with the electromagnetic shielding layer on the side of the second dielectric waveguide resonant cavity comprising the second negative coupling window.
The utility model has the advantages that: according to the scheme, the first negative coupling window is arranged on the side face of the first dielectric waveguide resonant cavity, the second negative coupling window is arranged on the side face of the second dielectric waveguide resonant cavity, and the first dielectric waveguide resonant cavity and the second dielectric waveguide resonant cavity are connected through the electromagnetic shielding layers on the respective side faces, so that the beneficial effects of small size, small insertion loss, large bearing power and low cost of the dielectric waveguide filter are achieved.
On the basis of the technical scheme, the utility model discloses can also do following improvement.
Further, the first coupling window includes: the electromagnetic shielding layer comprises a rectangular non-electroplating area and an electromagnetic shielding layer area nested in the non-electromagnetic shielding layer and having a preset shape; the second negative coupling window has the same structure as the first coupling window;
the first negative coupling window is connected with the second negative coupling window, and a rectangular non-electroplating area is avoided.
The beneficial effects of the further scheme are as follows: the structure that the first negative coupling window and the second negative coupling window are connected in the non-electroplating area avoiding the rectangle realizes that the dielectric waveguide filter is formed or metallized in a dry pressing mode, the manufacturing difficulty is greatly reduced, the manufacturing precision can be easily guaranteed, and the efficiency of mass production and the manufacturing yield are improved.
Further, the preset shape may include a T-shape, an E-shape, or a T-shape after modifying the loading site.
The beneficial effects of the further scheme are as follows: the scheme can better realize negative coupling through T-shaped, E-shaped or T-shaped shape after modifying the loading part.
Further, the length of the first negative coupling window is greater than 1/2 of the first dielectric waveguide cavity thickness; the length of the second negative coupling window is greater than 1/2 a of the thickness of the second dielectric waveguide resonant cavity.
The beneficial effects of the further scheme are as follows: according to the scheme, the length of the first negative coupling window is larger than 1/2 of the thickness of the first dielectric waveguide resonant cavity, and the length of the second negative coupling window is larger than 1/2 of the thickness of the second dielectric waveguide resonant cavity, so that the scheme is simpler to manufacture compared with the existing negative coupling structure.
Further, still include: said first negative coupling window increasing the electroless area of the loading site size such that the total length is reduced to 1/4 wavelengths;
the non-plated area of the loading site is oversized so that the overall length is reduced to the second negative coupling window of 1/4 wavelengths.
The beneficial effects of the further scheme are as follows: the area of the non-electroplating area of the loading position size is increased, so that the negative coupling effect is better, and compared with the existing structure, the structure is simpler.
Further, the first dielectric waveguide resonant cavity includes: the ceramic dielectric monomer and the electromagnetic shielding layer coated on the surface of the dielectric monomer; the second dielectric waveguide resonant cavity comprises: the ceramic dielectric single body and the electromagnetic shielding layer coated on the surface of the dielectric single body.
The beneficial effects of the further scheme are as follows: according to the scheme, the electromagnetic shielding layer is coated on the surface of the dielectric monomer, so that the ceramic dielectric monomer has an electromagnetic shielding effect.
Further, still include: the tuning blind hole is arranged on the upper surface of the first dielectric waveguide resonant cavity; and the tuning blind hole is arranged on the upper surface of the second dielectric waveguide resonant cavity.
The beneficial effects of the further scheme are as follows: according to the scheme, the tuning blind holes are formed in the upper surface of the dielectric waveguide resonant cavity, so that the frequency of each dielectric waveguide resonant cavity can be adjusted.
Further, the first dielectric waveguide resonant cavity and the second dielectric waveguide resonant cavity are connected in a high-temperature sintering mode through printing silver paste on the side electromagnetic shielding layer.
The beneficial effects of the further scheme are as follows: according to the scheme, the first ceramic block and the second ceramic block are reliably connected together in a high-temperature sintering mode of printing silver paste on the side electromagnetic shielding layer.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Detailed Description
The principles and features of the present invention are described below in conjunction with the following drawings, the examples given are only intended to illustrate the present invention and are not intended to limit the scope of the present invention.
As shown in fig. 1, a negative coupling structure of a novel single-layer dielectric waveguide filter includes: a first negative coupling window 24 disposed at a side of the first dielectric waveguide resonant cavity 22; a second negative coupling window 14 disposed at a side of the second dielectric waveguide resonant cavity 12; the position of the negative coupling window in the dielectric waveguide resonant cavity can be determined according to actual requirements, and is not only in the position shown in the figure. The first dielectric waveguide resonant cavity 22 is the dielectric waveguide resonant cavity 22 in the figure, the first negative coupling window 24 is the negative coupling window 24 in the figure, the second dielectric waveguide resonant cavity 12 is the dielectric waveguide resonant cavity 12 in the figure, and the second negative coupling window 14 is the negative coupling window 14 in the figure.
The electromagnetic shielding layer of the side of the first dielectric waveguide resonant cavity 22 containing the first negative coupling window 24 is connected to the electromagnetic shielding layer of the side of the second dielectric waveguide resonant cavity 12 containing the second negative coupling window 14.
In one embodiment, the first coupling window 24 includes: the electromagnetic shielding layer comprises a rectangular non-electroplating area and an electromagnetic shielding layer area nested in the non-electromagnetic shielding layer and having a preset shape; the second negative coupling window 14 has the same structure as the first coupling window 24; the coupling window comprises an electroplated layer, namely a shaded part of the coupling window shown in fig. 2, and further comprises an electromagnetic shielding layer, namely a blank part of the coupling window shown in fig. 2, wherein the electromagnetic shielding layer is an electroplated layer, the shaded part can be rectangular or square, and the blank part can be T-shaped, E-shaped or T-shaped after a loading part is modified. Wherein a shown in FIG. 2 represents a negative coupling window 14, a shaded portion represents an electroplated layer 16, and a blank is a T-shaped electroplated layer 15 with a reversed hook portion beside T in the figure added after the loading portion is modified; b represents the negative coupling window 24, the shaded portion represents the non-plated layer 26, and the blank is a T-shaped plated layer 25 with the modified loading portion, i.e., the undercut portion beside T in the figure is added.
The first negative coupling window 24 is connected to the second negative coupling window 14, avoiding the rectangular non-plating area.
The scheme has the advantages that the structure that the first negative coupling window 24 and the second negative coupling window 14 are connected with the non-electroplating area avoiding the rectangle is adopted, so that the dielectric waveguide filter is formed by dry pressing or metalized, the manufacturing difficulty is greatly reduced, the manufacturing precision can be easily ensured, and the mass production efficiency and the manufacturing yield are improved.
In another embodiment, the predetermined shape may include a T-shape, an E-shape, or a T-shape after modifying the loading site. The T shape after the loading portion is modified, as shown in fig. 2, the loading size is further increased by flanging the loading portion on the basis of the T shape, so that the total length of the negative coupling structure is reduced again, the flanging length can be any value, and the smaller the total length is, so that the negative coupling precision is higher.
The scheme can better realize negative coupling through T-shaped, E-shaped or T-shaped shape after modifying the loading part.
In one embodiment, the first negative coupling window 24 increases the size of the electroless region of the loading site such that the total length is reduced to 1/4 wavelengths;
the non-plated area of the loading site is oversized to reduce the overall length to the second negative coupling window 14 of 1/4 wavelengths.
The area of the non-electroplating area of the loading position size is increased, so that the negative coupling effect is better, and compared with the existing structure, the structure is simpler.
In one embodiment, in order to facilitate alignment, the plating layer 15 of the negative coupling window disposed on the ceramic block 11 and the plating layer 25 of the negative coupling window disposed on the ceramic block 21 are patterned with an alignment margin of 0.1mm to 0.2mm, which may be disposed on the coupling window 14 or on the coupling window 24. Wherein the alignment margin can be understood as enlarging the non-plating layer of one of the coupling windows, i.e. the hatched portion of the coupling window in the figure, or reducing the plating layer, i.e. the blank portion of the coupling window in the figure. Wherein a ceramic block may include a plurality of resonant cavities, only one of which is shown for ease of understanding and description.
According to the scheme, the first negative coupling window 24 is arranged on the side face of the first dielectric waveguide resonant cavity 22, the second negative coupling window 14 is arranged on the side face of the second dielectric waveguide resonant cavity 12, and the first dielectric waveguide resonant cavity 22 and the second dielectric waveguide resonant cavity 12 are connected through electromagnetic shielding layers on the respective side faces, so that the beneficial effects of small size, small insertion loss, large bearing power and low cost of the dielectric waveguide filter are achieved.
Preferably, in any of the above embodiments, the length of the first negative coupling window 24 is greater than 1/2 times the thickness of the first dielectric waveguide cavity 22; the length of the second negative coupling window 14 is greater than 1/2 times the thickness of the second dielectric waveguide cavity 12.
According to the scheme, the length of the first negative coupling window 24 is larger than 1/2 of the thickness of the first dielectric waveguide resonant cavity 22, and the length of the second negative coupling window 14 is larger than 1/2 of the thickness of the second dielectric waveguide resonant cavity 12, so that the scheme is simpler to manufacture compared with the existing negative coupling structure.
Preferably, in any of the above embodiments, the first dielectric waveguide resonant cavity 22 comprises: the ceramic dielectric monomer and the electromagnetic shielding layer coated on the surface of the dielectric monomer; the second dielectric waveguide resonant cavity 12 includes: the ceramic dielectric single body and the electromagnetic shielding layer coated on the surface of the dielectric single body. Wherein the dielectric monomer can be a high dielectric constant ceramic material.
According to the scheme, the electromagnetic shielding layer is coated on the surface of the dielectric monomer, so that the ceramic dielectric monomer has an electromagnetic shielding effect.
Preferably, in any of the above embodiments, further comprising: a tuning blind hole 23 disposed on the upper surface of the first dielectric waveguide resonant cavity 22; and a tuning blind hole 13 arranged on the upper surface of the second dielectric waveguide resonant cavity 12.
According to the scheme, the tuning blind holes are formed in the upper surface of the dielectric waveguide resonant cavity, so that the frequency of each dielectric waveguide resonant cavity can be adjusted.
Preferably, in any of the above embodiments, the first dielectric waveguide resonant cavity 22 and the second dielectric waveguide resonant cavity 12 are connected by high temperature sintering of a side electromagnetic shielding layer printed with silver paste. Wherein, the photoetching coupling window is required to be avoided when silver paste is printed.
In one embodiment, in order to improve the metallization yield, R or C chamfers are required to be arranged on the orifices of any through holes and blind holes and the edges of the ceramic body, the chamfer size can be any value, and the recommended value is 0.1-0.5.
According to the scheme, the first ceramic block 21 and the second ceramic block 11 are reliably connected together in a high-temperature sintering mode of printing silver paste on the side electromagnetic shielding layer.
In the description herein, references to the description of the terms "embodiment one," "embodiment two," "example," "specific example" or "some examples," etc., mean that a particular method, apparatus, or feature described in connection with the embodiment or example is included in at least one embodiment or example of the present invention.
In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, methods, apparatuses, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.