CN111653530A - Electric-drive double-side-radiating IGBT power module radiating device - Google Patents
Electric-drive double-side-radiating IGBT power module radiating device Download PDFInfo
- Publication number
- CN111653530A CN111653530A CN201910158889.9A CN201910158889A CN111653530A CN 111653530 A CN111653530 A CN 111653530A CN 201910158889 A CN201910158889 A CN 201910158889A CN 111653530 A CN111653530 A CN 111653530A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- radiating
- power module
- igbt power
- electrically
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/074—Stacked arrangements of non-apertured devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides an electrically-driven double-side radiating IGBT power module radiating device which comprises at least two radiating fins arranged up and down; a pressing mechanism is arranged between the radiating fins; the radiating fin is provided with a water inlet and a water outlet; the water inlet of adjacent fin communicates each other, and the delivery port of adjacent fin communicates each other, is located the bottom be equipped with the end cap on the water inlet of fin and the delivery port, and this device carries out the double-sided heat dissipation to the IGBT through the mode of lamination, and the superpose mode and the pressure that has guaranteed through the elastic component that every IGBT chip received are the same, guarantee radiating uniformity, and the radiating fin that sets up very much simultaneously cooperates cold water to get into, has improved the radiating effect greatly to holistic structure is small and exquisite, is applicable to miniature equipment fixing.
Description
Technical Field
The invention relates to the field of IGBT heat dissipation, in particular to an electric-drive double-side heat dissipation IGBT power module heat dissipation device.
Background
An Insulated Gate Bipolar Transistor (IGBT) is a composite fully-controlled voltage-driven power semiconductor device consisting of a Bipolar Junction Transistor (BJT) and an insulated Gate field effect transistor (MOS), and has the advantages of high input impedance of the MOSFET and low conduction voltage drop of the GTR. The IGBT module is mainly applied to the output control of alternating current motors of electric vehicles, railway locomotives and motor vehicle groups. The IGBT module has the advantages of small driving current, low on-resistance and the like, is widely applied to the field of vehicles, and solves the problem that the prior arrangement of the IGBT module is in the form disclosed by the following patents:
CN 207993856U, IGBT module heat abstractor and radiating basal plate thereof, its radiating mode is through setting up the IGBT that a plurality of plane distributions were placed on a monoblock radiating block and dispel the heat, and the plane distribution is placed and is leaded to whole device bulky to only can the single face dispel the heat, and during the two-sided heat dissipation, the plane was placed and is leaded to the IGBT atress uneven, and the radiating effect is unstable. CN 104882421A, the heat dissipation structure of IGBT device also has the above problems, and the thickness of the heat sink is large, the volume is also large, and the heat dissipation effect is not stable in the above patent and the prior art.
Disclosure of Invention
In order to solve the technical problem, the invention provides an electrically-driven double-side heat dissipation IGBT power module heat dissipation device which comprises at least two heat dissipation fins arranged up and down;
a pressing mechanism is arranged between the radiating fins;
the radiating fin is provided with a water inlet and a water outlet; the water inlets of the adjacent radiating fins are communicated with each other, the water outlets of the adjacent radiating fins are communicated with each other, and plugs are arranged on the water inlets and the water outlets of the radiating fins positioned at the bottom.
Preferably, the radiating fins comprise cover plates which are arranged in an up-and-down symmetrical mode, a radiating cavity is arranged between the cover plates, radiating fins are arranged in the radiating cavity, and the water inlet and the water outlet are arranged on the radiating cavity.
Preferably, the water inlet and the water outlet are arranged at two ends of the heat dissipation cavity.
Preferably, the heat dissipation fin comprises a heat dissipation plate body, a plurality of heat conduction pieces are arranged on the heat dissipation plate body, and each heat conduction piece comprises a plurality of hollow-out bulges which are arranged in a staggered mode.
Preferably, the compressing mechanism comprises four groups of screws penetrating through the end part of the cover plate, the end part of each screw is screwed with a nut, and an elastic part is sleeved on the screw at the lower part of the nut.
Preferably, the elastic member is a spring or a disc spring or a silica gel block.
Preferably, a sealing ring is arranged between the adjacent water inlets, and a sealing ring is arranged between the adjacent water outlets.
Preferably, the sealing ring comprises an annular body, and the inner ring of the annular body is provided with two concentric bulges.
The electric-drive double-side heat dissipation IGBT power module heat dissipation device provided by the invention has the following beneficial effects: this device carries out the double-sided heat dissipation to the IGBT through the mode of lamination, and the pressure that every IGBT chip received has been guaranteed the same to the mode of superpose and through the elastic component, guarantees radiating uniformity, and the radiating fin who sets up very much simultaneously cooperates cold water to get into, has improved the radiating effect greatly to holistic structure is small and exquisite, is applicable to miniature equipment fixing.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below.
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of the structure of the heat sink of the present invention;
FIG. 3 is a schematic view of the internal structure of the heat sink of the present invention;
FIG. 4 is a schematic side view of the present invention;
FIG. 5 is a schematic view of a heat sink fin structure according to the present invention;
FIG. 6 is a schematic structural view of a seal ring of the present invention;
wherein, 1, a radiating fin; 2. a water inlet; 3. a water outlet; 4. a cover plate; 5. a heat dissipation cavity; 6. a heat dissipating fin; 7. a heat dissipating plate body; 8. hollowing out the bulges; 9. a screw; 10. a nut; 11. an elastic member; 12. a seal ring; 13. a concentric protrusion; 14. and (7) a plug.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
As shown in figure 1, the invention provides an electrically-driven double-side heat dissipation IGBT power module heat dissipation device, which comprises at least two heat dissipation fins 1 arranged up and down, wherein the number of the heat dissipation fins 1 can be 2, 3, 4, 5 or more, the heat dissipation fins are arranged in a way of being sequentially overlapped, when in use, IGBT chips are placed between the adjacent heat dissipation fins 1, and the adjacent heat dissipation fins 1 are tightly pressed by a pressing mechanism, so that the IGBT chips are tightly attached.
As shown in fig. 2, 3 and 5, the heat sink 1 includes cover plates 4 disposed symmetrically, a heat dissipation cavity 5 is disposed between the cover plates 4, heat dissipation fins 6 are disposed in the heat dissipation cavity 5, the water inlet 2 and the water outlet 3 are disposed on the heat dissipation cavity 5, the thickness of the heat dissipation cavity 5 is very small, about 0.5cm, and the length of the whole heat sink 1 is only about 78mm, so as to ensure the small size of the whole device, the water inlet 2 and the water outlet 3 are disposed at two ends of the heat dissipation cavity 5, in this embodiment, the cover plate 4 of the heat sink 1 is square, not only is square, but also can be a polygonal structure, the middle of the heat dissipation cavity 5 is square, both sides have protrusions, the water inlet 2 and the water outlet 3 are both disposed at the protrusions, the water inlet 2 and the water inlet 2 of the adjacent heat sink 1 are connected, and the water outlet 3 is, the sealing ring 12 is directly connected with the inner ring of the annular body through the sealing ring 12, the sealing ring 12 comprises the annular body, the inner ring of the annular body is provided with two concentric bulges 13, the concentric bulges 13 can be clamped at the positions of the water inlet 2 and the water outlet 3, the sealing effect can be achieved, water can pass through the sealing ring, and the adjacent heating panels can be supported to prevent overvoltage. For better heat dissipation effect, the specially arranged heat dissipation fins 6 have the following structure: radiating fin 6 includes radiating plate body 7, it is provided with a plurality of heat conduction pieces to arrange on radiating plate body 7, heat conduction piece includes the fretwork arch 8 that a plurality of looks are wrong to be set up, aluminium can be chooseed for use to radiating fin 6's material, the proof mass is light, and the heat conduction is effectual, the heat conduction piece that sets up is wrong from top to bottom, and there is the arch of fretwork, the hydroenergy that lets in can flow in the fretwork arch 8, and radiating plate body 7 upper and lower part symmetry sets up, the heat conduction effect on two sides is unanimous, and the heat can be fast through radiating fin 6 leading-in to the aquatic, the radiating effect has been improved greatly, flow through rivers, the water that will heat up flows fast, in actual.
As shown in fig. 4, water connectors are provided at both the water inlet 2 and the water outlet 3 of the heat dissipating plate at both ends, and a sealing ring 12 is provided at the bottom of the heat dissipating plate to seal the sealing plate against water leakage, which is a plug 14.
In order to achieve a good heat dissipation effect, the heat dissipation fins 1 need to be pressed, specifically, a pressing mechanism is arranged between the heat dissipation fins 1; in the embodiment, because the heat sink 1 is square, the compressing mechanism includes four sets of screws 9 penetrating through the end of the cover plate 4, a nut 10 is screwed on the end of the screw 9, an elastic member 11 is sleeved on the screw 9 at the lower part of the nut 10, the elastic member 11 can be various materials with elastic characteristics such as a spring, a disc spring or a silica gel block, when the disc spring is used, the compressing effect is better and more stable, the screw 9 penetrates through the heat sink 1, the elastic member 11 is sleeved on the end part and is screwed through the nut 10, and because the screwing distance of the nut 10 is consistent and the disc spring is matched, the force borne by each IGBT is ensured to be the same, compared with the IGBT arranged on a plane, the heat dissipation consistency is greatly improved because the force is uniform.
Various modifications to the embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. An electrically-driven double-side heat dissipation IGBT power module heat dissipation device is characterized by comprising at least two heat dissipation fins which are arranged up and down;
a pressing mechanism is arranged between the radiating fins;
the radiating fin is provided with a water inlet and a water outlet; the water inlets of the adjacent radiating fins are communicated with each other, and the water outlets of the adjacent radiating fins are communicated with each other;
and plugs are arranged on the water inlet and the water outlet of the radiating fin positioned at the bottom.
2. The electrically-driven double-sided heat dissipation IGBT power module heat dissipation device as defined in claim 1, wherein the heat dissipation fins comprise cover plates symmetrically arranged from top to bottom, a heat dissipation accommodating cavity is arranged between the cover plates, heat dissipation fins are arranged in the heat dissipation accommodating cavity, and the water inlet and the water outlet are arranged on the heat dissipation accommodating cavity.
3. The electrically driven double-sided heat dissipation IGBT power module heat sink as recited in claim 2, wherein said water inlet and outlet are disposed at both ends of said heat dissipation volume.
4. The electrically-driven double-sided heat dissipation IGBT power module heat dissipation device as defined in claim 2, wherein the heat dissipation fins comprise a heat dissipation plate body, a plurality of heat conduction members are arranged on the heat dissipation plate body, and the heat conduction members comprise a plurality of hollow-out protrusions arranged in a staggered manner.
5. The electrically-driven double-sided heat dissipation IGBT power module heat dissipation device as defined in claim 1, wherein the compression mechanism comprises four sets of screws passing through the end of the cover plate, the ends of the screws being screwed with nuts, and the screws at the lower parts of the nuts being sleeved with elastic members.
6. The electrically-driven double-sided heat dissipation IGBT power module heat dissipation device as defined in claim 5, wherein the elastic member is a spring or a disc spring or a silica gel block.
7. The electrically driven double-sided heat dissipation IGBT power module heat dissipation device of claim 1, characterized in that a sealing ring is arranged between adjacent water inlets, and a sealing ring is arranged between adjacent water outlets.
8. The electrically driven double-sided heat dissipating IGBT power module heat sink of claim 7, wherein the sealing ring comprises an annular body with two concentric protrusions on an inner ring of the annular body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910158889.9A CN111653530A (en) | 2019-03-04 | 2019-03-04 | Electric-drive double-side-radiating IGBT power module radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910158889.9A CN111653530A (en) | 2019-03-04 | 2019-03-04 | Electric-drive double-side-radiating IGBT power module radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111653530A true CN111653530A (en) | 2020-09-11 |
Family
ID=72347924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910158889.9A Pending CN111653530A (en) | 2019-03-04 | 2019-03-04 | Electric-drive double-side-radiating IGBT power module radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111653530A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113206053A (en) * | 2021-04-28 | 2021-08-03 | 北京新能源汽车技术创新中心有限公司 | Heat dissipation device, power module and vehicle |
-
2019
- 2019-03-04 CN CN201910158889.9A patent/CN111653530A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113206053A (en) * | 2021-04-28 | 2021-08-03 | 北京新能源汽车技术创新中心有限公司 | Heat dissipation device, power module and vehicle |
| CN113206053B (en) * | 2021-04-28 | 2023-10-31 | 北京国家新能源汽车技术创新中心有限公司 | Heat abstractor, power module and vehicle |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10319665B2 (en) | Cooler and cooler fixing method | |
| US20150334875A1 (en) | Coldplate with Integrated DC Link Capacitor for Cooling Thereof | |
| CN206148572U (en) | Power cell pack | |
| WO2016091133A1 (en) | Heat management device of electro-heating component | |
| US10080313B2 (en) | Power module and method for manufacturing the same | |
| CN106712460A (en) | Electric power converter | |
| CN201898434U (en) | Metal water-cooling bottom plate for cooling electric automobile controller | |
| CN104883077B (en) | The level IGCT phase modules of compact three | |
| CN111653530A (en) | Electric-drive double-side-radiating IGBT power module radiating device | |
| CN208338138U (en) | Vehicle and its motor control assembly, electric machine controller cooling cabinet | |
| CN108173416A (en) | The mounting structure and installation method of plug-in component switch pipe | |
| CN209374432U (en) | A kind of electric drive two-side radiation IGBT power module radiator | |
| GB2542468A (en) | Coldplate with integrated DC link capacitor for cooling thereof | |
| KR102256906B1 (en) | Cold plate assembly for electrical cabinet | |
| CN109302083B (en) | stacked inverter | |
| KR101712354B1 (en) | High efficiency thermoelectric generation system | |
| CN209056483U (en) | A kind of two-sided expansible radiator on IGBT | |
| CN211788988U (en) | Be applied to high pressure feed water heater's IGBT heat radiation structure | |
| CN108337748B (en) | Heating device | |
| CN212434603U (en) | IGBT module power cycle radiating component | |
| CN104054252B (en) | Power conversion device | |
| CN204198415U (en) | A kind of air-cooled board-like ozone generating unit | |
| CN109052329B (en) | Ozone generating device | |
| CN113725199A (en) | Low inductance crimping type semiconductor module | |
| CN207743846U (en) | Frequency converter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20230515 Address after: 1 / F, building 28, 6055 Jinhai highway, Fengxian District, Shanghai 201400 Applicant after: Shanghai Xuxuan electronic parts Co.,Ltd. Address before: 200000 Room 101, No.60, Lane 99, Chunguang Road, Minhang District, Shanghai Applicant before: SHANGHAI XUHE AUTOMOTIVE ELECTRONIC TECHNOLOGY Co.,Ltd. |
|
| TA01 | Transfer of patent application right |