CN113206053A - Heat dissipation device, power module and vehicle - Google Patents
Heat dissipation device, power module and vehicle Download PDFInfo
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- CN113206053A CN113206053A CN202110463955.0A CN202110463955A CN113206053A CN 113206053 A CN113206053 A CN 113206053A CN 202110463955 A CN202110463955 A CN 202110463955A CN 113206053 A CN113206053 A CN 113206053A
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- heat dissipation
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 22
- 238000001816 cooling Methods 0.000 claims abstract description 141
- 238000007789 sealing Methods 0.000 claims abstract description 30
- 239000004519 grease Substances 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 238000001125 extrusion Methods 0.000 claims description 2
- 230000005489 elastic deformation Effects 0.000 abstract description 3
- 238000013461 design Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- 238000004891 communication Methods 0.000 description 4
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003044 adaptive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000005483 Hooke's law Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Abstract
The invention relates to the technical field of electronic components, in particular to a heat dissipation device, a power module and a vehicle, wherein the heat dissipation device comprises a lower cooling plate, an upper cooling assembly and an elastic fixing assembly, and a first cooling flow channel is formed in the lower surface of the lower cooling plate; the upper cooling assembly is fixed above the upper surface of the lower cooling plate through an elastic fixing assembly; the upper cooling assembly comprises a plurality of upper cooling plates, cooling channels are respectively arranged in the upper cooling plates, the cooling channels are mutually communicated to form a second cooling flow channel, and two ends of the second cooling flow channel are respectively communicated with the first cooling flow channel in a sealing manner; according to the invention, the upper cooling assembly can be tightly pressed on the power device through the elastic fixing assembly, and follow-up deformation is carried out through the elastic deformation of the elastic fixing assembly, so that damage caused by reasonable deformation and overlarge clamping force is avoided.
Description
Technical Field
The invention relates to the technical field of electronic components, in particular to a heat dissipation device, a power module and a vehicle.
Background
In recent years, new energy automobiles are rapidly developed in the automobile industry, and pure electric automobiles, hybrid electric automobiles and the like are particularly rapidly developed. With the gradual improvement of new energy automobiles on the requirements of endurance, energy conservation and the like, the traditional IGBT motor controller with the power density of about 15kW/L cannot meet the requirements of a car factory, and the development of a novel motor controller with the power density of 30KW/L or even higher is imperative. Therefore, double-sided water-cooled SiC modules (power modules) are beginning to be applied in motor controllers. In order to fully exert the low loss performance of SiC and the high heat dissipation capability of the double-sided water-cooled module, it is necessary to develop a more efficient and reliable heat dissipation method for the double-sided water-cooled SiC module.
The prior art generally comprises the following steps: the bottom radiator, the double-sided water cooling module, the top radiator, the radiator pressing strip and the radiator fixing bolt are sequentially arranged from bottom to top. The whole scheme adopts an installation mode of two radiator sandwich structures, and the two radiators and the pressing strips are tightened by the pressing strips on the upper part through bolts, so that the purpose of clamping the double-sided water-cooling module is achieved, heat dissipation is realized, and the installation sequence is sequentially carried out from bottom to top.
As the upper radiator and the lower radiator are both made of hard metal, most of the hard metal is made of materials such as cast aluminum and the like, and the deformation capacity is limited. The stress of the three modules is necessarily uneven. Considering that the thickness of module itself also differs, when the thickness of middle module is on the small side, two cooling surfaces of middle module can reduce a lot, influence the heat-sinking capability of middle module, probably lead to middle module overheat damage, simultaneously because both sides module height is higher, when reducing module clamp force difference through increaseing bolt locking force, can lead to the clamp force of both sides module too big, can lead to module mechanical damage when serious, influence module service reliability and life-span.
In addition, in the use process of the motor controller, due to the fact that the modules generate heat, the local temperature difference of the upper radiator and the lower radiator can be caused to cause reasonable deformation of the radiators, the stress difference among different modules is large at the moment, effective heat dissipation of the upper surface and the lower surface of each module is affected, and finally the degree of overheating damage is aggravated.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: provided are a heat sink, a power module, and a vehicle capable of adaptively adjusting a clamping force.
In order to solve the above technical problems, a first technical solution adopted by the present invention is:
a heat dissipation device comprises a lower cooling plate, an upper cooling assembly and an elastic fixing assembly, wherein a first cooling flow channel is formed in the lower surface of the lower cooling plate;
the upper cooling assembly is fixed above the upper surface of the lower cooling plate through an elastic fixing assembly; the upper cooling assembly comprises a plurality of upper cooling plates, cooling channels are formed in the upper cooling plates respectively, the cooling channels are communicated with one another to form second cooling channels, and two ends of each second cooling channel are communicated with the first cooling channels in a sealing mode.
In order to solve the above technical problems, the second technical solution adopted by the present invention is:
a power module comprises a power device and the heat dissipation device;
the power device is located between the lower cooling plate and the upper cooling assembly.
In order to solve the above technical problems, a third technical solution adopted by the present invention is:
a vehicle comprises the heat dissipation device and/or the power module.
The invention has the beneficial effects that: the elastic fixing component can realize that the upper cooling component is tightly pressed on the power device, and each corner end of the upper cooling plate corresponds to one elastic body, so that different compression amounts of the module areas of the power devices are ensured to be adaptive to pressing the power devices, the requirements of different clamping forces required by the different power devices are met, the reliable heat dissipation requirement of the power devices is also ensured, the mechanical damage caused by overlarge clamping force is avoided, and the reliability and the service life of the power devices are ensured; reasonable deformation which occurs when the power device works can also carry out follow-up deformation through the elastic deformation of the elastic fixing component, and damage caused by reasonable deformation is avoided.
Drawings
Fig. 1 is a schematic structural diagram of a power module according to an embodiment of the present invention;
FIG. 2 is an exploded view of FIG. 1;
FIG. 3 is another angular view of FIG. 2;
FIG. 4 is a cross-sectional view of a corrugated hose;
description of reference numerals: 1. a lower cooling plate; 11. a first cooling flow passage; 12. a communication port; 13. a heat sink; 2. An upper cooling assembly; 21. an upper cooling plate; 22. a second cooling flow channel; 23. a corrugated hose; 231. a pipe body; 232. a connecting member; 233. a sealing groove; 3. an elastic fixing component; 31. a tray; 32. an elastomer; 33. A fixing member; 34. a limiting column; 4. and a power device.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1 to 4, a heat dissipation device includes a lower cooling plate 1, an upper cooling assembly 2, and an elastic fixing assembly 3, wherein a first cooling channel 11 is formed on a lower surface of the lower cooling plate 1; two ends of the first cooling flow channel 11 are respectively provided with a communication port 12;
the upper cooling assembly 2 is fixed above the upper surface of the lower cooling plate 1 through an elastic fixing assembly 3; the upper cooling assembly 2 comprises a plurality of upper cooling plates 21, a plurality of cooling channels are formed in the upper cooling plates 21 respectively, the cooling channels are communicated with one another to form second cooling channels 22, and two ends of each second cooling channel 22 are communicated with the communication ports 12 of the first cooling channels 11 in a sealing mode respectively.
Further, the cooling channels are communicated with each other through a corrugated hose 23 to form a second cooling flow channel 22;
the upper cooling plate 21 has a connecting part at the outlet of the cooling channel;
the corrugated hose 23 includes a pipe body 231 and connecting members 232 at both ends, and the connecting members 232 are connected to the connecting portions.
Further, the connecting part is in threaded connection with the connecting part 232;
the end of the pipe body 231 has a first sealing cut, the connecting element 232 has a second sealing cut corresponding to the first sealing cut, the first sealing cut and the second sealing cut cooperate to form a sealing groove 233, and a sealing ring is disposed in the sealing groove 233.
Further, the elastic fixing assembly 3 comprises a tray 31, an elastic body 32 and a fixing member 33, wherein the tray 31 is positioned above the upper cooling assembly 2 and is connected to the lower cooling plate 1 through the fixing member 33;
the elastic member is located between the upper cooling module 2 and the tray 31 to form an elastic compression of the upper cooling module 2.
Further, there are a plurality of the elastic bodies 32, and each corner end of the upper cooling plate 21 corresponds to one elastic body 32.
Further, the elastic body 32 is a spring, a limiting column 34 for limiting the spring is arranged on the tray 31, and the length of the limiting column 34 is smaller than that of the spring.
Further, a plurality of cooling fins 13 are provided in the first cooling flow passage 11.
A power module comprises a power device 4 and the heat dissipation device;
the power device 4 is located between the lower cooling plate 1 and the upper cooling assembly 2.
Further, there are three power devices 4, and the upper cooling assembly 2 includes three upper cooling plates 21 corresponding to the power devices 4;
and the upper surface and the lower surface of the power device 4 are coated with heat-conducting silicone grease.
A vehicle comprises the heat dissipation device and/or the power module.
From the above description, the beneficial effects of the present invention are: the elastic fixing component 3 can realize that the upper cooling component 2 is tightly pressed on the power device 4, and each corner end of the upper cooling plate 21 corresponds to one elastic body 32, so that different compression amounts of the module areas of the power devices 4 where the upper cooling component is respectively arranged are ensured to be adaptive to pressing the respective power devices 4, different clamping forces required by different power devices 4 are met, the reliable heat dissipation requirements of the power devices 4 are also ensured, mechanical damage caused by overlarge clamping force is avoided, and the reliability and the service life of the power devices 4 are ensured; the reasonable deformation that takes place when power device 4 works also can carry out follow-up deformation through the elastic deformation of elastic fixation subassembly 3, avoids taking place to damage because of reasonable deformation. Through heat conduction silicone grease, the heat conductivity can be improved.
Example one
A heat dissipation device comprises a lower cooling plate, an upper cooling assembly and an elastic fixing assembly, wherein a first cooling flow channel is formed in the lower surface of the lower cooling plate; two ends of the first cooling flow channel are respectively provided with a communicating port;
the upper cooling assembly is fixed above the upper surface of the lower cooling plate through an elastic fixing assembly; the upper cooling assembly comprises a plurality of upper cooling plates, cooling channels are formed in the upper cooling plates respectively, the cooling channels are communicated with one another to form second cooling flow channels, and two ends of each second cooling flow channel are communicated with the communication ports of the first cooling flow channels in a sealing mode.
The cooling channels are communicated with each other through corrugated hoses to form a second cooling flow channel;
the outlet of the cooling channel of the upper cooling plate is provided with a connecting part;
the corrugated hose comprises a hose body and connecting pieces located at two ends, wherein the connecting pieces are connected to the connecting parts.
The connecting part is in threaded connection with the connecting piece;
the end of the pipe body is provided with a first sealing cut, a second sealing cut is arranged at the position, corresponding to the first sealing cut, of the connecting piece, the first sealing cut and the second sealing cut are matched to form a sealing groove, and a sealing ring is arranged in the sealing groove.
The elastic fixing assembly comprises a tray, an elastic body and a fixing piece, wherein the tray is positioned above the upper cooling assembly and is connected to the lower cooling plate through the fixing piece;
the elastic piece is positioned between the upper cooling assembly and the tray to form elastic extrusion on the upper cooling assembly.
The elastic bodies are multiple, and each corner end of the upper cooling plate corresponds to one elastic body.
The elastic body is a spring, a limiting column for limiting the spring is arranged on the tray, and the length of the limiting column is smaller than that of the spring.
And a plurality of radiating fins are arranged in the first cooling flow channel.
Example two
A power module comprising three power devices (SiC) and the heat sink of embodiment one;
the power device is located between the lower cooling plate and the upper cooling assembly.
The upper cooling assembly comprises three upper cooling plates corresponding to the power devices;
and the upper surface and the lower surface of the power device are coated with heat-conducting silicone grease.
The upper cooling plate is a round-corner rectangular plate body, and the number of the springs is 12;
the installation process is as follows:
(1) preparing a lower cooling plate;
(2) three SiC power devices (model: MD800HFC120N3S) are placed on the lower cooling plate, and heat-conducting silicone grease is coated on the upper surface and the lower surface of each power device in advance to improve the heat-conducting property;
(3) preparing three upper cooling plates corresponding to the power device of the controller;
(4) a corrugated flexible connecting pipe is arranged between the three upper cooling plates;
(5) 12 nonstandard compression springs are placed on the upper cooling assembly;
(6) the circuit board tray is installed on a lower cooling plate (in the attached drawing, the controller box body structure is adopted in the design, and the lower cooling plate and the control box body are integrated in the design), and then the tray tightly presses the three upper cooling plates on three power devices by compressing 12 nonstandard springs.
From the foregoing, since the thickness of each workpiece itself has thickness deviations from batch to batch in the production process, these production process control factors need to be added to the design input. In addition, the power module is influenced by factors such as environmental temperature change, local self-heating difference and the like in a vehicle-mounted environment, and the stress influence of hardware part deformation also needs to be added into design input.
From the module specification, the typical clamping force of a SiC power device (model: MD800HFC120N3S) is 700N, with a maximum of 850N. In order to make the thermal resistances of the three modules more consistent, it is desirable to make the clamping force deviation between the modules as small as possible. In the present case, we design the target for the clamping force of the module to be Ftotal 700N +100N, as shown in fig. 2, a single module is applied with force by 4 springs, so the elastic force requirement of the single spring is:
ftotal/4 175N +25N, Δ F25N, 1
Law of hooke's law
F ═ K ×. Δ x formula 2
It can be seen that the magnitude of the actual pressure is directly determined by the amount of spring deformation and the spring constant. The difference in the amount of spring deformation between the three modules is determined by the tolerances of the parts. The thickness h of the SiC power device (model: MD800HFC120N3S) is 4.7mm +/-0.3, the maximum thickness difference among three modules is delta h is 0.6mm, the processing precision requirement of the water cooling plate is that h1 is 26.5mm +0.3, delta h1 is 0.3mm, the processing precision requirement of the installation surface of the spring pressing plate installed in the box body is that h2 is 62.5mm +0.3, and delta h2 is 0.3mm, so the maximum deviation of the spring deformation among the three modules is considered by considering the tolerance extreme value:
Δ Δ x ═ Δ h + Δ h1+ Δ h2 ═ 1.2mm formula 3
From equation 1, equation 2, and equation 3, K ═ Δ F/Δ Δ x ═ 25N/1.2mm ═ 20.83N/mm equation 4
From equation 4 and company 1, the spring travel Δ x is 175/20.83 is 8.4mm, equation 5
From K to G d4/8*n*D3Formula 6
Book deviceG is 79000N/mm2D is 2mm and D is 9.6mm, which can be calculated from formula 4 and formula 6:
n＝G*d4/8*K*D38.5 formula 7
Wherein: g: transverse modulus of elasticity (young's modulus), d: wire diameter, n: effective number of turns, D: average coil diameter
Fmax ═ K ═ Δ x + Δ Δ x ═ 20.83 ═ 9.6 ═ 199.7N formula 8
Therefore, the design is realized by selecting G79000N/mm2And L is 16mm, which is obtained from formula 5, and has a strain of 50%, a wire diameter of 2mm, a diameter of 9.6mm, and 8.5 turns, and in the actual production process, the tolerance of the spring (L) can be controlled<+0.7mm) to further balance the stress difference between the three-phase modules and reduce the spring strain.
EXAMPLE III
A vehicle comprising the heat dissipation device of embodiment one and/or the power module of embodiment two.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (10)
1. A heat dissipation device is characterized by comprising a lower cooling plate, an upper cooling assembly and an elastic fixing assembly, wherein a first cooling flow channel is formed in the lower surface of the lower cooling plate;
the upper cooling assembly is fixed above the upper surface of the lower cooling plate through an elastic fixing assembly; the upper cooling assembly comprises a plurality of upper cooling plates, cooling channels are formed in the upper cooling plates respectively, the cooling channels are communicated with one another to form second cooling channels, and two ends of each second cooling channel are communicated with the first cooling channels in a sealing mode.
2. The heat dissipating device of claim 1, wherein the cooling channels communicate with each other through a corrugated hose to form a second cooling flow path;
the outlet of the cooling channel of the upper cooling plate is provided with a connecting part;
the corrugated hose comprises a hose body and connecting pieces located at two ends, wherein the connecting pieces are connected to the connecting parts.
3. The heat dissipating device of claim 2, wherein the connecting portion is threaded with the connecting member;
the end of the pipe body is provided with a first sealing cut, a second sealing cut is arranged at the position, corresponding to the first sealing cut, of the connecting piece, the first sealing cut and the second sealing cut are matched to form a sealing groove, and a sealing ring is arranged in the sealing groove.
4. The heat dissipation device of claim 1, wherein the elastic fixing component comprises a tray, an elastic body and a fixing piece, the tray is positioned above the upper cooling component and is connected to the lower cooling plate through the fixing piece;
the elastic piece is positioned between the upper cooling assembly and the tray to form elastic extrusion on the upper cooling assembly.
5. The heat dissipating device of claim 4, wherein there are a plurality of said elastic bodies, one elastic body for each corner end of said upper cooling plate.
6. The heat dissipation device of claim 4, wherein the elastic body is a spring, and the tray is provided with a limiting post for limiting the spring, and the length of the limiting post is smaller than that of the spring.
7. The heat dissipating device of claim 1, wherein a plurality of fins are disposed within the first cooling flow passage.
8. A power module comprising a power device and the heat dissipating apparatus of any of claims 1-7;
the power device is located between the lower cooling plate and the upper cooling assembly.
9. The power module of claim 1, wherein there are three power devices, and the upper cooling assembly includes three upper cooling plates corresponding to the power devices;
and the upper surface and the lower surface of the power device are coated with heat-conducting silicone grease.
10. A vehicle comprising a heat sink according to any one of claims 1-7 and/or a power module according to any one of claims 8-9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110463955.0A CN113206053B (en) | 2021-04-28 | 2021-04-28 | Heat abstractor, power module and vehicle |
| PCT/CN2022/088157 WO2022228266A1 (en) | 2021-04-28 | 2022-04-21 | Heat dissipation device, power module, and vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110463955.0A CN113206053B (en) | 2021-04-28 | 2021-04-28 | Heat abstractor, power module and vehicle |
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| Publication Number | Publication Date |
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| CN113206053A true CN113206053A (en) | 2021-08-03 |
| CN113206053B CN113206053B (en) | 2023-10-31 |
Family
ID=77029259
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110463955.0A Active CN113206053B (en) | 2021-04-28 | 2021-04-28 | Heat abstractor, power module and vehicle |
Country Status (2)
| Country | Link |
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| CN (1) | CN113206053B (en) |
| WO (1) | WO2022228266A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022228266A1 (en) * | 2021-04-28 | 2022-11-03 | 北京国家新能源汽车技术创新中心有限公司 | Heat dissipation device, power module, and vehicle |
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| DE202004007471U1 (en) * | 2004-05-10 | 2004-09-02 | Richard Wöhr GmbH | Fanless heat sink arrangement for a computer processor, has a heat conducting plate brought into close contact with the processor surface by a spring mechanism with a heat pipe in turn connected to the conducting plate |
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| WO2022228266A1 (en) * | 2021-04-28 | 2022-11-03 | 北京国家新能源汽车技术创新中心有限公司 | Heat dissipation device, power module, and vehicle |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022228266A1 (en) | 2022-11-03 |
| CN113206053B (en) | 2023-10-31 |
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