CN113206053B - Heat abstractor, power module and vehicle - Google Patents
Heat abstractor, power module and vehicle Download PDFInfo
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- CN113206053B CN113206053B CN202110463955.0A CN202110463955A CN113206053B CN 113206053 B CN113206053 B CN 113206053B CN 202110463955 A CN202110463955 A CN 202110463955A CN 113206053 B CN113206053 B CN 113206053B
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- 238000001816 cooling Methods 0.000 claims abstract description 140
- 238000007789 sealing Methods 0.000 claims abstract description 30
- 230000017525 heat dissipation Effects 0.000 claims abstract description 13
- 239000004519 grease Substances 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 229920001971 elastomer Polymers 0.000 claims description 4
- 239000000806 elastomer Substances 0.000 claims description 4
- 238000001125 extrusion Methods 0.000 claims description 2
- 230000006378 damage Effects 0.000 abstract description 6
- 230000005489 elastic deformation Effects 0.000 abstract description 3
- 238000013461 design Methods 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000005483 Hooke's law Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The application relates to the technical field of electronic components, in particular to a heat dissipation device, a power module and a vehicle, wherein the heat dissipation device comprises a lower cooling plate, an upper cooling assembly and an elastic fixing assembly, and a first cooling flow channel is formed in the lower surface of the lower cooling plate; the upper cooling assembly is fixed above the upper surface of the lower cooling plate through the elastic fixing assembly; the upper cooling assembly comprises a plurality of upper cooling plates, cooling channels are respectively arranged in the upper cooling plates, the cooling channels are mutually communicated to form a second cooling flow channel, and two ends of the second cooling flow channel are respectively communicated with the first cooling flow channel in a sealing way; according to the application, the upper cooling component can be tightly pressed on the power device through the elastic fixing component, and the follow-up deformation is carried out through the elastic deformation of the elastic fixing component, so that the damage caused by reasonable deformation and overlarge clamping force is avoided.
Description
Technical Field
The application relates to the technical field of electronic components, in particular to a heat dissipation device, a power module and a vehicle.
Background
In recent years, new energy automobiles are rapidly developed in the automobile industry, and particularly, pure electric automobiles, hybrid electric automobiles and the like are rapidly developed. Along with the gradual improvement of requirements of new energy automobiles on endurance, energy conservation and the like, the traditional IGBT motor controller with the power density of about 15kW/L cannot meet the requirements of factories, and development of a novel motor controller with the power density of 30kW/L or even higher is imperative. Thus, a double-sided water-cooled SiC module (power module) is beginning to be applied in a motor controller. In order to fully exert the low-loss performance of SiC and the high heat dissipation capability of the double-sided water-cooled SiC module, it is necessary to develop a more efficient and reliable heat dissipation method for the double-sided water-cooled SiC module.
The prior art is generally as follows: the bottom radiator, the double-sided water cooling module, the top radiator, the radiator pressing strip and the radiator fixing bolt are sequentially arranged from bottom to top. The whole scheme uses two radiator sandwich structure mounting modes, and the two radiators and the pressing strips are tensioned through bolts by the pressing strips above, so that the purpose of clamping the double-sided water cooling module is achieved, heat is dissipated, and the mounting sequence is sequentially carried out from bottom to top.
Because the upper radiator and the lower radiator are both made of hard metal, most of the upper radiator and the lower radiator are made of cast aluminum and other materials, and the deformation capability is limited. The force applied to the three modules must be uneven. Considering that the thickness of the modules is also different, when the thickness of the middle module is smaller, the two radiating surfaces of the middle module can be reduced greatly, so that the radiating capacity of the middle module is affected, the middle module can be possibly damaged due to overheating, and meanwhile, when the clamping force difference of the modules is reduced by increasing the locking force of the bolts due to the higher heights of the modules on two sides, the clamping force of the modules on two sides is excessively large, and the mechanical damage of the modules can be possibly caused when the clamping force is serious, so that the use reliability and the service life of the modules are affected.
On the other hand, in the use process of the motor controller, the upper and lower radiator local temperature difference can be caused to cause reasonable deformation of the radiator due to heating of the modules, and meanwhile, the stress difference among different modules is also caused to be large, so that the upper and lower effective heat dissipation of each module is influenced, and finally the degree of excessive thermal damage is aggravated.
Disclosure of Invention
The technical problems to be solved by the application are as follows: provided are a heat sink, a power module, and a vehicle capable of adaptively adjusting a clamping force.
In order to solve the technical problems, the first technical scheme adopted by the application is as follows:
a heat dissipating double-fuselage, including lower cooling plate, upper cooling assembly and elastic fixed assembly, offer the first cooling flow channel on the lower surface of the said lower cooling plate;
the upper cooling assembly is fixed above the upper surface of the lower cooling plate through the elastic fixing assembly; the upper cooling assembly comprises a plurality of upper cooling plates, a plurality of cooling channels are respectively arranged in the upper cooling plates, the cooling channels are mutually communicated to form a second cooling flow channel, and two ends of the second cooling flow channel are respectively communicated with the first cooling flow channel in a sealing way.
In order to solve the technical problems, a second technical scheme adopted by the application is as follows:
a power module comprises a power device and the heat dissipation device;
the power device is located between the lower cooling plate and the upper cooling assembly.
In order to solve the technical problems, a third technical scheme adopted by the application is as follows:
a vehicle comprises the heat dissipation device and/or the power module.
The application has the beneficial effects that: the upper cooling component can be tightly pressed on the power device through the elastic fixing component, each corner end of the upper cooling plate corresponds to one elastic body, different compression amounts of module areas of the power devices are guaranteed to be self-adaptively pressed on the power devices, different clamping forces required by different power devices are met, meanwhile, the reliable heat dissipation requirement of the power devices is guaranteed, mechanical damage caused by overlarge clamping force is avoided, and the reliability and the service life of the power devices are guaranteed; reasonable deformation occurring during the work of the power device can also be carried out the follow-up deformation through the elastic deformation of the elastic fixing component, so that the damage caused by the reasonable deformation is avoided.
Drawings
Fig. 1 is a schematic structural diagram of a power module according to an embodiment of the present application;
FIG. 2 is an exploded view of FIG. 1;
FIG. 3 is another angular view of FIG. 2;
FIG. 4 is a cross-sectional view of a corrugated hose;
description of the reference numerals: 1. a lower cooling plate; 11. a first cooling flow passage; 12. a communication port; 13. a heat sink; 2. an upper cooling assembly; 21. an upper cooling plate; 22. a second cooling flow path; 23. a corrugated hose; 231. a tube body; 232. a connecting piece; 233. sealing grooves; 3. an elastic fixing component; 31. a tray; 32. an elastomer; 33. a fixing member; 34. a limit column; 4. a power device.
Detailed Description
In order to describe the technical contents, the achieved objects and effects of the present application in detail, the following description will be made with reference to the embodiments in conjunction with the accompanying drawings.
Referring to fig. 1 to 4, a heat dissipating device includes a lower cooling plate 1, an upper cooling assembly 2, and an elastic fixing assembly 3, wherein a first cooling channel 11 is formed on a lower surface of the lower cooling plate 1; two ends of the first cooling flow channel 11 are respectively provided with a communication port 12;
the upper cooling assembly 2 is fixed above the upper surface of the lower cooling plate 1 through an elastic fixing assembly 3; the upper cooling assembly 2 comprises a plurality of upper cooling plates 21, a plurality of cooling channels are respectively arranged in the upper cooling plates 21, the cooling channels are mutually communicated to form a second cooling flow channel 22, and two ends of the second cooling flow channel 22 are respectively communicated with the communication ports 12 of the first cooling flow channel 11 in a sealing way.
Further, the cooling channels are mutually communicated through a corrugated hose 23 to form a second cooling flow passage 22;
the outlet of the cooling channel of the upper cooling plate 21 is provided with a connecting part;
the bellows 23 includes a pipe body 231 and connection members 232 at both ends, and the connection members 232 are connected to the connection portions.
Further, the connecting part is in threaded connection with the connecting piece 232;
the end of the pipe body 231 is provided with a first sealing notch, a second sealing notch is arranged at a position corresponding to the first sealing notch of the connecting piece 232, the first sealing notch and the second sealing notch are matched to form a sealing groove 233, and a sealing ring is arranged in the sealing groove 233.
Further, the elastic fixing assembly 3 comprises a tray 31, an elastic body 32 and a fixing piece 33, wherein the tray 31 is positioned above the upper cooling assembly 2 and is connected to the lower cooling plate 1 through the fixing piece 33;
the elastomer is located between the upper cooling module 2 and the tray 31 to form an elastic compression of the upper cooling module 2.
Further, there are a plurality of elastic bodies 32, and each corner end of the upper cooling plate 21 corresponds to one elastic body 32.
Further, the elastic body 32 is a spring, a limiting post 34 for limiting the spring is disposed on the tray 31, and the length of the limiting post 34 is smaller than that of the spring.
Further, a plurality of cooling fins 13 are provided in the first cooling flow passage 11.
A power module comprises a power device 4 and the heat dissipation device;
the power device 4 is located between the lower cooling plate 1 and the upper cooling assembly 2.
Further, the number of the power devices 4 is three, and the upper cooling assembly 2 comprises three upper cooling plates 21 corresponding to the power devices 4;
the upper surface and the lower surface of the power device 4 are coated with heat-conducting silicone grease.
A vehicle comprises the heat dissipation device and/or the power module.
From the above description, the beneficial effects of the application are as follows: the upper cooling component 2 can be tightly pressed on the power device 4 through the elastic fixing component 3, each corner end of the upper cooling plate 21 corresponds to one elastic body 32, different compression amounts of module areas of the power devices 4 are ensured to be self-adaptively pressed on the power devices 4, different clamping forces required by different power devices 4 are met, meanwhile, the reliable heat dissipation requirement of the power devices 4 is ensured, mechanical damage caused by overlarge clamping force is avoided, and the reliability and the service life of the power devices 4 are ensured; the reasonable deformation occurring during the operation of the power device 4 can also be followed by the elastic deformation of the elastic fixing component 3, so that the damage caused by the reasonable deformation is avoided. The heat conduction silicone grease can improve the heat conduction performance.
Example 1
A heat dissipating double-fuselage, including lower cooling plate, upper cooling assembly and elastic fixed assembly, offer the first cooling flow channel on the lower surface of the said lower cooling plate; two ends of the first cooling flow channel are respectively provided with a communication port;
the upper cooling assembly is fixed above the upper surface of the lower cooling plate through the elastic fixing assembly; the upper cooling assembly comprises a plurality of upper cooling plates, a plurality of cooling channels are respectively arranged in the upper cooling plates, the cooling channels are mutually communicated to form a second cooling flow channel, and two ends of the second cooling flow channel are respectively communicated with the communication ports of the first cooling flow channel in a sealing mode.
The cooling channels are mutually communicated through corrugated hoses to form a second cooling flow passage;
the outlet of the cooling channel of the upper cooling plate is provided with a connecting part;
the corrugated hose comprises a hose body and connecting pieces positioned at two ends, and the connecting pieces are connected to the connecting portions.
The connecting part is in threaded connection with the connecting piece;
the tail end of the pipe body is provided with a first sealing notch, a second sealing notch is arranged at the position, corresponding to the first sealing notch, of the connecting piece, the first sealing notch and the second sealing notch are matched to form a sealing groove, and a sealing ring is arranged in the sealing groove.
The elastic fixing assembly comprises a tray, an elastic body and a fixing piece, wherein the tray is positioned above the upper cooling assembly and is connected to the lower cooling plate through the fixing piece;
the elastic body is positioned between the upper cooling component and the tray to form elastic extrusion of the upper cooling component.
The elastic bodies are a plurality of, and each corner end of the upper cooling plate corresponds to one elastic body.
The elastic body is a spring, a limiting column for limiting the spring is arranged on the tray, and the length of the limiting column is smaller than that of the spring.
A plurality of cooling fins are arranged in the first cooling flow passage.
Example two
A power module comprising three power devices (SiC) and a heat sink as described in embodiment one;
the power device is located between the lower cooling plate and the upper cooling assembly.
The upper cooling assembly comprises three upper cooling plates corresponding to the power devices;
the upper surface and the lower surface of the power device are coated with heat conduction silicone grease.
The upper cooling plate is a rounded rectangular plate body, and the number of the springs is 12;
the installation process is as follows:
(1) Preparing a lower cooling plate;
(2) Placing three SiC power devices (model: MD800HFC120N 3S) on a lower cooling plate, and coating heat conduction silicone grease on the upper and lower surfaces of the power devices in advance to improve the heat conduction performance;
(3) Preparing three upper cooling plates of the controller, which correspond to the power devices;
(4) A corrugated flexible connecting pipe is arranged among the three upper cooling plates;
(5) Placing 12 nonstandard compression springs on the upper cooling assembly;
(6) The circuit board tray is arranged on a lower cooling plate (the structure of a controller box body is shown in the drawing), the design is that the lower cooling plate and the control box body are integrally designed, and then the tray tightly presses three upper cooling plates on three power devices through compressing 12 nonstandard springs.
From the foregoing, since various types of workpieces have thickness deviations from batch to batch during production, these production control factors need to be added to the design input. In the vehicle-mounted environment, the power module is influenced by factors such as environmental temperature change, self-heating local difference and the like, and the stress influence of hardware part deformation also needs to be added into design input.
As can be seen from the module specifications, typical clamping force for SiC power devices (model: MD800HFC120N 3S) is 700N, maximum 850N. In order to make the thermal resistances of the three modules more uniform, it is desirable to have a smaller and better variation in clamping force between the modules. In this case, the design goal according to the clamping force of the module is ftotal=700n+100n, as shown in fig. 2, the single module is forced by 4 springs, so the elastic force requirement of the single spring is as follows:
f=ftotal/4=175n+25n, Δf=25n formula 1
From Hooke's law
F=k×Δx type 2
It is known that the actual pressure is directly determined by the amount of spring deflection and the spring rate. The difference in spring deflection between the three modules is determined by the tolerances of the parts. The thickness h=4.7 mm plus or minus 0.3 of the SiC power device (model: MD800HFC120N 3S), the maximum thickness difference among the three modules is Δh=0.6 mm, the machining precision requirement of the upper water cooling plate is h1=26.5mm+0.3, Δh1=0.3 mm, the machining precision requirement of the mounting surface of the mounting spring pressing plate in the box body is h2=62.5mm+0.3, and Δh2=0.3 mm, so the maximum deviation of the deformation amount of the springs among the three modules is considered in consideration of tolerance extremum:
ΔΔΔx =Δ h+Δh1+Δh2=1.2 mm 3
As can be derived from equation 1, equation 2 and equation 3, k=Δf/ΔΔx=25n/1.2 mm=20.83N/mm equation 4
As can be derived from equation 4 and company 1, the spring travel Δx=f/k=175/20.83=8.4 mm equation 5
From k=g×d 4 /8*n*D 3 6. The method is to
In the design, G=79000N/mm is selected 2 D=2 mm, d=9.6 mm, calculated from formulas 4 and 6:
n＝G*d 4 /8*K*D 3 =8.5 type 7
Wherein: g: modulus of elasticity in transverse direction (young's modulus), d: wire diameter, n: effective turns, D: average coil diameter
Fmax=k (Δx+ΔΔx) =20.83×9.6=199.7N formula 8
The design is designed by selecting G=79000N/mm 2 L=16mm, can be obtained by formula 5, the strain is 50%, the diameter of line is 2mm, diameter is 9.6mm, nonstandard spring of 8.5 turns, in the actual production process, can also control the spring tolerance #<+0.7mm) to further balance the stress differences between the three phase modules, reducing spring strain.
Example III
A vehicle includes the heat sink of embodiment one and/or the power module of embodiment two.
The foregoing description is only illustrative of the present application and is not intended to limit the scope of the application, and all equivalent changes made by the specification and drawings of the present application, or direct or indirect application in the relevant art, are included in the scope of the present application.
Claims (9)
1. The heat dissipation device is characterized by comprising a lower cooling plate, an upper cooling assembly and an elastic fixing assembly, wherein a first cooling flow channel is formed in the lower surface of the lower cooling plate;
the upper cooling assembly is fixed above the upper surface of the lower cooling plate through the elastic fixing assembly; the upper cooling assembly comprises a plurality of upper cooling plates, cooling channels are respectively arranged in the upper cooling plates, the cooling channels are mutually communicated to form a second cooling flow channel, and two ends of the second cooling flow channel are respectively communicated with the first cooling flow channel in a sealing way;
the elastic fixing assembly comprises a tray, an elastic body and a fixing piece, wherein the tray is positioned above the upper cooling assembly and is connected to the lower cooling plate through the fixing piece;
the elastic body is positioned between the upper cooling component and the tray to form elastic extrusion of the upper cooling component.
2. The heat sink of claim 1 wherein the cooling channels communicate with each other through corrugated hoses to form a second cooling flow path;
the outlet of the cooling channel of the upper cooling plate is provided with a connecting part;
the corrugated hose comprises a hose body and connecting pieces positioned at two ends, and the connecting pieces are connected to the connecting portions.
3. The heat sink of claim 2, wherein the connection portion is threaded with the connection member;
the tail end of the pipe body is provided with a first sealing notch, a second sealing notch is arranged at the position, corresponding to the first sealing notch, of the connecting piece, the first sealing notch and the second sealing notch are matched to form a sealing groove, and a sealing ring is arranged in the sealing groove.
4. The heat sink of claim 1 wherein there are a plurality of said elastomers, one elastomer for each corner of said upper cooling plate.
5. The heat dissipating device of claim 1, wherein the elastic body is a spring, and a limiting post for limiting the spring is provided on the tray, and the length of the limiting post is smaller than the length of the spring.
6. The heat sink of claim 1 wherein a plurality of fins are disposed within the first cooling flow path.
7. A power module comprising a power device and a heat sink according to any one of claims 1-6;
the power device is located between the lower cooling plate and the upper cooling assembly.
8. The power module of claim 7, wherein the power devices are three, and the upper cooling assembly comprises three upper cooling plates corresponding to the power devices;
the upper surface and the lower surface of the power device are coated with heat conduction silicone grease.
9. A vehicle comprising a heat sink according to any one of claims 1-6 or a power module according to any one of claims 7-8.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110463955.0A CN113206053B (en) | 2021-04-28 | 2021-04-28 | Heat abstractor, power module and vehicle |
| PCT/CN2022/088157 WO2022228266A1 (en) | 2021-04-28 | 2022-04-21 | Heat dissipation device, power module, and vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110463955.0A CN113206053B (en) | 2021-04-28 | 2021-04-28 | Heat abstractor, power module and vehicle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113206053A CN113206053A (en) | 2021-08-03 |
| CN113206053B true CN113206053B (en) | 2023-10-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110463955.0A Active CN113206053B (en) | 2021-04-28 | 2021-04-28 | Heat abstractor, power module and vehicle |
Country Status (2)
| Country | Link |
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| CN (1) | CN113206053B (en) |
| WO (1) | WO2022228266A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113206053B (en) * | 2021-04-28 | 2023-10-31 | 北京国家新能源汽车技术创新中心有限公司 | Heat abstractor, power module and vehicle |
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2021
- 2021-04-28 CN CN202110463955.0A patent/CN113206053B/en active Active
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- 2022-04-21 WO PCT/CN2022/088157 patent/WO2022228266A1/en active Application Filing
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| DE202004007471U1 (en) * | 2004-05-10 | 2004-09-02 | Richard Wöhr GmbH | Fanless heat sink arrangement for a computer processor, has a heat conducting plate brought into close contact with the processor surface by a spring mechanism with a heat pipe in turn connected to the conducting plate |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN113206053A (en) | 2021-08-03 |
| WO2022228266A1 (en) | 2022-11-03 |
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