CN111596746A

CN111596746A - Device for cooling liquid by using semiconductor refrigeration piece and liquid-cooled CPU radiator

Info

Publication number: CN111596746A
Application number: CN202010416277.8A
Authority: CN
Inventors: 王公利; 李尚英; 杨成秋
Original assignee: Jinan Dede Environmental Protection Technology Co ltd
Current assignee: JIANGSU KETENG ENVIRONMENTAL TECHNOLOGY Co.,Ltd.
Priority date: 2020-05-17
Filing date: 2020-05-17
Publication date: 2020-08-28
Anticipated expiration: 2040-05-17
Also published as: CN111596746B

Abstract

The application provides a device for cooling liquid by adopting a semiconductor refrigeration piece, which comprises the semiconductor refrigeration piece, a rotating base, a fixed base, a clamp, a first rolling bearing, a second rolling bearing, a third rolling bearing, a first plastic insulating ring, a second plastic insulating ring, a direct-current motor, a motor base and a transmission disc, wherein the rotating base is arranged on the fixed base; the semiconductor refrigeration piece is fixed on the rotary metal heat conduction piece to rotate together, heat on the fixed base is transferred to the cold surface of the semiconductor refrigeration piece through the rolling bearing I, direct current is provided for the rotary semiconductor refrigeration piece through the rotary rolling bearing II and the rolling bearing III, the hot surface of the semiconductor refrigeration piece is directly exposed in the atmosphere, heat dissipation fins and a heat dissipation fan are not needed, stronger heat convection heat dissipation is directly generated with air, more semiconductor refrigeration pieces can be arranged in unit volume, the heat dissipation mode of the hot surface and the refrigeration mode of the cold surface are changed, and the refrigeration effect and the refrigeration efficiency are improved. The application also provides a liquid cooling CPU radiator.

Description

Device for cooling liquid by using semiconductor refrigeration piece and liquid-cooled CPU radiator

Technical Field

The invention relates to the technical field of semiconductor refrigeration, in particular to a device for cooling liquid by using a semiconductor refrigeration piece and a liquid-cooled CPU radiator.

Background

At present, cooling modes or heat dissipation modes mainly include air cooling and liquid cooling, for example, a CPU radiator includes an air cooling CPU radiator and a liquid cooling CPU radiator; for example, motorcycle engines include air-cooled engines and liquid-cooled engines; in general, the heat dissipation capacity of liquid cooling is greater than that of air cooling.

The semiconductor refrigerating sheet, also called thermoelectric refrigerating sheet, is a heat pump, and utilizes the Seebeck effect, Peltier effect and Thomson effect of semiconductor material, when the direct current passes through the semiconductor refrigerating sheet, the two long and wide surfaces of the semiconductor refrigerating sheet can respectively absorb heat and release heat, wherein the long and wide surface of the semiconductor refrigerating sheet absorbing heat is called cold surface, and the long and wide surface of the semiconductor refrigerating sheet releasing heat is called hot surface, so that the semiconductor refrigerating sheet can realize refrigeration, and the temperature difference between the cold surface and the hot surface can reach about 60 ℃. For example: at present, the semiconductor refrigerator on the market utilizes the semiconductor refrigerating sheet for refrigeration, so that the temperature in the refrigerator is about 25 ℃ lower than the temperature of the external environment.

Therefore, how to adopt the combined action of liquid cooling and semiconductor refrigeration to radiate heat of electronic devices such as a CPU and mechanical devices such as a motorcycle engine and the like, and improve the heat radiation effect and the heat radiation efficiency is a technical problem which needs to be solved urgently by those skilled in the art.

Disclosure of Invention

The invention aims to provide a device for cooling liquid by using a semiconductor chilling plate. Another object of the present invention is to provide a liquid-cooled CPU heat sink including the above-mentioned apparatus for cooling liquid using semiconductor cooling fins.

In order to solve the technical problems, the technical scheme provided by the invention is as follows:

a device for cooling liquid by adopting semiconductor refrigeration pieces comprises a plurality of semiconductor refrigeration pieces for refrigeration, a rotating base which is used for conducting heat and mounting the semiconductor refrigeration pieces and is made of metal materials, a fixing base which is used for conducting heat and supporting the rotation of the rotating base and is made of metal materials, a clamp which is used for clamping and fixing the semiconductor refrigeration pieces, a rolling bearing I which is used for supporting rotation and conducting heat and is made of metal materials, a rolling bearing II which is used for supporting rotation and conducting electricity and is made of metal materials, a rolling bearing III which is used for supporting rotation and conducting electricity and is made of metal materials, a plastic insulating ring I, a plastic insulating ring II, a direct current motor, a motor base and a transmission disc made of plastic materials;

the fixing base comprises a top plate, a liquid storage pipe, a bottom disc and a threading pipe, wherein a special-shaped through hole with a small opening and a large inner cavity is arranged at the axial center of the bottom disc, a top pipe opening of the liquid storage pipe is hermetically welded with the lower long and wide surface of the top plate, the top plate covers the top pipe opening of the liquid storage pipe, and a bottom pipe opening of the liquid storage pipe is hermetically welded with a top hole opening of the special-shaped through hole;

the threading pipe is used for allowing an electric wire to pass through, the threading pipe is of a 90-degree elbow structure, the threading pipe is sleeved in the liquid storage pipe to form an inner sleeve and outer sleeve structure, a wire inlet through hole for feeding the electric wire is formed in the pipe wall of the liquid storage pipe, an upper end pipe orifice of the threading pipe is in sealed welding connection with the wire inlet through hole in the liquid storage pipe, and a lower end pipe orifice of the threading pipe is inserted into the special-shaped through hole and is in sealed welding connection with a bottom hole orifice of the special-shaped through hole;

an upper cavity is formed by a gap left between the inner surface of the tube wall of the liquid storage tube and the outer surface of the tube wall of the threading tube, a lower cavity is formed by a gap left between the inner surface of the special-shaped through hole and the outer surface of the tube wall of the threading tube, the upper cavity is communicated with the lower cavity to form a liquid storage cavity for storing cooling liquid, a liquid inlet for feeding liquid into the liquid storage cavity is formed in the upper circular surface of the bottom disc, and a liquid outlet for discharging liquid from the liquid storage cavity is formed in the tube wall of the top of the liquid storage tube;

the rolling bearing I comprises an inner ring I, an outer ring I, a rolling body I and a retainer I;

the bottom disc is welded, inserted and fixed in the first inner ring of the first rolling bearing, and the outer diameter surface of the bottom disc is welded and connected with the inner diameter surface of the first inner ring so as to form mechanical connection and heat conduction connection between the bottom disc and the first inner ring;

the rotating base comprises a metal heat pipe and at least 2 metal heat conducting fins, and the at least 2 metal heat conducting fins are uniformly arranged on the outer surface of the pipe wall of the metal heat pipe so as to form integrated connection and heat conduction connection between the metal heat pipe and the metal heat conducting fins;

the motor base comprises a plastic pipe and a plastic flange, the plastic flange is arranged at the top end of the plastic pipe, the motor base is sleeved in the metal heat conduction pipe and is positioned below the bottom disc, a screw rod of a bolt penetrates through the plastic flange and the bottom disc to form a bolt connection so as to fix the motor base on the lower circular surface of the bottom disc, and a pipe cavity of the threading pipe is communicated with a pipe cavity of the plastic pipe;

the direct current motor is arranged in a bottom pipe orifice of the plastic pipe, the transmission disc is positioned in a pipe cavity of the metal heat conduction pipe and below the direct current motor, a rotating shaft of the direct current motor is inserted and fixed in an axial central through hole of the transmission disc, an axial central line of the rotating shaft in the direct current motor is superposed with an axial central line of the metal heat conduction pipe, and the outer diameter surface of the transmission disc is in adhesive connection with the inner surface of the pipe wall of the metal heat conduction pipe so as to drive the metal heat conduction pipe to rotate through the rotation of the rotating shaft of the direct current motor;

the metal heat conduction pipe rotates to drive the metal heat conduction sheet to rotate;

the top pipe orifice of the metal heat conduction pipe is welded and sleeved on the first outer ring of the first rolling bearing, and the outer diameter surface of the first outer ring is welded and connected with the inner surface of the pipe wall of the top pipe orifice of the metal heat conduction pipe so as to drive the first outer ring to rotate by the rotation of the metal heat conduction pipe and form heat conduction connection between the first outer ring and the metal heat conduction pipe;

the semiconductor refrigeration piece is clamped and fixed on the long and wide surface of the metal heat conducting piece by the clamp so as to be driven to rotate by the rotation of the metal heat conducting piece, and heat-conducting silicone grease is coated between the cold surface of the semiconductor refrigeration piece and the long and wide surface of the metal heat conducting piece to form heat-conducting connection between the cold surface of the semiconductor refrigeration piece and the long and wide surface of the metal heat conducting piece;

the outer surface of the pipe wall of the metal heat conduction pipe is coated with a layer of heat preservation material for heat preservation and heat insulation, and the rest outer surface of the metal heat conduction sheet except the outer surface provided with the semiconductor refrigeration sheet is coated with a layer of heat preservation material for heat preservation and heat insulation;

the second rolling bearing comprises a second inner ring, a second outer ring, a second rolling body and a second retainer, the second inner ring of the second rolling bearing is sleeved and fixed on the outer surface of the pipe wall of the plastic pipe, the outer diameter surface of the second outer ring of the second rolling bearing is in adhesive connection with the inner diameter surface of the first plastic insulating ring through an adhesive, and the outer diameter surface of the first plastic insulating ring is in adhesive connection with the inner surface of the pipe wall of the metal heat conduction pipe through the adhesive so as to drive the second outer ring to rotate through the rotation of the metal heat conduction pipe;

the third rolling bearing comprises a third inner ring, a third outer ring, a third rolling body and a third retainer, the third inner ring of the third rolling bearing is sleeved and fixed on the outer surface of the pipe wall of the plastic pipe, the third rolling bearing is positioned below the second rolling bearing, the outer diameter surface of the third outer ring of the third rolling bearing is in adhesive connection with the inner diameter surface of the second plastic insulating ring through an adhesive, and the outer diameter surface of the second plastic insulating ring is in adhesive connection with the inner surface of the pipe wall of the metal heat conduction pipe through the adhesive so as to drive the third outer ring to rotate through the rotation of the metal heat conduction pipe;

the first positive wire and the first negative wire for supplying power to the semiconductor refrigeration piece penetrate through the threading pipe and then enter the pipe cavity of the plastic pipe, the first positive wire penetrates through the pipe wall of the plastic pipe and is electrically connected with the second inner ring of the second rolling bearing to provide direct current for the second rolling bearing, and the first negative wire penetrates through the pipe wall of the plastic pipe and is electrically connected with the third inner ring of the third rolling bearing to provide direct current for the third rolling bearing;

the first plastic insulating ring is provided with a radial through hole for communicating the outer diameter surface and the inner diameter surface of the first plastic insulating ring, and a positive electrode conducting wire of the semiconductor refrigerating sheet firstly penetrates through the pipe wall of the metal heat conducting pipe and then penetrates through the radial through hole in the first plastic insulating ring to be finally electrically connected with the second outer ring of the rolling bearing so as to be used for providing direct current to the rotating semiconductor refrigerating sheet by taking the rotating second outer ring as the positive electrode of a direct current power supply;

the second plastic insulating ring is provided with a radial through hole for communicating the outer diameter surface and the inner diameter surface of the second plastic insulating ring, and a negative electrode conducting wire of the semiconductor refrigerating sheet firstly penetrates through the pipe wall of the metal heat conducting pipe and then penetrates through the radial through hole in the second plastic insulating ring to be finally electrically connected with the third outer ring of the rolling bearing, so that the third rotating outer ring serves as a negative electrode of a direct-current power supply to provide direct current for the third rotating semiconductor refrigerating sheet;

and the axial line surrounded by the rotation of the outer ring I of the rolling bearing I, the axial line surrounded by the rotation of the outer ring II of the rolling bearing II, the axial line surrounded by the rotation of the outer ring III of the rolling bearing III and the axial center line of the rotating shaft of the direct current motor are superposed.

Preferably, the metal heat conducting fins are planar and flaky, the length and width surfaces of the metal heat conducting fins are parallel to the axial center line of the metal heat conducting pipe, the outer surface of the pipe wall of the metal heat conducting pipe is integrally connected with one of the metal heat conducting fins in a side-to-side manner, and a gap is reserved between every two adjacent metal heat conducting fins to form an air duct so that cooling air can pass through the gap.

Preferably, each length and width surface of each metal heat conducting sheet is provided with a semiconductor refrigerating sheet.

Preferably, the clamp comprises an aluminum strip A, an aluminum strip B, an upper plastic bolt and a lower plastic bolt;

bolt through holes are respectively formed in the two ends of the aluminum strip A in the length direction, and bolt through holes are respectively formed in the two ends of the aluminum strip B in the length direction;

the two long and wide surfaces of the metal heat conducting sheet are respectively a long and wide surface A and a long and wide surface B;

the semiconductor refrigerating sheet on the long and wide surface A is clamped between the long and wide surface A and the inner long and wide surface of the aluminum strip A, and the hot surface of the semiconductor refrigerating sheet on the long and wide surface A is in close contact with the inner long and wide surface of the aluminum strip A;

the semiconductor refrigerating sheet on the long and wide surface B is clamped between the long and wide surface B and the inner long and wide surface of the aluminum strip B, and the hot surface of the semiconductor refrigerating sheet on the long and wide surface B is in close contact with the inner long and wide surface of the aluminum strip B;

the screw rod of the upper plastic bolt sequentially penetrates through the bolt through hole at the upper end of the aluminum strip A, the heat insulation material on the long and wide surface A, the metal heat conducting sheet, the heat insulation material on the long and wide surface B and the bolt through hole at the upper end of the aluminum strip B, the screw rod of the lower plastic bolt sequentially penetrates through the bolt through hole at the lower end of the aluminum strip A, the heat insulation material on the long and wide surface A, the metal heat conducting sheet, the heat insulation material on the long and wide surface B and the bolt through hole at the lower end of the aluminum strip B, the aluminum strip A, the aluminum strip B, the upper plastic bolt and the lower plastic bolt are connected end to form a rectangular frame, the upper end of the aluminum strip A is connected with the upper end of the aluminum strip B through a bolt, the lower end of the aluminum strip A is connected with the lower end of the aluminum strip B through a bolt, the semiconductor refrigerating sheet is clamped and fixed on the metal heat conducting sheet by screwing the upper plastic bolt and the lower plastic bolt through the aluminum strips A and B.

Preferably, the rotating base is made of aluminum alloy, copper or copper alloy materials;

the top plate is made of aluminum alloy, copper or copper alloy materials;

the liquid storage pipe is made of aluminum alloy, copper or copper alloy materials;

the bottom disc is made of aluminum alloy, copper or copper alloy materials;

the threading pipe is made of aluminum alloy, copper or copper alloy materials.

Preferably, the first rolling bearing is a cylindrical roller bearing, and an inner ring I, an outer ring I and a rolling body I in the first rolling bearing are all made of aluminum alloy, copper alloy or steel materials;

the second rolling bearing and the third rolling bearing are ball bearings, and the second inner ring, the second outer ring, the second rolling body, the third inner ring, the third outer ring and the third rolling body are all made of aluminum alloy, copper alloy or steel materials.

Preferably, a second positive electrode wire and a second negative electrode wire for supplying power to the direct current motor penetrate through the threading pipe and then enter the pipe cavity of the plastic pipe, and then the second positive electrode wire and the second negative electrode wire penetrate through the plastic pipe downwards and are finally electrically connected with the positive electrode and the negative electrode of the direct current motor respectively;

the semiconductor refrigeration piece is electrically connected with a direct current power supply, the direct current motor is electrically connected with the direct current power supply, and the semiconductor refrigeration piece is electrically connected with the direct current motor in parallel.

Preferably, the top plate is provided with a bolt through hole for inserting a fastening bolt to fix the top plate.

A liquid cooling CPU radiator comprises a water cooling head, a cooling liquid circulating pump, a plastic hose and any one of the devices which adopts a semiconductor refrigeration piece to cool liquid;

the inlet of the cooling liquid circulating pump is communicated with the liquid outlet on the liquid storage pipe through a plastic hose, the liquid outlet of the cooling liquid circulating pump is communicated with the inlet of the water cooling head through a plastic hose, and the liquid outlet of the water cooling head is communicated with the inlet on the bottom disc through a plastic hose so as to form a circulating flow loop of the cooling liquid.

Drawings

Fig. 1 is a schematic sectional view of an axial center plane of a device for cooling liquid by using semiconductor chilling plates, according to an embodiment of the present invention (fig. 1 is only a schematic view, in which a plurality of fine components are shown in a slightly larger size for clarity in fig. 1, actual sizes in practical applications include, but are not limited to, the sizes in fig. 1, and the actual sizes in practical applications include, but are not limited to, the sizes in fig. 1;

in order to embody the semiconductor refrigeration sheet in fig. 1, the metal heat-conducting sheet, the semiconductor refrigeration sheet, the heat-insulating material on the metal heat-conducting sheet, the aluminum strip a, the aluminum strip B, the upper plastic bolt and the lower plastic bolt are not cut in fig. 1;

in view of the complex internal structure of the dc motor, the dc motor is not cut in fig. 1;

in order to avoid the phenomenon that the appearance is disordered and unclear due to too many fine lines, a second positive electrode wire and a second negative electrode wire are not drawn in the figure 1);

FIG. 2 is a schematic cross-sectional view of the axial center plane of the stationary base, the motor base, the DC motor and the transmission disc of FIG. 1;

FIG. 3 is a schematic perspective view of the rotating base in FIG. 1;

FIG. 4 is a schematic cross-sectional view of the metal heat-conducting strip of FIG. 3 taken along the axial center plane where the upper plastic bolt and the lower plastic bolt coincide with each other;

fig. 5 is a schematic perspective view of the first plastic insulating ring in fig. 1;

fig. 6 is a schematic view showing the structure of a liquid-cooled CPU radiator including an apparatus for cooling liquid using a semiconductor cooling fin of fig. 1 (the direction of the arrow in fig. 6 represents the flow direction of the cooling liquid).

In the figure: 1CPU, 101 heat-conducting silicone grease;

2, fixing a base, 201 a top plate, 202 a liquid storage pipe, 2021 a liquid storage pipe, 203 a bottom disc, 2031 a bottom disc, 204 a threading pipe, 205 an upper cavity, 206 a lower cavity, 207 a positive electrode wire I and 208 a negative electrode wire I;

3 rolling bearing one, inner ring one 301, outer ring one 302 and rolling body one 303;

4, a rotating base, a 401 metal heat conduction pipe, a 402 metal heat conduction sheet, a heat insulation material on a 403 metal heat conduction pipe, a heat insulation material on a 404 metal heat conduction sheet, and a through hole which allows an anode conductive wire of a semiconductor refrigeration sheet to pass through on a 405 metal heat conduction pipe;

5, a motor base, 501 plastic pipes, 502 plastic flanges and 503 bolts;

6 DC motor, 601 rotation axis;

7, a transmission disc;

8 semiconductor refrigerating plates, 801 positive electrode conducting wires and 802 negative electrode conducting wires;

9, a second rolling bearing, a second inner ring 901, a second outer ring 902 and a second rolling body 903;

10, a third rolling bearing, a third inner ring 1001, a third outer ring 1002 and a third rolling body 1003;

11 a first plastic insulating ring, 1101 a radial through hole on the first plastic insulating ring;

12, a second plastic insulating ring, 1201 and a radial through hole on the second plastic insulating ring;

1301 aluminum strip A, 1302 aluminum strip B, 1303 upper plastic bolt and 1304 lower plastic bolt;

14 water cooling head, 1401 water cooling head liquid inlet, 1402 water cooling head liquid outlet;

15 cooling liquid circulating pump, 16 plastic hose.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

In the description of the present invention, it is to be understood that the terms "central," "axial," "radial," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "vertical," "horizontal," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present invention and to simplify the description, but are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the present invention.

Referring to fig. 1 to 6, fig. 1 to 6 include: CPU 1, thermal grease 101; the device comprises a fixed base 2, a top plate 201, a liquid storage pipe 202, a liquid outlet 2021 on the liquid storage pipe, a bottom disc 203, a liquid inlet 2031 on the bottom disc, a threading pipe 204, an upper cavity 205, a lower cavity 206, a first positive electrode wire 207 and a first negative electrode wire 208; the rolling bearing I3 comprises an inner ring I301, an outer ring I302 and a rolling body I303; the semiconductor refrigeration device comprises a rotating base 4, a metal heat conduction pipe 401, a metal heat conduction sheet 402, a heat insulation material 403 on the metal heat conduction pipe, a heat insulation material 404 on the metal heat conduction sheet, and a through hole 405 on the metal heat conduction pipe for allowing a positive electrode conductive wire of a semiconductor refrigeration sheet to pass through; a motor base 5, a plastic pipe 501, a plastic flange 502 and a bolt 503; a direct current motor 6, a rotating shaft 601; a transmission disc 7; the refrigerating device comprises a semiconductor refrigerating sheet 8, a positive electrode conducting wire 801 and a negative electrode conducting wire 802; a rolling bearing II 9, an inner ring II 901, an outer ring II 902 and a rolling body II 903; a rolling bearing III 10, an inner ring III 1001, an outer ring III 1002 and a rolling body III 1003; a first plastic insulating ring 11, wherein a radial through hole 1101 is formed in the first plastic insulating ring; a second plastic insulating ring 12, and a radial through hole 1201 on the second plastic insulating ring; aluminum strip A1301, aluminum strip B1302, upper plastic bolt 1303 and lower plastic bolt 1304; a water cooling head 14, a water cooling head liquid inlet 1401, a water cooling head liquid outlet 1402; a cooling liquid circulating pump 15 and a plastic hose 16.

The application provides a device for cooling liquid by adopting semiconductor chilling plates, which comprises a plurality of semiconductor chilling plates 8 for refrigeration, a rotating base 4 which is used for conducting heat and installing the semiconductor chilling plates 8 and is made of a metal material, a fixing base 2 which is used for conducting heat and supporting the rotation of the rotating base 4 and is made of the metal material, a clamp used for clamping and fixing the semiconductor chilling plates 8, a rolling bearing I3 which is used for supporting rotation and conducting heat and is made of the metal material, a rolling bearing II 9 which is used for supporting rotation and conducting electricity and is made of the metal material, a rolling bearing III which is used for supporting rotation and conducting electricity and is made of the metal material, a plastic insulating ring I11, a plastic insulating ring II 12, a direct current motor 6, a motor base 5 and a driving disc 7 which is made of the plastic material;

the fixed base 2 comprises a top plate 201, a liquid storage pipe 202, a bottom disc 203 and a threading pipe 204, wherein a special-shaped through hole with a small opening and a large inner cavity is arranged at the axial center of the bottom disc 203, a top pipe opening of the liquid storage pipe 202 is connected with the lower long and wide surface of the top plate 201 in a sealing and welding mode, the top pipe opening of the liquid storage pipe 202 is covered by the top plate 201, and a bottom pipe opening of the liquid storage pipe 202 is connected with a top hole opening of the special-shaped through hole in a sealing and welding mode;

the threading pipe 204 is used for allowing an electric wire to pass through, the threading pipe 204 is of a 90-degree elbow structure, the threading pipe 204 is sleeved in the liquid storage pipe 202 to form an inner and outer sleeve structure, a wire inlet through hole for feeding the electric wire is formed in the pipe wall of the liquid storage pipe 202, an upper end pipe orifice of the threading pipe 204 is in sealed welding connection with the wire inlet through hole in the liquid storage pipe 202, and a lower end pipe orifice of the threading pipe 204 is inserted into the special-shaped through hole and is in sealed welding connection with a bottom hole orifice of the special-shaped through hole;

an upper cavity 205 is formed by a distance left between the inner wall surface of the liquid storage tube 202 and the outer wall surface of the threading tube 204, a lower cavity 206 is formed by a distance left between the inner surface of the special-shaped through hole and the outer wall surface of the threading tube 204, the upper cavity 205 is communicated with the lower cavity 206 to form a liquid storage cavity for storing cooling liquid, a liquid inlet 2031 for feeding liquid into the liquid storage cavity is arranged on the upper circular surface of the bottom disc 203, and a liquid outlet 2021 for discharging liquid from the liquid storage cavity is arranged on the tube wall at the top of the liquid storage tube 202;

the rolling bearing I3 comprises an inner ring I301, an outer ring I302, a rolling body I303 and a retainer I;

the bottom disc 203 is welded and fixed in the inner ring I301 of the rolling bearing I3 in an inserted mode, and the outer diameter surface of the bottom disc 203 is welded and connected with the inner diameter surface of the inner ring I301 so as to form mechanical connection and heat conduction connection between the bottom disc 203 and the inner ring I301;

the rotating base 4 comprises a metal heat conduction pipe 401 and at least 2 metal heat conduction sheets 402, wherein the at least 2 metal heat conduction sheets 402 are uniformly arranged on the outer surface of the pipe wall of the metal heat conduction pipe 401 to form integral connection and heat conduction connection between the metal heat conduction pipe 401 and the metal heat conduction sheets 402;

the motor base 5 comprises a plastic pipe 501 and a plastic flange plate 502, the plastic flange plate 502 is arranged at the top end of the plastic pipe 501, the motor base 5 is sleeved in the metal heat conduction pipe 401 and is positioned below the bottom disc 203, a screw of the bolt 503 penetrates through the plastic flange plate 502 and the bottom disc 203 to form a bolt connection so as to fix the motor base 5 on the lower circular surface of the bottom disc 203, and a pipe cavity of the threading pipe 204 is communicated with a pipe cavity of the plastic pipe 501;

the direct current motor 6 is arranged in the bottom pipe orifice of the plastic pipe 501, the transmission disc 7 is located in the pipe cavity of the metal heat conduction pipe 401 and below the direct current motor 6, a rotating shaft 601 of the direct current motor 6 is inserted and fixed in an axial central through hole of the transmission disc 7, an axial central line of the rotating shaft 601 in the direct current motor 6 is overlapped with an axial central line of the metal heat conduction pipe 401, and an outer diameter surface of the transmission disc 7 is in adhesive connection with an inner surface of the pipe wall of the metal heat conduction pipe 401 so as to be used for driving the metal heat conduction pipe 401 to rotate by the rotation of the rotating shaft 601 of the direct current motor 6;

the metal heat conduction pipe 401 rotates to drive the metal heat conduction sheet 402 to rotate;

the top pipe orifice of the metal heat conduction pipe 401 is welded and sleeved on and fixed to the outer ring I302 of the rolling bearing I3, and the outer diameter surface of the outer ring I302 is welded and connected with the inner surface of the pipe wall of the top pipe orifice of the metal heat conduction pipe 401 so that the metal heat conduction pipe 401 rotates to drive the outer ring I302 to rotate and form heat conduction connection between the outer ring I302 and the metal heat conduction pipe 401;

the semiconductor refrigeration sheet 8 is arranged on the long and wide surface of the metal heat conducting sheet 402, the semiconductor refrigeration sheet 8 is clamped and fixed on the long and wide surface of the metal heat conducting sheet 402 by the clamp so as to be used for driving the semiconductor refrigeration sheet 8 to rotate by the rotation of the metal heat conducting sheet 402, and heat conduction silicone grease is coated between the cold surface of the semiconductor refrigeration sheet 8 and the long and wide surface of the metal heat conducting sheet 402 to form heat conduction connection between the cold surface of the semiconductor refrigeration sheet 8 and the long and wide surface of the metal heat conducting sheet 402;

the outer surface of the tube wall of the metal heat conduction tube 401 is coated with a layer of heat preservation material for heat preservation and heat insulation, and the rest outer surface of the metal heat conduction sheet 402 except the outer surface provided with the semiconductor refrigeration sheet 8 is coated with a layer of heat preservation material for heat preservation and heat insulation;

the second rolling bearing 9 comprises a second inner ring 901, a second outer ring 902, a second rolling body 903 and a second retainer, the second inner ring 901 of the second rolling bearing 9 is fixedly sleeved on the outer surface of the pipe wall of the plastic pipe 501, the outer diameter surface of the second outer ring 902 of the second rolling bearing 9 is in adhesive connection with the inner diameter surface of the first plastic insulating ring 11 through an adhesive, and the outer diameter surface of the first plastic insulating ring 11 is in adhesive connection with the inner surface of the pipe wall of the metal heat conduction pipe 401 through the adhesive so as to drive the second outer ring 902 to rotate through the rotation of the metal heat conduction pipe 401;

the third rolling bearing 10 comprises a third inner ring 1001, a third outer ring 1002, a third rolling body 1003 and a third retainer, the third inner ring 1001 of the third rolling bearing 10 is fixedly sleeved on the outer surface of the pipe wall of the plastic pipe 501, the third rolling bearing 10 is located below the second rolling bearing 9, the outer diameter surface of the third outer ring 1002 of the third rolling bearing 10 is in adhesive connection with the inner diameter surface of the second plastic insulating ring 12 through an adhesive, and the outer diameter surface of the second plastic insulating ring 12 is in adhesive connection with the inner surface of the pipe wall of the metal heat conduction pipe 401 through an adhesive, so that the third outer ring 1002 is driven to rotate by the rotation of the metal heat conduction pipe 401;

the first positive wire 207 and the first negative wire 208 for supplying power to the semiconductor refrigeration piece 8 penetrate through the threading pipe 204 and then enter the pipe cavity of the plastic pipe 501, then the first positive wire 207 penetrates through the pipe wall of the plastic pipe 501 to be electrically connected with the second inner ring 901 of the second rolling bearing 9 so as to supply direct current to the second rolling bearing 9, and then the first negative wire 208 penetrates through the pipe wall of the plastic pipe 501 to be electrically connected with the third inner ring 1001 of the third rolling bearing 10 so as to supply direct current to the third rolling bearing 10;

a radial through hole 1101 for communicating the outer diameter surface and the inner diameter surface of the plastic insulating ring I11 is formed, a positive conductive wire 801 of the semiconductor chilling plate 8 firstly penetrates through the pipe wall of the metal heat conduction pipe 401, then penetrates through the radial through hole 1101 in the plastic insulating ring I11 and is finally electrically connected with the outer ring II 902 of the rolling bearing II 9, and the rotating outer ring II 902 is used as the positive electrode of a direct current power supply to provide direct current for the rotating semiconductor chilling plate 8;

a radial through hole 1201 communicating the outer diameter surface and the inner diameter surface of the plastic insulating ring II 12 is formed in the plastic insulating ring II 12, a negative electrode conducting wire 802 of the semiconductor chilling plate 8 firstly penetrates through the pipe wall of the metal heat conduction pipe 401, then penetrates through the radial through hole 1201 in the plastic insulating ring II 12 and is finally electrically connected with an outer ring III 1002 of the rolling bearing III 10, and the rotating outer ring III 1002 serves as a negative electrode of a direct-current power supply to provide direct current for the rotating semiconductor chilling plate 8;

the four straight lines of the axis around which the outer ring I302 of the rolling bearing I3 rotates, the axis around which the outer ring II 902 of the rolling bearing II 9 rotates, the axis around which the outer ring III 1002 of the rolling bearing III 10 rotates and the axial center line of the rotating shaft 601 of the direct current motor 6 coincide with each other.

In this application, the appearance of threading pipe is L shape, preferred: the threading pipe comprises a horizontal pipe and a vertical pipe, wherein the horizontal pipe is connected with a top pipe opening of the vertical pipe in a sealing and welding manner to form a 90-degree elbow, the horizontal pipe is connected with a right pipe opening of the vertical pipe in a sealing and welding manner to an inlet wire through hole on the liquid storage pipe, and the vertical pipe is inserted into the special-shaped through hole and is connected with a bottom hole opening of the special-shaped through hole in a sealing and welding manner.

The heat transfer process of an object is divided into three basic heat transfer modes, namely: thermal conduction, convection and radiation; in most cases, the heat transfer efficiency of thermal convection > the heat transfer efficiency of thermal conduction > the heat transfer efficiency of thermal radiation, in comparison with the heat transfer efficiency. For example: the heat transfer process of the dividing wall type heat exchange is as follows: hot fluid transfers heat to the left side of the solid wall (convective heat transfer), then heat from the left side of the wall to the right side of the wall (conductive heat transfer), then heat from the right side of the wall to the cold fluid (convective heat transfer).

In this application, unable adjustment base 2 is weld forming, is sealing welded connection between roof 201 and the stock solution pipe 202, be sealing welded connection between stock solution pipe 202 and the end disc 203, sealing welding is in order to prevent stock solution cavity weeping.

In the application, the connection between the metal heat conduction pipe 401 and the metal heat conduction sheet 402 in the rotating base 4 is an integrated connection, but not a welded connection, so as to prevent poor heat conduction existing in the welded connection between the metal heat conduction pipe 401 and the metal heat conduction sheet 402; the metal heat conduction pipe 401 and the metal heat conduction sheet 402 may be integrally cast, and the metal heat conduction pipe 401 and the metal heat conduction sheet 402 are simultaneously cast; or casting an aluminum alloy rod, then hot-extruding the metal heat conduction pipe 401 and the metal heat conduction sheet 402 thereon simultaneously by hot extrusion molding, and then cutting into small sections to obtain the rotating base 4.

The brazing process comprises the following steps: when the workpiece and the brazing filler metal are heated to a temperature slightly higher than the melting point of the brazing filler metal, the brazing filler metal is melted (the workpiece is not melted), and is sucked into and filled in gaps among the solid workpieces by virtue of capillary action, the liquid brazing filler metal and the workpiece metal are mutually diffused and dissolved, and a brazed joint is formed after condensation. Brazing is divided into soldering and brazing according to different melting points of brazing filler metals; 1) soldering: the melting point of the solder for soldering is lower than 450 ℃, and the joint strength is lower (less than 70 MPa); 2) brazing: the brazing filler metal of brazing has a melting point higher than 450 ℃ and a joint strength higher than 200 MPa.

In the application, the bottom disc 203 is welded, inserted and fixed in the inner ring I301 of the rolling bearing I3, the outer diameter surface of the bottom disc 203 is welded and connected with the inner diameter surface of the inner ring I301 to form mechanical connection and heat conduction connection between the bottom disc 203 and the inner ring I301, the bottom disc 2 and the inner ring I301 are welded and connected together by welding, the welding connection can conduct heat, and is a simple, practical and efficient connection mode, and the connection strength is also sufficient; the base disc and the inner ring one 301 are preferably welded and connected together by brazing, and the brazing is more preferably adopted because the joint strength between the inner ring one 301 and the base disc 203 can be improved, most importantly, because a tiny gap which can not be seen by naked eyes is formed between the inner diameter surface of the inner ring one 301 and the outer diameter surface of the base disc 203, the gap can cause poor heat conduction, after the brazing is adopted, the melted brazing filler metal can be sucked into and filled in the gap by virtue of capillary action, the liquid brazing filler metal is mutually diffused and dissolved with the inner ring one 301 and the base disc 203, namely, the gap is filled by solidification of the liquid brazing filler metal, so that the heat conduction strength between the inner ring one 301 and the base disc 203 is remarkably improved, and the poor heat conduction caused by the gap which can not be seen by naked eyes between the inner ring one 301 and the base disc 203 is avoided.

In the application, a top pipe orifice of the metal heat conduction pipe 401 is welded and sleeved on and fixed to a first outer ring 302 of the first rolling bearing 3, and an outer diameter surface of the first outer ring 302 is welded and connected with an inner surface of a pipe wall of the top pipe orifice of the metal heat conduction pipe 401, so that the metal heat conduction pipe 401 rotates to drive the first outer ring 302 to rotate and form heat conduction connection between the first outer ring 302 and the metal heat conduction pipe 401; the welding connection can conduct heat, is a simple, practical and efficient connection mode, and has enough connection strength; the welding is preferably brazing, and more preferably brazing, where the brazing is performed because the connection strength between the outer ring one 302 and the metal heat conducting pipe 401 can be improved, and most importantly, because a small gap which is hardly visible to the naked eye is formed between the outer diameter surface of the outer ring one 302 and the inner diameter surface of the metal heat conducting pipe 401, and the gap causes poor heat conduction, and after the brazing is performed, the melted brazing filler metal is absorbed into and fills the gap by virtue of capillary action, and the liquid brazing filler metal is mutually dissolved and diffused with the outer ring one 302 and the metal heat conducting pipe 401, that is, the gap is filled with a solidified substance of the liquid brazing filler metal, so that the heat conduction strength between the outer ring one 302 and the metal heat conducting pipe 401 is remarkably improved, and the poor heat conduction caused by the gap which is hardly visible to the naked eye between the outer ring one 302 and the metal heat conducting pipe.

In this application, motor cabinet 5 includes plastic tubing 501 and plastic flange 502, plastic flange 502 set up in plastic tubing 501's top, motor cabinet 5 is plastic molding's integral type structure, and plastic tubing 501 is connected with plastic flange 502 is plastic molding's integral type.

In this application, semiconductor refrigeration piece 8 set up in metal conducting strip 402 in rotating base 4's length width is on the surface, because metal conducting strip 402 has two length width surfaces, consequently, preferred two length width surfaces of metal conducting strip 402 are equallyd divide on the surface and do not are provided with a semiconductor refrigeration piece 8, set up 2 semiconductor refrigeration pieces 8 on a metal conducting strip 402 promptly.

In this application, the cold insulation of the cold side of the semiconductor chilling plate 8, the cold insulation of the metal heat conducting plate 402 and the cold insulation of the metal heat conducting pipe 401 are the same as the cold insulation of the refrigerator by filling a large amount of hard foam polyurethane heat insulating materials in the interlayer in the shell of the refrigerator, which is a problem that important attention needs to be paid to, because the semiconductor chilling plate 8, the metal heat conducting plate 402 and the metal heat conducting pipe 401 are all rotary, if the three are in direct contact with air in the rotary process, heat convection heat transfer can be performed with the air, the cold made by consuming electric energy is heated by the air again, the cold is dissipated in the air, like opening the door when the refrigerator is refrigerating, and the cold generated by the semiconductor chilling plate 8 is wasted in vain. In order to avoid the situation, the outer surface of the pipe wall of the metal heat conduction pipe is coated with a layer of heat preservation material (the thickness of the heat preservation material is 2mm-5mm) for heat preservation and heat insulation, the rest outer surface of the metal heat conduction sheet except the outer surface provided with the semiconductor refrigeration sheet is coated with a layer of heat preservation material (the thickness of the heat preservation material is 1 mm-3 mm larger than that of the semiconductor refrigeration sheet 8), the long thick surface and the wide thick surface of the semiconductor refrigeration sheet 8 are sleeved and coated with the heat preservation material on the metal heat conduction sheet 402 for heat preservation and heat insulation of the semiconductor refrigeration sheet 8, and the heat preservation material is like a large amount of hard foam polyurethane heat preservation material filled in a refrigerator for cold preservation.

In this application, with the insulation material cladding metal heat pipe 401's whole pipe wall surface, with the insulation material cladding metal conducting strip 402 except that setting up semiconductor refrigeration piece 8's surface all remain the surface (including long wide surface, long thick surface and wide thick surface) to avoid this metal heat pipe 401 and metal conducting strip 402's surface to expose and take place the heat convection with the air, extravagant cold volume that semiconductor refrigeration piece 8's cold side made.

In the application, the inner ring II 901 of the rolling bearing II 9 is sleeved and fixed on the outer surface of the pipe wall of the plastic pipe 501 through an adhesive, the outer diameter surface of the outer ring II 902 of the rolling bearing II 9 is in adhesive connection with the inner diameter surface of the plastic insulating ring I11 through the adhesive, and the outer diameter surface of the plastic insulating ring I11 is in adhesive connection with the inner surface of the pipe wall of the metal heat conduction pipe 401 through the adhesive, so that the metal heat conduction pipe 401 rotates to drive the outer ring II 902 to rotate; preferably, the adhesive bonding of the adhesive is hot melt adhesive bonding realized by hot melting a hot melt adhesive rod by a hot melt adhesive gun.

In the application, the inner ring III 1001 of the rolling bearing III 10 is sleeved and fixed on the outer surface of the pipe wall of the plastic pipe 501 through an adhesive, the rolling bearing III 10 is located below the rolling bearing II 9, the outer diameter surface of the outer ring III 1002 of the rolling bearing III 10 is in adhesive connection with the inner diameter surface of the plastic insulating ring II 12 through the adhesive, and the outer diameter surface of the plastic insulating ring II 12 is in adhesive connection with the inner surface of the pipe wall of the metal heat conduction pipe 401 through the adhesive, so that the metal heat conduction pipe 401 rotates to drive the outer ring III 1002 to rotate; preferably, the adhesive bonding of the adhesive is hot melt adhesive bonding realized by hot melting a hot melt adhesive rod by a hot melt adhesive gun.

In the present application, the inner ring one 301 of the rolling bearing one 3 made of metal material is fixed and does not rotate but the outer ring one 302 rotates, and the rolling bearing one 3 functions as: one is for supporting the rotation of the rotating base 4 and the metal heat conduction pipe 401, although the metal heat conduction pipe 401 is powered by the dc motor 6 to rotate, there is a support of the outer ring one 302 in the rolling bearing one 3, the stability of the rotation of the rotating base 4 and the metal heat conducting pipe 401 can be improved, and the second is used for heat conduction and used as a bridge for heat transfer, firstly, the heat on the bottom disc is conducted to the first inner ring 301, then the heat on the inner ring I301 is conducted to the rolling bodies I303 in the rolling bearing I3, then, the heat of the first rolling element 303 is conducted to the first outer ring 302, and then the heat of the first outer ring 302 is conducted to the metal heat conduction pipe 401, thus transferring the heat on the bottom disk to the metal heat conduction pipe 401 through the rolling bearing-3 bridge, then, the heat on the metal heat conduction pipe 401 is transferred to the metal heat conduction sheet 402, and then the heat on the metal heat conduction sheet 402 is transferred to the cold surface of the semiconductor refrigeration sheet 8.

In the present application, the second inner ring 901 of the second rolling bearing 9 made of a metal material is fixed and does not rotate, but the second outer ring 902 of the second rolling bearing 9 rotates, and the second rolling bearing 9 acts as: serving as a positive electrode for supplying power in a rotating manner, first, a direct current power supply supplies direct current to the inner ring two 901 through the positive electrode wire one 207, since the second rolling bearing 9 is made of metal material and can conduct electricity, then the direct current on the second inner ring 901 is transmitted to the second rolling element 903, then the direct current on the second rolling element 903 is transmitted to the second outer ring 902, then the second outer ring 902 is in rigid transmission connection with the metal heat conduction pipe 401 through the first plastic insulation ring 11, the rotating speed of the second outer ring 902 is the same as that of the metal heat conduction pipe 401, the second outer ring 902 and the metal heat conduction pipe 401 are in a relative synchronous static state, the rotating speed of the second outer ring 902 is the same as that of the semiconductor chilling plate 8, the second outer ring 902 and the semiconductor chilling plate 8 are in a relative synchronous static state, and the second outer ring 902 rotates and conducts electricity to the rotating semiconductor chilling plate 8 through the positive electrode conducting wire 801.

In the present application, the inner ring three 1001 of the rolling bearing three 10 made of a metal material is fixed against rotation but the outer ring three 1002 rotates, and the rolling bearing three 10 functions as: serving as a negative electrode for supplying power in rotation, first a dc power source supplies dc power to the inner ring three 1001 through the negative electrode wire one 208, since the rolling bearing three 10 is made of metal material and is conductive, the direct current on the inner ring three 1001 is transmitted to the rolling bearing three 1003, then the direct current on the rolling body III 1003 is transmitted to the outer ring III 1002, the outer ring III 1002 is in rigid transmission connection with the metal heat conduction pipe 401 through the plastic insulation ring II 12, the rotating speed of the outer ring III 1002 is the same as that of the metal heat conduction pipe 401, the outer ring III 1002 and the metal heat conduction pipe 401 are in a relative synchronous static state, and the rotating speed of the outer ring three 1002 is the same as that of the semiconductor chilling plate 8, the outer ring three 1002 and the semiconductor chilling plate 8 are in a relative synchronous static state, and the outer ring three 1002 rotates and conducts electricity to the rotating semiconductor chilling plate 8 through the negative electrode conducting wire 802.

In this application, the above-mentioned axis refers to a straight line around which an object or a three-dimensional figure rotates or around which it can be assumed that the rotation is imaginary.

In this application, dc motor 6 set up in the base pipe mouth of plastic tubing 501 in motor cabinet 5, indicate dc motor 6's shell or main part set up in the base pipe mouth of plastic tubing 501 in motor cabinet 5, and the preferred carries out adhesive fixation through the adhesive, dc motor 6's shell is fixed in through the adhesive in the base pipe mouth of plastic tubing 501 in motor cabinet 5, preferably, the adhesive connection of the adhesive here is the hot melt adhesive bonding that the hot melt adhesive stick hot melt realized later for the hot melt adhesive rifle.

In the present application, the rotating shaft 601 of the dc motor 6 is inserted and fixed (preferably, adhesively connected) in the axial central through hole of the transmission disc 7, and the outer diameter surface of the transmission disc 7 is adhesively connected with the inner surface of the tube wall of the metal heat conducting tube 401; preferably, the adhesive connection is a hot-melt adhesive connection which is realized after the hot-melt gun melts the hot-melt adhesive rod. The transmission disc 7 is in a shape of a flat circular plate and made of hard plastic, an axial center through hole for inserting and fixing a rotating shaft 601 of the direct current motor 6 is formed in the axial center of the transmission disc 7, the transmission disc 7 is mainly used for transmission, torque generated by the direct current motor 6 is transmitted to the metal heat conduction pipe 401, and the rotating shaft of the direct current motor 6 rotates to drive the rotating base 4 to rotate; the transmission plate 7 is made of hard plastic, which is mainly non-heat-conductive and can block heat conduction between the metal heat-conductive pipe 401 and the rotating shaft 601 of the dc motor 6.

In this application, since the plastic pipe 501 and the plastic flange 502 are made of hard plastic, the plastic pipe 501 and the plastic flange 502 do not conduct heat, so that heat on the bottom disk 203 cannot be transferred to the dc motor 6 through the plastic flange 502 and the plastic pipe 501, and then transferred to the metal heat conducting pipe 401 by the dc motor 6, and therefore heat on the bottom disk 203 can only be transferred to the metal heat conducting pipe 401 and the metal heat conducting fin 402 through the rolling bearing one 3.

In this application, the first plastic insulating ring 11 and the second plastic insulating ring 12 are made of plastic, so that the two rings are neither heat conducting nor conducting.

The preferred rubber and plastic heat preservation cotton that is of insulation material in this application, rubber and plastic heat preservation cotton are a neotype heat preservation thermal insulation material, use butadiene-acrylonitrile rubber and polyvinyl chloride as the main material, through banburying, special technologies such as vulcanization foaming make, have low density, closed bubble mechanism, resistant inflection, coefficient of heat conductivity is low, the steam transmissivity is low, characteristics such as water absorption rate are low, compliance and elasticity, construction convenience, green, coefficient of heat conductivity (average temperature is 0 ℃) is less than or equal to 0.034W/(m K), for example: the outer surface of a copper pipe for connecting an indoor unit and an outdoor unit of the air conditioner is sleeved with a rubber and plastic heat preservation pipe. A rectangular through hole for embedding the semiconductor refrigerating sheet 8 is cut in the rubber and plastic heat-insulating cotton in advance, and the semiconductor refrigerating sheet 8 is placed in the rectangular through hole in the rubber and plastic heat-insulating cotton after the rubber and plastic heat-insulating cotton on the metal heat-conducting sheet 402 is well adhered. The rubber and plastic heat insulation cotton is mostly of a single-sided adhesive type, one side of the rubber and plastic heat insulation cotton is provided with an adhesive, the other side of the rubber and plastic heat insulation cotton is provided with no adhesive, and the layer of paper on the adhesive side is torn off, so that the rubber and plastic heat insulation cotton can be directly pasted for use.

The power of the semiconductor refrigerating sheet is power consumption, not refrigerating capacity, and the refrigerating efficiency of the existing semiconductor refrigerating sheet is about 60%, namely the energy efficiency ratio is about 0.6, and is very low (the heat pump of a compressor is at least more than 2.0). Taking 100 watts as an example: the refrigerating sheet of 100 watts can generally generate about 60 watts of refrigerating capacity (about 60 joules of heat can be absorbed from the cold surface per second), while the heat generated by the hot surface is very large, except the heat generated by 100 watts of power consumption, about 60 watts of heat absorbed from the cold surface is also generated, and the heat generated by the hot surface and the heat absorbed by the cold surface are about 160 watts in total, so that the temperature difference of the cold surface and the hot surface is very different.

In an embodiment of the present application, the metal heat conducting fins 402 are planar sheets, the long and wide surfaces of the metal heat conducting fins 402 are parallel to the axial center line of the metal heat conducting pipe 401, the outer surface of the pipe wall of the metal heat conducting pipe 401 is integrally connected to one of the thicknesses of the metal heat conducting fins 402 in a side direction, and a gap is left between two adjacent metal heat conducting fins 402 to form an air duct for passing cooling air therethrough.

In one embodiment of the present application, each of the metal heat conduction plates 402 is provided with a semiconductor cooling plate 8 on each of the long and wide surfaces.

In one embodiment of the present application, the rotating base 4 comprises 2 pieces of metal heat-conducting fins 402;

the device for cooling liquid by adopting the semiconductor refrigeration pieces comprises 4 semiconductor refrigeration pieces 8, 1 semiconductor refrigeration piece 8 is respectively arranged on two long and wide surfaces of each metal heat-conducting piece 402, and the 4 semiconductor refrigeration pieces 8 are in one-to-one correspondence with the 2 metal heat-conducting pieces 402.

In one embodiment of the present application, the rotating base 4 comprises 3 pieces of metal heat-conducting fins 402;

the device for cooling liquid by adopting the semiconductor refrigeration pieces comprises 6 semiconductor refrigeration pieces 8, 1 semiconductor refrigeration piece 8 is respectively arranged on two long and wide surfaces of each metal heat conduction piece 402, and the 6 semiconductor refrigeration pieces 8 are in one-to-one correspondence with the 3 metal heat conduction pieces 402.

In one embodiment of the present application, the rotating base 4 comprises 4 pieces of metal heat-conducting fins 402;

the device for cooling liquid by using the semiconductor chilling plates comprises 8 semiconductor chilling plates 8, wherein 1 semiconductor chilling plate 8 is arranged on each of two long and wide surfaces of each metal heat-conducting plate 402, and the 8 semiconductor chilling plates 8 correspond to the 4 metal heat-conducting plates 402 one by one.

In one embodiment of the present application, the clamp includes an aluminum bar a1301, an aluminum bar B1302, an upper plastic bolt 1303, and a lower plastic bolt 1304;

bolt through holes are respectively formed in the two ends of the aluminum strip A1301 in the length direction, and bolt through holes are respectively formed in the two ends of the aluminum strip B1302 in the length direction;

the two length and width surfaces of the metal heat conducting strip 402 are a length and width surface a and a length and width surface B, respectively;

the semiconductor refrigeration piece 8 on the long and wide surface A is clamped between the long and wide surface A and the inner long and wide surface of the aluminum strip A1301, and the hot surface of the semiconductor refrigeration piece 8 on the long and wide surface A is in close contact with the inner long and wide surface of the aluminum strip A1301;

the semiconductor refrigerating sheet 8 on the long and wide surface B is clamped between the long and wide surface B and the inner long and wide surface of the aluminum strip B1302, and the hot surface of the semiconductor refrigerating sheet 8 on the long and wide surface B is in close contact with the inner long and wide surface of the aluminum strip B1302;

the screw of the upper plastic bolt 1303 penetrates through the bolt through hole at the upper end of the aluminum strip A1301, the heat insulating material on the long and wide surface A, the metal heat conducting strip 402, the heat insulating material on the long and wide surface B and the bolt through hole at the upper end of the aluminum strip B1302 in sequence, the screw of the lower plastic bolt 1304 penetrates through the bolt through hole at the lower end of the aluminum strip A1301, the heat insulation material on the long and wide surface A, the metal heat conducting fin 402, the heat insulation material on the long and wide surface B and the bolt through hole at the lower end of the aluminum strip B1302 in sequence, the aluminum strip A1301, the aluminum strip B1302, the upper plastic bolt 1303 and the lower plastic bolt 1304 are connected end to form a rectangular frame, so that the upper end of the aluminum strip A1301 is connected with the upper end of the aluminum strip B1302 through a bolt, the lower end of the aluminum strip A1301 is connected with the lower end of the aluminum strip B1302 through a bolt, the semiconductor chilling plate 8 is clamped and fixed on the metal heat conducting plate 402 by screwing the upper plastic bolt and the lower plastic bolt to enable the aluminum strips A1301 and B1302 to be clamped and fixed.

In this application, aluminium strip A and aluminium strip B are wide 10mm x thick 4 mm's cuboid shape, and length can be long or short according to actual need, and length is long 30mm ~ 60mm, is the aluminum alloy material.

In this application, choose for use plastic bolt 1303 and lower plastic bolt 1304 to be the duroplastic material, mainly because the duroplastic material is not heat-conducting, avoids taking place heat-conduction through last plastic bolt 1303 and lower plastic bolt 1304.

In one embodiment of the present application, the rotating base 4 is made of an aluminum alloy, copper or copper alloy material, and the metal heat conducting pipe 401 and the metal heat conducting fin 402 are both made of an aluminum alloy, copper or copper alloy material;

the top plate 201 is made of aluminum alloy, copper or copper alloy material;

the liquid storage pipe 202 is made of aluminum alloy, copper or copper alloy material;

the bottom disc 203 is made of aluminum alloy, copper or copper alloy material;

the threading pipe 204 is made of aluminum alloy, copper or copper alloy material.

In one embodiment of the present application, the rolling bearing one 3 is a cylindrical roller bearing, and the inner ring one 301, the outer ring one 302 and the rolling body one 303 in the rolling bearing one 3 are all made of aluminum alloy, copper alloy or steel material;

the second rolling bearing 9 and the third rolling bearing 10 are ball bearings (also called ball bearings), and the second inner ring 901, the second outer ring 902, the second rolling element 903, the third inner ring 1001, the third outer ring 1002 and the third rolling element 1003 are all made of aluminum alloy, copper alloy or steel materials;

here, the rolling bearing one 3 is selected to be a cylindrical roller bearing, mainly because the rolling elements of the cylindrical roller bearing are cylindrical, and compared with a ball bearing, a needle bearing, a tapered roller bearing, and the like, the contact area between the cylindrical rolling element one 303 and the inner ring one 301 and the outer ring one 302 is larger, that is, the heat conduction area is larger, so that the heat transfer efficiency of the heat conduction from the inner ring one 301 to the outer ring one 302 can be improved;

here, the inner ring one 301, the outer ring one 302 and the rolling element one 303 in the rolling bearing one 3 are all made of aluminum alloy, and the inner ring two 901, the outer ring two 902, the rolling element two 903, the inner ring three 1001, the outer ring three 1002 and the rolling element three 1003 are all made of aluminum alloy, and the rolling bearing is actually divided into a ceramic bearing, a plastic bearing, a steel bearing and the like according to the materials, and since the rolling bearing can be made of ceramic materials and also can be made of plastic materials, it is not difficult to make the rolling bearing by using aluminum alloy materials; in view of the special requirements of the application, a batch of rolling bearings made of aluminum alloy materials can be specially customized and processed.

In one embodiment of the present application, the second positive wire and the second negative wire for supplying power to the dc motor 6 pass through the threading tube 204 and then enter the lumen of the plastic tube 501, and then the second positive wire and the second negative wire pass downward through the plastic tube 501 and finally are electrically connected to the positive electrode and the negative electrode of the dc motor 6, respectively;

the semiconductor refrigeration piece 8 is electrically connected with a direct current power supply, the direct current motor 6 is electrically connected with the direct current power supply, and the semiconductor refrigeration piece 8 is electrically connected with the direct current motor 6 in parallel.

In one embodiment of the present application, the top plate 201 is provided with a bolt through hole for inserting a fastening bolt to fix the top plate 201; the top plate is preferably fixedly mounted on the wall of the host case through a bolt connection of a fastening bolt; preferably, the outer surface of the top plate is coated with a layer of heat preservation material for heat preservation and heat insulation, the outer surface of the pipe wall of the liquid storage pipe is coated with a layer of heat preservation material for heat preservation and heat insulation, the outer surface of the bottom disc is coated with a layer of heat preservation material for heat preservation and heat insulation, the outer surface of the top plate exposed outside is coated with the heat preservation material, the outer surface of the liquid storage pipe exposed outside is coated with the heat preservation material, and the outer surfaces of the top plate, the liquid storage pipe and the bottom disc are prevented from being exposed and conducting heat with air, so that the cold quantity prepared by the cold surface of the semiconductor refrigerating sheet 8 is avoided.

The application also provides a liquid cooling CPU radiator, which comprises a water cooling head 14, a cooling liquid circulating pump 15, a plastic hose 16 and any one of the devices for cooling liquid by using the semiconductor refrigeration sheet;

a liquid inlet of the cooling liquid circulating pump 15 is communicated with a liquid outlet 2021 on the liquid storage pipe 202 through a plastic hose 16, a liquid outlet of the cooling liquid circulating pump 15 is communicated with a liquid inlet 1401 of the water-cooling head 14 through the plastic hose 16, and a liquid outlet 1402 of the water-cooling head 14 is communicated with a liquid inlet 2031 on the bottom disc 203 through the plastic hose 16, so as to form a circulating flow loop of the cooling liquid.

In this application, the water-cooling head install the mounting means on the mainboard for prior art, and the mechanical connection mode between water-cooling head and the CPU is prior art with heat-conduction connected mode, and this place is no longer repeated.

The application obtains the following beneficial technical effects:

1) firstly, the liquid cooling and the semiconductor refrigeration are combined to dissipate heat of electronic devices such as a CPU and mechanical devices such as a motorcycle engine, and the like, so that the heat dissipation effect and the heat dissipation efficiency are improved, and the technical problem in the background art is solved;

here, taking a liquid-cooled CPU radiator as an example, the whole heat dissipation process of a liquid-cooled CPU radiator including a device that uses a semiconductor cooling fin to cool liquid provided by the present application is: the heat generated by the work of the CPU → the cooling liquid in the water cooling head absorbs the heat to raise the temperature, then the cooling liquid after absorbing the heat to raise the temperature flows into the liquid storage cavity → the heat of the cooling liquid in the liquid storage cavity is transferred to the bottom disc in the fixed base, the heat on the bottom disc → the inner ring one 301 → the rolling body one 303 → the outer ring one 302 → the metal heat conducting pipe 401 → the metal heat conducting plate 402 → the cold surface of the semiconductor cooling plate 8 → the hot surface of the semiconductor cooling plate 8 → the cooling air generated by the rotation of the rotating base 4 (mainly the rotation of the metal heat conducting plate 402), and the heat generated by the work of the CPU is transferred to the air by one step and the other step, thereby obtaining.

2) Semiconductor refrigeration piece 8 has two length wide surfaces, and a length wide surface (cold side) is used for the refrigeration, and another length wide surface (hot side) is used for the heat dissipation, and in fact, to realizing that semiconductor refrigeration piece 8's long-time normal work does not damage, guarantee that the good of semiconductor refrigeration piece 8's hot side, fully, enough dispel the heat is first order, guarantee on the contrary that the good refrigeration of semiconductor refrigeration piece 8's cold side is second order.

In view of the refrigeration principle of the semiconductor refrigeration piece 8, the heat of the hot surface of the semiconductor refrigeration piece 8 must be actively and fully radiated, so that the whole semiconductor refrigeration piece 8 is prevented from being burned out due to overheating of the hot surface.

Therefore, in the prior art, generally, the heat radiating fins are arranged on the hot surface of the semiconductor chilling plate 8, then the heat radiating fan is arranged on the heat radiating fins, because the hot surface of the semiconductor chilling plate 8 is in direct contact with the heat radiating fins, the heat on the hot surface of the semiconductor chilling plate 8 is transferred to the heat radiating fins, the heat radiating fan rotates to generate cooling air, the cooling air passes through the surface of the heat radiating fins, and the heat on the hot surface of the semiconductor chilling plate 8 is finally taken away by the cooling air generated by the heat radiating fan, so that the heat radiation of the hot surface of the semiconductor chilling plate 8 is realized.

Above-mentioned, the heat dissipation to the hot side of semiconductor refrigeration piece 8 is the heat convection formula heat dissipation that the air flows through heat radiation fins, and semiconductor refrigeration piece 8 is the rigid among the prior art, and heat radiation fins is also the rigid, and sets up an axial fan simultaneously and carries out convulsions to heat radiation fins for the air flows to get up and passes through from heat radiation fins's surface, takes place heat convection formula heat dissipation, so mainly has following 4 defects: (1) the volume of the semiconductor refrigeration piece 8 is very small, the thickness is 3 mm-5mm, for example, the length is 40mm × the width is 40mm × the thickness is 3.5mm, but compared with the volume of the semiconductor refrigeration piece 8, the volume of the heat dissipation fin and the heat dissipation fan is too large, the sum of the volumes of the heat dissipation fin and the heat dissipation fan is dozens or even hundreds of times of the volume of the semiconductor refrigeration piece 8, the proportion of the volumes is very inconsistent, and the volume is too large, and the larger the refrigeration capacity of the semiconductor refrigeration piece 8 is, the larger the heat dissipation capacity of the matched heat dissipation fin and the heat dissipation fan is, the larger the sum of the volumes of the matched heat dissipation fin and the heat dissipation fan is, which corresponds to the technical problem that the refrigeration capacity of the semiconductor refrigeration assembly in the prior art is enough but the volume is too large or the volume can be put into but the refrigeration capacity is not enough when being: for example, a semiconductor cooling plate 8 with 60W cooling capacity is required for a CPU to radiate heat well and sufficiently, but the volume of a 160W heat dissipation fin and a heat dissipation fan is too large to be placed in a host case of a computer, so that there is not enough space for installation, so at this time, the sum of the volume of the heat dissipation fin and the heat dissipation fan is controlled, and a heat dissipation fin and a heat dissipation fan which are small in volume and can be placed in the host case of the computer are selected, for example, an 80W heat dissipation fin and a heat dissipation fan are selected, and then a semiconductor cooling plate 8 which is matched with the heat dissipation fin and the heat dissipation fan is selected, for example, a 30W cooling semiconductor cooling plate 8 is selected, and it is obvious that the 30W cooling semiconductor cooling plate 8 is not enough to radiate heat well and sufficiently for the CPU, but there is no method, firstly, the volume is allowed to be put into a host case of a computer, and if the volume is too large, the refrigerating capacity cannot be put into the host case, and the refrigerating capacity is enough;

(2) the heat really needs to be dissipated by the hot surface of the semiconductor refrigerating sheet 8, but the cooling air directly blows the heat dissipating fins, the cooling air does not directly blow the hot surface of the semiconductor refrigerating sheet 8, the heat dissipating fins are separated between the cooling air and the hot surface of the semiconductor refrigerating sheet 8, like a first-level medium is separated between a buyer and a seller, the price difference is earned by an intermediary, the first-level thermal resistance is increased by increasing the first-level medium in the middle of the heat transfer process, the total heat transfer efficiency is reduced, and the heat dissipating effect and the heat dissipating efficiency of the hot surface of the semiconductor refrigerating sheet 8 are reduced;

(3) cooling air (air) only lightly sweeps over the surfaces of the heat dissipation fins, and the convection strength is low, so that the heat dissipation effect and the heat dissipation efficiency are low;

(4) the heat dissipation fins in the prior art are always in a passive state with equal wind, the amount of the wind is not controlled, the heat dissipation fins are always in an equal, reliable and necessary passive state with the initiative in the heat dissipation fan, the heat dissipation fins are not actively struggled not to actively knock out the heat dissipation fins, the heat dissipation fins wait for the wind quietly, and like people do nothing in life, the passive attitude such as the passive attitude and the necessary attitude can cause passive idling, low efficiency and difficult success, and the heat dissipation effect and the heat dissipation efficiency of the hot surface of the semiconductor refrigeration sheet 8 are also lower.

Therefore, how to improve the heat dissipation effect and the heat dissipation efficiency of the hot surface of the semiconductor cooling plate 8 is a technical problem that needs to be solved urgently by those skilled in the art.

Therefore, the application creatively provides a novel heat dissipation mode of the hot surface of the semiconductor refrigeration sheet 8: the semiconductor refrigeration piece is fixed on the rotary metal heat conduction piece, the method is similar to the method that wet clothes are directly tied on the rotating blades in the fan blades of a ceiling fan, the hot surface of the semiconductor refrigeration piece 8 is directly exposed, the hot surface of the semiconductor refrigeration piece 8 is not covered by any object except aluminum strips, the hot surface of the semiconductor refrigeration piece 8 is directly exposed in the atmosphere and directly contacted with air, and the semiconductor refrigeration piece 8 rotates to be like the method that the semiconductor refrigeration piece is tied and fixed on the rotating blades in the ceiling fan to rotate together, the rotating semiconductor refrigeration piece 8 has kinetic energy and can do work on the air, the hot surface of the rotating semiconductor refrigeration piece 8 can extrude, cut, rub and stir the air, so that the hot surface of the semiconductor refrigeration piece 8 directly conducts heat with the air in a heat convection mode, and the heat on the hot surface of the semiconductor refrigeration piece 8 is transferred to the air, then the heat is taken away by the air, so that the working principle of radiating the hot surface of the semiconductor refrigeration piece 8 in the application is realized, and the application realizes good and sufficient heat radiation of the hot surface of the semiconductor refrigeration piece 8.

The application adopts the novel heat radiation mode of the hot surface of the semiconductor refrigerating sheet 8 to obtain the following beneficial technical effects:

(a) after the novel heat dissipation mode of the hot surface of the semiconductor refrigeration piece 8 is adopted, a large-size heat dissipation fin and a heat dissipation fan do not need to be arranged on the hot surface of the semiconductor refrigeration piece 8, and the refrigeration function and the heat dissipation function can be realized only by one thin semiconductor refrigeration piece 8, so that the volume of the refrigeration assembly is remarkably reduced, the refrigeration assembly is favorable for being installed and used in a narrow space, and the technical problems that the refrigeration amount of the semiconductor refrigeration assembly in the prior art is enough but the volume is too large and cannot be put into the refrigeration assembly or the volume can be put into the refrigeration assembly but the refrigeration amount is not enough are solved;

(b) the hot surface of the semiconductor refrigeration piece 8 is directly exposed in the atmosphere and is directly contacted with the air, and the semiconductor refrigeration piece 8 is rotated, so that the hot surface of the semiconductor refrigeration piece 8 can directly generate heat convection type heat transfer with the air, a heat transfer medium such as a heat dissipation fin is not arranged between the hot surface of the semiconductor refrigeration piece 8 and the air, and a thermal resistance generated by the medium is not arranged, so that the heat dissipation effect and the heat dissipation efficiency of the hot surface of the semiconductor refrigeration piece 8 are improved;

(c) the application leads the hot surface of the semiconductor refrigeration piece 8 to be directly exposed in the atmosphere and directly contacted with the air, and leads the semiconductor refrigeration piece 8 to rotate, just like binding and fixing the semiconductor refrigeration piece on the rotating blade in the ceiling fan to rotate together, the rotating semiconductor refrigeration piece 8 has kinetic energy and can do work to the air, the hot surface of the rotating semiconductor refrigeration piece 8 can extrude, cut, rub and stir the air, thereby obviously improving the heat convection intensity between the hot surface of the semiconductor refrigeration piece 8 and the air, obviously improving the heat transfer efficiency of the heat transfer on the hot surface of the semiconductor refrigeration piece 8 to the air, therefore, more heat can be transferred to the air in unit time and further taken away by the air, and improving the heat dissipation effect and the heat dissipation efficiency of the hot surface of the semiconductor refrigeration piece 8, the heat dissipation effect and the heat dissipation efficiency of the semiconductor refrigerator are improved finally;

for example, it is all the more true that, if a T-shirt is washed in summer, the washed T-shirt is aired indoors, and the room is naturally ventilated, and the T-shirt is aired completely, the time is generally 10 hours; further, if the washed T-shirt is wrapped with a layer of water-absorbing dry sponge and then placed under an indoor ceiling fan, the wind generated by the ceiling fan blows directly towards the dry sponge, and the wet T-shirt can be dried completely for 5 hours; furthermore, if the washed T-shirt is tightly bound on the blades in the fan blades of the ceiling fan, the wet T-shirt rotates along with the blades of the ceiling fan, and the complete drying may only need 1-2 hours; the principle is convection drying, but the convection intensity is gradually improved, so that the drying time is gradually and obviously reduced;

the semiconductor refrigerating sheet 8 in the application is just like the wet T-shirt which is just washed and has water, and the layer of water-absorbing dry sponge wrapping the wet T-shirt is just like the heat dissipation fins on the hot surface of the semiconductor refrigerating sheet 8 in the prior art;

in the prior art, the semiconductor refrigerating sheet 8 is fixed, the radiating fins are also fixed, and an axial flow fan is arranged to exhaust air to the radiating fins, so that air flows through the surfaces of the radiating fins to generate heat convection type heat dissipation, namely the washed T-shirt is wrapped by a layer of water-absorbing dry sponge and placed right below an indoor ceiling fan, and then the air generated by the ceiling fan is blown directly towards the dry sponge, so that the heat convection intensity is low, and the heat dissipation effect and the heat dissipation efficiency of the hot surface of the semiconductor refrigerating sheet 8 are low;

the semiconductor refrigerating sheet is arranged on the long and wide surface of the metal heat conducting sheet and rotates along with the metal heat conducting sheet, the hot surface of the semiconductor refrigerating sheet 8 is directly exposed in the atmosphere and rotates, the hot surface of the semiconductor refrigerating sheet 8 actively blows out to squeeze air, shear air, friction air and stir air, the washed T-shirt is tightly bound on blades in blades of a ceiling fan, the wet T-shirt rotates along with the blades of the ceiling fan, the heat convection strength is obviously improved, and the heat dissipation effect and the heat dissipation efficiency of the hot surface of the semiconductor refrigerating sheet 8 are obviously improved;

(d) the semiconductor refrigerating sheet 8 is rotated, the hot surface of the semiconductor refrigerating sheet 8 is actively knocked out to extrude air, cut air, friction air and stir air, the active knocking out is used for generating air and capturing air, the active knocking out is used for some reason, the situation is not equal, and is not required, and the heat radiation fan is not required to provide air for the semiconductor refrigerating sheet 8, the wind comes and the amount of the wind comes are controlled by the semiconductor refrigerating sheet 8, the active right is firmly controlled at the semiconductor refrigerating sheet 8, and the active knocking out is actively performed, so that the heat radiation effect and the heat radiation efficiency of the hot surface of the semiconductor refrigerating sheet 8 are obviously improved.

3) In the actual use process of the semiconductor refrigerating sheet 8, when the refrigerating capacity of a single semiconductor refrigerating sheet 8 is larger and cannot meet the actual requirement, a plurality of semiconductor refrigerating sheets 8 are used for refrigerating together.

The semiconductor refrigerating sheet 8 is a plane sheet, so that the semiconductor refrigerating sheet cannot be folded or bent; furthermore, in view of the refrigeration principle of the semiconductor refrigeration sheet 8, in the prior art, a plurality of semiconductor refrigeration sheets 8 are not usually overlapped together for refrigeration, although the overlapping is feasible in principle, the operation is difficult in reality, and the semiconductor refrigeration sheets 8 consume large electric energy and are not paid, so that the significance is not great; therefore, in order to realize the common refrigeration of the plurality of semiconductor refrigeration sheets 8 in the prior art, usually, the plurality of refrigeration assemblies are simply and repeatedly arranged, each refrigeration assembly comprises 1 semiconductor refrigeration sheet 8 and a heat radiation fin and a heat radiation fan which are matched with the semiconductor refrigeration sheet 8, the final assembled finished product has a large volume due to the repeated arrangement, for example, if 4 semiconductor refrigeration sheets 8 are needed for refrigeration, 4 heat radiation fins and 4 heat radiation fans must be matched, the volume is too large, the semiconductor refrigeration sheets 8 cannot be installed in a general installation space, and the popularization and application of the common refrigeration of the plurality of semiconductor refrigeration sheets 8 in the industry are severely limited.

Therefore, how to set several semiconductor refrigeration pieces 8 in a limited crowded installation space in practical application, a plurality of semiconductor refrigeration pieces 8 can refrigerate together, so as to improve the total refrigeration capacity (namely, improve the total refrigeration capacity of all semiconductor refrigeration pieces 8 in a unit volume), or put it another way, on the premise of keeping the total refrigeration capacity sufficient and unchanged, the volume occupied by all semiconductor refrigeration pieces 8 is minimized (the volume occupied by the semiconductor refrigeration pieces 8 is reduced in the unit refrigeration capacity), which is a technical problem that technicians in the field need to solve urgently.

Therefore, the refrigeration mode of the cold surface of the semiconductor refrigeration sheet 8 is changed, a plurality of semiconductor refrigeration sheets 8 can be arranged in the refrigeration device, each metal heat conduction sheet 402 comprises two long and wide surfaces, each long and wide surface of each metal heat conduction sheet 402 is provided with one semiconductor refrigeration sheet 8, namely 2 semiconductor refrigeration sheets 8 are arranged on one metal heat conduction sheet 402, and preferably, the rotating base 4 in the refrigeration device comprises 2-8 metal heat conduction sheets 402, namely, 4-16 semiconductor refrigeration sheets 8 can be arranged at most in the refrigeration device;

in the application, one semiconductor chilling plate 8 rotates around the axial center line of the metal heat conduction pipe 401, so that the semiconductor chilling plate occupies a large volume, 2 semiconductor chilling plates 8 also rotate around the axial center line of the metal heat conduction pipe 401, so that the semiconductor chilling plates occupy a large volume, and the semiconductor chilling plates 8 rotate around the axial center line of the metal heat conduction pipe 401, so that the semiconductor chilling plates occupy a large volume, the volumes occupied by 1 semiconductor chilling plate, 2 semiconductor chilling plates and a plurality of semiconductor chilling plates 8 are not different, and the occupied volume is not increased along with the increase of the number of the semiconductor chilling plates 8;

in the application, as for the number of the finally set semiconductor refrigerating sheets 8 and the refrigerating capacity of each semiconductor refrigerating sheet 8, the number needs to be determined according to the total refrigerating capacity required by the CPU, and the total refrigerating capacity is determined according to the actual needs on site, which is the sum of the refrigerating capacities of all the semiconductor refrigerating sheets 8;

so, this application has solved in crowded limited installation space in practical application, can set up several semiconductor refrigeration pieces 8 more, polylith semiconductor refrigeration piece 8 refrigerates jointly, has improved total refrigerating output (having improved the total refrigerating output of whole semiconductor refrigeration pieces 8 in unit volume promptly), or has traded one to say, keeps under the enough and unchangeable prerequisite of total refrigerating output, has reduced the shared volume of all semiconductor refrigeration pieces 8 (having reduced the shared volume of semiconductor refrigeration piece 8 in unit refrigerating output).

To sum up, in fact, the overall idea of solving the technical problem of the present application is: in the prior art, a method for radiating heat of a CPU by using a semiconductor refrigeration chip 8 is already available, but the prior art has a plurality of technical problems, one of which is as follows: the problem that the semiconductor refrigeration assembly in the prior art has enough refrigeration capacity but too large volume and cannot be put in the semiconductor refrigeration assembly or has enough volume but insufficient refrigeration capacity is caused by the fact that the volume of the semiconductor refrigeration piece 8 is small but the sizes of the matched heat dissipation fins and the heat dissipation fan are too large;

therefore, the heat dissipation mode of the hot surface of the semiconductor refrigeration piece 8 is changed, the heat dissipation fins and the heat dissipation fan are removed, and the refrigeration mode of the cold surface of the semiconductor refrigeration piece 8 is changed on the basis of changing the heat dissipation mode;

thus, the present application solves the problems in the above example as follows: the CPU needs 60W of semiconductor refrigeration sheets 8 for good and sufficient heat dissipation, the requirement is required to be met and cannot be reduced, then 4 semiconductor refrigeration sheets 8 with 15W of refrigeration capacity are selected and 4 semiconductor refrigeration sheets 8 with 15W of refrigeration capacity are respectively arranged on two metal heat conduction sheets 402, 2 semiconductor refrigeration sheets 8 with 15W of refrigeration capacity are arranged on each metal heat conduction sheet 402, the total refrigeration capacity of a refrigeration assembly comprising the 4 semiconductor refrigeration sheets 8 with 15W of refrigeration capacity is enough, the size is small, the refrigeration assembly can be placed into a host case of a computer, the heat dissipation capacity of each semiconductor refrigeration sheet 8 is small (only 15W), the heat dissipation capacity of the hot surface of each semiconductor refrigeration sheet 8 needs about 40W, the heat dissipation capacity of about 40W is small, the hot surface of each semiconductor refrigeration sheet 8 rotates and is in direct contact with air, and the heat dissipation capacity of about 40W can be easily realized, therefore, the technical problems that the refrigerating capacity of the semiconductor refrigerating assembly in the prior art is enough but the volume is overlarge and cannot be put in or the volume can be put in but the refrigerating capacity is not enough are solved.

In this application, this application has changed the radiating mode of the hot side of semiconductor refrigeration piece 8, has torn heat radiation fin and radiator fan down, and whether the heat dissipation capacity of the radiating mode of the hot side of semiconductor refrigeration piece 8 in this application is enough problem, and this application adopts following mode to solve: 1) the rotating speed of the rotating shaft 601 of the direct-current motor is increased, so that the semiconductor chilling plate 8 rotates faster, the heat convection intensity between the hot surface of the semiconductor chilling plate 8 and air is further increased, and the heat dissipation capacity of the hot surface of the semiconductor chilling plate 8 is further increased as the rotating speed of the semiconductor chilling plate 8 is larger, so that the heat dissipation capacity of the hot surface of the semiconductor chilling plate 8 is further increased; 2) in the present application, a maximum of 4-16 semiconductor cooling fins 8 can be provided, the cooling capacity required for good and sufficient heat dissipation of the CPU is constant, the 4-16 semiconductor refrigerating pieces 8 can share the refrigerating capacity, each semiconductor refrigerating piece is divided into a little, therefore, the refrigerating capacity of the cold surface of each semiconductor refrigerating sheet does not need to be too large (between 3 and 20W) after the uniform distribution, and not only does the cold surface of each semiconductor refrigerating sheet need to be too large, therefore, the heat dissipation amount of the hot side of each semiconductor cooling plate does not need to be too large, and if a phenomenon that the heat dissipation amount of the hot side of the semiconductor cooling plate 8 is insufficient occurs, the problem can be solved by adopting a method of further increasing the number of the semiconductor refrigerating pieces so as to further reduce the heat dissipation capacity of each semiconductor refrigerating piece, and the heat dissipation capacity of the smaller heat surface can be easily realized by rotating the heat surface of each semiconductor refrigerating piece 8 and directly contacting with air.

In this application, this application has changed the refrigeration mode of the cold side of semiconductor refrigeration piece 8, and the refrigeration mode about the cold side of semiconductor refrigeration piece 8 in this application whether can cause the problem of dewfall frost condensation, this application adopts following mode to solve: 1) the CPU radiator that this application provided still includes controller and temperature sensor, the controller is equallyd divide do not to be connected with each semiconductor refrigeration piece electricity, the controller with the DC power supply electricity is connected, the controller is connected with temperature sensor electricity, temperature sensor and controller all are located the outside of metal heat pipe, temperature sensor sets up the temperature that the lower length of unable adjustment base's roof is wide on the surface in order to be used for detecting the roof, and when the temperature less than or equal to 15 ℃ that temperature sensor detected, the controller cuts off DC power supply to the power supply of semiconductor refrigeration piece for the semiconductor refrigeration piece cuts off the power supply and stops the refrigeration, takes place the dewfall frost on the CPU in order to avoid the temperature of CPU to hang down; 2) the application can set up 4-16 semiconductor refrigeration pieces 8 at most, but whole semiconductor refrigeration pieces can not be electrified to work simultaneously, the controller can set for the procedure, which semiconductor refrigeration pieces are automatically controlled by the controller to be electrified to work, which semiconductor refrigeration pieces are automatically controlled by the controller to be powered off for rest, all semiconductor refrigeration pieces alternately work or stand by for standby, so that the phenomenon that the service life loss caused by long-time work of the semiconductor refrigeration pieces is too fast can be avoided, the service life of the semiconductor refrigeration pieces is prolonged, the phenomenon that the whole semiconductor refrigeration pieces are electrified to refrigerate simultaneously and the condensation frost is generated on a CPU due to too low concentrated refrigeration temperature can also be avoided.

Methods and devices not described in detail in the present invention are all the prior art and are not described in detail.

The principles and embodiments of the present invention are explained herein using specific examples, which are set forth only to help understand the method and its core ideas of the present invention. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.

Claims

1. A device for cooling liquid by adopting semiconductor chilling plates is characterized by comprising a plurality of semiconductor chilling plates for refrigeration, a rotating base which is used for conducting heat and mounting the semiconductor chilling plates and is made of metal materials, a fixing base which is used for conducting heat and supporting the rotation of the rotating base and is made of metal materials, a clamp which is used for clamping and fixing the semiconductor chilling plates, a rolling bearing I which is used for supporting rotation and conducting heat and is made of metal materials, a rolling bearing II which is used for supporting rotation and conducting electricity and is made of metal materials, a rolling bearing III which is used for supporting rotation and conducting electricity and is made of metal materials, a plastic insulating ring I, a plastic insulating ring II, a direct current motor, a motor base and a transmission disc made of plastic materials;

2. The device for cooling liquid by using the semiconductor chilling plate according to claim 1, wherein the metal heat conduction plate is a planar plate, the long and wide surfaces of the metal heat conduction plate are parallel to the axial center line of the metal heat conduction pipe, the outer surface of the pipe wall of the metal heat conduction pipe is integrally connected with one of the thicknesses of the metal heat conduction plates in a side direction, and a gap is left between two adjacent metal heat conduction plates to form an air duct for cooling air to pass through.

3. The apparatus as claimed in claim 1, wherein each of said metallic heat-conducting plates has a semiconductor cooling plate disposed on each of the long and wide surfaces thereof.

4. The device for cooling liquid by using the semiconductor chilling plate according to claim 1, wherein the clamp comprises an aluminum strip A, an aluminum strip B, an upper plastic bolt and a lower plastic bolt;

5. The device for cooling liquid by using the semiconductor chilling plate according to claim 1, wherein the rotating base is made of aluminum alloy, copper or copper alloy material;

the top plate is made of aluminum alloy, copper or copper alloy materials;

the bottom disc is made of aluminum alloy, copper or copper alloy materials;

the threading pipe is made of aluminum alloy, copper or copper alloy materials.

6. The device for cooling liquid by using the semiconductor chilling plate according to claim 1, wherein the first rolling bearing is a cylindrical roller bearing, and an inner ring I, an outer ring I and a rolling body I in the first rolling bearing are all made of aluminum alloy, copper alloy or steel material;

7. The device for cooling liquid by using the semiconductor chilling plate according to claim 1, wherein a second positive wire and a second negative wire for supplying power to the DC motor pass through the threading pipe and then enter the lumen of the plastic pipe, and then the second positive wire and the second negative wire pass downward through the plastic pipe and are finally electrically connected with the positive electrode and the negative electrode of the DC motor respectively;

8. The device for cooling liquid by using the semiconductor chilling plate as claimed in claim 1, wherein the top plate is provided with a bolt through hole for inserting a fastening bolt to fix the top plate.

9. A liquid cooling CPU radiator, including water-cooling head, coolant circulation pump and plastic hose, characterized by, also include any one of claim 1-8 said device to adopt semiconductor refrigeration chip to cool liquid;