CN211451446U - Semiconductor refrigerator and fan using same - Google Patents
Semiconductor refrigerator and fan using same Download PDFInfo
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- CN211451446U CN211451446U CN202020069717.2U CN202020069717U CN211451446U CN 211451446 U CN211451446 U CN 211451446U CN 202020069717 U CN202020069717 U CN 202020069717U CN 211451446 U CN211451446 U CN 211451446U
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- semiconductor cooler
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Abstract
The utility model discloses a semiconductor cooler and applied semiconductor cooler's fan, wherein semiconductor cooler includes: the semiconductor refrigerating sheet is provided with a heat effect surface and a cold effect surface; the upper surface of the cold conducting metal sheet is tightly attached to the cold effect surface of the semiconductor refrigerating sheet through an adhesive layer; the heat effect surfaces of the heat dissipation fins and the semiconductor refrigerating sheet are attached to each other and used for dissipating heat of the semiconductor refrigerating sheet; the semiconductor refrigeration piece is including the ceramic layer that is located upper and lower both ends to and the semiconductor refrigeration chip of pressfitting between upper and lower both ends ceramic layer, the semiconductor refrigeration chip stacks with the pyramid mode from last to bottom. The utility model discloses a semiconductor cooler makes semiconductor cooler's refrigeration effect improve greatly in less volume. The utility model discloses provide simultaneously use aforementioned semiconductor cooler's fan.
Description
Technical Field
The utility model relates to a semiconductor cooler, and applied this semiconductor cooler's fan.
Background
The semiconductor refrigerating plate, also called thermoelectric refrigerating plate, is a heat pump. Its advantages are no slide part, limited space, high reliability and no pollution of refrigerant. The semiconductor refrigerating sheet in the traditional semiconductor refrigerator is of a single-layer structure, and the refrigerating effect is poor.
For the foregoing reasons, there is a need for improvements in the prior art.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a to not enough among the prior art, provide the semiconductor cooler.
The application is realized by the following technical scheme: a semiconductor cooler, comprising: the semiconductor refrigerating sheet is provided with a heat effect surface and a cold effect surface; the upper surface of the cold conducting metal sheet is tightly attached to the cold effect surface of the semiconductor refrigerating sheet through an adhesive layer; the heat effect surfaces of the heat dissipation fins and the semiconductor refrigerating sheet are attached to each other and used for dissipating heat of the semiconductor refrigerating sheet; the semiconductor refrigeration piece is including the ceramic layer that is located upper and lower both ends to and the semiconductor refrigeration chip of pressfitting between upper and lower both ends ceramic layer, the semiconductor refrigeration chip stacks with the pyramid mode from last to bottom.
In the above technical scheme, the bonding layer is an Ag layer.
In the above technical scheme, the bonding layer is a mixture layer of silicone grease and heat conducting material.
In the technical scheme, the heat conduction material is Ag, graphene or nano copper powder.
In the above technical scheme, the bonding layer is a graphene layer.
In the above technical scheme, the surface of the heat dissipation fin is coated with a radiation material layer.
In the above technical solution, the radiation material is a graphite layer or a boron nitride layer.
In the above technical solution, the heat dissipating fins are provided with fans.
In the above technical scheme, the heat pipe heat dissipation mechanism is arranged on the heat dissipation fins.
The utility model discloses provide simultaneously use semiconductor cooler's fan, including the aforesaid semiconductor cooler, still include a fan main part and circulation pipeline, the fan main part has upper water tank and lower water tank, is provided with filter core mechanism between upper water tank and lower water tank, filter core mechanism includes the filter paper that has the function of absorbing water that a plurality of intervals set up, semiconductor cooler's cold sheetmetal that leads inserts in the lower water tank or with the tank wall laminating of lower water tank, circulation pipeline's head and the tail respectively with lower water tank and upper water tank connect be provided with the pump on the circulation pipeline in order to be used for providing power for the circulation of the interior refrigeration liquid of circulation pipeline, filter core mechanism sets up between air intake and the mouth of blowing.
The utility model discloses following beneficial effect has: the utility model discloses make in less volume semiconductor cooler's refrigeration effect improve greatly, the utility model discloses the fan of using aforementioned semiconductor cooler is provided simultaneously.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural diagram of a semiconductor chilling plate.
Fig. 3 shows a fan using the semiconductor cooler.
Fig. 4 is a schematic view of the fan body of fig. 3.
Detailed Description
The invention will be described in further detail with reference to the following detailed description and accompanying drawings: referring to fig. 1 to 2, a semiconductor refrigerator includes: the semiconductor refrigerating chip 1 is provided with a heat effect surface 10 and a cold effect surface 11;
the upper surface of the cold conducting metal sheet 2 is tightly attached to the cold effect surface 11 of the semiconductor refrigerating sheet 1 through the bonding layer 3; and the heat radiating fins 4 are attached to the heat effect surfaces 10 of the semiconductor refrigerating sheets 1, and are used for radiating the semiconductor refrigerating sheets.
The semiconductor refrigeration piece 2 comprises ceramic layers 20 located at the upper end and the lower end and a semiconductor refrigeration chip 21 pressed between the ceramic layers at the upper end and the lower end, and the semiconductor refrigeration chip 21 is stacked in a pyramid mode from top to bottom.
Adopt the silicone grease layer as the tie coat between traditional semiconductor refrigeration piece 1 and the cold sheetmetal 2 of leading, its heat transfer coefficient is lower, so this application is to the tie coat that has adopted higher heat transfer coefficient, specific: the bonding layer 3 is an Ag layer, and the Ag layer can bond the semiconductor refrigerating sheet and the cold conducting metal sheet in a silver paste curing mode; or the bonding layer is a mixture layer of silicone grease and heat conducting materials, wherein the heat conducting materials are Ag, graphene or nano copper powder. In addition, the bonding layer can also be selected to be a graphene layer.
In order to further improve the heat dissipation efficiency of the heat dissipation fins 4, the surfaces of the heat dissipation fins are coated with a radiation material layer, and the radiation material layer is a graphite layer or a boron nitride layer. In addition, a fan 5 or a heat pipe heat dissipation mechanism (prior art, not shown in the drawings) is mounted on the heat dissipation fin 4 for increasing the heat exchange speed.
Referring to fig. 3 to 4, the fan of the semiconductor refrigerator is applied, embodiment 1: the semiconductor refrigerator comprises the semiconductor refrigerator, and further comprises a fan main body 200 and a circulating pipeline 101, wherein the fan main body 200 is provided with an upper water tank 100a and a lower water tank 100b, a through hole is formed in the bottom of the upper water tank 100a, a filter element mechanism 201 is arranged between the upper water tank 100a and the lower water tank 100b, the filter element mechanism 201 comprises a plurality of pieces of filter paper 202 arranged at intervals, and the filter paper has a water absorption function.
The cold conducting metal sheet 2 of the semiconductor refrigerator is inserted into the lower water tank 100b or attached to the wall of the lower water tank 100b, so as to transfer the temperature of the cold conducting metal sheet to the refrigerant liquid in the lower water tank 100 b; the head and the tail of the circulating pipeline 101 are respectively connected with the lower water tank 100b and the upper water tank 100a, a pump 103 is arranged on the circulating pipeline 101 and used for providing power for circulation of refrigerating fluid in the circulating pipeline 101, the cooling fluid in the lower water tank 100b is pumped into the upper water tank 100a through the circulating pipeline 101, the cooling fluid in the upper water tank 100a drips onto the filter element mechanism 201 through a through hole formed in the bottom wall of the upper water tank 100a, and then drips into the lower water tank 100b from the filter element mechanism 201, and circulation of the cooling fluid is completed. The fan main body 200 includes an air inlet 200a and an air outlet 200b, and the filter element mechanism 201 is disposed between the air inlet 200a and the air outlet 200b for cooling air blown from the air blowing mechanism before being blown out from the air outlet 200 b.
Through the structure, the air blown out by the common fan is cooled through the cooling liquid, so that the fan can blow out cool air, and the use experience of a user is improved. In addition, the mode that the semiconductor refrigerator water adding tank recycles the cooling liquid is directly adopted, so that compared with a common refrigerating fan, ice blocks or cold water does not need to be added additionally. And because the cooling liquid firstly drops on the filter paper of the filter core mechanism, excessive moisture cannot be mixed by the air blown out from the fan, and the filter paper also plays a role in absorbing dust in the air.
Although the cold conducting metal sheet 2 is described in the above embodiments for conducting cold, it is easy for those skilled in the art to understand that when a current in a direction is applied to the semiconductor cooling sheet, the original temperatures of the hot effect surface and the cold effect surface are reversed, and the cold conducting metal sheet 2 is used for conducting heat; that is, the fan may be used to blow warm air.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The foregoing embodiments and description of the invention have been provided in the present application for the purpose of illustrating the principles of the invention and is subject to various changes and modifications without departing from the spirit and scope of the invention. All such variations and modifications are intended to be within the scope of the claimed invention.
Claims (10)
1. A semiconductor cooler, comprising:
the semiconductor refrigerating sheet is provided with a heat effect surface and a cold effect surface;
the upper surface of the cold conducting metal sheet is tightly attached to the cold effect surface of the semiconductor refrigerating sheet through an adhesive layer;
the heat effect surfaces of the heat dissipation fins and the semiconductor refrigerating sheet are attached to each other and used for dissipating heat of the semiconductor refrigerating sheet; the method is characterized in that: the semiconductor refrigeration piece is including the ceramic layer that is located upper and lower both ends to and the semiconductor refrigeration chip of pressfitting between upper and lower both ends ceramic layer, the semiconductor refrigeration chip stacks with the pyramid mode from last to bottom.
2. The semiconductor cooler of claim 1, wherein: the bonding layer is an Ag layer.
3. The semiconductor cooler of claim 1, wherein: the bonding layer is a mixture layer of silicone grease and heat conducting materials.
4. A semiconductor cooler according to claim 3, wherein: the heat conduction material is Ag, graphene or nano copper powder.
5. The semiconductor cooler of claim 1, wherein: the bonding layer is a graphene layer.
6. The semiconductor cooler of claim 1, wherein: the surfaces of the radiating fins are coated with radiating materials.
7. The semiconductor cooler of claim 6, wherein: the radiation material is graphite or boron nitride.
8. The semiconductor cooler of claim 1, wherein: and a fan is arranged on the heat dissipation fin.
9. The semiconductor cooler of claim 1, wherein: and the heat dissipation fins are provided with heat pipe heat dissipation mechanisms.
10. Use fan of semiconductor cooler, its characterized in that: the semiconductor refrigerator comprises a semiconductor refrigerator according to any one of claims 1 to 9, and further comprises a fan body and a circulation pipeline, wherein the fan body is provided with an upper water tank and a lower water tank, a filter element mechanism is arranged between the upper water tank and the lower water tank, the filter element mechanism comprises a plurality of pieces of filter paper with a water absorption function, the filter paper is arranged at intervals, cold guide metal sheets of the semiconductor refrigerator are inserted into the lower water tank or attached to the wall of the lower water tank, the head and the tail of the circulation pipeline are respectively connected with the lower water tank and the upper water tank, a pump is arranged on the circulation pipeline and used for providing power for circulation of refrigerating fluid in the circulation pipeline, and the filter element mechanism is arranged between an air inlet and an air blowing port.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2019219710710 | 2019-11-15 | ||
| CN201921971071 | 2019-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211451446U true CN211451446U (en) | 2020-09-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020069717.2U Active CN211451446U (en) | 2019-11-15 | 2020-01-14 | Semiconductor refrigerator and fan using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211451446U (en) |
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2020
- 2020-01-14 CN CN202020069717.2U patent/CN211451446U/en active Active
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