CN111592838A - Optical adhesive tape based on negative photoresist and production process thereof - Google Patents
Optical adhesive tape based on negative photoresist and production process thereof Download PDFInfo
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- CN111592838A CN111592838A CN202010468887.2A CN202010468887A CN111592838A CN 111592838 A CN111592838 A CN 111592838A CN 202010468887 A CN202010468887 A CN 202010468887A CN 111592838 A CN111592838 A CN 111592838A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/14—Glass
- C09J2400/143—Glass in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2425/00—Presence of styrenic polymer
- C09J2425/006—Presence of styrenic polymer in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/006—Presence of halogenated polymer in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
Abstract
The invention discloses an optical adhesive tape based on negative photoresist and a production process thereof, belonging to the technical field of optical adhesive tapes. The optical adhesive tape can be directly bonded on the object, so that the surface of the object directly has the imaging characteristic of the negative photoresist, the negative photoresist layer on the surface of the object is covered and protected by the substrate, and the two sides of the negative photoresist layer are supported by the optical adhesive layer, so that the phenomenon that the adhesive path collapses due to over thickness can be avoided.
Description
Technical Field
The invention relates to the technical field of optical adhesive tapes, in particular to an optical adhesive tape based on negative photoresist and a production process thereof.
Background
The optical adhesive tape is made of optical adhesive, and has the characteristics of colorless transparency, light transmittance of over 90 percent, good bonding strength, capability of being cured at room temperature or middle temperature, small curing shrinkage and the like. Negative photoresist is a mixed liquid which is sensitive to light and consists of three main components of photosensitive resin, sensitizer (visible spectrum sensitizing dye) and solvent, and when the photoresist receives light or radiation with a certain wavelength, a photochemical reaction or an excitation action can be correspondingly generated, wherein the negative photoresist which forms insoluble substances after illumination is negative photoresist.
Patent No. CN201110420291.6 provides a negative photoresist-based process for photolithography of a diffuser, which comprises the following steps: firstly, coating photoresist on the surface of a substrate, then carrying out prebaking, prebaking the substrate coated with the negative photoresist in a spinning mode, and removing a solvent of the negative photoresist; then, exposure is carried out, the diffusion sheet is positioned on the mask plate, and the negative photoresist is subjected to ultraviolet exposure by using the diffusion sheet and the mask plate as masks; finally, post-baking and developing are carried out, the negative photoresist in the exposure area is crosslinked in the post-baking process and is insoluble in a developing solution, and a specific cross-section structure is obtained; the diffusion sheet and the mask plate are used as a mask to participate in the exposure of the photoresist. The three-dimensional microstructure pattern which cannot be realized by the traditional photoetching method is prepared by adopting a photoetching process of combining a diffusion sheet with a negative photoresist, converting linear light of a light source into diffuse light by using the diffusion sheet and combining the imaging characteristic of the negative photoresist. The invention can obtain the circular arc, double circular arc and other complex section graph structures by utilizing single photoetching. However, the photoresist is manufactured by coating the photoresist on the surface of an object, and then performing processes such as drying and exposure, the photoresist is easy to collapse on the surface of the object, the thickness of the photoresist is limited when the photoresist path is higher, and the object with the imaging characteristic of the photoresist needs to be subjected to complicated processes and cannot be obtained immediately.
Disclosure of Invention
The invention aims to provide an optical adhesive tape based on a negative photoresist and a production process thereof, which can be used for directly bonding the optical adhesive tape on an object, so that the surface of the object directly has the imaging characteristic of the negative photoresist, the negative photoresist layer on the surface of the object is covered and protected by a substrate, and the two sides of the negative photoresist layer are supported by the optical adhesive layer, so that collapse caused by over-thick photoresist paths is avoided, and the problems in the background art are solved.
In order to achieve the purpose, the invention provides the following technical scheme: the optical adhesive tape based on the negative photoresist comprises a substrate, a resist layer, a negative photoresist layer and an optical adhesive layer, wherein the surface of the substrate is coated with the resist layer, the negative photoresist layer and the optical adhesive layer, and the resist layer is positioned between the negative photoresist layer and the optical adhesive layer as well as between the substrate.
Furthermore, the width of the substrate is equal to or more than that of the negative photoresist layer, the substrate is plate-shaped, the anti-corrosion layer and the negative photoresist layer are distributed on the upper surface and the lower surface of the substrate in a route mode, the remaining blank parts of the upper surface and the lower surface of the substrate are coated with the optical photoresist layer, and the outer surfaces of the negative photoresist layer and the optical photoresist layer are flush with each other.
Furthermore, the width of the substrate is 4-5 times of the width of the negative photoresist layer, the substrate is plate-shaped, the anti-corrosion layer and the negative photoresist layer are distributed on the upper surface of the substrate in a route mode, the optical adhesive layer is coated on the residual blank part of the upper surface of the substrate, and the outer surfaces of the negative photoresist layer and the optical adhesive layer are flush with each other.
Furthermore, the width of the substrate is 1.2-1.5 times of the width of the negative photoresist layer, the substrate is in a strip shape, the edge and the lower surface of the upper surface of the substrate are coated with the optical photoresist layer, the middle of the upper surface of the substrate is coated with the anti-corrosion layer, and the anti-corrosion layer is coated with the negative photoresist layer in half.
Further, the substrate is a structural layer made of one or more of PET, PVC and PS materials or silicon wafers and glass.
Further, the anti-corrosion layer is made of light isolation materials and is composed of aluminum powder, glass fibers and gel.
Further, the optical adhesive layer has a light intensity range of 1000mJ/cm2～5000mJ/cm2The curing rate of the short-wave ultraviolet curing liquid optical cement is more than 50 percent.
According to another aspect of the present invention, there is provided a process for producing a negative photoresist-based optical tape, comprising the steps of:
s101: coating a corrosion-resistant layer and a negative photoresist layer on the surface of the substrate in sequence to form a negative photoresist layer circuit;
s102: pre-baking the substrate to remove the solvent of the negative photoresist;
s103: exposing, post-baking and developing the substrate in the step S102;
s104: and coating an optical adhesive layer on the surface of the substrate, wherein the optical adhesive layer and the negative photoresist layer form an adhesive surface.
Further, the exposure in S103 is any one of contact exposure, macro exposure, and step projection exposure.
Compared with the prior art, the invention has the beneficial effects that: the invention provides an optical adhesive tape based on negative photoresist and a production process thereof.A negative photoresist layer is arranged in an optical adhesive layer to form an adhesive surface with the optical adhesive layer, and a sheet-shaped optical adhesive tape with distributed negative photoresist layer circuits can be directly adhered on an object or a belt-shaped optical adhesive tape is adhered on the object according to a certain route, so that the surface of the object directly has the imaging characteristic of the negative photoresist, the negative photoresist layer on the surface of the object is covered and protected by a substrate, and the two sides of the negative photoresist layer are supported by the optical adhesive layer, and the phenomenon of collapse caused by over-thick adhesive route can be avoided.
Drawings
FIG. 1 is a schematic diagram of a negative photoresist-based optical tape according to a first embodiment of the present invention;
FIG. 2 is a cross-sectional view of a negative photoresist-based optical tape according to one embodiment of the present invention;
FIG. 3 is a schematic diagram of a negative photoresist-based optical tape according to a second embodiment of the present invention;
FIG. 4 is a cross-sectional view of a negative photoresist-based optical tape according to a second embodiment of the present invention;
FIG. 5 is a schematic diagram of a negative photoresist-based optical tape according to a third embodiment of the present invention;
FIG. 6 is a cross-sectional view of a negative photoresist-based optical tape according to a third embodiment of the present invention;
FIG. 7 is a flow chart of the process for manufacturing a negative photoresist-based optical tape according to the present invention.
In the figure: 1. a substrate; 2. a resist layer; 3. a negative photoresist layer; 4. and the optical adhesive layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Referring to fig. 1-2, an optical adhesive tape based on negative photoresist comprises a substrate 1, a resist layer 2, a negative photoresist layer 3 and an optical adhesive layer 4, wherein the surface of the substrate 1 is coated with the resist layer 2, the negative photoresist layer 3 and the optical adhesive layer 4, the resist layer 2 is a light isolation material, the resist layer 2 is composed of aluminum powder, glass fiber and gel, and the optical adhesive layer 4 has a light intensity range of 1000mJ/cm2～5000mJ/cm2The curing rate of the short-wave ultraviolet-cured liquid optical adhesive is more than 50%, the corrosion-resistant layer 2 is positioned between the negative photoresist layer 3 and the optical adhesive layer 4, and the substrate 1, the substrate 1 is a structural layer made of one or more of PET, PVC, PS materials or silicon wafers and glass, the width of the substrate 1 is 4-5 times of the width of the negative photoresist layer 3, the substrate 1 is plate-shaped, the corrosion-resistant layer 2 and the negative photoresist layer 3 are distributed on the upper surface and the lower surface of the substrate 1 in a route form, the optical adhesive layer 4 is coated on the residual blank parts on the upper surface and the lower surface of the substrate 1, the outer surfaces of the negative photoresist layer 3 and the optical adhesive layer 4 are parallel and level, and the routes of the negative photoresist layers 3 on the upper surface and the lower.
Referring to fig. 7, in order to better show the production flow of the optical adhesive tape based on the negative photoresist, the present embodiment now provides a production process of the optical adhesive tape based on the negative photoresist, which includes the following steps:
s101: the surface of the substrate 1 is sequentially coated with an anti-corrosion layer 2 and a negative photoresist layer 3 to form a negative photoresist layer 3 circuit;
s102: pre-baking the substrate 1 to remove the solvent of the negative photoresist;
s103: exposing, post-baking and developing the substrate 1 in the step S102; the exposure is any one of contact exposure, macro exposure and step projection exposure, and the negative photoresist in the exposure area is crosslinked in postbaking and is insoluble in a developing solution to obtain a specific cross-sectional structure;
s104: the surface of the substrate 1 is coated with the optical glue layer 4, the optical glue layer 4 and the negative photoresist layer 3 form a glue surface, and a sheet-shaped optical adhesive tape with the arranged lines of the negative photoresist layer 3 can be directly bonded on an object, so that the surface of the object directly has the imaging characteristic of the negative photoresist, the negative photoresist layer 3 on the surface of the object is covered and protected by the substrate 1, and the two sides are supported by the optical glue layer 4, so that the phenomenon that the glue path collapses due to over thickness can not occur.
Example two
Referring to fig. 3-4, the optical adhesive tape based on the negative photoresist comprises a substrate 1, a corrosion-resistant layer 2, a negative photoresist layer 3 and an optical adhesive layer 4, wherein the corrosion-resistant layer 2, the negative photoresist layer 3 and the optical adhesive layer 4 are coated on the surface of the substrate 1, the corrosion-resistant layer 2 is a light isolation material, the corrosion-resistant layer 2 is composed of aluminum powder, glass fiber and a gelling agent, and the optical adhesive layer 4 has a light intensity range of 1000mJ/cm2～5000mJ/cm2The curing rate of the short-wave ultraviolet-cured liquid optical adhesive is more than 50%, the corrosion-resistant layer 2 is positioned between the negative photoresist layer 3 and the optical adhesive layer 4, and the substrate 1, the substrate 1 is a structural layer made of one or more of PET, PVC, PS materials or silicon wafers and glass, the width of the substrate 1 is 4-5 times of the width of the negative photoresist layer 3, the substrate 1 is plate-shaped, the corrosion-resistant layer 2 and the negative photoresist layer 3 are distributed on the upper surface of the substrate 1 in a route form, the optical adhesive layer 4 is coated on the residual blank part of the upper surface of the substrate 1, the outer surfaces of the negative photoresist layer 3 and the optical adhesive layer 4 are parallel and level, and the lines of the negative photoresist layer 3 on the upper surface and the lower surface of the substrate.
Referring to fig. 7, in order to better show the production flow of the optical adhesive tape based on the negative photoresist, the present embodiment now provides a production process of the optical adhesive tape based on the negative photoresist, which includes the following steps:
s101: the surface of the substrate 1 is sequentially coated with an anti-corrosion layer 2 and a negative photoresist layer 3 to form a negative photoresist layer 3 circuit;
s102: pre-baking the substrate 1 to remove the solvent of the negative photoresist;
s103: exposing, post-baking and developing the substrate 1 in the step S102; the exposure is any one of contact exposure, macro exposure and step projection exposure, and the negative photoresist in the exposure area is crosslinked in postbaking and is insoluble in a developing solution to obtain a specific cross-sectional structure;
s104: the surface of the substrate 1 is coated with the optical glue layer 4, the optical glue layer 4 and the negative photoresist layer 3 form a glue surface, and a sheet-shaped optical adhesive tape with the arranged lines of the negative photoresist layer 3 can be directly bonded on an object, so that the surface of the object directly has the imaging characteristic of the negative photoresist, the negative photoresist layer 3 on the surface of the object is covered and protected by the substrate 1, and the two sides are supported by the optical glue layer 4, so that the phenomenon that the glue path collapses due to over thickness can not occur.
EXAMPLE III
Referring to fig. 5-6, the optical adhesive tape based on the negative photoresist comprises a substrate 1, a corrosion-resistant layer 2, a negative photoresist layer 3 and an optical adhesive layer 4, wherein the corrosion-resistant layer 2, the negative photoresist layer 3 and the optical adhesive layer 4 are coated on the surface of the substrate 1, the corrosion-resistant layer 2 is a light isolation material, the corrosion-resistant layer 2 is composed of aluminum powder, glass fiber and a gelling agent, and the optical adhesive layer 4 has a light intensity range of 1000mJ/cm2～5000mJ/cm2The curing rate of the short-wave ultraviolet-cured liquid optical adhesive is more than 50%, the corrosion-resistant layer 2 is positioned between the negative photoresist layer 3 and the optical adhesive layer 4, and the substrate 1, the substrate 1 is a structural layer made of one or more of PET, PVC, PS materials or silicon wafers and glass, the width of the substrate 1 is 1.2-1.5 times of the width of the negative photoresist layer 3, the substrate 1 is in a belt shape, the optical adhesive layer 4 is coated on the edge of the upper surface and the lower surface of the substrate 1, the corrosion-resistant layer 2 is coated in the middle of the upper surface of the substrate 1, the negative photoresist layer 3 is coated in half of the corrosion-resistant layer 2, and the lines of the negative photoresist layer 3 on the upper surface and the lower surface of the.
Referring to fig. 7, in order to better show the production flow of the optical adhesive tape based on the negative photoresist, the present embodiment now provides a production process of the optical adhesive tape based on the negative photoresist, which includes the following steps:
s101: the surface of the substrate 1 is sequentially coated with an anti-corrosion layer 2 and a negative photoresist layer 3 to form a negative photoresist layer 3 circuit;
s102: pre-baking the substrate 1 to remove the solvent of the negative photoresist;
s103: exposing, post-baking and developing the substrate 1 in the step S102; the exposure is any one of contact exposure, macro exposure and step projection exposure, and the negative photoresist in the exposure area is crosslinked in postbaking and is insoluble in a developing solution to obtain a specific cross-sectional structure;
s104: the surface of the substrate 1 is coated with the optical adhesive layer 4, the optical adhesive layer 4 and the negative photoresist layer 3 form an adhesive surface, and the object is bonded with the strip-shaped optical adhesive tape according to a certain route, so that the surface of the object directly has the imaging characteristic of the negative photoresist, the negative photoresist layer 3 on the surface of the object is covered and protected by the substrate 1, and the two sides of the negative photoresist layer are supported by the optical adhesive layer 4, so that the phenomenon that the adhesive path collapses due to over thickness can not occur.
In summary, the following steps: the invention provides an optical adhesive tape based on negative photoresist and a production process thereof.A negative photoresist layer 3 is arranged in an optical adhesive layer 4 to form a glue surface with the optical adhesive layer 4, a sheet-shaped optical adhesive tape with distributed lines of the negative photoresist layer 3 can be directly adhered on an object, or a strip-shaped optical adhesive tape is adhered on the object according to a certain route, so that the surface of the object directly has the imaging characteristic of the negative photoresist, the negative photoresist layer 3 on the surface of the object is covered and protected by a substrate 1, and the two sides of the negative photoresist layer are supported by the optical adhesive layer 4, thus the phenomenon that the glue path collapses due to over-thickness is avoided.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical solutions disclosed in the present invention and the equivalent alternatives or modifications thereof within the scope of the present invention.
Claims (9)
1. An optical adhesive tape based on a negative photoresist is characterized by comprising a substrate (1), a corrosion-resistant layer (2), a negative photoresist layer (3) and an optical adhesive layer (4), wherein the corrosion-resistant layer (2), the negative photoresist layer (3) and the optical adhesive layer (4) are coated on the surface of the substrate (1), and the corrosion-resistant layer (2) is positioned between the negative photoresist layer (3), the optical adhesive layer (4) and the substrate (1).
2. The optical tape based on the negative photoresist as claimed in claim 1, wherein the width of the substrate (1) is 4 to 5 times of the width of the negative photoresist layer (3), and the substrate (1) is in a plate shape, the resist layer (2) and the negative photoresist layer (3) are distributed on the upper surface and the lower surface of the substrate (1) in a route form, the remaining blank portions of the upper surface and the lower surface of the substrate (1) are coated with the optical photoresist layer (4), and the outer surfaces of the negative photoresist layer (3) and the optical photoresist layer (4) are flush with each other.
3. The optical tape based on the negative photoresist as claimed in claim 1, wherein the width of the substrate (1) is 4 to 5 times of the width of the negative photoresist layer (3), the substrate (1) is plate-shaped, the resist layer (2) and the negative photoresist layer (3) are distributed on the upper surface of the substrate (1) in a route manner, the remaining blank part of the upper surface of the substrate (1) is coated with the optical photoresist layer (4), and the outer surfaces of the negative photoresist layer (3) and the optical photoresist layer (4) are flush with each other.
4. The optical tape based on the negative photoresist as claimed in claim 1, wherein the width of the substrate (1) is 1.2 to 1.5 times of the width of the negative photoresist layer (3), and the substrate (1) is in a strip shape, the edge of the upper surface and the lower surface of the substrate (1) are coated with the optical photoresist layer (4), the middle of the upper surface of the substrate (1) is coated with the resist layer (2), and the resist layer (2) is half coated with the negative photoresist layer (3).
5. The optical tape based on negative photoresist as claimed in claim 1, wherein the substrate (1) is a structural layer made of one or more of PET, PVC, PS material or silicon wafer, glass.
6. The optical tape based on negative photoresist as claimed in claim 1, characterized in that the resist layer (2) is a light-isolating material, and the resist layer (2) is composed of aluminum powder, glass fiber and gelling agent.
7. Such asOptical adhesive tape according to claim 1, characterized in that the optical adhesive layer (4) has a light intensity in the range of 1000mJ/cm2～5000mJ/cm2The curing rate of the short-wave ultraviolet curing liquid optical cement is more than 50 percent.
8. A process for producing a negative photoresist-based optical tape according to any one of claims 1 to 7, comprising the steps of:
s101: the surface of the substrate (1) is sequentially coated with an anti-corrosion layer (2) and a negative photoresist layer (3) to form a negative photoresist layer (3) circuit;
s102: pre-baking the substrate (1) to remove the solvent of the negative photoresist;
s103: exposing, post-baking and developing the substrate (1) in the step S102;
s104: and coating an optical adhesive layer (4) on the surface of the substrate (1), wherein the optical adhesive layer (4) and the negative photoresist layer (3) form an adhesive surface.
9. The process of claim 8, wherein the exposure in step S103 is any one of contact exposure, macro exposure and step projection exposure.
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