CN110032041B - Photoresist composition, display panel and preparation method thereof - Google Patents
Photoresist composition, display panel and preparation method thereof Download PDFInfo
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- CN110032041B CN110032041B CN201910375030.3A CN201910375030A CN110032041B CN 110032041 B CN110032041 B CN 110032041B CN 201910375030 A CN201910375030 A CN 201910375030A CN 110032041 B CN110032041 B CN 110032041B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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Abstract
The invention provides a light resistance composition, a display panel and a preparation method thereof, wherein the light resistance composition comprises resin and a photosensitizer, the resin and/or the photosensitizer comprise hydrophilic groups, the hydrophilic groups enable the light resistance composition to have hydrophilicity, and a light resistance film prepared by the light resistance composition has strong adhesion with a substrate. The display panel can avoid using a tackifier, reduce the manufacturing cost of the display panel and improve the yield of the display panel.
Description
Technical Field
The invention relates to the technical field of display, in particular to a light resistance composition, a display panel and a preparation method thereof.
Background
In the process of manufacturing a display panel, a photoresist is usually used to pattern a film layer to form a circuit pattern, and generally, the photoresist has hydrophobicity, and when the substrate of the photoresist is a hydrophilic material, the adhesion between the photoresist and the substrate is not good, and a tackifier needs to be coated on the surface of the substrate to enhance the adhesion between the photoresist and the substrate.
However, the tackifier is generally volatile and flammable, has corrosiveness and toxicity, and is harmful to human bodies; and the adhesion promoter is coated on the surface of the substrate, which increases the manufacturing cost of the display panel.
In view of the foregoing, it is desirable to provide a photoresist composition, a display panel and a method for preparing the same that can avoid using an adhesion promoter.
Disclosure of Invention
The invention provides a light resistance composition capable of avoiding using a tackifier, a display panel and a preparation method thereof, which can reduce the manufacturing cost of the display panel and improve the yield of the display panel.
The embodiment of the invention provides a photoresist composition, which comprises resin and a photosensitizer, wherein the resin and/or the photosensitizer comprise hydrophilic groups, and the hydrophilic groups enable the photoresist composition to have hydrophilicity.
In one embodiment, the resin comprises the hydrophilic group, and the molecular structural formula of the resin is as follows:
wherein at least one of R1 and R2 comprises the hydrophilic group, and n is a positive integer.
In one embodiment, the photosensitizer comprises the hydrophilic group, and the molecular structural formula of the photosensitizer is as follows:
wherein at least one of R3 and R4 comprises the hydrophilic group.
In one embodiment, the hydrophilic group is arranged on the side of the photoresist composition close to the hydrophilic substance under heating.
In one embodiment, the photoresist composition further includes a surfactant and a solvent.
The embodiment of the invention also provides a display panel, which comprises a substrate and a light resistance layer arranged on the substrate;
the preparation material of the light resistance layer comprises a light resistance composition, the light resistance composition comprises resin and photosensitizer, and the resin and/or the photosensitizer comprise hydrophilic groups, wherein the hydrophilic groups enable the light resistance composition to have hydrophilicity.
In one embodiment, the resin comprises the hydrophilic group, and the molecular structural formula of the resin is as follows:
wherein at least one of R1 and R2 comprises the hydrophilic group, and n is a positive integer.
In one embodiment, the photosensitizer comprises the hydrophilic group, and the molecular structural formula of the photosensitizer is as follows:
wherein at least one of R3 and R4 comprises the hydrophilic group.
In one embodiment, the hydrophilic group is arranged on the side of the photoresist composition close to the hydrophilic substance under heating.
In one embodiment, the photoresist composition further includes a surfactant and a solvent.
The embodiment of the invention also provides a preparation method of the display panel, which comprises the following steps:
providing a resin, a photosensitizer, a surfactant and a solvent, wherein the resin and/or the photosensitizer comprises a hydrophilic group, and the hydrophilic group has hydrophilicity;
mixing the resin, the photosensitizer, the surfactant and the solvent to form a solution;
coating the solution on the surface of a substrate to form a photoresist film;
baking the photoresist film so that hydrophilic groups in the resin and/or the photosensitizer are arranged on the side of the photoresist film close to the substrate to improve the adhesion between the photoresist film and the substrate;
and developing the photoresist film to form a photoresist layer.
The invention provides a photoresist composition, a display panel and a preparation method thereof. The display panel can avoid using a tackifier, reduce the manufacturing cost of the display panel and improve the yield of the display panel.
Drawings
The invention is further illustrated by the following figures. It should be noted that the drawings in the following description are only for illustrating some embodiments of the invention, and that other drawings may be derived from those drawings by a person skilled in the art without inventive effort.
Fig. 1 is a schematic cross-sectional view of a display panel according to an embodiment of the present invention.
Fig. 2 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention.
Fig. 3 is a flowchart of a method for manufacturing a display panel according to another embodiment of the present invention.
FIG. 4 is a diagram illustrating a chemical reaction between a resin and a photosensitizer in a developer according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be understood that the terms "upper", "lower", "right", "close", etc. indicate the orientation or positional relationship based on the drawings, wherein "upper" simply means the surface above the object, specifically refers to the right above, obliquely above, upper surface, as long as it is above the object level, and "close" means the side with smaller distance to the target in comparison, and the above orientation or positional relationship is only for convenience of describing the present invention and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
It should be noted that the drawings only provide the structures and/or steps which are relatively closely related to the present invention, and some details which are not related to the present invention are omitted, so as to simplify the drawings and make the present invention clear, but not to show that the actual devices and/or methods are the same as the drawings and are not limitations of the actual devices and/or methods.
The present invention provides a display panel, as shown in fig. 1, the display panel 100 includes a substrate 101, a substrate 102 disposed on the substrate 101, and a photoresist layer 103 disposed on the substrate 102.
The substrate 101 may be made of a transparent substrate, for example, a transparent material including, but not limited to, glass; the substrate 102 is made of a hydrophilic material, such as a hydrophilic material including, but not limited to, silicon oxide or silicon nitride.
In particular, the present invention also provides a photoresist composition, which may be used to prepare the photoresist layer 103 of the display panel 100, and the photoresist composition may be a positive photoresist or a negative photoresist, and includes a resin and a photosensitizer, where the resin and/or the photosensitizer include a hydrophilic group, and the hydrophilic group makes the photoresist composition hydrophilic.
Wherein, the hydrophilic group can comprise at least one of carboxylic acid group, sulfonic group, phosphoric group, amino group, quaternary ammonium group, ether group, carboxylic ester and block polyether.
Further, the hydrophilic group has photosensitivity, such as: when the photoresist composition is heated, the hydrophilic groups are arranged on the side of the photoresist composition close to the hydrophilic substances, so that the adhesion between the photoresist composition and the hydrophilic substances is enhanced.
When the hydrophilic group is included in the resin, the following examples are included, but not limited to:
in one embodiment, the resin has a molecular structure of:
wherein the R1 and R2 can be the hydrophilic group or a side chain including the hydrophilic group, and n is a positive integer.
Alternatively, the R1 can be any of the R1 directly connected in the molecular structural formula of the resin
Or a side chain comprising the hydrophilic group; the R2 can be any one indirectly connected in the molecular structural formula of the resin
Or a side chain comprising said hydrophilic group. For example, the R1 and/or R2 may be a single alkane CB having a hydrophilic functional group or a long carbon chain having a hydrophilic functional group or a functional group in which a substituent of a hydrogen atom is hydrophilic, wherein C is a central carbon atom and B is a generic term for other "non-central carbon atoms" attached to the central carbon atom.
In one embodiment, the molecular structural formula of the resin may include one of R1 or one of R2.
In one embodiment, the resin may include one of the R1 and/or a plurality of the R2 in a molecular structural formula.
In one embodiment, the resin may include a plurality of R1 and/or one R2 in the molecular structural formula.
In one embodiment, the resin may include a plurality of R1 and/or a plurality of R2 in the molecular structural formula.
When the hydrophilic group is included in the sensitizer, the following examples are included, but not limited to:
in one embodiment, the photosensitizer has a molecular formula:
wherein the photosensitizer comprises a first benzene ring and a second benzene ring located at the right side of the first benzene ring, and the R3 and R4 may be the hydrophilic group or a side chain comprising the hydrophilic group.
Alternatively, the R3 may be any hydrophilic group directly attached to the first benzene ring or a side chain including the hydrophilic group; the R4 can be any hydrophilic group directly attached to the second phenyl ring or a side chain comprising the hydrophilic group. For example, the R3 and/or R4 may be a single alkane CB having a hydrophilic functional group or a long carbon chain having a hydrophilic functional group or a functional group in which a substituent of a hydrogen atom is hydrophilic, wherein C is a central carbon atom and B is a generic term for other "non-central carbon atoms" attached to the central carbon atom.
In one embodiment, the molecular structure of the photosensitizer may include one of the R3 or one of the R4.
In one embodiment, the molecular structure of the photosensitizer may include one of the R3 and/or a plurality of the R4.
In one embodiment, the molecular structural formula of the photosensitizer may include a plurality of the R3 and/or one of the R4.
In one embodiment, the photosensitizer may include a plurality of the R3 and/or a plurality of the R4 in its molecular structural formula.
In one embodiment, the photoresist composition further includes a surfactant and a solvent. The surfactant can obviously change the interface state of a solution system of the surfactant, and the surfactant has fixed hydrophilic groups and oleophilic groups which can be directionally arranged on the surface of the solution; the solvent may be an organic solvent, and may include, for example, but not limited to, at least one of styrene, perchloroethylene, trichloroethylene, ethylene glycol ether, and triethanolamine.
The invention also provides a preparation method of the display panel, as shown in fig. 2, comprising the following steps:
s101: provided are a resin, a sensitizer, a surfactant, and a solvent, the resin and/or the sensitizer including a hydrophilic group, the hydrophilic group having hydrophilicity.
Wherein the hydrophilic group comprises at least one of carboxylic acid group, sulfonic group, phosphoric group, amino group, quaternary ammonium group, ether group, carboxylic ester and block polyether.
Further, the hydrophilic group has photosensitivity, such as: when the photoresist composition is heated, the hydrophilic groups are arranged on the side of the photoresist composition close to the hydrophilic substances, so that the adhesion between the photoresist composition and the hydrophilic substances is enhanced.
When the hydrophilic group is included in the resin, the following examples are included, but not limited to:
in one embodiment, the resin has a molecular structure of:
wherein the R1 and R2 can be the hydrophilic group or a side chain including the hydrophilic group, and n is a positive integer.
Alternatively, the R1 can be any of the R1 directly connected in the molecular structural formula of the resin
Or a side chain comprising the hydrophilic group; the R2 can be any one indirectly connected in the molecular structural formula of the resin
Or a side chain comprising said hydrophilic group. For example, the R1 and/or R2 may be a single alkane CB having a hydrophilic functional group or a long carbon chain having a hydrophilic functional group or a functional group in which a substituent of a hydrogen atom is hydrophilic, wherein C is a central carbon atom and B is a generic term for other "non-central carbon atoms" attached to the central carbon atom.
In one embodiment, the molecular structural formula of the resin may include one of R1 or one of R2.
In one embodiment, the resin may include one of the R1 and/or a plurality of the R2 in a molecular structural formula.
In one embodiment, the resin may include a plurality of R1 and/or one R2 in the molecular structural formula.
In one embodiment, the resin may include a plurality of R1 and/or a plurality of R2 in the molecular structural formula.
When the hydrophilic group is included in the sensitizer, the following examples are included, but not limited to:
in one embodiment, the photosensitizer has a molecular formula:
wherein the photosensitizer comprises a first benzene ring and a second benzene ring located at the right side of the first benzene ring, and the R3 and R4 may be the hydrophilic group or a side chain comprising the hydrophilic group.
Alternatively, the R3 may be any hydrophilic group directly attached to the first benzene ring or a side chain including the hydrophilic group; the R4 can be any hydrophilic group directly attached to the second phenyl ring or a side chain comprising the hydrophilic group. For example, the R3 and/or R4 may be a single alkane CB having a hydrophilic functional group or a long carbon chain having a hydrophilic functional group or a functional group in which a substituent of a hydrogen atom is hydrophilic, wherein C is a central carbon atom and B is a generic term for other "non-central carbon atoms" attached to the central carbon atom.
In one embodiment, the molecular structure of the photosensitizer may include one of the R3 or one of the R4.
In one embodiment, the molecular structure of the photosensitizer may include one of the R3 and/or a plurality of the R4.
In one embodiment, the molecular structural formula of the photosensitizer may include a plurality of the R3 and/or one of the R4.
In one embodiment, the photosensitizer may include a plurality of the R3 and/or a plurality of the R4 in its molecular structural formula.
S102: the resin, sensitizer, surfactant, and the solvent are mixed to form a solution.
The surfactant can obviously change the interface state of a solution system of the surfactant, and the surfactant has fixed hydrophilic groups and lipophilic groups which can be directionally arranged on the surface of the solution; the solvent is generally an organic solvent, and may include, but is not limited to, styrene, perchloroethylene, trichloroethylene, ethylene glycol ether, triethanolamine, for example.
S103: and coating the solution on the surface of the substrate to form a photoresist film.
The substrate is made of a hydrophilic material, such as but not limited to silicon oxide or silicon nitride.
It should be noted that the substrate is cleaned before the solution is applied, and the solution can be applied to the substrate surface through a coater to ensure that the solution can be uniformly applied.
S104: and baking the photoresist film to enable hydrophilic groups in the resin and/or the photosensitizer to be arranged on one side of the photoresist film close to the substrate so as to improve the adhesion between the photoresist film and the substrate.
It should be noted that before baking the photoresist film, the method further includes vacuum drying the substrate coated with the photoresist, to preliminarily reduce the solvent component in the photoresist film, and to reduce the fluidity of the photoresist film.
The baking can refer to the prebaking condition before exposure in the prior art, and the prebaking process inherent in the prior art is directly relied on, so that the cost for preparing the display panel is reduced.
S105: and developing the photoresist film to form a photoresist layer.
In an embodiment, as shown in fig. 3, the step S105 may specifically include the following steps:
s1051: exposing the photoresist film to the photosensitive agent in the exposed region
Decomposition reaction occurs to produce acid radical
Further acid generation upon encountering water
As the exposure light source, a high-pressure mercury lamp may be used, the main wavelength of light emitted from the high-pressure mercury lamp is 365nm, and the exposure may be performed for 1 minute.
S1052: developing and hard baking the exposed photoresist film, and obtaining the resin in the non-exposure area
And the said sensitizer
Reacting to form a polymer, a molecular junction of said polymerThe structure formula is as follows:
and forming the photoresist layer.
The chemical reaction equation between the resin and the photosensitizer in the developer MOH is shown in fig. 4, and the developer MOH may be an alkaline solution without limitation to potassium hydroxide, sodium hydroxide, or tetramethylammonium hydroxide.
As will be appreciated, in S1051, the photosensitizer in the exposed region eventually reacts to form an acidic substance
The developer MOH is an alkaline solution, so that the photosensitizer in the exposed area will be neutralized with the developer to generate water and be removed.
As shown in fig. 4, the photosensitive agent is not exposed to light in the environment of the developing solution
Addition to the resin not exposed to light
and-OH in the developer MOH reacts with-H of-OH in the resin to generate water so that the M atom replaces-H of-OH in the resin. During the development, the hydrophilic groups or the side chains R1, R2, R3, R4 containing the hydrophilic groups do not participate in chemical reactions and remain in the polymer, and during the hard baking at a later stage, the hydrophilic groups or the side chains R1, R2, R3, R4 containing the hydrophilic groups may still be arranged on the side of the photoresist film close to the substrate, and thus the photoresist film still has hydrophilicity.
The invention provides a photoresist composition, a display panel and a preparation method thereof. The display panel can avoid using a tackifier, reduce the manufacturing cost of the display panel and improve the yield of the display panel.
The photoresist composition, the display panel and the preparation method thereof provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by applying specific examples, and the description of the above embodiments is only used to help understanding the technical solutions and the core ideas of the present invention; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (7)
1. A photoresist composition for reacting with an alkaline developer, comprising a resin and a photosensitizer, wherein the resin comprises hydrophilic groups, and the hydrophilic groups make the photoresist composition hydrophilic;
the molecular structural formula of the resin is as follows:
at least one of R1 and R2 comprises the hydrophilic group, n is a positive integer, and R1 comprises at least one of a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, an amino group, a quaternary ammonium group, an ether group, a carboxylic ester and a block polyether;
the molecular structural formula of the photosensitizer is as follows:
wherein at least one of R3 and R4 comprises the hydrophilic group.
2. The photoresist composition of claim 1, wherein the hydrophilic group is arranged on the side of the photoresist composition near the hydrophilic substance under heating.
3. The photoresist composition of claim 1, further comprising a surfactant and a solvent.
4. The display panel is characterized by comprising a substrate and a light resistance layer arranged on the substrate;
the preparation material of the light resistance layer comprises a light resistance composition, the light resistance composition is used for reacting with an alkaline developer, the light resistance composition comprises resin and a photosensitizer, the resin contains hydrophilic groups, and the hydrophilic groups enable the light resistance composition to have hydrophilicity;
the molecular structural formula of the resin is as follows:
at least one of R1 and R2 comprises the hydrophilic group, n is a positive integer, and R1 comprises at least one of a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, an amino group, a quaternary ammonium group, an ether group, a carboxylic ester and a block polyether;
the molecular structural formula of the photosensitizer is as follows:
wherein at least one of R3 and R4 comprises the hydrophilic group.
5. The display panel according to claim 4, wherein the hydrophilic group is arranged on a side of the photoresist composition adjacent to the hydrophilic substance under heating.
6. The display panel of claim 4, wherein the photoresist composition further comprises a surfactant and a solvent.
7. A method for manufacturing a display panel, comprising:
providing a resin, a photosensitizer,The resin is used for reacting with an alkaline developer, the resin contains hydrophilic groups, the hydrophilic groups have hydrophilicity, and the molecular structural formula of the resin is as follows:
at least one of R1 and R2 comprises the hydrophilic group, n is a positive integer, R1 comprises at least one of a carboxylic acid group, a sulfonic acid group, a phosphoric acid group, an amino group, a quaternary ammonium group, an ether group, a carboxylic ester and a block polyether, and the molecular structural formula of the photosensitizer is as follows:
wherein at least one of R3 and R4 comprises the hydrophilic group;
mixing the resin, the photosensitizer, the surfactant and the solvent to form a solution;
coating the solution on the surface of a substrate to form a photoresist film;
baking the photoresist film so that hydrophilic groups in the resin are arranged on the side of the photoresist film close to the substrate to improve the adhesion between the photoresist film and the substrate;
and developing the photoresist film to form a photoresist layer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910375030.3A CN110032041B (en) | 2019-05-07 | 2019-05-07 | Photoresist composition, display panel and preparation method thereof |
| PCT/CN2019/099339 WO2020224071A1 (en) | 2019-05-07 | 2019-08-06 | Photoresist composition, display panel and preparation method therefor |
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| CN201910375030.3A CN110032041B (en) | 2019-05-07 | 2019-05-07 | Photoresist composition, display panel and preparation method thereof |
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| CN110032041B (en) * | 2019-05-07 | 2020-11-10 | 深圳市华星光电半导体显示技术有限公司 | Photoresist composition, display panel and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85104885A (en) * | 1985-06-22 | 1986-12-17 | 上海交通大学 | The manufacture method of photosensitive printing glue |
| CN1127763A (en) * | 1994-08-25 | 1996-07-31 | 三井东压化学株式会社 | Aromatic hydroxycarboxylic acid resins and their use |
| US5998095A (en) * | 1997-08-12 | 1999-12-07 | Fuji Photo Film Co., Ltd. | Negative-working photosensitive material |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3474719A (en) * | 1966-04-15 | 1969-10-28 | Gaf Corp | Offset printing plates |
| JPS5988734A (en) * | 1982-11-12 | 1984-05-22 | Fuji Photo Film Co Ltd | Photosensitive composition |
| JPS62175729A (en) * | 1986-01-30 | 1987-08-01 | Fuji Photo Film Co Ltd | Photosensitive composition |
| JPS62191848A (en) * | 1986-02-17 | 1987-08-22 | Nec Corp | Positive resist material |
| JPH09160233A (en) * | 1995-11-17 | 1997-06-20 | Hoechst Ag | Radiation-sensitive recording material for manufacture of planographic printing plate |
| JP2000162764A (en) * | 1998-12-01 | 2000-06-16 | Dainippon Ink & Chem Inc | Photosensitive material for positive lithographic printing plate and method for forming printing plate by using same |
| JP2011248274A (en) * | 2010-05-31 | 2011-12-08 | Sanyo Chem Ind Ltd | Photosensitive resin composition |
| CN102199282A (en) * | 2011-03-07 | 2011-09-28 | 华映视讯（吴江）有限公司 | Hydrophilic monomer, hydrophilic photoresist composition, and formation method for resist pattern |
| WO2014192671A1 (en) * | 2013-05-30 | 2014-12-04 | 三洋化成工業株式会社 | Photosensitive resin composition, photospacer, protective film for color filters, and protective film or insulating film of touch panel |
| CN108329446B (en) * | 2017-01-20 | 2019-07-05 | 中国科学院化学研究所 | Phenolic resin is esterified sulfonate and its synthetic method, printing hydrophilic version and application and galley |
| CN110032041B (en) * | 2019-05-07 | 2020-11-10 | 深圳市华星光电半导体显示技术有限公司 | Photoresist composition, display panel and preparation method thereof |
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- 2019-05-07 CN CN201910375030.3A patent/CN110032041B/en active Active
- 2019-08-06 WO PCT/CN2019/099339 patent/WO2020224071A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85104885A (en) * | 1985-06-22 | 1986-12-17 | 上海交通大学 | The manufacture method of photosensitive printing glue |
| CN1127763A (en) * | 1994-08-25 | 1996-07-31 | 三井东压化学株式会社 | Aromatic hydroxycarboxylic acid resins and their use |
| US5998095A (en) * | 1997-08-12 | 1999-12-07 | Fuji Photo Film Co., Ltd. | Negative-working photosensitive material |
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| WO2020224071A1 (en) | 2020-11-12 |
| CN110032041A (en) | 2019-07-19 |
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