CN113867108A - Method for double-sided patterning based on optical transparent substrate - Google Patents
Method for double-sided patterning based on optical transparent substrate Download PDFInfo
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- CN113867108A CN113867108A CN202111114879.9A CN202111114879A CN113867108A CN 113867108 A CN113867108 A CN 113867108A CN 202111114879 A CN202111114879 A CN 202111114879A CN 113867108 A CN113867108 A CN 113867108A
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
- G03F7/2032—Simultaneous exposure of the front side and the backside
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Laminated Bodies (AREA)
- Materials For Photolithography (AREA)
Abstract
The invention provides a method for double-sided patterning based on an optically transparent substrate, which is characterized by comprising the following steps of: (1) providing an optically transparent substrate having a UV blocking function; (2) coating photoresist on two surfaces of the optical transparent substrate; and (3) exposing and developing the optically transparent substrate coated with the photoresist material under the irradiation of UV light to obtain a double-sided patterned optically transparent substrate. The method for double-sided patterning based on the optical transparent substrate can avoid photochemical reaction of a light resistance material on the other side of the substrate caused by UV light irradiated from one side of the substrate, and then realizes double-sided patterning by one-time exposure; and the used base materials are roll-to-roll production materials, and the coating of the photoresist material, the exposure of the material and the subsequent processes can be roll-to-roll, so that the process is completed once, the production efficiency is obviously improved, and the production cost is obviously reduced.
Description
Technical Field
The invention belongs to the field of photoetching patterning, and particularly relates to a method for carrying out double-sided patterning on the basis of an optical transparent substrate.
Background
Patterning of photosensitive materials is achieved by photolithographic techniques, which have been widely used in the electronics and microelectronics fields, especially in the electronics industry printed circuit boards and chips, and which have been practiced for decades. In a photolithographic process, a photosensitive material, commonly referred to as a photoresist, is selectively exposed to actinic radiation (typically ultraviolet, visible, infrared, or combinations thereof) that changes the solubility of the photosensitive glue, (light insoluble-negative glue; light soluble-positive glue), and then the exposed or unexposed areas of the photosensitive material are removed with a solvent or developing medium. In the above process, the area pattern not removed by the developer can be used as a protective barrier, and can be used to protect the area under the pattern from chemical or physical attack in the subsequent wet or dry process.
For example, after a photoresist is coated on a copper-clad epoxy glass plate and developed by photolithography, an exposed copper layer is etched away, copper under a pattern protection region formed after exposure is not affected by an etching solution, and then the photoresist on the copper surface is removed to obtain a desired copper pattern. The photolithographic process can also be used for patterning devices on transparent substrates, which is particularly common in the fields of information display and human-computer interface, and the electrodes obtained by patterning the surfaces of glass with an optical transparent material ITO through the photolithographic technique can be used for preparing capacitive touch cells for application in display equipment on which a user can directly perform interactive operation with patterns displayed on a screen.
In the field of printed circuit boards, it is common to produce multilayer structures by coating a photoresist material on both sides of a copper-clad epoxy glass, and then patterning both sides simultaneously. The simultaneous exposure process on both sides can reduce the number and complexity of process steps, and is economically and technically advantageous. The key to double-sided patterning here is that the copper layer is opaque and the top exposure light does not affect the bottom photoresist coating and vice versa.
Simultaneous double-sided photolithography on optically transparent substrates is not feasible in display, touch screen, solar cell and lighting applications because the transparency of the substrate means that light can also pass through the substrate to affect the photoresist on one side of the substrate when the other side is exposed, in the sense that the patterns on both sides of the substrate always interfere and the target pattern is not obtained. Thus, these devices are typically composed of several substrates stacked together, with only one patterned layer on each substrate; or the etching process is carried out after two or more repeated exposure and development, the scheme is only suitable for negative photoresist and can not be applied to positive photoresist, because the positive photoresist is still influenced by the light transmitted by the other surface in the second exposure stage.
Disclosure of Invention
The invention aims to overcome the defect that the double-sided patterning method in the prior art is generally used for an opaque material copper layer, and the double-sided photoetching is difficult to perform on an optically transparent substrate at the same time, and provides a method capable of performing double-sided patterning on the surface of the optically transparent substrate at the same time.
In one aspect, the present invention provides a method for double-sided patterning on an optically transparent substrate, comprising the steps of:
(1) providing an optically transparent substrate having a UV blocking function;
(2) coating photoresist on two surfaces of the optical transparent substrate; and
(3) exposing the optical transparent substrate coated with the photoresist material under the irradiation of UV light and developing to obtain the double-sided patterned optical transparent substrate.
In one embodiment, the optically transparent substrate is comprised of one or more layers, including at least a base layer, and optionally, other layers that modify the surface properties of the base layer.
In one embodiment, the base layer of the optically transparent substrate is made of at least one of polyethylene terephthalate (PET), transparent polyimide (CPI), cyclo-olefin polymer (COP, which may be particularly a cyclo-olefin copolymer (COC)), Super Retarder Film (SRF), Polycarbonate (PC), and polyethylene naphthalate (PEN).
In one embodiment, the surface property is selected from at least one of adhesion, surface tension, and chemical resistance.
In one embodiment, the UV blocking function of the optically transparent substrate is provided by adding a UV blocking material during the production of the optically transparent substrate; or by disposing a UV-blocking coating on one or more layers in the optically transparent substrate.
In one embodiment, the optically transparent substrate is planar, preferably in the form of a plate, sheet or film.
In one embodiment, the optically transparent substrate may be a polarizer, preferably present in a linear or elliptical shape.
In one embodiment, the photoresist material applied on the two surfaces is independently selected from the same or different positive or negative photoresist materials.
In one embodiment, the photoresist material is matched to different exposure energies based on the blocking of the optically transparent substrate at the target exposure wavelength.
In one embodiment, the UV light has a wavelength below 400 nm.
In one embodiment, the optically transparent substrate has a transmittance of 10% or less, preferably 2% or less, at the wavelength of the UV light.
In another aspect, the invention also provides a visual display manufactured by the method as described above.
In another aspect, the invention also provides a touch screen, in particular a capacitive touch screen, which is manufactured based on the method as described above.
Compared with the prior art, the technical scheme of the invention at least comprises the following advantages:
(1) by selecting a proper base material, a light resistance material and exposure parameters to be matched, the photo resistance material on the other side of the base material can be prevented from generating photochemical reaction due to the UV light irradiated from one side of the base material, and then one-time exposure is realized to realize double-sided patterning, so that the process flow is greatly simplified compared with the processes of multiple development and multiple exposure in the prior art;
(2) the used base materials are roll-to-roll production materials, and the coating of the photoresist material, the exposure of the material and the subsequent processes (according to different products, the processes can comprise etching, evaporation, electroplating and chemical plating) can be roll-to-roll and are completed by one process, so that the production efficiency is obviously improved, the production cost is obviously reduced due to the reduction of the manufacturing process, and the production efficiency is improved;
(3) double-layer patterns can be obtained on a single-layer transparent substrate, and based on the double-layer patterns, a double-sided metal touch grid can be obtained by combining a single-layer wet method and a dry method metal grid preparation process, compared with the conventional single-layer pattern product, the capacitive touch screen can realize the function of the capacitive touch screen by one layer of film material of the product, so that the overall thickness of the touch screen is greatly reduced, and the market acceptance is high; and
(4) the selected base materials are wide in range, and products with specific functions can be obtained by selecting different base materials, such as a touch screen which realizes flexibility and high permeability, eliminates the characteristic of color stripes, can be bent and can replace a polaroid.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
fig. 1 shows a schematic diagram of simultaneous patterning on both sides of an optically transparent substrate according to an embodiment of the present invention.
Fig. 2 shows an enlarged view under a microscope of a pattern formed according to example 1 of the present invention.
Fig. 3 shows an enlarged view under a microscope of a pattern formed according to comparative example 1 of the present invention.
Detailed Description
The following describes in detail specific embodiments of the present invention. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
The endpoints of the ranges and any values disclosed herein are not limited to the precise range or value, and such ranges or values should be understood to encompass values close to those ranges or values. For ranges of values, between the endpoints of each of the ranges and the individual points, and between the individual points may be combined with each other to give one or more new ranges of values, and these ranges of values should be considered as specifically disclosed herein.
It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present invention.
Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
In one aspect, the present invention provides a method for double-sided patterning on an optically transparent substrate, comprising the steps of:
(1) providing an optically transparent substrate having a UV blocking function;
(2) coating photoresist on two surfaces of the optical transparent substrate; and
(3) exposing the optical transparent substrate coated with the photoresist material under the irradiation of UV light and developing to obtain the double-sided patterned optical transparent substrate.
For step (1), the term "optically transparent substrate" as used herein refers to a substrate having high transparency, meaning that the substrate is transparent to all or part of the visible spectrum of illumination radiation (typically from 380nm to 720 nm); or the light can transmit full spectrum light mixed by red, yellow and blue with different proportions, and the lowest wavelength in the system can extend to about 420 nm. In both systems, the substrate need not transmit light shorter than the lowest wavelength to exhibit transparency. That is, the optically transparent substrate of the present invention can achieve an optically transparent effect as long as it can transmit all or part of the visible spectrum illumination radiation.
The optically transparent substrate according to the present invention is not necessarily unitary in its constituent structure and may consist of one or more layers, which may include at least a base layer and, optionally, other layers that modify the surface properties of the base layer.
The material of the base layer is not particularly limited by the present invention and may be made of various materials commonly used in the art as long as the materials can have optical transparency in the visible spectrum or in one or more narrow-band spectrums. For example, in one embodiment of the present invention, the base layer of the optically transparent substrate may be made of at least one of polyethylene terephthalate (PET), transparent polyimide (CPI), cyclic olefin polymer (COP, which may be particularly Cyclic Olefin Copolymer (COC)), Super Retarder Film (SRF), Polycarbonate (PC), and polyethylene naphthalate (PEN).
As for the other layers modifying the surface properties of the base layer described above, which may be selected from at least one of adhesion, surface tension and chemical resistance properties, the selection and judgment of the actual requirements of the surface properties may be made freely by those skilled in the art, and accordingly, these other layers may be provided as layers modifying or improving the surface properties such as adhesion, surface tension and chemical resistance properties.
In addition, as described above, the optically transparent substrate provided by the present invention is an optically transparent substrate having a UV blocking function, and the purpose thereof is to make the optically transparent substrate have a low transmittance at a target exposure wavelength (which may be a UV wavelength band, for example, a UV wavelength band of less than 400 nm), specifically, the transmittance may be 10% or less (for example, 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, etc.), preferably 2% or less (for example, 0.1%, 0.5%, 1%, 2%, etc.), wherein the substrate transmittance is measured according to ASTM D1003 standard using a Lambda 850+ UV-vis spectrophotometer.
This "opaque" nature in the lower wavelength band may limit the transmission of light at one or more wavelengths to which the substrate is sensitive to the photoresist material applied to the upper and lower surfaces. In one embodiment of the present invention, the UV blocking function of the optically transparent substrate may be achieved by adding a UV blocking material during the production of the optically transparent substrate; or by providing a UV-blocking coating on one or more layers (e.g., a base layer) in the optically transparent substrate.
In addition, as the shape of the optically transparent substrate of the present invention, a planar optically transparent substrate may be used, and for example, the optically transparent substrate may be present in the form of a plate, a sheet or a film. In addition, the optically transparent substrate of the present invention may also be a polarizer (linear or elliptical), so that the use of an appropriate polarized light prevents light from transmitting through the substrate, thereby preventing the UV light irradiated from one side of the substrate from causing the photo-chemical reaction of the photo-resist on the other side of the substrate, and preventing the UV light irradiated from one side of the substrate from causing the photo-chemical reaction of the photo-resist on the other side of the substrate. The product can be directly used in a liquid crystal display needing a polarizer, and simultaneously meets the requirements of the liquid crystal display needing the polarizer and a touch unit, thereby reducing the thickness and the weight of equipment.
Further, the optically transparent substrate of the present invention may suitably comprise one or more types of additives. As the additive, for example, the additive may be a UV absorber, an antioxidant, a lubricant, a plasticizer, a mold release agent, an anti-coloring agent, a flame retardant, a surfactant, an antistatic agent, a pigment, a coloring agent, and the like.
Further, the thickness of the optically transparent substrate of the present invention may be appropriately determined, however, in general, the thickness may be determined to be between 1 μm and 500 μm in consideration of the strength, workability and thin layer properties thereof. In particular, a value between 1 μm and 300 μm is preferred, and a value between 5 μm and 200 μm is more preferred.
As used herein with respect to step (2), the term "photoresist" refers to a material that undergoes a photochemical reaction upon exposure to one or more specific wavelengths of actinic radiation to cause a chemical or physical change, the photochemical reaction typically resulting in a change in the molecular weight of the photoresist, i.e., a change in solubility in a particular developer, and the reaction occurring at a certain rate. The current process usually uses two or more repeated exposures and development followed by an etching process to pattern both sides of the substrate, but this solution is only applicable to negative resists and not to positive resists, because the positive resist is still affected by the light transmitted through the other side during the second exposure.
However, the double-sided patterning method of the present invention is not affected by the properties of the photoresist, and a positive photoresist or a negative photoresist may be arbitrarily used as required. In one embodiment of the present invention, the photoresist material coated on the two surfaces may be independently selected from the same or different positive photoresist material or negative photoresist material.
The resist composition of the present invention may contain a photoinitiator (also referred to as a sensitizer or a photosensitizer), and the resist composition may be polymerized at different wavelengths depending on the photoinitiator. Further, the kind of the photoinitiator of the present invention is not particularly limited, and may be a photoinitiator commonly used in the art. In one embodiment, the photoinitiator may be at least one selected from the group consisting of acetophenone-based compounds, benzophenone-based compounds, triazine-based compounds, thioxanthone-based compounds, and oxime-based compounds. Specific examples of the acetophenone-based compound may include 2-hydroxy-2-methyl-1-phenylpropan-1-one, diethoxyacetophenone, 2- (4-methylbenzyl) -2- (dimethylamino) -1- (4-morpholinophenyl) butan-1-one and the like. Specific examples of the benzophenone-based compound may include benzophenone, methyl o-benzoylbenzoate, 4-benzoyl-4' -methyl diphenyl sulfide, 2,4, 6-trimethylbenzophenone, and the like. Specific examples of the triazine-based compound may include 2, 4-bis (trichloromethyl) -6- (4-methoxyphenyl) -1,3, 5-triazine, 2, 4-bis (trichloromethyl) -6- (4-methoxynaphthyl) -1,3, 5-triazine, 2, 4-bis (trichloromethyl) -6- [2- (3, 4-dimethoxyphenyl) vinyl ] -1,3, 5-triazine, and 2, 4-bis (trichloromethyl) -6-2- (4-diethylamino-2-methylphenyl) vinyl ] -1,3, 5-triazine and the like. Specific examples of the thioxanthone-based compound may include 2-isopropylthioxanthone, 2, 4-diethylthioxanthone, 2, 4-dichlorothioxanthone, 1-chloro-4-propoxythioxanthone, and the like. Specific examples of the oxime ester compounds may include o-ethoxycarbonyl- α -oxyimino-1-phenylpropan-1-one, 1, 2-octanedione, 1- (4-phenylthio) phenyl, 2- (o-benzoyloxime), and the like.
In the step (3), after the optically transparent substrate coated with the photoresist material is exposed to the UV light, since the optically transparent substrate of the present invention has a UV blocking function, it is possible to prevent the photo-resist material on the other side of the substrate from undergoing a photochemical reaction due to the UV light irradiated from one side of the substrate, and the photo-resist material on the other side of the substrate from undergoing a photochemical reaction due to the UV light irradiated from one side of the substrate, thereby achieving simultaneous double-sided lithography. In addition, according to actual needs, appropriate process parameters such as exposure energy, exposure intensity, exposure time and the like can be comprehensively evaluated. In particular, the photoresist material can be matched to different exposure energies (e.g., 3-300 mJ/cm) depending on the blocking of the optically transparent substrate at the target exposure wavelength2)。
After exposure, the soluble photoresist coating is typically removed from the upper and lower surfaces of the substrate selectively, using a developer solution to develop, leaving a pattern of insoluble photoresist material, the pattern of both the upper and lower surfaces typically being non-uniform. The obtained photoresist pattern can play different roles in different process schemes, for example, the photoresist pattern can be used as an etching mask to protect a bottom layer material from being influenced by dry etching or wet etching; masks may also be formed to prevent subsequent material deposition on the underlying material (e.g., by metal evaporation or electroplating); or a template may be formed on which subsequent layers are formed (e.g., electroless plating which may be initiated by a catalyst such as electroless palladium or platinum).
Fig. 1 shows a schematic diagram of simultaneous patterning on both sides of an optically transparent substrate according to an embodiment of the present invention.
In another aspect, the invention also provides a visual display manufactured by the method as described above.
In another aspect, the present invention also provides a touch screen, in particular a capacitive touch screen, which is manufactured by the method as described above.
In summary, the method for double-sided patterning based on the optically transparent substrate provided by the invention can avoid photochemical reaction caused by the curing of the photoresist material on the other side of the substrate due to the UV light irradiated from one side of the substrate by selecting the appropriate substrate, photoresist material and exposure parameters to match, and then realize one-time exposure to realize double-sided patterning; and the used base materials are roll-to-roll production materials, and the coating of the photoresist material, the exposure of the material and the subsequent processes can be roll-to-roll, so that the process is completed once, the production efficiency is obviously improved, the production cost is obviously reduced due to the reduction of the manufacturing process, and the production efficiency is improved. In addition, the product obtained by the double-sided patterning method obtains double-layer patterns on the single-layer transparent base material, so that compared with the conventional single-layer pattern product, the whole thickness of the touch screen is greatly reduced, and the market acceptance is high.
The preferred embodiments of the present invention have been described in detail, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
The technical solutions in the embodiments of the present invention are described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
Examples
Example 1
The transmittance at 365nm wavelength of the transparent substrate 1 is less than 2.4% by using an ultraviolet-visible spectrophotometer. Coating 800nm photoresist material on the upper and lower surfaces of the substrate simultaneously by roll-to-roll wet coating, and baking in an oven at 80 ℃ for 30s to form the base film 1A, wherein the photoresist material is a negative photoresist which has a specific reaction rate at a 365nm wavelength.
Taking a base film 1A, coating the upper layer and the lower layer of the base film 1A with a catalyst containing palladium metal by a roll-to-roll wet method, wherein the dosage of the catalyst is about 1.6g/m2And baking the substrate in an oven at 80 ℃ for 30s, taking the water-soluble protective coating, coating the 500nm protective coating on the surfaces of the upper and lower catalyst layers by a wet method, and baking the substrate in the oven at 80 ℃ for 20s to form the protective coating with the water and oxygen isolating function to prepare the base film 1B.
The obtained base film 1B was subjected to contact double-side exposure using masks of different patterns on both sides in an ultraviolet exposure machine having a wavelength of 365nm at an exposure energy of 50mJ/cm2To obtain the base film 1C having partial region curing.
The obtained base film 1C was developed to remove uncured regions, and a substrate having double-sided patterning was obtained. The resulting substrate pattern is shown under a microscope in FIG. 2, where the pattern on each side is the same as the mask pattern that is in contact with and does not interfere with each other. And chemically plating copper in a copper plating solution based on the developed substrate to form a copper layer on the area with the pattern, so as to obtain the capacitive touch grid with the conductive layer on the two sides.
Comparative example 1
The transparent substrate 2 was taken and tested to have a transmittance of > 12% at a wavelength of 314nm using an ultraviolet-visible spectrophotometer. The base film 2A is formed by roll-to-roll, wet coating while coating 650nm photoresist material on both upper and lower surfaces of the base material, and baking in an oven at 80 ℃ for 60s, wherein the photoresist material is a negative photoresist having a specific reaction rate at a wavelength of 314 nm.
Taking a base film 2A, coating the upper layer and the lower layer of the base film 2A simultaneously by a roll-to-roll wet methodPalladium metal catalyst in an amount of about 1.4g/m2And baking the substrate in an oven at 80 ℃ for 30s, taking the water-soluble protective coating, coating the 500nm protective coating on the surfaces of the upper and lower catalyst layers by a wet method, and baking the substrate in the oven at 80 ℃ for 20s to form the protective coating with the function of isolating water and oxygen to prepare the base film 2B.
The obtained base film 2B was subjected to contact double-side exposure with exposure energy of 7mJ/cm using masks of different patterns on both sides in an ultraviolet exposure machine having a wavelength of 314nm2To obtain a base film 2C having partial area curing.
The obtained base film 2C was developed to remove uncured regions, and a substrate having double-sided patterning was obtained. The pattern of the resulting substrate was microscopically as shown in fig. 3, and the patterns on both sides were mutually influenced, i.e., during the simultaneous exposure on both sides, uv light from one side was irradiated through the substrate to the other side, and the photoresist material in the corresponding region was cured, so that both the upper and lower sides of the substrate had the patterns of two masks. Based on the developed substrate, electroless copper plating can be carried out in a copper plating solution, a copper layer is formed on the area with the patterns, and a sample with two patterns on two sides is obtained, but the function of the capacitive touch screen cannot be realized.
The preferred embodiments of the present invention have been described in detail, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
Claims (13)
1. A method for double-sided patterning on the basis of an optically transparent substrate, comprising the steps of:
(1) providing an optically transparent substrate having a UV blocking function;
(2) coating photoresist on two surfaces of the optical transparent substrate; and
(3) exposing the optical transparent substrate coated with the photoresist material under the irradiation of UV light and developing to obtain the double-sided patterned optical transparent substrate.
2. The method of claim 1, wherein the optically transparent substrate is comprised of one or more layers including at least a base layer and, optionally, other layers that modify the surface properties of the base layer.
3. The method of claim 2, wherein the base layer of the optically transparent substrate is made of at least one of polyethylene terephthalate (PET), transparent polyimide (CPI), cyclic olefin polymer (COP, which may be particularly Cyclic Olefin Copolymer (COC)), Super Retarder Film (SRF), Polycarbonate (PC) and polyethylene naphthalate (PEN).
4. The method of claim 2, wherein the surface property is selected from at least one of adhesion, surface tension, and chemical resistance.
5. The method of claim 2, wherein the UV blocking function of the optically transparent substrate is achieved by adding a UV blocking material during the production of the optically transparent substrate; or by disposing a UV-blocking coating on one or more layers in the optically transparent substrate.
6. The method according to claim 1, wherein the optically transparent substrate is planar, preferably in the form of a plate, sheet or film.
7. The method according to claim 1, wherein the optically transparent substrate is a polarizer, preferably present in a linear or elliptical shape.
8. The method of claim 1, wherein the photoresist material applied on the two surfaces is independently selected from the same or different positive or negative photoresist materials.
9. The method of claim 1, wherein the photoresist material is matched to different exposure energies based on the blocking of the optically transparent substrate at a target exposure wavelength.
10. The method of claim 1, wherein the UV light has a wavelength below 400 nm.
11. The method of claim 10, wherein the optically transparent substrate has a transmittance of 10% or less, preferably 2% or less, at the wavelength of the UV light.
12. A visual display manufactured by the method of any one of claims 1-11.
13. Touch screen, in particular capacitive touch screen, manufactured on the basis of a method according to any one of claims 1-11.
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| CN202111114879.9A CN113867108A (en) | 2021-09-23 | 2021-09-23 | Method for double-sided patterning based on optical transparent substrate |
| PCT/CN2022/113509 WO2023045648A1 (en) | 2021-09-23 | 2022-08-19 | Method for performing double-sided patterning on basis of optically transparent substrate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115524940A (en) * | 2022-09-20 | 2022-12-27 | 浙江鑫柔科技有限公司 | Touch screen and forming method thereof |
| WO2023045648A1 (en) * | 2021-09-23 | 2023-03-30 | 浙江鑫柔科技有限公司 | Method for performing double-sided patterning on basis of optically transparent substrate |
| WO2023174414A1 (en) * | 2022-03-18 | 2023-09-21 | 浙江鑫柔科技有限公司 | New asymmetric ultraviolet exposure method |
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| CN117250783B (en) * | 2023-10-26 | 2024-06-11 | 湖北欧雷登显示科技有限公司 | Integrated forming production process and application of liquid crystal display module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101533325A (en) * | 2007-01-03 | 2009-09-16 | 苹果公司 | Double-sided touch sensitive panel and flex circuit bonding |
| TW201007363A (en) * | 2008-08-15 | 2010-02-16 | Wen Wang | The film structures and fabricating methods of which with two-side coatings and followed two-side photoresist coatings, and the patterned coatings made from above film structures |
| CN101726888A (en) * | 2008-10-27 | 2010-06-09 | 宸鸿光电科技股份有限公司 | Fabricating method of touch circuit two-sided graph structure |
| CN103502890A (en) * | 2011-03-18 | 2014-01-08 | 传导喷墨技术有限公司 | Photopatternable structure containing substrate with two-side photoresist coatings |
| CN110998457A (en) * | 2017-07-28 | 2020-04-10 | 富士胶片株式会社 | Pattern forming method, laminate, and touch panel manufacturing method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5532105A (en) * | 1992-08-07 | 1996-07-02 | Hitachi Chemical Company, Ltd. | Photolithographically viahole-forming photosensitive element comprising two photosensitive layers for the fabrication process of multilayer wiring board |
| CN102541368A (en) * | 2011-03-14 | 2012-07-04 | 烟台正海电子网板股份有限公司 | Capacitive touch panel and manufacturing method thereof |
| CN113867108A (en) * | 2021-09-23 | 2021-12-31 | 浙江鑫柔科技有限公司 | Method for double-sided patterning based on optical transparent substrate |
-
2021
- 2021-09-23 CN CN202111114879.9A patent/CN113867108A/en active Pending
-
2022
- 2022-08-19 WO PCT/CN2022/113509 patent/WO2023045648A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101533325A (en) * | 2007-01-03 | 2009-09-16 | 苹果公司 | Double-sided touch sensitive panel and flex circuit bonding |
| TW201007363A (en) * | 2008-08-15 | 2010-02-16 | Wen Wang | The film structures and fabricating methods of which with two-side coatings and followed two-side photoresist coatings, and the patterned coatings made from above film structures |
| CN101726888A (en) * | 2008-10-27 | 2010-06-09 | 宸鸿光电科技股份有限公司 | Fabricating method of touch circuit two-sided graph structure |
| CN103502890A (en) * | 2011-03-18 | 2014-01-08 | 传导喷墨技术有限公司 | Photopatternable structure containing substrate with two-side photoresist coatings |
| CN110998457A (en) * | 2017-07-28 | 2020-04-10 | 富士胶片株式会社 | Pattern forming method, laminate, and touch panel manufacturing method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023045648A1 (en) * | 2021-09-23 | 2023-03-30 | 浙江鑫柔科技有限公司 | Method for performing double-sided patterning on basis of optically transparent substrate |
| WO2023174414A1 (en) * | 2022-03-18 | 2023-09-21 | 浙江鑫柔科技有限公司 | New asymmetric ultraviolet exposure method |
| CN115524940A (en) * | 2022-09-20 | 2022-12-27 | 浙江鑫柔科技有限公司 | Touch screen and forming method thereof |
| CN115524940B (en) * | 2022-09-20 | 2024-03-12 | 浙江鑫柔科技有限公司 | Touch screen and forming method thereof |
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