TWI675744B - "electrically-conductive articles with protective polymeric coatings, method for providing the same, and electronic device comprising the same" - Google Patents

"electrically-conductive articles with protective polymeric coatings, method for providing the same, and electronic device comprising the same" Download PDF

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TWI675744B
TWI675744B TW105101925A TW105101925A TWI675744B TW I675744 B TWI675744 B TW I675744B TW 105101925 A TW105101925 A TW 105101925A TW 105101925 A TW105101925 A TW 105101925A TW I675744 B TWI675744 B TW I675744B
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conductive
pattern
support side
photo
dry
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TW105101925A
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TW201630718A (en
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馬可斯 史帝芬 伯梅爾
Marcus Stephen Bermel
麗莎 貝斯特 陶德
Lisa Baxter Todd
琳達 梅 富蘭克林
Linda Mae Franklin
湯瑪斯 亨利 梅里
Thomas Henry Mourey
考特蘭 克莉絲汀 喬安 藍卓
Christine Joanne Landry-Coltrain
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美商柯達公司
Eastman Kodak Company
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Priority claimed from US14/602,500 external-priority patent/US9650716B2/en
Priority claimed from US14/602,372 external-priority patent/US9545025B2/en
Priority claimed from US14/602,509 external-priority patent/US9557841B2/en
Priority claimed from US14/602,384 external-priority patent/US9516760B2/en
Application filed by 美商柯達公司, Eastman Kodak Company filed Critical 美商柯達公司
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Abstract

本發明係關於一種物件,其包括具有第一支撐側及相對第二支撐側之透明基板。導電圖案佈置於至少該第一支撐側上。乾燥最外聚合物塗層佈置於至少一部分但非全部該導電圖案上,該乾燥最外聚合物塗層具有小於5μm之乾燥厚度、至少80%之積分透射率且包括玻璃轉變溫度(Tg)等於或大於65℃之非交聯熱塑性聚合物。可製備該等物件且納入各種電子器件中。 The invention relates to an object, which includes a transparent substrate having a first supporting side and an opposite second supporting side. A conductive pattern is arranged on at least the first support side. The dried outermost polymer coating is disposed on at least a portion but not all of the conductive pattern. The dried outermost polymer coating has a dry thickness of less than 5 μm, an integrated transmittance of at least 80%, and includes a glass transition temperature (T g ). Non-crosslinked thermoplastic polymer equal to or greater than 65 ° C. Such articles can be prepared and incorporated into various electronic devices.

Description

具有保護性聚合物塗層之導電物件、提供其之方法及包含其之電子裝置 Conductive article with protective polymer coating, method for providing the same, and electronic device including the same

本發明係關於導電物件,其包括一或多種通常包含一或多種導電金屬圖案之導電圖案。乾燥聚合物塗層通常佈置於用於各種保護性及著色特徵之至少一部分導電圖案上。可將該等導電物件納入各種電子器件中以(例如)提供觸控螢幕顯示器。 The present invention relates to a conductive object, which includes one or more conductive patterns that generally include one or more conductive metal patterns. The dry polymer coating is typically disposed on at least a portion of the conductive pattern for various protective and coloring features. Such conductive objects can be incorporated into various electronic devices to provide, for example, a touch screen display.

各種電子器件正快速發展,尤其係用於各種通信、金融及檔案目的之顯示器件。對於諸如觸控螢幕板、電致變色器件、發光二極體、場效應電晶體及液晶顯示器等應用而言,導電膜極為重要且在工業中進行大量工作以改良彼等導電膜之性質且尤其改良金屬柵格或線導電性並在遮罩設計與所得使用者金屬圖案之間提供較大一致性。 Various electronic devices are developing rapidly, especially display devices used for various communication, financial and archival purposes. For applications such as touch screen panels, electrochromic devices, light-emitting diodes, field-effect transistors, and liquid crystal displays, conductive films are extremely important and a lot of work has been done in the industry to improve the properties of their conductive films and especially Improves metal grid or line conductivity and provides greater consistency between the mask design and the resulting user metal pattern.

各種電子器件中所使用之導電物件(包含電子、光學、感覺及診斷器件(包含但不限於電話、計算器件及其他顯示器件)中之觸控螢幕)已經設計以對人類指尖或機械記錄針之觸控具有反應。通常,觸控螢幕技術納入使用構成顯示器之一部分之電阻性或電容性感測器層。 Conductive objects used in various electronic devices (including touch screens in electronic, optical, sensory and diagnostic devices (including but not limited to phones, computing devices, and other display devices)) have been designed to work against human fingertips or mechanical recording needles The touch is responsive. Generally, touch screen technology incorporates the use of resistive or capacitive sensor layers that form part of a display.

通常,觸控螢幕技術納入使用構成顯示器之一部分之電阻性或電容性感測器層。需要提供含有改良導電膜元件之觸控螢幕感測器及顯示器。當前,該等電阻性及電容性觸控螢幕顯示器使用氧化銦錫(ITO)塗層來產生用於區分多個接觸點之陣列。在工業中正努力尋找 用於ITO塗層之有用替代者,包含使用各種其他導電金屬組合物。 Generally, touch screen technology incorporates the use of resistive or capacitive sensor layers that form part of a display. There is a need to provide touch screen sensors and displays containing improved conductive film elements. Currently, these resistive and capacitive touch screen displays use an indium tin oxide (ITO) coating to create an array to distinguish multiple contact points. Struggling to find in industry Useful alternatives for ITO coatings include the use of various other conductive metal compositions.

如所論述,因顯示器使用者之直接接觸(觸控)程度有所增加或因環境中之水分或水,觸控螢幕通常易於損害。電阻性及電容性觸控感測器可包含佈置於顯示結構上之半透明(或接近透明)電絕緣覆蓋材料以保護觸控螢幕感測器免受環境條件(例如水分)、磨損、氧及任何有害化學劑影響且使其隔離。 As discussed, touch screens are often susceptible to damage due to increased direct contact (touch) by display users or due to moisture or water in the environment. Resistive and capacitive touch sensors can include translucent (or near-transparent) electrically insulating covering materials placed on the display structure to protect the touch screen sensor from environmental conditions (such as moisture), abrasion, oxygen, and Any harmful chemicals affect and isolate them.

亦需要在製造及整合操作期間保護感測器之導電部分免受環境損害(例如水分)及環境與物理損害影響。 There is also a need to protect the conductive portion of the sensor from environmental damage (such as moisture) and environmental and physical damage during manufacturing and integration operations.

該等電絕緣覆蓋材料包含玻璃或聚酯層作為保護性覆蓋物。該等材料中之每一者具有一定優點及缺點。WO 2013/062630(Petcavich)及WO 2013/063051(Petcavich等人)皆闡述使用含有各種光起始劑及光固化材料之光可固化組合物在觸控感測器(及顯示螢幕)上形成交聯聚合物保護性層。 These electrically insulating covering materials include a glass or polyester layer as a protective covering. Each of these materials has certain advantages and disadvantages. WO 2013/062630 (Petcavich) and WO 2013/063051 (Petcavich et al.) Both describe the use of light-curable compositions containing various light initiators and light-curable materials to form cross-links on touch sensors (and display screens). Protective layer of bipolymer.

美國專利7,569,250(Nelson)闡述將保護性塗層施加至在一個表面上具有導電跡線之撓曲電路上且藉由自包含保護性塗層之輥以逐圖案方式將保護性塗層以實質上液態施加至一個表面上之製程。撓曲電路之多個部分保持暴露(未塗覆)用於連結至電子器件(例如印刷頭總成)。可將保護性塗層施加至撓曲電路之表面上且然後進一步(例如)藉由交聯或熱固化進行處理。 U.S. Patent 7,569,250 (Nelson) describes applying a protective coating to a flex circuit having conductive traces on one surface and applying the protective coating in a The process of applying a liquid to a surface. Parts of the flex circuit remain exposed (uncoated) for attachment to an electronic device (such as a print head assembly). A protective coating may be applied to the surface of the flex circuit and then further processed, for example, by cross-linking or thermal curing.

儘管該等材料可在觸控感測器中提供保護性表面,但期望避免由所需其他處理程序所致之可交聯材料以及與光起始劑或其他可在最終保護性表面中保持化學反應性且可以殘餘物形式保留於保護性塗層中時引起黃化之交聯劑有關之潛在問題。 Although these materials can provide a protective surface in touch sensors, it is desirable to avoid cross-linkable materials caused by other required processing procedures, as well as with photoinitiators or other chemicals that can remain in the final protective surface Potential problems with crosslinkers that are reactive and can cause yellowing when left in the protective coating as a protective coating.

另外,用於製備保護性塗層之光固化操作中所使用之殘餘光起始劑可引起黏著及收縮問題,此至少一部分地係由於其低分子量、高流動性及(同樣)高初始濃度,從而在光固化之後之殘餘濃度可高達最 終保護性覆層重量之15%。在使用印刷方法(例如柔版印刷術)以高固化及印刷速度施加至導電圖案之光可固化組合物中,該等問題可尤其明顯。 In addition, residual photoinitiators used in photocuring operations for the preparation of protective coatings can cause adhesion and shrinkage problems, at least in part due to their low molecular weight, high flowability, and (again) high initial concentration, Therefore, the residual concentration after photocuring can be as high as 15% by weight of the final protective coating. These problems can be particularly noticeable in photocurable compositions that are applied to conductive patterns at high cure and printing speeds using printing methods such as flexography.

因此,需要改良導電圖案之保護(尤其在存在高濃度之光固化光起始劑時),從而將黃化及其他問題最小化。 Therefore, there is a need to improve the protection of conductive patterns (especially in the presence of high concentrations of light-curable photoinitiators), thereby minimizing yellowing and other problems.

本發明提供一種物件,其包括:透明基板,其具有第一支撐側及相對第二支撐側;佈置於至少第一支撐側上之導電圖案,及乾燥最外聚合物塗層,其佈置於至少一部分但非全部該導電圖案上,該乾燥最外聚合物塗層具有小於5μm之乾燥厚度、至少80%之積分透射率且包括玻璃轉變溫度(Tg)等於或大於65℃之非交聯熱塑性聚合物。 The invention provides an object, comprising: a transparent substrate having a first supporting side and an opposite second supporting side; a conductive pattern arranged on at least the first supporting side, and a dry outermost polymer coating arranged on at least On some but not all of the conductive pattern, the dried outermost polymer coating has a dry thickness of less than 5 μm, an integrated transmittance of at least 80%, and includes a non-crosslinked thermoplastic having a glass transition temperature (T g ) equal to or greater than 65 ° C. polymer.

在一些實施例中,本發明物件進一步包括:佈置於透明基板之相對第二支撐側上之導電圖案,及乾燥最外聚合物層,其佈置於透明基板中相對第二支撐側上之至少一部分但非全部該導電圖案上,此乾燥聚合物塗層具有小於5μm之乾燥厚度、至少80%之積分透射率且包括玻璃轉變溫度(Tg)等於或大於65℃之非交聯熱塑性聚合物。 In some embodiments, the article of the present invention further comprises: a conductive pattern disposed on the opposite second support side of the transparent substrate, and a dry outermost polymer layer disposed on at least a portion of the transparent substrate on the opposite second support side But not all of the conductive patterns, the dried polymer coating has a dry thickness of less than 5 μm, an integrated transmittance of at least 80%, and includes a non-crosslinked thermoplastic polymer having a glass transition temperature (T g ) equal to or greater than 65 ° C.

舉例而言,作為導電物件之物件可具有係連續透明聚合物網片之透明基板,且該物件可包括佈置於連續透明聚合物網片中第一支撐側之至少第一部分及相對第二支撐側之至少第一部分上之相同或不同導電圖案。 For example, an object as a conductive object may have a transparent substrate that is a continuous transparent polymer mesh, and the object may include at least a first portion and a second opposite support side disposed on the first transparent side of the continuous transparent polymer mesh. The same or different conductive patterns on at least the first portion.

此外,在本發明之一些其他實施例中,連續透明聚合物網片包括:位於第一支撐側上之多個部分及位於相對第二支撐側上之多個 部分;分別佈置於透明基板中第一支撐側及相對第二支撐側之多個部分上之相同或不同導電圖案;及乾燥最外聚合物塗層,其佈置於至少一部分但非全部每一導電圖案上。 In addition, in some other embodiments of the present invention, the continuous transparent polymer mesh includes: a plurality of portions on the first support side and a plurality of portions on the second support side Part; the same or different conductive patterns respectively arranged on the first support side and a plurality of parts opposite to the second support side in the transparent substrate; and a dry outermost polymer coating arranged on at least a part but not all of each conductive On the pattern.

本發明提供諸多優點。因乾燥最外聚合物塗層未交聯(或可交聯),故乾燥最外聚合物塗層無需固化或後處理,由此減小了印刷裝置及製程之複雜性。另外,與光起始劑及其他交聯劑有關之問題(例如來自殘餘反應物之黃化)及其他與後固化化學反應有關之問題得以避免。另外,來自收縮及黏著之潛在問題亦得以避免,此乃因無需低分子量材料(例如光起始劑)。最後,乾燥最外聚合物層高度透明且可適當地用於覆蓋全部或僅一部分導電圖案,從而可在期望時達成適當電連結。 The invention provides a number of advantages. Because the dried outermost polymer coating is not crosslinked (or crosslinkable), the dried outermost polymer coating does not require curing or post-treatment, thereby reducing the complexity of the printing device and process. In addition, problems related to photoinitiators and other cross-linking agents (such as yellowing from residual reactants) and other problems related to post-cure chemical reactions are avoided. In addition, potential problems from shrinkage and adhesion are avoided because low molecular weight materials (such as photoinitiators) are not needed. Finally, the dried outermost polymer layer is highly transparent and can be suitably used to cover all or only a portion of the conductive pattern so that a proper electrical connection can be achieved when desired.

定義definition

除非另外指示,否則如本文定義導電圖案及乾燥最外聚合物塗層之各種組份所用,單數形式「一(a、an)」及「該(the)」意欲包含一或多種組份(亦即包含複數個指示物)。 Unless otherwise indicated, as used herein to define the various components of the conductive pattern and dry outermost polymer coating, the singular forms "a, an" and "the" are intended to include one or more components (also That is, it includes a plurality of indicators).

如本文中所使用,術語「光固化」意指使功能寡聚物及單體或甚至聚合物因應於該等材料之輻照(例如使用適宜波長之紫外(UV)、可見或紅外輻射之輻照)聚合成交聯聚合物網絡。 As used herein, the term "light-curing" means subjecting functional oligomers and monomers or even polymers to exposure to such materials (e.g., irradiation with ultraviolet (UV), visible or infrared radiation at a suitable wavelength) ) Polymerize the crosslinked polymer network.

術語「光固化」用於定義在適當環境中使用適宜輻射輻照(例如使用諸如紫外(UV)、可見或紅外輻射等輻射輻照)時發生聚合或交聯之材料(或組份)。 The term "photocuring" is used to define a material (or component) that polymerizes or crosslinks when exposed to suitable radiation in a suitable environment (eg, using radiation such as ultraviolet (UV), visible, or infrared radiation).

「熱塑性聚合物」係指在個別聚合物大分子之間並無交聯位點且在高於具體溫度下變成液體、易曲折或可模製且然後在冷卻後返回固態之聚合物。在多種情況下,熱塑性聚合物亦可溶於適當有機溶劑介質中。 A "thermoplastic polymer" refers to a polymer that has no cross-linking sites between individual polymer macromolecules and becomes liquid, pliable, or moldable above a specific temperature and then returns to the solid state after cooling. In many cases, the thermoplastic polymer is also soluble in a suitable organic solvent medium.

本文所闡述非交聯熱塑性聚合物中之重複單元通常衍生自縮合或自由基聚合製程中所使用之可聚合單元,該等可聚合單元具有期望性質且有助於期望聚合物TgThe repeating units in the non-crosslinked thermoplastic polymers described herein are generally derived from polymerizable units used in condensation or radical polymerization processes, which polymerizable units have the desired properties and contribute to the desired polymer Tg .

本文所闡述層(例如乾燥最外聚合物塗層)之平均乾燥厚度可(例如)使用電子顯微術、光學顯微術或輪廓術自在乾燥層中所進行至少兩個單獨量測之平均值測得。 The average dry thickness of the layers described herein (e.g., the dried outermost polymer coating) can be, for example, the average of at least two separate measurements made in the dried layer using electron microscopy, light microscopy, or profiling Measured.

類似地,本文所闡述線、柵格線或其他圖案特徵之平均乾燥厚度或寬度可為(例如)使用電子顯微術、光學顯微術或輪廓術進行之至少兩次單獨量測之平均值。 Similarly, the average dry thickness or width of a line, grid line, or other pattern feature described herein may be the average of at least two separate measurements, for example, using electron microscopy, light microscopy, or profiling .

「光化輻射」用於係指能夠根據本發明產生光固化或光聚合作用且波長為至少200nm且至多並包含1400nm及通常至少200nm且至多並包含750nm或甚至至少300nm且至多並包含700nm之任一電磁輻射。術語「曝光輻射」亦係指該光化輻射。 "Actinic radiation" is used to mean any one that is capable of producing a photocuring or photopolymerization according to the present invention and has a wavelength of at least 200 nm and at most and including 1400 nm and usually at least 200 nm and at most and including 750 nm or even at least 300 nm and at most and including 700 nm An electromagnetic radiation. The term "exposure radiation" also refers to the actinic radiation.

術語「UV輻射」在本文中用於係指具有至少200nm且至多並包含400nm之波長(λmax)之電磁輻射。 The term "UV radiation" is used herein to refer to electromagnetic radiation having a wavelength (λ max ) of at least 200 nm and up to and including 400 nm.

使用尺寸排除層析(SEC)測定重量平均分子量(Mw)。本文所報告之值係以聚(甲基丙烯酸甲酯)等效重量形式報告。 Weight-average molecular weight ( Mw ) was determined using size exclusion chromatography (SEC). The values reported herein are reported as poly (methyl methacrylate) equivalent weights.

可使用差示掃描量熱法(DSC)測定玻璃轉變溫度(Tg)且本文所報告之值係指銦標準。 Differential scanning calorimetry (DSC) can be used to determine the glass transition temperature (T g ) and the values reported herein refer to the indium standard.

本文所使用提及基板、聚合物層(包含乾燥最外聚合物塗層)之術語「透明」及「透明性」係指積分透射率為至少80%及更可能至少90%之材料及結構。積分透射率係在電磁光譜(例如410nm至700nm) 之可見區中使用分光光度計及已知技術量測。 As used herein, the terms "transparent" and "transparency" referring to substrates, polymer layers (including dry outermost polymer coatings) refer to materials and structures with an integrated transmittance of at least 80% and more likely at least 90%. Integrated transmission is in the electromagnetic spectrum (e.g. 410nm to 700nm) The visible region is measured using a spectrophotometer and known techniques.

如本文中所使用,術語「導電圖案」係指導電材料之具有攜載電流之功能之預定或隨機配置圖案。在大部分實施例中,該等導電圖案係導電金屬圖案,但可使用其他導電材料,舉例而言,可在其他實施例中使用導電聚合物、碳奈米管、石墨烯及其他導電碳結構。導電圖案可由多個區構成,一些區經設計位於納入導電物件之器件(例如觸控螢幕感測器)之「觸控」區內。導電圖案之其他區可位於「觸控」區外側且配置於邊界或電連結區內。該等區可由導電匯流排線、探針墊、電極及連結器組成。如針對本發明所定義之連結器或連結器墊係導電圖案之導電區,其連結至外部電子連結、檢測器、電路或其他外部組件。舉例而言,每一導電圖案可包括可佈置於「觸控」區中之「導電柵格」或「導電金屬柵格」。導電圖案亦可包括位於「觸控」區外側且為連結器墊之一部分之「導電連結器」或「導電金屬連結器」。其他區可包括提供器件組份內之電流路徑之其他導電線及互連。 As used herein, the term "conductive pattern" refers to a predetermined or randomly arranged pattern of an electrical material having a function of carrying a current. In most embodiments, the conductive patterns are conductive metal patterns, but other conductive materials may be used. For example, conductive polymers, carbon nanotubes, graphene, and other conductive carbon structures may be used in other embodiments. . The conductive pattern can be composed of multiple regions, some of which are designed to be located in the "touch" region of a device (such as a touch screen sensor) incorporated into a conductive object. The other areas of the conductive pattern may be located outside the "touch" area and disposed in the boundary or electrical connection area. These areas may consist of conductive bus bars, probe pads, electrodes, and connectors. A connector or connector pad as defined for the present invention is a conductive region of a conductive pattern that is connected to an external electronic connection, a detector, a circuit, or other external component. For example, each conductive pattern may include a "conductive grid" or a "conductive metal grid" that can be arranged in a "touch" area. The conductive pattern may also include a "conductive connector" or a "conductive metal connector" located outside the "touch" area and being part of the connector pad. Other regions may include other conductive lines and interconnects that provide current paths within the device component.

用途use

本發明物件可用於各種技術及器件中,包含但不限於觸控螢幕感測器、顯示器、積體電路組件、微晶片、薄膜電晶體組件及其他可用於諸多消費者、工業及商業產品中之顯示器或功能器件。可用於該等顯示器件中之影像器件可包含陰極射線管(CRS)、投影機、平板液晶顯示器(LCD)、LED系統、OLED系統、電漿系統、電致發光顯示器(ECD)及場發射顯示器(FED)。舉例而言,本發明可用於製備可納入具有觸控-敏感特徵之電子器件中之電容式觸控感測器以提供計算器件、電腦顯示器、可攜式媒體播放器(包含電子閱讀器、行動電話及其他可攜式通信器件)。 The object of the present invention can be used in various technologies and devices, including but not limited to touch screen sensors, displays, integrated circuit components, microchips, thin-film transistor components, and others that can be used in many consumer, industrial and commercial products. Display or functional device. Imaging devices that can be used in these display devices can include cathode ray tubes (CRS), projectors, flat panel liquid crystal displays (LCD), LED systems, OLED systems, plasma systems, electroluminescent displays (ECD), and field emission displays (FED). For example, the present invention can be used to prepare capacitive touch sensors that can be incorporated into electronic devices with touch-sensitive features to provide computing devices, computer displays, portable media players (including e-readers, mobile Phones and other portable communication devices).

使用本發明以高容量捲對捲製造製程製作撓性及光學順應性觸 控感測器之系統及方法係可能的,其中可在單遍次中產生微導電特徵。可使用多個印刷部件(例如多個柔版印刷板)來自彼等多個印刷部件中所提供之預定設計或圖案形成多個高解析度導電圖案(或影像)。可如下文更詳細闡述將多個圖案印刷於透明基板之一側或兩側上。舉例而言,可將一個預定圖案形成於透明基板之一側上且可將不同預定圖案形成於透明基板之相對側上。可將本文所闡述之乾燥最外聚合物塗層納入或佈置於至少一部分但非全部之多個導電圖案中之每一者中。 Using the present invention to produce flexible and optically compliant contacts in a high-volume roll-to-roll manufacturing process Systems and methods for controlling sensors are possible, in which micro-conductive features can be generated in a single pass. A plurality of high-resolution conductive patterns (or images) may be formed using a plurality of printed parts (eg, a plurality of flexographic printing plates) from predetermined designs or patterns provided in the plurality of printed parts. Printing multiple patterns on one or both sides of the transparent substrate can be explained in more detail below. For example, one predetermined pattern may be formed on one side of the transparent substrate and different predetermined patterns may be formed on opposite sides of the transparent substrate. The dry outermost polymer coating described herein may be incorporated or arranged in each of at least a portion, but not all of the plurality of conductive patterns.

最外聚合物塗層Outermost polymer coating

本發明中所使用之最外聚合物塗層係源於混合一或多種非交聯熱塑性聚合物(若並不另外指示,則在下文中係「聚合物」),每一聚合物或聚合物混合物具有等於或大於65℃之玻璃轉變溫度(Tg)。 The outermost polymer coating used in the present invention is derived from the mixing of one or more non-crosslinked thermoplastic polymers (hereinafter "polymers" unless otherwise indicated), each polymer or polymer mixture Has a glass transition temperature (T g ) equal to or greater than 65 ° C.

可使用有用非交聯熱塑性聚合物來提供如本文所定義具有上述積分透射率之透明膜。 Useful non-crosslinked thermoplastic polymers can be used to provide a transparent film as defined herein with the integrated transmittance described above.

該等非交聯熱塑性聚合物可無縮合聚合物,包含但不限於聚酯、聚醯胺、聚醯亞胺、聚碳酸酯、聚胺基甲酸酯、聚脲及聚碸。更可能的是,非交聯熱塑性聚合物係衍生自一或多種乙烯系不飽和可聚合單體之加成聚合物,該等聚合物包含但不限於聚乙烯縮醛、聚丙烯酸、聚丙烯醯胺、聚苯乙烯、聚烯烴、聚乙烯基鹵化物、聚亞乙烯基鹵化物、聚碸及聚乙烯基醚。亦可使用天然或合成纖維素。 These non-crosslinked thermoplastic polymers may be non-condensing polymers, including, but not limited to, polyesters, polyamides, polyimides, polycarbonates, polyurethanes, polyureas, and polyfluorenes. It is more likely that the non-crosslinked thermoplastic polymer is an addition polymer derived from one or more ethylenically unsaturated polymerizable monomers. These polymers include, but are not limited to, polyvinyl acetal, polyacrylic acid, and polypropylene. Amine, polystyrene, polyolefin, polyvinyl halide, polyvinylidene halide, polyfluorene and polyvinyl ether. Natural or synthetic cellulose can also be used.

有用非交聯熱塑性聚合物可為線性、具支鏈、梳形或任一其他已知聚合物形態。亦有用者係含有各種形態之多個單體之嵌段、接枝或錐形共聚物或聚合物,只要達成本文所闡述之其他性質。 Useful non-crosslinked thermoplastic polymers can be linear, branched, comb, or any other known polymer morphology. Also useful are block, graft, or cone copolymers or polymers containing multiple monomers in various morphologies, as long as the other properties described herein are achieved.

尤其有用之非交聯熱塑性聚合物為「非芳香族」,此意味著在聚合物內並不特意納入碳環芳香族或雜環芳香族部分(或基團)。 Particularly useful non-crosslinked thermoplastic polymers are "non-aromatic", which means that carbocyclic aromatic or heterocyclic aromatic moieties (or groups) are not intentionally included in the polymer.

此類有用非交聯熱塑性聚合物包含衍生自至少一或多種丙烯酸 酯或甲基丙烯酸酯乙烯系不飽和可聚合單體之丙烯酸聚合物。使用該等單體在(共)聚合物中提供至少5mol%或至少10mol%且至多並包含100mol%之「丙烯酸」重複單元(基於總重複單元)。若「丙烯酸」重複單元佔小於100mol%,則剩餘重複單元可衍生自一或多種熟習此項技術者所熟知之乙烯系不飽和可聚合單體,只要該等重複單元並不包括能夠發生變色反應之碳環芳香族或雜環芳香族部分或其他官能基。因此,有用丙烯酸聚合物可為均聚物或包括兩個或更多個衍生自兩種或更多種不同乙烯系不飽和可聚合單體之不同重複單元之共聚物。 Such useful non-crosslinked thermoplastic polymers include derivatives derived from at least one or more acrylic acids Ester or methacrylate Acrylic polymer of ethylenically unsaturated polymerizable monomer. Use of these monomers provides at least 5 mol% or at least 10 mol% and up to and including 100 mol% of "acrylic" repeating units (based on total repeating units) in the (co) polymer. If the "acrylic" repeating unit accounts for less than 100 mol%, the remaining repeating units may be derived from one or more ethylenically unsaturated polymerizable monomers familiar to those skilled in the art, as long as the repeating units do not include the ability to undergo a color change reaction Carbocyclic aromatic or heterocyclic aromatic moieties or other functional groups. Thus, useful acrylic polymers can be homopolymers or copolymers that include two or more different repeating units derived from two or more different ethylenically unsaturated polymerizable monomers.

因此,丙烯酸酯或甲基丙烯酸酯乙烯系不飽和可聚合單體可包括可未經取代或經一或多個烷氧基、羥基烷氧基、烷氧基烷氧基或鹵代烷氧基取代之適宜酯烷基。舉例而言,該等有用乙烯系不飽和可聚合單體包含羥基烷基甲基丙烯酸酯(例如甲基丙烯酸羥甲基酯)、甲基丙烯酸甲酯、甲基丙烯酸乙酯、丙烯酸甲酯、丙烯酸乙酯、丙烯酸正丁基酯、甲基丙烯酸正丁基酯、甲基丙烯酸異丁基酯、丙烯酸第三丁基酯、甲基丙烯酸第三丁基酯、甲基丙烯酸正己基酯、丙烯酸正十二烷基酯、甲基丙烯酸2-乙基己基酯、丙烯酸2-乙基己基酯、甲基丙烯酸環己基酯、丙烯酸環己基酯、甲基丙烯酸縮水甘油基酯、丙烯酸縮水甘油基酯、丙烯酸氯甲基酯或羥基烷基丙烯酸酯(例如丙烯酸羥乙基酯或丙烯酸羥丙基酯)。 Thus, acrylate or methacrylate vinyl-based unsaturated polymerizable monomers may include those which may be unsubstituted or substituted with one or more alkoxy, hydroxyalkoxy, alkoxyalkoxy, or haloalkoxy groups. Suitable for ester alkyl. For example, such useful ethylenically unsaturated polymerizable monomers include hydroxyalkyl methacrylates (such as methyl methacrylate), methyl methacrylate, ethyl methacrylate, methyl acrylate, Ethyl acrylate, n-butyl acrylate, n-butyl methacrylate, isobutyl methacrylate, third butyl acrylate, third butyl methacrylate, n-hexyl methacrylate, acrylic acid N-dodecyl ester, 2-ethylhexyl methacrylate, 2-ethylhexyl acrylate, cyclohexyl methacrylate, cyclohexyl acrylate, glycidyl methacrylate, glycidyl acrylate , Chloromethyl acrylate or hydroxyalkyl acrylate (such as hydroxyethyl acrylate or hydroxypropyl acrylate).

在許多實施例中,非交聯熱塑性聚合物係共聚物(包含三元聚合物),其各自包括衍生自(甲基)丙烯酸甲酯(意指丙烯酸甲酯或甲基丙烯酸甲酯)之重複單元及衍生自(甲基)丙烯酸烷基酯(其中烷基具有至少1個碳原子且至多並包含18個碳原子)之重複單元,其中衍生自(甲基)丙烯酸烷基酯之重複單元佔總共聚物重複單元之至少5mol%且至多並包含25mol%,且衍生自甲基丙烯酸甲酯之重複單元構成其餘共 聚物。有用乙烯系不飽和可聚合單體闡述於上文中且其他者為熟習此項技術者易於明瞭。 In many embodiments, non-crosslinked thermoplastic polymer-based copolymers (including terpolymers) each include a repeat derived from methyl (meth) acrylate (meaning methyl acrylate or methyl methacrylate) Units and repeating units derived from alkyl (meth) acrylates (wherein the alkyl group has at least 1 carbon atom and up to and including 18 carbon atoms), wherein the repeating units derived from alkyl (meth) acrylates account for At least 5 mol% and up to and including 25 mol% of the total copolymer repeat units, and repeat units derived from methyl methacrylate constitute the remaining total Polymer. Useful ethylenically unsaturated polymerizable monomers are described above and others will be readily apparent to those skilled in the art.

其他可用於提供共聚物中之重複單元之有用乙烯系不飽和可聚合單體包含但不限於丙烯醯胺、甲基丙烯醯胺、丙烯酸酸、甲基丙烯酸、丙烯腈、乙酸乙烯酯、氯乙烯及二氯亞乙烯或任一能夠與(甲基)丙烯酸酯共聚合之其他乙烯系不飽和單-芳香族可聚合單體。 Other useful ethylenically unsaturated polymerizable monomers that can be used to provide repeating units in the copolymer include, but are not limited to, acrylamide, methacrylamide, acrylic acid, methacrylic acid, acrylonitrile, vinyl acetate, vinyl chloride And dichloroethylene or any other ethylenically unsaturated mono-aromatic polymerizable monomer capable of copolymerizing with (meth) acrylate.

可製備具有一或多個不同類型衍生自一或多種上述乙烯系不飽和可聚合單體之重複單元之非交聯熱塑性聚合物,且該等重複單元可以任一期望順序(例如隨機、交替、嵌段或熟習聚合物化學技術者明瞭之其他配置)配置於聚合物內。 Non-crosslinked thermoplastic polymers having one or more different types of repeating units derived from one or more of the aforementioned ethylenically unsaturated polymerizable monomers can be prepared, and the repeating units can be in any desired order (e.g., random, alternating, Block or other configurations known to those skilled in polymer chemistry) are disposed within the polymer.

本文針對所闡述聚合物定義之各種重複單元之mol%量意欲係指存在於聚合物中之實際莫耳量。熟習此項技術者應理解,實際mol%值可不同於源自聚合程序中所使用乙烯系不飽和可聚合單體之量之彼等理論可能值。然而,在大部分達成所有乙烯系不飽和可聚合單體之高聚合物產率及最佳反應之聚合條件下,每一乙烯系不飽和可聚合單體之實際mol%通常在理論量±15mol%內。 The mol% amounts of the various repeat units defined herein for the polymers illustrated are intended to refer to the actual mole amounts present in the polymers. Those skilled in the art will understand that actual mol% values may differ from their theoretically possible values derived from the amount of ethylenically unsaturated polymerizable monomers used in the polymerization process. However, under most polymerization conditions that achieve high polymer yields and optimal reactions for all ethylenically unsaturated polymerizable monomers, the actual mol% of each ethylenically unsaturated polymerizable monomer is usually within the theoretical amount of ± 15mol% Inside.

一些代表性非交聯熱塑性聚合物包含但不限於下列聚合物,其中莫耳比率係基於聚合製程中所使用乙烯系不飽和可聚合單體之實際莫耳比之理論(標稱)量。若聚合反應並未實施完全,則重複單元之實際莫耳量可不同於乙烯系不飽和可聚合單體之理論(標稱)量。 Some representative non-crosslinked thermoplastic polymers include, but are not limited to, the following polymers, where the molar ratio is a theoretical (nominal) amount based on the actual molar ratio of the ethylenically unsaturated polymerizable monomer used in the polymerization process. If the polymerization reaction is not carried out completely, the actual molar amount of the repeating unit may be different from the theoretical (nominal) amount of the ethylenically unsaturated polymerizable monomer.

聚(甲基丙烯酸甲酯-共-甲基丙烯酸正丁基酯)90:10莫耳比;聚(甲基丙烯酸甲酯-共-甲基丙烯酸正丁基酯)75:25莫耳比;聚(甲基丙烯酸甲酯-共-甲基丙烯酸正丁基酯-共-甲基丙烯酸)85:15:5莫耳比;聚(甲基丙烯酸甲酯-共-甲基丙烯酸己酯)90:10莫耳比;聚(甲基丙烯酸甲酯-共-甲基丙烯酸辛酯)90:10莫耳比; 聚(甲基丙烯酸甲酯-共-甲基丙烯酸月桂基酯)90:10莫耳比;聚(甲基丙烯酸乙酯-共-甲基丙烯酸正丁基酯-共-甲基丙烯酸)80:15:5莫耳比;及聚(甲基丙烯酸乙酯-共-甲基丙烯酸)90:10莫耳比。 Poly (methyl methacrylate-co-n-butyl methacrylate) 90: 10 mole ratio; poly (methyl methacrylate-co-n-butyl methacrylate) 75: 25 mole ratio; Poly (methyl methacrylate-co-n-butyl methacrylate-co-methacrylic acid) 85: 15: 5 mole ratio; poly (methyl methacrylate-co-hexyl methacrylate) 90 : 10 mole ratio; poly (methyl methacrylate-co-octyl methacrylate) 90: 10 mole ratio; Poly (methyl methacrylate-co-lauryl methacrylate) 90: 10 mol ratio; poly (ethyl methacrylate-co-n-butyl methacrylate-co-methacrylic acid) 80: 15: 5 mole ratio; and poly (ethyl methacrylate-co-methacrylic acid) 90:10 mole ratio.

有用非交聯熱塑性共聚物及三元聚合物市面有售。舉例而言,聚(甲基丙烯酸甲酯-共-甲基丙烯酸正丁基酯)係以ELVACITE® 4028形式獲得;聚(甲基丙烯酸甲酯-共-甲基丙烯酸正丁基酯-共-甲基丙烯酸)係以ELVACITE® 2614形式獲得;且聚(甲基丙烯酸甲酯-共-甲基丙烯酸月桂基酯)係以ELVACITE® 2552形式自Lucite International獲得。 Useful non-crosslinked thermoplastic copolymers and terpolymers are commercially available. For example, poly (methyl methacrylate-co-n-butyl methacrylate) is obtained as ELVACITE ® 4028; poly (methyl methacrylate-co-n-butyl methacrylate-co- methacrylic acid) -based obtained in the form of ELVACITE ® 2614; and poly (methyl methacrylate - co - lauryl methacrylate ester) based to form ELVACITE ® 2552 obtained from Lucite International.

具有乾燥最外聚合物塗層之物件之製備Preparation of articles with dry outermost polymer coating

一般而言,藉由首先提供具有第一支撐側及相對第二支撐側(與邊緣相對之相對平面側)之適宜透明基板來製備本發明物件。適宜透明基板可由各種材料構成。 Generally speaking, the object of the present invention is prepared by first providing a suitable transparent substrate having a first support side and a second support side (opposite planar side opposite to the edge). A suitable transparent substrate may be composed of various materials.

適宜透明基板包含但不限於玻璃(包含撓性玻璃)、玻璃增強之環氧壓層、三乙酸纖維素、丙烯酸酯、聚碳酸酯、黏著劑塗覆之聚合物透明基板、聚酯膜及透明複合材料。用作透明聚合物基板之適宜透明聚合物包含但不限於聚乙烯及其他聚烯烴、聚酯(例如聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、聚-對苯二甲酸1,4-環己烷二亞甲基酯、聚(對苯二甲酸伸丁基酯)及其共聚物)、聚丙烯、聚乙酸乙烯酯、聚胺基甲酸酯、聚醯胺、聚醯亞胺、聚碸、聚碳酸酯、聚(甲基丙烯酸甲酯)及熟習此項技術者易於明瞭之其他材料。其他有用透明基板可由纖維素衍生物(例如纖維素酯、三乙酸纖維素、二乙酸纖維素、乙酸丙酸纖維素、乙酸丁酸纖維素、聚丙烯酸酯、聚醚亞醯胺及其混合物)構成。 Suitable transparent substrates include, but are not limited to, glass (including flexible glass), glass-reinforced epoxy laminates, cellulose triacetate, acrylate, polycarbonate, adhesive-coated polymer transparent substrates, polyester films, and transparent Composite material. Suitable transparent polymers for use as transparent polymer substrates include, but are not limited to, polyethylene and other polyolefins, polyesters (e.g., polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polymer -1,4-cyclohexane dimethylene terephthalate, poly (butylene terephthalate) and its copolymers), polypropylene, polyvinyl acetate, polyurethane, Polyamines, polyimides, polyfluorenes, polycarbonates, poly (methyl methacrylate), and other materials readily understood by those skilled in the art. Other useful transparent substrates may be derived from cellulose derivatives (e.g., cellulose esters, cellulose triacetate, cellulose diacetate, cellulose acetate propionate, cellulose acetate butyrate, polyacrylates, polyetherimides, and mixtures thereof) Make up.

在表現為具有一層時,雙軸定向薄片亦可提供有其他可用於改變雙軸定向薄片之光學或其他性質之層。該等層可含有著色劑、抗靜 電或導電材料或滑動劑,只要維持期望積分透射率。 When presenting as a layer, the biaxially oriented sheet may also be provided with other layers that can be used to change the optical or other properties of the biaxially oriented sheet. These layers may contain colorants, antistatic Electrical or conductive materials or slips, as long as the desired integrated transmittance is maintained.

使用撓性透明基板來製造撓性電子器件或觸控螢幕組件會促進快速捲對捲製造。ESTAR®聚(對苯二甲酸乙二酯)膜、MELLINEX®聚(對苯二甲酸乙二酯)膜及三乙酸纖維素膜係用於製造撓性透明基板(包含連續基板網片)之尤其有用材料。 The use of flexible transparent substrates to manufacture flexible electronic devices or touch screen components facilitates rapid roll-to-roll manufacturing. ESTAR ® poly (ethylene terephthalate) film, MELLINEX ® poly (ethylene terephthalate) film and cellulose triacetate film are especially used for manufacturing flexible transparent substrates (including continuous substrate mesh). Useful materials.

透明基板可具有至少20μm且至多並包含300μm或通常至少75μm且至多並包含200μm之厚度。若期望,則可以適宜量將抗氧化劑、抗靜電或導電劑、塑化劑及其他有用添加劑納入透明基板中。 The transparent substrate may have a thickness of at least 20 μm and up to and including 300 μm or typically at least 75 μm and up to and including 200 μm. If desired, antioxidants, antistatic or conductive agents, plasticizers, and other useful additives may be incorporated into the transparent substrate in suitable amounts.

可使用任一期望方式(存在業內已知之若干技術)將導電圖案(例如導電金屬圖案,其可包含導電柵格(例如導電金屬柵格)及導電連結器(例如導電金屬連結器))佈置於透明基板中第一支撐側及相對第二支撐側中之一者或兩者上。 The conductive pattern (such as a conductive metal pattern, which may include a conductive grid (such as a conductive metal grid) and a conductive connector (such as a conductive metal connector)) may be arranged in any desired manner (there are several techniques known in the industry) One or both of the first support side and the opposite second support side in the transparent substrate.

一些導電圖案可自一或多種導電聚合物(許多為業內已知)構成。舉例而言,該等導電聚合物可選自經取代或未經取代之含吡咯聚合物[如(例如)在美國專利5,665,498(Savage等人)及5,674,654(Zumbalyadis等人)中所闡述];經取代或未經取代之含噻吩聚合物[如(例如)在美國專利5,300,575(Joans等人)、5,312,681(Muys等人)、5,354,613(Quinters等人)、5,370,981(Krafft等人)、5,372,924(Quinters等人)、5,391,472(Muys等人)、5,403,467(Jonas等人)、5,443,944(Azoulay)、4,987,042(Jonas等人)及4,731,408(Jasne)中所闡述];及經取代或未經取代之含苯胺聚合物[如(例如)在美國專利5,716,550(Gardner等人)、5,093,439(Epstein等人)及4,070,189(Kelley等人)中所闡述]。 Some conductive patterns may be constructed from one or more conductive polymers, many of which are known in the art. For example, the conductive polymers may be selected from substituted or unsubstituted pyrrole-containing polymers [as described, for example, in US Patents 5,665,498 (Savage et al.) And 5,674,654 (Zumbalyadis et al.)]; Substituted or unsubstituted thiophene-containing polymers [e.g., in U.S. Patents 5,300,575 (Joans et al.), 5,312,681 (Muys et al.), 5,354,613 (Quinters et al.), 5,370,981 (Krafft et al.), 5,372,924 (Quinters et al. People), 5,391,472 (Muys et al.), 5,403,467 (Jonas et al.), 5,443,944 (Azoulay), 4,987,042 (Jonas et al., And 4,731,408 (Jasne)); and substituted or unsubstituted aniline containing polymers [As set forth, for example, in US Patents 5,716,550 (Gardner et al.), 5,093,439 (Epstein et al.), And 4,070,189 (Kelley et al.)].

一些導電圖案可由一或多種導電碳結構構成,許多為業內已知,包含(例如)導電碳黑、碳奈米管、石墨、石墨烯或其組合。 Some conductive patterns may be composed of one or more conductive carbon structures, many of which are known in the industry and include, for example, conductive carbon black, carbon nanotubes, graphite, graphene, or combinations thereof.

在其他實施例中,導電圖案經設計以具有金屬特徵。舉例而言,光敏性鹵化銀技術可用於此目的以在透明基板之一或兩個支撐側 上提供導電銀圖案,例如如美國專利申請公開案2011/0289771(Kuriki)及2011/0308846(Ichiki)中所闡述。用於此目的之其他鹵化銀技術亦闡述於共同申請且共同讓與之美國專利臨時申請案第14/468,626號(2014年8月26日由Lushington提出申請)。在該技術中,可將鹵化銀乳液設計於透明基板之一或兩個支撐側上,經由適宜遮罩暴露,且然後可處理藉由此暴露形成之圖案以形成銀金屬圖案且適宜地去除非暴露鹵化銀乳液。可使用具有相應圖案之預定遮罩元件設計各種導電銀圖案以具有期望圖案。 In other embodiments, the conductive pattern is designed to have metallic features. For example, photosensitive silver halide technology can be used for this purpose on one or both support sides of a transparent substrate A conductive silver pattern is provided thereon, for example as set forth in U.S. Patent Application Publications 2011/0289771 (Kuriki) and 2011/0308846 (Ichiki). Other silver halide technologies used for this purpose are also described in co-filed and commonly assigned U.S. Patent Provisional Application No. 14 / 468,626 (filed by Lushington on August 26, 2014). In this technique, a silver halide emulsion can be designed on one or both supporting sides of a transparent substrate, exposed through a suitable mask, and then the pattern formed by this exposure can be processed to form a silver metal pattern and suitably remove non- Expose the silver halide emulsion. Various conductive silver patterns can be designed using predetermined masking elements having corresponding patterns to have a desired pattern.

在其他實施例中,可使用可提供用於無電電鍍製程之晶種金屬觸媒之光可固化組合物在透明基板之一或兩個支撐側上形成導電圖案(例如導電金屬圖案)。舉例而言,光可固化組合物可包括酸催化光可固化化學物質、自由基光可固化化學物質或此兩類化學物質,其實例闡述於下文中,但本發明並不限於所闡述光可固化化學物質且可使用任一可進一步包括適於無電金屬電鍍製程之晶種金屬觸媒之已知光可固化組合物來實施。 In other embodiments, a light-curable composition that can provide a seed metal catalyst for an electroless plating process can be used to form a conductive pattern (such as a conductive metal pattern) on one or both support sides of a transparent substrate. For example, the photo-curable composition may include an acid-catalyzed photo-curable chemical substance, a radical photo-curable chemical substance, or these two types of chemicals, examples of which are described below, but the present invention is not limited to the described photo-curable Curing chemicals and can be implemented using any known photocurable composition that can further include a seed metal catalyst suitable for electroless metal plating processes.

酸催化光可固化化學物質:Acid-catalyzed photo-curable chemicals:

在一些實施例中,有用光可固化組合物包括一或多種UV可固化組份,其中之至少一者係酸催化光可固化組份。該等光可固化組合物可進一步包括參與生成酸自由基以引起光可固化組份之光固化之光酸生成劑。 In some embodiments, useful photo-curable compositions include one or more UV-curable components, at least one of which is an acid-catalyzed photo-curable component. The photocurable compositions may further include a photoacid generator that participates in generating acid radicals to cause photocuring of the photocurable component.

一些有用酸催化光可固化組份係光可固化環氧材料。陽離子型光可固化環氧材料可為具有至少一個環氧乙烷環之有機化合物,該環氧乙烷環展示於下式中:

Figure TWI675744B_D0001
Some useful acid-catalyzed photocurable components are photocurable epoxy materials. The cationic photocurable epoxy material may be an organic compound having at least one ethylene oxide ring, which is shown in the following formula:
Figure TWI675744B_D0001

其可藉由開環機制聚合(光固化)。該等環氧材料包含單體環氧化合物及聚合物類型之環氧化物且可為脂肪族、環脂族、芳香族或雜環的。該等材料通常每分子具有平均至少一個可聚合環氧基,或通常每分子具有至少約1.5個或甚至至少約2個可聚合環氧基。聚合物環氧材料包含具有末端環氧基之線性聚合物(例如聚氧化烯二醇之二縮水甘油基醚)、具有骨架(主鏈)環氧乙烷單元之聚合物(例如聚丁二烯聚環氧化物)及具有側鏈環氧基之聚合物(例如甲基丙烯酸縮水甘油基酯聚合物或共聚物)。光可固化環氧材料可為單一化合物或其可為每分子含有一個、兩個或更多個環氧基之不同環氧材料之混合物。 It can be polymerized (light-cured) by a ring-opening mechanism. These epoxy materials include monomeric epoxy compounds and epoxides of the polymer type and may be aliphatic, cycloaliphatic, aromatic or heterocyclic. Such materials typically have an average of at least one polymerizable epoxy group per molecule, or typically have at least about 1.5 or even at least about 2 polymerizable epoxy groups per molecule. Polymer epoxy materials include linear polymers with terminal epoxy groups (e.g. diglycidyl ether of polyoxyalkylene glycols), polymers with backbone (backbone) ethylene oxide units (e.g. polybutadiene Polyepoxides) and polymers with side chain epoxy groups (such as glycidyl methacrylate polymer or copolymer). The photocurable epoxy material may be a single compound or it may be a mixture of different epoxy materials containing one, two or more epoxy groups per molecule.

環氧材料可自低分子量單體材料至高分子量聚合物有所變化且其主鏈及取代基(或側鏈)基團之性質可大不相同。舉例而言,主鏈可為任一類型且其上之取代基可為在室溫下實質上不干擾期望之陽離子光固化製程之任一基團。所闡釋之容許取代基包含但不限於鹵素、酯基團、醚、磺酸酯基團、矽氧烷基團、硝基及磷酸酯基團。 Epoxy materials can vary from low molecular weight monomer materials to high molecular weight polymers and the properties of their main chain and substituent (or side chain) groups can vary widely. For example, the main chain can be of any type and the substituents thereon can be any group that does not substantially interfere with the desired cationic photocuring process at room temperature. The permissible substituents illustrated include, but are not limited to, halogens, ester groups, ethers, sulfonate groups, siloxane groups, nitro groups, and phosphate groups.

有用之光環氧材料包含彼等含有環氧環己烷基團者,例如環氧基環己烷甲酸酯(例如3,4-環氧基環己基甲基-3,4-環氧基環己烷甲酸酯、3,4-環氧基-2-甲基環己基甲基-3,4-環氧基-2-甲基環己烷甲酸酯)及己二酸雙(3,4-環氧基-6-甲基環己基甲基)酯。具有此性質之有用環氧材料之更詳細列表提供於美國專利3,117,099(Proops等人)中。 Useful light epoxy materials include those containing epoxy cyclohexane groups, such as epoxy cyclohexane formate (e.g. 3,4-epoxycyclohexylmethyl-3,4-epoxy Cyclohexaneformate, 3,4-epoxy-2-methylcyclohexylmethyl-3,4-epoxy-2-methylcyclohexaneformate) and adipic acid bis (3 , 4-epoxy-6-methylcyclohexylmethyl) ester. A more detailed list of useful epoxy materials having this property is provided in US Patent 3,117,099 (Proops et al.).

其他有用之環氧材料包含縮水甘油基醚單體,其為藉由使多元酚與過量氯醇(例如表氯醇)反應獲得之多元酚之縮水甘油基醚[例如2,2-雙-(2,3-環氧基丙氧基苯酚)-丙烷之二縮水甘油基醚]。此類環氧材料之其他實例闡述於美國專利3,018,262(Schroeder)及Lee及Neville之「Handbook of Epoxy Resins」,McGraw-Hill Book公司,New York(1967)中。 Other useful epoxy materials include glycidyl ether monomers, which are glycidyl ethers of polyhydric phenols obtained by reacting polyhydric phenols with excess chlorohydrins such as epichlorohydrin [eg 2,2-bis- ( 2,3-epoxypropoxyphenol) -propane diglycidyl ether]. Other examples of such epoxy materials are described in US Patent 3,018,262 (Schroeder) and "Handbook of Epoxy Resins" by Lee and Neville, McGraw-Hill Book Company, New York (1967).

其他有用之環氧材料係樹脂,例如衍生自與縮水甘油反應之丙 烯酸酯(例如丙烯酸縮水甘油基酯及甲基丙烯酸縮水甘油基酯)與一或多種乙烯系不飽和可聚合單體共聚合之共聚物。其他有用之環氧材料係表氯醇、環氧烷(例如環氧丙烷及氧化苯乙烯)、烯基氧化物(例如丁二烯氧化物)及縮水甘油基酯(例如縮水甘油酸乙酯)。其他有用之環氧材料係具有環氧基官能基或諸如環己基環氧基等基團之聚矽氧,尤其係彼等具有聚矽氧主鏈之環氧材料。該等環氧材料之商業實例包含可自Momentive獲得之UV 9300、UV 9315、UV 9400、UV 9425聚矽氧材料。 Other useful epoxy-based resins, such as propylene derived from reacting with glycidol Copolymers of acrylates (such as glycidyl acrylate and glycidyl methacrylate) copolymerized with one or more ethylenically unsaturated polymerizable monomers. Other useful epoxy materials are epichlorohydrin, alkylene oxides (such as propylene oxide and styrene oxide), alkenyl oxides (such as butadiene oxide), and glycidyl esters (such as ethyl glycidyl ester) . Other useful epoxy materials are polysiloxanes having epoxy functional groups or groups such as cyclohexyl epoxy groups, especially their epoxy materials having a polysiloxane backbone. Commercial examples of these epoxy materials include UV 9300, UV 9315, UV 9400, UV 9425 polysiloxane materials available from Momentive.

聚合環氧材料可視情況含有在室溫下實質上不干擾光可固化組合物之陽離子光固化之其他官能基。舉例而言,光可聚合環氧材料亦可包含自由基可聚合功能性。 The polymeric epoxy material may optionally contain other functional groups that do not substantially interfere with the cationic photocuring of the photocurable composition at room temperature. For example, a photopolymerizable epoxy material may also include free radical polymerizable functionality.

光可聚合環氧材料可包括兩種或更多種不同環氧材料之摻合物或混合物。該等摻合物之實例包含兩個或更多個分子量分佈之光可聚合環氧材料,例如一或多種低分子量(低於200)環氧材料與一或多種中等分子量(200至10,000)光可聚合環氧材料或一或多種該等光可聚合環氧材料與一或多種較高分子量(高於10,000)環氧材料之摻合物。另一選擇為或另外,光可聚合環氧材料可包括具有不同化學性質(例如脂肪族及芳香族性質或不同官能基(例如極性及非極性性質))之環氧材料之摻合物。 The photopolymerizable epoxy material may include a blend or mixture of two or more different epoxy materials. Examples of such blends include two or more molecular weight distribution photopolymerizable epoxy materials, such as one or more low molecular weight (less than 200) epoxy materials and one or more medium molecular weight (200 to 10,000) light Polymerizable epoxy materials or blends of one or more of these photopolymerizable epoxy materials with one or more higher molecular weight (greater than 10,000) epoxy materials. Alternatively or additionally, the photopolymerizable epoxy material may include a blend of epoxy materials having different chemical properties (such as aliphatic and aromatic properties or different functional groups (such as polar and non-polar properties)).

光可固化組合物中包含一或多種量適於提供期望有效光固化(或光聚合)之光可固化環氧材料。舉例而言,基於光可固化組合物之總重量,一或多種光可聚合環氧材料可以至少5重量%且至多並包含50重量%或通常至少10重量%且至多並包含40重量%之量存在。 The photocurable composition comprises one or more amounts of a photocurable epoxy material suitable to provide the desired effective photocuring (or photopolymerization). For example, based on the total weight of the photocurable composition, the one or more photopolymerizable epoxy materials may be at least 5% by weight and up to and including 50% by weight or usually at least 10% by weight and up to and including 40% by weight. presence.

可使用各種化合物作為光酸生成劑來生成適宜酸以參與環氧材料中之光固化。一些該等「光酸生成劑」為酸性且其他為非離子性。熟習此項技術者根據本文所提供之教示可易於明瞭除彼等於下文所闡 述者外之其他有用之光酸生成劑。 Various compounds can be used as photoacid generators to generate suitable acids to participate in photocuring in epoxy materials. Some of these "photoacid generators" are acidic and others are non-ionic. Those skilled in the art can easily understand according to the teaching provided in this article except that they are explained below. Other useful photoacid generators other than those mentioned.

可在本發明實踐中用作光酸生成劑之鎓鹽酸生成劑包含但不限於重氮之鹽、鏻、碘鎓或鋶鹽,包含聚芳基重氮、鏻、碘鎓及鋶鹽。碘鎓或鋶鹽包含但不限於二芳基碘鎓及三芳基鋶鹽。有用之抗衡陰離子包含但不限於錯合物金屬鹵化物,例如四氟硼酸鹽、六氟銻酸鹽、三氟甲烷磺酸鹽、六氟砷酸鹽、六氟磷酸鹽及芳烴磺酸鹽(arenesulfonate)。鎓鹽亦可為具有多個鎓鹽部分之寡聚物或聚合物化合物以及具有單一鎓鹽部分之分子。 The onium hydrochloride generators that can be used as photoacid generators in the practice of the present invention include, but are not limited to, diazonium salts, sulfonium, iodonium, or phosphonium salts, including polyaryldiazonium, phosphonium, iodonium, and sulfonium salts. Iodonium or sulfonium salts include, but are not limited to, diaryl iodonium and triarylsulfonium salts. Useful counter anions include, but are not limited to, complex metal halides such as tetrafluoroborate, hexafluoroantimonate, trifluoromethanesulfonate, hexafluoroarsenate, hexafluorophosphate, and aromatic sulfonates ( arenesulfonate). An onium salt may also be an oligomer or polymer compound having multiple onium salt moieties and a molecule having a single onium salt moiety.

有用碘鎓鹽可為簡單鹽(例如含有陰離子(例如氯離子、溴離子、碘離子或C4H5SO3 -))或金屬錯合物鹽(例如含有SbF6 -、PF6 -、BF4 -、四(全氟苯基)硼酸鹽或SbF5OH31 AsF6 -)。若期望,可使用該等相同或不同種類碘鎓鹽中之任一者之混合物。鋶鹽之使用係合意的且其應溶於任一惰性有機溶劑(如下文所闡述)中且其亦應儲架穩定,此意味著其在曝光於適宜輻射前與其他組份(尤其電子受體光敏劑及電子供體共起始劑)混合時並不自發地促進聚合。尤其有用之鋶鹽包含但不限於三芳基取代之鹽,例如混合型六氟銻酸三芳基鋶(例如以UVI-6974自Dow化學公司購得)、混合型六氟磷酸三芳基鋶(例如以UVI-6990自Dow化學公司購得)及六氟磷酸芳基鋶(例如自Sartomer公司購得)。 Useful iodonium salt may be a simple salt (e.g., containing an anion (e.g. chloride, bromide, iodide, or C 4 H 5 SO 3 -) ) or a metal complex salt (e.g., containing SbF 6 -, PF 6 -, BF 4 -, tetrakis (perfluorophenyl) borate or SbF 5 OH 31 AsF 6 -) . If desired, a mixture of any of these same or different iodonium salts can be used. The use of phosphonium salt is desirable and it should be soluble in any inert organic solvent (as explained below) and it should also be shelf-stable, which means that it is compatible with other components (especially electron acceptors) before exposure to suitable radiation. Bulk photosensitizers and electron donor co-initiators) do not spontaneously promote polymerization when mixed. Particularly useful phosphonium salts include, but are not limited to, triaryl substituted salts, such as mixed hexafluoroantimonate triarylsulfonium (for example, commercially available from Dow Chemical Company as UVI-6974), mixed hexafluorophosphate triarylsulfonium (for example, UVI-6990 (available from Dow Chemical Co.) and arylfluorene hexafluorophosphate (for example from Sartomer).

基於光可固化組合物之總重量,一或多種鎓鹽(例如碘鎓鹽或鋶鹽)通常可以至少0.05重量%且至多並包含10重量%或通常至少0.1重量%且至多並包含10重量%或甚至至少0.5重量%且至多並包含5重量%之量存在於光可固化組合物中。 Based on the total weight of the photocurable composition, the one or more onium salts (e.g., iodonium or sulfonium salts) may generally be at least 0.05% by weight and up to and including 10% by weight or usually at least 0.1% by weight and up to and including 10% by weight Or even present in the photocurable composition in an amount of at least 0.5% by weight and up to and including 5% by weight.

非離子型光酸生成劑亦可用於本發明中,該等化合物包含但不限於重氮甲烷衍生物。非離子型光酸生成劑亦可包含乙二肟衍生物。有用光酸生成劑亦可包含雙碸衍生物。其他種類之有用非離子型光酸 生成劑包含二磺基衍生物。 Non-ionic photoacid generators can also be used in the present invention. These compounds include, but are not limited to, diazomethane derivatives. The non-ionic photoacid generator may also include an ethylenedioxime derivative. Useful photoacid generators may also include difluorene derivatives. Other useful nonionic photoacids The generating agent contains a disulfo derivative.

基於光可固化組合物之總重量,一或多種非離子型光酸生成劑可以至少0.05重量%且至多並包含10重量%或通常至少0.1重量%且至多並包含10重量%或甚至至少0.5重量%且至多並包含5重量%之量存在於光可固化組合物中。 Based on the total weight of the photocurable composition, the one or more non-ionic photoacid generators may be at least 0.05% by weight and up to and including 10% by weight or usually at least 0.1% by weight and up to and including 10% by weight or even at least 0.5% by weight Is present in the photocurable composition in an amount of up to and including 5% by weight.

本文所闡述之一些光可固化組合物、尤其彼等含有光可聚合環氧材料及光酸生成劑者可含有一或多種電子供體光敏劑以改良光固化效率。有用之電子供體光敏劑應溶於光可固化組合物中,不含實質上干擾陽離子光固化製程之官能基,且能夠吸收(敏感度)至少150nm且至多並包含1000nm範圍內之波長之光。 Some of the photocurable compositions described herein, especially those containing photopolymerizable epoxy materials and photoacid generators, may contain one or more electron donor photosensitizers to improve photocuring efficiency. Useful electron donor photosensitizers should be soluble in the photo-curable composition, contain no functional groups that substantially interfere with the cationic photo-curing process, and can absorb (sensitivity) light of at least 150 nm and up to and including wavelengths in the 1000 nm range. .

適宜電子供體光敏劑因應於自輻照吸收之光子來引發鎓鹽(或其他光酸生成劑)之化學轉變。在電子供體光敏劑吸收光之後,電子供體光敏劑亦應能夠還原光酸生成劑(亦即光誘導電子轉移)。因此,電子供體光敏劑在自輻照吸收光子後通常能夠將電子供予光酸生成劑。 Suitable electron-donor photosensitizers initiate chemical conversion of onium salts (or other photoacid generators) in response to photons absorbed from irradiation. After the electron donor photosensitizer absorbs light, the electron donor photosensitizer should also be able to reduce the photoacid generator (ie, light-induced electron transfer). Therefore, electron donor photosensitizers are generally capable of donating electrons to photoacid generators after absorbing photons from irradiation.

在期望極快速固化(例如固化所施加之光可固化組合物薄膜)時,電子供體光敏劑在使用光固化製程之期望輻照波長下可具有至少1000公升-莫耳-1cm-1且通常至少50,000公升-莫耳-1cm-1之消光係數。舉例而言,每一電子供體光敏劑通常具有至少0.4V且至多並包含3V之氧化電位(相對於SCE)。 When extremely fast curing is desired (e.g., curing of the applied photo-curable composition film), the electron donor photosensitizer may have at least 1000 liters-Mole -1 cm -1 at a desired irradiation wavelength using a photo-curing process, and Usually an extinction coefficient of at least 50,000 liters-Mole -1 cm -1 . For example, each electron donor photosensitizer typically has an oxidation potential (relative to SCE) of at least 0.4V and up to and including 3V.

一般而言,許多不同種類之化合物可用作各種反應物之電子供體光敏劑。有用電子供體光敏劑包含但不限於芳香族化合物,例如萘、1-甲基萘、蒽、9,10-二甲氧基蒽、苯并[a]蒽、芘、菲、苯并[c]菲及螢蒽。其他涉及三重激發態之有用電子供體光敏劑係羰基化合物,例如噻噸酮及呫噸酮。酮(包含芳香族酮(例如茀酮))及香豆素染料(例如酮基香豆素)(例如彼等具有強供電子部分者(例如二烷基胺基))亦可用作電子供體光敏劑。據信,其他適宜電子供體光敏劑包含 呫噸染料、吖啶染料、噻唑染料、噻嗪染料、噁嗪染料、吖嗪染料、胺基酮染料、卟啉、芳香族多環烴、對取代之胺基苯乙烯基酮化合物、胺基三芳基甲烷、部花青素、方酸菁染料及吡啶鎓染料。 In general, many different kinds of compounds can be used as electron donor photosensitizers for various reactants. Useful electron donor photosensitizers include, but are not limited to, aromatic compounds such as naphthalene, 1-methylnaphthalene, anthracene, 9,10-dimethoxyanthracene, benzo [a] anthracene, pyrene, phenanthrene, benzo [c ] Phenanthrene and fluoranthene. Other useful electron donor photosensitizers involving triplet excited states are carbonyl compounds such as thioxanthone and xanthone. Ketones (including aromatic ketones (e.g. fluorenone)) and coumarin dyes (e.g. ketocoumarin) (e.g. those with a strong electron donating moiety (e.g. dialkylamino)) can also be used as electron donor Body photosensitizer. It is believed that other suitable electron donor photosensitizers contain Xanthene dye, acridine dye, thiazole dye, thiazine dye, oxazine dye, azine dye, amine ketone dye, porphyrin, aromatic polycyclic hydrocarbon, para-substituted amine styryl ketone compound, amine group Triarylmethane, meroanthocyanins, squaraine dyes and pyridinium dyes.

亦可使用選自同或不同種類材料之電子供體光敏劑之混合物。 Mixtures of electron donor photosensitizers selected from the same or different types of materials can also be used.

基於光可固化組合物之總重量,一或多種電子供體光敏劑可以至少0.000001重量%且至多並包含5重量%及通常至少0.0001重量%且至多並包含2重量%之量存在於光可固化組合物中。 Based on the total weight of the photo-curable composition, one or more electron donor photosensitizers may be present in the photo-curable in an amount of at least 0.000001 wt.% And up to and including 5 wt.% And usually at least 0.0001 wt.% And up to and including 2 wt.%. In the composition.

在一些實施例中,電子供體光敏劑係芘、苯并芘、苝或苯并苝,其基於光可固化組合物之總重量以至少0.0001重量%且至多並包含2重量%之量存在。 In some embodiments, the electron donor photosensitizer is fluorene, benzofluorene, fluorene, or benzofluorene, which is present in an amount of at least 0.0001% by weight and up to and including 2% by weight based on the total weight of the photocurable composition.

在其他實施例中,可使用一或多種電子受體光敏劑及一或多種電子供體共起始劑之組合來代替電子供體光敏劑。 In other embodiments, a combination of one or more electron acceptor photosensitizers and one or more electron donor co-initiators may be used instead of the electron donor photosensitizer.

適宜電子受體光敏劑因應於自輻照吸收之光子引發鎓鹽之化學轉換。電子受體光敏劑亦應能夠在電子受體光敏劑吸收光之後將電子供體共起始劑(如下文所闡述)氧化為自由基陽離子(亦即光誘導之電子轉移)。因此,電子受體光敏劑在自輻照吸收光子後通常能夠自電子供體共起始劑接受電子。 Suitable electron acceptor photosensitizers are responsible for the chemical conversion of onium salts caused by photons absorbed from irradiation. The electron acceptor photosensitizer should also be able to oxidize the electron donor co-initiator (as explained below) to free radical cations (ie, light-induced electron transfer) after the electron acceptor photosensitizer absorbs light. Therefore, electron acceptor photosensitizers are usually able to accept electrons from the electron donor co-initiator after absorbing photons from radiation.

在期望極快速固化(例如固化所施加之組合物薄膜)時,電子受體光敏劑在使用光固化製程之期望輻照波長下可具有至少1000公升-莫耳-1cm-1且通常至少10,000公升-莫耳-1cm-1之消光係數。 When extremely fast curing is desired (e.g., curing of applied composition films), the electron acceptor photosensitizer may have at least 1000 liters-Mole -1 cm -1 and typically at least 10,000 at the desired irradiation wavelength using a photo-curing process. Extinction coefficient of liter-Mole -1 cm -1 .

一般而言,可使用許多不同種類之化合物作為電子受體光敏劑用於各種反應物,前提係滿足上文所論述之能量需求。有用電子受體光敏劑包含但不限於氰基芳香族化合物、芳香族酸酐及亞醯胺及縮合吡啶鎓鹽。其他涉及三重激發態之有用電子受體光敏劑係羰基化合物,例如醌。酮(包含芳香族酮(例如茀酮))及香豆素染料(例如酮基香豆素)(例如具有強吸電子部分者(例如吡啶鎓))亦可用作電子受體光敏 劑。據信,其他適宜電子受體光敏劑包含呫噸染料、吖啶染料、噻唑染料、噻嗪染料、噁嗪染料、吖嗪染料、胺基酮染料、卟啉、芳香族多環烴、對取代之胺基苯乙烯基酮化合物、胺基三芳基甲烷、部花青素、方酸菁染料及吡啶鎓染料。二芳基酮及其他芳香族酮(例如茀酮)係有用之電子受體光敏劑。 In general, many different kinds of compounds can be used as electron acceptor photosensitizers for various reactants, provided that the energy requirements discussed above are met. Useful electron acceptor photosensitizers include, but are not limited to, cyano aromatic compounds, aromatic acid anhydrides, and imidamines and condensed pyridinium salts. Other useful electron acceptor photosensitizers involving triplet excited states are carbonyl compounds, such as quinones. Ketones (including aromatic ketones (such as fluorenone)) and coumarin dyes (such as ketocoumarin) (such as those with a strong electron-withdrawing moiety (such as pyridinium)) can also be used as electron acceptor photosensitizers Agent. It is believed that other suitable electron acceptor photosensitizers include xanthene dye, acridine dye, thiazole dye, thiazine dye, oxazine dye, azine dye, amino ketone dye, porphyrin, aromatic polycyclic hydrocarbon, para-substitution Amine styryl ketone compounds, amine triarylmethanes, merocyanin, squaraine dyes and pyridinium dyes. Diaryl ketones and other aromatic ketones (such as fluorenone) are useful electron acceptor photosensitizers.

基於光可固化組合物之總重量,一或多種電子受體光敏劑可以至少0.000001重量%且至多並包含5重量%及通常至少0.0001重量%且至多並包含2重量%之量存在於光可固化組合物中。 Based on the total weight of the photo-curable composition, one or more electron acceptor photosensitizers may be present in the photo-curable in an amount of at least 0.000001 wt% and up to and including 5 wt% and usually at least 0.0001 wt% and up to and including 2 wt%. In the composition.

藉由在光可固化組合物中包含一或多種電子供體共起始劑,電子受體光敏劑之使用高度有效,每一電子供體共起始劑具有至少0.1V且至多並包含3V之氧化電位(相對於SCE)。該等電子供體共起始劑應可溶於光可固化組合物中。 By including one or more electron donor co-initiators in the photocurable composition, the use of electron acceptor photosensitizers is highly effective. Each electron donor co-initiator has at least 0.1V and at most and contains 3V. Oxidation potential (relative to SCE). These electron donor co-initiators should be soluble in the photocurable composition.

有用之電子供體共起始劑係烷基芳香族聚醚、芳基經一或多個吸電子基團(包含但不限於羧酸、羧酸酯、酮、醛、磺酸、磺酸酯及腈基團)取代之芳基烷基胺基化合物。舉例而言,芳基二烷基二胺基化合物係有用的,其中芳基係經取代或未經取代之苯基或萘基(例如具有一或多個如上所述之吸電子基團之苯基或萘基),且兩個烷基獨立地包括1至6個碳原子。 Useful electron donor co-initiators are alkyl aromatic polyethers, aryl groups via one or more electron withdrawing groups (including but not limited to carboxylic acids, carboxylic acid esters, ketones, aldehydes, sulfonic acids, sulfonic acid esters) And nitrile groups) substituted arylalkylamino compounds. For example, aryldialkyldiamine compounds are useful in which the aryl group is a substituted or unsubstituted phenyl or naphthyl group (e.g., a benzene having one or more electron withdrawing groups as described above). Or naphthyl), and the two alkyl groups independently include 1 to 6 carbon atoms.

一般而言,基於光可固化組合物之總重量,一或多種電子供體共起始劑可以至少0.001重量%且至多並包含10重量%或更通常至少0.005重量%且至多並包含5重量%或甚至至少0.01重量%且至多並包含2重量%之量存在。 In general, based on the total weight of the photocurable composition, the one or more electron donor co-initiators may be at least 0.001% by weight and up to and including 10% by weight or more typically at least 0.005% by weight and up to and including 5% by weight Or it is present in an amount of at least 0.01% by weight and up to and including 2% by weight.

如上所述,所有含有各種基本及可選組份之光可固化組合物可基於光可固化組合物之總重量進一步以至少0.5重量%且至多並包含20重量%或至少1重量%且至多並包含10重量%之量包括經分散碳黑。 As mentioned above, all photocurable compositions containing various basic and optional components may be further at least 0.5% by weight and up to and including 20% by weight or at least 1% by weight based on the total weight of the photocurable composition. Contained in an amount of 10% by weight including dispersed carbon black.

自由基光可固化化學物質:Free radical photocurable chemicals:

在其他實施例中,光可固化組合物可包括一或多種UV可固化組份,其中之至少一者係自由基光可固化組份且光可固化組合物可進一步包括自由基光起始劑以在光固化期間提供自由基。 In other embodiments, the photocurable composition may include one or more UV curable components, at least one of which is a radical photocurable component and the photocurable composition may further include a radical photoinitiator. To provide free radicals during light curing.

可存在一或多自由基可聚合化合物以提供自由基可聚合官能基,包含乙烯系不飽和可聚合單體、寡聚物或聚合物(例如單官能或多官能丙烯酸酯)(亦包含甲基丙烯酸酯)。該等自由基可聚合化合物包括至少一個乙烯系不飽和可聚合鍵(部分)且在許多實施例中其可包括該等不飽和部分中之兩者或更多者。此類適宜材料含有至少一個乙烯系不飽和可聚合鍵且能夠發生加成(或自由基)聚合。該等自由基可聚合材料包含單-、二-或聚丙烯酸酯及甲基丙烯酸酯,包含但不限於丙烯酸甲酯、甲基丙烯酸甲酯、丙烯酸乙酯、甲基丙烯酸異丙基酯、丙烯酸正己基酯、丙烯酸硬脂基酯、丙烯酸烯丙基酯、甘油二丙烯酸酯、甘油三丙烯酸酯、乙二醇二丙烯酸酯、二乙二醇二丙烯酸酯、三乙二醇二甲基丙烯酸酯、1,3-丙二醇二丙烯酸酯、1,3-丙二醇二甲基丙烯酸酯、1,4-丁二醇二丙烯酸酯、1,6-己二醇二丙烯酸酯、新戊二醇二丙烯酸酯、新戊二醇二甲基丙烯酸酯、三羥甲基丙烷三丙烯酸酯、1,2,4-丁烷三醇三甲基丙烯酸酯、1,4-環己二醇二丙烯酸酯、新戊四醇三丙烯酸酯、新戊四醇四丙烯酸酯、新戊四醇四甲基丙烯酸酯、二新戊四醇六丙烯酸酯、山梨醇六丙烯酸酯、雙[1-(2-丙烯醯氧基)]-對乙氧基苯基二甲基甲烷、雙[1-(3-丙烯醯氧基-2-羥基)]-對丙氧基苯基二甲基甲烷及異氰尿酸三羥乙基酯三甲基丙烯酸酯;具有200至500且包含500之分子量之聚乙二醇之雙丙烯酸酯及雙甲基丙烯酸酯;丙烯酸酯單體之可共聚合混合物,例如闡述於美國專利4,652,274(Boettcher等人)中者;及丙烯酸酯寡聚物,例如闡述於美國專利4,642,126(Zader等人)中者;及乙烯基化合物,例如苯乙烯及苯乙烯衍生物、鄰苯二甲酸二烯丙基酯、琥珀酸二乙烯基酯、己二酸二乙烯 基酯及鄰苯二甲酸二乙烯基酯。 One or more free radical polymerizable compounds may be present to provide free radical polymerizable functional groups, including ethylenically unsaturated polymerizable monomers, oligomers, or polymers (such as monofunctional or polyfunctional acrylates) (also containing methyl groups) Acrylate). The radical polymerizable compounds include at least one ethylenically unsaturated polymerizable bond (portion) and in many embodiments it may include two or more of the unsaturated portions. Such suitable materials contain at least one ethylenically unsaturated polymerizable bond and are capable of addition (or radical) polymerization. The free radical polymerizable materials include mono-, di- or polyacrylates and methacrylates, including but not limited to methyl acrylate, methyl methacrylate, ethyl acrylate, isopropyl methacrylate, acrylic acid N-hexyl ester, stearyl acrylate, allyl acrylate, glycerol diacrylate, glycerol triacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol dimethacrylate , 1,3-propanediol diacrylate, 1,3-propanediol dimethacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, neopentyl glycol diacrylate , Neopentyl glycol dimethacrylate, trimethylolpropane triacrylate, 1,2,4-butanetriol trimethacrylate, 1,4-cyclohexanediol diacrylate, neopentyl Tetraol triacrylate, neopentaerythritol tetraacrylate, neopentaerythritol tetramethacrylate, dipentaerythritol hexaacrylate, sorbitol hexaacrylate, bis [1- (2-propenyloxy) )]-P-ethoxyphenyldimethylmethane, bis [1- (3-propenyloxy-2-hydroxy)]-p-propoxyphenyldimethyl Methane and trihydroxyethyl isocyanurate trimethacrylate; diacrylates and bismethacrylates of polyethylene glycol having a molecular weight of 200 to 500 and containing 500; copolymerizable mixtures of acrylate monomers , Such as those described in U.S. Patent 4,652,274 (Boettcher et al.); And acrylate oligomers, such as those described in U.S. Patent 4,642,126 (Zader et al.); And vinyl compounds such as styrene and styrene derivatives, Diallyl phthalate, divinyl succinate, diethylene adipate And divinyl phthalate.

儘管一或多種自由基可聚合材料之量並無特定限制,其可基於光可固化組合物之總重量以至少30重量%且至多並包含90重量%或通常至少40重量%且至多並包含85重量%之量存在於光可固化組合物中。 Although the amount of the one or more radical polymerizable materials is not particularly limited, it may be at least 30% by weight and up to and including 90% by weight or usually at least 40% by weight and up to and including 85 based on the total weight of the photocurable composition. An amount by weight is present in the photocurable composition.

一或多種自由基光起始劑亦可存在於光可固化組合物中以生成自由基。該等自由基光起始劑包含任一能夠在曝光於光固化輻射(例如紫外或可見輻射)後生成自由基之化合物。舉例而言,自由基光起始劑可選自三嗪化合物、噻噸酮化合物、安息香化合物、咔唑化合物、二酮化合物、鋶硼酸鹽化合物、重氮化合物、二苯甲酮化合物及聯咪唑化合物及熟習此項技術者易於明瞭之其他化合物。 One or more free radical photo initiators may also be present in the photocurable composition to generate free radicals. The free radical photoinitiators include any compound capable of generating free radicals upon exposure to photocuring radiation, such as ultraviolet or visible radiation. For example, the radical photoinitiator may be selected from the group consisting of triazine compounds, thioxanthone compounds, benzoin compounds, carbazole compounds, dione compounds, sulfonium borate compounds, diazo compounds, benzophenone compounds, and biimidazole Compounds and other compounds readily understood by those skilled in the art.

基於光可固化組合物之總重量,一或多種自由基光起始劑可以至少0.3重量%且至多並包含10重量%或通常至少0.4重量%且至多並包含10重量%或甚至至少0.5重量%且至多並包含5重量%之量存在於光可固化組合物中。 Based on the total weight of the photocurable composition, the one or more free radical photoinitiators may be at least 0.3% by weight and up to and including 10% by weight or usually at least 0.4% by weight and up to and including 10% by weight or even at least 0.5% by weight And is present in the photocurable composition in an amount up to and including 5% by weight.

本文所闡述之光可固化組合物(酸催化化學物質或自由基化學物質)通常包含可用作用於無電電鍍製程之晶種金屬催化位點之適宜金屬顆粒。通常,僅使用一類金屬顆粒,但亦可包含來自相同或不同種類金屬且彼此不干擾之金屬顆粒之混合物。該等金屬顆粒通常具有淨中性電荷。 The photocurable compositions (acid-catalyzed chemicals or free-radical chemicals) described herein generally include suitable metal particles that can be used as seed metal catalytic sites for electroless plating processes. Generally, only one type of metal particles is used, but a mixture of metal particles from the same or different metal types that do not interfere with each other can also be included. The metal particles typically have a net neutral charge.

有用之金屬顆粒可選自一或多種種類之貴金屬、半貴金屬、第IV族金屬或其組合。有用之金屬顆粒包含但不限於金、銀、鈀、鉑、銠、銥、錸、汞、釕、鋨、鐵、鈷、鎳、銅、鋁、鋅及鎢之顆粒。有用之第IV族金屬顆粒包含但不限於錫、鈦及鍺之顆粒。貴金屬顆粒(例如銀、鈀及鉑之顆粒)尤其有用,且鎳及銅之半貴顆粒亦尤其有用。錫顆粒在第IV族金屬種類中尤其有用。在許多實施例中,光可固 化組合物中使用銀顆粒或銅顆粒。 Useful metal particles may be selected from one or more types of precious metals, semi-precious metals, Group IV metals, or combinations thereof. Useful metal particles include, but are not limited to, particles of gold, silver, palladium, platinum, rhodium, iridium, osmium, mercury, ruthenium, osmium, iron, cobalt, nickel, copper, aluminum, zinc, and tungsten. Useful Group IV metal particles include, but are not limited to, particles of tin, titanium, and germanium. Precious metal particles (such as particles of silver, palladium, and platinum) are particularly useful, as are semi-precious particles of nickel and copper. Tin particles are particularly useful in Group IV metal species. In many embodiments, light can be fixed Silver particles or copper particles are used in the chemical composition.

可使用表面活性劑、聚合物或碳塗覆可用於本發明中之金屬顆粒且使其彼此分離。碳塗覆金屬顆粒上之碳可具有非晶形、sp2混成或類石墨烯性質。該碳可用於防止金屬顆粒之聚集且提供改良之於光可聚合組合物中之分散性。有用碳塗覆金屬顆粒包含碳塗覆銀顆粒及碳塗覆銅顆粒或碳塗覆銀顆粒及碳塗覆銅顆粒之混合物。 Surfactants, polymers, or carbon can be used to coat and separate metal particles that can be used in the present invention. The carbon on the carbon-coated metal particles can have amorphous, sp2-mixed, or graphene-like properties. The carbon can be used to prevent the aggregation of metal particles and provide improved dispersibility in the photopolymerizable composition. Useful carbon-coated metal particles include carbon-coated silver particles and carbon-coated copper particles or a mixture of carbon-coated silver particles and carbon-coated copper particles.

可用於光可固化組合物中之金屬顆粒可分散於各種有機溶劑中且可在光可固化組合物之其他組份(例如多官能聚合物環氧材料)存在下或在可選組份(例如下文所闡述之多官能丙烯酸酯樹脂)存在下具有改良分散性。有用分散劑為業內已知且亦可存在(若期望)。用於分散金屬顆粒之方法包含但不限於球磨、磁攪拌、高速均質化、高壓均質化及超音波處理。 The metal particles that can be used in the photocurable composition can be dispersed in various organic solvents and can be in the presence of other components of the photocurable composition (such as a multifunctional polymer epoxy material) or in optional components (such as The multifunctional acrylate resins described below have improved dispersibility. Useful dispersants are known in the art and may also be present if desired. Methods for dispersing metal particles include, but are not limited to, ball milling, magnetic stirring, high-speed homogenization, high-pressure homogenization, and ultrasonic processing.

可用於該等實施例中之金屬顆粒可作為個別顆粒存在於光可固化組合物中,但在許多實施例中,金屬顆粒係作為兩種或更多種金屬顆粒之團聚物存在。該等金屬顆粒可以任一幾何形狀存在,包含但不限於球形、桿形、棱柱形、立方形、圓錐形、棱錐形、絲線形、薄片形、小板形及其組合,且其形狀及大小可為均勻或非均勻的。個別及團聚金屬顆粒之平均粒徑可自至少0.01μm且至多並包含25μm或更可能至少0.02μm且至多並包含5μm變化。儘管金屬顆粒之大小並無特定限制,但最佳益處可使用平均粒徑為至少0.02μm且至多並包含10μm之個別顆粒或團聚物形式之金屬顆粒來達成。粒徑分佈合意地較窄,如其中大於50%或通常至少75%之顆粒之粒徑在平均粒徑之0.2倍至2倍範圍內所定義。平均粒徑(average particle size)(與平均粒徑(mean particle size)相同)可自可使用任一適宜程序及設備(包含購自Coulter或Horiba者)及該設備使用之適當數學計算確定之粒徑分佈來確定。 The metal particles that can be used in these embodiments can exist as individual particles in the photocurable composition, but in many embodiments, the metal particles exist as agglomerates of two or more metal particles. These metal particles can exist in any geometric shape, including but not limited to spherical, rod-shaped, prism-shaped, cubic, cone-shaped, pyramid-shaped, wire-shaped, lamellar, platelet-shaped, and combinations thereof, and their shapes and sizes It can be uniform or non-uniform. The average particle size of the individual and agglomerated metal particles may vary from at least 0.01 μm and up to and including 25 μm or more likely at least 0.02 μm and up to and including 5 μm. Although the size of the metal particles is not particularly limited, the best benefit can be achieved using metal particles in the form of individual particles or aggregates having an average particle size of at least 0.02 μm and up to and including 10 μm. The particle size distribution is desirably narrow, as defined by a particle size in which more than 50% or usually at least 75% of the particles is in the range of 0.2 to 2 times the average particle size. The average particle size (same as the mean particle size) can be determined from any suitable procedure and equipment (including those purchased from Coulter or Horiba) and the appropriate mathematical calculations used for the equipment Diameter distribution.

在使用碳塗覆金屬顆粒時,其可經設計以具有等於或小於0.6μm或小於0.2μm或更可能小於0.1μm之中值顆粒直徑。該等碳塗覆金屬顆粒通常具有0.005μm之最小中值直徑。可使用動態光散射方法測定中值顆粒直徑[Dv(50%)]。舉例而言,可使用可在商業上自Malvern Instruments有限公司獲得之Malvern Zetasizer Nano ZS實施此一方法。 When carbon-coated metal particles are used, they can be designed to have a median particle diameter that is equal to or less than 0.6 μm or less than 0.2 μm or more possibly less than 0.1 μm. The carbon-coated metal particles typically have a minimum median diameter of 0.005 μm. The median particle diameter [Dv (50%)] can be determined using a dynamic light scattering method. For example, this method can be implemented using a Malvern Zetasizer Nano ZS commercially available from Malvern Instruments Ltd.

光可固化組合物通常提供於用作溶解或分散光可固化組合物之組份之非水性(有機)溶劑或溶劑組合之適宜有機稀釋劑中。在許多實施例中,有機稀釋劑係有機溶劑介質,其包含一或多種惰性有機溶劑,例如2-乙氧基乙醇、2-(2-甲氧基乙氧基)乙醇、2-(2-乙氧基乙氧基)乙醇、1-甲氧基-2-丙醇(DOWANOLTM PM有機溶劑)、4-庚酮、3-庚酮、2-庚酮、環戊酮、環己酮、碳酸二乙酯、乙酸2-乙氧基乙基酯、丁酸正丁基酯、丙酮、二氯甲烷、異丙醇、乙二醇及乳酸甲酯。「惰性」意指有機溶劑並不明顯參與任一化學反應。 Photocurable compositions are typically provided in a suitable organic diluent that is a non-aqueous (organic) solvent or solvent combination used as a component to dissolve or disperse the photocurable composition. In many embodiments, the organic diluent is an organic solvent medium comprising one or more inert organic solvents, such as 2-ethoxyethanol, 2- (2-methoxyethoxy) ethanol, 2- (2- (Ethoxyethoxy) ethanol, 1-methoxy-2-propanol (DOWANOL TM PM organic solvent), 4-heptanone, 3-heptanone, 2-heptanone, cyclopentanone, cyclohexanone, Diethyl carbonate, 2-ethoxyethyl acetate, n-butyl butyrate, acetone, dichloromethane, isopropanol, ethylene glycol, and methyl lactate. "Inert" means that the organic solvent does not significantly participate in any chemical reaction.

基於光可固化組合物之總重量,有機稀釋劑(例如有機溶劑介質)可佔至多並包含1重量%或至多至少70重量%或至少10重量%且至多並包含30重量%。有機稀釋劑通常包含極少或不含水(通常小於總光可固化組合物重量之5重量%),從而光可固化組合物可視為「光可固化組合物」。 Based on the total weight of the photocurable composition, the organic diluent (such as an organic solvent medium) may account for up to and including 1% by weight or up to at least 70% by weight or at least 10% by weight and up to and including 30% by weight. Organic diluents usually contain little or no water (usually less than 5% by weight of the total photocurable composition), so that the photocurable composition can be considered a "photocurable composition."

在一或多種光可固化組份(如上文所闡述)以液體有機化合物形式存在時,彼等一或多種光可固化組份可用作有機稀釋劑且可無需單獨惰性有機溶劑。在該等情況下,有機稀釋劑可視為「反應性」稀釋劑。另一選擇為,一或多種反應性稀釋劑可與一或多種惰性有機溶劑組合使用以形成適宜有機稀釋劑。 When one or more photocurable components (as set forth above) are present as liquid organic compounds, their one or more photocurable components can be used as organic diluents and may not require a separate inert organic solvent. In these cases, organic diluents can be considered "reactive" diluents. Alternatively, one or more reactive diluents can be used in combination with one or more inert organic solvents to form a suitable organic diluent.

物件object

可如上文所闡述來調配上文所闡述之光可固化組合物且使用任 一適宜方式施加至任一適宜基板(闡述於下文中)之一或兩個支撐側(平面側)以形成「前體物件」。舉例而言,可使用(例如)浸塗、輥塗、料斗塗覆、噴塗、旋塗、噴墨、光微影壓印、使用柔版印刷部件(例如柔版印刷板及柔版印刷套筒))之柔版印刷、使用微影印刷板之微影印刷及使用適當印刷部件之凹版(gravure或intaglio)印刷以均勻或逐圖案方式將光可固化組合物施加至一或兩個支撐側。使用柔版印刷部件之柔版印刷可用於將相同或不同光可固化組合物之多個圖案提供於基板之一或兩個支撐側及基板任一支撐側之一或多個部分中(例如在其係連續透明聚合物網片時)。 The light-curable composition described above can be formulated as described above and used at any time. A suitable method is applied to one or both support sides (planar sides) of any suitable substrate (described below) to form a "precursor article". For example, dip coating, roll coating, hopper coating, spray coating, spin coating, inkjet, photolithography, and the use of flexographic printing components such as flexographic printing plates and flexographic printing sleeves can be used )) Flexographic printing, lithographic printing using lithographic printing plates, and gravure or intaglio printing with appropriate printed parts, apply the photocurable composition to one or two supporting sides in a uniform or pattern-wise manner. Flexographic printing using flexographic printing components can be used to provide multiple patterns of the same or different photocurable compositions on one or both of the substrate's supporting sides and one or more portions of either of the substrate's supporting sides (e.g., in When it is a continuous transparent polymer mesh).

所施加光可固化組合物可形成及乾燥為均勻層或乾燥為預定圖案。所得物件可視為在如下文所闡述實施光固化之前之「前體」物件。 The applied photo-curable composition may be formed and dried into a uniform layer or dried into a predetermined pattern. The resulting article can be considered as a "precursor" article prior to photocuring as explained below.

如下文更詳細所述,用於該等物件之基板可由任一有用材料構成且可為具有任一適宜大小及形狀之個別膜或薄片(例如由金屬材料、玻璃、紙料(任一類型之纖維素材料)或陶瓷構成),或其可為材料連續網片(例如連續透明聚合物網片,例如連續聚(對苯二甲酸乙二酯)網片)。 As described in more detail below, the substrates used for such objects can be constructed from any useful material and can be individual films or sheets of any suitable size and shape (e.g., metallic materials, glass, paper (any type of Cellulosic material) or ceramic), or it may be a continuous web of material (eg, a continuous transparent polymer mesh, such as a continuous poly (ethylene terephthalate) mesh).

在乾燥光可固化組合物中,金屬顆粒(例如碳塗覆金屬顆粒)可以至少10重量%且至多並包含90重量%之量存在,顆粒分散劑可以至少1重量%且至多並包含30重量%之量存在,個別碳顆粒可以至多並包含20重量%之量存在,且光可固化組份(闡述於上文中,在固化之前)可以至多並包含90重量%之量存在。 In the dry photocurable composition, metal particles (such as carbon-coated metal particles) may be present in an amount of at least 10% by weight and up to and including 90% by weight, and the particle dispersant may be at least 1% by weight and up to and including 30% by weight The amount is present, individual carbon particles may be present in an amount of up to and including 20% by weight, and the photocurable component (explained above, before curing) may be present in an amount of up to and including 90% by weight.

在以適宜方式(例如以逐圖案方式)將光可固化組合物施加於透明基板之一或兩個支撐側上後,可以適宜方式處理所得中間物件從而以適宜圖案光固化光可固化組合物以提供具有晶種金屬觸媒之導電圖案。 After the photo-curable composition is applied on one or both of the supporting sides of the transparent substrate in a suitable manner (for example, in a pattern-by-pattern manner), the resulting intermediate article may be appropriately processed to photo-curable the photo-curable composition in a suitable pattern to Provide a conductive pattern with a seed metal catalyst.

可將適宜乾燥最外聚合物塗層佈置於每一導電金屬圖案之整個表面上,但在大部分實施例中,其係僅佈置於導電金屬圖案之一部分上。舉例而言,可使用如上文所闡述之非交聯熱塑性聚合物將其佈置於整個導電金屬柵格上,但僅佈置於導電金屬連結器之一部分上。乾燥最外聚合物層之此配置可佈置於第一支撐側及相對第二支撐側中之僅一者上,或佈置於該等支撐側中之二者上。 A suitable dry outermost polymer coating may be disposed on the entire surface of each conductive metal pattern, but in most embodiments, it is disposed on only a portion of the conductive metal pattern. For example, a non-crosslinked thermoplastic polymer as set forth above can be used to place the entire conductive metal grid, but only on a portion of the conductive metal connector. This configuration of the dried outermost polymer layer may be arranged on only one of the first supporting side and the opposite second supporting side, or on both of the supporting sides.

乾燥最外聚合物塗層可具有小於5μm或更可能小於3μm或甚至小於1μm之乾燥厚度。最大乾燥厚度並無限制,但出於實踐目的,最大乾燥厚度為最大20μm。乾燥最外聚合物塗層亦具有至少80%或更可能至少90%之積分透射率(如使用上文所闡述之技術所量測)及至少65℃(如上文所闡述)之玻璃轉變溫度。在一些實施例中,乾燥最外聚合物塗層具有小於3μm之乾燥厚度及大於90%之積分透射率,且非交聯熱塑性聚合物係為非交聯熱塑性丙烯酸聚合物之非交聯熱塑性非芳香族聚合物。 The dried outermost polymer coating may have a dry thickness of less than 5 μm or more possibly less than 3 μm or even less than 1 μm. The maximum dry thickness is not limited, but for practical purposes, the maximum dry thickness is a maximum of 20 μm. The dried outermost polymer coating also has an integrated transmittance of at least 80% or more likely of at least 90% (as measured using the techniques set forth above) and a glass transition temperature of at least 65 ° C (as set forth above). In some embodiments, the dried outermost polymer coating has a dry thickness of less than 3 μm and an integrated transmittance of greater than 90%, and the non-crosslinked thermoplastic polymer is a non-crosslinked thermoplastic non-crosslinked thermoplastic acrylic polymer. Aromatic polymer.

在一些尤其有用之實施例中,該等物件在透明基板之第一支撐側及相對第二支撐側中之一者或兩者上包括導電圖案(例如導電金屬圖案),其包括導電金屬圖案,例如由金屬線構成,該等金屬線係由銀、銅、鈀或鉑及尤其銅或銀構成。另外,可藉由無電電鍍碳塗覆金屬顆粒(例如碳塗覆銀顆粒)及視情況與碳塗覆金屬顆粒混合之個別碳顆粒來獲得該等導電金屬圖案。在導電金屬圖案具有導電金屬柵格及導電金屬連結器之情形下,導電金屬連結器可具有類似構成,只是其可實質上不包括個別碳顆粒(此意味著存在小於5重量%之個別碳顆粒)。 In some particularly useful embodiments, the objects include a conductive pattern (such as a conductive metal pattern) on one or both of the first support side and the opposite second support side of the transparent substrate, including a conductive metal pattern, For example, they are composed of metal wires, which are composed of silver, copper, palladium or platinum, and especially copper or silver. In addition, the conductive metal patterns can be obtained by electrolessly plating carbon-coated metal particles (such as carbon-coated silver particles) and individual carbon particles mixed with the carbon-coated metal particles as appropriate. In the case where the conductive metal pattern has a conductive metal grid and a conductive metal connector, the conductive metal connector may have a similar configuration, except that it may not substantially include individual carbon particles (this means that there are individual carbon particles less than 5% by weight) ).

因此,在使中間物件經受用於光固化佈置於透明基板之支撐側上之光可固化組合物之條件且使用下文所闡述的程序及設備形成乾燥最外聚合物塗層後,可將所得產品物件納入需要導電圖案之觸控螢幕 或其他器件中。 Therefore, after subjecting the intermediate article to conditions for photo-curing a photo-curable composition disposed on a supporting side of a transparent substrate and forming a dry outermost polymer coating using the procedures and equipment described below, the resulting product can be Objects incorporated into touch screens that require conductive patterns Or other devices.

光可固化組合物之用途Uses of photocurable compositions

在提供乾燥最外聚合物塗層後,可使用適宜輻射(包含紫外光或可見光化光或二者)光固化(或光聚合)本文所闡述之光可固化組合物。可使用一或多種適宜光源用於曝光過程。可個別地以單一元件形式暴露每一前體物件,或在下文所闡述之替代實施例中,在使連續聚合物網片通過暴露站時,或在使暴露器件以期望路徑通過連續透明聚合物網片上方時,可個別地或共同暴露連續網片(例如捲對捲連續透明聚合物網片,其在連續透明聚合物網片之一或兩個支撐側之多個部分中包括多個前體物件(包括多個光可固化圖案))。可於基板之兩個支撐側上施加(例如使用柔版印刷術及柔版印刷部件印刷)相同或不同光可固化組合物,無論基板呈單一元件抑或連續透明聚合物網片形式。在許多實施例中,可使用本文所闡述之光可固化組合物在基板(或連續聚合物網片)之相對支撐側形成不同導電圖案。 After the dry outermost polymer coating is provided, the light-curable composition described herein can be photocured (or photopolymerized) using suitable radiation (including ultraviolet or visible light or both). One or more suitable light sources may be used for the exposure process. Each precursor article may be individually exposed as a single element, or in alternative embodiments described below, when passing a continuous polymer web through an exposure station, or when passing an exposed device through a continuous transparent polymer in a desired path When above the mesh, continuous meshes (such as roll-to-roll continuous transparent polymer meshes) can be exposed individually or collectively. Body (including multiple photo-curable patterns). The same or different photocurable compositions can be applied (eg, printed using flexography and flexographic printing components) on the two supporting sides of the substrate, whether the substrate is in the form of a single element or a continuous transparent polymer mesh. In many embodiments, the photo-curable composition described herein can be used to form different conductive patterns on opposite support sides of a substrate (or continuous polymer mesh).

在將光可固化組合物均勻施加至適宜基板時,可使用曝光輻射經由具有期望圖案之適宜光遮罩(遮蔽元件)使所得均勻乾燥層「成像」或選擇性曝光(或圖案化),且然後使用溶解或以其他方式去除非光固化材料之適宜「顯影劑」溶液適當去除非交聯(非固化)光可固化組合物。該等特徵或步驟可在基板之兩個(相對)支撐側上實施。若期望,則可使用相同或不同光遮罩在乾燥層中形成多個導電及光固化圖案。 When the photocurable composition is uniformly applied to a suitable substrate, the resulting uniform dry layer can be "imaged" or selectively exposed (or patterned) via a suitable light mask (masking element) with a desired pattern using exposure radiation, and A suitable "developer" solution that dissolves or otherwise removes the non-photocurable material is then used to properly remove the non-crosslinked (non-cured) photocurable composition. These features or steps may be implemented on two (opposite) support sides of the substrate. If desired, multiple conductive and photo-curable patterns can be formed in the dried layer using the same or different photomasks.

更可能的是,可在適宜基板上使用如下文所闡述之方法形成一或多種光可固化組合物之預定圖案。 It is more likely that a predetermined pattern of one or more photocurable compositions can be formed on a suitable substrate using a method as described below.

可用於提供前體基板之適宜基板(亦在業內稱為「接收器元件」)可由任一適宜材料構成,只要其不抑制光可固化組合物之目的。舉例而言,有用基板可自包含但不限於以下之材料形成:聚合物膜、金 屬、紙料、剛性或柔性玻璃(未經處理或經(例如)四氟碳電漿、疏水氟或矽氧烷防水材料處理)、矽或陶瓷晶圓、織物及其組合(例如各種膜之壓層或紙與膜之壓層),前提係可以適宜方式在該基板上形成光可固化組合物之均勻層或圖案且隨後輻照而在其至少一個接收(支撐)表面上形成均勻的光固化層或一或多種光固化圖案。基板可為透明的、半透明或不透明的及剛性的或撓性的。許多有用基板係透明的且具有至少90%之積分透射率,且該等透明基板亦可為撓性連續透明聚合物網片。 A suitable substrate (also known in the industry as a "receiver element") that can be used to provide a precursor substrate can be composed of any suitable material as long as it does not inhibit the purpose of the photocurable composition. For example, useful substrates can be formed from materials that include but are not limited to: polymer films, gold Metal, paper, rigid or flexible glass (untreated or treated with, for example, a Teflon plasma, hydrophobic fluorine or silicone waterproofing material), silicon or ceramic wafers, fabrics and combinations thereof (e.g. various membranes Lamination or lamination of paper and film) provided that a uniform layer or pattern of photocurable composition can be formed on the substrate in a suitable manner and then irradiated to form uniform light on at least one of its receiving (supporting) surfaces. A cured layer or one or more light-cured patterns. The substrate may be transparent, translucent or opaque, and rigid or flexible. Many useful substrates are transparent and have an integrated transmittance of at least 90%, and the transparent substrates can also be flexible continuous transparent polymer meshes.

在一些實施例中,基板可包括單獨接收層作為佈置於基板上之接收表面,該接收層及基板可由諸如高度接收光可固化組合物之適宜聚合物材料等材料構成。該等接收層之乾燥厚度在25℃下量測時可為至少0.05μm且至多並包含10μm,或通常至少0.05μm且至多並包含3μm。 In some embodiments, the substrate may include a separate receiving layer as a receiving surface disposed on the substrate, and the receiving layer and the substrate may be composed of a material such as a suitable polymer material that highly receives the light-curable composition. The dry thickness of the receiving layers when measured at 25 ° C may be at least 0.05 μm and up to and including 10 μm, or usually at least 0.05 μm and up to and including 3 μm.

更尤其地,用於形成連續透明聚合物網片形式之前體物件之適宜基板材料包含但不限於金屬膜或箔、位於聚合物上之金屬膜(例如使用導電聚合物膜上之金屬膜)、撓性玻璃、半導電有機或無機膜、有機或無機介電膜或該等材料之兩個或更多個層之壓層。舉例而言,有用連續透明聚合物網片基板可包含聚合膜(例如聚(對苯二甲酸乙二酯)膜、聚(萘二甲酸乙二酯)膜、聚醯亞胺膜、聚碳酸酯膜、聚丙烯酸酯膜、聚苯乙烯膜、聚烯烴膜及聚醯胺膜)、金屬箔(例如鋁箔)、纖維素紙或樹脂塗覆或玻璃塗覆紙、紙板網片及金屬化聚合物膜。 More particularly, suitable substrate materials for forming precursor objects in the form of continuous transparent polymer mesh include, but are not limited to, metal films or foils, metal films on polymers (e.g., metal films on conductive polymer films), Flexible glass, semi-conductive organic or inorganic film, organic or inorganic dielectric film or a laminate of two or more layers of these materials. For example, a useful continuous transparent polymer mesh substrate may include a polymeric film (e.g., a poly (ethylene terephthalate) film, a poly (ethylene naphthalate) film, a polyimide film, a polycarbonate Film, polyacrylate film, polystyrene film, polyolefin film, and polyamide film), metal foils (such as aluminum foil), cellulose or resin-coated or glass-coated paper, paperboard mesh, and metalized polymers membrane.

尤其有用之基板係如上文所闡述具有大於90%之積分透射率之透明聚酯膜。 A particularly useful substrate is a transparent polyester film having an integrated transmittance of greater than 90% as explained above.

在一些實施例中,可混合第一聚合物乳膠及第二聚合物乳膠以在基板上形成乾燥底漆層,從而黏附具有使用光可固化組合物形成之精細導電線之圖案化材料。第一聚合物乳膠可包括第一聚合物及第一 表面活性劑,從而第一聚合物乳膠之乾燥塗層具有至少50%之表面極性。第二聚合物乳膠可包括第二聚合物及第二表面活性劑,從而第二聚合物乳膠之乾燥塗層具有小於或等於27%之表面極性。 In some embodiments, the first polymer latex and the second polymer latex may be mixed to form a dry primer layer on a substrate, thereby adhering a patterned material having fine conductive lines formed using a photo-curable composition. The first polymer latex may include a first polymer and a first polymer A surfactant, so that the dry coating of the first polymer latex has a surface polarity of at least 50%. The second polymer latex may include a second polymer and a second surfactant, so that the dry coating of the second polymer latex has a surface polarity of less than or equal to 27%.

本文所闡述第一及第二聚合物中之至少一者包括含有至少一部分地衍生自(甲基)丙烯酸縮水甘油基酯(意指丙烯酸縮水甘油基酯、甲基丙烯酸縮水甘油基酯或二者)之重複單元之乙烯基聚合物。另外,第一聚合物及第二聚合物中之至少一者係可交聯的,該聚合物可(例如)在將聚合物混合物塗覆於適宜載體上之後(例如在基板之乾燥或各種熱處理期間)發生交聯。 At least one of the first and second polymers described herein includes containing at least a portion derived from glycidyl (meth) acrylate (meaning glycidyl acrylate, glycidyl methacrylate, or both) ) Of vinyl polymer. In addition, at least one of the first polymer and the second polymer is cross-linkable, and the polymer may be, for example, after a polymer mixture is coated on a suitable carrier (for example, drying on a substrate or various heat treatments) Period).

第一聚合物可為衍生自(甲基)丙烯酸縮水甘油基酯之均聚物,但更可能地,其係衍生自(甲基)丙烯酸縮水甘油基酯及一或多種其他乙烯系不飽和可聚合單體之共聚物。 The first polymer may be a homopolymer derived from glycidyl (meth) acrylate, but more likely, it is derived from glycidyl (meth) acrylate and one or more other ethylenically unsaturated polymers. Copolymer of polymerized monomers.

第二聚合物乳膠可包括一或多種第二聚合物及一或多種第二表面活性劑(闡述於下文中),從而第二聚合物乳膠之乾燥塗層具有小於或等於28%或小於或等於27%之表面極性。如上文針對第一聚合物所闡述,尤其有用之第二聚合物係至少一部分地衍生自一或多種縮水甘油基官能乙烯系不飽和可聚合單體(例如(甲基)丙烯酸縮水甘油基酯,例如丙烯酸縮水甘油基酯及甲基丙烯酸縮水甘油基酯)之乙烯基聚合物。因此,第二聚合物可為衍生自(甲基)丙烯酸縮水甘油基酯之均聚物或衍生自(甲基)丙烯酸縮水甘油基酯及一或多種其他乙烯系不飽和可聚合單體之共聚物。 The second polymer latex may include one or more second polymers and one or more second surfactants (described below) so that the dry coating of the second polymer latex has less than or equal to 28% or less than or equal to 27% surface polarity. As explained above for the first polymer, a particularly useful second polymer is derived at least in part from one or more glycidyl-functional ethylenically unsaturated polymerizable monomers (eg, glycidyl (meth) acrylate, Examples are vinyl polymers of glycidyl acrylate and glycidyl methacrylate). Therefore, the second polymer may be a homopolymer derived from glycidyl (meth) acrylate or a copolymer derived from glycidyl (meth) acrylate and one or more other ethylenically unsaturated polymerizable monomers. Thing.

第一聚合物乳膠包括一或多種第一表面活性劑,其中之每一者係烷基磺酸鈉鹽,其中烷基具有至少10個碳原子。舉例而言,第一表面活性劑可為α-烯烴(C14-C16)磺酸鈉,或第一表面活性劑可為由R-CH2-CH=CH-CH2-S(=O)2O-Na+(其中R係C10、C11或C12烴基團)代表之化合物或該等化合物之混合物(其中不同R基團係C10至C12烴基團中之 任一者)。 The first polymer latex includes one or more first surfactants, each of which is a sodium alkylsulfonic acid salt, wherein the alkyl group has at least 10 carbon atoms. For example, the first surfactant may be an α-olefin (C 14 -C 16 ) sodium sulfonate, or the first surfactant may be R-CH 2 -CH = CH-CH 2 -S (= O ) 2 O - Na + (wherein R is a C 10 , C 11 or C 12 hydrocarbon group) or a mixture of these compounds (wherein different R groups are any of C 10 to C 12 hydrocarbon groups) .

第二聚合物乳膠包括一或多種第二表面活性劑,其中之每一者係具有至少3個環氧乙烷單元之烷基酚硫酸銨。舉例而言,第二表面活性劑可為聚乙氧基壬基酚硫酸銨鹽,或第二表面活性劑可由R’-苯基-(O-CH2CH2)n-S(=O)O2 -NH4 +代表,其中R’係C8至C12烴基團且n至少為3且至多並包含10,或更可能地n至少為3且至多並包含6。 The second polymer latex includes one or more second surfactants, each of which is an alkylphenol ammonium sulfate having at least 3 ethylene oxide units. For example, the second surfactant may be polyethoxynonylphenol ammonium sulfate, or the second surfactant may be R'-phenyl- (O-CH 2 CH 2 ) n -S (= O) O 2 - NH 4 + representatives, where R 'based C 8 to C 12 hydrocarbyl group and n is at least 3 and up to 10, and comprising, or more likely, n is at least 3 and up to 6, and comprising.

用於製備本文所闡述物件之基板可以各種形式提供,例如呈任一大小或形狀之個別薄片及連續網片(例如適於捲至捲操作之連續透明聚合物網片(包含連續透明聚酯網片)之連續網)。該等連續聚合物網片可分成或形成個別之第一、第二及其他部分,該等部分可用於形成相同或不同之光固化導電圖案。 The substrates used to prepare the articles described herein can be provided in various forms, such as individual sheets and continuous meshes of any size or shape (e.g., continuous transparent polymer meshes suitable for roll-to-roll operations (including continuous transparent polyester meshes) Film) of continuous network). These continuous polymer meshes can be divided or formed into individual first, second, and other portions, and these portions can be used to form the same or different light-curable conductive patterns.

在逐圖案施加光可固化組合物之後,可藉由蒸發(例如並不不利地影響剩餘組份或過早引起光固化之乾燥或預烘焙程序)去除任何剩餘有機溶劑。在下文所闡述之大部分製程(例如捲至捲製程)中,乾燥條件可處於足夠高之溫度及適宜乾燥設備下以在至少5秒內去除所有惰性有機溶劑之至少90%。舉例而言,可藉由使用熱空氣噴射、在室溫下蒸發或在升高溫度下於烘箱中加熱來達成惰性有機溶劑之適宜去除。 After the photo-curable composition is applied pattern by pattern, any remaining organic solvents can be removed by evaporation, such as a drying or pre-baking process that does not adversely affect the remaining components or cause photo-curing prematurely. In most of the processes described below (eg, roll-to-roll processes), the drying conditions can be at a sufficiently high temperature and suitable drying equipment to remove at least 90% of all inert organic solvents in at least 5 seconds. For example, a suitable removal of the inert organic solvent can be achieved by using hot air spray, evaporation at room temperature, or heating in an oven at an elevated temperature.

任一所施加之均勻的光可固化組合物層之乾燥厚度可為至少0.1μm且至多並包含10μm或通常至少0.2μm且至多並包含1μm,且最佳乾燥厚度可針對所得均勻光固化層之預期應用來調節,其通常具有與均勻之非光固化光可固化組合物層大約相同之乾燥厚度。 The dry thickness of any of the applied uniform photo-curable composition layers may be at least 0.1 μm and at most and includes 10 μm or usually at least 0.2 μm and at most and includes 1 μm, and the optimal dry thickness may be for the resulting uniform photo-curable layer. The application is intended to be adjusted, which typically has a dry thickness of about the same as a uniform non-photocurable photocurable composition layer.

任一所施加之光可固化組合物圖案可包括平均乾燥寬度為至少0.2μm且至多並包含100μm或通常至少5μm且至多並包含10μm線柵格(或其他形狀(包含圓、菱形或橢圓形或不規則網絡)之圖案),且最佳乾燥寬度可針對所得均勻光固化層之預期用途來調節,該所得均勻 光固化層通常具有尺寸基本上與非光固化導電金屬線相同之光固化及導電金屬線。 Any of the applied photo-curable composition patterns may include an average dry width of at least 0.2 μm and up to and including 100 μm or typically at least 5 μm and up to and including 10 μm line grids (or other shapes (including circles, diamonds, or ovals or Pattern of irregular network), and the optimal drying width can be adjusted for the intended use of the obtained uniform photo-curable layer, which is uniform The photo-curable layer typically has a photo-curable and conductive metal wire having substantially the same size as the non-photo-curable conductive metal wire.

在一些實施例中,可以適宜方式將相同或不同之光可固化組合物施加於基板之兩個支撐側(平面表面)上以形成「雙向」或雙側之前體物件,且每一所施加光可固化組合物可呈相同或不同之均勻層或預定圖案之形式。 In some embodiments, the same or different light-curable compositions may be applied to the two support sides (planar surfaces) of the substrate in a suitable manner to form a "two-way" or two-sided precursor object, and each applied light The curable composition may be in the form of the same or different uniform layers or predetermined patterns.

在許多實施例中,使用任一已知印刷方法(例如噴墨印刷、凹版印刷或柔版印刷(其中凸版元件(例如彈性凸版元件(柔版印刷部件))源於柔版印刷板前體))將光可固化組合物之圖案施加於基板(例如作為輥至輥連續網片)之一或兩個(相對)支撐側上,許多該等印刷部件已為業內所知且一些以(例如)CYREL®柔版光聚合物板購自DuPont及以Flexcel SR及NX柔版板及Flexcel直接柔版板購自Eastman Kodak公司。 In many embodiments, any known printing method is used (e.g., inkjet printing, gravure printing, or flexographic printing (where a relief element (e.g., an elastic relief element (flexographic printing component) is derived from a flexographic printing plate precursor)) The pattern of the photocurable composition is applied to one or both (opposite) support sides of a substrate (e.g., as a roll-to-roll continuous web), many of these printed components are known in the industry and some are, for example, CYREL ® flexographic photopolymer plates were purchased from DuPont and Flexcel SR and NX flexographic plates and Flexcel direct flexographic plates were purchased from Eastman Kodak.

尤其有用之彈性凸版元件源於柔版印刷板前體及柔版印刷套筒前體,其中之每一者可適當地成像(及處理(若需要))以提供凸版元件用於「印刷」或施加光可固化組合物之適宜圖案。 Particularly useful elastic letterpress elements are derived from flexographic printing plate precursors and flexographic printing sleeve precursors, each of which can be appropriately imaged (and processed (if needed)) to provide letterpress elements for "printing" or application Suitable patterns for photocurable compositions.

在其他實施例中,在利用或不利用整體遮罩之情形下自直接(或剝蝕)雷射可雕刻彈性凸版元件前體提供彈性凸版元件,如以下專利中所闡述:例如美國專利5,719,009(Fan)、5,798,202(Cushner等人)、5,804,353(Cushner等人)、6,090,529(Gelbart)、6,159,659(Gelbart)、6,511,784(Hiller等人)、7,811,744(Figov)、7,947,426(Figov等人)、8,114,572(Landry-Coltrain等人)、8,153,347(Veres等人)、8,187,793(Regan等人)及美國專利申請公開案2002/0136969(Hiller等人)、2003/0129530(Leinenback等人)、2003/0136285(Telser等人)、2003/0180636(Kanga等人)及2012/0240802(Landry-Coltrain等人)。 In other embodiments, an elastic letterpress element is provided from a direct (or ablated) laser engravable elastic letterpress element precursor with or without the use of an integral mask, as set forth in the following patents: for example, US Patent No. 5,719,009 (Fan ), 5,798,202 (Cushner et al.), 5,804,353 (Cushner et al.), 6,090,529 (Gelbart), 6,159,659 (Gelbart), 6,511,784 (Hiller et al.), 7,811,744 (Figov), 7,947,426 (Figov et al.), 8,114,572 (Landry-Coltrain) Et al.), 8,153,347 (Veres et al.), 8,187,793 (Regan et al.) And U.S. Patent Application Publication 2002/0136969 (Hiller et al.), 2003/0129530 (Leinenback et al.), 2003/0136285 (Telser et al.), 2003/0180636 (Kanga et al.) And 2012/0240802 (Landry-Coltrain et al.).

在使用彈性凸版元件時,可以適宜方式將光可固化組合物施加至彈性凸版元件中之最上凸版表面(凸起表面)上。可使用適宜方式實 現該施加且期望儘可能少地塗覆至凸版凹陷之側(斜坡)或凹部。可使用網紋輥系統或其他輥施加系統、尤其低容量網紋輥(低於25億立方微米/平方英吋(63.5億立方微米/平方公分))及相關研磨刀。可藉由控制黏度或厚度或選擇適當施加方式來達成光可固化組合物至最上凸版表面上之最佳計量。舉例而言,光可固化組合物可經調配以具有用於該等應用之至少1cps(厘泊)且至多並包含5000cps之黏度。凸版影像上之光可固化組合物之厚度通常限於在施加期間可易於轉移至基板但不會太多以致於在凹部中之彈性凸版元件之邊緣上流動之足夠量。 When using an elastic relief member, the photocurable composition can be applied to the uppermost relief surface (convex surface) of the elastic relief member in a suitable manner. You can use appropriate methods It is now applied and it is desirable to apply as little as possible to the sides (slopes) or recesses of the relief of the relief. Anilox roll systems or other roll application systems can be used, especially low capacity anilox rolls (less than 2.5 billion cubic micrometers per square inch (6.35 billion cubic micrometers per square centimeter)) and related abrasive knives. Optimal metering of the photocurable composition to the uppermost relief surface can be achieved by controlling the viscosity or thickness or selecting an appropriate application method. For example, a photocurable composition can be formulated to have a viscosity of at least 1 cps (centipoise) for such applications and up to and including 5000 cps. The thickness of the photo-curable composition on the letterpress image is generally limited to a sufficient amount that can be easily transferred to the substrate during application but not so much as to flow over the edges of the elastic letterpress element in the recess.

因此,可自網紋或其他輥噴墨系統以用於每一印刷前體物件(以均勻層或圖案形式)之量測量來供給光可固化組合物。在一實施例中,可使用第一輥將光可固化組合物自「油墨」盤或計量系統轉移至計量輥或網紋輥。光可固化組合物在其自網紋輥轉移至印刷板滾筒時通常計量至均勻厚度。在以連續網片形式經由捲至捲處置系統將基板自印刷板滾筒移動至壓印滾筒時,壓印滾筒將壓力施加至印刷板滾筒,從而將光可固化組合物之影像自彈性凸版元件轉移至基板。 Thus, the photocurable composition can be supplied from an anilox or other roller inkjet system in an amount measurement for each printed precursor object (in the form of a uniform layer or pattern). In one embodiment, a first roll can be used to transfer the photocurable composition from an "ink" tray or metering system to a metering or anilox roll. The photocurable composition is typically metered to a uniform thickness as it is transferred from the anilox roll to the printing plate cylinder. When the substrate is moved from the printing plate cylinder to the impression cylinder via a roll-to-roll processing system in a continuous web, the impression cylinder applies pressure to the printing plate cylinder, thereby transferring the image of the photocurable composition from the elastic letterpress element. To the substrate.

在基板上後,在柵格線或其他形狀之均勻層或預定圖案中(在基板之一或兩個相對側上),可利用如上文所闡述來自適宜來源(例如螢光燈或LED)之適宜輻射輻照前體物件中之光可固化組合物以在基板上提供光固化層或一或多種光固化圖案。舉例而言,光固化可藉由使用波長(λmax)為至少190nm且至多並包含700nm且強度為至少1,000微瓦特(microwatt)/cm2且至多並包含80,000微瓦特/cm2之UV-可見輻照來達成。用於生成該輻射之輻照系統可由一或多個(例如)呈1至50個放電燈形式之紫外燈組成,例如氙、金屬鹵化物、金屬弧(例如具有自數毫米至約10個大氣壓之期望操作壓力之低壓、中壓或高壓汞蒸氣放電燈)。該等燈可包含能夠傳送波長為至少190nm且至多並包含700nm或通常至少240nm且至多並包含450nm之光之殼。燈殼可由石英 (例如光譜純石英(spectrocil)或派熱克斯玻璃(Pyrex))組成。可用於提供紫外輻射之典型燈係(例如)中壓汞弧,例如GE H3T7弧及Hanovia 450W弧燈。光固化可使用各種燈之組合來實施,一些或所有該等燈可在惰性氣氛中操作。在使用UV燈時,碰撞在基板(或所施加之層或圖案)上之輻照通量可經設計以足以使所施加光可固化組合物以連續方式(例如以捲至捲操作)在1秒至20秒內實現足夠迅速之光固化。 After being on the substrate, in a uniform layer or predetermined pattern of grid lines or other shapes (on one or two opposite sides of the substrate), the It is suitable to irradiate the photo-curable composition in the precursor object to provide a photo-curable layer or one or more photo-curable patterns on a substrate. For example, photocuring may be used by the wavelength (λ max) of at least 190nm and 700nm and containing up to and intensity of at least 000 microwatt (microwatt) / cm 2 and up to 80,000 and comprising microwatt / cm UV- 2 it visible Irradiation to reach. The irradiation system used to generate the radiation may consist of one or more UV lamps in the form of, for example, 1 to 50 discharge lamps, such as xenon, metal halides, metal arcs (e.g. Low pressure, medium pressure or high pressure mercury vapor discharge lamp with the desired operating pressure). Such lamps may include a shell capable of transmitting light having a wavelength of at least 190 nm and up to and including 700 nm or typically at least 240 nm and up to and including 450 nm. The lamp housing may be composed of quartz, such as spectrocil or Pyrex. Typical lamps that can be used to provide UV radiation are, for example, medium pressure mercury arcs, such as the GE H3T7 arc and Hanovia 450W arc lamps. Light curing can be implemented using a combination of various lamps, and some or all of these lamps can be operated in an inert atmosphere. When using a UV lamp, the radiation flux impinging on the substrate (or the applied layer or pattern) may be designed to be sufficient for the applied photo-curable composition to be applied in a continuous manner (e.g., in a roll-to-roll operation) at 1 Sufficiently fast light curing within seconds to 20 seconds.

欲用於光固化中之LED輻照器件可具有350nm或更大之發射峰波長。LED器件可包含兩種或更多種類型之具有大於或等於350nm之不同發射峰波長之元件。具有350nm或更大之發射峰波長且具有紫外光發射二極體(UV-LED)之LED器件之商業實例係購自Nichia公司之NCCU-033。 The LED irradiation device to be used in photo-curing may have an emission peak wavelength of 350 nm or more. The LED device may include two or more types of elements having different emission peak wavelengths greater than or equal to 350 nm. A commercial example of an LED device having an emission peak wavelength of 350 nm or more and having an ultraviolet light emitting diode (UV-LED) is NCCU-033 from Nichia Corporation.

前體物件之該輻照會得到包括基板(例如個別薄片或連續網片)且其上具有衍生自基板上一或兩個支撐側上之光可固化組合物之光固化層或一或多種光固化圖案之中間物件。每一光固化圖案通常含有可如下文所闡述無電電鍍之「晶種」金屬顆粒。 This irradiation of the precursor article results in a light-curing layer or one or more light comprising a substrate (e.g., individual sheets or continuous webs) having a light-curable composition derived from one or two supporting sides on the substrate thereon The middle object of the cured pattern. Each photo-curable pattern typically contains "seed" metal particles that can be electrolessly plated as described below.

可進一步處理所得中間物件以在均勻光固化層或光固化圖案(其中之每一者包含金屬顆粒作為用於進一步(例如)使用無電金屬電鍍程序施加導電金屬之「晶種」材料)上納入導電金屬。舉例而言,如上文所闡述之無電「晶種」金屬顆粒可包含銀、鈀或鉑顆粒或其混合物以及上文所闡述之碳塗覆金屬顆粒,其可如下文所闡述使用銀、銅、鉑、鈀或其他金屬進行無電電鍍。 The resulting intermediate objects can be further processed to incorporate electrical conductivity on a uniform photo-curable layer or photo-curable pattern (each of which contains metal particles as a "seed" material for further, for example, applying a conductive metal using an electroless metal plating process) metal. For example, the electroless "seed" metal particles as described above may include silver, palladium, or platinum particles or mixtures thereof and the carbon-coated metal particles described above, which may use silver, copper, Electroless plating of platinum, palladium or other metals.

本發明之一種有用方法在印刷站中使用呈堆疊形式之多個柔版印刷板(例如如上文所闡述製得),其中每一堆疊其本身具有印刷板滾筒,從而使用每一柔版印刷板來印刷個別基板,或可使用印刷板之堆疊來印刷連續透明聚合物網片(在一或兩個支撐側上)中之多個部分。可使用多個柔版印刷板將相同或不同的光可固化組合物「印刷」或施 加至此一基板(在相同或相對支撐側上)。 A useful method of the present invention uses a plurality of flexographic printing plates in a stack (e.g., made as explained above) in a printing station, where each stack itself has a printing plate cylinder, thereby using each flexographic printing plate To print individual substrates, or a stack of printing plates can be used to print multiple portions of a continuous transparent polymer mesh (on one or two support sides). Multiple flexographic printing plates can be used to "print" or apply the same or different photocurable compositions. Add to this one substrate (on the same or opposite support side).

在其他實施例中,可與安裝於印刷機框架上之單一壓印滾筒一起使用中心壓印滾筒。在基板(或接收器元件)進入印刷機框架時,使其與壓印滾筒接觸且利用光可固化組合物印刷適當圖案。另一選擇為,可利用線上柔版印刷製程,其中印刷站係排列成水平線且由常見線軸驅動。印刷站可耦合至曝光站、切割站、摺疊機及其他後處理設備。熟習此項技術者可使用業內可獲得之資訊容易地確定設備及站之其他有用構形。舉例而言,於WO 2013/063084(Jin等人)中闡述全方位(in-the-round)製程。 In other embodiments, a central impression cylinder may be used with a single impression cylinder mounted on a printing press frame. As the substrate (or receiver element) enters the printer frame, it is brought into contact with the impression cylinder and a suitable pattern is printed with the photo-curable composition. Alternatively, an on-line flexographic printing process can be used, in which the printing stations are arranged in horizontal lines and driven by common spools. Printing stations can be coupled to exposure stations, cutting stations, folding machines and other post-processing equipment. Those skilled in the art can easily determine other useful configurations of equipment and stations using information available in the industry. For example, an in-the-round process is described in WO 2013/063084 (Jin et al.).

可將本文所闡述具有含有金屬顆粒之所闡述光固化導電圖案之中間物件立即浸沒於基於水性之無電金屬電鍍浴或溶液中,或可儲存僅具有光固化圖案之中間物件(例如以捲起之連續網片形式)供隨後使用。 Intermediate articles described herein having a photocurable conductive pattern containing metal particles can be immediately immersed in a water-based electroless metal plating bath or solution, or intermediate articles with only photocurable patterns can be stored (e.g., rolled up Continuous mesh format) for subsequent use.

舉例而言,可使每一中間物件與光固化圖案內所納入金屬顆粒內之金屬相同或不同之無電電鍍金屬接觸。在大部分實施例中,然而,無電電鍍金屬係不同於分散於光固化圖案內之金屬顆粒中所使用之金屬的金屬。 For example, each intermediate object can be brought into contact with an electroless plated metal that is the same as or different from the metal contained in the metal particles in the photo-curable pattern. In most embodiments, however, the electroless plated metal is a metal different from the metal used in the metal particles dispersed in the photo-curable pattern.

此時可使用將可能無電「電鍍」於金屬顆粒上之任一金屬,但在大部分實施例中,無電電鍍金屬可為(例如)銅(II)、銀(I)、金(IV)、鈀(II)、鉑(II)、鎳(II)、鉻(II)及其組合。銅(II)、銀(I)及鎳(II)係用於銀、銅、鉑或鈀晶種金屬觸媒之尤其有用之無電電鍍金屬。在一些實施例中,所得導電金屬圖案係由呈晶種金屬觸媒或電鍍金屬或二者之形式之銀、銅、鈀或鉑或其組合構成。 Any metal that may be electrolessly "plated" on the metal particles may be used at this time, but in most embodiments, the electroless plated metal may be, for example, copper (II), silver (I), gold (IV), Palladium (II), platinum (II), nickel (II), chromium (II), and combinations thereof. Copper (II), silver (I), and nickel (II) are particularly useful electroless plated metals for silver, copper, platinum, or palladium seed metal catalysts. In some embodiments, the resulting conductive metal pattern is composed of silver, copper, palladium, or platinum or a combination thereof in the form of a seed metal catalyst or a plated metal or both.

無電電鍍可使用已知溫度及時間條件來實施,此乃因該等條件在各種教科書及科學文獻中眾所周知。亦已知基於水性之無電電鍍溶液中包含各種添加劑,例如金屬錯合劑或穩定劑。時間及溫度之變化 可用於改變金屬無電電鍍厚度或金屬無電電鍍沈積速率。 Electroless plating can be performed using known temperature and time conditions because these conditions are well known in various textbooks and scientific literature. It is also known to include various additives such as metal complexing agents or stabilizers in aqueous-based electroless plating solutions. Changes in time and temperature Can be used to change metal electroless plating thickness or metal electroless plating deposition rate.

在用於在基板之一或兩個支撐側之一或多個部分上提供導電圖案之無電電鍍程序之後,可自基於水性之無電電鍍浴或溶液取出所得產品物件且使用蒸餾水或去離子水或另一基於水性之溶液洗滌以去除任何殘餘無電電鍍化學物質。此時,無電電鍍金屬通常較為穩定且可用於其預期目的以形成具有期望導電金屬圖案之各種導電物件。 After an electroless plating procedure for providing a conductive pattern on one or more portions of one or both support sides of the substrate, the resulting product article can be removed from an aqueous based electroless plating bath or solution and distilled or deionized water or Another aqueous-based solution washes to remove any residual electroless plating chemicals. At this time, electroless plated metal is generally relatively stable and can be used for its intended purpose to form various conductive objects having a desired conductive metal pattern.

在一些實施例中,所得產品物件可如(例如)US 2014/0071356(Petcavich)之[0048]中所闡述在室溫下使用水或如WO 2013/169345(Ramakrishnan等人)之[0027]中所闡述在小於70℃之溫度下使用去離子水來沖洗或清洗。 In some embodiments, the resulting product article may use water at room temperature as described in, for example, [0048] of US 2014/0071356 (Petcavich) or as in [0027] of WO 2013/169345 (Ramakrishnan et al.) Rinse or rinse with deionized water at temperatures less than 70 ° C.

為出於視覺或耐久性原因改變無電電鍍金屬之表面,可採用各種後處理,包含在無電電鍍金屬上表面電鍍再至少另一(第三或更多)金屬(例如鎳或銀)(此程序有時稱為「覆蓋」),或產生足以改變表面色彩及散射性質而不降低無電電鍍(第二)金屬之導電率之金屬氧化物、金屬硫化物或金屬硒化物層。 To change the surface of electroless plated metal for visual or durability reasons, various post-treatments can be used, including electroplating on the top surface of electroless plated metal and then at least another (third or more) metal (such as nickel or silver) (this procedure (Sometimes referred to as "covering"), or a layer of metal oxide, metal sulfide, or metal selenide sufficient to alter the surface color and scattering properties without reducing the conductivity of the electroless (second) metal.

用於實施本發明一些實施例之有用方法及裝置之一些細節闡述於(例如)US 2014/0071356(闡述於上文中)及WO 2013/169345(闡述於上文中)。由Petcavich及Jin於2012年10月29日提出申請之PCT/US/062366中提供用於尤其以捲至捲方式製備導電物件之有用之製造系統之其他細節。 Some details of useful methods and devices for implementing some embodiments of the invention are set forth, for example, in US 2014/0071356 (described above) and WO 2013/169345 (described above). Further details of a useful manufacturing system for the preparation of conductive objects, especially in a roll-to-roll manner, are provided in PCT / US / 062366, filed by Petcavich and Jin on October 29, 2012.

可用於實施本發明之設備及步驟特徵之額外系統闡述於美國專利第14/146,867號(2014年1月3日由Shifley提出申請)中。 Additional systems that can be used to implement the features of the apparatus and steps of the present invention are described in US Patent No. 14 / 146,867 (filed by Shifley on January 3, 2014).

本文所闡述之光可固化組合物可用於提供一或多種導電物件之方法中。此方法包括提供連續透明聚合物網片[例如由聚(對苯二甲酸乙二酯)構成]。 The photocurable compositions described herein can be used in a method of providing one or more conductive articles. This method includes providing a continuous transparent polymer mesh [for example, composed of poly (ethylene terephthalate)].

在至少透明基板之連續網片之第一部分上,方法亦包含形成包 括如上文所闡述之光可固化組份及分散金屬顆粒之光可固化組合物(如本文所闡述)之光可固化圖案。然後光固化光可固化圖案以在連續網片之第一部分上形成光固化圖案,該光固化圖案包括分散金屬顆粒(闡述於上文中)作為晶種金屬觸媒位點。然後可使用導電金屬(如上文所闡述)該光固化圖案無電電鍍於連續網片之第一部分上。 On a first portion of a continuous mesh of at least a transparent substrate, the method also includes forming a package Including the photo-curable components of the photo-curable composition as described above and the photo-curable composition of the dispersed metal particles (as described herein). The photocurable pattern is then photocured to form a photocurable pattern on the first portion of the continuous mesh, the photocurable pattern including dispersed metal particles (described above) as seed metal catalyst sites. The photocurable pattern can then be electrolessly plated on the first portion of the continuous mesh using a conductive metal (as set forth above).

此方法可進一步包括:在連續網片中一或多個不同於第一部分之其他部分上使用相同或不同光可固化組合物再實施上文所闡述之形成、光固化及無電電鍍特徵一或多次。以該方式,可在基板之相同或不同支撐側上形成多個光固化及無電電鍍圖案。所得導電圖案可具有相同組成、圖案或導電性,或其可在任一或所有該等特徵中皆不同(如自消費者需要預先確定)。該多個無電板圖案可在透明聚合物網片中一或兩個支撐側上之多個部分中之每一者上分別形成為多個導電柵格及連結至其之多個導電連結器。如下文更詳細所述,可在多個部分中之任一者中於至少一部分但非全部每一導電圖案上形成乾燥最外聚合物塗層。以此方式在透明基板中第一支撐側及相對第二支撐側中之一者或二者上形成之導電金屬圖案可包括導電金屬線,其包括銀、銅、鈀或鉑或該等金屬中之兩者或更多者。 This method may further include: using the same or different photo-curable composition on one or more parts of the continuous web different from the first part and then implementing one or more of the formation, photo-curing, and electroless plating features described above Times. In this way, multiple photo-curable and electroless plating patterns can be formed on the same or different support sides of the substrate. The resulting conductive patterns may have the same composition, pattern, or conductivity, or they may be different in any or all of these characteristics (such as predetermined by the consumer). The plurality of electroless plate patterns may be formed as a plurality of conductive grids and a plurality of conductive connectors connected to each of the plurality of portions on one or two supporting sides in the transparent polymer mesh, respectively. As described in more detail below, a dry outermost polymer coating can be formed on at least a portion but not all of each conductive pattern in any of a plurality of portions. The conductive metal pattern formed on one or both of the first support side and the opposite second support side in the transparent substrate in this manner may include a conductive metal wire including silver, copper, palladium, or platinum or the like. Two or more of them.

因此,本發明方法可用於提供複數個前體物件,其包括:藉由使用柔版印刷部件將光可固化組合物施加至連續透明聚合物網片之第一部分上來在該第一部分上形成第一光可固化圖案,使包括第一光可固化圖案之連續透明聚合物網片前進以接近曝光輻射,且由此在第一部分上形成第一光固化圖案,藉由使用柔版印刷部件將相同或不同之光可固化組合物施加至連續透明聚合物網片之第二部分來在該第二部分上形成第二光可固化圖案, 使包括第二光可固化圖案之連續透明聚合物網片前進以接近曝光輻射,且由此在第二部分上形成第二光固化圖案,視情況,以類似方式使用相同或不同之光可固化組合物及相同或不同之柔版印刷部件在連續透明聚合物網片之一或多個其他各別部分上形成一或多個其他光固化圖案,及捲繞包括多個光固化圖案之連續透明聚合物網片,或將連續網片立即用於進一步處理(例如無電電鍍)且在組裝成電子器件之前提供乾燥最外聚合物塗層。 Therefore, the method of the present invention can be used to provide a plurality of precursor objects, including: forming a first on the first portion by applying a photocurable composition to a first portion of a continuous transparent polymer mesh using a flexographic printing member. The photo-curable pattern advances a continuous transparent polymer mesh including the first photo-curable pattern to approximate exposure to radiation, and thereby forms a first photo-curable pattern on the first portion by using the flexographic printing member to convert the same or A different photo-curable composition is applied to the second part of the continuous transparent polymer mesh to form a second photo-curable pattern on the second part, A continuous transparent polymer mesh including a second photo-curable pattern is advanced to approximate exposure to radiation, and a second photo-curable pattern is thereby formed on the second portion, using the same or different light-curables in a similar manner, as appropriate, The composition and the same or different flexographic printing parts form one or more other photo-curable patterns on one or more other respective portions of the continuous transparent polymer mesh, and rolls a continuous transparent pattern including a plurality of photo-curable patterns A polymer mesh, or a continuous mesh is immediately used for further processing (eg, electroless plating) and a dry outermost polymer coating is provided before assembly into an electronic device.

因此,該方法可進一步包括:自包括多個光固化圖案之連續透明聚合物網片形成多個導電物件,在多個光固化圖案中之每一者之至少一部分但非全部部分上形成乾燥最外聚合物塗層(如本文所闡述),及將個別導電物件組裝成相同或不同之個別電子器件(例如相同或不同之觸控螢幕顯示器或器件)。 Therefore, the method may further include forming a plurality of conductive objects from a continuous transparent polymer mesh including a plurality of photo-curable patterns, and forming a dry layer on at least a portion but not all of each of the plurality of photo-curable patterns An outer polymer coating (as explained herein), and the assembly of individual conductive objects into the same or different individual electronic devices (eg, the same or different touch screen displays or devices).

該方法亦可包括:無電電鍍連續透明聚合物網片中之多個光固化導電圖案中之每一者以形成多個導電物件,且形成期望乾燥最外聚合物塗層,且可藉由相同或不同之使用者將所得導電物件組裝成相同或不同之個別電子器件。該等器件可為觸控螢幕或其他顯示器件,其亦包含適宜控制器、外殼及軟體以用於經由網際網路進行之任一類型之期望通信。另一選擇為,器件可為該等觸控螢幕或其他顯示器件之子組件。在一些實施例中,由本發明提供之器件係觸控螢幕,其各自具有至少1cm2且至多並包含100m2之觀看面積。觸控螢幕之大小及形狀可端視預期用途而有所變化。 The method may also include: electrolessly plating each of a plurality of photo-curable conductive patterns in a continuous transparent polymer mesh to form a plurality of conductive objects, and forming a desired outermost polymer coating that may be dried by the same Or different users assemble the obtained conductive objects into the same or different individual electronic devices. These devices may be touch screens or other display devices, which also include suitable controllers, housings, and software for any type of desired communication over the Internet. Alternatively, the device may be a sub-component of these touch screens or other display devices. In some embodiments, the devices provided by the present invention are touch screens, each of which has a viewing area of at least 1 cm 2 and up to and including 100 m 2 . The size and shape of the touch screen can vary depending on the intended use.

在一些實施例中,本發明方法可用於製備包括觸控螢幕之電子 器件,該方法包括:將一或多個個別導電物件組裝成器件外殼以形成觸控螢幕區,一或多個個別導電物件中之每一者包括含有導電金屬(無電電鍍於衍生自本文所闡述光可固化組合物之光固化導電圖案上)之導電圖案,且將乾燥最外聚合物塗層佈置於至少一部分但非全部導電金屬圖案上。 In some embodiments, the method of the present invention can be used to prepare an electronic device including a touch screen. Device, the method comprising: assembling one or more individual conductive objects into a device housing to form a touch screen area, each of the one or more individual conductive objects including a conductive metal (electrolessly electroplated derived from that described herein On the photocurable conductive pattern of the photocurable composition), and the dried outermost polymer coating is disposed on at least a portion but not all of the conductive metal pattern.

可藉由以下方式來製備本文所闡述之乾燥最外聚合物塗層:首先將一或多種適宜非交聯熱塑性聚合物溶於適當溶劑(或其混合物)中,隨後將所得最外聚合物塗層調配物印刷或施加於導電圖案之一部分上。適宜非交聯熱塑性聚合物包含彼等詳細闡述於上文中者。 The dry outermost polymer coatings described herein can be prepared by first dissolving one or more suitable non-crosslinked thermoplastic polymers in a suitable solvent (or mixture thereof), and then coating the resulting outermost polymer The layer formulation is printed or applied on a portion of the conductive pattern. Suitable non-crosslinked thermoplastic polymers include those detailed above.

用於非交聯熱塑性聚合物之適當溶劑包含但不限於醇、醚及二醇醚,例如二丙二醇甲醚、1-甲氧基-2-丙醇及乙酸2-甲氧基-1-甲基乙基酯。可將其他材料添加至最外聚合物塗層調配物中以賦予其期望性質,且該等材料可用於控制黏度或其可為用於修改表面張力之表面活性劑。 Suitable solvents for non-crosslinked thermoplastic polymers include, but are not limited to, alcohols, ethers, and glycol ethers, such as dipropylene glycol methyl ether, 1-methoxy-2-propanol, and 2-methoxy-1-methyl acetate Ethyl ester. Other materials can be added to the outermost polymer coating formulation to impart its desired properties, and these materials can be used to control viscosity or they can be surfactants used to modify surface tension.

根據本發明,可使用業內已知之各種沈積或印刷技術將最外聚合物塗層調配物佈置於基板中一或兩個支撐側上之至少一部分導電圖案上。該等技術包含但不限於柔版印刷、網版印刷、凹版印刷、噴墨印刷及狹縫沈積。可使用沈積方法將最外聚合物塗層調配物一次性施加於一個導電圖案中(例如間歇式製程)或以連續捲對捲製程施加於多個導電圖案中。 According to the present invention, the outermost polymer coating formulation can be arranged on at least a portion of the conductive pattern on one or two support sides in a substrate using various deposition or printing techniques known in the art. These technologies include, but are not limited to, flexographic printing, screen printing, gravure printing, inkjet printing, and slit deposition. The deposition method can be used to apply the outermost polymer coating formulation to one conductive pattern at a time (eg, a batch process) or to multiple conductive patterns in a continuous roll-to-roll process.

可將根據本發明製得之有用產品物件調配成包括導電金屬圖案之適宜圖案及發明性乾燥最外聚合物塗層之電容性觸控螢幕感測器。舉例而言,可藉由以下方式在導電圖案中形成導電金屬柵格及導電金屬連結器:以預定圖案印刷光可固化組合物,隨後使用如上文所闡述之適宜金屬無電電鍍印刷圖案。亦可使用如上文所闡述之柔版印刷將 乾燥最外聚合物塗層調配物僅施加於導電金屬圖案上。 A useful product article made according to the present invention can be formulated into a suitable pattern including a conductive metal pattern and a capacitive touch screen sensor with an inventive dry outermost polymer coating. For example, a conductive metal grid and a conductive metal connector can be formed in a conductive pattern by printing a photo-curable composition in a predetermined pattern and then printing the pattern using a suitable metal electroless plating as described above. You can also use flexo printing as explained above The dry outermost polymer coating formulation is applied only to the conductive metal pattern.

本發明提供至少以下實施例及其組合,但特徵之其他組合被視為在本發明內,如熟習此項技術者自此揭示內容之教示將瞭解: The present invention provides at least the following embodiments and combinations thereof, but other combinations of features are considered to be within the present invention, as those skilled in the art will appreciate from the teachings disclosed herein since then:

1.一種導電物件,其包括:透明基板,其具有第一支撐側及相對第二支撐側;佈置於至少該第一支撐側上之導電圖案,及乾燥最外聚合物塗層,其佈置於至少一部分但非全部該導電圖案上,該乾燥最外聚合物塗層具有小於5μm之乾燥厚度、至少80%之積分透射率且包括玻璃轉變溫度(Tg)等於或大於65℃之非交聯熱塑性聚合物。 1. A conductive object comprising: a transparent substrate having a first support side and an opposite second support side; a conductive pattern disposed on at least the first support side, and a dry outermost polymer coating layer disposed on On at least a portion but not all of the conductive pattern, the dried outermost polymer coating has a dry thickness of less than 5 μm, an integrated transmittance of at least 80%, and includes non-crosslinked glass transition temperature (T g ) equal to or greater than 65 ° C. Thermoplastic polymer.

2.如實施例1之導電物件,其中該導電圖案至少包括:導電柵格;及導電連結器,其連結至該導電柵格。 2. The conductive object according to embodiment 1, wherein the conductive pattern includes at least: a conductive grid; and a conductive connector connected to the conductive grid.

3.如實施例2之導電物件,其中該乾燥最外聚合物塗層佈置於100%或以下之該導電柵格上,但該乾燥最外聚合物塗層佈置於小於100%之該導電連結器上。 3. The conductive article according to embodiment 2, wherein the dry outermost polymer coating is arranged on the conductive grid of 100% or less, but the dry outermost polymer coating is arranged on the conductive connection less than 100% Device.

4.如實施例2或3之導電物件,其中該導電柵格係導電金屬柵格且該導電連結器係連結至其之導電金屬連結器。 4. The conductive object according to embodiment 2 or 3, wherein the conductive grid is a conductive metal grid and the conductive connector is a conductive metal connector connected thereto.

5.如實施例1至4中任一項之導電物件,其進一步包括:佈置於該透明基板之相對第二支撐側上之導電圖案,及乾燥最外聚合物層,其佈置於該透明基板中該相對第二支撐側上之至少一部分但非全部該導電圖案上,此乾燥聚合物塗層具有小於5μm之乾燥厚度、至少80%之積分透射率且包括玻璃轉變溫度(Tg)等於或大於65℃之非交聯熱塑性聚合物。 5. The conductive article according to any one of embodiments 1 to 4, further comprising: a conductive pattern arranged on the opposite second support side of the transparent substrate, and a dry outermost polymer layer arranged on the transparent substrate On at least a part but not all of the conductive pattern on the opposite second supporting side, the dried polymer coating has a dry thickness of less than 5 μm, an integrated transmittance of at least 80%, and includes a glass transition temperature (T g ) equal to or Non-crosslinked thermoplastic polymers above 65 ° C.

6.如實施例5之導電物件,其中該導電圖案至少包括:導電柵格,及 導電連結器,其連結至該導電柵格。 6. The conductive object of embodiment 5, wherein the conductive pattern includes at least: a conductive grid, and A conductive connector connected to the conductive grid.

7.如實施例6之導電物件,其中該乾燥最外聚合物塗層佈置於100%或以下之該導電柵格上,但該乾燥最外聚合物塗層佈置於小於100%之該導電連結器上,其皆位於該透明基板之該相對第二支撐側上。 7. The conductive article according to embodiment 6, wherein the dry outermost polymer coating is arranged on the conductive grid of 100% or less, but the dry outermost polymer coating is arranged on the conductive connection less than 100% On the device, they are all located on the opposite second supporting side of the transparent substrate.

8.如實施例1至7中任一項之導電物件,其中該非交聯熱塑性聚合物係非交聯、非芳香族熱塑性聚合物。 8. The conductive article according to any one of embodiments 1 to 7, wherein the non-crosslinked thermoplastic polymer is a non-crosslinked, non-aromatic thermoplastic polymer.

9.如實施例1至8中任一項之導電物件,其中該乾燥最外聚合物塗層具有小於3μm之乾燥厚度。 9. The conductive article according to any one of embodiments 1 to 8, wherein the dried outermost polymer coating has a dry thickness of less than 3 μm.

10.如實施例1至9中任一項之導電物件,其中該非交聯熱塑性聚合物係非交聯熱塑性丙烯酸聚合物。 10. The conductive article according to any one of embodiments 1 to 9, wherein the non-crosslinked thermoplastic polymer is a non-crosslinked thermoplastic acrylic polymer.

11.如實施例1至10中任一項之導電物件,其中該非交聯熱塑性聚合物包括至少衍生自(甲基)丙烯酸甲酯之重複單元及衍生自(甲基)丙烯酸烷基酯之重複單元,其中該烷基具有1至18個碳原子,其中衍生自(甲基)丙烯酸烷基酯之該等重複單元佔總聚合物重複單元之至少5mol%且至多並包含25mol%。 11. The conductive article according to any one of embodiments 1 to 10, wherein the non-crosslinked thermoplastic polymer includes at least repeating units derived from methyl (meth) acrylate and repeats derived from alkyl (meth) acrylate Unit, wherein the alkyl group has 1 to 18 carbon atoms, wherein the repeating units derived from the alkyl (meth) acrylate account for at least 5 mol% and up to and including 25 mol% of the total polymer repeating units.

12.如實施例1至11中任一項之導電物件,其中至少佈置於該透明基板之該第一支撐側上之該導電圖案包括由至少銀、銅、鈀或鉑構成之導電金屬線。 12. The conductive article according to any one of embodiments 1 to 11, wherein the conductive pattern arranged at least on the first support side of the transparent substrate includes a conductive metal wire composed of at least silver, copper, palladium, or platinum.

13.如實施例5至12中任一項之導電物件,其中佈置於該透明基板之該相對第二支撐側上之該導電圖案包括至少由銀、銅、鈀或鉑構成之導電金屬線。 13. The conductive object according to any one of embodiments 5 to 12, wherein the conductive pattern disposed on the opposite second support side of the transparent substrate includes a conductive metal wire composed of at least silver, copper, palladium, or platinum.

14.如實施例1至13中任一項之導電物件,其中該透明基板係連續透明聚合物網片,且該物件包括相同或不同之佈置於上該連續透明聚合物網片中該第一支撐側之至少第一部分及該相對第二支撐側之至少第一部分上的導電圖案。 14. The conductive object according to any one of embodiments 1 to 13, wherein the transparent substrate is a continuous transparent polymer mesh, and the object includes the same or different ones of the first in the continuous transparent polymer mesh. A conductive pattern on at least a first portion of the support side and at least a first portion of the opposite second support side.

15.如實施例14之導電物件,其中該連續透明聚合物網片包括:位於該第一支撐側上之多個部分及位於該相對第二支撐側上之多個部分;分別佈置於該透明基板中該第一支撐側及該相對第二支撐側上之該多個部分上之相同或不同之導電圖案;及乾燥最外聚合物塗層,其佈置於至少一部分但非全部每一導電圖案上。 15. The conductive article according to embodiment 14, wherein the continuous transparent polymer mesh comprises: a plurality of portions on the first support side and a plurality of portions on the opposite second support side; and each of the portions is disposed on the transparent portion. The same or different conductive patterns on the first support side and the plurality of portions on the opposite second support side in the substrate; and a dry outermost polymer coating disposed on at least a portion but not all of each conductive pattern on.

16.一種電子器件,其包括作為觸控螢幕之如實施例1至15中任一項之導電物件。 16. An electronic device comprising a conductive object as in any one of embodiments 1 to 15 as a touch screen.

17.如實施例16之電子器件,其中該觸控螢幕具有至少1cm2且至多並包含100m2之觀看面積。 17. The electronic device of embodiment 16, wherein the touch screen has a viewing area of at least 1 cm 2 and up to and including 100 m 2 .

18.一種提供如實施例1至15中任一項之導電物件之方法,該方法包括:在透明基板之第一支撐側上形成導電圖案,該透明基板亦包括相對第二支撐側;及在至少一部分但非全部該導電圖案上形成乾燥最外聚合物塗層,該乾燥聚合物塗層具有小於5μm之乾燥厚度、至少80%之積分透射率且包括玻璃轉變溫度(Tg)等於或大於65℃之非交聯熱塑性聚合物。 18. A method of providing a conductive article as in any one of embodiments 1 to 15, the method comprising: forming a conductive pattern on a first support side of a transparent substrate, the transparent substrate also including an opposite second support side; and A dry outermost polymer coating is formed on at least a portion but not all of the conductive pattern, the dry polymer coating having a dry thickness of less than 5 μm, an integrated transmittance of at least 80%, and including a glass transition temperature (T g ) equal to or greater than 65 ° C non-crosslinked thermoplastic polymer.

19.如實施例18之方法,其中該導電圖案至少包括:導電柵格,及導電連結器,其連結至該導電柵格。 19. The method of embodiment 18, wherein the conductive pattern comprises at least: a conductive grid, and a conductive connector connected to the conductive grid.

20.如實施例19之方法,其包括在100%或以下之該導電柵格上形成該乾燥最外聚合物塗層,但該乾燥最外聚合物塗層佈置於小於100%之該導電連結器上。 20. The method of embodiment 19, comprising forming the dry outermost polymer coating on the conductive grid at or below 100%, but the dry outermost polymer coating is disposed at less than 100% of the conductive connection Device.

21.如實施例19之方法,其中該導電柵格係導電金屬柵格且該導電連結器係連結至其之導電金屬連結器。 21. The method of embodiment 19, wherein the conductive grid is a conductive metal grid and the conductive connector is a conductive metal connector connected thereto.

22.如實施例18至21中任一項之方法,其進一步包括:在該透明基板之該相對第二支撐側上形成導電圖案,及在該透明基板中該相對第二支撐側上之至少一部分但非全部該導電圖案上形成乾燥最外聚合物塗層,此乾燥聚合物塗層具有小於5μm之乾燥厚度、至少80%之積分透射率且包括玻璃轉變溫度(Tg)等於或大於65℃之非交聯熱塑性聚合物。 22. The method of any one of embodiments 18 to 21, further comprising: forming a conductive pattern on the opposite second support side of the transparent substrate, and at least on the opposite second support side of the transparent substrate. A part, but not all, of the conductive pattern forms a dry outermost polymer coating. The dry polymer coating has a dry thickness of less than 5 μm, an integrated transmittance of at least 80%, and includes a glass transition temperature (T g ) equal to or greater than 65. Non-crosslinked thermoplastic polymer at ℃.

23.如實施例22之方法,其中該相對第二支撐側上之該導電圖案包括導電柵格及連結至該導電柵格之導電連結器。 23. The method of embodiment 22, wherein the conductive pattern on the opposite second support side includes a conductive grid and a conductive connector connected to the conductive grid.

24.如實施例22或23中任一項之方法,其包括在100%或以下之該導電柵格上形成該乾燥最外聚合物塗層,但該乾燥最外聚合物塗層佈置於小於100%之該導電連結器上,其皆位於該透明基板之該相對第二支撐側上。 24. The method of any one of embodiments 22 or 23, comprising forming the dry outermost polymer coating on the conductive grid at 100% or less, but the dry outermost polymer coating is disposed at less than 100% of the conductive connectors are located on the opposite second support side of the transparent substrate.

25.如實施例18至24中任一項之方法,其包括使用柔版印刷部件在該第一支撐側上形成該最外聚合物塗層。 25. The method of any one of embodiments 18 to 24, comprising forming the outermost polymer coating on the first support side using a flexographic printing member.

26.如實施例18至25中任一項之方法,其包括在係連續透明聚合物網片之該基板之第一部分上形成該導電圖案。 26. The method of any one of embodiments 18 to 25, comprising forming the conductive pattern on a first portion of the substrate that is a continuous transparent polymer mesh.

27.如實施例18至26中任一項之方法,其包括:在係連續透明聚合物網片之該基板之該第一支撐側上之各別多個部分上形成多個導電圖案,及在該多個部分中之該等導電圖案中之每一者之至少一部分但非全部部分上形成乾燥最外聚合物塗層,該乾燥最外聚合物塗層佈置於該多個導電圖案中之每一者上且具有小於5μm之乾燥厚度、至少80%之積分透射率且包括玻璃轉變溫度(Tg)等於或大於65℃之非交聯熱塑性聚合物。 27. The method of any one of embodiments 18 to 26, comprising: forming a plurality of conductive patterns on respective plurality of portions on the first support side of the substrate of the continuous transparent polymer mesh, and A dry outermost polymer coating is formed on at least a portion but not all of each of the conductive patterns in the plurality of portions, the dry outermost polymer coating being disposed in the plurality of conductive patterns Non-crosslinked thermoplastic polymers having a dry thickness of less than 5 μm, an integrated transmittance of at least 80%, and a glass transition temperature (T g ) equal to or greater than 65 ° C. on each.

28.一種提供如實施例1至15中任一項之導電物件之方法,該方法包括:(i)提供呈連續透明聚合物網片形式之基板;(ii)使用包括金屬顆粒之光可固化組合物在該連續透明聚合物網片之第一支撐側上之至少第一部分上形成第一光可固化圖案;(iii)將該光可固化圖案曝光於光固化輻射以在該第一支撐側之該第一部分上形成光固化圖案;(iv)使用導電金屬無電電鍍該第一支撐側之該第一部分上之該光固化圖案以在該第一支撐側之該第一部分上形成導電金屬圖案;及(v)在該第一支撐側之該第一部分中之至少一部分但非全部導電圖案上形成乾燥最外聚合物塗層。 28. A method of providing a conductive article according to any one of embodiments 1 to 15, the method comprising: (i) providing a substrate in the form of a continuous transparent polymer mesh; (ii) using a photo-curable comprising metal particles The composition forms a first photo-curable pattern on at least a first portion on a first support side of the continuous transparent polymer mesh; (iii) exposing the photo-curable pattern to photo-curable radiation to the first support side Forming a photo-curable pattern on the first portion; (iv) electrolessly plating the photo-curing pattern on the first portion of the first support side with a conductive metal to form a conductive metal pattern on the first portion of the first support side; And (v) forming a dry outermost polymer coating on at least a portion, but not all, of the first pattern of the first support side of the conductive pattern.

29.如實施例28之方法,其進一步包括:使用相同或不同之光可固化組合物及相同或不同之乾燥最外聚合物塗層,在該連續透明聚合物網片之該第一支撐側上一或多個不同於該第一部分之其他部分上重複特徵(ii)至(v)。 29. The method of embodiment 28, further comprising: using the same or different photocurable composition and the same or different dry outermost polymer coating on the first supporting side of the continuous transparent polymer mesh Features (ii) to (v) are repeated on the previous part or parts different from the first part.

30.如實施例28或29之方法,其包括:藉由使用第一柔版印刷部件將該光可固化組合物施加至該連續透明聚合物網片之該第一支撐側上之第一部分上來在該第一部分上形成該第一光可固化圖案,使包括含有該第一光可固化圖案之該第一部分之該連續透明聚合物網片前進以接近曝光輻射,且由此在該第一部分上形成第一光固化圖案,藉由使用相同或不同之柔版印刷部件將相同或不同之光可固化組合物施加至該連續透明聚合物網片之該第一支撐側上之第二部分來同時或依序在該第二部分上形成第二光可固化圖案;使包括含有該第二光可固化圖案之該第一支撐側上之該第二部 分之該連續透明聚合物網片前進以接近曝光輻射,且由此在該第一支撐側之該第二部分上形成第二光固化圖案;視情況使用相同或不同之光可固化組合物及相同或不同之柔版印刷部件在該連續透明聚合物網片中該第一支撐側上之一或多個其他部分上同時或依序形成一或多個其他光固化圖案;無電電鍍該第一支撐側上之該等光固化圖案中之每一者以形成多個導電金屬圖案;及在該多個導電金屬圖案中之每一者之至少一部分但非全部部分上形成該乾燥最外聚合物塗層。 30. The method of embodiment 28 or 29, comprising: applying the photocurable composition to a first portion on the first support side of the continuous transparent polymer mesh by using a first flexographic printing member Forming the first photo-curable pattern on the first portion, advancing the continuous transparent polymer mesh including the first portion containing the first photo-curable pattern to approximate exposure to radiation, and thereby on the first portion Forming a first photo-curable pattern by applying the same or different photo-curable composition to a second portion on the first support side of the continuous transparent polymer mesh using the same or different flexographic printing members simultaneously Or sequentially forming a second photo-curable pattern on the second portion; including the second portion on the first support side containing the second photo-curable pattern The continuous transparent polymer mesh is advanced to approach the exposure radiation, and thereby a second photo-curable pattern is formed on the second portion of the first support side; using the same or different photo-curable compositions as appropriate and The same or different flexographic printing parts form one or more other photo-curable patterns simultaneously or sequentially on one or more other parts on the first supporting side in the continuous transparent polymer mesh; electroless plating of the first Supporting each of the photo-cured patterns on the side to form a plurality of conductive metal patterns; and forming the dry outermost polymer on at least a portion but not all of each of the plurality of conductive metal patterns coating.

31.如實施例30之方法,其進一步包括在該多個導電金屬圖案中之每一者之至少一部分但非全部部分上形成該乾燥最外塗層之後:捲繞該連續聚合物網片。 31. The method of embodiment 30, further comprising after forming the dry outermost coating on at least a portion, but not all, of each of the plurality of conductive metal patterns: winding the continuous polymer mesh.

32.如實施例28至30中任一項之方法,其進一步包括在該多個導電金屬圖案中之每一者之至少一部分但非全部部分上形成該乾燥最外塗層之後:將來自該連續透明聚合物網片之該等個別導電金屬圖案以個別物件形式組裝成相同或不同之個別器件。 32. The method of any one of embodiments 28 to 30, further comprising after forming the dry outermost coating on at least a portion but not all of each of the plurality of conductive metal patterns: The individual conductive metal patterns of the continuous transparent polymer mesh are assembled into the same or different individual devices in the form of individual objects.

33.根據實施例28至32中任一項之方法,其進一步包括:使用包括金屬顆粒之光可固化組合物在該連續透明聚合物網片之相對第二支撐側之至少第一部分上形成光可固化圖案;將該光可固化圖案曝光於輻射以在該相對第二支撐側之該第一部分上形成光固化圖案;使用導電金屬無電電鍍該相對第二支撐側之該第一部分上之該光固化圖案以在該相對第二支撐側之該第一部分上形成導電金屬圖案;及在至少一部分但非全部該導電金屬圖案上形成乾燥最外聚合物 塗層,該乾燥聚合物塗層具有小於5μm之乾燥厚度、至少80%之積分透射率且包括玻璃轉變溫度(Tg)等於或大於65℃之非交聯熱塑性聚合物。 33. The method according to any one of embodiments 28 to 32, further comprising: using a photo-curable composition including metal particles to form light on at least a first portion of the continuous transparent polymer mesh opposite the second support side Curable pattern; exposing the photo-curable pattern to radiation to form a photo-curable pattern on the first portion of the opposite second support side; electroless plating of the light on the first portion of the opposite second support side with a conductive metal Curing the pattern to form a conductive metal pattern on the first portion of the opposite second support side; and forming a dry outermost polymer coating on at least a portion but not all of the conductive metal pattern, the dried polymer coating having a size of less than 5 μm The non-crosslinked thermoplastic polymer has a dry thickness, an integrated transmittance of at least 80%, and includes a glass transition temperature (T g ) equal to or greater than 65 ° C.

34.如實施例33之方法,其進一步包括:使用相同或不同之光可固化組合物及相同或不同之乾燥最外聚合物塗層,在該連續透明聚合物網片中不同於該相對第二支撐側上之該第一部分之該相對第二支撐側上之一或多個其他部分上,重複形成光可固化圖案、曝光、無電電鍍及形成乾燥最外聚合物塗層特徵。 34. The method of embodiment 33, further comprising: using the same or different photo-curable composition and the same or different dry outermost polymer coating, which is different from the relative transparent polymer web in the continuous transparent polymer web. On one or more other parts of the first part on the two supporting sides and on the opposite second supporting side, photocurable patterns are repeatedly formed, exposure, electroless plating, and dry outer polymer coating features are formed.

提供下列實例以闡釋本發明之實踐且不意欲以任何方式進行限制。 The following examples are provided to illustrate the practice of the invention and are not intended to be limiting in any way.

代表性光可固化組合物1:此代表性光可固化組合物至少包括下列組份(形成為100g等分試樣):14.4g環氧丙烯酸酯(來自Sartomer之CN 153)、9.9g聚(乙二醇)二丙烯酸酯(Mn為258,Sigma-Aldrich)、2.1g聚(乙二醇)二丙烯酸酯(Mn為575,Sigma-Aldrich)、10.8g新戊四醇四丙烯酸酯(Sigma-Aldrich)、0.8g混合於50%碳酸丙二酯中之六氟磷酸三芳基鋶鹽(Sigma-Aldrich)、0.8g混合於50%碳酸丙二酯中之六氟銻酸三芳基鋶鹽(Sigma-Aldrich)、2.4g自由基光起始劑羥基環己基苯基酮(Sigma-Aldrich)、1.2g自由基光起始劑甲基-4'-(甲硫基)-2-嗎啉基苯丙酮(Sigma-Aldrich)、19.5g「晶種」銀顆粒(來自NovaCentrix,20-25nm平均粒徑,Ag-25-ST3)、1.1g碳顆粒(US1074,來自US Nano)、0.001g 9-茀酮(Sigma-Aldrich)及35g 1-甲氧基異丙醇(Sigma-Aldrich)溶劑。 Representative Photocurable Composition 1: This representative photocurable composition includes at least the following components (formed into 100g aliquots): 14.4g epoxy acrylate (CN 153 from Sartomer), 9.9g poly ( Ethylene glycol) diacrylate (258 n , Sigma-Aldrich), 2.1 g poly (ethylene glycol) diacrylate (575 n , Sigma-Aldrich), 10.8 g neopentaerythritol tetraacrylate ( Sigma-Aldrich), 0.8 g hexafluorophosphate triarylphosphonium salt mixed in 50% propylene carbonate, Sigma-Aldrich, 0.8 g hexafluoroantimonate triarylphosphonium salt mixed in 50% propylene carbonate (Sigma-Aldrich), 2.4 g of radical photoinitiator hydroxycyclohexylphenyl ketone (Sigma-Aldrich), 1.2 g of radical photoinitiator methyl-4 '-(methylthio) -2-morpholine Phenylacetone (Sigma-Aldrich), 19.5g "seed" silver particles (from NovaCentrix, 20-25nm average particle size, Ag-25-ST3), 1.1g carbon particles (US1074, from US Nano), 0.001g 9 -Fluorenone (Sigma-Aldrich) and 35 g of 1-methoxyisopropanol (Sigma-Aldrich) solvent.

印刷光可固化組合物:Printing light curable composition:

使用臺式測試印刷機「IGT F1印刷性測試儀」(來自IGT Testing Systems公司,Arlington Heights,IL)以柔版模式獲得位於各種塗底層聚(對苯二甲酸乙二酯)PET基板(MELLINEX® 561,可自DuPont Teijin Films獲得)上之上文所闡述光可固化組合物之印刷圖案試樣。用於將光可固化組合物施加至柔版印刷板上之網紋輥系統具有1.3BCMI及1803lpi之值,如由IGT指定。在環境溫度下使用20N之網紋力、10N之印刷力及0.20m/sec之印刷速度形成印刷圖案。 A desktop test printing press "IGT F1 Printability Tester" (from IGT Testing Systems, Arlington Heights, IL) was used to obtain poly (ethylene terephthalate) PET substrates (MELLINEX ® 561, available from DuPont Teijin Films) as a sample of the printed pattern of the photocurable composition described above. The anilox system used to apply the photocurable composition to flexographic printing plates has values of 1.3BCMI and 1803 lpi, as specified by IGT. A printing pattern was formed at ambient temperature using an anilox force of 20 N, a printing force of 10 N, and a printing speed of 0.20 m / sec.

用於印刷光可固化組合物之柔版印刷板係市售KODAK® Flexcel NX光聚合物板(來自Eastman Kodak公司)之試樣,其已使用遮罩進行UV輻射成像,該遮罩具有使用KODAK® SQUARE SPOT雷射技術在12,800dpi之解析度下書寫之預定圖案。使用由製造商提出之已知條件處理(顯影)經曝光柔版光聚合物板。所得柔版印刷板(或部件)各自為1.14mm厚(包含PET)。用於將每一柔版印刷板安裝至印刷形式滾筒上之背襯膠帶為來自3M公司之1120米色膠帶,其為20密耳(0.051cm)厚且蕭氏A(Shore A)值為55。柔版印刷板中之凸版影像設計包含具有在頂部凸版表面上之寬度為7μm之精細線之柵格圖案。所得相應印刷光可固化組合物圖案具有佈置於塗底層PET基板上之平均線寬度。 The flexographic printing plate used to print the photo-curable composition was a sample of a commercially available KODAK ® Flexcel NX photopolymer plate (from Eastman Kodak), which had been imaged with UV radiation using a mask having the use of KODAK ® SQUARE SPOT laser technology for predetermined patterns written at a resolution of 12,800dpi. The exposed flexographic photopolymer plate was processed (developed) using known conditions proposed by the manufacturer. The resulting flexographic printing plates (or parts) were each 1.14 mm thick (including PET). The backing tape used to mount each flexographic printing plate to a printing form cylinder was a 1120 meter colored tape from 3M Company, which was 20 mils (0.051 cm) thick and had a Shore A value of 55. The relief image design in a flexographic printing plate included a grid pattern with fine lines with a width of 7 μm on the top relief surface. The resulting corresponding printed photo-curable composition pattern has an average line width arranged on a primer PET substrate.

在施加至基板上之後,利用UV輻射使用Fusion 300 WPI中壓汞燈(提供介於190-1500nm之間之輻照波長)利用298mJ/cm2之近似暴露輻照光可固化組合物之每一印刷圖案(亦即印刷圖案)以光固化每一印刷圖案。以透射及反射模式使用Olympus BH-2光學顯微鏡量測所得前體物件中之所得光固化圖案之印刷平均線寬度。 After being applied to the substrate, each of the Fusion 300 WPI medium pressure mercury lamps (providing an irradiation wavelength between 190-1500 nm) was used with UV radiation to approximate each of the 298 mJ / cm 2 of the irradiated light curable composition using UV radiation. The printed patterns (ie, printed patterns) cure each printed pattern with light. The printed average line width of the obtained photo-cured pattern in the obtained precursor object was measured in a transmission and reflection mode using an Olympus BH-2 optical microscope.

無電金屬電鍍:Electroless metal plating:

藉由將具有固化圖案之前體物件在45℃下於含有Enplate Cu-406無電電鍍溶液(ENTHONE®公司)的燒杯中浸沒7分鐘來無電銅電鍍包括位於各種塗底層基板上之光固化圖案之前體物件,隨後使用蒸餾水沖洗且使用氮乾燥以形成具有佈置於基板上之導電圖案之物件。 By previously having the cured pattern body object at 45 ℃ containing Enplate Cu-406 beakers electroless plating solution (ENTHONE ® Corporation) was immersed for 7 minutes in an electroless copper plating it includes a variety of light on the primed substrate cured pattern before the body The object is then rinsed with distilled water and dried with nitrogen to form an object having a conductive pattern disposed on a substrate.

最外聚合物塗層調配物:Outermost polymer coating formulation:

製備具有10重量%存於1-甲氧基-2-丙醇(DOWANOL® PM有機溶劑)中之ELVACITE® 4028樹脂(Lucite International)之最外聚合物塗層調配物。調配物較為澄清且在22℃下具有25cps之黏度。 Preparing a 10% by weight present in the 1-methoxy-2-propanol (DOWANOL ® PM organic solvent) of ELVACITE ® 4028 resin (Lucite International) the most outer polymeric coating formulations. The formulation is clear and has a viscosity of 25 cps at 22 ° C.

印刷最外聚合物塗層調配物:Printed outermost polymer coating formulation:

根據本發明藉由使用柔版印刷壓機(Performance Series P7,可自Mark Andy公司獲得)以連續捲對捲操作且使用單一柔版站來提供乾燥最外聚合物塗層。此柔版站包括塔盤(其裝填有300克最外聚合物塗層調配物)、彈性計量輥(硬度大約為30蕭氏A)、陶瓷網紋輥(具有鋼醫用刮刀)及柔版板輥。在此製程中,藉由彈性計量輥將最外聚合物塗層調配物自塔盤遞送至網紋輥中。藉由鋼醫用刮刀自網紋輥去除過量最外聚合物塗層調配物。網紋輥系統具有2.0BCMI(十億μm3/in2)之值,其等效於0.31十億μm3/cm2According to the present invention, a dry outermost polymer coating is provided by using a flexographic printing press (Performance Series P7, available from Mark Andy) in a continuous roll-to-roll operation and using a single flexographic station. This flexographic station includes a tray (filled with 300 grams of the outermost polymer coating formulation), an elastic metering roller (with a hardness of about 30 Shore A), a ceramic anilox roller (with a steel medical doctor blade), and a flexographic plate Plate roll. In this process, the outermost polymer coating formulation is delivered from the tray to the anilox roll by an elastic metering roll. Excessive outermost polymer coating formulation was removed from the anilox roller by a steel medical doctor blade. The anilox roll system has a value of 2.0 BCMI (billion μm 3 / in 2 ), which is equivalent to 0.31 billion μm 3 / cm 2 .

然後將最外聚合物塗層調配物轉移至如下文所闡述獲得之柔版印刷板中且然後轉移至含有上文在連續網片製程中所闡述無電金屬電鍍導電圖案之移動網片中。在18℃及50%相對濕度下在0.10m/sec之線速度下實施所有印刷、乾燥及捲繞操作。最終乾燥導電物件具有佈置於至少一部分但非全部每一導電圖案上之乾燥最外聚合物塗層,該乾燥塗層厚0.3μm。 The outermost polymer coating formulation is then transferred to a flexographic printing plate obtained as described below and then to a moving mesh containing the electroless metal plating conductive pattern described above in the continuous mesh process. All printing, drying and winding operations were performed at 18 ° C and 50% relative humidity at a linear speed of 0.10 m / sec. The final dried conductive article has a dried outermost polymer coating disposed on at least a portion but not all of each conductive pattern, the dried coating having a thickness of 0.3 μm.

自已使用遮罩(具有使用KODAK® SQUARE SPOT雷射技術在12,800dpi之解析度下書寫之預定圖案)成像之市售KODAK® Flexcel NX光聚合物板(Eastman Kodak公司)形成用於施加(印刷)最外聚合物塗層調配物之柔版印刷板。使用由製造商提出之已知條件處理(顯影)UV曝光柔版光聚合物板。所得柔版印刷板大約為1mm厚。除標記為導電圖案最外部分之區中之矩形凸版區(2×35mm)外,柔版印刷板之表面保持平滑(亦即按接收狀態)。此凸版區並不接收(或傳輸)最外聚 合物塗層調配物且因此在所得導電物件中每一導電圖案之較小部分保持為「開放」(未塗覆)。此未塗覆區對應於印刷導電連結器之區。 A commercially available KODAK ® Flexcel NX photopolymer plate (Eastman Kodak company) imaged using a mask (having a predetermined pattern written at a resolution of 12,800 dpi using KODAK ® SQUARE SPOT laser technology) for application (printing) Flexographic printing plate with outermost polymer coating formulation. UV exposure flexographic photopolymer plates were processed (developed) using known conditions proposed by the manufacturer. The resulting flexographic printing plate was approximately 1 mm thick. Except for the rectangular relief area (2 × 35 mm) in the area marked as the outermost part of the conductive pattern, the surface of the flexographic printing plate remains smooth (ie, in the receiving state). This relief area does not receive (or transmit) the outermost polymer coating formulation and therefore a smaller portion of each conductive pattern in the resulting conductive object remains "open" (uncoated). This uncoated area corresponds to the area of the printed conductive connector.

試樣之環境暴露:Environmental exposure of the sample:

將所有如上文所闡述製得之導電物件在維持於65℃及90% RH(相對濕度)之環境室中培育4週。導電物件垂直懸掛於環境室中且以不同時間間隔取出以用於評價電性質。 All conductive objects made as described above were incubated in an environmental chamber maintained at 65 ° C and 90% RH (relative humidity) for 4 weeks. The conductive objects are suspended vertically in the environmental chamber and taken out at different time intervals for evaluation of electrical properties.

電連續性之量測:Measurement of electrical continuity:

此導電物件之導電圖案包含多個導電柵格網絡,其中每一導電柵格網絡之終點連結至兩個探針墊,一個探針墊(近探針墊)連結至BUS導電線,其繼而可連結至「連結器」接合墊(其連結至外部電路)。「連結器」可包括多個連結器接合墊。第二探針墊(遠探針墊)連結至電路徑中距「連結器」接合墊最遠之點處之導電柵格。對於本實例而言,連結器接合墊未經最外聚合物塗層調配物塗覆以提供可用於量測電阻之連結器。 The conductive pattern of this conductive object includes multiple conductive grid networks, where the end of each conductive grid network is connected to two probe pads, and one probe pad (near probe pad) is connected to the BUS conductive line, which in turn can Connects to a "connector" pad (which is connected to an external circuit). A "connector" may include multiple connector engagement pads. The second probe pad (remote probe pad) is connected to the conductive grid at the farthest point in the electrical path from the "connector" bonding pad. For this example, the connector bonding pads are not coated with the outermost polymer coating formulation to provide a connector that can be used to measure electrical resistance.

藉由向每一導電圖案中之每一導電連結器施加脈衝電壓(25伏特,DC)且量測連結器接合墊與相應末端探針墊之間的電流來測試上文所闡述經培育導電物件之電連續性。因此,電流路徑係自外部電路至連結器接合墊,其穿過BUS線、穿過近探針墊、穿過導電柵格網絡(長度大約300mm)並到達末端探針墊。然後使用歐姆定律(Ohm’s Law)測定電阻。此路徑中大於1000歐姆之電阻視為失敗且視為「斷路」。對於該等實例中所使用之每一導電物件而言,存在34個接合墊位點及34個晶格列網絡。因此,每一導電物件(且由此每一導電圖案)中可能「斷路」結果之最大數量為34。 Test the cultivated conductive objects described above by applying a pulse voltage (25 volts, DC) to each conductive connector in each conductive pattern and measuring the current between the connector pads and the corresponding end probe pads Electrical continuity. Therefore, the current path is from the external circuit to the connector bonding pad, which passes through the BUS line, through the near probe pad, through the conductive grid network (about 300 mm in length), and reaches the end probe pad. Ohm's Law was then used to determine the resistance. A resistance greater than 1000 ohms in this path is considered a failure and is considered an "open circuit". For each conductive object used in these examples, there are 34 bond pad sites and 34 lattice column networks. Therefore, the maximum number of possible "break" results in each conductive object (and thus each conductive pattern) is 34.

透明性之量測:Measurement of transparency:

藉由如上文所闡述量測在550nm下輻射之積分透射率來評估每一導電物件之透明性。 The transparency of each conductive object was evaluated by measuring the integrated transmittance of radiation at 550 nm as explained above.

對比實例:Comparative example:

將如上文所闡述製得之導電物件發送至所述柔版印刷壓機上且並不施加最外聚合物塗層調配物。所得對比性導電物件由此在導電圖案上並不包括乾燥最外聚合物塗層。隨後如上文所闡述測試每一對比性導電物件之初始電連續性。三個對比性導電物件中之每一者之初始平均積分透射率為84%。 The conductive article made as explained above was sent to the flexographic printing press without applying the outermost polymer coating formulation. The resulting comparative conductive article thus does not include a dry outermost polymer coating on the conductive pattern. The initial electrical continuity of each comparative conductive article was then tested as explained above. The initial average integrated transmittance of each of the three comparative conductive objects was 84%.

然後如上文針對本發明導電物件所闡述,在環境室中培育對比性物件且週期性取出以評估電連續性。下表I展示對比性物件之「斷路」評估之數量之增加。如表I中所展示,在4週培育時段中,每一導電物件中「斷路」評估之平均數量漸進地增加5。 Then, as explained above for the conductive article of the present invention, a comparative article is cultivated in an environmental chamber and periodically removed to assess electrical continuity. Table I below shows the increase in the number of "open circuit" assessments for comparative objects. As shown in Table I, the average number of "open circuit" evaluations per conductive object increased gradually by 5 during the 4-week incubation period.

本發明實例:Examples of the invention:

將9個如上文所闡述製得之導電物件發送至所述柔版印刷壓機中,該柔版印刷壓機與含有最外聚合物塗層調配物之印刷站充分嚙合。因此,除導電圖案之較小矩形區(2mm×35mm)外,該等本發明導電物件中之每一者包括施加於包含導電金屬柵格之導電圖案上之乾燥最外聚合物塗層。最外保護性塗層之乾燥厚度為0.3μm。所有9個導電物件之初始積分透射率經測定為84%。 Nine conductive objects made as described above were sent to the flexographic printing press, which flexibly engaged the printing station containing the outermost polymer coating formulation. Therefore, in addition to the smaller rectangular area (2 mm x 35 mm) of the conductive pattern, each of these conductive objects of the present invention includes a dry outermost polymer coating applied to a conductive pattern that includes a conductive metal grid. The outermost protective coating has a dry thickness of 0.3 μm. The initial integrated transmittance of all 9 conductive objects was determined to be 84%.

如上文所闡述,在環境室中培育本發明物件且週期性取出評估電連續性。下表I展示本發明導電物件之「斷路」評估之數量之增加。如表I中所展示,在4週培育時段中,「斷路」評估之平均數量並不增加。因此,經測定,每一導電物件中佈置於上至少一部分但非全部導電圖案上之乾燥最外聚合物塗層會良好地保護導電圖案免受污染物(例如水及氧)影響,即使在苛刻環境條件下。 As explained above, the objects of the invention are cultivated in an environmental chamber and periodically taken out to assess electrical continuity. Table I below shows an increase in the number of "open circuit" evaluations of the conductive articles of the present invention. As shown in Table I, the average number of "open circuit" assessments did not increase during the 4-week incubation period. Therefore, it has been determined that the dry outermost polymer coating disposed on at least a part but not all of the conductive patterns in each conductive object will well protect the conductive patterns from contaminants such as water and oxygen, even under harsh conditions. Environmental conditions.

Claims (34)

一種導電物件,其包括:透明基板,其具有第一支撐側及相對第二支撐側;佈置於至少該第一支撐側上之導電圖案,及乾燥最外聚合物塗層,其佈置於至少一部分但非全部該導電圖案上,該乾燥最外聚合物塗層具有小於5μm之乾燥厚度、至少80%之積分透射率且包括玻璃轉變溫度(Tg)等於或大於65℃之非交聯熱塑性聚合物。A conductive object includes: a transparent substrate having a first support side and an opposite second support side; a conductive pattern disposed on at least the first support side, and a dry outermost polymer coating disposed on at least a portion But not all of the conductive patterns, the dried outermost polymer coating has a dry thickness of less than 5 μm, an integrated transmittance of at least 80%, and includes a non-crosslinked thermoplastic polymerization having a glass transition temperature (T g ) equal to or greater than 65 ° C. Thing. 如請求項1之導電物件,其中該導電圖案至少包括:導電柵格;及導電連結器,其連結至該導電柵格。The conductive object of claim 1, wherein the conductive pattern includes at least: a conductive grid; and a conductive connector connected to the conductive grid. 如請求項2之導電物件,其中該乾燥最外聚合物塗層佈置於100%或以下之該導電柵格上,但該乾燥最外聚合物塗層佈置於小於100%之該導電連結器上。The conductive article of claim 2, wherein the dry outermost polymer coating is arranged on the conductive grid of 100% or less, but the dry outermost polymer coating is arranged on the conductive connector less than 100% . 如請求項2之導電物件,其中該導電柵格係導電金屬柵格且該導電連結器係連結至其之導電金屬連結器。The conductive article of claim 2, wherein the conductive grid is a conductive metal grid and the conductive connector is a conductive metal connector connected thereto. 如請求項1之導電物件,其進一步包括:佈置於該透明基板之相對第二支撐側上之導電圖案,及乾燥最外聚合物塗層,其佈置於該透明基板之該相對第二支撐側上之至少一部分但非全部該導電圖案上,此乾燥最外聚合物塗層具有小於5μm之乾燥厚度、至少80%之積分透射率且包括玻璃轉變溫度(Tg)等於或大於65℃之非交聯熱塑性聚合物。The conductive article of claim 1, further comprising: a conductive pattern disposed on the opposite second support side of the transparent substrate, and a dry outermost polymer coating disposed on the opposite second support side of the transparent substrate On at least a part but not all of the conductive pattern, the dried outermost polymer coating has a dry thickness of less than 5 μm, an integrated transmittance of at least 80%, and includes a non-glass transition temperature (T g ) equal to or greater than 65 ° C. Crosslinked thermoplastic polymer. 如請求項5之導電物件,其中該導電圖案至少包括:導電柵格,及導電連結器,其連結至該導電柵格。The conductive object of claim 5, wherein the conductive pattern includes at least a conductive grid, and a conductive connector connected to the conductive grid. 如請求項6之導電物件,其中該乾燥最外聚合物塗層佈置於100%或以下之該導電柵格上,但該乾燥最外聚合物塗層佈置於小於100%之該導電連結器上,所有皆位於該透明基板之該相對第二支撐側上。The conductive article of claim 6, wherein the dry outermost polymer coating is arranged on the conductive grid 100% or less, but the dry outermost polymer coating is arranged on the conductive connector less than 100% Are all located on the opposite second supporting side of the transparent substrate. 如請求項1至7中任一項之導電物件,其中該非交聯熱塑性聚合物係非交聯、非芳香族熱塑性聚合物。The conductive article according to any one of claims 1 to 7, wherein the non-crosslinked thermoplastic polymer is a non-crosslinked, non-aromatic thermoplastic polymer. 如請求項1至7中任一項之導電物件,其中該乾燥最外聚合物塗層具有小於3μm之乾燥厚度。The conductive article of any one of claims 1 to 7, wherein the dried outermost polymer coating has a dry thickness of less than 3 μm. 如請求項1至7中任一項之導電物件,其中該非交聯熱塑性聚合物係非交聯熱塑性丙烯酸聚合物。The conductive article according to any one of claims 1 to 7, wherein the non-crosslinked thermoplastic polymer is a non-crosslinked thermoplastic acrylic polymer. 如請求項1至7中任一項之導電物件,其中該非交聯熱塑性聚合物包括至少衍生自(甲基)丙烯酸甲酯之重複單元及衍生自(甲基)丙烯酸烷基酯之重複單元,其中該烷基具有1至18個碳原子,其中衍生自(甲基)丙烯酸烷基酯之該等重複單元佔總聚合物重複單元之至少5mol%且至多並包含25mol%。The conductive article according to any one of claims 1 to 7, wherein the non-crosslinked thermoplastic polymer includes at least repeating units derived from methyl (meth) acrylate and repeating units derived from alkyl (meth) acrylate, Wherein the alkyl group has 1 to 18 carbon atoms, wherein the repeating units derived from the alkyl (meth) acrylate account for at least 5 mol% and up to and including 25 mol% of the total polymer repeating units. 如請求項1至7中任一項之導電物件,其中至少佈置於該透明基板之該第一支撐側上之該導電圖案包括由至少銀、銅、鈀或鉑構成之導電金屬線。The conductive article according to any one of claims 1 to 7, wherein the conductive pattern arranged at least on the first supporting side of the transparent substrate includes a conductive metal wire composed of at least silver, copper, palladium, or platinum. 如請求項5至7中任一項之導電物件,其中佈置於該透明基板之該相對第二支撐側上之該導電圖案包括至少由銀、銅、鈀或鉑構成之導電金屬線。The conductive article according to any one of claims 5 to 7, wherein the conductive pattern disposed on the opposite second supporting side of the transparent substrate includes a conductive metal wire composed of at least silver, copper, palladium, or platinum. 如請求項1至7中任一項之導電物件,其中該透明基板係連續透明聚合物網片,且該物件包括相同或不同之佈置於該連續透明聚合物網片之該第一支撐側之至少第一部分及該相對第二支撐側之至少第一部分上的導電圖案。The conductive object according to any one of claims 1 to 7, wherein the transparent substrate is a continuous transparent polymer mesh, and the object includes the same or different ones disposed on the first supporting side of the continuous transparent polymer mesh. At least a first portion and a conductive pattern on at least a first portion of the opposite second support side. 如請求項14之導電物件,其中該連續透明聚合物網片包括:位於該第一支撐側上之多個部分及位於該相對第二支撐側上之多個部分;分別佈置於該透明基板之該第一支撐側及該相對第二支撐側上之該多個部分上之相同或不同之導電圖案;及乾燥最外聚合物塗層,其佈置於至少一部分但非全部之每一導電圖案上。The conductive article as claimed in claim 14, wherein the continuous transparent polymer mesh includes: a plurality of portions on the first support side and a plurality of portions on the opposite second support side; and each of the portions is disposed on the transparent substrate. The same or different conductive patterns on the plurality of portions on the first support side and the opposite second support side; and a dry outermost polymer coating disposed on at least a portion but not all of each conductive pattern . 一種電子器件,其包括作為觸控螢幕之如請求項1至15中任一項之導電物件。An electronic device includes a conductive object as in any one of claims 1 to 15 as a touch screen. 如請求項16之電子器件,其中該觸控螢幕具有至少1cm2且至多並包含100m2之觀看面積。The electronic device of claim 16, wherein the touch screen has a viewing area of at least 1 cm 2 and at most including 100 m 2 . 一種提供如請求項1至15中任一項之導電物件之方法,該方法包括:在透明基板之第一支撐側上形成導電圖案,該透明基板亦包括相對第二支撐側;及在至少一部分但非全部該導電圖案上形成乾燥最外聚合物塗層,該乾燥聚合物塗層具有小於5μm之乾燥厚度、至少80%之積分透射率且包括玻璃轉變溫度(Tg)等於或大於65℃之非交聯熱塑性聚合物。A method of providing a conductive object as in any of claims 1 to 15, the method comprising: forming a conductive pattern on a first support side of a transparent substrate, the transparent substrate also including an opposite second support side; and at least a portion But not all of the conductive patterns form a dry outermost polymer coating. The dry polymer coating has a dry thickness of less than 5 μm, an integrated transmittance of at least 80%, and includes a glass transition temperature (T g ) equal to or greater than 65 ° C. Non-crosslinked thermoplastic polymer. 如請求項18之方法,其中該導電圖案至少包括:導電柵格,及導電連結器,其連結至該導電柵格。The method of claim 18, wherein the conductive pattern includes at least: a conductive grid, and a conductive connector connected to the conductive grid. 如請求項19之方法,其包括在100%或以下之該導電柵格上形成該乾燥最外聚合物塗層,但該乾燥最外聚合物塗層佈置於小於100%之該導電連結器上。The method of claim 19, comprising forming the dry outermost polymer coating on the conductive grid at or below 100%, but the dry outermost polymer coating is disposed on the conductive connector at less than 100% . 如請求項19之方法,其中該導電柵格係導電金屬柵格且該導電連結器係連結至其之導電金屬連結器。The method of claim 19, wherein the conductive grid is a conductive metal grid and the conductive connector is a conductive metal connector connected thereto. 如請求項18至21中任一項之方法,其進一步包括:在該透明基板之該相對第二支撐側上形成導電圖案,及在該透明基板之該相對第二支撐側上之至少一部分但非全部該導電圖案上形成乾燥最外聚合物塗層,此乾燥聚合物塗層具有小於5μm之乾燥厚度、至少80%之積分透射率且包括玻璃轉變溫度(Tg)等於或大於65℃之非交聯熱塑性聚合物。The method of any one of claims 18 to 21, further comprising: forming a conductive pattern on the opposite second support side of the transparent substrate, and at least a part of the opposite second support side of the transparent substrate but Not all of the conductive patterns form a dry outermost polymer coating. The dry polymer coating has a dry thickness of less than 5 μm, an integrated transmittance of at least 80%, and includes a glass transition temperature (T g ) equal to or greater than 65 ° C. Non-crosslinked thermoplastic polymer. 如請求項22之方法,其中該相對第二支撐側上之該導電圖案包括導電柵格及連結至該導電柵格之導電連結器。The method of claim 22, wherein the conductive pattern on the opposite second support side includes a conductive grid and a conductive connector connected to the conductive grid. 如請求項23之方法,其包括在100%或以下之該導電柵格上形成該乾燥最外聚合物塗層,但該乾燥最外聚合物塗層佈置於小於100%之該導電連結器上,所有皆位於該透明基板之該相對第二支撐側上。The method of claim 23, comprising forming the dry outermost polymer coating on the conductive grid at or below 100%, but the dry outermost polymer coating is disposed on the conductive connector at less than 100% Are all located on the opposite second supporting side of the transparent substrate. 如請求項18至21中任一項之方法,其包括使用柔版印刷部件在該第一支撐側上形成該最外聚合物塗層。The method of any of claims 18 to 21, comprising forming the outermost polymer coating on the first support side using a flexographic printing member. 如請求項18至21中任一項之方法,其包括在係連續透明聚合物網片之該基板之第一部分上形成該導電圖案。The method of any one of claims 18 to 21, comprising forming the conductive pattern on a first portion of the substrate that is a continuous transparent polymer mesh. 如請求項18至21中任一項之方法,其包括:在係連續透明聚合物網片之該基板之該第一支撐側上之各別多個部分上形成多個導電圖案,及在該多個部分中之該等導電圖案中之每一者之至少一部分但非全部部分上形成乾燥最外聚合物塗層,該乾燥最外聚合物塗層佈置於該多個導電圖案中之每一者上且具有小於5μm之乾燥厚度、至少80%之積分透射率且包括玻璃轉變溫度(Tg)等於或大於65℃之非交聯熱塑性聚合物。The method of any one of claims 18 to 21, comprising: forming a plurality of conductive patterns on respective multiple portions on the first support side of the substrate of the continuous transparent polymer mesh sheet, and A dry outermost polymer coating is formed on at least a portion but not all of each of the conductive patterns in the plurality of portions, the dry outermost polymer coating being disposed on each of the plurality of conductive patterns This is a non-crosslinked thermoplastic polymer having a dry thickness of less than 5 μm, an integrated transmittance of at least 80%, and including a glass transition temperature (T g ) equal to or greater than 65 ° C. 一種提供如請求項1至15中任一項之導電物件之方法,該方法包括:(i)提供呈連續透明聚合物網片形式之基板;(ii)使用包括金屬顆粒之光可固化組合物在該連續透明聚合物網片之第一支撐側上之至少第一部分上形成第一光可固化圖案;(iii)將該光可固化圖案曝光於光固化輻射以在該第一支撐側之該第一部分上形成光固化圖案;(iv)使用導電金屬無電電鍍該第一支撐側之該第一部分上之該光固化圖案以在該光固化圖案上形成導電金屬圖案;及(v)在該第一支撐側之該第一部分中之至少一部分但非全部導電圖案上形成乾燥最外聚合物塗層。A method of providing a conductive article as claimed in any one of claims 1 to 15, the method comprising: (i) providing a substrate in the form of a continuous transparent polymer mesh; (ii) using a photo-curable composition including metal particles Forming a first photo-curable pattern on at least a first portion on a first support side of the continuous transparent polymer mesh; (iii) exposing the photo-curable pattern to photo-curable radiation to provide the Forming a photo-curable pattern on the first portion; (iv) electrolessly plating the photo-curable pattern on the first portion of the first support side with a conductive metal to form a conductive metal pattern on the photo-curable pattern; and (v) A dry outermost polymer coating is formed on at least a portion, but not all, of the first portion of the supporting side of the conductive pattern. 如請求項28之方法,其進一步包括:使用相同或不同之光可固化組合物及相同或不同之乾燥最外聚合物塗層,在該連續透明聚合物網片之該第一支撐側上之一或多個不同於該第一部分之其他部分上重複特徵(ii)至(v)。The method of claim 28, further comprising: using the same or different photocurable composition and the same or different dry outermost polymer coating on the first support side of the continuous transparent polymer mesh. Features (ii) to (v) are repeated on one or more other parts different from the first part. 如請求項28或29之方法,其包括:藉由使用第一柔版印刷部件將該光可固化組合物施加至該連續透明聚合物網片之該第一支撐側上之第一部分上來在該第一部分上形成該第一光可固化圖案;使包括含有該第一光可固化圖案之該第一部分之該連續透明聚合物網片前進以接近曝光輻射,且由此在該第一部分上形成第一光固化圖案;藉由使用相同或不同之柔版印刷部件將相同或不同之光可固化組合物施加至該連續透明聚合物網片之該第一支撐側上之第二部分來同時或依序在該第二部分上形成第二光可固化圖案;使包括含有該第二光可固化圖案之該第一支撐側上之該第二部分之該連續透明聚合物網片前進以接近曝光輻射,且由此在該第一支撐側之該第二部分上形成第二光固化圖案;視情況使用相同或不同之光可固化組合物及相同或不同之柔版印刷部件在該連續透明聚合物網片中該第一支撐側上之一或多個其他部分上同時或依序形成一或多個其他光固化圖案;無電電鍍該第一支撐側上之該等光固化圖案中之每一者以形成多個導電金屬圖案;及在該多個導電金屬圖案中之每一者之至少一部分但非全部部分上形成該乾燥最外聚合物塗層。The method of claim 28 or 29, comprising: applying the photocurable composition to a first portion on the first support side of the continuous transparent polymer mesh by using a first flexographic printing member on the continuous transparent polymer mesh. Forming the first photo-curable pattern on the first portion; advancing the continuous transparent polymer mesh including the first portion containing the first photo-curable pattern to approach exposure to radiation, and thereby forming a first portion on the first portion A photo-curable pattern; simultaneously or in accordance with applying the same or different photo-curable composition to a second portion on the first support side of the continuous transparent polymer mesh using the same or different flexographic printing members Sequentially forming a second photo-curable pattern on the second portion; advancing the continuous transparent polymer mesh including the second portion on the first support side containing the second photo-curable pattern to approximate exposure to radiation And thereby forming a second photo-curable pattern on the second portion of the first support side; optionally using the same or different photo-curable composition and the same or different flexographic printing components in the company One or more other photo-curable patterns are formed simultaneously or sequentially on one or more other portions on the first support side of the transparent polymer mesh sheet; the photo-curable patterns on the first support side are electrolessly plated Each forming a plurality of conductive metal patterns; and forming the dry outermost polymer coating on at least a portion but not all of each of the plurality of conductive metal patterns. 如請求項30之方法,其進一步包括在該多個導電金屬圖案中之每一者之至少一部分但非全部部分上形成該乾燥最外塗層之後:捲繞該連續聚合物網片。The method of claim 30, further comprising, after forming the dry outermost coating on at least a portion but not all of each of the plurality of conductive metal patterns: winding the continuous polymer mesh. 如請求項30之方法,其進一步包括在該多個導電金屬圖案中之每一者之至少一部分但非全部部分上形成該乾燥最外塗層之後:將來自該連續透明聚合物網片之該等個別導電金屬圖案作為個別物件組裝成相同或不同之個別器件。The method of claim 30, further comprising, after forming the dry outermost coating on at least a portion, but not all, of each of the plurality of conductive metal patterns: The individual conductive metal patterns are assembled into the same or different individual devices as individual objects. 如請求項28或29之方法,其進一步包括:使用包括金屬顆粒之光可固化組合物在該連續透明聚合物網片之相對第二支撐側之至少第一部分上形成光可固化圖案;將該光可固化圖案曝光於輻射以在該相對第二支撐側之該第一部分上形成光固化圖案;使用導電金屬無電電鍍該相對第二支撐側之該第一部分上之該光固化圖案以在該相對第二支撐側之該第一部分上形成導電金屬圖案;及在至少一部分但非全部之該導電金屬圖案上形成乾燥最外聚合物塗層,該乾燥聚合物塗層具有小於5μm之乾燥厚度、至少80%之積分透射率且包括玻璃轉變溫度(Tg)等於或大於65℃之非交聯熱塑性聚合物。The method of claim 28 or 29, further comprising: using a photo-curable composition including metal particles to form a photo-curable pattern on at least a first portion of the continuous transparent polymer mesh opposite to a second support side; The photo-curable pattern is exposed to radiation to form a photo-curable pattern on the first portion of the opposite second support side; the photo-curable pattern on the first portion of the opposite second support side is electrolessly plated with a conductive metal to form the photo-curable pattern on the opposite second support side. Forming a conductive metal pattern on the first portion of the second support side; and forming a dry outermost polymer coating on at least a portion but not all of the conductive metal pattern, the dry polymer coating having a dry thickness of less than 5 μm, at least An integrated transmittance of 80% and includes a non-crosslinked thermoplastic polymer having a glass transition temperature (T g ) equal to or greater than 65 ° C. 如請求項33之方法,其進一步包括:使用相同或不同之光可固化組合物及相同或不同之乾燥最外聚合物塗層,在該連續透明聚合物網片之該相對第二支撐側上之不同於該相對第二支撐側上之該第一部分之一或多個其他部分上,重複形成光可固化圖案、曝光、無電電鍍及形成乾燥最外聚合物塗層特徵。The method of claim 33, further comprising: using the same or different photocurable composition and the same or different dry outermost polymer coating on the opposite second support side of the continuous transparent polymer mesh Unlike one or more other portions of the first portion on the opposite second support side, the photocurable pattern is repeatedly formed, exposed, electrolessly plated, and the dry outermost polymer coating feature is formed.
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