CN111590467A - 具有磨粒的蓝宝石晶片及其制备方法、蓝宝石修整器 - Google Patents
具有磨粒的蓝宝石晶片及其制备方法、蓝宝石修整器 Download PDFInfo
- Publication number
- CN111590467A CN111590467A CN202010323878.4A CN202010323878A CN111590467A CN 111590467 A CN111590467 A CN 111590467A CN 202010323878 A CN202010323878 A CN 202010323878A CN 111590467 A CN111590467 A CN 111590467A
- Authority
- CN
- China
- Prior art keywords
- sapphire wafer
- silicon oxide
- sapphire
- abrasive particles
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/16—Oxides
- C30B29/20—Aluminium oxides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/08—Etching
- C30B33/10—Etching in solutions or melts
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010323878.4A CN111590467B (zh) | 2020-04-22 | 2020-04-22 | 具有磨粒的蓝宝石晶片及其制备方法、蓝宝石修整器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010323878.4A CN111590467B (zh) | 2020-04-22 | 2020-04-22 | 具有磨粒的蓝宝石晶片及其制备方法、蓝宝石修整器 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111590467A true CN111590467A (zh) | 2020-08-28 |
CN111590467B CN111590467B (zh) | 2022-06-21 |
Family
ID=72187593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202010323878.4A Active CN111590467B (zh) | 2020-04-22 | 2020-04-22 | 具有磨粒的蓝宝石晶片及其制备方法、蓝宝石修整器 |
Country Status (1)
Country | Link |
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CN (1) | CN111590467B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113881349A (zh) * | 2021-09-01 | 2022-01-04 | 上海工程技术大学 | 用于碳化硅晶片硅表面化学机械抛光的抛光液及抛光方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102184842A (zh) * | 2011-03-30 | 2011-09-14 | 华灿光电股份有限公司 | 一种湿法腐蚀与干法刻蚀相结合图形化蓝宝石的方法 |
CN104029125A (zh) * | 2013-03-08 | 2014-09-10 | 鑫晶钻科技股份有限公司 | 蓝宝石抛光垫修整器及其制造方法 |
CN104051584A (zh) * | 2014-06-25 | 2014-09-17 | 中国科学院半导体研究所 | 蓝宝石图形衬底晶片及制备方法 |
CN104972398A (zh) * | 2014-04-03 | 2015-10-14 | 深圳市平华兴科技有限公司 | 一种抛光垫修整器及其制造方法 |
-
2020
- 2020-04-22 CN CN202010323878.4A patent/CN111590467B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102184842A (zh) * | 2011-03-30 | 2011-09-14 | 华灿光电股份有限公司 | 一种湿法腐蚀与干法刻蚀相结合图形化蓝宝石的方法 |
CN104029125A (zh) * | 2013-03-08 | 2014-09-10 | 鑫晶钻科技股份有限公司 | 蓝宝石抛光垫修整器及其制造方法 |
CN104972398A (zh) * | 2014-04-03 | 2015-10-14 | 深圳市平华兴科技有限公司 | 一种抛光垫修整器及其制造方法 |
CN104051584A (zh) * | 2014-06-25 | 2014-09-17 | 中国科学院半导体研究所 | 蓝宝石图形衬底晶片及制备方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113881349A (zh) * | 2021-09-01 | 2022-01-04 | 上海工程技术大学 | 用于碳化硅晶片硅表面化学机械抛光的抛光液及抛光方法 |
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Publication number | Publication date |
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CN111590467B (zh) | 2022-06-21 |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20220418 Address after: 321000 south side of Building 1, No. 2688, south 2nd Ring West Road, qiubin street, Wucheng District, Jinhua City, Zhejiang Province Applicant after: Jinhua Bolante New Material Co.,Ltd. Address before: 321000 South Second Ring West Road, Jinhua, Zhejiang Province, No. 2688 Applicant before: ZHEJIANG BOLANTE SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Sapphire wafer with abrasive particles and its preparation method, sapphire trimmer Effective date of registration: 20230619 Granted publication date: 20220621 Pledgee: Bank of Jinhua Limited by Share Ltd. science and Technology Branch Pledgor: Jinhua Bolante New Material Co.,Ltd. Registration number: Y2023980044592 |