CN111586975A - Laminating method and laminating row board structure of PCB (printed circuit board) - Google Patents
Laminating method and laminating row board structure of PCB (printed circuit board) Download PDFInfo
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- CN111586975A CN111586975A CN202010284586.4A CN202010284586A CN111586975A CN 111586975 A CN111586975 A CN 111586975A CN 202010284586 A CN202010284586 A CN 202010284586A CN 111586975 A CN111586975 A CN 111586975A
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- pcb
- aluminum sheet
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a PCB laminating method and a laminating row plate structure, wherein when a PCB is laminated, the PCB is laminated by utilizing upper and lower steel plates of the PCB, at least one aluminum sheet is arranged between the PCB and the upper and lower steel plates, and the thickness of the aluminum sheet is controlled to be 0.1-0.2 mm. According to the invention, the aluminum sheet is arranged between the PCB and the steel plate, and the problems of copper foil wrinkling and inner white spots caused by insufficient glue filling of an inner layer copper-free area due to uneven stress in the process of laminating the inner layer core board with low residual copper rate can be effectively solved by utilizing the characteristics of the aluminum sheet, so that the laminating quality and the yield are improved.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a PCB laminating method and a laminating plate arrangement structure.
Background
In the PCB laminating process, the PCB plates are isolated by using steel plates.
The normal stacking sequence is as follows: chassis-kraft paper-steel plate-PCB plate-steel plate- … … kraft paper-cover plate.
In the PCB pressing plate laminating process, only steel plates are used for isolation among the PCB plates, and for the PCB plates with the small residual copper rate of the thick copper plate and the inner core plate, the hardness of the steel plates is high, so that the stress of the copper-free area of the inner layer of the core plate in the PCB plate in the pressing plate process is smaller than that of the copper area, the resin is not completely filled, the copper foil of the PCB plate is wrinkled, and the inner layer has white spots and other bad spots, thereby leading to rework or scrapping.
In the rigid-flex board processing process, a rigid board, a non-flowing prepreg and a flexible board are laminated, wherein the non-flowing prepreg has poor polyimide bonding force with the flexible board material, the requirements on the performances of covering, heat conduction and the like in the laminating process are high, otherwise, the poor problems of laminating white spots, board explosion, layering and the like are easy to occur, so that the product is scrapped, and the laminating quality plays a key role in the product quality.
In order to meet the requirements of uniform pressure application, covering effect and temperature in the rigid-flex printed circuit board pressing process, a production factory generally adopts a buffer material to assist the rigid-flex printed circuit board pressing, and the common buffer material is a combination of a silica gel pad, a release film and a PE film.
In the use process of the buffer material, the silica gel pad is subjected to a high-temperature and high-pressure environment for a long time, aging of different degrees can occur, the buffer covering and heat transfer effects cannot meet the use requirements after a certain number of use times, and white spots are generated in product pressing and scrapped. The white spots are mainly generated due to the fact that the glue content of the non-flowing prepreg in the rigid-flex printed circuit board is low, due to the fact that the glue content is low, uneven pressure application can cause uneven glue adding between inner layers to cause less resin in partial areas, and glass fibers can be exposed to form the white spots. Moreover, the quality defects at present have no effective method for carrying out statistical specification on the using times of the silica gel pad for replacement. The release film and the PE film are both disposable plastic materials, and the silica gel pad, the release film and the PE film are difficult to use and recycle and are not environment-friendly. The thickness of the silica gel pad is large (single sheet is 1.6mm), the lamination of the silica gel pad, the release film and the PE film is required to be less than or equal to 3 layers, otherwise, the pressure transmission is poor, so that a middle layer product is scrapped, the productivity of a press is greatly occupied, and the processing cost is high.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a method for laminating PCB plates, which can effectively solve the problems of copper foil wrinkling and inner white spots caused by insufficient glue filling of an inner layer copper-free area due to uneven stress in the laminating process of an inner layer core plate with low residual copper rate by arranging an aluminum sheet between a PCB plate and a steel plate and improve the laminating quality and the yield.
In order to solve the technical problem, the invention provides a method for laminating PCB plates, in a plate arrangement structure for laminating PCBs, the PCBs are laminated by utilizing upper and lower steel plates of the PCBs, at least one aluminum sheet is arranged between the PCBs and the upper and lower steel plates, and the thickness of the aluminum sheet is controlled to be 0.1-0.2 mm.
Further, the thickness of the aluminum sheet is 0.15 mm.
Further, the size of the aluminum sheet is equal to or larger than that of the PCB.
Furthermore, at least 14 pieces of kraft paper are stacked on the outer sides of the steel plates.
Furthermore, brand new kraft paper needs to be replaced after each pressing.
Furthermore, the aluminum sheet is a double-sided polished aluminum sheet with a smooth surface.
The pressing row board structure of the PCB comprises a chassis, a kraft paper group, a steel plate, an aluminum sheet, a PCB, an aluminum sheet, a steel plate, a kraft paper group and a cover plate which are sequentially arranged from bottom to top, wherein the thickness of the aluminum sheet is controlled to be 0.1-0.2 mm.
Further, the thickness of the aluminum sheet is 0.15 mm.
Further, the size of the aluminum sheet is equal to or larger than that of the PCB; the aluminum sheet is a double-sided polished aluminum sheet with a smooth surface.
Further, the kraft paper group includes at least 14 kraft papers.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the aluminum sheet is arranged between the PCB and the steel plate, the expansion coefficient of the aluminum sheet is large, and the toughness, the ductility and the thermal conductivity of the aluminum sheet are good, in the process of pressing the plate, the aluminum sheet can better transmit pressure to the copper-free area in the inner core plate, so that the pressure distribution of the copper-free area and the copper-containing area of the inner core plate is consistent, the resin is uniformly stressed, and the copper-free area of the inner core plate can be completely filled, thereby preventing the problem of insufficient glue filling, avoiding the bad phenomena of white spots and the like of the inner layer, effectively solving the problem of wrinkling of the copper foil caused by insufficient glue filling of the copper-free area of the inner layer due to uneven stress in the process of pressing the inner core plate with small residual copper rate by utilizing the characteristics of the aluminum; in addition, the thickness of the aluminum sheet is controlled to be 0.1-0.2mm, the aluminum sheet with the thickness is moderate in softness, the pressing force applied during pressing can be better and averagely transmitted, and the pressing quality is prevented from being influenced by uneven conduction pressure caused by over-thickness of the aluminum sheet and deformation easily caused by over-thin of the aluminum sheet; during pressing, a certain number of kraft paper is required to be arranged on the outer side of the steel plate as a buffer, so that the quality of the PCB after pressing can be further improved, and brand new kraft paper needs to be replaced during pressing each time, so that the pressing quality is prevented from being influenced by the change of physical properties when the pressed kraft paper is reused; in addition, the invention adopts the aluminum sheet mode, reduces the use of the silica gel pad and the release film in the pressing process, reduces the quality risk caused by over-thick thickness of the silica gel pad, and can effectively improve the production efficiency of the lamination operation.
Drawings
Fig. 1 is a schematic structural view of a laminated board array in an embodiment.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Example 1
As shown in fig. 1, in the board arrangement structure for stitching the PCB1, the upper and lower steel plates 3 of the PCB1 are used for stitching, a piece of aluminum sheet 2 is arranged between the PCB1 and the upper and lower steel plates 3, and the thickness of the aluminum sheet 2 is controlled to be 0.1-0.2 mm; in the above, the problems of copper foil wrinkling and inner white spots caused by insufficient filling glue in the inner layer copper-free area due to uneven stress in the inner layer core plate pressing process with small residual copper rate can be effectively solved by utilizing the characteristics of the aluminum sheet, and the pressing quality and the yield are improved.
Specifically, the size of the aluminum sheet is equal to or larger than that of the PCB, so that the pressure can be uniformly transmitted to the whole PCB by utilizing the aluminum sheet; the outer sides of the upper steel plate 3 and the lower steel plate 3 are respectively provided with 14 pieces of kraft paper 4 in a stacking manner, and during lamination, a chassis 5 and a cover plate 6 in the hot press are respectively arranged on the outer sides of the kraft paper on the upper side and the lower side, so that the kraft paper is used as a buffer for the pressure of the hot press, the pressure in the lamination process is balanced, and the quality of the PCB after lamination can be further improved.
Specifically, all need be changed into brand-new with all kraft paper after the pressfitting every time, influence the pressfitting quality because of the change of physical properties when avoiding the kraft paper that the pressfitting was used again.
In other embodiments, the aluminum sheet is a double-sided polished aluminum sheet with a smooth surface, and no crease or garbage residue exists, so that uneven pressure distribution caused by strength and deformation influenced by the crease during pressing is avoided, the garbage residue on the aluminum sheet is prevented from damaging the surface of the PCB, and the integrity of the surface of the PCB is improved; and the two surfaces of the aluminum sheet are smooth surfaces, so that the aluminum sheet is prevented from being adhered to the PCB after being pressed.
In other embodiments, the aluminum sheet has a thickness of 0.15 mm.
Example 2
As shown in fig. 1, the pressing row board structure of PCB boards in this embodiment includes a chassis 5, a kraft paper group, a steel plate 3, an aluminum sheet 2, a PCB1, an aluminum sheet 2, a steel plate 3, a kraft paper group, and a cover plate 6, which are sequentially arranged from bottom to top, and the thickness of the aluminum sheet is controlled to be 0.1-0.2 mm.
Specifically, the size of the aluminum sheet is equal to or larger than that of the PCB;
specifically, the kraft paper group includes 14 kraft papers 4.
The chassis and the cover plate act as follows: the heat transfer is directly contacted with the hot press, and the bearing effect is realized.
Kraft paper function: and (5) equalizing the pressure of the pressing process.
Steel plate and aluminum sheet action: heat and pressure are transferred downwards, and the aluminum sheet is in contact with the copper foil in the PCB, so that the surface smoothness of the aluminum sheet is ensured.
In other embodiments, the aluminum sheet is a double-sided polished aluminum sheet with a smooth surface, and no crease or garbage residue exists, so that uneven pressure distribution caused by strength and deformation influenced by the crease during pressing is avoided, the garbage residue on the aluminum sheet is prevented from damaging the surface of the PCB, and the integrity of the surface of the PCB is improved; and the two surfaces of the aluminum sheet are smooth surfaces, so that the aluminum sheet is prevented from being adhered to the PCB after being pressed.
In other embodiments, the aluminum sheet has a thickness of 0.15 mm.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (10)
1. A PCB plate lamination method is characterized in that at least one aluminum sheet is arranged between the PCB and the upper and lower steel plates, and the thickness of the aluminum sheet is controlled to be 0.1-0.2 mm.
2. A method of press-fitting a stack of PCB boards according to claim 1 wherein the thickness of the aluminium sheet is 0.15 mm.
3. A method of press-fitting a stack of PCB boards according to claim 1 wherein the size of the aluminium sheet is equal to or greater than the size of the PCB.
4. A method of press-stacking PCB boards according to claim 1, wherein at least 14 kraft papers are laminated on the outer side of the steel boards.
5. A method of pressing together a stack of PCB boards as claimed in claim 4 wherein after each pressing an entirely new kraft paper is replaced.
6. A method of press-fitting and stacking PCB boards as claimed in any one of claims 1 to 5 wherein the aluminum sheet is a smooth surfaced double-sided polished aluminum sheet.
7. A pressfitting of PCB plate arranges the board structure, characterized by that, include chassis, kraft paper group, steel sheet, aluminum sheet, PCB, aluminum sheet, steel sheet, kraft paper group and cover plate that set gradually from bottom to top, and the thickness of the said aluminum sheet is controlled in 0.1-0.2 mm.
8. A laminated panel structure according to claim 6, wherein the aluminium sheet has a thickness of 0.15 mm.
9. The laminated panel arrangement of claim 6, wherein the aluminum sheets have dimensions equal to or greater than the dimensions of the PCB; the aluminum sheet is a double-sided polished aluminum sheet with a smooth surface.
10. A laminated panel arrangement according to claim 6, wherein the kraft paper group includes at least 14 kraft papers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010284586.4A CN111586975A (en) | 2020-04-13 | 2020-04-13 | Laminating method and laminating row board structure of PCB (printed circuit board) |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010284586.4A CN111586975A (en) | 2020-04-13 | 2020-04-13 | Laminating method and laminating row board structure of PCB (printed circuit board) |
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| CN111586975A true CN111586975A (en) | 2020-08-25 |
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| CN202010284586.4A Pending CN111586975A (en) | 2020-04-13 | 2020-04-13 | Laminating method and laminating row board structure of PCB (printed circuit board) |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114698266A (en) * | 2022-03-21 | 2022-07-01 | 深圳市奔强电路有限公司 | Treatment method for improving pressing glue shortage |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63153110A (en) * | 1986-12-17 | 1988-06-25 | Toshiba Chem Corp | Production of paper-phenol laminated sheet |
| CN104202927A (en) * | 2014-09-12 | 2014-12-10 | 高德（无锡）电子有限公司 | Production process of semi-finished rigid-flexible printed circuit boards |
| CN204968229U (en) * | 2015-10-16 | 2016-01-13 | 胜宏科技（惠州）股份有限公司 | Structure of lamination in advance before circuit board pressfitting |
| CN106255350A (en) * | 2016-08-18 | 2016-12-21 | 东莞市五株电子科技有限公司 | Bury copper coin manufacture method |
| CN110392487A (en) * | 2019-07-25 | 2019-10-29 | 生益电子股份有限公司 | A kind of method for plugging of PCB |
-
2020
- 2020-04-13 CN CN202010284586.4A patent/CN111586975A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63153110A (en) * | 1986-12-17 | 1988-06-25 | Toshiba Chem Corp | Production of paper-phenol laminated sheet |
| CN104202927A (en) * | 2014-09-12 | 2014-12-10 | 高德（无锡）电子有限公司 | Production process of semi-finished rigid-flexible printed circuit boards |
| CN204968229U (en) * | 2015-10-16 | 2016-01-13 | 胜宏科技（惠州）股份有限公司 | Structure of lamination in advance before circuit board pressfitting |
| CN106255350A (en) * | 2016-08-18 | 2016-12-21 | 东莞市五株电子科技有限公司 | Bury copper coin manufacture method |
| CN110392487A (en) * | 2019-07-25 | 2019-10-29 | 生益电子股份有限公司 | A kind of method for plugging of PCB |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114698266A (en) * | 2022-03-21 | 2022-07-01 | 深圳市奔强电路有限公司 | Treatment method for improving pressing glue shortage |
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Application publication date: 20200825 |
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