CN215898137U

CN215898137U - Rigid-flex board vacuum pressfitting structure

Info

Publication number: CN215898137U
Application number: CN202122051738.9U
Authority: CN
Inventors: 郭仲平; 牛国刚; 雒天华
Original assignee: Zhuhai Dahan Electronics Co ltd
Current assignee: Zhuhai Dahan Electronics Co ltd
Priority date: 2021-08-27
Filing date: 2021-08-27
Publication date: 2022-02-22
Anticipated expiration: 2031-08-27

Abstract

The utility model discloses a vacuum press-fit structure of a rigid-flexible printed circuit board, which sequentially comprises a first steel plate, a first buffer layer, a flexible layer, a substrate, a release film and a second steel plate from bottom to top; the first buffer layer is a plurality of pieces of kraft paper. The utility model can concentrate the stress generated in the pressing process of the pressing structure on the non-bonding surface of the product, so that the bonding surface of the product is ensured to be flat.

Description

Rigid-flex board vacuum pressfitting structure

Technical Field

The utility model relates to the field of pressing structures, in particular to a vacuum pressing structure of a rigid-flex board.

Background

The stitching structure is to transfer the circuit pattern of the soft layer to the corresponding outer layer of the substrate by filling the soft material (PVC or PE, etc.) in the stitching process.

Two faces of camera class product are bonding face and non-bonding face respectively, and camera class product has higher requirement to the roughness of bonding face product, but current base plate pressfitting adopts the mode of flexible layer + PP + outer copper foil to assemble and the pressfitting, and harmomegathus deformation appears in the pressfitting in-process product, and the deformation in-process can produce stress, and stress dispersion is in the both sides of product, can't satisfy the demand of camera class product to bonding face roughness.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to solving at least one of the problems of the prior art. Therefore, the utility model provides a vacuum lamination structure of a rigid-flex board, which can concentrate stress generated in the pressing process of the lamination structure on a non-bonding surface of a product, so that the bonding surface of the product is ensured to be flat.

According to the vacuum lamination structure of the rigid-flex board in the embodiment of the first aspect of the utility model, the lamination structure sequentially comprises a first steel plate, a first buffer layer, a flexible layer, a substrate, a release film and a second steel plate from bottom to top; the first buffer layer is a plurality of pieces of kraft paper.

According to the embodiment of the utility model, the vacuum laminating structure of the rigid-flexible printed circuit board at least has the following beneficial effects: when the pressing structure is pressed, the soft layer and the buffer layer are arranged on the non-bonding surface of the substrate, the bonding surface of the substrate directly faces the steel plate after passing through the thin release film, so that stress generated in the pressing process is concentrated on one side close to the non-bonding surface, a very flat plane can be obtained after the base material is pressed, and the flatness of the bonding surface of the product is ensured; the buffer layer adopts multilayer kraft paper, and the kraft paper plays heat preservation, water absorption, decompression, buffering, heat transfer's effect at the clamp plate in-process, and one side of pressfitting structure is provided with the buffer layer, and the opposite side does not set up the buffer layer, makes pressfitting structure's stress concentrate on the buffer layer.

According to some embodiments of the utility model, the first buffer layer sequentially comprises a first kraft paper and a second kraft paper from bottom to top, the first kraft paper is a new kraft paper, and the second kraft paper is a laminated first kraft paper.

According to some embodiments of the utility model, the flexible layer is two three-in-one films.

According to some embodiments of the utility model, the three-in-one film has a thickness of 200 um.

According to some embodiments of the utility model, the release film is a TPX release film.

According to some embodiments of the utility model, the thickness of the TPX release film is 80 um.

According to some embodiments of the utility model, the device further comprises a bearing plate, wherein a second buffer layer is placed on the bearing plate, and the first steel plate is installed on the second buffer layer.

According to some embodiments of the utility model, the second buffer layer is a third kraft paper.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic view of a pressing structure according to an embodiment of the utility model.

The buffer layer comprises a first steel plate 1, a first buffer layer 2, a first kraft paper 21, a second kraft paper 22, a soft layer 3, a substrate 4, a release film 5, a second steel plate 6, a bearing disc 7 and a second buffer layer 8.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.

Referring to fig. 1, according to a vacuum lamination structure of a rigid-flex board in an embodiment of a first aspect of the present invention, the lamination structure sequentially includes, from bottom to top, a first steel plate 1, a first buffer layer 2, a flexible layer 3, a substrate 4, a release film 5, and a second steel plate 6; the first buffer layer 2 is a plurality of kraft papers.

The soft layer 3 plays a role of shape application in the pressing process, and the pressing structure can transfer the circuit pattern of the soft layer 3 to the corresponding outer layer of the substrate 4 through the filling of a soft material (PVC or PE, etc.) in the pressing process.

According to the embodiment of the utility model, the vacuum laminating structure of the rigid-flexible printed circuit board at least has the following beneficial effects: when the pressing structure is pressed, the soft layer 3 and the buffer layer are arranged on the non-bonding surface of the substrate 4, the bonding surface of the substrate 4 directly faces the steel plate after passing through the thin release film 5, so that stress generated in the pressing process is concentrated on one side close to the non-bonding surface, a very flat plane can be obtained after the substrate is pressed, and the flatness of the bonding surface of the product is ensured; the buffer layer adopts multilayer kraft paper, and the kraft paper plays heat preservation, water absorption, decompression, buffering, heat transfer's effect at the clamp plate in-process, and one side of pressfitting structure is provided with the buffer layer, and the opposite side does not set up the buffer layer, makes pressfitting structure's stress concentrate on the buffer layer.

The buffer layer is provided with many kraft papers, and wherein the kraft paper that is closest to base plate 4 can receive the stress influence that the pressfitting process produced, leads to the surface to warp, and all the other kraft papers, what mainly played is the cushioning effect, can not produce the deformation, because the pressfitting is passed the back surface and is more level and more smooth on the contrary.

In some embodiments of the utility model, the first buffer layer 2 sequentially includes a first kraft paper 21 and a second kraft paper 22 from bottom to top, the first kraft paper 21 is a new kraft paper, and the second kraft paper 22 is a pressed first kraft paper 21. First kraft paper 21 can reduce the surface smoothness after the pressfitting of pressfitting structure, and second kraft paper 22 is for being close to the buffer film of base plate 4, uses the first kraft paper 21 after the pressfitting, and the kraft paper can fully contact with soft layer 3, and the buffer layer can more even atress, and the kraft paper can reuse, the cost is reduced.

In some embodiments of the utility model, the flexible layer 3 is two three-in-one films. Trinity membrane is for from type membrane 5+ PE or PV + from type membrane 5, and trinity is from type 5 upper and lower from the effect that the layer played the isolation production board under high temperature from the type membrane, and middle buffer film plays effectual filler effect, plays effectual pressfitting effect to multiply wood, rigid-flexible board and the great circuit board of height drop, prevents defects such as layering, foaming.

In some embodiments of the present invention, the flexible layer 3 is a polyimide film, and is particularly suitable for being used as a flexible printed circuit board substrate and various high temperature resistant electrical and mechanical insulating materials.

In some embodiments of the utility model, the three-in-one film has a thickness of 200 um.

In some embodiments of the present invention, the release film 5 is a TPX release film. TPX is a highly crystalline transparent plastic with a specific gravity of 0.83 and is the lightest of all plastics. TPX has low surface hardness and is nontoxic. The bonding surface of the substrate 4 is in direct contact with the release film 5, and then a steel plate is placed, so that the bonding area of the camera lens is smoother, and a high-quality camera lens product is pressed.

In some embodiments of the present invention, the thickness of the TPX release film 5 is 80 um.

In some embodiments of the present invention, the buffer device further comprises a carrier tray 7, a second buffer layer 8 is placed on the carrier tray 7, and the first steel plate 1 is installed on the second buffer layer 8. The bearing disc 7 plays a role in bearing pressure and is used for bearing the whole press-fit structure, and the second buffer layer 8 plays a role in buffering the whole press-fit structure in the press-fit process.

In some embodiments of the utility model, the second buffer layer 8 is a third kraft paper.

In some embodiments of the present invention, the operation steps of the pressing structure are:

1. the cleaned and polished steel plate is placed on the kraft paper of the bearing plate 7

2. Placing two pieces of kraft paper on the steel plate (New old kraft paper, old kraft paper for base plate 4)

3. Placing two three-in-one sheets on kraft paper

4. The substrates 4 are arranged on the three-in-one substrate in order, and the front side of the substrate faces upwards during typesetting

5. Covering a release film 5 and then covering a steel plate.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.

Claims

1. A vacuum lamination structure of a rigid-flex board is characterized by comprising a first steel plate (1), a first buffer layer (2), a flexible layer (3), a substrate (4), a release film (5) and a second steel plate (6) from bottom to top in sequence; the first buffer layer (2) is made of a plurality of pieces of kraft paper.

2. The vacuum press-fit structure for the rigid-flexible printed circuit board according to claim 1, wherein the first buffer layer (2) comprises a first kraft paper (21) and a second kraft paper (22) from bottom to top, the first kraft paper (21) is a new kraft paper, and the second kraft paper (22) is a first kraft paper (21) which is press-fit.

3. The vacuum lamination structure of rigid-flexible board as claimed in claim 1, wherein the flexible layer (3) is two three-in-one films.

4. The rigid-flex board vacuum lamination structure of claim 3, wherein the three-in-one film has a thickness of 200 um.

5. The rigid-flex board vacuum lamination structure according to claim 1, wherein the release film (5) is a TPX release film.

6. The rigid-flex board vacuum lamination structure of claim 5, wherein the thickness of the TPX release film is 80 um.

7. The vacuum lamination structure of the rigid-flexible printed circuit board as claimed in claim 1, further comprising a carrier plate (7), wherein a second buffer layer (8) is placed on the carrier plate (7), and the first steel plate (1) is mounted on the second buffer layer (8).

8. The vacuum press-fit structure for rigid-flexible printed boards according to claim 7, wherein the second buffer layer (8) is a third kraft paper.